JP7038726B2 - 実装構造体の製造方法およびこれに用いられるシート - Google Patents
実装構造体の製造方法およびこれに用いられるシート Download PDFInfo
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- JP7038726B2 JP7038726B2 JP2019545689A JP2019545689A JP7038726B2 JP 7038726 B2 JP7038726 B2 JP 7038726B2 JP 2019545689 A JP2019545689 A JP 2019545689A JP 2019545689 A JP2019545689 A JP 2019545689A JP 7038726 B2 JP7038726 B2 JP 7038726B2
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Description
実装構造体10は、第1回路部材1と、第1回路部材1に搭載される複数の第2回路部材2と、第2回路部材2を封止する封止材4と、を備える。複数の第2回路部材2の少なくとも一つは、第1回路部材1との間に形成される空間(内部空間S)を備える中空部材である。封止材4は、シート4P(図2参照)の硬化物である。本発明は、このシート4Pを包含する。封止材4は、第1硬化層41および第2硬化層42を備える。第1硬化層41および第2硬化層42はそれぞれ、後述する第1層41Pおよび第2層42Pの硬化物である。シート4Pは未硬化物または半硬化物であり、第1層41Pおよび第2層42Pもまた、それぞれ未硬化物または半硬化物である。
シート4Pは、複数の第2回路部材2を一括して封止する部材である。
シート4Pによれば、中空部材を含み、かつ、様々な間隔で配置された複数の第2回路部材2を、中空部材の内部空間Sを維持しながら、一括して封止することができる。つまり、複数の第2回路部材2は、1種のシート4Pあるいは1枚のシート4Pにより封止できる。通常、離間距離が小さいほど、シート4Pは回路部材同士の隙間に入り込み難くなる。しかし、シート4Pは、内部空間Sに入り込まない程度の弾性と、離間距離の大小にかかわらず第2回路部材2間に入り込んで、伸展できる程度の粘性と、を有する。
治具:Extensional Viscosity Fixture
試料:長さ30mm、幅10mm、厚み100μm
せん断速度:0.1s-1
封止前の熱硬化性樹脂は、未硬化状態でもよく、半硬化状態でもよい。半硬化状態とは、熱硬化性樹脂がモノマーおよび/またはオリゴマーを含む状態であり、熱硬化性樹脂の三次元架橋構造の発達が不十分な状態をいう。半硬化状態の熱硬化性樹脂は、室温(25℃)では溶剤に溶解しないが硬化は不完全な状態、いわゆるBステージにある。
以下、第1層41Pおよび第2層42Pがともに流動制御層であり、かつ、tanδ1<tanδ2である場合を例に挙げて説明する。
第1層41Pは、一方の最外に配置され、封止工程において第2回路部材2に対向する。
温度tにおいて、第1層41Pを構成する第1樹脂組成物(以下、第1樹脂と称す)の損失正接tanδ1は、0.1以上、0.8以下であり、かつ、貯蔵せん断弾性率G1’は1×104Pa以上、1×107Pa以下である。
第2層42Pは、第1層41Pに隣接する層である。tanδ1<tanδ2を満たす第2層42Pは、シート4Pが内部空間Sに入り込むのを抑制する機能を有する。つまり、第2層42Pにより、シート4Pの内部空間Sへの進入量が制御される。
本実施形態にかかる製造方法を、図3を参照しながら説明する。図3は、本実施形態にかかる製造方法を、実装部材あるいは実装構造体10の断面により模式的に示す説明図である。
以下、シート4Pが、第1層41Pおよび第2層42Pを備える場合を例に挙げて、各工程を説明する。
第1回路部材1と、第1回路部材1に搭載される複数の第2回路部材2と、を備える実装部材を準備する(図3(a))。
第1層41Pおよび第2層42Pを備えるシート4Pを準備する(図3(a))。
積層体であるシート4Pの製造方法は、特に限定されない。シート4Pは、各層を別途作成した後、積層する(ラミネート法)ことにより形成されてもよいし、各層の材料を順次、コーティングする(コーティング法)ことにより形成されてもよい。
単層体であるシート4Pも、上記の薄膜と同様の方法により作製される。
シート4Pを、第1層41Pが第2回路部材2に対向するように実装部材に配置する。このとき、複数の第2回路部材2を、一枚のシート4Pで覆う。
シート4Pを第1回路部材1に対して押圧するとともに(図3(b))、シート4Pを加熱する。これにより、内部空間Sを維持しながら、第2回路部材2が封止される。シート4Pは、第2回路部材2の封止と同時に、あるいは第2回路部材2が封止された後、硬化する(図3(c))。
次に、実施例に基づいて、本発明をより具体的に説明する。ただし、以下の実施例は、本発明を限定するものではない。
(1)シート4Pの作製
単層体であるシートX1(厚み250μm)を、以下の樹脂組成物(流動制御樹脂X1)を用いて、コーティング法により作製した。
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):80部
アクリル樹脂(熱可塑性樹脂):50部
溶融球状シリカ(無機充填剤):400部
イミダゾール(硬化促進剤):2部
ガラス基板(第1回路部材、50mm角、厚み0.2mm)に、3つの同型のSAWチップA~SAWチップC(第2回路部材、1.1mm×1.1mm、高さ0.2mm)を、金バンプ(直径100μm、高さ20μm)を介して、この順に並べて搭載することにより実装部材を得た。SAWチップAとSAWチップBとの間の離間距離D1は0.4mmであり、SAWチップBとSAWチップCとの間の離間距離D2は0.1mmであった。
得られた実装部材をシートX1で封止して、実装構造体を得た。封止は、シートX1を100℃で加熱しながら、減圧雰囲気下(400Pa)で行った。
得られた実装構造体をガラス基板側から光学顕微鏡で観察し、以下の評価法に従って評価した。結果を表1に示す。
最良:すべてのSAWチップとガラス基板との間に、十分な内部空間が形成されている。さらに、SAWチップAとSAWチップB、SAWチップBとSAWチップCとの間にはいずれも、樹脂が隙間なく充填されている。
良*1:すべてのSAWチップとガラス基板との間に、十分な内部空間が形成されている。加えて、SAWチップAとSAWチップB、SAWチップBとSAWチップCとの間にはいずれも、樹脂が充填されているが、SAWチップBとSAWチップCとの間に小さなボイドが確認できる。
良*2:SAWチップAとSAWチップB、SAWチップBとSAWチップCとの間にはいずれも樹脂が隙間なく充填されている。加えて、すべてのSAWチップとガラス基板との間に十分な内部空間が形成されているが、SAWチップA、SAWチップB、SAWチップCとの間で、内部空間の大きさのバラツキ(樹脂の侵入量のバラツキ)が認められる。
不良:SAWチップAとSAWチップB、SAWチップBとSAWチップCとの間にはいずれも樹脂が隙間なく充填されている。ただし、SAWチップA、SAWチップBとガラス基板との間に樹脂が大きく侵入しており、十分な内部空間が形成されていない。
第1層X21(12μm)および第2層X22(250μm)を備えるシートX2を用いたこと以外、実施例1と同様にして実装構造体を作製し、評価した。結果を表1に示す。
(第1樹脂X21)
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):60部
アクリル樹脂(熱可塑性樹脂):60部
溶融球状シリカ(無機充填剤):100部
イミダゾール(硬化促進剤):2部
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):80部
アクリル樹脂(熱可塑性樹脂):50部
溶融球状シリカ(無機充填剤):400部
イミダゾール(硬化促進剤):2部
第1層X31(40μm)および第2層X32(250μm)を備えるシートX3を用いたこと以外、実施例1と同様にして実装構造体を作製し、評価した。結果を表1に示す。
(第1樹脂X31)
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):60部
アクリル樹脂(熱可塑性樹脂):20部
溶融球状シリカ(無機充填剤):250部
イミダゾール(硬化促進剤):2部
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):60部
アクリル樹脂(熱可塑性樹脂):25部
溶融球状シリカ(無機充填剤):900部
イミダゾール(硬化促進剤):2部
第1層Y11(15μm)および第2層Y12(250μm)を備えるシートY1を用いたこと以外、実施例1と同様にして実装構造体を作製し、評価した。結果を表1に示す。
(第1樹脂Y11)
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):60部
フェノキシ樹脂(熱可塑性樹脂):20部
溶融球状シリカ(無機充填剤):250部
イミダゾール(硬化促進剤):2部
エポキシ樹脂(熱硬化性樹脂):100部
フェノールノボラック(硬化剤):60部
フェノキシ樹脂(熱可塑性樹脂):35部
溶融球状シリカ(無機充填剤):340部
イミダゾール(硬化促進剤):2部
1:第1回路部材
2:第2回路部材
21:基準部材
22:第1の隣接部材
23:第2の隣接部材
3:バンプ
4:封止材(シートの硬化物)
41:第1硬化層(硬化した第1層)
42:第2硬化層(硬化した第2層)
4P:シート
41P:第1層
42P:第2層
Claims (9)
- 第1回路部材と、前記第1回路部材に搭載される複数の第2回路部材と、を備える実装部材を準備する工程と、
熱硬化性のシートを準備する工程と、
前記シートを、前記第2回路部材に対向するように前記実装部材に配置する配置工程と、
前記シートを前記第1回路部材に対して押圧するとともに、前記シートを加熱することにより前記第2回路部材を封止し、前記シートを硬化させる封止工程と、を具備し、
前記第2回路部材は、基準部材と、前記基準部材にそれぞれ隣接する第1の隣接部材および第2の隣接部材と、を備え、
前記基準部材と前記第1の隣接部材との間の離間距離D1と、前記基準部材と前記第2の隣接部材との間の離間距離D2とは、異なっており、
さらに、複数の前記第2回路部材の少なくとも一つは、前記第1回路部材との間に形成される空間を備える中空部材であり、
前記シートは、一方の最外に配置され、前記第2回路部材に対向する第1層と、前記第1層に隣接する第2層と、を備え、
前記第1層は、熱硬化性樹脂を含む第1樹脂組成物により構成され、
前記第2層は、熱硬化性樹脂を含む第2樹脂組成物により構成され、
前記第1樹脂組成物の前記第2回路部材が封止されるときの温度tにおける損失正接tanδは、前記第2樹脂組成物の前記温度tにおける損失正接tanδよりも小さく、
前記封止工程では、前記空間を維持しながら、複数の前記第2回路部材が封止される、実装構造体の製造方法。 - (削除)
- 前記第1樹脂組成物および前記第2樹脂組成物の少なくとも一方は、前記温度tにおいて、損失正接tanδが、0.1以上、0.8以下、および、貯蔵せん断弾性率が、1×104Pa以上、1×107Pa以下を満たす、請求項1に記載の実装構造体の製造方法。
- 前記第1樹脂組成物および前記第2樹脂組成物がともに、前記温度tにおいて、損失正接tanδが、0.1以上、0.8以下、および、貯蔵せん断弾性率が、1×104Pa以上、1×107Pa以下を満たし、
前記第1樹脂組成物により構成された厚み100μmの層の前記温度tにおける伸び率は、1000%以上であり、
前記第1層の厚みは、50μm以下である、請求項3に記載の実装構造体の製造方法。 - 前記基準部材からの前記第1の隣接部材の高さΔH1と、前記基準部材からの前記第2の隣接部材の高さΔH2とは、異なっている、請求項1、3または4に記載の実装構造体の製造方法。
- 第1回路部材と、前記第1回路部材に搭載される複数の第2回路部材と、を備える実装部材を封止するために用いられるシートであって、
一方の最外に配置され、前記第2回路部材に対向させる第1層と、前記第1層に隣接する第2層とを備えており、
前記第1層は、熱硬化性樹脂を含む第1樹脂組成物により構成され、
前記第2層は、熱硬化性樹脂を含む第2樹脂組成物により構成され、
前記第1樹脂組成物の前記第2回路部材が封止されるときの温度tにおける損失正接tanδは、前記第2樹脂組成物の前記温度tにおける損失正接tanδよりも小さく、
前記第2回路部材は、基準部材と、前記基準部材にそれぞれ隣接する第1の隣接部材および第2の隣接部材と、を備え、
前記基準部材と前記第1の隣接部材との間の離間距離D1と、前記基準部材と前記第2の隣接部材との間の離間距離D2とは、異なっており、
複数の前記第2回路部材の少なくとも一つは、前記第1回路部材との間に形成される空間を備える中空部材である、シート。 - 前記第1樹脂組成物および前記第2樹脂組成物の少なくとも一方は、前記温度tにおいて、損失正接tanδが、0.1以上、0.8以下、および、貯蔵せん断弾性率が、1×104Pa以上、1×107Pa以下を満たす、請求項6に記載のシート。
- 前記第1樹脂組成物および前記第2樹脂組成物がともに、前記温度tにおいて、損失正接tanδが、0.1以上、0.8以下、および、前記温度tにおける貯蔵せん断弾性率が、1×104Pa以上、1×107Pa以下を満たし、
前記第1樹脂組成物により構成された厚み100μmの層の前記温度tにおける伸び率は、1000%以上であり、
前記第1層の厚みは、50μm以下である、請求項7に記載のシート。 - 前記第2層の全体が前記第1層に隣接する、請求項6~8のいずれか一項に記載のシート。
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