JP7075295B2 - Saw wire, saw wire manufacturing method, and substrate manufacturing method - Google Patents

Saw wire, saw wire manufacturing method, and substrate manufacturing method Download PDF

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JP7075295B2
JP7075295B2 JP2018122070A JP2018122070A JP7075295B2 JP 7075295 B2 JP7075295 B2 JP 7075295B2 JP 2018122070 A JP2018122070 A JP 2018122070A JP 2018122070 A JP2018122070 A JP 2018122070A JP 7075295 B2 JP7075295 B2 JP 7075295B2
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abrasive grains
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好雄 三浦
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Kyocera Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

本開示は、芯線に砥粒を固着してなるソーワイヤとその製造方法、および前記ソーワイヤを用いてインゴットから基板を製造する方法に関する。 The present disclosure relates to a saw wire obtained by fixing abrasive grains to a core wire and a method for manufacturing the same, and a method for manufacturing a substrate from an ingot using the saw wire.

マルチワイヤソー装置（以下、ＭＷＳともいう）は、半導体インゴットなどの被加工物を複数枚の板状の基板に切断加工する装置である。ＭＷＳによる被加工物の切断方法には、砥粒を含む切削液をワイヤ列に供給しながら切断する、遊離砥粒方式と、表面に砥粒を固着させたワイヤ（以下、ソーワイヤともいう）を用いて切断する、固定砥粒方式とがある。また、ワイヤの走行方法として、ワイヤを常に一方向に走行させて、被加工物を切断する前の新ワイヤを供給し続けて切断する方法（一方向切断）と、ワイヤをメインローラ間で双方向に往復走行させながら少しずつ新線を供給して切断する方法（往復走行切断）と、がある。 The multi-wire saw device (hereinafter, also referred to as MWS) is a device that cuts a workpiece such as a semiconductor ingot into a plurality of plate-shaped substrates. The method of cutting the workpiece by MWS includes a free abrasive grain method that cuts while supplying cutting fluid containing abrasive grains to the wire row, and a wire (hereinafter, also referred to as saw wire) in which the abrasive grains are fixed to the surface. There is a fixed abrasive grain method that cuts using. In addition, as a method of running the wire, a method of always running the wire in one direction and continuously supplying a new wire before cutting the workpiece (one-way cutting) and a method of cutting the wire between the main rollers are both performed. There is a method of supplying a new line little by little while reciprocating in the direction of reciprocation (reciprocating reciprocating disconnection).

固定砥粒方式のＭＷＳは、切断速度が大きく、また、サファイア、ＳｉＣなどの硬質材料の切断に適している。また、通常、水溶性の加工液のみを使用すること、切断後の加工液にほとんど砥粒が含まれないことから、環境衛生面や加工液のリサイクルのしやすさという観点からも優れている。一方、遊離砥粒方式と比べてワイヤのコストが高いため、固定砥粒方式では、往復走行で切断するのが一般的である。 The fixed abrasive grain type MWS has a high cutting speed and is suitable for cutting hard materials such as sapphire and SiC. In addition, since only water-soluble processing liquid is usually used and the processing liquid after cutting contains almost no abrasive grains, it is excellent in terms of environmental hygiene and ease of recycling of the processing liquid. .. On the other hand, since the cost of the wire is higher than that of the free abrasive grain method, in the fixed abrasive grain method, cutting is generally performed by reciprocating traveling.

固定砥粒方式のＭＷＳを用い、往復走行で複数のインゴットを切断する場合、ソーワイヤの交換後、１本目のインゴットの切断では、新品のソーワイヤがワイヤ列を形成しているのに対し、２本目以降のインゴットの切断では、使用済のソーワイヤがワイヤ列を形成している。そのため、１本目のインゴットと２本目以降のインゴットとの間で、切断条件が異なるという問題がある。例えば、１本目のインゴットの切断では、厚み分布、反りなどの加工精度が悪化しやすい、２本目以降のインゴットの切断では、ソーワイヤの断線が起こりやすいなどの問題が生じる。 When cutting multiple ingots by reciprocating using the fixed abrasive grain method MWS, after replacing the saw wire, in the cutting of the first ingot, the new saw wire forms a wire row, whereas the second one. In the subsequent cutting of the ingot, the used saw wires form a wire row. Therefore, there is a problem that the cutting conditions are different between the first ingot and the second and subsequent ingots. For example, in the cutting of the first ingot, the processing accuracy such as the thickness distribution and the warp tends to deteriorate, and in the cutting of the second and subsequent ingots, the saw wire tends to be broken.

そのため、特許文献１には、始端と終端の砥粒径が小さい固定砥粒ワイヤを用い、１本のインゴットの切り始めと切り終わりで粒径の小さい箇所を使うことで、加工精度よくインゴットを切断できることが記載されている。特許文献２には、１本目のインゴットと２本目以降のインゴットで切断条件の違いを減らすために所定量ワイヤを巻き取ってから切断する方法が記載されている。しかし、特許文献１に記載のソーワイヤは、１本のソーワイヤで１本のインゴットを切断することを前提としているので、例えば、砥粒径の小さい領域で１本目のインゴットを、砥粒径が大きい領域で２本目のインゴットを切断すると、砥粒径が異なるために、１本目の切断と２本目以降の切断で切断条件が異なってしまう。また、特許文献２に記載の基板の製造方法は、インゴットの切断前に、ソーワイヤを巻き戻すという工程が必要なため、作業性が悪化し、ワイヤの使用量も多くなるので基板の製造コストも増加する。 Therefore, in Patent Document 1, a fixed abrasive grain wire having a small grain size at the start and end is used, and a portion having a small grain size is used at the start and end of cutting of one ingot, so that the ingot can be processed with high processing accuracy. It is stated that it can be cut. Patent Document 2 describes a method of winding a predetermined amount of wire and then cutting it in order to reduce the difference in cutting conditions between the first ingot and the second and subsequent ingots. However, since the saw wire described in Patent Document 1 is premised on cutting one ingot with one saw wire, for example, the first ingot has a large abrasive particle size in a region where the abrasive particle size is small. When the second ingot is cut in the region, the cutting conditions are different between the first cutting and the second and subsequent cuttings because the abrasive grain size is different. Further, the method for manufacturing a substrate described in Patent Document 2 requires a step of rewinding the saw wire before cutting the ingot, which deteriorates workability and increases the amount of wire used, so that the manufacturing cost of the substrate is also high. To increase.

特開２０１１－２３０２７４号公報Japanese Unexamined Patent Publication No. 2011-230274 特開２０１５－７４０３７号公報JP-A-2015-74037

本開示は、基板の生産性に優れ、断線や加工精度の悪化の生じにくいソーワイヤおよび、インゴットの切断方法を提供することを目的とする。 It is an object of the present disclosure to provide a saw wire having excellent substrate productivity and less likely to cause disconnection or deterioration of processing accuracy, and a method for cutting an ingot.

本開示のソーワイヤは、始端を有する芯線と、前記芯線の表面に固着した砥粒とを備え、前記始端に接続する所定長さの第１部分と、前記第１部分に接続する第２部分とを有し、前記第１部分の前記砥粒の粒径と前記第２部分の前記砥粒の粒径は略同じで、前記第１部分の仕上げ径が、前記第２部分の仕上げ径よりも小さい。 The saw wire of the present disclosure includes a core wire having a starting end and abrasive grains fixed to the surface of the core wire, and has a first portion having a predetermined length connected to the starting end and a second portion connected to the first portion. The particle size of the abrasive grains in the first portion and the particle size of the abrasive grains in the second portion are substantially the same, and the finishing diameter of the first portion is larger than the finishing diameter of the second portion. small.

本開示のソーワイヤの製造方法は、始端を有する芯線の表面に砥粒を固着する工程と、前記砥粒をドレスする工程を有し、前記始端に接続する所定長さの第１部分において、前記第１部分に接続する第２部分よりもドレス量を大きくする。 The method for manufacturing a saw wire of the present disclosure includes a step of fixing abrasive grains to the surface of a core wire having a starting end and a step of dressing the abrasive grains, and in a first portion having a predetermined length connected to the starting end, the said The amount of dress is larger than that of the second part connected to the first part.

本開示の基板の製造方法は、マルチワイヤソー装置と請求項１に記載のソーワイヤを用いて、前記ソーワイヤを往復走行させながら、複数本のインゴットをそれぞれ複数枚の基板に切断する、基板の製造方法であって、前記ソーワイヤ交換後１本目のインゴットは前記第１部分を用いて切断を開始し、２本目以降のインゴットは前記第２部分を用いて切断を開始する。 The method for manufacturing a substrate of the present disclosure is a method for manufacturing a substrate, which uses a multi-wire saw device and the saw wire according to claim 1 to cut a plurality of ingots into a plurality of substrates while reciprocating the saw wires. After the saw wire is replaced, the first ingot starts cutting using the first portion, and the second and subsequent ingots start cutting using the second portion.

本開示のソーワイヤ、ソーワイヤの製造方法、および基板の製造方法によれば、基板の生産性に優れ、断線や加工精度不良の生じにくいソーワイヤおよび、基板の製造方法を提供できる。 According to the saw wire, the saw wire manufacturing method, and the substrate manufacturing method of the present disclosure, it is possible to provide a saw wire having excellent substrate productivity and less likely to cause disconnection or processing accuracy failure, and a substrate manufacturing method.

本実施形態のソーワイヤの概略図である。It is a schematic diagram of the saw wire of this embodiment. マルチワイヤソー装置の概略図である。It is a schematic diagram of a multi-wire saw device. 本実施形態のソーワイヤの製造方法の概略説明図である。It is a schematic explanatory drawing of the manufacturing method of the saw wire of this embodiment.

本開示のソーワイヤ１について、図を参照しながら説明する。図１は、本実施形態のソーワイヤ１の一例を示す概略図、図２は、マルチワイヤソー装置（ＭＷＳ）の概略図である。 The saw wire 1 of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic view showing an example of the saw wire 1 of the present embodiment, and FIG. 2 is a schematic view of a multi-wire saw device (MWS).

ＭＷＳ９０は、複数のメインローラ２０、複数のガイドローラ３０、供給リール４０、巻取リール５０およびソーワイヤ１を有し、ソーワイヤ１はメインローラ２０間でワイヤ列を形成する。そして、被加工物であるインゴット６０を、高速走行させたワイヤ列に押し当てることによって、インゴット６０を複数の基板に切断する。 The MWS 90 has a plurality of main rollers 20, a plurality of guide rollers 30, a supply reel 40, a take-up reel 50, and a saw wire 1, and the saw wire 1 forms a wire row among the main rollers 20. Then, the ingot 60, which is a workpiece, is pressed against the wire row driven at high speed to cut the ingot 60 into a plurality of substrates.

通常、固定砥粒方式のＭＷＳ９０では、ソーワイヤ１は、往復走行で使用されるので、ソーワイヤ１を交換した直後、１本目のインゴット６０の切断では、新品のソーワイヤ１がワイヤ列を形成しているのに対し、２本目以降のインゴット６０の切断では、使用済のソーワイヤ１がワイヤ列を形成している。そのため、１本目のインゴット６０と２本目以降のインゴット６０との間で、切断条件が異なるという問題があった。例えば、１本目のインゴット６０の切断では、厚み分布、反りなどの加工精度が悪化しやすく、２本目以降のインゴット６０の切断では、ソーワイヤ１の断線が起こりやすい。 Normally, in the fixed abrasive grain type MWS 90, the saw wire 1 is used for reciprocating traveling. Therefore, immediately after the saw wire 1 is replaced, in the cutting of the first ingot 60, the new saw wire 1 forms a wire row. On the other hand, in the cutting of the second and subsequent ingots 60, the used saw wires 1 form a wire row. Therefore, there is a problem that the cutting conditions are different between the first ingot 60 and the second and subsequent ingots 60. For example, in the cutting of the first ingot 60, the processing accuracy such as the thickness distribution and the warp tends to deteriorate, and in the cutting of the second and subsequent ingots 60, the saw wire 1 tends to be broken.

本開示のソーワイヤ１は、始端２ａを有する芯線２と芯線２の表面に固着した砥粒３とを備える。そして、始端２ａに接続する所定長さ（Ｌ１）の第１部分１ａと、第１部分１aに接続する第２部分１ｂとを有する。第１部分１ａの砥粒３（第１砥粒３ａ）の粒径（ｄ１）と、第２部分１ｂの砥粒３（第２砥粒３ｂ）の粒径（ｄ２）は略同じで、第１部分１ａの仕上げ径（Φ１）は、第２部分１ｂの仕上げ径(Φ２)よりも小さい。 The saw wire 1 of the present disclosure includes a core wire 2 having a start end 2a and abrasive grains 3 fixed to the surface of the core wire 2. Then, it has a first portion 1a having a predetermined length (L1) connected to the starting end 2a and a second portion 1b connected to the first portion 1a. The particle size (d1) of the abrasive grains 3 (first abrasive grains 3a) of the first portion 1a and the particle size (d2) of the abrasive grains 3 (second abrasive grains 3b) of the second portion 1b are substantially the same. The finishing diameter (Φ1) of the first portion 1a is smaller than the finishing diameter (Φ2) of the second portion 1b.

本開示のソーワイヤ１は、上記構成により、交換後１本目のインゴット６０と、２本目以降のインゴット６０の切断条件の違いを減らすことができるので、断線や加工精度の悪化が生じにくい。 With the above configuration, the saw wire 1 of the present disclosure can reduce the difference in cutting conditions between the first ingot 60 after replacement and the second and subsequent ingots 60, so that disconnection and deterioration of processing accuracy are unlikely to occur.

ソーワイヤ１の仕上げ径とは、砥粒３を含むソーワイヤ１の直径であり、芯線２の直径と、砥粒３の芯線２からの突出量で規定される。砥粒３の突出量は、砥粒３の粒径と、後述するドレス処理におけるドレス量で調節できる。ソーワイヤ１の仕上げ径は、マイクロメーターにより測定できる。第１部分１ａのソーワイヤ１の直径を、測定箇所を変えて３箇所以上測定し、その平均値を第１部分１ａの仕上げ径とする。第２部分１ｂの仕上げ径の測定も同様である。 The finishing diameter of the saw wire 1 is the diameter of the saw wire 1 including the abrasive grains 3, and is defined by the diameter of the core wire 2 and the amount of protrusion of the abrasive grains 3 from the core wire 2. The amount of protrusion of the abrasive grains 3 can be adjusted by the particle size of the abrasive grains 3 and the dressing amount in the dressing process described later. The finished diameter of the saw wire 1 can be measured with a micrometer. The diameter of the saw wire 1 of the first portion 1a is measured at three or more points by changing the measurement points, and the average value thereof is taken as the finishing diameter of the first part 1a. The same applies to the measurement of the finish diameter of the second portion 1b.

第１部分１ａの仕上げ径Φ１は、一定でもよいし、第２部分１ｂに近づくにつれて連続的または、段階的に大きくしてもよい。 The finish diameter Φ1 of the first portion 1a may be constant, or may be continuously or stepwise increased as it approaches the second portion 1b.

芯線２は、例えば、直径１００～２００μｍ程度の鋼線などの金属線である。 The core wire 2 is, for example, a metal wire such as a steel wire having a diameter of about 100 to 200 μm.

砥粒３は、例えば、粒径２０～６０μｍ程度のダイヤモンド砥粒やＣＢＮ砥粒などである。なお、本明細書において、砥粒３の粒径とは平均粒径のことである。砥粒３として、粒径の異なる複数の砥粒３を固着させて使用してもよい。その場合の砥粒３の粒径は、複数の砥粒３の平均粒径のことである。 The abrasive grains 3 are, for example, diamond abrasive grains having a particle size of about 20 to 60 μm, CBN abrasive grains, and the like. In the present specification, the particle size of the abrasive grains 3 is the average particle size. As the abrasive grains 3, a plurality of abrasive grains 3 having different particle sizes may be fixed and used. The particle size of the abrasive grains 3 in that case is the average particle size of the plurality of abrasive grains 3.

砥粒３を芯線２の表面に固着させる方法としては、例えば、砥粒が混入したレジンボ
ンド（熱硬化性樹脂）の中に芯線２を通過させ、芯線２の表面に付着したレジンボンドを冷却して硬化させるレジンボンド法や、砥粒３が混入したメッキ液中で芯線２をニッケル等の金属で電気メッキする電着法などがあり、砥粒３の固着力の観点からすれば電着法が好ましい。芯線２を電気メッキすることによりメッキ層に砥粒３を埋設して固着させることができる。 As a method of fixing the abrasive grains 3 to the surface of the core wire 2, for example, the core wire 2 is passed through a resin bond (thermosetting resin) in which the abrasive grains are mixed, and the resin bond adhering to the surface of the core wire 2 is cooled. There are a resin bond method in which the core wire 2 is electroplated with a metal such as nickel in a plating solution mixed with the abrasive grains 3, and an electrodeposition method is performed from the viewpoint of the fixing force of the abrasive grains 3. The method is preferred. By electroplating the core wire 2, the abrasive grains 3 can be embedded and fixed in the plating layer.

本開示のソーワイヤ１の製造方法を、図を参照しながら説明する。本開示のソーワイヤ１の製造方法は、始端２ａを有する芯線２の表面に砥粒３を固着する工程と、砥粒３をドレスする工程を有し、始端２ａに接続する所定長さ（Ｌ１）の第１部分１ａにおいて、第１部分１ａに接続する第２部分１ｂよりもドレス量を大きくすることを特徴とする。 The manufacturing method of the saw wire 1 of the present disclosure will be described with reference to the drawings. The method for manufacturing the saw wire 1 of the present disclosure includes a step of fixing the abrasive grains 3 to the surface of the core wire 2 having the starting end 2a and a step of dressing the abrasive grains 3, and has a predetermined length (L1) connected to the starting end 2a. The first portion 1a of the above is characterized in that the dress amount is larger than that of the second portion 1b connected to the first portion 1a.

以下、本開示のソーワイヤ１の製造方法の詳細を説明する。図３は、ソーワイヤ１の製造過程の概略図である。まず、直径１００～２００μｍ程度の鋼線などの金属線からなる芯線２と、粒径２０～６０μｍ程度のダイヤモンド砥粒やＣＢＮ砥粒などからなる砥粒３を準備する。 Hereinafter, the details of the manufacturing method of the saw wire 1 of the present disclosure will be described. FIG. 3 is a schematic view of the manufacturing process of the saw wire 1. First, a core wire 2 made of a metal wire such as a steel wire having a diameter of about 100 to 200 μm and an abrasive grain 3 made of diamond abrasive grains or CBN abrasive grains having a particle size of about 20 to 60 μm are prepared.

次に、芯線２に砥粒３を固着させる。砥粒３の固着は、例えば、砥粒３が混入したメッキ液中で芯線２にニッケル等の金属を電気メッキする電着法により、芯線２の表面にメッキ層（不図示）を形成するとともに、メッキ層に砥粒３を埋設して固着させるとよい。この時、図３（ａ）に示すように、第１領域２ａと第２領域２ｂに固着させる砥粒３の粒径は略同じである。なお、砥粒３として、粒径の異なる複数の砥粒３を、平均粒径が均一になるように混合して固着させてもよい。 Next, the abrasive grains 3 are fixed to the core wire 2. To fix the abrasive grains 3, for example, a plating layer (not shown) is formed on the surface of the core wire 2 by an electrodeposition method in which a metal such as nickel is electroplated on the core wire 2 in a plating solution mixed with the abrasive grains 3. It is preferable to embed the abrasive grains 3 in the plating layer and fix them. At this time, as shown in FIG. 3A, the particle sizes of the abrasive grains 3 fixed to the first region 2a and the second region 2b are substantially the same. As the abrasive grains 3, a plurality of abrasive grains 3 having different particle sizes may be mixed and fixed so that the average particle size becomes uniform.

続いて、固着した砥粒３の表面を研磨することにより、砥粒３の芯線２からの突出量すなわち、ソーワイヤ１の仕上げ径を調節するドレス処理を行う。ドレス処理は、例えば、
回転する砥石の表面に対し、ソーワイヤ１を接触させながら走行させることにより行うとよい。この時、図３（ｂ）に示すように、始端２ａに接続する所定長さ（Ｌ１）の第１部分１ａにおいて、第１部分１ａに接続する第２部分１ｂよりもドレス量を大きくする。つまり、第１部分１ａのドレス処理後の仕上げ径（Φ１）が、第２部分１ｂのドレス後の仕上げ径（Φ２）よりも小さくなるように、ドレス処理を行う。 Subsequently, by polishing the surface of the fixed abrasive grains 3, a dressing process is performed to adjust the amount of protrusion of the abrasive grains 3 from the core wire 2, that is, the finish diameter of the saw wire 1. The dressing process is, for example,
It is preferable to run the saw wire 1 in contact with the surface of the rotating grindstone. At this time, as shown in FIG. 3B, the dress amount is made larger in the first portion 1a of the predetermined length (L1) connected to the starting end 2a than in the second portion 1b connected to the first portion 1a. That is, the dressing process is performed so that the finished diameter (Φ1) of the first portion 1a after the dressing process is smaller than the finished diameter (Φ2) of the second portion 1b after the dressing process.

上記製造方法により、始端２ａを有する芯線２と芯線２の表面に固着した砥粒３と、始端２ａに接続する所定長さ（Ｌ１）の第１部分１ａと、第１部分１aに接続する第２部分
１ｂとを備え、第１部分１ａの砥粒３（第１砥粒３ａ）の粒径（ｄ１）と、第２部分１ｂの砥粒３（第２砥粒３ｂ）の粒径（ｄ２）が略同じで、第１部分１ａの仕上げ径（Φ１）は、第２部分１ｂの仕上げ径(Φ２)よりも小さいソーワイヤ１を得ることができる。 By the above manufacturing method, the core wire 2 having the starting end 2a, the abrasive grains 3 fixed to the surface of the core wire 2, the first portion 1a of a predetermined length (L1) connected to the starting end 2a, and the first portion 1a connected to the first portion 1a. The two portions 1b are provided, and the particle size (d1) of the abrasive grains 3 (first abrasive grains 3a) of the first portion 1a and the particle size (d2) of the abrasive grains 3 (second abrasive grains 3b) of the second portion 1b are provided. ) Is substantially the same, and the saw wire 1 having a finish diameter (Φ1) of the first portion 1a smaller than the finish diameter (Φ2) of the second portion 1b can be obtained.

以下に本開示の基板の製造方法を、図を参照しながら説明する。図２は、本実施形態で使用されるマルチワイヤソー装置の概略図である。 The method of manufacturing the substrate of the present disclosure will be described below with reference to the drawings. FIG. 2 is a schematic view of the multi-wire saw device used in the present embodiment.

まず、被加工物となるインゴット６０とソーワイヤ１をＭＷＳ装置にセットし、ソーワイヤ１を供給リール４０から供給して、メインローラ２０間にワイヤ列を形成する。そして、ソーワイヤ１を、供給リール４０と巻取リール５０との間で往復走行させながら、インゴット６０を、高速走行させたワイヤ列に押し当てることによって、インゴット６０を複数の基板に切断にする。 First, the ingot 60 and the saw wire 1 to be the workpiece are set in the MWS device, and the saw wire 1 is supplied from the supply reel 40 to form a wire row between the main rollers 20. Then, the ingot 60 is cut into a plurality of substrates by pressing the ingot 60 against the wire row traveled at high speed while reciprocating the saw wire 1 between the supply reel 40 and the take-up reel 50.

ここで、ソーワイヤ１を交換後１本目のインゴット６０の切断開始時点では、ワイヤ列は新品のソーワイヤ１から形成されている。１本目のインゴットは、第１部分１ａを用いて切断を開始する。ソーワイヤ１を交換後２本目以降のインゴット６０の切断開始時点では、ワイヤ列は使用済のソーワイヤ１から形成されている。２本目以降のインゴットは、第１部分１ａよりもドレス量の大きい（砥粒３の粒径が略同じで仕上げ径が小さい）第２部分１ｂを用いて切断を開始する。本開示のインゴット６０の切断方法によれば、１本目のインゴット６０と２本目以降のインゴット６０の切断条件の違いに起因する、断線や加工精度不良が生じにくい。 Here, at the time of starting cutting of the first ingot 60 after replacing the saw wire 1, the wire row is formed from the new saw wire 1. The first ingot starts cutting using the first portion 1a. At the start of cutting the second and subsequent ingots 60 after replacing the saw wire 1, the wire row is formed from the used saw wire 1. The second and subsequent ingots start cutting using the second portion 1b, which has a larger dressing amount than the first portion 1a (the particle size of the abrasive grains 3 is substantially the same and the finishing diameter is smaller). According to the cutting method of the ingot 60 of the present disclosure, disconnection and poor processing accuracy due to the difference in cutting conditions between the first ingot 60 and the second and subsequent ingots 60 are unlikely to occur.

第１部分１ａの長さ（Ｌ１）は、往復走行切断の１送り分に相当する長さより長いと好適である。また、インゴット１本の切断に要するソーワイヤ１の長さよりも短いと好適である。 It is preferable that the length (L1) of the first portion 1a is longer than the length corresponding to one feed of the reciprocating traveling cut. Further, it is preferable that the length is shorter than the length of the saw wire 1 required for cutting one ingot.

また、第１部分１ａの仕上げ径（Φ１）と第２部分１ｂの仕上げ径（Φ２）の差（Φ２－Φ１）が、インゴット６０の切断直後のワイヤ列の砥粒３の消耗量に相当していると特によい。 Further, the difference (Φ2-Φ1) between the finish diameter (Φ1) of the first portion 1a and the finish diameter (Φ2) of the second portion 1b corresponds to the consumption amount of the abrasive grains 3 of the wire row immediately after cutting the ingot 60. Especially good if you have.

第１部分１ａのドレス量（仕上げ径Φ１）は、一定でもよいし、第２部分１ｂに近づくにつれて連続的または、段階的に小さく（仕上げ径Φ１を大きく）してもよい。 The dress amount (finishing diameter Φ1) of the first portion 1a may be constant, or may be continuously or stepwise reduced (the finishing diameter Φ1 is increased) as it approaches the second portion 1b.

このように、第１部分１ａのドレス量（仕上げ径Φ１）と長さ（Ｌ１）を適宜調整することで、１本目のインゴットと２本目以降のインゴットの切断条件の違いを小さくすることができる。 In this way, by appropriately adjusting the dress amount (finishing diameter Φ1) and length (L1) of the first portion 1a, it is possible to reduce the difference in cutting conditions between the first ingot and the second and subsequent ingots. ..

以上、本開示の実施形態について説明したが、本開示は前述した実施形態に限定されるものではなく、本開示の要旨を逸脱しない範囲において種々の変更、改良、組合せ等が可能である。 Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various changes, improvements, combinations, and the like can be made without departing from the gist of the present disclosure.

１ ソーワイヤ
１ａ 第１部分
１ｂ 第２部分
２ 芯線
２ａ 始端
３ 砥粒
３ａ 第１砥粒
３ｂ 第２砥粒
１０ マルチワイヤソー装置（ＭＷＳ） 1 Saw wire 1a 1st part 1b 2nd part 2 Core wire 2a Starting end 3 Abrasive grain 3a 1st abrasive grain 3b 2nd abrasive grain 10 Multi-wire saw device (MWS)

Claims (4)

始端を有する芯線と、前記芯線の表面に固着した砥粒とを備え、
前記始端に接続する所定長さの第１部分と、前記第１部分に接続する第２部分とを有し、前記第１部分の前記砥粒の粒径と、前記第２部分の前記砥粒の粒径は略同じで、
前記第１部分の前記芯線の直径と、前記第２部分の前記芯線の直径は略同じで、
前記第１部分の仕上げ径が、前記第２部分の仕上げ径よりも小さい、ソーワイヤ。 A core wire having a start end and abrasive grains fixed to the surface of the core wire are provided.
It has a first portion having a predetermined length connected to the starting end and a second portion connected to the first portion, and the particle size of the abrasive grains in the first portion and the abrasive grains in the second portion. The particle size of is almost the same,
The diameter of the core wire in the first portion and the diameter of the core wire in the second portion are substantially the same.
A saw wire in which the finishing diameter of the first portion is smaller than the finishing diameter of the second portion. 始端を有する芯線の表面に砥粒を固着する工程と、
前記砥粒をドレスする工程を有し、
前記始端に接続する所定長さの第１部分において、前記第１部分に接続する第２部分よりもドレス量を大きくする、ソーワイヤの製造方法。 The process of fixing the abrasive grains to the surface of the core wire having the starting end,
It has a step of dressing the abrasive grains, and has a step of dressing the abrasive grains.
A method for manufacturing a saw wire, wherein a first portion having a predetermined length connected to the starting end has a larger dress amount than a second portion connected to the first portion. 始端を有する芯線の表面に砥粒を固着する工程の前に、 Before the process of fixing the abrasive grains to the surface of the core wire having the starting end,
前記芯線の直径が、前記第１部分および前記第２部分において略同じものを準備する工程を有する、請求項２に記載のソーワイヤの製造方法。The method for manufacturing a saw wire according to claim 2, further comprising a step of preparing a core wire having substantially the same diameter in the first portion and the second portion. マルチワイヤソー装置と請求項１に記載のソーワイヤを用いて、前記ソーワイヤを往復走行させながら、複数本のインゴットをそれぞれ複数枚の基板に切断する、基板の製造方法であって、前記ソーワイヤ交換後１本目のインゴットは前記第１部分を用いて切断を開始し、２本目以降のインゴットは前記第２部分を用いて切断を開始する、基板の製造方法。 A method for manufacturing a substrate, wherein a plurality of ingots are cut into a plurality of substrates while the saw wire is reciprocated by using the multi-wire saw apparatus and the saw wire according to claim 1. After the saw wire is replaced, 1 A method for manufacturing a substrate, wherein the main ingot starts cutting using the first portion, and the second and subsequent ingots start cutting using the second portion.
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JP2010131715A (en) 2008-12-05 2010-06-17 Sharp Corp Saw wire, wire saw, method of cutting semi-conductor block using the same, method of manufacturing semiconductor wafer, and semiconductor wafer
JP2011230274A (en) 2010-04-30 2011-11-17 Sharp Corp Saw wire and method for cutting silicon ingot using the same
JP2015074037A (en) 2013-10-07 2015-04-20 株式会社安永 Fixed abrasive wire saw device and wafer manufacturing method using the same
JP2015188958A (en) 2014-03-27 2015-11-02 古河電気工業株式会社 Wire tool and production method thereof

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JP3566449B2 (en) * 1996-03-27 2004-09-15 信越半導体株式会社 Workpiece cutting method with wire saw

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Publication number Priority date Publication date Assignee Title
JP2010131715A (en) 2008-12-05 2010-06-17 Sharp Corp Saw wire, wire saw, method of cutting semi-conductor block using the same, method of manufacturing semiconductor wafer, and semiconductor wafer
JP2011230274A (en) 2010-04-30 2011-11-17 Sharp Corp Saw wire and method for cutting silicon ingot using the same
JP2015074037A (en) 2013-10-07 2015-04-20 株式会社安永 Fixed abrasive wire saw device and wafer manufacturing method using the same
JP2015188958A (en) 2014-03-27 2015-11-02 古河電気工業株式会社 Wire tool and production method thereof

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