JP6983345B1 - 熱伝導性シート、および電子機器 - Google Patents
熱伝導性シート、および電子機器 Download PDFInfo
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- JP6983345B1 JP6983345B1 JP2021023935A JP2021023935A JP6983345B1 JP 6983345 B1 JP6983345 B1 JP 6983345B1 JP 2021023935 A JP2021023935 A JP 2021023935A JP 2021023935 A JP2021023935 A JP 2021023935A JP 6983345 B1 JP6983345 B1 JP 6983345B1
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- heat conductive
- conductive sheet
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- filler
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Abstract
Description
図1は、本技術が適用された熱伝導性シートの一例を示す図である。図1に示す熱伝導性シート1は、シート本体2と、樹脂被覆層5を有する。シート本体2は、少なくとも高分子マトリックス成分と繊維状の熱伝導性充填剤とを含むバインダ樹脂が硬化されたものである。樹脂被覆層5は、シート本体2から滲み出た高分子マトリックス成分の未硬化成分によって形成されている。シート本体2の一方の面2aには、第1剥離フィルム3が貼り付けられ、シート本体2の他方の面2bは、第2剥離フィルム4が貼り付けられている。
シート本体2を構成する高分子マトリックス成分は、熱伝導性シート1の基材となる高分子成分のことである。その種類については、特に限定されず、公知の高分子マトリックス成分を適宜選択することができる。例えば、高分子マトリックス成分の一つとして、熱硬化性ポリマーが挙げられる。
熱伝導性シート1に含まれる繊維状の熱伝導性充填剤は、シートの熱伝導性を向上させるための成分である。熱伝導性充填剤の種類については、熱伝導性の高い繊維状の材料であれば特に限定はされないが、より高い熱伝導性を得られる点からは、炭素繊維を用いることが好ましい。
熱伝導性シート1は、熱伝導性充填剤として、無機物フィラーをさらに含有させてもよい。無機物フィラーを含有させることにより、熱伝導性シート1の熱伝導性をより高め、シートの強度を向上できる。前記無機物フィラーとしては、形状、材質、平均粒径等については特に制限がされず、目的に応じて適宜選択することができる。前記形状としては、例えば、球状、楕円球状、塊状、粒状、扁平状、針状等が挙げられる。これらの中でも、球状、楕円形状が充填性の点から好ましく、球状が特に好ましい。
熱伝導性シート1は、上述した、高分子マトリックス成分および繊維状熱伝導性充填剤、適宜含有される無機物フィラーに加えて、目的に応じてその他の成分を適宜含むこともできる。その他の成分としては、例えば、磁性粉、チキソトロピー性付与剤、分散剤、硬化促進剤、遅延剤、微粘着付与剤、可塑剤、難燃剤、酸化防止剤、安定剤、着色剤等が挙げられる。また、磁性粉の含有量を調整することにより、熱伝導性シート1に電磁波吸収性能を付与してもよい。
熱伝導性シート1は、磁性粉の含有量を調整することにより、熱伝導性シート1に電磁波吸収性能を付与してもよい。
次いで、熱伝導性シート1の製造工程について説明する。本技術が適用された熱伝導性シート1の製造工程は、高分子マトリックス成分に繊維状の熱伝導性充填剤等が含有された熱伝導性樹脂組成物を所定の形状に成型して硬化させ、熱伝導性成形体を形成する工程(工程A)と、前記熱伝導性成形体をシート状にスライスし、成形体シートを形成する工程(工程B)と、成形体シートを第1剥離フィルム3と第2剥離フィルム4とで挟持しプレスすることにより、成形体シート表面を平滑化するとともに樹脂被覆層5を形成する工程(工程C)とを有する。なお、ここでは、繊維状の熱伝導性充填剤を用いた場合について説明するが、繊維状の熱伝導性充填剤に替えて鱗片状の無機物フィラーを用いる場合も同様の製造工程が利用でき、以下の工程に於いても適宜読み替えが可能である。
この工程Aでは、上述した高分子マトリックス成分および繊維状熱伝導性充填剤、適宜含有される無機物フィラー、その他の成分を配合し、熱伝導性樹脂組成物を調製する。なお、各成分を配合、調製する手順については特に限定はされず、例えば、高分子マトリックス成分に、繊維状熱伝導性充填剤、適宜、無機物フィラー、磁性粉、その他成分を添加し、混合することにより、熱伝導性樹脂組成物の調製が行われる。
図2に示すように、熱伝導性成形体6をシート状にスライスし、成形体シート7を形成する工程Bでは、配向した繊維状の熱伝導性充填剤の長軸方向に対して、0°〜90°の角度となるように、より好ましくは45°〜90°の角度となるように、熱伝導性成形体6をシート状に切断する。これにより、繊維状熱伝導性充填剤は、シート本体2の厚み方向に配向される。
工程Cでは、成形体シート7の一方の面に第1剥離フィルム3を貼り付け、成形体シート7の他方の面に第2剥離フィルム4を貼り付けてプレスする。このプレスにより、成形体シート7の表面を平滑化するとともに高分子マトリックス成分の未硬化成分をブリードさせ、成形体シート7の一方の面と第1剥離フィルム3との間と、成形体シート7の他方の面と第2剥離フィルム4との間に樹脂被覆層5を形成する。ここで、熱伝導性シート1の面2aと面2bは、スライスされた面であり、スライスされた後にプレスされた面である。これにより、熱伝導性シート1が形成され、シート表面の凹凸を低減させるとともに、露出する繊維状の熱伝導性充填剤を被覆させ、熱源や放熱部材との密着性を向上し、軽荷重時の界面接触抵抗を軽減させ、熱伝導効率を向上させることができる。
実使用時においては、熱伝導性シート1は、例えば、半導体装置等の電子部品や、ヒートシンク等の各種放熱部材に実装される。このとき、熱伝導性シート1は、シート本体2からの剥離強度が小さい方の剥離フィルム、例えば上述した例で言えば、第1剥離フィルム3から剥離する。これにより、第1剥離フィルム3に付着してシート本体2の全部が第2剥離フィルム4から剥離することがなく、第2剥離フィルム4に支持された状態でシート本体2の一方の面2aを露出させることができる。熱伝導性シート1は、樹脂被覆層5が露出したシート本体2の一方の面2aを半導体装置等の電子部品またはヒートシンク等の放熱部材に貼り付け、その後、第2剥離フィルム4をシート本体2の他方の面2bから剥離する。
本実施例では、下記の表1に示すように、まず、シリコーン樹脂(バインダの一例):34体積%と、結晶形状が六方晶型である鱗片状の窒化ホウ素(D50が40μm):25体積%と、窒化アルミニウム(D50が1.5μm):19体積%と、球状アルミナ粒子(D50が5μm):19体積%と、酸化亜鉛(D50が1μm):1体積%と、水酸化アルミ(D50が8μm):1体積%と、カップリング剤:1体積%と、を均一に混合することにより、熱伝導性シート形成用の樹脂組成物を調製した。
本実施例では、まず、ガラス容器に、平均繊維径:9μm、平均繊維長:110μmのピッチ系炭素繊維を100g、エタノールを450g投入し、撹拌翼にて混合してスラリー液を得た。流量:160mL/minで窒素をスラリー液に加えてイナート化を行いながら、スラリーにジビニルベンゼン(93%ジビニルベンゼン)を25g加えた。ジビニルベンゼンを加えた10分後に、予め50gのエタノールに溶解させておいた0.500gの重合開始剤(油溶性アゾ重合開始剤)をスラリー液に投入した。投入後、5分間撹拌した後に、窒素によるイナート化を停止させた。
本実施例では、まず、ポリエチレン製容器に、平均繊維径9μm、平均繊維長110μmのピッチ系炭素繊維を100g、テトラエトキシシラン(TEOS)200g、エタノール900gを投入し、撹拌翼にて混合した。その後、50℃まで加温しながら、反応開始剤(10%アンモニア水)176gを5分かけて投入した。溶媒の投入が完了した時点を0分として、3時間撹拌を行った。撹拌終了後、降温させ、吸引濾過して固形分を回収し、固形分を水とエタノールを用いて洗浄し、再度吸引濾過を行い、固形分を回収した。回収した固形分を100℃にて2時間乾燥後、更に200℃で8時間焼成を行うことで、SiO2絶縁被覆炭素繊維(表面を絶縁物で被覆した炭素繊維の一例)を得た。
本実施例では、下記の表1に示すように、シリコーン樹脂:28体積%と、炭素繊維:6体積%、球状アルミナ粒子(D50が15μm):30体積%と、球状アルミナ粒子(D50が5μm):1体積%と、粒状窒化アルミ(D50が1.5μm):33体積%と、水酸化アルミ(D50が8μm):1体積%と、カップリング剤:1体積%と、を混合し、シリコーン組成物を調製した。
比較例1〜4では、実施例1〜4で得られた成形体ブロックをカッターナイフ(合金工具鋼)でスライスすることにより、炭素繊維が厚み方向に配向した熱伝導性シート1を得た。その際、比較例1では、表1に示すように、熱伝導性シート1のいずれか一方の面のSaが5.687μmかつSzが71.652μmとなるように、成形体ブロックを超硬刃物でスライスして熱伝導性シート1を得た。また、比較例2では、表1に示すように、熱伝導性シート1のいずれか一方の面のSaが5.899μmかつSzが65.050μmとなるように、成形体ブロックを超硬刃物でスライスして熱伝導性シート1を得た。また、比較例3では、表1に示すように、熱伝導性シート1のいずれか一方の面のSaが5.680μmかつSzが57.380μmとなるように、成形体ブロックを超硬刃物でスライスして熱伝導性シート1を得た。また、比較例4では、表1に示すように、熱伝導性シート1のいずれか一方の面のSaが7.761μmかつSzが65.230μmとなるように、成形体ブロックを超硬刃物でスライスして熱伝導性シート1を得た。
実施例1〜4および比較例1〜4のそれぞれで得られた熱伝導性シート1の熱抵抗は、以下の手順で測定した。上記の厚みの熱伝導性シート1を直径20mmの円形になるように加工し、テストピースを得た。次いで、得られたテストピースを銅の間に挟み、熱抵抗[℃・cm2/W]を1kgf/cm2の荷重で測定した。横軸に測定時厚み、縦軸に熱抵抗値としてプロットし、切片から接触熱抵抗を求めた。
実施例1〜4および比較例1〜4のそれぞれで得られた熱伝導性シート1の表面粗さは、株式会社キーエンス製ワンショット3D形状機VR5200で測定した。Sa(算術平均高さ)は、Ra(線の算術平均高さ)を面に拡張したパラメーターであり、表面の平均面に対して、各点の高さの差の絶対値の平均を表す。Saは、面粗さを評価する際に一般的に利用する。Sz(最大高さ)は、表面の最も高い点から最も低い点までの距離を表す。そして、表1に示すように、実施例1と比較例1、実施例2と比較例2、実施例3と比較例3、および実施例4と比較例4を比較すると、比較例の熱伝導性シート1と比較すると、実施例の熱伝導性シート1の熱伝導率および絶縁破壊電圧が高くなった。これにより、バインダと違法性熱伝導フィラーを含み、当該異方性熱伝導フィラーが厚み方向に配向した熱伝導性シート1のSaが5μm以下かつSzが50μm以下であり、絶縁破壊電圧が0.5kV/mm以上とすることにより、絶縁性を有しながらも低熱抵抗の熱伝導性シート1を得ることができることが分かる。すなわち、絶縁性材料を用いてもSaとSzを所定の値以下とすることで厚み方向に良好に伝熱させることが可能な熱伝導性シート1が得られる。そして、電子機器において、実施例1〜4の熱伝導性シート1を、当該電子機器を構成する電子部品51(発熱体の一例)と、放熱ファンや放熱板等(放熱部材の一例)と、の間に挟むことにより、放熱部材に対する熱伝導率を向上させることができ、効率良く放熱させることができる。
Claims (5)
- バインダと異方性熱伝導フィラーとを含み、前記異方性熱伝導フィラーが厚み方向に配向した熱伝導性シートであり、
前記バインダがシリコーン樹脂であり、
前記異方性熱伝導フィラーが窒化ホウ素であって、
当該熱伝導性シートのいずれか一方の面のSzが50μm以下であり、絶縁破壊電圧が0.5kV/mm以上である、熱伝導性シート。 - バインダと異方性熱伝導フィラーとを含み、前記異方性熱伝導フィラーが厚み方向に配向した熱伝導性シートであり、
前記バインダがシリコーン樹脂であり、
前記異方性熱伝導フィラーが炭素繊維または表面を絶縁物で被覆した炭素繊維であって、
前記炭素繊維の配合量が4体積%以上6体積%以下であり、
当該熱伝導性シートのいずれか一方の面のSzが50μm以下であり、絶縁破壊電圧が0.5kV/mm以上である、熱伝導性シート。 - 前記窒化ホウ素が鱗片状窒化ホウ素である、請求項1に記載の熱伝導性シート。
- さらに、アルミナ、窒化アルミ、酸化亜鉛、および水酸化アルミのいずれかを含有する、請求項1〜3に記載の熱伝導性シート。
- 請求項1〜4記載の熱伝導性シートを、発熱体と放熱部材の間に挟んだ、電子機器。
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