JP6971756B2 - 基板液処理装置 - Google Patents
基板液処理装置 Download PDFInfo
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- JP6971756B2 JP6971756B2 JP2017195221A JP2017195221A JP6971756B2 JP 6971756 B2 JP6971756 B2 JP 6971756B2 JP 2017195221 A JP2017195221 A JP 2017195221A JP 2017195221 A JP2017195221 A JP 2017195221A JP 6971756 B2 JP6971756 B2 JP 6971756B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Description
34B 外槽
71,72 蓋体
71A,72A 本体部
71B,71D,72B,72D 飛沫遮蔽部
71B、72B 第1辺部
71D,72D 第2辺部
71E,72E 斜辺部
71J,72J 壁体
71R,72R 凹所
74 基板押さえ
H 高さ
G 隙間
Claims (12)
- 処理液を貯留することができ、上部開口を有する内槽と、
前記内槽の外側に設けられた外槽と、
前記内槽の上部開口を閉鎖する閉鎖位置と、前記内槽の上部開口を開放する開放位置との間で移動可能な蓋体と、
を備え、
前記蓋体は、
前記蓋体が閉鎖位置にあるときに、前記内槽の上部開口を覆う本体部と、
前記本体部に接続された飛沫遮蔽部と、
を有しており、
前記蓋体が閉鎖位置にあるときに、前記飛沫遮蔽部は、当該飛沫遮蔽部に隣接する前記内槽の側壁の上端より高い高さ位置から当該側壁よりも前記外槽側であってかつ当該側壁の上端より低い位置まで延びており、
前記蓋体は、前記内槽の前記上部開口の第1部分を覆う第1蓋体部分と、前記内槽の前記上部開口の第2部分を覆う第2蓋体部分と、を有しており、前記第1蓋体部分及び前記第2蓋体部分は、水平方向に延びる各々の旋回軸線を中心として旋回可能であり、この旋回に伴い、前記第1蓋体部分及び前記第2蓋体部分が閉鎖位置と開放位置との間で移動するようになっており、前記第1蓋体部分及び前記第2蓋体部分の各々が、前記本体部と、前記飛沫遮蔽部とを有している、基板液処理装置。 - 前記蓋体は、案内部を有し、前記案内部は、前記第1蓋体部分が閉鎖位置にあるときに前記本体部の上面に付着した液を、前記第1蓋体部分が開放位置に位置したときに前記外槽の外側に案内する、請求項1記載の基板液処理装置。
- 前記外槽は、前記内槽からオーバーフローする処理液を受ける、請求項1記載の基板液処理装置。
- 前記蓋体が閉鎖位置にあるとき、前記飛沫遮蔽部の下端は、前記内槽の外側であってかつ前記外槽の内側の水平方向位置に位置している、請求項3記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分が前記閉鎖位置にあるとき、前記第1蓋体部分及び前記第2蓋体部分の前記本体部の全体が、前記内槽から前記外槽へとオーバーフローしているときの前記処理液の前記内槽内における液面と実質的に同じ高さに位置する、請求項1記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分が前記閉鎖位置にあるとき、前記第1蓋体部分及び前記第2蓋体部分の前記本体部は傾斜しており、前記第1蓋体部分及び前記第2蓋体部分の前記本体部の基端部分が、前記内槽から前記外槽へとオーバーフローしているときの前記処理液の前記内槽内における液面よりも高い位置にあり、前記第1蓋体部分及び前記第2蓋体部分の前記本体部の先端部分が前記液面よりも低い位置にある、請求項1記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分が前記閉鎖位置にあるとき、平面視で、前記第1蓋体部分の前記本体部の前記先端部分と前記第2蓋体部分の前記本体部の前記先端部分とが重なりあっている、請求項6記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分が前記閉鎖位置にあるとき、前記第1蓋体部分の前記本体部の前記先端部分と前記第2蓋体部分の前記本体部の前記先端部分とが離れている、請求項7記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分の上方にさらに第1の補助蓋体及び第2の補助蓋体を有する、請求項6記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分の前記飛沫遮蔽部の各々は、前記旋回軸線の方向に延びる第1辺部と、前記旋回軸線と直交する方向に延びる第2辺部と、第1辺部及び第2辺部に対して角度を成して延びて前記第1辺部の端部と前記第2辺部の端部を接続する斜辺部と、を有している、請求項1記載の基板液処理装置。
- 前記第1蓋体部分及び前記第2蓋体部分の下面の各々は、前記第1辺部に近づくに従って低くなるように傾斜するとともに、前記第2辺部に近づくに従って低くなるように傾斜している、請求項10記載の基板液処理装置。
- 前記内槽内で複数枚の基板を下方から支持する基板支持部材と、前記第1蓋体部分及び前記第2蓋体部分の少なくともいずれか一方に設けられた基板押さえと、をさらに備え、
前記基板押さえは、前記第1蓋体部分及び前記第2蓋体部分が閉鎖位置にあるときに、前記基板支持部材により支持された基板と係合して、前記基板の少なくとも上方への変位を防止または抑制する、請求項1記載の基板液処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/883,481 US11309194B2 (en) | 2017-02-01 | 2018-01-30 | Substrate liquid treatment apparatus |
KR1020180012083A KR102451367B1 (ko) | 2017-02-01 | 2018-01-31 | 기판액 처리 장치 |
CN201810096859.5A CN108376660B (zh) | 2017-02-01 | 2018-01-31 | 基板液处理装置 |
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JP2017017082 | 2017-02-01 | ||
JP2017017082 | 2017-02-01 |
Publications (2)
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JP2018125516A JP2018125516A (ja) | 2018-08-09 |
JP6971756B2 true JP6971756B2 (ja) | 2021-11-24 |
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US (1) | US11309194B2 (ja) |
JP (1) | JP6971756B2 (ja) |
KR (1) | KR102451367B1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6909620B2 (ja) * | 2017-04-20 | 2021-07-28 | 株式会社Screenホールディングス | 基板処理方法 |
JP6986917B2 (ja) * | 2017-10-04 | 2021-12-22 | 東京エレクトロン株式会社 | 基板液処理装置 |
CN109075111A (zh) * | 2018-05-17 | 2018-12-21 | 长江存储科技有限责任公司 | 用于改进的化学蚀刻的方法和*** |
JP7081361B2 (ja) * | 2018-07-17 | 2022-06-07 | 富士通株式会社 | 液浸槽 |
US11532493B2 (en) * | 2018-07-30 | 2022-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wet bench and chemical treatment method using the same |
JP7176904B2 (ja) * | 2018-09-21 | 2022-11-22 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP7178261B2 (ja) * | 2018-12-27 | 2022-11-25 | 東京エレクトロン株式会社 | 基板液処理装置 |
JP7190912B2 (ja) * | 2019-01-10 | 2022-12-16 | 東京エレクトロン株式会社 | 基板処理装置 |
JP7349876B2 (ja) * | 2019-10-17 | 2023-09-25 | 東京エレクトロン株式会社 | 基板処理装置および装置洗浄方法 |
CN111162026B (zh) * | 2019-12-25 | 2022-04-15 | 绍兴华立电子有限公司 | 一种蚀刻后的表面防氧化处理装置 |
US11682567B2 (en) * | 2020-06-30 | 2023-06-20 | Applied Materials, Inc. | Cleaning system with in-line SPM processing |
CN112768377B (zh) * | 2020-12-31 | 2022-08-12 | 上海至纯洁净***科技股份有限公司 | 一种有效解决晶圆干燥颗粒数干燥后二次污染的结构 |
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JPH07122531A (ja) * | 1993-10-22 | 1995-05-12 | Dainippon Screen Mfg Co Ltd | 基板処理液収容装置およびそれを備えた基板処理装置 |
US5887602A (en) * | 1995-07-31 | 1999-03-30 | Tokyo Electron Limited | Cleaning machine and method of controlling the same |
JP3462325B2 (ja) | 1995-12-21 | 2003-11-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH11102888A (ja) * | 1997-09-29 | 1999-04-13 | Dainippon Screen Mfg Co Ltd | 基板処理槽 |
US7140512B2 (en) * | 2004-01-20 | 2006-11-28 | Taiwan Semiconductor Manufacturing Co. | Interlocking lid for wet bench |
JP4429106B2 (ja) * | 2004-07-28 | 2010-03-10 | 大日本スクリーン製造株式会社 | 基板エッチング装置 |
JP2006100717A (ja) * | 2004-09-30 | 2006-04-13 | Dainippon Screen Mfg Co Ltd | 基板処理方法およびその装置 |
JP2013187401A (ja) * | 2012-03-08 | 2013-09-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
JP6326365B2 (ja) * | 2014-12-24 | 2018-05-16 | 東京エレクトロン株式会社 | 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
US11062922B2 (en) * | 2017-02-28 | 2021-07-13 | Tokyo Electron Limited | Substrate liquid processing apparatus |
-
2017
- 2017-10-05 JP JP2017195221A patent/JP6971756B2/ja active Active
-
2018
- 2018-01-30 US US15/883,481 patent/US11309194B2/en active Active
- 2018-01-31 KR KR1020180012083A patent/KR102451367B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US11309194B2 (en) | 2022-04-19 |
US20180218924A1 (en) | 2018-08-02 |
KR20180089864A (ko) | 2018-08-09 |
JP2018125516A (ja) | 2018-08-09 |
KR102451367B1 (ko) | 2022-10-05 |
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