JP7075650B2 - Polishing equipment - Google Patents

Polishing equipment Download PDF

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JP7075650B2
JP7075650B2 JP2017192841A JP2017192841A JP7075650B2 JP 7075650 B2 JP7075650 B2 JP 7075650B2 JP 2017192841 A JP2017192841 A JP 2017192841A JP 2017192841 A JP2017192841 A JP 2017192841A JP 7075650 B2 JP7075650 B2 JP 7075650B2
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polishing
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opening
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JP2019063946A (en
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文昭 斎藤
文博 市川
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株式会社エステーリンク
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Description

本発明は、研磨装置に関するものである。 The present invention relates to a polishing device.

従来から、例えば実用新案登録第3172710号に開示されるような研磨装置(以下、従来例)が提案されている。 Conventionally, for example, a polishing device (hereinafter referred to as a conventional example) as disclosed in Utility Model Registration No. 3172710 has been proposed.

この従来例は、回転することでワークを研磨する研磨ヘッドが設けられたヘッド部と、このヘッド部を先端に保持し、リンク機構により先端部が3次元空間内を自在に移動可能に形成されたヘッド保持部と、ワークを載置する上面に複数の穴が設けられたテーブル部と、このテーブル部の下面側から空気を吸い込む吸引装置を有する空気吸引部とを有するものである。 In this conventional example, a head portion provided with a polishing head that polishes a work by rotating and a head portion are held at the tip, and the tip portion is formed so as to be freely movable in a three-dimensional space by a link mechanism. It has a head holding portion, a table portion provided with a plurality of holes on the upper surface on which a work is placed, and an air suction portion having a suction device for sucking air from the lower surface side of the table portion.

この構成から、薄いワークでも吸引して簡易に固定することができ、また、上面からの研磨であるのでワークの姿勢が問われず、さらに、ワークの固定や交換をチャックによる固定に比較して効率よく行うことができるとされる。 With this configuration, even a thin work can be sucked and easily fixed, and since it is polished from the top surface, the posture of the work does not matter, and the work can be fixed or replaced more efficiently than fixing with a chuck. It is said that it can be done well.

実用新案登録第3172710号公報Utility Model Registration No. 3172710 Gazette

本発明は、前述した研磨装置について更なる開発を進め、その結果、非常に実用的な研磨装置を開発した。 The present invention has further developed the above-mentioned polishing apparatus, and as a result, has developed a very practical polishing apparatus.

添付図面を参照して本発明の要旨を説明する。 The gist of the present invention will be described with reference to the accompanying drawings.

ワークWを固定するワーク固定台部50にワークWを研磨する研磨本体部1が備えられ、この研磨本体部1には前記ワークWに駆動回転しながら接触して該ワークWを研磨する回転研磨部2が設けられ、この回転研磨部2にはワーク研磨時に生じる研磨粉塵Pの飛散を防止するカバー部3が設けられ、このカバー部3には研磨粉塵導出用の導出開口部3aが設けられ、この導出開口部3aに吸引部4の吸引先端開口部4a連設され、前記カバー部3内の研磨粉塵Pを回収するように構成された研磨装置であって、前記研磨本体部1には前記回転研磨部2が複数設けられ、前記研磨本体部1を手動により回転可動若しくはスライド可動させて前記ワークWに接触させる前記回転研磨部2を選択可能に設けられ、この研磨本体部1の前記可動により前記回転研磨部2を選択切り替えした場合、切り替えした前記カバー部3の導出開口部3aと前記吸引部4の吸引先端開口部4aが連設されるように構成されていることを特徴とする研磨装置に係るものである。 The work fixing base 50 for fixing the work W is provided with a polishing main body 1 for polishing the work W, and the polishing main body 1 is in contact with the work W while being driven and rotated to grind the work W. A polishing portion 2 is provided, and the rotary polishing portion 2 is provided with a cover portion 3 for preventing scattering of polishing dust P generated during work polishing, and the cover portion 3 is provided with a lead-out opening 3a for leading out the polishing dust. The suction tip opening 4a of the suction portion 4 is continuously provided in the lead-out opening 3a, and is a polishing device configured to collect the polishing dust P in the cover portion 3, and is the polishing main body portion. A plurality of rotary polishing units 2 are provided in 1, and the rotary polishing unit 2 that allows the polishing main body 1 to be manually rotated or slid to be brought into contact with the work W is selectively provided . When the rotary polishing unit 2 is selectively switched by the movement of the polishing main body 1, the lead-out opening 3a of the cover unit 3 and the suction tip opening 4a of the suction unit 4 are configured to be connected in series . It relates to a polishing apparatus characterized by the fact that it is used.

また、請求項1記載の研磨装置において、前記研磨本体部1を回転可動若しくはスライド可動させ、前記回転研磨部2を前記ワークWに接触する位置に移動させて前記回転研磨部2を選択した場合、前記カバー部3の導出開口部3aが前記吸引先端開口部4a対向する位置に移動して前記導出開口部3aと前記吸引先端開口部4aとが連設するように構成されていることを特徴とする研磨装置に係るものである。 Further, in the polishing apparatus according to claim 1, the polishing main body 1 is rotatably or slidably movable, and the rotary polishing unit 2 is moved to a position in contact with the work W to select the rotary polishing unit 2 . In this case, the lead-out opening 3a of the cover portion 3 is configured to move to a position facing the suction tip opening 4a so that the lead-out opening 3a and the suction tip opening 4a are connected to each other. It relates to a polishing apparatus characterized by.

また、請求項1,2いずれか1項に記載の研磨装置において、前記ワーク固定台部50に固定した前記ワークWに対して前記研磨本体部1を接近移動及び退避移動させる移動手段53を具備し、前記移動手段53により前記ワークWに対して前記研磨本体部1を接近移動させて前記回転研磨部2で該ワークWを研磨する際、前記ワーク固定台部50に近接若しくは当接した状態で前記回転研磨部2の周囲を被覆するように前記カバー部3は構成されていることを特徴とする研磨装置に係るものである。 Further, in the polishing apparatus according to any one of claims 1 and 2, a moving means 53 for moving the polishing main body portion 1 closer to and retracting from the work W fixed to the work fixing base portion 50 is provided. Then, when the polishing main body 1 is moved closer to the work W by the moving means 53 and the work W is polished by the rotary polishing unit 2, the work W is brought close to or in contact with the work fixing base 50. The present invention relates to a polishing apparatus characterized in that the cover portion 3 is configured to cover the periphery of the rotary polishing portion 2 in a state.

また、請求項1~3いずれか1項に記載の研磨装置において、前記研磨本体部1は、この研磨本体部1の鉛直軸の両端部に前記回転研磨部2が設けられるとともに、更に、この研磨本体部1の前記鉛直軸に対して交差する方向に配される水平軸部5の軸線を中心に回転可動自在に設けられており、前記研磨本体部1が回転可動することで前記ワークWに接触させる前記回転研磨部2を選択可能に設けられていることを特徴とする研磨装置に係るものである。 Further, in the polishing apparatus according to any one of claims 1 to 3, the polishing main body 1 is provided with the rotary polishing portions 2 at both ends of the vertical shaft of the polishing main body 1, and further. The work W is rotatably provided around the axis of the horizontal shaft portion 5 arranged in a direction intersecting the vertical axis of the polishing main body portion 1 , and the polishing main body portion 1 is rotatably movable. The present invention relates to a polishing apparatus characterized in that the rotary polishing unit 2 to be brought into contact with the surface is selectively provided.

また、請求項1~4いずれか1項に記載の研磨装置において、前記導出開口部3a及び前記吸引先端開口部4aの少なくとも一方には開口縁部を囲繞する環状の可撓部材6が設けられ、前記導出開口部3aと前記吸引先端開口部4aが近接した際、一方の開口縁部に設けられた前記可撓部材6が他方の開口縁部に接触して両開口縁部同士間の間隙が閉塞されるように構成されていることを特徴とする研磨装置に係るものである。 Further, in the polishing apparatus according to any one of claims 1 to 4, an annular flexible member 6 surrounding the opening edge is provided at least one of the lead-out opening 3a and the suction tip opening 4a. When the lead-out opening 3a and the suction tip opening 4a are close to each other, the flexible member 6 provided at one opening edge comes into contact with the other opening edge and a gap between the two opening edges. The present invention relates to a polishing apparatus characterized in that it is configured to be closed.

また、請求項1~5いずれか1項に記載の研磨装置において、前記カバー部3は、前記回転研磨部2の周囲を被覆して前記ワーク固定台部50に近接若しくは当接する形状の先端開口部を有し、このカバー部3の先端開口部は前記回転研磨部2の基端方向に移動自在に設けられていることを特徴とする研磨装置に係るものである。 Further, in the polishing apparatus according to any one of claims 1 to 5, the cover portion 3 has a shape that covers the periphery of the rotary polishing portion 2 and is in close proximity to or in contact with the work fixing base portion 50. The present invention relates to a polishing apparatus having an opening, wherein the tip opening of the cover portion 3 is provided so as to be movable in the proximal direction of the rotary polishing portion 2.

また、請求項1~6いずれか1項に記載の研磨装置において、一の前記回転研磨部2を前記ワークWに接触する位置に移動させ他の前記回転研磨部2をその他の位置に移動させた際、この他の前記回転研磨部2が移動配設することで該回転研磨部2を覆う覆い部7を具備することを特徴とする研磨装置に係るものである。 Further, in the polishing apparatus according to any one of claims 1 to 6, the rotary polishing unit 2 is moved to a position in contact with the work W, and the other rotary polishing unit 2 is moved to another position. The present invention relates to a polishing apparatus characterized in that the rotary polishing unit 2 is moved and arranged to provide a covering portion 7 that covers the rotary polishing unit 2 when the polishing unit 2 is moved.

本発明は上述のように構成したから、ワークを良好に研磨することができ、また、ワーク研磨時に生じる研磨粉塵の飛散を防止して良好な作業完了を提供することができ、しかも、この研磨粉塵の飛散防止構造が効率の良い簡易構造の為、コスト安にして量産性に秀れるなど、非常に実用的な研磨装置となる。 Since the present invention is configured as described above, the work can be satisfactorily polished, and the scattering of polishing dust generated during the polishing of the work can be prevented to provide a good work completion, and moreover, this polishing can be performed. Since the dust scattering prevention structure is an efficient and simple structure, it is a very practical polishing device, such as low cost and excellent mass productivity.

本実施例を示す斜視図である。It is a perspective view which shows this Example. 本実施例の要部を示す分解斜視図である。It is an exploded perspective view which shows the main part of this Example. 本実施例の要部の説明図である。It is explanatory drawing of the main part of this Example. 本実施例の要部の説明図である。It is explanatory drawing of the main part of this Example. 本実施例の要部の説明図である。It is explanatory drawing of the main part of this Example. 本実施例の要部の動作説明図である。It is operation explanatory drawing of the main part of this Example. 本実施例の使用状態説明図である。It is a usage state explanatory drawing of this Example. 本実施例の要部の動作説明図である。It is operation explanatory drawing of the main part of this Example. 本実施例の要部の説明図である。It is explanatory drawing of the main part of this Example. 本実施例の使用状態説明図である。It is a usage state explanatory drawing of this Example.

好適と考える本発明の実施形態(発明をどのように実施するか)を、図面に基づいて本発明の作用を示して簡単に説明する。 An embodiment of the present invention (how to carry out the invention) which is considered to be suitable will be briefly described by showing the operation of the present invention based on the drawings.

ワークWをワーク固定台部50に固定し、この固定されたワークWに研磨本体部1に設けられた回転研磨部2を回転させながら接触させて研磨する。 The work W is fixed to the work fixing base portion 50, and the rotary polishing portion 2 provided in the polishing main body portion 1 is brought into contact with the fixed work W while rotating to polish.

本発明は、研磨本体部1に回転研磨部2が複数設けられており、研磨本体部1を可動することでワークWに接触させる回転研磨部2を選択使用することができる。 In the present invention, a plurality of rotary polishing units 2 are provided in the polishing main body 1, and the rotary polishing unit 2 that is brought into contact with the work W by moving the polishing main body 1 can be selectively used.

従って、例えば、各回転研磨部2を研磨条件の異なる構造とすれば、ワークWに接触させる回転研磨部2を選択切り替えすることで種々の研磨が迅速且つ良好に行えることになる。 Therefore, for example, if each rotary polishing unit 2 has a structure having different polishing conditions, various types of polishing can be performed quickly and satisfactorily by selectively switching the rotary polishing unit 2 in contact with the work W.

ところで、本発明は、この各回転研磨部2にはワーク研磨時に生じる研磨粉塵Pの飛散を防止するカバー部3が設けられ、このカバー部3には研磨粉塵導出用の導出開口部3aが設けられ、この導出開口部3aに吸引部4の吸引先端開口部4aを連設し、カバー部3内の研磨粉塵Pを回収するように構成されている。 By the way, in the present invention, each of the rotary polishing portions 2 is provided with a cover portion 3 for preventing the scattering of the polishing dust P generated at the time of polishing the work, and the cover portion 3 is provided with a lead-out opening 3a for deriving the polishing dust. The suction tip opening 4a of the suction portion 4 is continuously provided in the lead-out opening 3a, and is configured to collect the polishing dust P in the cover portion 3.

従って、ワーク研磨時において、カバー部3により研磨粉塵Pの飛散は防止され、更に、このカバー部3内の研磨粉塵Pは吸引部4で吸引されて回収されることになる為、良好な作業環境が得られることになる。 Therefore, at the time of polishing the work, the cover portion 3 prevents the polishing dust P from scattering, and the polishing dust P in the cover portion 3 is sucked and collected by the suction portion 4, which is a good work. The environment will be obtained.

また、本発明は、研磨本体部1の可動により回転研磨部2を選択切り替えした際に、カバー部3の導出開口部3aと吸引部4の吸引先端開口部4aが切り替え連設されるように構成されている。 Further, in the present invention, when the rotary polishing portion 2 is selectively switched by the movement of the polishing main body portion 1, the lead-out opening portion 3a of the cover portion 3 and the suction tip opening portion 4a of the suction portion 4 are switched and continuously provided. It is configured.

つまり、複数設けられる回転研磨部2の数に応じて吸引部4を複数設けた構造ではなく、一つの吸引部4で複数の回転研磨部2に対応することができて極めて効率の良い簡易構造である為、コスト安にして量産性に秀れることになる。 That is, it is not a structure in which a plurality of suction portions 4 are provided according to the number of a plurality of rotary polishing portions 2, but a simple structure in which one suction portion 4 can correspond to a plurality of rotary polishing portions 2 and is extremely efficient. Therefore, the cost is low and the mass productivity is excellent.

本発明の具体的な実施例について図面に基づいて説明する。 Specific examples of the present invention will be described with reference to the drawings.

本実施例は、ワークWを固定するワーク固定台部50にこのワークWを研磨する研磨本体部1が備えられ、ワーク固定台部50に固定したワークWに対して研磨本体部1を接近移動及び退避移動させる移動手段53を具備し、この研磨本体部1にはワークWに回転しながら接触して該ワークWを研磨する回転研磨部2が設けられ、この回転研磨部2には、移動手段53によりワークWに対して研磨本体部1を接近移動させて回転研磨部2で該ワークWを研磨する際、ワーク固定台部50に近接若しくは当接した状態で回転研磨部2の周囲を被覆することで、ワーク研磨時に生じる研磨粉塵Pの飛散を防止するカバー部3が設けられ、この導出開口部3aに吸引部4の吸引先端開口部4aを連設し、カバー部3内の研磨粉塵Pを回収するように構成された研磨装置である。 In this embodiment, the work fixing base 50 for fixing the work W is provided with the polishing main body 1 for polishing the work W, and the polishing main body 1 is moved closer to the work W fixed to the work fixing base 50. A moving means 53 for moving back and forth is provided, and the polishing main body 1 is provided with a rotary polishing unit 2 that comes into contact with the work W while rotating and polishes the work W, and the rotary polishing unit 2 is provided with a rotary polishing unit 2 for moving. When the polishing main body 1 is moved closer to the work W by the means 53 and the work W is polished by the rotary polishing unit 2, the circumference of the rotary polishing unit 2 is moved in close proximity to or in contact with the work fixing base 50. By covering, a cover portion 3 is provided to prevent scattering of polishing dust P generated during work polishing, and a suction tip opening 4a of the suction portion 4 is continuously provided in the lead-out opening 3a to polish the inside of the cover portion 3. It is a polishing device configured to collect dust P.

以下、本実施例係る構成各部について詳細な説明をする。 Hereinafter, each component of the present embodiment will be described in detail.

ワーク固定台部50は、図1に図示したようにボックス形状の装置本体51の上面部に多数の通気孔52aを有するワーク載置部52が設けられ、また、この装置本体51の内部にワーク載置部52付近の空気を通気孔52aを介して吸引する吸引装置(図示省略)が設けられたものである。 As shown in FIG. 1, the work fixing base portion 50 is provided with a work mounting portion 52 having a large number of ventilation holes 52a on the upper surface portion of the box-shaped device main body 51, and the work is provided inside the device main body 51. A suction device (not shown) for sucking air in the vicinity of the mounting portion 52 through the ventilation hole 52a is provided.

従って、吸引装置を作動させてワーク載置部52付近の空気を通気孔52aを介して吸引すると、ワーク載置部52に載置されたワークWは吸引固定される。 Therefore, when the suction device is operated to suck the air near the work mounting portion 52 through the ventilation hole 52a, the work W mounted on the work mounting portion 52 is sucked and fixed.

尚、ワーク固定台部50におけるワーク固定手段としては前述した吸引構造に限らず、チャック等の治具を使用した構造でも良いなど、本実施例の特性を発揮する構造であれば前述した構造に限られないのは勿論である。符号51aは本実施例で具備する各種装置の作動を制御する制御部の操作部である。 The work fixing means in the work fixing base 50 is not limited to the suction structure described above, but may be a structure using a jig such as a chuck, and any structure exhibiting the characteristics of the present embodiment may be used. Of course, it is not limited. Reference numeral 51a is an operation unit of a control unit that controls the operation of various devices provided in this embodiment.

また、ワーク固定台部50には、研磨本体部1を保持して移動させる移動手段53が設けられている。 Further, the work fixing base portion 50 is provided with a moving means 53 for holding and moving the polishing main body portion 1.

この移動手段53は、図1に図示したようにワーク固定台部50の後方部に設けられる基部53aに水平回動自在に枢着される第一アーム部53bと、この第一アーム部53bの先端部に水平回動自在にして上下回動自在に枢着される第二アーム部53cとから成るリンク機構を備えたアーム構造体であり、第二アーム部53cの先端部には、該第二アーム部53cの先端部を移動させる際に握持する把手部54が設けられている。 As shown in FIG. 1, the moving means 53 includes a first arm portion 53b pivotally attached to a base portion 53a provided at the rear portion of the work fixing base portion 50 so as to be horizontally rotatable, and the first arm portion 53b. It is an arm structure provided with a link mechanism including a second arm portion 53c that is horizontally rotatable and vertically rotatably attached to the tip portion, and the tip portion of the second arm portion 53c is the first. A handle portion 54 for gripping when moving the tip portion of the two arm portion 53c is provided.

従って、作業者は把手部54を持ち、手動にて研磨本体部1を移動手段53を介してワーク固定台部50の上を上下左右前後方向(3次元方向)にフレキシブルに移動させることができ、ワーク固定台部50に固定したワークWに対して第二アーム部53cの先端部(研磨本体部1)を接近移動及び退避移動させることができる。尚、移動手段53は手動式でなく自動式(電動式)でも良いなど、本実施例の特性を発揮する構造であれば前述した構造に限られないのは勿論である。 Therefore, the operator can hold the handle portion 54 and manually move the polishing main body portion 1 on the work fixing base portion 50 via the moving means 53 in the vertical, horizontal, front-back directions (three-dimensional directions). The tip portion (polishing main body portion 1) of the second arm portion 53c can be moved closer to and retracted from the work W fixed to the work fixing base portion 50. Of course, the moving means 53 is not limited to the above-mentioned structure as long as it has a structure that exhibits the characteristics of the present embodiment, such as an automatic type (electric type) instead of a manual type.

また、第二アーム部53cの先端部には、後述する研磨本体部1を保持する保持部55が設けられている。 Further, a holding portion 55 for holding the polishing main body portion 1, which will be described later, is provided at the tip portion of the second arm portion 53c.

この保持部55は、図5,6に図示したように移動手段53(第二アーム部53c)の先端部に上下方向に首振り可動自在に設けられた連結部材55aに、研磨本体部1と交差連設される水平軸部5を設けて構成されている。 As shown in FIGS. It is configured by providing the horizontal axis portions 5 that are cross-connected.

従って、この水平軸部5の軸線を中心に研磨本体部1は上下方向に回転可動させることができる。 Therefore, the polishing main body portion 1 can be rotated and moved in the vertical direction around the axis of the horizontal shaft portion 5.

また、本実施例は、研磨本体部1の回転可動をロックする回転ロック部10が設けられている。 Further, in this embodiment, a rotation lock portion 10 for locking the rotational movement of the polishing main body portion 1 is provided.

この回転ロック部10は、図5,6,8,9に図示したように研磨本体部1に設けられた係止杆10aと、この係止杆10aが貫挿係止する連結部材55aに設けられた係止孔10bとで構成され、後述する可動規制部8で研磨本体部1が180度の範囲で回動規制される際、係止杆10aが係止孔10bに貫挿係止して研磨本体部1の回転可動はロックされるように構成されている。 As shown in FIGS. 5, 6, 8 and 9, the rotary lock portion 10 is provided on the locking rod 10a provided on the polishing main body portion 1 and the connecting member 55a on which the locking rod 10a is inserted and locked. When the polishing main body 1 is restricted in rotation within a range of 180 degrees by the movable restricting portion 8 described later, the locking rod 10a is inserted and locked into the locking hole 10b. The rotational movement of the polishing body 1 is configured to be locked.

また、係止杆10aは図示省略の付勢部材の付勢に抗して引動し得るように構成されており、係止孔10bに貫挿係止した状態で係止杆10aを引動すると、係止孔10bに対する貫挿係止が解除され、この引動した指を離すと復帰動して係止孔10bに貫挿係止する。この係止孔10bは、可動規制部8で回動規制された際に、係止杆10aの対向する位置(本実施例では2箇所)に設けられている。 Further, the locking rod 10a is configured to be able to be pulled against the urging of an urging member (not shown), and when the locking rod 10a is pulled in a state of being inserted and locked in the locking hole 10b, The penetrating lock to the locking hole 10b is released, and when the pulled finger is released, the penetrating lock is released and the penetrating lock is performed to the locking hole 10b. The locking holes 10b are provided at opposite positions (two places in this embodiment) of the locking rods 10a when the rotation is restricted by the movable restricting portion 8.

尚、更に係止孔10bを研磨本体部1を90度回転可動させた状態(図8の状態)で係止杆10aが貫挿係止する位置に設けても良い。 Further, the locking hole 10b may be provided at a position where the locking rod 10a is inserted and locked in a state where the polishing main body 1 is rotated by 90 degrees (state in FIG. 8).

また、本実施例では、水平軸部5における研磨本体部1に対する連設位置は、研磨本体部1の重心付近となるように設けられている。即ち、水平軸部5との連設位置から、後述する両端部の回転研磨部2,カバー部3及び導出開口部3aは略等距離に設けられている。 Further, in this embodiment, the continuous position of the horizontal shaft portion 5 with respect to the polishing main body portion 1 is provided so as to be near the center of gravity of the polishing main body portion 1. That is, the rotary polishing portions 2, the cover portion 3 and the lead-out opening portion 3a at both ends, which will be described later, are provided at substantially equidistant distances from the position of being connected to the horizontal shaft portion 5.

従って、重心が両端部のうちいずれか一方の端部側に大きくずれていると、前述した回動ロック部10を解除した際、自重により勝手に回動してしまう場合があり危険であるが、前述した構成からこの問題は確実に解消されることになる。 Therefore, if the center of gravity is largely deviated to the end side of either end, it is dangerous because the rotation lock portion 10 may rotate by its own weight when the above-mentioned rotation lock portion 10 is released. , This problem will surely be solved from the above-mentioned configuration.

また、保持部55と研磨本体部1との間には、該研磨本体部1の可動を規制する可動規制部8が設けられている。 Further, a movable restricting portion 8 for restricting the movement of the polishing main body 1 is provided between the holding portion 55 and the polishing main body 1.

この可動規制部8は、研磨本体部1が可動(回転可動)する範囲においてこの研磨本体部1に設けられた係止部8aが突き当て係止する係合部8bを連結部材55aに設けて構成されている。 The movable restricting portion 8 is provided with an engaging portion 8b on the connecting member 55a to which the locking portion 8a provided on the polishing main body 1 abuts and engages within the range in which the polishing main body 1 is movable (rotatably movable). It is configured.

また、この可動規制部8は、研磨本体部1の可動を180度の範囲で規制するように構成されており、よって、後述する研磨本体部1の両端部の回転研磨部2は180度の範囲で回転可動(上下反転)することになる(図5,8,9参照)。 Further, the movable restricting portion 8 is configured to restrict the movement of the polishing main body portion 1 within a range of 180 degrees, so that the rotary polishing portions 2 at both ends of the polishing main body portion 1 described later are 180 degrees. It will be rotatable (upside down) within the range (see FIGS. 5, 8 and 9).

また、本実施例では、ワーク研磨時に生じる研磨粉塵Pを回収する吸引部4が設けられている。 Further, in this embodiment, a suction unit 4 is provided to collect the polishing dust P generated during the polishing of the work.

この吸引部4は、前述したワーク固定台部50の装置本体51内に設けられる吸引装置から延設される吸引管部4bと、この吸引管部4bの先端部に設けられる吸引先端開口部4aとで構成されている。 The suction portion 4 includes a suction pipe portion 4b extending from the suction device provided in the device main body 51 of the work fixing base portion 50 described above, and a suction tip opening 4a provided at the tip portion of the suction pipe portion 4b. It is composed of and.

この吸引先端開口部4aは保持部55(連結部材55a)に設けられ、吸引管部4bの先端部に設けられた方形開口部であり、後述するカバー部3の導出開口部3aが対向合致する位置で連設されるように構成されている。 The suction tip opening 4a is a square opening provided in the holding portion 55 (connecting member 55a) and provided at the tip of the suction pipe portion 4b, and the lead-out opening 3a of the cover portion 3 described later is opposed to each other. It is configured to be connected at the position.

また、図3に図示したように吸引先端開口部4aには開口縁部を囲繞する環状の可撓部材6(モヘア)が設けられている。尚、この可撓部材6はゴム製(ゴムパッキン)でも良い。 Further, as shown in FIG. 3, the suction tip opening 4a is provided with an annular flexible member 6 (mohair) surrounding the opening edge. The flexible member 6 may be made of rubber (rubber packing).

この可撓部材6は、導出開口部3aと吸引先端開口部4aが近接した際、この吸引先端開口部4aの開口縁部に設けられた可撓部材6が導出開口部3aの開口縁部に接触して両開口縁部同士間の間隙が閉塞されるように構成されている。 In this flexible member 6, when the lead-out opening 3a and the suction tip opening 4a are close to each other, the flexible member 6 provided at the opening edge of the suction tip opening 4a becomes the opening edge of the lead-out opening 3a. It is configured to be in contact and close the gap between the edges of both openings.

尚、この可撓部材6を設ける位置は導出開口部3aの開口縁部のみに設けても良いし、導出開口部3a及び吸引先端開口部4a双方の開口縁部に設けても良い。また、この両開口縁部同士間の間隙を閉塞するとは完全密閉だけを指すものではない。また、本実施例のように可撓部材6を設けなくても良く、導出開口部3aと吸引先端開口部4aの両開口縁部同士間の隙間を可及的に減らした構造に設計する事でも良い。 The position where the flexible member 6 is provided may be provided only at the opening edge of the lead-out opening 3a, or may be provided at both the lead-out opening 3a and the suction tip opening 4a. Further, closing the gap between the two opening edges does not mean only complete sealing. Further, it is not necessary to provide the flexible member 6 as in the present embodiment, and the structure should be designed so that the gap between the both opening edges of the lead-out opening 3a and the suction tip opening 4a is reduced as much as possible. But it's okay.

研磨本体部1は、ワーク固定台部50に固定されたワークWに回転しながら接触して該ワークWを研磨する回転研磨部2が複数設けられている。 The polishing main body 1 is provided with a plurality of rotary polishing portions 2 that rotate and contact the work W fixed to the work fixing base 50 to polish the work W.

具体的には、研磨本体部1は、図1,2に図示したように両端部に回転駆動軸部9を備えた両軸タイプのモーターであり、この各回転駆動軸部9の先端部に円形板材の表面に研磨ブラシ(バリ取りブラシ)が多数植設された研磨部材2aを設けることで回転研磨部2として構成されている。尚、この各回転研磨部2を構成する研磨部材2aは回転駆動軸部9に対して着脱自在に設けられており、また、研磨部材2aとして互いに研磨条件の異なる構造の研磨部材2aが採用されている。 Specifically, the polishing main body 1 is a dual-axis type motor provided with rotary drive shafts 9 at both ends as shown in FIGS. 1 and 2, and is attached to the tip of each rotary drive shaft 9. The rotary polishing unit 2 is configured by providing a polishing member 2a in which a large number of polishing brushes (deburring brushes) are planted on the surface of the circular plate material. The polishing member 2a constituting each of the rotary polishing portions 2 is detachably provided with respect to the rotary drive shaft portion 9, and the polishing member 2a having a structure different from each other is adopted as the polishing member 2a. ing.

また、研磨本体部1は、前述した移動手段53の保持部55に設けられ、この研磨本体部1の鉛直軸と交差連設される水平軸部5の軸線を中心に回転可動自在(上下反転自在)に設けられており、この研磨本体部1が回転可動することで該研磨本体部1の両端部に設けられた回転研磨部2が交互に上下位置に配されることになる。 Further, the polishing main body 1 is provided in the holding portion 55 of the moving means 53 described above, and is rotatable (upside down) around the axis of the horizontal shaft portion 5 which is cross-connected with the vertical axis of the polishing main body 1. The polishing main body 1 is rotatably movable, so that the rotary polishing portions 2 provided at both ends of the polishing main body 1 are alternately arranged at the upper and lower positions.

つまり、研磨本体部1の回転可動(上下反転)に伴いワークWに接触させる回転研磨部2を選択使用可能となる。 That is, the rotary polishing unit 2 that comes into contact with the work W can be selectively used as the polishing main unit 1 rotates and moves (upside down).

尚、本実施例では、回転研磨部を研磨本体部の中央部を中心とした放射方向に2つ設けられた構造であるが、放射方向に3つ以上設けても良く、また、研磨本体部の可動は回転可動に限らずスライド可動でも良く、この可動方向も上下方向に限らず水平方向でも良い。 In this embodiment, the structure is such that two rotary polishing portions are provided in the radial direction centered on the central portion of the polishing main body portion, but three or more rotary polishing portions may be provided in the radial direction, and the polishing main body portion may be provided. The movement of is not limited to rotation movement, but may be slide movement, and this movement direction is not limited to the vertical direction but may be horizontal.

また、回転研磨部2夫々には、ワーク研磨時に生じる研磨粉塵Pの飛散を防止するカバー部3が設けられている。 Further, each of the rotary polishing portions 2 is provided with a cover portion 3 for preventing the scattering of the polishing dust P generated during the polishing of the work.

この各カバー部3は、図1~5,7~9に図示したように研磨本体部1の端部に取付けられる基体3’と、この基体3’に設けられる筒状体3”とで構成されている。 As shown in FIGS. 1 to 5, 7 to 9, each of the cover portions 3 is composed of a substrate 3'attached to the end portion of the polishing main body portion 1 and a tubular body 3 "provided on the substrate 3'. Has been done.

また、この各カバー部3は、移動手段53によりワークWに対して研磨本体部1を接近移動させて回転研磨部2で該ワークWを研磨する際、ワーク固定台部50に近接した状態で回転研磨部2の周囲を被覆するように構成されている。 Further, each of the cover portions 3 is in a state of being close to the work fixing base portion 50 when the polishing main body portion 1 is moved closer to the work W by the moving means 53 and the work W is polished by the rotary polishing portion 2. It is configured to cover the periphery of the rotary polishing unit 2.

筒状体3”は、適宜な透明樹脂製の部材で形成したものであり、基体3’に対してスライド自在に設けられている。 The tubular body 3 "is formed of an appropriate transparent resin member, and is slidably provided with respect to the substrate 3'.

従って、カバー部3の先端開口部は回転研磨部2の先端基端方向(本実施例は上下方向)に移動自在となり、例えば研磨部材2aが摩耗して短くなった場合などに応じてカバー部3(先端開口部)を回転研磨部2の基端方向に移動させることができる(図4参照)。 Therefore, the tip opening of the cover portion 3 can be moved in the direction of the tip base end of the rotary polishing portion 2 (vertical direction in this embodiment), and the cover portion becomes shorter, for example, when the polishing member 2a is worn and shortened. 3 (tip opening) can be moved toward the base end of the rotary polishing unit 2 (see FIG. 4).

また、各カバー部3には、研磨粉塵導出用の導出開口部3aが設けられている。 Further, each cover portion 3 is provided with a lead-out opening 3a for leading out the polishing dust.

この導出開口部3aは、基体3’に突設された方形開口部であり、回転研磨部2をワークWに接触して研磨する状態に位置させた際、前述した吸引部4の吸引先端開口部4aと対向合致する位置に設けられている。 The lead-out opening 3a is a square opening projecting from the substrate 3', and when the rotary polishing portion 2 is positioned in a state of being in contact with the work W for polishing, the suction tip opening of the suction portion 4 described above is described. It is provided at a position facing and matching the portion 4a.

つまり、研磨本体部1を回転可動させて回転研磨部2をワークWに接触し得る位置に移動させて研磨回転部2を選択切り替えすると、吸引先端開口部4aに導出開口部3aが対向する位置に移動して切り替え連設するように構成されている。 That is, when the polishing main body 1 is rotatably moved to move the rotary polishing portion 2 to a position where it can come into contact with the work W and the polishing rotating portion 2 is selected and switched, the position where the lead-out opening 3a faces the suction tip opening 4a. It is configured to move to and switch to a series.

また、本実施例では、一の回転研磨部2をワークWに接触し得る位置に移動させて他の回転研磨部2をその他の位置に移動させた際、この他の回転研磨部2が移動配設されることで該回転研磨部2を覆う覆い部7を具備する。 Further, in this embodiment, when one rotary polishing unit 2 is moved to a position where it can come into contact with the work W and the other rotary polishing unit 2 is moved to another position, the other rotary polishing unit 2 moves. By being arranged, a covering portion 7 that covers the rotary polishing portion 2 is provided.

この覆い部7は、保持部55の上端部に設けられたケース状体であり、カバー部3の先端開口部を覆うことで回転研磨部2を覆うように構成されている。 The cover portion 7 is a case-like body provided at the upper end portion of the holding portion 55, and is configured to cover the rotary polishing portion 2 by covering the tip opening portion of the cover portion 3.

従って、回転研磨部2を切り替える一連の動きの中でこの回転研磨部2が覆い部7で自動的に覆われ、この覆い部7により、回転研磨部2に対する接触を防止することができる。 Therefore, in a series of movements for switching the rotary polishing unit 2, the rotary polishing unit 2 is automatically covered with the covering portion 7, and the covering portion 7 can prevent contact with the rotary polishing unit 2.

本実施例は上述のように構成したから、ワークWをワーク固定台部50に吸引固定し、この固定されたワークWに研磨本体部1に設けられた回転研磨部2を回転させながら接触させて研磨する。 Since this embodiment is configured as described above, the work W is suction-fixed to the work fixing base 50, and the rotary polishing portion 2 provided in the polishing main body 1 is brought into contact with the fixed work W while rotating. Polish.

本実施例は、研磨本体部1に回転研磨部2が複数設けられており、研磨本体部1を可動することでワークWに接触させる回転研磨部2を選択使用することができる。 In this embodiment, a plurality of rotary polishing units 2 are provided in the polishing main body 1, and the rotary polishing unit 2 that is brought into contact with the work W by moving the polishing main body 1 can be selectively used.

従って、例えば、各回転研磨部2を研磨条件の異なる構造とすれば、ワークWに接触させる回転研磨部2を選択切り替えすることで種々の研磨が迅速且つ良好に行えることになる。 Therefore, for example, if each rotary polishing unit 2 has a structure having different polishing conditions, various types of polishing can be performed quickly and satisfactorily by selectively switching the rotary polishing unit 2 in contact with the work W.

ところで、本実施例は、この各回転研磨部2にはワーク研磨時に生じる研磨粉塵Pの飛散を防止するカバー部3が設けられ、このカバー部3には研磨粉塵導出用の導出開口部3aが設けられ、この導出開口部3aに吸引部4の吸引先端開口部4aを連設し、カバー部3内の研磨粉塵Pを回収するように構成されている。 By the way, in this embodiment, each of the rotary polishing portions 2 is provided with a cover portion 3 for preventing the scattering of the polishing dust P generated during the polishing of the work, and the cover portion 3 has a lead-out opening 3a for deriving the polishing dust. The suction tip opening 4a of the suction portion 4 is continuously provided in the lead-out opening 3a, and is configured to collect the polishing dust P in the cover portion 3.

従って、ワーク研磨時において、カバー部3により研磨粉塵Pの飛散は防止され、更に、このカバー部3内の研磨粉塵Pは吸引部4で吸引されて回収されることになる為、良好な作業環境が得られることになる。 Therefore, at the time of polishing the work, the cover portion 3 prevents the polishing dust P from scattering, and the polishing dust P in the cover portion 3 is sucked and collected by the suction portion 4, which is a good work. The environment will be obtained.

また、本実施例は、研磨本体部1の可動により回転研磨部2を選択切り替えした際に、カバー部3の導出開口部3aと吸引部4の吸引先端開口部4aが切り替え連設されるように構成されている。 Further, in this embodiment, when the rotary polishing portion 2 is selectively switched by the movement of the polishing main body portion 1, the lead-out opening portion 3a of the cover portion 3 and the suction tip opening portion 4a of the suction portion 4 are switched and continuously provided. It is configured in.

つまり、複数設けられる回転研磨部2の数に応じて吸引部4を複数設けた構造ではなく、一つの吸引部4で複数の回転研磨部2に対応することができて極めて効率の良い簡易構造である為、コスト安にして量産性に秀れることになる。 That is, it is not a structure in which a plurality of suction portions 4 are provided according to the number of a plurality of rotary polishing portions 2, but a simple structure in which one suction portion 4 can correspond to a plurality of rotary polishing portions 2 and is extremely efficient. Therefore, the cost is low and the mass productivity is excellent.

また、本実施例は、研磨本体部1を回転可動若しくはスライド可動させて回転研磨部2をワークWに接触し得る位置に移動させて研磨回転部2を選択切り替えすると、吸引先端開口部4aに導出開口部3aが対向する位置に移動して切り替え連設するように構成されているから、研磨本体部1を回転可動させる操作だけで研磨粉塵Pを吸引して回収する状態が得られることになる。 Further, in this embodiment, when the polishing main body 1 is rotatably or slidably moved to move the rotary polishing part 2 to a position where it can come into contact with the work W and the polishing rotating part 2 is selected and switched, the suction tip opening 4a is formed. Since the lead-out opening 3a is configured to move to a position facing each other and to be switched and connected, it is possible to obtain a state in which the polishing dust P is sucked and collected only by the operation of rotating the polishing main body 1. Become.

また、本実施例は、ワーク固定台部50に固定したワークWに対して研磨本体部1を接近移動及び退避移動させる移動手段53を具備し、回転研磨部2には、移動手段53によりワークWに対して研磨本体部1を接近移動させて回転研磨部2で該ワークWを研磨する際、ワーク固定台部50に近接若しくは当接した状態で回転研磨部2の周囲を被覆するようにカバー部3は構成されているから、作業者の思い通りの位置に研磨本体部1を移動させてワークWを研磨することができ、しかも、この研磨の際、ワーク研磨時に生じる研磨粉塵Pを確実に回収することができる。 Further, in this embodiment, the moving means 53 for moving the polishing main body 1 to the work W fixed to the work fixing base 50 in an approaching manner and retracting is provided, and the rotary polishing part 2 is provided with a moving means 53 by the moving means 53. When the work W is polished by the rotary polishing unit 2 by moving the polishing main body 1 closer to W, the circumference of the rotary polishing unit 2 is covered in a state of being close to or in contact with the work fixing base 50. Since the cover portion 3 is configured, the polishing main body portion 1 can be moved to the position desired by the operator to polish the work W, and at the time of this polishing, the polishing dust P generated during the polishing of the work is surely removed. Can be collected.

また、本実施例は、研磨本体部1は、該研磨本体部1と交差連設される水平軸部5の軸線を中心に回転可動自在に設けられるとともに、この研磨本体部1の両端部に回転研磨部2が設けられており、研磨本体部1が回転可動することでワークWに接触させる回転研磨部2を選択使用可能に設けられているから、研磨本体部1を反転させるだけでワークWに対する良好な研磨が行えることになる。 Further, in this embodiment, the polishing main body 1 is provided so as to be rotatable around the axis of the horizontal shaft portion 5 that is cross-connected with the polishing main body 1 and is provided at both ends of the polishing main body 1. Since the rotary polishing unit 2 is provided and the rotary polishing unit 2 that is brought into contact with the work W by rotating the polishing main body 1 can be selectively used, the work can be simply inverted by reversing the polishing body 1. Good polishing for W can be performed.

また、本実施例は、導出開口部3a及び吸引先端開口部4aの少なくとも一方には開口縁部を囲繞する環状の可撓部材6が設けられ、導出開口部3aと吸引先端開口部4aが近接した際、一方の開口縁部に設けられた可撓部材6が他方の開口縁部に接触して両開口縁部同士間の間隙が閉塞されるように構成されているから、研磨粉塵Pを回収する際の漏れを可及的に防止することができる。 Further, in this embodiment, at least one of the lead-out opening 3a and the suction tip opening 4a is provided with an annular flexible member 6 surrounding the opening edge, and the lead-out opening 3a and the suction tip opening 4a are close to each other. When this is done, the flexible member 6 provided at one opening edge is configured to come into contact with the other opening edge to close the gap between the two opening edges, so that the polishing dust P is removed. Leakage during collection can be prevented as much as possible.

また、本実施例は、カバー部3は、回転研磨部2の周囲を被覆してワーク固定台部50に近接若しくは当接させる先端開口部を有する形状であり、カバー部3は後退移動自在に設けられているから、回転研磨部2の状態に合わせてカバー部3の位置を任意に変更することができる。 Further, in this embodiment, the cover portion 3 has a shape having a tip opening that covers the periphery of the rotary polishing portion 2 and is in close proximity to or in contact with the work fixing base portion 50, and the cover portion 3 can be moved backward. Since it is provided, the position of the cover portion 3 can be arbitrarily changed according to the state of the rotary polishing portion 2.

また、本実施例は、一の回転研磨部2をワークWに接触し得る位置に移動させて他の回転研磨部2をその他の位置に移動させた際、この他の回転研磨部2が移動配設されることで該回転研磨部2を覆う覆い部7を具備するから、研磨使用しない回転研磨部2に接触することを防止することができ安全となる。 Further, in this embodiment, when one rotary polishing unit 2 is moved to a position where it can come into contact with the work W and the other rotary polishing unit 2 is moved to another position, the other rotary polishing unit 2 moves. Since the cover portion 7 that covers the rotary polishing portion 2 is provided by being arranged, it is possible to prevent contact with the rotary polishing portion 2 that is not used for polishing, which is safe.

尚、本発明は、本実施例に限られるものではなく、各構成要件の具体的構成は適宜設計し得るものである。 The present invention is not limited to this embodiment, and the specific configuration of each constituent requirement can be appropriately designed.

P 研磨粉塵
W ワーク
1 研磨本体部
2 回転研磨部
3 カバー部
3a 導出開口部
4 吸引部
4a 吸引先端開口部
水平軸部
6 可撓部材
7 覆い部
50 ワーク固定台部
53 移動手段
P Polishing dust W work 1 Polishing body 2 Rotating polishing 3 Cover
3a lead-out opening
4 Suction part 4a Suction tip opening 5 Horizontal shaft part 6 Flexible member 7 Cover part
50 Work fixing base
53 means of transportation

Claims (7)

ワークを固定するワーク固定台部にワークを研磨する研磨本体部が備えられ、この研磨本体部には前記ワークに駆動回転しながら接触して該ワークを研磨する回転研磨部が設けられ、この回転研磨部にはワーク研磨時に生じる研磨粉塵の飛散を防止するカバー部が設けられ、このカバー部には研磨粉塵導出用の導出開口部が設けられ、この導出開口部に吸引部の吸引先端開口部連設され、前記カバー部内の研磨粉塵を回収するように構成された研磨装置であって、前記研磨本体部には前記回転研磨部が複数設けられ、前記研磨本体部を手動により回転可動若しくはスライド可動させて前記ワークに接触させる前記回転研磨部を選択可能に設けられ、この研磨本体部の前記可動により前記回転研磨部を選択切り替えした場合、切り替えした前記カバー部の導出開口部と前記吸引部の吸引先端開口部が連設されるように構成されていることを特徴とする研磨装置。 The work fixing base for fixing the work is provided with a polishing main body for polishing the work, and the polishing main body is provided with a rotary polishing part for polishing the work by contacting the work while driving and rotating. The rotary polishing part is provided with a cover part for preventing the scattering of polishing dust generated during work polishing, the cover part is provided with a lead-out opening for drawing out the polishing dust, and the lead-out opening is provided with the suction tip of the suction part. It is a polishing device configured to collect polishing dust in the cover portion by continuously providing openings, and the polishing main body portion is provided with a plurality of rotary polishing portions, and the polishing main body portion is manually rotated. The rotary polishing part that is movable or slideable to be brought into contact with the work is provided so as to be selectable , and when the rotary polishing part is selectively switched by the movement of the polishing main body part , the switched cover part is derived. A polishing apparatus characterized in that the opening and the suction tip opening of the suction portion are connected in series . 請求項1記載の研磨装置において、前記研磨本体部を回転可動若しくはスライド可動させ、前記回転研磨部を前記ワークに接触する位置に移動させて前記回転研磨部を選択した場合、前記カバー部の導出開口部が前記吸引先端開口部対向する位置に移動して前記導出開口部と前記吸引先端開口部とが連設するように構成されていることを特徴とする研磨装置。 In the polishing apparatus according to claim 1, when the rotary polishing portion is selected by rotating or sliding the polishing main body portion and moving the rotary polishing portion to a position in contact with the work, the cover portion of the cover portion. A polishing apparatus characterized in that the lead-out opening is moved to a position facing the suction tip opening so that the lead-out opening and the suction tip opening are connected to each other. 請求項1,2いずれか1項に記載の研磨装置において、前記ワーク固定台部に固定した前記ワークに対して前記研磨本体部を接近移動及び退避移動させる移動手段を具備し、前記移動手段により前記ワークに対して前記研磨本体部を接近移動させて前記回転研磨部で該ワークを研磨する際、前記ワーク固定台部に近接若しくは当接した状態で前記回転研磨部の周囲を被覆するように前記カバー部は構成されていることを特徴とする研磨装置。 The polishing apparatus according to any one of claims 1 and 2, is provided with a moving means for moving the polishing main body portion closer to and retracting from the work fixed to the work fixing base portion, and the moving means. When the work is polished by the rotary polishing portion by moving the polishing main body closer to the work, the periphery of the rotary polishing portion is covered in a state of being close to or in contact with the work fixing base portion. A polishing apparatus characterized in that the cover portion is configured. 請求項1~3いずれか1項に記載の研磨装置において、前記研磨本体部は、この研磨本体部の鉛直軸の両端部に前記回転研磨部が設けられるとともに、更に、この研磨本体部の前記鉛直軸に対して交差する方向に配される水平軸部の軸線を中心に回転可動自在に設けられており、前記研磨本体部が回転可動することで前記ワークに接触させる前記回転研磨部を選択可能に設けられていることを特徴とする研磨装置。 In the polishing apparatus according to any one of claims 1 to 3, the polishing main body portion is provided with the rotary polishing portions at both ends of the vertical shaft of the polishing main body portion, and further, the polishing main body portion is described. The rotary polishing part is rotatably provided around the axis of the horizontal axis portion arranged in the direction intersecting the vertical axis, and the rotary polishing part to be brought into contact with the work is selected by rotating the polishing main body part. A polishing device characterized in that it is provided in a selectable manner. 請求項1~4いずれか1項に記載の研磨装置において、前記導出開口部及び前記吸引先端開口部の少なくとも一方には開口縁部を囲繞する環状の可撓部材が設けられ、前記導出開口部と前記吸引先端開口部が近接した際、一方の開口縁部に設けられた前記可撓部材が他方の開口縁部に接触して両開口縁部同士間の間隙が閉塞されるように構成されていることを特徴とする研磨装置。 In the polishing apparatus according to any one of claims 1 to 4 , at least one of the lead-out opening and the suction tip opening is provided with an annular flexible member surrounding the opening edge, and the lead-out opening is provided. When the suction tip openings are close to each other, the flexible member provided at one opening edge is configured to come into contact with the other opening edge to close the gap between the two opening edges. A polishing device characterized by being 請求項1~5いずれか1項に記載の研磨装置において、前記カバー部は、前記回転研磨部の周囲を被覆して前記ワーク固定台部に近接若しくは当接する形状の先端開口部を有し、このカバー部の先端開口部は前記回転研磨部の基端方向に移動自在に設けられていることを特徴とする研磨装置。 In the polishing apparatus according to any one of claims 1 to 5, the cover portion has a tip opening having a shape that covers the periphery of the rotary polishing portion and is in close proximity to or in contact with the work fixing base portion. A polishing apparatus characterized in that the tip opening of the cover portion is movably provided in the direction of the base end of the rotary polishing portion. 請求項1~6いずれか1項に記載の研磨装置において、一の前記回転研磨部を前記ワークに接触する位置に移動させ他の前記回転研磨部をその他の位置に移動させた際、この他の前記回転研磨部が移動配設することで該回転研磨部を覆う覆い部を具備することを特徴とする研磨装置。 In the polishing apparatus according to any one of claims 1 to 6, when one of the rotary polishing portions is moved to a position in contact with the work and the other rotary polishing portion is moved to another position, the rotary polishing portion is moved to another position. A polishing apparatus comprising a covering portion that covers the rotary polishing portion by moving and arranging the other rotary polishing portion.
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JP2006130575A (en) 2004-11-02 2006-05-25 Hoseki No Angel:Kk Polishing dust collector
JP2007301638A (en) 2004-09-21 2007-11-22 Hitachi Ltd Shape member manufacturing method
US20090298402A1 (en) 2008-05-30 2009-12-03 Sebastian Guillen Cobos Surface grinding machine
JP2010221383A (en) 2009-03-25 2010-10-07 Kirin Brewery Co Ltd Dust collection device

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US5100270A (en) * 1990-03-06 1992-03-31 Artistic Mat, Inc. Apparatus and method for cutting mat board
JPH0871884A (en) * 1994-09-01 1996-03-19 Sankyo Alum Ind Co Ltd Dust collecting hood

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Publication number Priority date Publication date Assignee Title
JP2007301638A (en) 2004-09-21 2007-11-22 Hitachi Ltd Shape member manufacturing method
JP2006130575A (en) 2004-11-02 2006-05-25 Hoseki No Angel:Kk Polishing dust collector
US20090298402A1 (en) 2008-05-30 2009-12-03 Sebastian Guillen Cobos Surface grinding machine
JP2010221383A (en) 2009-03-25 2010-10-07 Kirin Brewery Co Ltd Dust collection device

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