JP7023629B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
- Publication number
- JP7023629B2 JP7023629B2 JP2017133344A JP2017133344A JP7023629B2 JP 7023629 B2 JP7023629 B2 JP 7023629B2 JP 2017133344 A JP2017133344 A JP 2017133344A JP 2017133344 A JP2017133344 A JP 2017133344A JP 7023629 B2 JP7023629 B2 JP 7023629B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- pulse width
- beam splitter
- wavelength
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0732—Shaping the laser spot into a rectangular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/353—Frequency conversion, i.e. wherein a light beam is generated with frequency components different from those of the incident light beams
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/355—Non-linear optics characterised by the materials used
- G02F1/3551—Crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/35—Non-linear optics
- G02F1/353—Frequency conversion, i.e. wherein a light beam is generated with frequency components different from those of the incident light beams
- G02F1/354—Third or higher harmonic generation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0092—Nonlinear frequency conversion, e.g. second harmonic generation [SHG] or sum- or difference-frequency generation outside the laser cavity
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
図1には、本発明に基づき構成されたレーザー加工装置2の全体斜視図が示されている。レーザー加工装置2は、被加工物を保持する保持手段22と、静止基台2a上に配設され保持手段22を移動させる移動手段23と、保持手段22に保持された被加工物にレーザー光線を照射するレーザー光線照射手段24と、静止基台2a上の移動手段23の側方に矢印Zで示すZ方向に立設される垂直壁部51、及び垂直壁部51の上端部から水平方向に延びる水平壁部52からなる枠体50とを備えている。枠体50の水平壁部52内部には、本発明のレーザー加工装置2の主要部を構成するレーザー光線照射手段24の光学系が内蔵されており、水平壁部52の先端部下面側には、レーザー光線照射手段24を構成する集光器241が配設されると共に、集光器241に対して図中矢印Xで示す方向で隣接する位置に撮像手段26が配設される。なお、保持手段22は、図中左上方に拡大して示す粘着テープTを介して環状のフレームFに保持された被加工物(ウエーハ10)を保持する。なお、本実施形態では、ウエーハ10は、Si(シリコン)基板から構成され、Siに対して吸収性を有する355nm波長のパルスレーザー光線を照射してアブレーション加工を実施する場合について説明するが、本発明のレーザー加工装置がこれに限定されるものではないことはいうまでもない。
2a:静止基台
10:ウエーハ
12:分割予定ライン
14:デバイス
22:保持手段
23:移動手段
24:レーザー光線照射手段
241:集光器
242:レーザー発振器
243:アッテネータ
244:1/2波長板
245:ビームスプリッター
246:第一の1/4波長板
247:パルス幅調整手段
248:波長変換手段
249:第二の1/4波長板
250:ミラー
30:X方向可動板
31:Y方向可動板
32:支柱
33:カバー板
34:チャックテーブル
35:吸着チャック
42:X方向移動手段
43:Y方向移動手段
50:枠体
T:粘着テープ
F:フレーム
Claims (5)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物に線幅をもった波長のパルスレーザー光線を照射するレーザー光線照射手段と、該保持手段と該レーザー光線照射手段とを相対的に加工送りする手段と、を少なくとも備えたレーザー加工装置であって、
該レーザー光線照射手段は、パルスレーザー光線を発振するレーザー発振器と、該レーザー発振器が発振したパルスレーザー光線を集光する集光器と、該レーザー発振器が発振したパルスレーザー光線の方向を変換するビームスプリッターと、を備えると共に、
該レーザー発振器と該集光器との間に該線幅におけるパルスレーザー光線の波長域に時間差を生じさせてパルス幅を調整するパルス幅調整手段が配設され、
該集光器は、該ビームスプリッターによって方向が変換されたパルスレーザー光線を集光し、該パルス幅調整手段は、該ビームスプリッターを挟んで該レーザー発振器の反対側に配設され、
該レーザー発振器と該ビームスプリッターとの間に配設され該ビームスプリッターに対してP偏光、S偏光を選択的に位置付ける1/2波長板と、該ビームスプリッターと該パルス幅調整手段との間に配設され該1/2波長板によって選択されたP偏光を円偏光に変換する第一の1/4波長板と、を備えることにより、
該パルス幅調整手段によって回転方向が逆転したパルスレーザー光線が該第一の1/4波長板に導かれてS偏光に変換され、S偏光に変換されたパルスレーザー光線が該ビームスプリッターに導かれ、該ビームスプリッターによって進行方向が変換されたパルスレーザー光線が該集光器に導かれるレーザー加工装置。 - 該ビームスプリッターを挟んで該該集光器の反対側に配設された第二の1/4波長板と、該第二の1/4波長板に対向して配設されたミラーと、を備え、
該1/2波長板によって選択されたS偏光は該ビームスプリッターによって該第二の1/4波長板に導かれて円偏光に変換され、該ミラーによって回転方向が逆転したパルスレーザー光線が該第二の1/4波長板に導かれてP偏光に変換され、P偏光に変換されたパルスレーザー光線が該ビームスプリッターから該集光器に導かれる請求項1に記載のレーザー加工装置。 - 該パルス幅調整手段は、第一の端面と該第一の端面の反対側の第二の端面とを備えた石英体で構成され、該第一の端面と該第二の端面との間には線幅の波長域で反射する複数の反射層が形成されていて該第一の端面と該第二の端面との長さによって被加工物に照射されるパルスレーザー光線のパルス幅が決定される請求項1又は2に記載されたレーザー加工装置。
- 該パルス幅調整手段は、該第一の端面と該第二の端面との長さが異なる複数の石英体を備え、所望のパルス幅に応じて該石英体が選択される請求項3に記載のレーザー加工装置。
- 該パルス幅調整手段によってパルス幅が調整されたパルスレーザー光線の波長を変換する波長変換手段が配設される請求項1乃至4のいずれかに記載されたレーザー加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017133344A JP7023629B2 (ja) | 2017-07-07 | 2017-07-07 | レーザー加工装置 |
TW107119455A TWI759497B (zh) | 2017-07-07 | 2018-06-06 | 雷射加工裝置 |
DE102018210843.9A DE102018210843A1 (de) | 2017-07-07 | 2018-07-02 | Laserbearbeitungsvorrichtung |
CN201810714566.9A CN109202277B (zh) | 2017-07-07 | 2018-07-03 | 激光加工装置 |
US16/026,267 US10923873B2 (en) | 2017-07-07 | 2018-07-03 | Laser processing apparatus |
KR1020180078374A KR102516981B1 (ko) | 2017-07-07 | 2018-07-05 | 레이저 가공 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017133344A JP7023629B2 (ja) | 2017-07-07 | 2017-07-07 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019013962A JP2019013962A (ja) | 2019-01-31 |
JP7023629B2 true JP7023629B2 (ja) | 2022-02-22 |
Family
ID=64665997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017133344A Active JP7023629B2 (ja) | 2017-07-07 | 2017-07-07 | レーザー加工装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10923873B2 (ja) |
JP (1) | JP7023629B2 (ja) |
KR (1) | KR102516981B1 (ja) |
CN (1) | CN109202277B (ja) |
DE (1) | DE102018210843A1 (ja) |
TW (1) | TWI759497B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7045706B2 (ja) * | 2019-01-30 | 2022-04-01 | 京楽産業.株式会社 | 遊技機 |
JP7045705B2 (ja) * | 2019-01-30 | 2022-04-01 | 京楽産業.株式会社 | 遊技機 |
JP7328020B2 (ja) * | 2019-06-21 | 2023-08-16 | 株式会社ディスコ | レーザー加工装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012096268A (ja) | 2010-11-02 | 2012-05-24 | Disco Corp | レーザー加工装置 |
WO2014156818A1 (ja) | 2013-03-27 | 2014-10-02 | 国立大学法人九州大学 | レーザアニール装置 |
JP2016112579A (ja) | 2014-12-12 | 2016-06-23 | 株式会社ディスコ | レーザー加工装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5499134A (en) * | 1994-08-24 | 1996-03-12 | Imra America | Optical pulse amplification using chirped Bragg gratings |
US5696782A (en) * | 1995-05-19 | 1997-12-09 | Imra America, Inc. | High power fiber chirped pulse amplification systems based on cladding pumped rare-earth doped fibers |
JPH10305420A (ja) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法 |
US6198568B1 (en) * | 1997-04-25 | 2001-03-06 | Imra America, Inc. | Use of Chirped Quasi-phase-matched materials in chirped pulse amplification systems |
JPH10305410A (ja) | 1997-05-09 | 1998-11-17 | Matsushita Electric Works Ltd | 改質木質ボードの製法 |
US6956878B1 (en) * | 2000-02-07 | 2005-10-18 | Silicon Light Machines Corporation | Method and apparatus for reducing laser speckle using polarization averaging |
JP2004188475A (ja) | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
US7486705B2 (en) * | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
JP5473414B2 (ja) * | 2009-06-10 | 2014-04-16 | 株式会社ディスコ | レーザ加工装置 |
KR101770836B1 (ko) * | 2009-08-11 | 2017-08-23 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공장치 및 레이저 가공방법 |
JP5964621B2 (ja) * | 2012-03-16 | 2016-08-03 | 株式会社ディスコ | レーザー加工装置 |
CN103345098B (zh) * | 2013-07-09 | 2015-10-28 | 上海朗研光电科技有限公司 | 基于晶体双折射的脉冲展宽与压缩结构 |
TWI623784B (zh) * | 2013-09-09 | 2018-05-11 | 克萊譚克公司 | 固態照明源及檢查系統 |
CN203690694U (zh) * | 2013-12-19 | 2014-07-02 | 中国科学院西安光学精密机械研究所 | 超短脉冲光纤激光*** |
CN105206517A (zh) * | 2014-06-24 | 2015-12-30 | 上海微电子装备有限公司 | 一种脉宽展宽激光退火装置 |
JP6261471B2 (ja) * | 2014-07-31 | 2018-01-17 | 株式会社キーエンス | レーザ加工装置 |
KR101825922B1 (ko) * | 2015-08-28 | 2018-03-22 | 주식회사 이오테크닉스 | 레이저 가공장치 및 방법 |
WO2017044646A1 (en) * | 2015-09-09 | 2017-03-16 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of laser-processing workpieces and related arrangements |
-
2017
- 2017-07-07 JP JP2017133344A patent/JP7023629B2/ja active Active
-
2018
- 2018-06-06 TW TW107119455A patent/TWI759497B/zh active
- 2018-07-02 DE DE102018210843.9A patent/DE102018210843A1/de active Pending
- 2018-07-03 US US16/026,267 patent/US10923873B2/en active Active
- 2018-07-03 CN CN201810714566.9A patent/CN109202277B/zh active Active
- 2018-07-05 KR KR1020180078374A patent/KR102516981B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012096268A (ja) | 2010-11-02 | 2012-05-24 | Disco Corp | レーザー加工装置 |
WO2014156818A1 (ja) | 2013-03-27 | 2014-10-02 | 国立大学法人九州大学 | レーザアニール装置 |
JP2016112579A (ja) | 2014-12-12 | 2016-06-23 | 株式会社ディスコ | レーザー加工装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2019013962A (ja) | 2019-01-31 |
KR20190005778A (ko) | 2019-01-16 |
TW201906681A (zh) | 2019-02-16 |
US10923873B2 (en) | 2021-02-16 |
CN109202277B (zh) | 2022-06-28 |
DE102018210843A1 (de) | 2019-01-10 |
CN109202277A (zh) | 2019-01-15 |
US20190013636A1 (en) | 2019-01-10 |
TWI759497B (zh) | 2022-04-01 |
KR102516981B1 (ko) | 2023-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4736633B2 (ja) | レーザ照射装置 | |
JP5580826B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
JP7023629B2 (ja) | レーザー加工装置 | |
US9085046B2 (en) | Laser beam applying mechanism and laser processing apparatus | |
JP7034621B2 (ja) | レーザ加工装置 | |
TW201221263A (en) | Laser processing apparatus | |
JP6817027B2 (ja) | レーザ加工装置 | |
JP2007268581A (ja) | レーザ加工装置 | |
TWI756229B (zh) | 波長變換裝置 | |
JP7039238B2 (ja) | レーザー照射機構 | |
JP6695699B2 (ja) | レーザ加工装置 | |
CN108568601B (zh) | 激光加工方法和激光加工装置 | |
KR101261248B1 (ko) | 평판디스플레이 리페어용 레이저 원형 또는 타원편광 형성장치를 구비한 광학계 | |
JP7475211B2 (ja) | レーザー加工装置の検査方法 | |
WO2011158646A1 (ja) | レーザ発生装置及びレーザ発生方法 | |
JP2003001470A (ja) | レーザ加工装置およびレーザ加工方法 | |
JP6625928B2 (ja) | レーザー加工装置 | |
JP6781650B2 (ja) | レーザー加工装置 | |
JPH08118057A (ja) | レーザ加工装置 | |
JP6802094B2 (ja) | レーザー加工装置 | |
JP2003094191A (ja) | レーザ加工装置 | |
JP6710891B2 (ja) | 光変調装置及び光変調方法 | |
JP2020126244A (ja) | 光変調装置及び光変調方法 | |
JP2021089922A (ja) | 被加工物の加工方法 | |
JPS6033892A (ja) | レ−ザ加工機 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200515 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210727 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210922 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220118 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220209 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7023629 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |