JP7048336B2 - How to grind the holding surface - Google Patents

How to grind the holding surface Download PDF

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JP7048336B2
JP7048336B2 JP2018016323A JP2018016323A JP7048336B2 JP 7048336 B2 JP7048336 B2 JP 7048336B2 JP 2018016323 A JP2018016323 A JP 2018016323A JP 2018016323 A JP2018016323 A JP 2018016323A JP 7048336 B2 JP7048336 B2 JP 7048336B2
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grinding
center
holding
holding surface
grinding wheel
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JP2019130637A (en
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修 三浦
健 長井
有希子 木川
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Disco Corp
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Description

本発明は、保持テーブルの保持面を研削する研削方法に関する。 The present invention relates to a grinding method for grinding a holding surface of a holding table.

ウェーハを研削する研削装置は、ウェーハを保持する保持テーブルと、保持テーブルに保持されたウェーハに研削を施す研削砥石が固着された研削ホイールが回転可能に装着された研削手段とを備え、ウェーハを所定の厚みに研削することができる。研削装置において、研削ホイールや保持テーブルを交換等した後は、保持テーブルの保持面と研削砥石の研削面とを平行にするため、研削砥石で保持面を研削するセルフグラインドを実施している（例えば、下記の特許文献１を参照）。 A grinding device for grinding a wafer includes a holding table for holding the wafer and a grinding means for rotatably mounting a grinding wheel to which a grinding wheel for grinding the wafer held on the holding table is fixed. It can be ground to a predetermined thickness. After replacing the grinding wheel or holding table in the grinding device, self-grinding is performed to grind the holding surface with the grinding wheel in order to make the holding surface of the holding table parallel to the grinding surface of the grinding wheel (). For example, see Patent Document 1 below).

特開２０１４－２３７２１０号公報Japanese Unexamined Patent Publication No. 2014-237210

上記のセルフグラインドでは、保持テーブルの半径範囲に研削砥石の研削面を接触させて研削を行っていることから、保持テーブルの保持面が円錐形状に形成される。保持テーブルによって保持されるウェーハが厚い場合、ウェーハが保持面の形状にならわずに保持面の円錐面の頂点付近で保持面とウェーハの中央下面とに隙間が生じ、ウェーハの中央が研削され過ぎて薄くなるという問題がある。 In the above self-grinding, since the grinding surface of the grinding wheel is brought into contact with the radius range of the holding table for grinding, the holding surface of the holding table is formed in a conical shape. When the wafer held by the holding table is thick, the wafer does not follow the shape of the holding surface, and a gap is created between the holding surface and the lower center of the wafer near the apex of the conical surface of the holding surface, and the center of the wafer is ground. There is a problem that it becomes too thin.

本発明は、上記の事情に鑑みてなされたものであり、研削後のウェーハの中央が薄くなりすぎないように保持テーブルで保持できるようにすることを目的としている。 The present invention has been made in view of the above circumstances, and an object of the present invention is to enable the wafer to be held on a holding table so that the center of the wafer after grinding is not too thin.

本発明は、環状に研削砥石を配設した研削ホイールの中心を軸に回転させる研削手段と、ウェーハを保持する保持面の中心を軸に保持テーブルを回転させる保持手段とを備えた研削装置を用いて、該保持面の中心を通過する該研削砥石で該保持面を研削する保持面の研削方法であって、該保持面の中心を頂点とする略円錐面の該保持面を形成するように該研削ホイールの中心の該軸と該保持テーブルの中心の該軸とを相対的に傾けて該保持面の外周から該保持面の中心に至るまで該研削砥石の研削面を接触させ、該研削砥石で該保持面を研削して該保持面の中心を頂点とする略円錐面の該保持面を形成する第一の研削工程と、該第一の研削工程の該研削ホイールの中心の該軸と該保持テーブルの中心の該軸との傾きを、該研削ホイールの中心の該軸と該保持テーブルの中心の該軸とが略平行に近くなる方向に相対的に変更して、該第一の研削工程で用いた該研削砥石で該保持面の中央部分を研削する第二の研削工程と、を備える。 The present invention provides a grinding device including a grinding means for rotating a grinding wheel in which a grinding wheel is arranged in an annular shape around the center of a grinding wheel and a holding means for rotating a holding table around the center of a holding surface for holding a wafer. It is a method of grinding a holding surface by grinding the holding surface with the grinding grind that passes through the center of the holding surface, and forms the holding surface of a substantially conical surface having the center of the holding surface as an apex. The axis at the center of the grinding wheel and the axis at the center of the holding table are relatively tilted so that the grinding surface of the grinding wheel is brought into contact with the grinding wheel from the outer periphery of the holding surface to the center of the holding surface. The first grinding step of grinding the holding surface with a grinding wheel to form the holding surface of a substantially conical surface having the center of the holding surface as the apex, and the center of the grinding wheel in the first grinding step. The inclination of the axis and the axis at the center of the holding table is relatively changed in a direction in which the axis at the center of the grinding wheel and the axis at the center of the holding table are substantially parallel to each other . It comprises a second grinding step of grinding the central portion of the holding surface with the grinding grind used in one grinding step .

上記研削砥石は、ビトリファイドボンドとダイヤモンド砥粒とを混合して焼結させて固形化したビトリファイド砥石であることが好ましい。 The grinding wheel is preferably a vitrified grindstone obtained by mixing and sintering a vitrified bond and diamond abrasive grains to solidify the grindstone.

本発明に係る保持面の研削方法は、保持面の中心を頂点とする略円錐面の保持面を形成するように研削ホイールの中心の軸と保持テーブルの中心の軸とを相対的に傾けて保持面の外周から保持面の中心に至るまで研削砥石の研削面を接触させ、研削砥石で保持面を研削して保持面の中心を頂点とする略円錐面の保持面を形成する第一の研削工程と、第一の研削工程の研削ホイールの中心の軸と保持テーブルの中心の軸との傾きを、研削ホイールの中心の軸と保持テーブルの中心の軸とが略平行に近くなる方向に相対的に変更して、研削砥石で保持面の中央部分を研削する第二の研削工程とを備えたため、保持面の中央部分に平坦な凹み部を形成することができる。これにより、例えば厚みのあるウェーハを保持テーブルで保持する場合、中央に凹み部が形成された保持面でウェーハを隙間無く保持できるため、ウェーハの中央が過度に研削されるのを防ぐことができ、ウェーハを均等の厚さに研削することが可能となる。 In the method for grinding a holding surface according to the present invention, the central axis of the grinding wheel and the central axis of the holding table are relatively tilted so as to form a holding surface of a substantially conical surface having the center of the holding surface as an apex. The first is to bring the grinding surface of the grinding wheel into contact from the outer periphery of the holding surface to the center of the holding surface, and grind the holding surface with the grinding wheel to form a holding surface of a substantially conical surface having the center of the holding surface as the apex. In the direction in which the center axis of the grinding wheel and the center axis of the holding table are almost parallel to the center axis of the grinding wheel and the center axis of the holding table in the grinding process and the inclination of the center axis of the grinding wheel and the center axis of the holding table in the first grinding process. Since a second grinding step of grinding the central portion of the holding surface with a grinding grind is provided, which is relatively modified, a flat recessed portion can be formed in the central portion of the holding surface. As a result, for example, when a thick wafer is held on a holding table, the wafer can be held without a gap on the holding surface having a recess formed in the center, so that the center of the wafer can be prevented from being excessively ground. , The wafer can be ground to a uniform thickness.

上記研削砥石は、ビトリファイドボンドとダイヤモンド砥粒とを混合させ焼結させて固形化したビトリファイド砥石であることから、かかるビトリファイド砥石で保持面を研削すると、保持面の面状態を良好に仕上げることが可能となる。 Since the grinding wheel is a vitrified grindstone obtained by mixing and sintering a vitrified bond and diamond abrasive grains to solidify the grinding wheel, when the holding surface is ground with such a vitrified grindstone, the surface condition of the holding surface can be improved. It will be possible.

研削装置の一例の構成を示すとともに第一の研削工程を示す断面図である。It is sectional drawing which shows the structure of an example of a grinding apparatus, and also shows the 1st grinding process. 保持手段の構成を示す斜視図である。It is a perspective view which shows the structure of the holding means. 第二の研削工程を示す断面図である。It is sectional drawing which shows the 2nd grinding process. 第二の研削工程を実施した後の保持テーブルの状態を示す断面図である。It is sectional drawing which shows the state of the holding table after carrying out the 2nd grinding process.

図１に示す研削装置１は、本発明に係る保持面の研削方法に用いられる研削装置１の一例であり、研削ホイール１３の中心を通る回転軸１００を軸に回転させる研削手段１０と、ウェーハを保持する保持面２４ａの中心を通る回転軸２００を軸に保持テーブル２１を回転させる保持手段２０とを少なくとも備えている。 The grinding device 1 shown in FIG. 1 is an example of a grinding device 1 used in the method for grinding a holding surface according to the present invention, and is a grinding means 10 for rotating a rotating shaft 100 passing through the center of a grinding wheel 13 and a wafer. It is provided with at least a holding means 20 for rotating the holding table 21 around a rotating shaft 200 passing through the center of the holding surface 24a for holding.

研削手段１０は、鉛直方向の軸心を有するスピンドル１１と、マウント１２を介してスピンドル１１の下端に装着された研削ホイール１３と、研削ホイール１３の下部に環状に配設された複数の研削砥石１４とを備えている。研削手段１０には、研削手段１０を鉛直方向に昇降させる昇降手段１７と、スピンドル１１を回転させるモータ（図示せず）とが接続されている。 The grinding means 10 includes a spindle 11 having a vertical axis, a grinding wheel 13 mounted at the lower end of the spindle 11 via a mount 12, and a plurality of grinding wheels arranged in an annular shape under the grinding wheel 13. It is equipped with 14. The grinding means 10 is connected to an elevating means 17 for raising and lowering the grinding means 10 in the vertical direction and a motor (not shown) for rotating the spindle 11.

研削砥石１４は、ビトリファイドボンド１５とダイヤモンド砥粒１６とを混合して焼結させて固形化したビトリファイド砥石である。研削砥石１４の下面は、被研削物と接触する研削面１４ａとなっている。研削砥石１４は、例えば、ビトリファイドボンド１５にダイヤモンド砥粒１６を混入し、所定の型枠において混入したダイヤモンド砥粒１６にプレス加工を施し、その後、所定の温度で所定時間焼結することにより直方体形状に固形化されて製造される。 The grinding wheel 14 is a vitrified grindstone obtained by mixing and sintering a vitrified bond 15 and diamond abrasive grains 16 to solidify the grindstone 14. The lower surface of the grinding wheel 14 is a grinding surface 14a that comes into contact with the object to be ground. The grinding wheel 14 is a rectangular parallelepiped, for example, by mixing diamond abrasive grains 16 into a vitrified bond 15, pressing the diamond abrasive grains 16 mixed in a predetermined mold, and then sintering the diamond abrasive grains 16 at a predetermined temperature for a predetermined time. Manufactured by solidifying into a shape.

本実施形態に示す研削砥石１４では、ダイヤモンド砥粒１６を固めるボンド材としてビトリファイドボンド１５を利用していることから、他のボンド材（例えばレジンボンドやメタルボンド）と比べて比較的硬く、研削砥石１４で保持面２４ａを研削すると、保持面２４ａの面状態を良好に仕上げることが可能となる。また、ボンド材としてビトリファイドボンド１５を用いることでダイヤモンド砥粒１６を強固に保持でき、研削効率が向上して研削砥石１４の寿命も長くなる。したがって、研削砥石１４の交換頻度が少なくて済むため、有用である。 In the grinding wheel 14 shown in the present embodiment, since the vitrified bond 15 is used as the bonding material for solidifying the diamond abrasive grains 16, the grinding wheel 14 is relatively hard compared to other bonding materials (for example, resin bond or metal bond) and is ground. When the holding surface 24a is ground with the grindstone 14, the surface condition of the holding surface 24a can be satisfactorily finished. Further, by using the vitrified bond 15 as the bond material, the diamond abrasive grains 16 can be firmly held, the grinding efficiency is improved, and the life of the grinding wheel 14 is extended. Therefore, the grinding wheel 14 needs to be replaced less frequently, which is useful.

保持手段２０は、ウェーハを吸引保持する保持テーブル２１と、保持テーブル２１の回転軸２００を回転させる図２に示すモータ２２とを少なくとも備えている。保持テーブル２１は、中央に凹状の嵌合溝２３０を有する枠体２３と、枠体２３に収容されるポーラス部材２４とを備えている。枠体２３は、例えばセラミックス等によって構成されている。ポーラス部材２４が枠体２３の嵌合溝２３０に嵌め込まれることにより、保持テーブル２１として構成される。 The holding means 20 includes at least a holding table 21 that sucks and holds the wafer, and a motor 22 shown in FIG. 2 that rotates the rotating shaft 200 of the holding table 21. The holding table 21 includes a frame body 23 having a concave fitting groove 230 in the center, and a porous member 24 housed in the frame body 23. The frame body 23 is made of, for example, ceramics or the like. The porous member 24 is fitted into the fitting groove 230 of the frame body 23 to form a holding table 21.

ポーラス部材２４は、円盤状に形成されており、ポーラスセラミックス等の多孔質部材によって構成されている。ポーラス部材２４の上面がウェーハを保持する保持面２４ａである。保持面２４ａは、例えば直径３００ｍｍに形成されている。また、ポーラス部材２４の保持面２４ａは、保持面２４ａの中心Ｃから保持面２４ａの外周Ｅにかけて傾斜した略円錐面となっており、図示に示す中心Ｃは略円錐面の頂点となっている。保持面２４ａの中心Ｃと外周Ｅの高さ差Ｈは、例えば３０μｍ程度に形成されている。 The porous member 24 is formed in a disk shape and is made of a porous member such as porous ceramics. The upper surface of the porous member 24 is a holding surface 24a for holding the wafer. The holding surface 24a is formed to have a diameter of, for example, 300 mm. Further, the holding surface 24a of the porous member 24 is a substantially conical surface inclined from the center C of the holding surface 24a to the outer peripheral E of the holding surface 24a, and the center C shown in the figure is the apex of the substantially conical surface. .. The height difference H between the center C and the outer circumference E of the holding surface 24a is formed to be, for example, about 30 μm.

図２に示すように、枠体２３には、環状のフランジ２５が一体的に形成されている。保持テーブル２１の傾きを調整するために、フランジ２５の円周方向に互いに１２０度離間して例えば３つの傾き調整手段３０が配設されている。フランジ２５には、円周方向にそれぞれ例えば１２０度離間して３つの貫通穴（図示せず）が形成されている。傾き調整手段３０は、フランジ２５に形成された各貫通穴に挿通されたボルト３１と、一端にボルト３１が係合されたロッド３２と、ボルト３１を上下方向に移動させるパルスモータ３３とにより構成されている。ロッド３２の内部には、雌ネジ穴が形成されており、雌ネジ穴にパルスモータ３３の軸部３４に形成された雄ネジ３５が螺合している。そして、パルスモータ３３が駆動することにより雄ネジ３５が回転しボルト３１を上下方向に移動させ、保持面２４ａの高さ位置を調整して保持面２４ａの傾きを調整することができる。 As shown in FIG. 2, an annular flange 25 is integrally formed on the frame body 23. In order to adjust the inclination of the holding table 21, for example, three inclination adjusting means 30 are arranged 120 degrees apart from each other in the circumferential direction of the flange 25. The flange 25 is formed with three through holes (not shown) separated by, for example, 120 degrees in the circumferential direction. The inclination adjusting means 30 includes a bolt 31 inserted into each through hole formed in the flange 25, a rod 32 in which the bolt 31 is engaged at one end, and a pulse motor 33 for moving the bolt 31 in the vertical direction. Has been done. A female screw hole is formed inside the rod 32, and a male screw 35 formed on the shaft portion 34 of the pulse motor 33 is screwed into the female screw hole. Then, when the pulse motor 33 is driven, the male screw 35 rotates to move the bolt 31 in the vertical direction, and the height position of the holding surface 24a can be adjusted to adjust the inclination of the holding surface 24a.

次に、研削装置１を用いて、保持テーブル２１の保持面２４ａを研削する保持面の研削方法について詳述する。本実施形態では、厚みのあるウェーハを保持テーブル２１の保持面２４ａで保持するために、予め保持面２４ａを研削するものとする。 Next, a method for grinding the holding surface 24a of the holding table 21 using the grinding device 1 will be described in detail. In the present embodiment, in order to hold the thick wafer on the holding surface 24a of the holding table 21, the holding surface 24a is ground in advance.

（１） 第一の研削工程
まず、保持面２４ａの中心Ｃを頂点とする略円錐面の保持面２４ａを形成するように、図２に示した傾き調整手段３０によって、例えば保持テーブル２１の正面視における外周右側を上げることにより、研削砥石１４の中心の回転軸１００と保持テーブル２１の中心の回転軸２００とを相対的に第一の角度だけ傾けて、研削砥石１４の研削面１４ａを保持面２４ａの円錐面の頂点（中心Ｃ）から外周Ｅに至る面に対して平行となるように調整する。 (1) First Grinding Step First, by the tilt adjusting means 30 shown in FIG. 2, for example, the front surface of the holding table 21 so as to form the holding surface 24a of a substantially conical surface having the center C of the holding surface 24a as the apex. By raising the right side of the outer circumference in view, the rotating shaft 100 at the center of the grinding cone 14 and the rotating shaft 200 at the center of the holding table 21 are relatively tilted by the first angle to hold the grinding surface 14a of the grinding grinding stone 14. Adjust so that it is parallel to the surface from the apex (center C) of the conical surface of the surface 24a to the outer circumference E.

次いで、モータ２２によって保持テーブル２１を例えば矢印Ａ方向に回転させる。昇降手段１７により研削手段１０を下降させつつ、研削手段１０は、スピンドル１１を回転させることにより、研削ホイール１３を例えば矢印Ａ方向に回転させ、研削砥石１４の研削面１４ａを保持面２４ａの外周Ｅから保持面２４ａの中心Ｃに至るまで接触させて研削する。保持面２４ａの研削中は、研削砥石１４は常に保持面２４ａの中心Ｃを通過する。このようにして、研削砥石１４で保持面２４ａを研削して保持面２４ａの中心Ｃを頂点とする略円錐面の保持面２４ａを形成する。 Next, the holding table 21 is rotated by the motor 22 in the direction of arrow A, for example. While lowering the grinding means 10 by the elevating means 17, the grinding means 10 rotates the grinding wheel 13 in the direction of arrow A, for example, by rotating the spindle 11, and holds the grinding surface 14a of the grinding wheel 14 on the outer periphery of the holding surface 24a. Grinding is performed by contacting from E to the center C of the holding surface 24a. During grinding of the holding surface 24a, the grinding wheel 14 always passes through the center C of the holding surface 24a. In this way, the holding surface 24a is ground with the grinding wheel 14 to form the holding surface 24a having a substantially conical surface having the center C of the holding surface 24a as the apex.

（２）第二の研削工程
図３に示すように、第一の研削工程の研削ホイール１３の中心の回転軸１００と保持テーブル２１の中心の回転軸２００との傾きを、回転軸１００と回転軸２００とが略平行に近くなる方向に相対的に変更する。具体的には、図２に示した傾き調整手段３０によって、例えば保持テーブル２１の正面視における外周右側をわずかに下げることにより、第二の角度だけ保持面２４ａを傾け、研削面１４ａを保持面２４ａの円錐面の頂点（中心Ｃ）から外周Ｅに至る面に対して非平行となるように調整する。このようにして、研削砥石１４で保持面２４ａの中央部分を平坦に形成しうる位置に保持面２４ａの傾きを変更したら、研削砥石１４で保持面２４ａの中央部分を研削することにより、図４に示すように、保持面２４ａの中央部分に平坦な凹み部２６を形成する。凹み部２６の矢印で示す径は、例えば直径３０ｍｍである。保持面２４ａの研削が完了したら、ウェーハを保持テーブル２１で保持し、ウェーハに対して研削を施す。本実施形態では、保持手段２０側に傾き調整手段３０を備えたが、この構成に限られず、研削手段１０側に傾き調整手段を備えることで回転軸１００の傾きを調整するようにしてもよい。 (2) Second Grinding Process As shown in FIG. 3, the inclination of the central rotary shaft 100 of the grinding wheel 13 and the central rotary shaft 200 of the holding table 21 in the first grinding step is rotated with the rotary shaft 100. The direction is changed so that the axis 200 is substantially parallel to the axis 200. Specifically, the holding surface 24a is tilted by a second angle by the tilt adjusting means 30 shown in FIG. 2, for example, by slightly lowering the outer peripheral right side in the front view of the holding table 21, and the grinding surface 14a is held. Adjust so that it is non-parallel to the surface from the apex (center C) of the conical surface of 24a to the outer circumference E. In this way, after changing the inclination of the holding surface 24a to a position where the central portion of the holding surface 24a can be formed flat by the grinding wheel 14, the central portion of the holding surface 24a is ground by the grinding wheel 14 in FIG. As shown in the above, a flat recess 26 is formed in the central portion of the holding surface 24a. The diameter indicated by the arrow of the recess 26 is, for example, a diameter of 30 mm. When the grinding of the holding surface 24a is completed, the wafer is held by the holding table 21 and the wafer is ground. In the present embodiment, the tilt adjusting means 30 is provided on the holding means 20 side, but the present invention is not limited to this configuration, and the tilt of the rotating shaft 100 may be adjusted by providing the tilt adjusting means on the grinding means 10 side. ..

以上のとおり、本発明に係る保持面の研削方法は、保持面２４ａの中心Ｃを頂点とする略円錐面の保持面２４ａを形成するように研削ホイール１３の中心の回転軸１００と保持テーブル２１の中心の回転軸２００とを相対的に傾けて保持面２４ａの外周Ｅから保持面２４ａの中心Ｃに至るまで研削砥石１４の研削面１４ａを接触させ、研削砥石１４で保持面２４ａを研削して保持面２４ａの中心Ｃを頂点とする略円錐面の保持面２４ａを形成する第一の研削工程と、第一の研削工程の研削ホイール１３の中心の回転軸１００と保持テーブル２１の中心の回転軸２００との傾きを、回転軸１００と回転軸２００とが略平行に近くなる方向に相対的に変更して、研削砥石１４で保持面２４ａの中央部分を研削する第二の研削工程とを備えたため、保持面２４ａの中央に平坦な凹み部２６を形成することができる。
保持面２４ａの中央に凹み部２６が形成された保持テーブル２１では、例えば厚みのあるウェーハを吸引保持する際、凹み部２６にならってウェーハの中央部分も吸引保持できるため、保持面２４ａの中央とウェーハの中央部分との間に隙間が生じることはなくなる。したがって、保持面２４ａでウェーハを隙間無く保持できるため、ウェーハの中央が過度に研削されるのを防ぐことができ、ウェーハを均等の厚さに研削することが可能となる。 As described above, in the method for grinding the holding surface according to the present invention, the rotation axis 100 at the center of the grinding wheel 13 and the holding table 21 so as to form the holding surface 24a of a substantially conical surface having the center C of the holding surface 24a as the apex. The grinding surface 14a of the grinding machine 14 is brought into contact with the rotating shaft 200 at the center of the grinding wheel 14 from the outer periphery E of the holding surface 24a to the center C of the holding surface 24a, and the holding surface 24a is ground by the grinding wheel 14. In the first grinding step of forming the holding surface 24a of a substantially conical surface having the center C of the holding surface 24a as the apex, and the center of the rotating shaft 100 of the grinding wheel 13 and the center of the holding table 21 in the first grinding step. A second grinding step in which the inclination of the rotating shaft 200 is relatively changed in a direction in which the rotating shaft 100 and the rotating shaft 200 are substantially parallel to each other, and the central portion of the holding surface 24a is ground by the grinding tool 14. Therefore, a flat recess 26 can be formed in the center of the holding surface 24a.
In the holding table 21 in which the recessed portion 26 is formed in the center of the holding surface 24a, for example, when sucking and holding a thick wafer, the central portion of the wafer can be sucked and held in accordance with the recessed portion 26, so that the center of the holding surface 24a is held. There will be no gap between the wafer and the center of the wafer. Therefore, since the wafer can be held without a gap by the holding surface 24a, it is possible to prevent the center of the wafer from being excessively ground, and it is possible to grind the wafer to a uniform thickness.

１：研削装置
１０：研削手段 １１：スピンドル １２：マウント １３：研削ホイール
１４：研削砥石 １５：ビトリファイドボンド １６：ダイヤモンド砥粒
１７：昇降手段
２０：保持手段 ２１：保持テーブル ２２：モータ ２３：枠体
２４：ポーラス部材 ２５：フランジ ２６：凹み部
３０：傾き調整手段 ３１：ボルト ３２：ロッド ３３：パルスモータ ３４：軸部
３５：雄ネジ 1: Grinding device 10: Grinding means 11: Spindle 12: Mount 13: Grinding wheel 14: Grinding wheel 15: Vitrified bond 16: Diamond abrasive grains 17: Elevating means 20: Holding means 21: Holding table 22: Motor 23: Frame 24: Porous member 25: Flange 26: Recessed part 30: Tilt adjusting means 31: Bolt 32: Rod 33: Pulse motor 34: Shaft part 35: Male screw

Claims (2)

環状に研削砥石を配設した研削ホイールの中心を軸に回転させる研削手段と、ウェーハを保持する保持面の中心を軸に保持テーブルを回転させる保持手段とを備えた研削装置を用いて、該保持面の中心を通過する該研削砥石で該保持面を研削する保持面の研削方法であって、
該保持面の中心を頂点とする略円錐面の該保持面を形成するように該研削ホイールの中心の該軸と該保持テーブルの中心の該軸とを相対的に傾けて該保持面の外周から該保持面の中心に至るまで該研削砥石の研削面を接触させ、該研削砥石で該保持面を研削して該保持面の中心を頂点とする略円錐面の該保持面を形成する第一の研削工程と、
該第一の研削工程の該研削ホイールの中心の該軸と該保持テーブルの中心の該軸との傾きを、該研削ホイールの中心の該軸と該保持テーブルの中心の該軸とが略平行に近くなる方向に相対的に変更して、該第一の研削工程で用いた該研削砥石で該保持面の中央部分を研削する第二の研削工程と、を備える保持面の研削方法。 Using a grinding device provided with a grinding means for rotating the center of the grinding wheel in which the grinding wheels are arranged in an annular shape around the center of the grinding wheel and a holding means for rotating the holding table around the center of the holding surface for holding the wafer. A method for grinding a holding surface by grinding the holding surface with the grinding wheel that passes through the center of the holding surface.
The outer circumference of the holding surface is tilted relatively between the axis at the center of the grinding wheel and the axis at the center of the holding table so as to form the holding surface of a substantially conical surface having the center of the holding surface as an apex. The grinding surface of the grinding wheel is brought into contact with the holding surface from the surface to the center of the holding surface, and the holding surface is ground with the grinding wheel to form the holding surface of a substantially conical surface having the center of the holding surface as an apex. One grinding process and
The inclination of the axis at the center of the grinding wheel and the axis at the center of the holding table in the first grinding step is substantially parallel to the axis at the center of the grinding wheel and the axis at the center of the holding table. A method for grinding a holding surface, comprising a second grinding step of grinding a central portion of the holding surface with the grinding grind used in the first grinding step, which is relatively changed in a direction closer to. 前記研削砥石は、ビトリファイドボンドとダイヤモンド砥粒とを混合して焼結させて固形化したビトリファイド砥石である請求項１記載の保持面の研削方法。 The method for grinding a holding surface according to claim 1, wherein the grinding wheel is a vitrified grindstone obtained by mixing and sintering a vitrified bond and diamond abrasive grains to solidify the grindstone.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059949A (en) 1999-09-20 2007-03-08 Shin Etsu Handotai Co Ltd Method for manufacturing semiconductor wafer
JP2014024153A (en) 2012-07-26 2014-02-06 Disco Abrasive Syst Ltd Manufacturing method of substrate material for optical device
JP2014037020A (en) 2012-08-14 2014-02-27 Disco Abrasive Syst Ltd Grinding device
JP2015131354A (en) 2014-01-10 2015-07-23 株式会社ディスコ Chuck table and grinding device
JP2016016462A (en) 2014-07-04 2016-02-01 株式会社ディスコ Grinding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059949A (en) 1999-09-20 2007-03-08 Shin Etsu Handotai Co Ltd Method for manufacturing semiconductor wafer
JP2014024153A (en) 2012-07-26 2014-02-06 Disco Abrasive Syst Ltd Manufacturing method of substrate material for optical device
JP2014037020A (en) 2012-08-14 2014-02-27 Disco Abrasive Syst Ltd Grinding device
JP2015131354A (en) 2014-01-10 2015-07-23 株式会社ディスコ Chuck table and grinding device
JP2016016462A (en) 2014-07-04 2016-02-01 株式会社ディスコ Grinding method

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