JP6985034B2 - Cutting equipment - Google Patents

Cutting equipment Download PDF

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JP6985034B2
JP6985034B2 JP2017121271A JP2017121271A JP6985034B2 JP 6985034 B2 JP6985034 B2 JP 6985034B2 JP 2017121271 A JP2017121271 A JP 2017121271A JP 2017121271 A JP2017121271 A JP 2017121271A JP 6985034 B2 JP6985034 B2 JP 6985034B2
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cutting
air
holding table
annular
workpiece
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JP2019009175A (en
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寧 丹野
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Disco Corp
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Disco Corp
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Priority to TW107115386A priority patent/TWI754746B/en
Priority to KR1020180066666A priority patent/KR102504620B1/en
Priority to CN201810634412.9A priority patent/CN109093863B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mining & Mineral Resources (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Milling Processes (AREA)

Description

本発明は、被加工物を切削加工する切削装置に関する。 The present invention relates to a cutting apparatus for cutting a workpiece.

被加工物を切削する切削装置は、被加工物を保持する保持テーブルと、保持テーブルに保持された被加工物を切削する切削手段と、被加工物の被加工面を撮像する撮像カメラ（顕微鏡）とを少なくとも備えている。撮像カメラは、切削中に使用される切削水や加工屑が付着するのを防止するケースに収容されている。ケースの底部には、撮像用の開口が形成されており、この開口には開閉可能なシャッターが取り付けられている。被加工物の撮像時には、シャッターをあけて開口を開いている。そして、被加工物の撮像時以外はシャッターで開口を遮蔽して閉じることにより、切削中に使用される切削水の飛沫（水滴）が撮像カメラの対物レンズに付着するのを防止している（例えば、下記の特許文献１及び２を参照）。 The cutting device that cuts the work piece includes a holding table that holds the work piece, a cutting means that cuts the work piece held on the holding table, and an imaging camera (microscope) that captures the work surface of the work piece. ) And at least. The image pickup camera is housed in a case that prevents cutting water and work chips used during cutting from adhering to the camera. An opening for imaging is formed at the bottom of the case, and a shutter that can be opened and closed is attached to this opening. When imaging the work piece, the shutter is opened and the opening is opened. Then, by blocking the opening with a shutter and closing it except when imaging the workpiece, it is possible to prevent droplets (water droplets) of cutting water used during cutting from adhering to the objective lens of the imaging camera (). For example, see Patent Documents 1 and 2 below).

また、上記した切削装置のほか、ケースの底部にカバーガラスと、カバーガラスに付着した水滴を除去するためにエアを噴出させるエアノズルとを備える切削装置がある（例えば、下記の特許文献３及び４を参照）。この切削装置においては、被加工物の切削中に、エアノズルからエアを噴射することにより、カバーガラスに付着した水滴を除去するとともに、被加工物の上面に付着した切削水も除去している。 Further, in addition to the above-mentioned cutting device, there is a cutting device provided with a cover glass at the bottom of the case and an air nozzle for ejecting air to remove water droplets adhering to the cover glass (for example, Patent Documents 3 and 4 below). See). In this cutting device, water droplets adhering to the cover glass are removed by injecting air from an air nozzle during cutting of the workpiece, and cutting water adhering to the upper surface of the workpiece is also removed.

特許第５９３６８４５号公報Japanese Patent No. 5936845 特許第４６６４７８８号公報Japanese Patent No. 4664788 特許第５７６９６０５号公報Japanese Patent No. 5769605 特許第２６１７００１号公報Japanese Patent No. 261001

しかし、エアの噴出には方向性があるため、エアを噴出した方向の周囲に切削水の飛沫があると、その飛沫をエアの噴出方向に引き込んで、エアを被加工物に向けて噴出しているのにもかかわらず、被加工物の上面に細かい水滴が付着するという問題がある。従来においては、切削加工を一時停止し、撮像カメラで撮像し切削位置や切削溝幅（切削溝の両脇のチッピング）を検査しているが、被加工物の上面に細かい水滴が付着していると正確に切削溝の溝幅を測定することができないことから、被加工物の上面を乾燥させる必要がある。また、撮像カメラ側にも切削水の飛沫が水滴となって付着するため、撮像カメラ側を乾燥させる必要がある。 However, since the air ejection is directional, if there is a splash of cutting water around the direction in which the air is ejected, the droplet is drawn in the air ejection direction and the air is ejected toward the workpiece. However, there is a problem that fine water droplets adhere to the upper surface of the workpiece. In the past, cutting was temporarily stopped, and the image was taken with an imaging camera to inspect the cutting position and cutting groove width (chipping on both sides of the cutting groove), but fine water droplets adhered to the upper surface of the workpiece. If this is the case, the groove width of the cutting groove cannot be measured accurately, so it is necessary to dry the upper surface of the workpiece. In addition, since the droplets of cutting water adhere to the image pickup camera side as water droplets, it is necessary to dry the image pickup camera side.

本発明は、上記の事情に鑑みてなされたもので、効率よく被加工物に形成された切削溝を撮像可能にして撮像開始から被加工物の収容までに要する時間を短縮できるようにすることを目的としている。 The present invention has been made in view of the above circumstances, and makes it possible to efficiently image a cutting groove formed in a work piece so that the time required from the start of image pickup to the accommodation of the work piece can be shortened. It is an object.

本発明は、被加工物を保持する保持テーブルと、切削ブレードが回転自在に装着され該保持テーブルが保持した被加工物に切削水を供給して切削加工する切削手段と、該保持テーブルが保持した被加工物を上方から撮像する撮像手段と、切削送り方向に該保持テーブルと該撮像手段とを相対的に移動させる移動手段と、を備えた切削装置であって、該撮像手段は、該保持テーブルが保持した被加工物の上面に対向する対物レンズを備えた顕微鏡と、該顕微鏡の周囲を覆い該対物レンズの光軸を中心とした撮影用の円開口を備えた環状の底部を有するケースと、該底部から被加工物に向けてエアを噴出して該底部と被加工物との間に周囲より高圧なエア層を形成するエア層形成手段とを備え、該エア層形成手段は、該対物レンズの光軸を中心とした環状エア路と、該環状エア路にエアを導入するエア導入口と、該エア導入口から導入されたエアを該環状エア路内で一方向に旋回させ渦巻き気流を生成させる案内板と、該環状エア路から下方に縮径する逆環状円錐流路と、を備え、該エア層形成手段の該逆環状円錐流路の下端から環状に噴出し渦巻き気流を備えたエアにより該対物レンズと被加工物の上面との間で該対物レンズの光軸を中心とした渦巻き気流を備える高圧エア層を形成するとともに、該保持テーブルと該撮像手段とを相対的に該切削送り方向に移動させながら被加工物に形成された切削溝を撮像する際に、該保持テーブルが保持した被加工物の上面に残存する切削水を渦巻き気流で吹き飛ばしながら該切削溝を撮像することを特徴とする。 In the present invention, a holding table for holding a work piece, a cutting means to which a cutting blade is rotatably mounted and cutting water is supplied to the work piece held by the holding table to perform cutting, and the holding table holds the work piece. It is a cutting device provided with an image pickup means for imaging the work piece from above and a moving means for relatively moving the holding table and the image pickup means in the cutting feed direction, and the image pickup means is said to be the same. It has a microscope with an objective lens facing the top surface of the workpiece held by the holding table and an annular bottom with a circular opening for imaging that wraps around the microscope and is centered on the optical axis of the objective lens. The case is provided with an air layer forming means for ejecting air from the bottom toward the workpiece to form an air layer having a higher pressure than the surroundings between the bottom and the workpiece, and the air layer forming means is provided. An annular air path centered on the optical axis of the objective lens, an air introduction port for introducing air into the annular air path, and air introduced from the air introduction port swirl in one direction in the annular air path. A guide plate for generating a swirling airflow and an inverted annular conical flow path whose diameter is reduced downward from the annular air path are provided, and a spiral is ejected from the lower end of the inverted annular conical flow path of the air layer forming means in an annular shape. The air provided with the air flow forms a high-pressure air layer having a swirling air flow centered on the optical axis of the objective lens between the objective lens and the upper surface of the workpiece, and the holding table and the imaging means are provided. When an image of a cutting groove formed in a work piece while relatively moving in the cutting feed direction, the cutting water remaining on the upper surface of the work piece held by the holding table is blown off by a swirling airflow. It is characterized by imaging a groove.

本発明に係る切削装置は、被加工物を保持する保持テーブルと、保持テーブルが保持した被加工物に切削水を供給して切削加工する切削手段と、保持テーブルが保持した被加工物を上方から撮像する撮像手段とを備え、撮像手段は、保持テーブルが保持した被加工物の上面に対向する対物レンズを備えた顕微鏡と、顕微鏡の周囲を覆い対物レンズの光軸を中心とした撮影用の円開口を備えた環状の底部を有するケースと、底部から被加工物に向けてエアを噴出して底部と被加工物との間に周囲より高圧なエア層を形成するエア層形成手段とを備え、エア層形成手段は、対物レンズの光軸を中心とした環状エア路と、環状エア路にエアを導入するエア導入口と、エア導入口から導入されたエアを環状エア路内で一方向に旋回させ渦巻き気流を生成させる案内板と、環状エア路から下方に縮径する逆環状円錐流路とを備え、被加工物に形成された切削溝を撮像する際に、対物レンズと被加工物との間に渦巻き気流を備える高圧エア層を形成し、渦巻き気流によって被加工物の上面や切削溝に残存した切削水を吹き飛ばすように構成したため、より正確な切削溝の溝幅を測定することができる。これにより、効率よく切削溝の撮像を行えることから、撮像開始から被加工物の収容までに要する時間を短縮することができる。 The cutting apparatus according to the present invention has a holding table for holding a workpiece, a cutting means for supplying cutting water to the workpiece held by the holding table for cutting, and an workpiece held by the holding table. The image pickup means is provided with an image pickup means for imaging from, and the image pickup means is a microscope equipped with an objective lens facing the upper surface of the workpiece held by the holding table, and an image pickup means that covers the periphery of the microscope and is centered on the optical axis of the objective lens. A case having an annular bottom with a circular opening, and an air layer forming means for forming an air layer having a higher pressure than the surroundings between the bottom and the workpiece by ejecting air from the bottom toward the workpiece. The air layer forming means includes an annular air path centered on the optical axis of the objective lens, an air introduction port for introducing air into the annular air path, and air introduced from the air introduction port in the annular air path. It is equipped with a guide plate that swirls in one direction to generate a swirling airflow, and an inverted annular conical flow path that contracts downward from the annular air path. A high-pressure air layer with a swirling airflow is formed between the work piece and the work piece, and the swirl airflow blows off the cutting water remaining on the upper surface of the work piece and the cutting groove, so that the groove width of the cutting groove can be made more accurate. Can be measured. As a result, the cutting groove can be efficiently imaged, and the time required from the start of imaging to the accommodation of the workpiece can be shortened.

切削装置の一例の構成を示す斜視図である。It is a perspective view which shows the structure of an example of a cutting apparatus. 切削手段及び撮像手段の構成を示す斜視図である。It is a perspective view which shows the structure of the cutting means and the image pickup means. 撮像手段の構成を示す断面図である。It is sectional drawing which shows the structure of the image pickup means. 撮像手段を下方側からみた底面図である。It is a bottom view which looked at the image pickup means from the lower side. エア層形成手段の構成を示す部分拡大斜視図である。It is a partially enlarged perspective view which shows the structure of the air layer forming means. 図３のａ−ａ線断面図である。FIG. 3 is a cross-sectional view taken along the line aa of FIG. 図６のｂ−ｂ線断面図である。FIG. 6 is a cross-sectional view taken along the line bb of FIG. 撮像手段により被加工物の上面を撮像する状態を説明する断面図である。It is sectional drawing explaining the state which image | photographed the upper surface of the workpiece by the image pickup means. 対物レンズと被加工物との間に形成される高圧エア層に備える渦巻き気流を説明する説明図である。It is explanatory drawing explaining the swirl airflow provided in the high pressure air layer formed between an objective lens and a work piece. エア層形成手段の変形例の構成を示す部分拡大斜視図である。It is a partially enlarged perspective view which shows the structure of the modification of the air layer forming means.

図１に示す切削装置１は、装置ベース２を有しており、装置ベース２の上に配設され被加工物である板状ワークＷを保持する保持テーブル１０と、切削ブレード２３が回転自在に装着され保持テーブル１０が保持した板状ワークＷに切削水を供給しながら切削加工する切削手段２０と、保持テーブル１０が保持した板状ワークＷを上方から撮像する撮像手段３０と、切削送り方向（Ｘ軸方向）に保持テーブル１０と撮像手段３０とを相対的に移動させる移動手段４０と、切削手段２０を割り出し送り方向（Ｙ軸方向）に割り出し送りする割り出し送り手段５０と、切削手段２０を鉛直方向（Ｚ軸方向）に昇降させる昇降手段６０とを備えている。 The cutting device 1 shown in FIG. 1 has a device base 2, and a holding table 10 arranged on the device base 2 to hold a plate-shaped work W as a workpiece and a cutting blade 23 are rotatable. The cutting means 20 for cutting while supplying cutting water to the plate-shaped work W mounted on the holding table 10 and held by the holding table 10, the imaging means 30 for imaging the plate-shaped work W held by the holding table 10 from above, and the cutting feed. A moving means 40 for relatively moving the holding table 10 and the imaging means 30 in the direction (X-axis direction), an indexing feeding means 50 for indexing and feeding the cutting means 20 in the indexing feed direction (Y-axis direction), and a cutting means. It is provided with an elevating means 60 for elevating and elevating 20 in the vertical direction (Z-axis direction).

保持テーブル１０の上面は、板状ワークＷを保持する保持面１０ａとなっている。保持テーブル１０の周縁には、テープＴを介して板状ワークＷを支持する環状のフレームＦを保持するためのフレーム保持手段１１が複数配設されている。フレーム保持手段１１は、フレームＦが載置されるフレーム載置台１２と、フレーム載置台１２に載置されたフレームＦの上面を押さえるクランプ部１３とを備えている。 The upper surface of the holding table 10 is a holding surface 10a for holding the plate-shaped work W. A plurality of frame holding means 11 for holding the annular frame F that supports the plate-shaped work W via the tape T are arranged on the peripheral edge of the holding table 10. The frame holding means 11 includes a frame mounting table 12 on which the frame F is mounted, and a clamp portion 13 for pressing the upper surface of the frame F mounted on the frame mounting table 12.

移動手段４０は、Ｘ軸方向に延在するボールネジ４１と、ボールネジ４１の一端に接続されたモータ４２と、ボールネジ４１と平行に延在する一対のガイドレール４３と、Ｘ軸方向に移動可能な移動ベース４４とを備えている。移動ベース４４の一方の面には保持テーブル１０が回転自在に支持され、移動ベース４４の他方の面には一対のガイドレール４３が摺接し、移動ベース４４の中央部に形成されたナットにはボールネジ４１が螺合している。モータ４２によって駆動されたボールネジ４１が回動することにより、移動ベース４４がガイドレール４３に沿ってＸ軸方向に移動し、Ｘ軸方向に保持テーブル１０と切削手段２０，撮像手段３０とを相対的に移動させることができる。 The moving means 40 can move in the X-axis direction with the ball screw 41 extending in the X-axis direction, the motor 42 connected to one end of the ball screw 41, the pair of guide rails 43 extending in parallel with the ball screw 41, and the ball screw 41. It is equipped with a moving base 44. A holding table 10 is rotatably supported on one surface of the moving base 44, a pair of guide rails 43 are slidably contacted on the other surface of the moving base 44, and a nut formed in the center of the moving base 44 has a nut. The ball screw 41 is screwed. By rotating the ball screw 41 driven by the motor 42, the moving base 44 moves in the X-axis direction along the guide rail 43, and the holding table 10, the cutting means 20, and the imaging means 30 are relative to each other in the X-axis direction. Can be moved.

装置ベース２のＸ軸方向後部において移動手段４０を跨ぐようにして門型のコラム３が立設されている。コラム３の側方には割り出し送り手段５０及び昇降手段６０を介して切削手段２０が配設されている。割り出し送り手段５０は、Ｙ軸方向に延在するボールネジ５１と、ボールネジ５１の一端に接続されたモータ５２と、ボールネジ５１と平行に延在する一対のガイドレール５３と、一方の面が昇降手段６０に取り付けられた移動ベース５４とを備えている。一対のガイドレール５３には移動ベース５４の他方の面が摺接し、移動ベース５４の内部に形成されたナットにはボールネジ５１が螺合している。モータ５２がボールネジ５１を回動させることにより移動ベース５４がガイドレール５３にガイドされてＹ軸方向に移動し、昇降手段６０及び切削手段２０を同方向に割り出し送りすることができる。 A gate-shaped column 3 is erected so as to straddle the moving means 40 at the rear portion of the device base 2 in the X-axis direction. A cutting means 20 is arranged on the side of the column 3 via an indexing feeding means 50 and an elevating means 60. The indexing feed means 50 includes a ball screw 51 extending in the Y-axis direction, a motor 52 connected to one end of the ball screw 51, a pair of guide rails 53 extending in parallel with the ball screw 51, and one surface of the raising / lowering means. It is equipped with a moving base 54 attached to the 60. The other surface of the moving base 54 is in sliding contact with the pair of guide rails 53, and the ball screw 51 is screwed into the nut formed inside the moving base 54. When the motor 52 rotates the ball screw 51, the moving base 54 is guided by the guide rail 53 and moves in the Y-axis direction, so that the elevating means 60 and the cutting means 20 can be indexed and fed in the same direction.

昇降手段６０は、Ｚ軸方向に延在するボールネジ６１と、ボールネジ６１の一端に接続されたモータ６２と、ボールネジ６１と平行に延在する一対のガイドレール６３と、下端部に切削手段２０が装着された昇降板６４とを備えている。一対のガイドレール６３には昇降板６４が摺接し、昇降板６４の内部に形成されたナットにはボールネジ６１が螺合している。モータ６２によって駆動されてボールネジ６１が回動することにより、昇降板６４がガイドレール６３にガイドされてＺ軸方向に移動し、切削手段２０を同方向に昇降させることができる。 The elevating means 60 includes a ball screw 61 extending in the Z-axis direction, a motor 62 connected to one end of the ball screw 61, a pair of guide rails 63 extending in parallel with the ball screw 61, and a cutting means 20 at the lower end. It is equipped with a mounted elevating plate 64. An elevating plate 64 is slidably contacted with the pair of guide rails 63, and a ball screw 61 is screwed into a nut formed inside the elevating plate 64. By being driven by the motor 62 and rotating the ball screw 61, the elevating plate 64 is guided by the guide rail 63 and moves in the Z-axis direction, so that the cutting means 20 can be moved up and down in the same direction.

切削手段２０は、Ｙ軸方向の軸心を有するスピンドル２１と、スピンドル２１を回転可能に囲繞して支持するスピンドルハウジング２２と、スピンドル２１の先端に装着された切削ブレード２３と、切削ブレード２３の周囲をカバーするブレードカバー２４とを備えている。図示しないモータによって駆動されてスピンドル２１が所定の回転速度で回転することにより、切削ブレード２３を所定の回転速度で回転させることができる。 The cutting means 20 includes a spindle 21 having an axial center in the Y-axis direction, a spindle housing 22 that rotatably surrounds and supports the spindle 21, a cutting blade 23 mounted on the tip of the spindle 21, and a cutting blade 23. It is provided with a blade cover 24 that covers the periphery. The cutting blade 23 can be rotated at a predetermined rotation speed by being driven by a motor (not shown) and rotating the spindle 21 at a predetermined rotation speed.

図２に示すように、ブレードカバー２４は、カバー本体２４０と、カバー本体２４０の一方の側面に取り付けられた第１のブロック２４１とカバー本体２４０の他方の側面に取り付けられた第２のブロック２４２とから構成されている。第１のブロック２４１の下端部から水平方向に延在し、切削ブレード２３を挟んで切削ブレード２３の側面に向けて切削水を供給する一対の切削水供給ノズル２５が装着されている。また、第２のブロック２４２の下端部には、切削ブレード２３と板状ワークＷとが接触する領域に切削水を供給する切削水供給ノズル（図示せず）が装着されている。第１のブロック２４１の上端には、一対の切削水供給ノズル２５と切削水供給源２７とを連通させる配管２６が接続されている。また、第２のブロック２４２の上端にも図示しない切削水供給ノズルと切削水供給源２７とを連通させる配管２６ａが接続されている。 As shown in FIG. 2, the blade cover 24 includes a cover main body 240, a first block 241 attached to one side surface of the cover main body 240, and a second block 242 attached to the other side surface of the cover main body 240. It is composed of and. A pair of cutting water supply nozzles 25 extending horizontally from the lower end of the first block 241 and supplying cutting water toward the side surface of the cutting blade 23 with the cutting blade 23 interposed therebetween are mounted. Further, a cutting water supply nozzle (not shown) for supplying cutting water to a region where the cutting blade 23 and the plate-shaped work W are in contact is mounted on the lower end portion of the second block 242. A pipe 26 for communicating the pair of cutting water supply nozzles 25 and the cutting water supply source 27 is connected to the upper end of the first block 241. Further, a pipe 26a for communicating the cutting water supply nozzle and the cutting water supply source 27 (not shown) is also connected to the upper end of the second block 242.

撮像手段３０は、スピンドルハウジング２２の側部に取り付けられ、図１に示した保持テーブル１０の移動経路の上方側に位置している。図３に示すように、撮像手段３０は、図１に示した保持テーブル１０が保持した板状ワークＷの上面に対向する対物レンズ３１０を備えた顕微鏡３１と、顕微鏡３１の周囲を覆い対物レンズ３１０の光軸を中心とした撮影用の円開口３２０を備えた環状の底部３２１を有するケース３２と、底部３２１から板状ワークＷに向けてエアを噴出して底部３２１と板状ワークＷとの間に周囲より高圧なエア層を形成するエア層形成手段３３とを備えている。 The image pickup means 30 is attached to the side portion of the spindle housing 22 and is located on the upper side of the movement path of the holding table 10 shown in FIG. As shown in FIG. 3, the imaging means 30 includes a microscope 31 having an objective lens 310 facing the upper surface of the plate-shaped work W held by the holding table 10 shown in FIG. 1, and an objective lens that covers the periphery of the microscope 31. A case 32 having an annular bottom portion 321 having a circular opening 320 for photographing centered on the optical axis of 310, and a bottom portion 321 and a plate-shaped work W by ejecting air from the bottom portion 321 toward the plate-shaped work W. An air layer forming means 33 for forming an air layer having a higher pressure than the surroundings is provided between the two.

顕微鏡３１は、板状ワークＷを上方から撮像する撮像カメラであり、その内部に光学系の撮像素子（例えばＣＣＤまたはＣＭＯＳ）を備えている。顕微鏡３１では、板状ワークＷの被撮像面で反射した反射光が対物レンズ３１０を介して撮像素子に入射されることにより、例えば、切削加工前の板状ワークＷの加工すべき領域が写し出された撮像画を撮像したり、切削加工中または切削加工完了後の板状ワークＷの切削溝等が写し出された撮像画を撮像したりすることできる。 The microscope 31 is an image pickup camera that captures a plate-shaped work W from above, and includes an optical image pickup element (for example, CCD or CMOS) inside the microscope. In the microscope 31, the reflected light reflected by the image-received surface of the plate-shaped work W is incident on the image pickup element via the objective lens 310, so that, for example, a region to be processed of the plate-shaped work W before cutting is projected. It is possible to take an image of the captured image, or to take an image of the cutting groove of the plate-shaped work W during or after the cutting process is projected.

ケース３２は、筒状に形成され、顕微鏡３１の周囲を密閉した構成となっており、切削時に使用され周囲に飛散する切削水の飛沫が顕微鏡３１に付着するのを防ぐことができる。対物レンズ３１０の直下には、ケース３２の底部３２１に形成された円開口３２０が位置している。本実施形態に示す円開口３２０は、図４に示すように、少なくとも対物レンズ３１０の径よりも大径に形成されており、円開口３２０から対物レンズ３１０が露出した構成となっている。 The case 32 is formed in a cylindrical shape and has a structure in which the periphery of the microscope 31 is sealed, so that it is possible to prevent the droplets of cutting water used during cutting and scattered around the microscope 31 from adhering to the microscope 31. Immediately below the objective lens 310, a circular aperture 320 formed in the bottom portion 321 of the case 32 is located. As shown in FIG. 4, the circular opening 320 shown in the present embodiment is formed to have a diameter at least larger than the diameter of the objective lens 310, and the objective lens 310 is exposed from the circular opening 320.

図５に示すように、エア層形成手段３３は、ケース３２の下方側に一体となって形成されたエアノズルである。エア層形成手段３３は、図４に示した対物レンズ３１０の光軸を中心とした環状エア路３４と、環状エア路３４にエアを導入するエア導入口３５と、エア導入口３５から導入されたエアを環状エア路３４内で一方向に旋回させ渦巻き気流を生成させる案内板３６と、環状エア路３４から下方に縮径する逆環状円錐流路３７とを備えている。 As shown in FIG. 5, the air layer forming means 33 is an air nozzle integrally formed on the lower side of the case 32. The air layer forming means 33 is introduced from the annular air passage 34 centered on the optical axis of the objective lens 310 shown in FIG. 4, the air introduction port 35 for introducing air into the annular air passage 34, and the air introduction port 35. It is provided with a guide plate 36 that swirls the air in one direction in the annular air passage 34 to generate a swirling airflow, and an inverted annular conical flow path 37 that reduces the diameter downward from the annular air passage 34.

環状エア路３４は、ケース３２の内部に形成され天井３４ａと底面３４ｂと側面３４ｃとにより囲繞された環状の空洞である。環状エア路３４の側面３４ｃには、エア導入口３５に連通する流入口３４０が形成されている。エア導入口３５には、図示しないバルブを介してエア供給源３９が接続されている。バルブを開いて、エア導入口３５にエアを導入することにより、流入口３４０を通じて環状エア路３４内にエアを供給することができる。 The annular air passage 34 is an annular cavity formed inside the case 32 and surrounded by a ceiling 34a, a bottom surface 34b, and a side surface 34c. An inflow port 340 communicating with the air introduction port 35 is formed on the side surface 34c of the annular air passage 34. An air supply source 39 is connected to the air introduction port 35 via a valve (not shown). By opening the valve and introducing air into the air introduction port 35, air can be supplied into the annular air passage 34 through the inflow port 340.

逆環状円錐流路３７の最上端は、環状エア路３４に連通しており、環状エア路３４の内部に供給されたエアが逆環状円錐流路３７に流れ込むように構成されている。逆環状円錐流路３７の最下端には、エアを噴出するための環状のエア噴出口３８が形成されている。エア噴出口３８は、図４に示した対物レンズ３１０の周囲を囲繞しており、対物レンズ３１０の中心の光軸に向けてエアを噴出する構成となっている。 The uppermost end of the inverted annular conical flow path 37 communicates with the annular air passage 34, and the air supplied to the inside of the annular air passage 34 is configured to flow into the inverted annular conical flow path 37. An annular air ejection port 38 for ejecting air is formed at the lowermost end of the inverted annular conical flow path 37. The air ejection port 38 surrounds the periphery of the objective lens 310 shown in FIG. 4, and is configured to eject air toward the optical axis at the center of the objective lens 310.

図６に示すように、案内板３６は、例えば平板によって構成されており、環状エア路３４内でエアの流れる方向を一方向に整える流体案内板である。案内板３６は、図７に示すように、エア導入口３５よりも後方側の位置において環状エア路３４内で傾斜して配設されている。すなわち、案内板３６の上端部３６０が、エア導入口３５に連通する流入口３４０よりも後側に配置されるとともに、案内板３６の下端部３６１が、環状エア路３４の底面３４ｂに固定されエアの流れる一方向側の位置に配置されることで、案内板３６の案内面３６２が傾斜した状態となっている。このように構成される案内板３６では、環状エア路３４内に流れ込んできたエアが案内面３６２に当たると、環状エア路３４内でエアを一方向に旋回させ、渦巻き気流を生成させることができる。また、案内板３６の案内面３６２は、流入口３４０の位置よりも後方側に位置づけられていることから、流入口３４０から環状エア路３４内に流れ込んだエアがエアの流れる一方向と反対方向に逆流するのを防ぐことができる。なお、案内板３６の個数、材質、大きさ等は特に限定されない。 As shown in FIG. 6, the guide plate 36 is composed of, for example, a flat plate, and is a fluid guide plate that adjusts the direction of air flow in one direction in the annular air passage 34. As shown in FIG. 7, the guide plate 36 is inclinedly arranged in the annular air passage 34 at a position rearward from the air introduction port 35. That is, the upper end portion 360 of the guide plate 36 is arranged behind the inflow port 340 communicating with the air introduction port 35, and the lower end portion 361 of the guide plate 36 is fixed to the bottom surface 34b of the annular air passage 34. By arranging it at a position on the one-way side through which air flows, the guide surface 362 of the guide plate 36 is in an inclined state. In the guide plate 36 configured in this way, when the air flowing into the annular air passage 34 hits the guide surface 362, the air can be swirled in one direction in the annular air passage 34 to generate a swirl airflow. .. Further, since the guide surface 362 of the guide plate 36 is positioned on the rear side of the position of the inflow port 340, the air flowing from the inflow port 340 into the annular air passage 34 is in the direction opposite to the one direction in which the air flows. It is possible to prevent backflow to. The number, material, size, etc. of the guide plates 36 are not particularly limited.

次に、切削装置１の動作例について説明する。図１に示す板状ワークＷは、円形板状の基板を有する被加工物の一例であり、その上面Ｗａには、格子状の分割予定ラインＳによって区画されたそれぞれの領域にデバイスＤが形成されている。板状ワークＷの上面Ｗａと反対側の面である下面Ｗｂには、テープＴが貼着される。すなわち、本実施形態に示す板状ワークＷは、テープＴを介して環状のフレームＦと一体となって形成され、これが図示しないカセットなどに複数収容されている。 Next, an operation example of the cutting device 1 will be described. The plate-shaped work W shown in FIG. 1 is an example of a workpiece having a circular plate-shaped substrate, and a device D is formed on the upper surface Wa of the plate-shaped work W in each region partitioned by a grid-shaped division schedule line S. Has been done. The tape T is attached to the lower surface Wb, which is the surface opposite to the upper surface Wa of the plate-shaped work W. That is, the plate-shaped work W shown in the present embodiment is formed integrally with the annular frame F via the tape T, and a plurality of the plate-shaped work W is housed in a cassette or the like (not shown).

まず、フレームＦと一体となった板状ワークＷを保持テーブル１０に搬送する。具体的には、テープＴを介して板状ワークＷを保持テーブル１０の保持面１０ａに載置するとともに、フレームＦをフレーム載置台１２に載置する。続いて、図示しない吸引源の吸引力により保持面１０ａで板状ワークＷを吸引保持するとともに、クランプ部１３によってフレームＦの上面を押さえて固定する。 First, the plate-shaped work W integrated with the frame F is conveyed to the holding table 10. Specifically, the plate-shaped work W is placed on the holding surface 10a of the holding table 10 via the tape T, and the frame F is placed on the frame mounting table 12. Subsequently, the plate-shaped work W is suction-held by the holding surface 10a by the suction force of a suction source (not shown), and the upper surface of the frame F is pressed and fixed by the clamp portion 13.

保持テーブル１０で板状ワークＷを保持した後、移動手段４０によって保持テーブル１０を切削手段２０の下方側に移動させる。このとき、撮像手段３０が保持テーブル１０に保持された板状ワークＷの上面Ｗａを撮像し、板状ワークＷを切削加工すべき領域（分割予定ラインＳ）を検出する。 After the plate-shaped work W is held by the holding table 10, the holding table 10 is moved to the lower side of the cutting means 20 by the moving means 40. At this time, the image pickup means 30 images the upper surface Wa of the plate-shaped work W held on the holding table 10 and detects a region (scheduled division line S) for cutting the plate-shaped work W.

次いで、切削手段２０によって板状ワークＷの上面Ｗａに対して切削加工を行う。具体的には、切削手段２０の下方に保持テーブル１０を移動させつつ、スピンドル２１が所定の回転速度で回転し、切削ブレード２３を所定の回転速度で回転させるとともに、昇降手段６０によって切削手段２０を保持テーブル１０に保持された板状ワークＷに接近するＺ軸方向に下降させる。回転する切削ブレード２３を板状ワークＷの上面Ｗａから所定の深さまで切り込ませ、切削手段２０と保持テーブル１０とを切削送り方向に相対移動させながら切削する。このようにして、分割予定ラインＳに沿って図８に示す切削溝Ｇを板状ワークＷに形成する。 Next, the cutting means 20 performs cutting on the upper surface Wa of the plate-shaped work W. Specifically, while moving the holding table 10 below the cutting means 20, the spindle 21 rotates at a predetermined rotation speed, the cutting blade 23 is rotated at a predetermined rotation speed, and the cutting means 20 is rotated by the elevating means 60. Is lowered in the Z-axis direction approaching the plate-shaped work W held on the holding table 10. The rotating cutting blade 23 is cut from the upper surface Wa of the plate-shaped work W to a predetermined depth, and cutting is performed while the cutting means 20 and the holding table 10 are relatively moved in the cutting feed direction. In this way, the cutting groove G shown in FIG. 8 is formed in the plate-shaped work W along the planned division line S.

板状ワークＷの切削加工中は、図２に示した切削水供給源２７から配管２６に切削水を流入し切削水供給ノズル２５から切削ブレード２３の側面に向けて切削水を供給するとともに、切削水供給源２７から配管２６ａに切削水を流入し図示しない切削水供給ノズルから切削ブレード２３と板状ワークＷとの接触領域に切削水を供給して、切削ブレード２３を冷却しながら板状ワークＷを切削する。すべての分割予定ラインＳに沿って切削溝Ｇを形成したら、昇降手段６０により切削手段２０を上昇させ、板状ワークＷの上面Ｗａから切削ブレード２３を退避させる。 During the cutting process of the plate-shaped work W, the cutting water flows into the pipe 26 from the cutting water supply source 27 shown in FIG. 2, and the cutting water is supplied from the cutting water supply nozzle 25 toward the side surface of the cutting blade 23. Cutting water flows from the cutting water supply source 27 into the pipe 26a, and cutting water is supplied from a cutting water supply nozzle (not shown) to the contact area between the cutting blade 23 and the plate-shaped work W, and the cutting blade 23 is cooled and plate-shaped. Cut the work W. After forming the cutting groove G along all the scheduled division lines S, the cutting means 20 is raised by the elevating means 60, and the cutting blade 23 is retracted from the upper surface Wa of the plate-shaped work W.

次に、撮像手段３０で板状ワークＷの上面Ｗａを撮像し、被加工物Ｗに形成された切削溝Ｇの溝幅を測定する動作について説明する。切削溝Ｇを撮像するタイミングは、特に限定されない。例えば、板状ワークＷの処理枚数、切削ブレード２３で板状ワークＷを切削する切削距離、切削溝Ｇの本数などに基づいて撮像するタイミングを切削装置１に設定しておく。 Next, an operation of imaging the upper surface Wa of the plate-shaped work W with the image pickup means 30 and measuring the groove width of the cutting groove G formed in the workpiece W will be described. The timing at which the cutting groove G is imaged is not particularly limited. For example, the timing for imaging is set in the cutting device 1 based on the number of processed plate-shaped works W, the cutting distance for cutting the plate-shaped work W with the cutting blade 23, the number of cutting grooves G, and the like.

図８に示すように、保持テーブル１０と撮像手段３０とを相対的にＸ軸方向（切削送り方向）に移動させながら、撮像手段３０で板状ワークＷの上面Ｗａを撮像する。このとき、エア供給源３９からエア導入口３５にエアを導入することにより、環状エア路３４、逆環状円錐流路３７を通じてエア噴出口３８から下方にエアを噴出させ、対物レンズ３１０と板状ワークＷの上面Ｗａとの間に高圧エア層１００を形成する。 As shown in FIG. 8, the image pickup means 30 images the upper surface Wa of the plate-shaped work W while the holding table 10 and the image pickup means 30 are relatively moved in the X-axis direction (cutting feed direction). At this time, by introducing air from the air supply source 39 to the air introduction port 35, air is ejected downward from the air ejection port 38 through the annular air passage 34 and the inverted annular conical flow path 37, and the objective lens 310 and the plate shape are formed. A high-pressure air layer 100 is formed between the work W and the upper surface Wa.

高圧エア層１００は、図９に示す渦巻き気流１０１を備えている。ここで、渦巻き気流１０１が生成される流れについて説明する。図７に示したエア導入口３５を通じて流入口３４０から環状エア路３４の内部にエアが流れ込むと、案内板３６の案内面３６２にエアが当たってエアの流れる向きが整えられて、エアが環状エア路３４の内部を例えば矢印Ａ方向に示す一方向に流れていく。これにより、環状エア路３４内でエアが一方向に旋回して、対物レンズ３１０の直下で渦巻き気流１０１を生成させる。つまり、環状エア路３４内で一方向に渦巻き状に流れるエアが、逆環状円錐流路３７に沿って下方に向けて流れていくため、エア噴出口３８から噴出されるエアの気流は、対物レンズ３１０と板状ワークＷの上面Ｗａとの間で対物レンズ３１０の光軸を中心とした渦巻き気流１０１となる。 The high-pressure air layer 100 includes the swirl airflow 101 shown in FIG. Here, the flow in which the spiral airflow 101 is generated will be described. When air flows into the inside of the annular air passage 34 from the inflow port 340 through the air introduction port 35 shown in FIG. 7, the air hits the guide surface 362 of the guide plate 36 and the direction of the air flow is adjusted, so that the air is annular. It flows inside the air passage 34 in one direction shown by, for example, the direction of arrow A. As a result, the air swirls in one direction in the annular air passage 34 to generate a swirl airflow 101 directly under the objective lens 310. That is, since the air flowing spirally in one direction in the annular air passage 34 flows downward along the inverted annular conical flow path 37, the air flow of the air ejected from the air ejection port 38 is an objective. A spiral airflow 101 centered on the optical axis of the objective lens 310 is formed between the lens 310 and the upper surface Wa of the plate-shaped work W.

渦巻き気流１０１は、撮像手段３０の撮像範囲における板状ワークＷの上面Ｗａに残存する切削水を吹き飛ばす。すなわち、渦巻き気流１０１が板状ワークＷの上面Ｗａに接触すると、その接触した部分から径方向外側に向けてエアが流れていき、板状ワークＷの上面Ｗａや切削溝Ｇの溝内に付着した切削水の水滴を吹き飛ばすことができる。その結果、板状ワークＷの上面Ｗａから水滴が取り除かれ上面Ｗａが乾燥した状態となり、図８に示した顕微鏡３１で切削溝Ｇを効率よく撮像することが可能となる。もっとも、板状ワークＷの撮像中だけでなく、板状ワークＷの切削加工中も常に渦巻き気流１０１を備える高圧エア層１００を対物レンズ３１０の直下に形成することが好ましい。これにより、切削水がケース３２の円開口３２０からケース３２内に浸入するのを防ぎ、対物レンズ３１０に切削水が付着するのを防止することができる。 The swirl airflow 101 blows off the cutting water remaining on the upper surface Wa of the plate-shaped work W in the imaging range of the imaging means 30. That is, when the swirl airflow 101 comes into contact with the upper surface Wa of the plate-shaped work W, air flows outward in the radial direction from the contacted portion and adheres to the upper surface Wa of the plate-shaped work W or the groove of the cutting groove G. It is possible to blow off the water droplets of the cutting water that has been cut. As a result, water droplets are removed from the upper surface Wa of the plate-shaped work W, and the upper surface Wa becomes dry, and the cutting groove G can be efficiently imaged with the microscope 31 shown in FIG. However, it is preferable to form the high-pressure air layer 100 having the swirl airflow 101 directly under the objective lens 310 not only during the imaging of the plate-shaped work W but also during the cutting process of the plate-shaped work W. As a result, it is possible to prevent the cutting water from entering the case 32 through the circular opening 320 of the case 32 and prevent the cutting water from adhering to the objective lens 310.

このように、本発明に係る切削装置１は、保持テーブル１０が保持した板状ワークＷを上方から撮像する撮像手段３０を備え、撮像手段３０は、保持テーブル１０が保持した板状ワークの上面Ｗａに対向する対物レンズ３１０を備えた顕微鏡３１と、顕微鏡３１の周囲を覆い対物レンズ３１０の光軸を中心とした撮影用の円開口３２０を備えた環状の底部３２１を有するケース３２と、底部３２１から板状ワークに向けてエアを噴出して底部３２１と板状ワークＷとの間に周囲より高圧なエア層を形成するエア層形成手段３３とを備え、エア層形成手段３３は、対物レンズ３１０の光軸を中心とした環状エア路３４と、環状エア路３４にエアを導入するエア導入口３５と、エア導入口３５から導入されたエアを環状エア路３４内で一方向に旋回させ渦巻き気流を生成させる案内板３６と、環状エア路３４から下方に縮径する逆環状円錐流路３７とを備え、板状ワークＷに形成された切削溝Ｇを撮像する際に、対物レンズ３１０と板状ワークＷとの間に渦巻き気流１０１を備える高圧エア層１００を形成し、渦巻き気流１０１によって板状ワークＷの上面Ｗａや切削溝Ｇに残存した切削水を吹き飛ばすように構成したため、より正確な切削溝Ｇの溝幅を測定することが可能となる。このように、本発明によれば、効率よく切削溝Ｇの撮像を行えるため、撮像開始から板状ワークＷの収容までに要する時間を短縮することができる。
また、板状ワークＷの撮像時だけでなく、板状ワークＷの切削加工中においても対物レンズ３１０の直下に渦巻き気流１０１を備える高圧エア層１００を形成することで、対物レンズ３１０に切削水が付着するのを防ぐことができるため、ケース３２の円開口３２０を閉じるシャッター等を別に備える必要がない。これにより、対物レンズ３１０を板状ワークＷに近づけることが可能となり顕微鏡３１の分解能を向上させることができる。 As described above, the cutting apparatus 1 according to the present invention includes an image pickup means 30 for imaging the plate-shaped work W held by the holding table 10 from above, and the image pickup means 30 is the upper surface of the plate-shaped work held by the holding table 10. A microscope 31 having an objective lens 310 facing Wa, a case 32 having an annular bottom 321 covering the periphery of the microscope 31 and having a circular opening 320 for photographing centered on the optical axis of the objective lens 310, and a bottom. An air layer forming means 33 for ejecting air from the 321 toward the plate-shaped work to form an air layer having a higher pressure than the surroundings between the bottom portion 321 and the plate-shaped work W is provided, and the air layer forming means 33 is an objective. The annular air passage 34 centered on the optical axis of the lens 310, the air introduction port 35 for introducing air into the annular air passage 34, and the air introduced from the air introduction port 35 swirl in one direction in the annular air passage 34. An objective lens is provided when the guide plate 36 for generating a swirling airflow is provided and the inverted annular conical flow path 37 whose diameter is reduced downward from the annular air passage 34 is provided, and the cutting groove G formed in the plate-shaped work W is imaged. A high-pressure air layer 100 having a swirling airflow 101 is formed between the 310 and the plate-shaped work W, and the swirling airflow 101 is configured to blow off the cutting water remaining in the upper surface Wa of the plate-shaped work W and the cutting groove G. It becomes possible to measure the groove width of the cutting groove G more accurately. As described above, according to the present invention, since the cutting groove G can be efficiently imaged, the time required from the start of imaging to the accommodation of the plate-shaped work W can be shortened.
Further, not only when the plate-shaped work W is imaged, but also during the cutting process of the plate-shaped work W, the cutting water is formed on the objective lens 310 by forming the high-pressure air layer 100 having the swirl airflow 101 directly under the objective lens 310. It is not necessary to separately provide a shutter or the like for closing the circular opening 320 of the case 32 because it is possible to prevent the lens from adhering to the case 32. As a result, the objective lens 310 can be brought closer to the plate-shaped work W, and the resolution of the microscope 31 can be improved.

上記実施形態に示したエア層形成手段３３は、環状エア路３４の側面３４ｃ側から環状エア路３４にエアを導入する構成としたが、この構成に限定されない。例えば、図１０に示すエア層形成手段３３Ａのように、エア導入口３５Ａを、ケース３２の内部に配設されたパイプを介して環状エア路３４の天井３４ａに形成された流入口３４１に連通させることで、天井３４ａ側から環状エア路３４内にエアを導入する構成にしてもよい。このように構成されるエア層形成手段３３Ａであっても、エア導入口３５Ａを通じて流入口３４１から環状エア路３４内に導入されたエアを、環状エア路３４内で一方向に旋回させ渦巻き気流を生成させることができる。 The air layer forming means 33 shown in the above embodiment has a configuration in which air is introduced into the annular air passage 34 from the side surface 34c side of the annular air passage 34, but the configuration is not limited to this. For example, as in the air layer forming means 33A shown in FIG. 10, the air introduction port 35A communicates with the inflow port 341 formed in the ceiling 34a of the annular air passage 34 via a pipe arranged inside the case 32. By doing so, air may be introduced into the annular air passage 34 from the ceiling 34a side. Even with the air layer forming means 33A configured in this way, the air introduced into the annular air passage 34 from the inflow port 341 through the air introduction port 35A is swirled in one direction in the annular air passage 34 and swirled airflow. Can be generated.

１：切削装置 ２：装置ベース ３：コラム
１０：保持テーブル １０ａ：保持面 １１：フレーム保持手段 １２：フレーム載置台
１３：クランプ部
２０：切削手段 ２１：スピンドル ２２：スピンドルハウジング ２３：切削ブレード
２４：ブレードカバー ２４０：カバー本体 ２４１：第１のブロック
２４２：第２のブロック ２５：切削水供給ノズル ２６，２６ａ：配管
２７：切削水供給源
３０：撮像手段 ３１：顕微鏡 ３１０：対物レンズ ３２：ケース ３２０：円開口
３２１：底部 ３３，３３Ａ：エア層形成手段
３４：環状エア路 ３４０，３４１：流入口 ３５，３５Ａ：エア導入口
３６：案内板 ３７：逆環状円錐流路 ３８：エア噴出口 ３９：エア供給源
４０：移動手段 ４１：ボールネジ ４２：モータ ４３：ガイドレール
４４：移動ベース
５０：割り出し送り手段 ５１：ボールネジ ５２：モータ ５３：ガイドレール
５４：移動ベース
６０：昇降手段 ６１：ボールネジ ６２：モータ ６３：ガイドレール ６４：昇降板
１００：高圧エア層 １０１：渦巻き気流 1: Cutting device 2: Device base 3: Column 10: Holding table 10a: Holding surface 11: Frame holding means 12: Frame mounting table 13: Clamp portion 20: Cutting means 21: Spindle 22: Spindle housing 23: Cutting blade 24: Blade cover 240: Cover body 241: First block 242: Second block 25: Cutting water supply nozzle 26, 26a: Piping 27: Cutting water supply source 30: Imaging means 31: Microscope 310: Objective lens 32: Case 320 : Circular opening 321: Bottom 33, 33A: Air layer forming means 34: Circular air passage 340, 341: Inlet 35, 35A: Air introduction port 36: Guide plate 37: Reverse annular conical flow path 38: Air ejection port 39: Air supply source 40: Moving means 41: Ball screw 42: Motor 43: Guide rail 44: Moving base 50: Indexing feeding means 51: Ball screw 52: Motor 53: Guide rail 54: Moving base 60: Elevating means 61: Ball screw 62: Motor 63: Guide rail 64: Elevating plate 100: High-pressure air layer 101: Swirling airflow

Claims (1)

被加工物を保持する保持テーブルと、切削ブレードが回転自在に装着され該保持テーブルが保持した被加工物に切削水を供給して切削加工する切削手段と、該保持テーブルが保持した被加工物を上方から撮像する撮像手段と、切削送り方向に該保持テーブルと該撮像手段とを相対的に移動させる移動手段と、を備えた切削装置であって、
該撮像手段は、該保持テーブルが保持した被加工物の上面に対向する対物レンズを備えた顕微鏡と、
該顕微鏡の周囲を覆い該対物レンズの光軸を中心とした撮影用の円開口を備えた環状の底部を有するケースと、
該底部から被加工物に向けてエアを噴出して該底部と被加工物との間に周囲より高圧なエア層を形成するエア層形成手段とを備え、
該エア層形成手段は、該対物レンズの光軸を中心とした環状エア路と、
該環状エア路にエアを導入するエア導入口と、
該エア導入口から導入されたエアを該環状エア路内で一方向に旋回させ渦巻き気流を生成させる案内板と、
該環状エア路から下方に縮径する逆環状円錐流路と、を備え、
該エア層形成手段の該逆環状円錐流路の下端から環状に噴出し渦巻き気流を備えたエアにより該対物レンズと被加工物の上面との間で該対物レンズの光軸を中心とした渦巻き気流を備える高圧エア層を形成するとともに、該保持テーブルと該撮像手段とを相対的に該切削送り方向に移動させながら被加工物に形成された切削溝を撮像する際に、該保持テーブルが保持した被加工物の上面に残存する切削水を渦巻き気流で吹き飛ばしながら該切削溝を撮像することを特徴とする切削装置。 A holding table that holds the work piece, a cutting means that is rotatably mounted with a cutting blade and supplies cutting water to the work piece held by the holding table to perform cutting, and a work piece held by the holding table. A cutting device including an image pickup means for capturing an image from above and a moving means for relatively moving the holding table and the image pickup means in the cutting feed direction.
The imaging means includes a microscope provided with an objective lens facing the upper surface of the workpiece held by the holding table.
A case that covers the periphery of the microscope and has an annular bottom with a circular aperture for photographing centered on the optical axis of the objective lens.
It is provided with an air layer forming means for forming an air layer having a higher pressure than the surroundings between the bottom portion and the workpiece by ejecting air from the bottom portion toward the workpiece.
The air layer forming means includes an annular air path centered on the optical axis of the objective lens and an annular air path.
An air inlet for introducing air into the annular air passage and
A guide plate that swirls the air introduced from the air inlet in one direction in the annular air passage to generate a swirl airflow, and
With an inverted annular conical flow path that reduces in diameter downward from the annular air passage,
Spiral around the optical axis of the objective lens with the upper surface of the objective lens and the workpiece by an air having a lower ejection annularly from and spiral airflow inverse circular cone passage of the air layer forming means When forming a high-pressure air layer provided with an air flow and imaging a cutting groove formed in a workpiece while relatively moving the holding table and the imaging means in the cutting feed direction, the holding table is used. A cutting device characterized in that the cutting groove is imaged while blowing off the cutting water remaining on the upper surface of the held workpiece with a swirling airflow.
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