JP7012020B2 - 基板上に配線構造体を形成するためのボトムアップ方法 - Google Patents
基板上に配線構造体を形成するためのボトムアップ方法 Download PDFInfo
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- JP7012020B2 JP7012020B2 JP2018550428A JP2018550428A JP7012020B2 JP 7012020 B2 JP7012020 B2 JP 7012020B2 JP 2018550428 A JP2018550428 A JP 2018550428A JP 2018550428 A JP2018550428 A JP 2018550428A JP 7012020 B2 JP7012020 B2 JP 7012020B2
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Description
湿潤領域を画定するように、電気的に分極可能なナノ粒子を含む流体を基板上に堆積させるステップと、
複数のナノ粒子が組み立てられて、第1の電極から第2の電極に向かって延在する細長い構造体を形成するように、第1の電極および第2の電極を用いて、領域上の流体に交番電界を印加するステップと、
細長い構造体が基板上に残るように流体を除去するステップと、を含み、
交番電界を印加するステップの間に、細長い構造体を第2の電極に向かってさらに延長させるために、第2の電極を第1の電極から離れるように移動させることによって第1の電極と第2の電極との間の分離を増加させるステップをさらに含む。
Claims (14)
- 基板上に構造体を形成するための方法であって、
電気的に分極可能なナノ粒子を含む流体を基板上に堆積して前記流体が配置された湿潤領域を形成するステップと、
複数の前記ナノ粒子が凝集して、第1の電極から第2の電極に向かって延在する細長い構造体が形成されるように、前記第1の電極および前記第2の電極を用いて、前記領域上の前記流体に交番電界を印加するステップと、
前記細長い構造体が前記基板上に残るように前記流体を除去するステップと、
を含み、
前記交番電界を印加する前記ステップの間に、前記細長い構造体を前記第1の電極から前記第2の電極に向かう方向にさらに延長させるために、前記第2の電極を前記第1の電極から離れるように移動させることによって前記第1の電極と前記第2の電極との間の距離を増加させるステップをさらに含む方法。 - 前記形成された前記細長い構造体の長さが増加する速度と、前記第1の電極と前記第2の電極との間の前記距離が増加する速度との間の関係により、前記構造体の端部と前記第2の電極との間の距離が変化し、前記第2の電極および前記構造体の前記端部の近傍の前記流体の領域内の前記電界が、その領域内の可動ナノ粒子を前記構造体の前記端部に凝集させる、請求項1に記載の方法。
- 前記細長い構造体の長さが増加する速度を監視するステップと、
前記細長い構造体の前記長さが所定の速度で増加するように、前記監視された速度に従って前記交番電界の特性を調整するステップと、をさらに含む、請求項1または2に記載の方法。 - 前記電極の少なくとも一方が、尖った端部を含む細長い形状を有し、前記流体に交番電界を印加するステップが、前記電極の各々の前記尖った端部を前記流体に接触させるステップを含む、請求項1乃至3のいずれか一項に記載の方法。
- 前記電界が、前記複数のナノ粒子に誘電泳動力が働くように印加され、前記電界によって、前記流体中の可動ナノ粒子が前記誘電泳動力により前記細長い構造体に引き付けられる、請求項1乃至4のいずれか一項に記載の方法。
- 前記電界がDCバイアスを有し、前記DCバイアスが、前記構造体の第1の端部が、前記流体内の可動ナノ粒子が前記第1の電極に付着することによって形成されるようなものである、請求項1乃至5のいずれか一項に記載の方法。
- 前記第1の電極または前記第2の電極が導管を含み、前記流体が前記導管を介して前記基板上に堆積される、請求項1乃至6のいずれか一項に記載の方法。
- 前記第1および第2の電極が、電流が1~10,000μAの範囲のAC振幅および0.1~1,000μAの範囲のDCバイアスを有するように、前記電極間の交流電流を制御するように構成されたコントローラに接続される、請求項1乃至7のいずれか一項に記載の方法。
- ポテンショメータが、前記AC振幅が10~1000μAの範囲になり、前記DCバイアスが1~100μAの範囲になるように前記交流電流を制御するように構成されている、請求項8に記載の方法。
- 前記基板上の前記湿潤領域の形状に対応する所定の経路に沿って前記第2の電極を移動させて、それにより、前記構造体が前記所定の経路に沿って第1の端部位置から第2の端部位置まで前記領域内に延在するように前記構造体を組み立てるステップを含む、請求項1乃至9のいずれか一項に記載の方法。
- 前記電界を印加する前記ステップが、第2の構造体を形成するように、前記基板上の第2の湿潤領域に堆積された流体に対して繰り返され、前記第2の構造体が、前記第2の湿潤領域内の第1の端部位置から前記第2の湿潤領域内の第2の端部位置まで延在し、前記第2の湿潤領域の前記第1または第2の端部位置のいずれかは、前記湿潤領域上に形成された前記構造体と一致する、請求項1乃至10のいずれか一項に記載の方法。
- 前記方法が、焼結プロセスをさらに含み、前記焼結プロセスが、前記細長い構造体の硬度を増加させるように、凝集したナノ粒子を合体させる、請求項1乃至11のいずれか一項に記載の方法。
- 基板上に構造体を形成するための装置であって、
電気的に分極可能なナノ粒子を含む流体を基板上に堆積させるためのプリントヘッドと、
前記プリントヘッドによって堆積された流体によって形成された湿潤領域に交番電界を印加するための第1の電極および第2の電極であって、当該第1の電極および第2の電極のそれぞれが前記流体と接触しており、当該第2の電極が当該第1の電極に対して移動可能である、第1の電極および第2の電極と、
前記基板から堆積された流体を除去するための流体除去装置と、
を含む装置。 - 前記第1の電極と前記第2の電極との間に交番電界を印加するために、前記第1の電極および前記第2の電極への交番電気信号を制御するように構成された信号コントローラをさらに含む、請求項13に記載の装置。
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