JP6970432B2 - Board alignment device - Google Patents

Board alignment device Download PDF

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JP6970432B2
JP6970432B2 JP2017230253A JP2017230253A JP6970432B2 JP 6970432 B2 JP6970432 B2 JP 6970432B2 JP 2017230253 A JP2017230253 A JP 2017230253A JP 2017230253 A JP2017230253 A JP 2017230253A JP 6970432 B2 JP6970432 B2 JP 6970432B2
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alignment
substrates
substrate
strip
alignment member
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JP2019099407A (en
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勝喜 中田
平道 谷垣内
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to TW107142628A priority patent/TW201925114A/en
Priority to CN201811456187.0A priority patent/CN110028233A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Description

本発明は、基板整列装置、特に、複数の基板を整列する基板整列装置に関する。 The present invention relates to a substrate aligning device, particularly a substrate aligning device for aligning a plurality of substrates.

ガラス基板の分断方法として、下記の方法が知られている（例えば、特許文献１を参照）。
第１ステップでは、マザー基板の互いに直交するＸ方向とＹ方向に複数のスクライブラインを形成する。
第２ステップでは、Ｘ方向に延びるスクライブラインに沿って分断を行い、複数の短冊状（一方に長い矩形状の）基板を形成する。
第３ステップでは、短冊状の基板をＹ方向に延びるスクライブラインに沿って分断を行い、単位基板を形成する。 The following method is known as a method for dividing a glass substrate (see, for example, Patent Document 1).
In the first step, a plurality of scribe lines are formed in the X and Y directions orthogonal to each other on the mother substrate.
In the second step, division is performed along a scribe line extending in the X direction to form a plurality of strip-shaped (long rectangular-shaped) substrates.
In the third step, the strip-shaped substrate is divided along a scribe line extending in the Y direction to form a unit substrate.

特開２０１３−７１３３５号公報Japanese Unexamined Patent Publication No. 2013-71335

生産性を向上させるため、第３ステップでは、従来より複数の短冊状基板を同時に分断することが望まれている。しかし、その場合、複数の短冊状基板が互いに整列していなければ、Ｙ方向に延びるスクライブラインの位置が互いにずれてしまい、正確な分断ができなくなる。 In order to improve productivity, it has been conventionally desired to divide a plurality of strip-shaped substrates at the same time in the third step. However, in that case, if the plurality of strip-shaped substrates are not aligned with each other, the positions of the scribe lines extending in the Y direction will be displaced from each other, and accurate division will not be possible.

本発明の目的は、次に分断工程が待っている複数の基板を整列させることにある。 An object of the present invention is to align a plurality of substrates awaiting the next dividing step.

以下に、課題を解決するための手段として複数の態様を説明する。これら態様は、必要に応じて任意に組み合せることができる。 Hereinafter, a plurality of aspects will be described as means for solving the problem. These aspects can be arbitrarily combined as needed.

本発明の一見地に係る基板整列装置は、複数の基板の端面を直線状に整列するための装置であって、コンベヤ装置と、整列部材と、駆動部とを備えている。
コンベヤ装置は、複数の基板を搬送する搬送面を有する。
整列部材は、搬送面の上方に配置され、搬送方向第１側に直線状の整列端面を有する。
駆動部は、整列部材を、搬送面から上方に離れた第１位置と、搬送面に当接又は近接した第２位置との間で移動可能である。
この装置では、整列部材が第２位置にあるときに、コンベヤ装置が複数の基板を搬送して複数の基板の端面を整列部材の整列端面に当接させることで、複数の基板の端面をコンベヤ装置搬送方向に整列させる。 The substrate aligning device according to the first aspect of the present invention is a device for linearly aligning the end faces of a plurality of substrates, and includes a conveyor device, an alignment member, and a drive unit.
The conveyor device has a transport surface for transporting a plurality of substrates.
The alignment member is arranged above the transport surface and has a linear alignment end surface on the first side in the transport direction.
The drive unit is capable of moving the alignment member between a first position above the transport surface and a second position in contact with or close to the transport surface.
In this device, when the alignment member is in the second position, the conveyor device conveys a plurality of substrates and brings the end faces of the plurality of substrates into contact with the alignment end faces of the alignment members, so that the end faces of the plurality of substrates are conveyored. Align in the device transport direction.

基板整列装置は、コントローラを備えている。
コントローラは、下記のステップを実行する。
◎駆動部によって整列部材を第１位置に配置させるステップ。
◎コンベヤ装置によって、複数の基板を整列部材の下方を搬送方向第２側から搬送方向第１側に通過させるステップ。
◎駆動部によって整列部材を第２位置に移動させるステップ。
◎コンベヤ装置によって複数の基板を搬送方向第２側に移動させることで、複数の基板の端面を整列部材の整列端面に当接させるステップ。
この装置では、コンベヤ装置が複数の基板を整列部材の下方を通過させた後に、整列部材をコンベヤ装置の搬送面に当接又は近接させ、次に、コンベヤ装置が複数の基板を搬送して複数の基板の端面を整列部材の整列端面に当接させることで、複数の基板の端面をコンベヤ装置搬送方向に整列させる。 Substrate alignment apparatus includes a controller.
The controller performs the following steps.
◎ The step of arranging the alignment member in the first position by the drive unit.
◎ A step in which a plurality of substrates are passed under the alignment member from the second side in the transport direction to the first side in the transport direction by a conveyor device.
◎ Step to move the alignment member to the second position by the drive unit.
◎ A step in which the end faces of a plurality of boards are brought into contact with the alignment end faces of the alignment member by moving the plurality of boards to the second side in the transport direction by a conveyor device.
In this device, after the conveyor device passes a plurality of substrates under the alignment member, the alignment member is brought into contact with or close to the transport surface of the conveyor device, and then the conveyor device transports the plurality of substrates to a plurality. By bringing the end faces of the substrates of the above into contact with the alignment end faces of the alignment members, the end faces of the plurality of substrates are aligned in the conveyor device transport direction.

基板整列装置は、複数の基板を搬送面上で保持することで複数の基板の位置を固定する基板保持部をさらに備えていてもよい。コントローラは、複数の基板を搬送面上で保持することで複数の基板の位置を固定するステップをさらに実行してもよい。 The substrate aligning device may further include a substrate holding portion for fixing the positions of the plurality of substrates by holding the plurality of substrates on the transport surface. The controller may further perform the step of fixing the positions of the plurality of boards by holding the plurality of boards on the transport surface.

本発明に係る基板整列装置では、次に分断工程が待っている複数の基板を整列させることができる。 In the substrate aligning apparatus according to the present invention, a plurality of substrates waiting for the next dividing step can be aligned.

本発明の第１実施形態に係る基板整列装置の側面図。The side view of the substrate alignment apparatus which concerns on 1st Embodiment of this invention. 基板整列装置の制御構成を示すブロック図。The block diagram which shows the control composition of the board alignment apparatus. 基板整列装置の整列制御動作を示すフローチャート。The flowchart which shows the alignment control operation of the board alignment apparatus. 整列動作の一状態を示す基板整列装置の側面図。The side view of the board alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the board alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the board alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the board alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の側面図。The side view of the board alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。The schematic plan view of the substrate alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。The schematic plan view of the substrate alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。The schematic plan view of the substrate alignment apparatus which shows one state of the alignment operation. 整列動作の一状態を示す基板整列装置の模式的平面図。The schematic plan view of the substrate alignment apparatus which shows one state of the alignment operation.

１．第１実施形態
（１）基板整列装置の構成
図１を用いて、基板整列装置１を説明する。図１は、本発明の第１実施形態に係る基板整列装置の側面図である。
基板整列装置１は、複数の短冊状基板１１１の端面１１１ａを直線状に整列するための装置である。複数の短冊状基板１１１は、貼り合わせ基板を複数の第１スクライブラインに沿って分断されることで形成されている。複数の短冊状基板１１１は、図９に示すように、単位基板と端材とを有しており、後に複数のスクライブラインに沿って分断されることで複数の単位基板になる。
図１において、紙面直交方向が第１方向（矢印Ｘ）であり、図左右方向が第２方向（矢印Ｙ）である。複数の短冊状基板１１１の搬送方向は第２方向であり、複数の短冊状基板１１１は第２方向において左から右に向かって搬送されながら加工される。そのため、図１の第２方向左側が搬送上流側であり、図１の第２方向右側が搬送方向下流側である。
基板整列装置１は、コンベヤ装置３（コンベヤ装置の一例）と、整列部材５（整列部材の一例）と、整列駆動部７（駆動部の一例、図２）とを備えている。 1. 1. 1st Embodiment (1) Configuration of Board Aligning Device The substrate arranging device 1 will be described with reference to FIG. FIG. 1 is a side view of the substrate alignment device according to the first embodiment of the present invention.
The substrate alignment device 1 is a device for linearly aligning the end faces 111a of a plurality of strip-shaped substrates 111. The plurality of strip-shaped substrates 111 are formed by dividing the bonded substrate along a plurality of first scribe lines. As shown in FIG. 9, the plurality of strip-shaped substrates 111 have a unit substrate and scraps, and are later divided along a plurality of scribe lines to form a plurality of unit substrates.
In FIG. 1, the direction orthogonal to the paper surface is the first direction (arrow X), and the left-right direction in the figure is the second direction (arrow Y). The transport direction of the plurality of strip-shaped substrates 111 is the second direction, and the plurality of strip-shaped substrates 111 are processed while being transported from left to right in the second direction. Therefore, the left side in the second direction in FIG. 1 is the upstream side in the transport direction, and the right side in the second direction in FIG. 1 is the downstream side in the transport direction.
The substrate alignment device 1 includes a conveyor device 3 (an example of a conveyor device), an alignment member 5 (an example of an alignment member), and an alignment drive unit 7 (an example of a drive unit, FIG. 2).

コンベヤ装置３は、複数の短冊状基板１１１を搬送する搬送面３ａを有する。具体的には、コンベヤ装置３は、搬送方向に延びるベルトコンベヤである。図１では、複数の短冊状基板１１１は、図９に示すように、第１方向に間を空けて並んでおり、第２方向（搬送方向）に延びて配置されている。そして、複数の短冊状基板１１１の端面１１１ａは、搬送方向上流側を向いている。
整列部材５は、搬送面３ａの上方に配置され、直線状の整列端面５ａを有する。整列端面５ａは、第１方向に沿って延び搬送方向下流側を向いた平面である。 The conveyor device 3 has a transport surface 3a for transporting a plurality of strip-shaped substrates 111. Specifically, the conveyor device 3 is a belt conveyor extending in the transport direction. In FIG. 1, as shown in FIG. 9, the plurality of strip-shaped substrates 111 are arranged side by side with a gap in the first direction, and are arranged so as to extend in the second direction (transportation direction). The end faces 111a of the plurality of strip-shaped substrates 111 face upstream in the transport direction.
The alignment member 5 is arranged above the transport surface 3a and has a linear alignment end surface 5a. The aligned end surface 5a is a plane extending along the first direction and facing the downstream side in the transport direction.

整列駆動部７は、整列部材５を、搬送面３ａから上方に離れた第１位置（図１）と、搬送面３ａに当接又は近接した第２位置（図４）との間で移動可能である。具体的には、整列駆動部７は、整列部材５を上下方向に駆動する流体シリンダである。整列駆動部７は、他の直線駆動装置であってもよい。
基板整列装置１では、整列部材５が第２位置にあるときに、コンベヤ装置３が複数の短冊状基板１１１を搬送して複数の短冊状基板１１１の端面１１１ａを整列部材５の整列端面５ａに当接させることで、複数の短冊状基板１１１の端面１１１ａを搬送方向に整列させる。 The alignment drive unit 7 can move the alignment member 5 between a first position (FIG. 1) away from the transport surface 3a and a second position (FIG. 4) in contact with or close to the transport surface 3a. Is. Specifically, the alignment drive unit 7 is a fluid cylinder that drives the alignment member 5 in the vertical direction. The alignment drive unit 7 may be another linear drive device.
In the substrate aligning device 1, when the aligning member 5 is in the second position, the conveyor device 3 conveys a plurality of strip-shaped substrates 111 and transfers the end faces 111a of the plurality of strip-shaped substrates 111 to the aligning end faces 5a of the aligning member 5. By abutting them, the end faces 111a of the plurality of strip-shaped substrates 111 are aligned in the transport direction.

基板整列装置１は、さらに、吸着保持装置９（基板保持部の一例）を有している。吸着保持装置９は、整列後の複数の短冊状基板１１１を搬送面３ａ上で保持するための装置である。それにより、短冊状基板１１１の搬送面３ａ上の位置が固定される。吸着保持装置９は、整列部材５より搬送方向下流側に配置されている。吸着保持装置９は、吸着部１１、保持駆動部１３（図２）、吸引装置１５（図２）を有している。
吸着部１１は、下方に向いた吸着口を有して、上下方向に移動可能な部材である。保持駆動部１３（図２）は、吸着部１１を上下方向に移動する装置である。吸引装置１５（図２）は、吸着部１１に負圧を供給する装置である。 The substrate aligning device 1 further includes a suction holding device 9 (an example of a substrate holding portion). The suction holding device 9 is a device for holding a plurality of strip-shaped substrates 111 after alignment on the transport surface 3a. As a result, the position of the strip-shaped substrate 111 on the transport surface 3a is fixed. The suction holding device 9 is arranged on the downstream side in the transport direction from the alignment member 5. The suction holding device 9 has a suction unit 11, a holding drive unit 13 (FIG. 2), and a suction device 15 (FIG. 2).
The suction unit 11 is a member that has a suction port facing downward and can move in the vertical direction. The holding drive unit 13 (FIG. 2) is a device that moves the suction unit 11 in the vertical direction. The suction device 15 (FIG. 2) is a device that supplies a negative pressure to the suction unit 11.

（２）基板整列装置の制御構成
図２を用いて、基板整列装置の制御構成を説明する。図２は、基板整列装置の制御構成を示すブロック図である。
図２に示すように、基板整列装置１は、コントローラ５０を有している。 (2) Control configuration of the board alignment device The control configuration of the board alignment device will be described with reference to FIG. FIG. 2 is a block diagram showing a control configuration of the substrate alignment device.
As shown in FIG. 2, the substrate alignment device 1 has a controller 50.

コントローラ５０は、プロセッサ（例えば、ＣＰＵ）と、記憶装置（例えば、ＲＯＭ、ＲＡＭ、ＨＤＤ、ＳＳＤなど）と、各種インターフェース（例えば、Ａ／Ｄコンバータ、Ｄ／Ａコンバータ、通信インターフェースなど）を有するコンピュータシステムである。コントローラ５０は、記憶部（記憶装置の記憶領域の一部又は全部に対応）に保存されたプログラムを実行することで、各種制御動作を行う。 The controller 50 is a computer having a processor (for example, a CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.) and various interfaces (for example, an A / D converter, a D / A converter, a communication interface, etc.). It is a system. The controller 50 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

コントローラ５０は、単一のプロセッサで構成されていてもよいが、各制御のために独立した複数のプロセッサから構成されていてもよい。
コントローラ５０の各要素の機能は、一部又は全てが、コントローラ５０を構成するコンピュータシステムにて実行可能なプログラムとして実現されてもよい。その他、コントローラ５０の各要素の機能の一部は、カスタムＩＣにより構成されていてもよい。 The controller 50 may be composed of a single processor, or may be composed of a plurality of independent processors for each control.
Some or all of the functions of each element of the controller 50 may be realized as a program that can be executed by the computer system constituting the controller 50. In addition, a part of the function of each element of the controller 50 may be configured by a custom IC.

コントローラ５０には、コンベヤ装置３、整列駆動部７、保持駆動部１３、吸引装置１５が接続されている。
コントローラ５０には、図示しないが、対象物の大きさ、形状及び位置検出するセンサ、各装置の状態を検出するためのセンサ及びスイッチ、並びに情報入力装置が接続されている。 A conveyor device 3, an alignment drive unit 7, a holding drive unit 13, and a suction device 15 are connected to the controller 50.
Although not shown, the controller 50 is connected to a sensor that detects the size, shape, and position of an object, a sensor and a switch for detecting the state of each device, and an information input device.

（３）基板整列装置の整列動作
図３〜図１０を用いて、基板整列装置の整列動作を説明する。図３は、基板整列装置の整列制御動作を示すフローチャートである。図４〜８は、整列動作の一状態を示す基板整列装置の側面図である。図９〜１２は、整列動作の一状態を示す基板整列装置の模式的平面図である。 (3) Alignment Operation of Board Aligning Device The alignment operation of the substrate arranging device will be described with reference to FIGS. 3 to 10. FIG. 3 is a flowchart showing an alignment control operation of the substrate alignment device. 4 to 8 are side views of the substrate alignment device showing one state of the alignment operation. 9 to 12 are schematic plan views of a substrate alignment device showing a state of alignment operation.

以下に説明する制御フローチャートは例示であって、各ステップは必要に応じて省略及び入れ替え可能である。また、複数のステップが同時に実行されたり、一部又は全てが重なって実行されたりしてもよい。
さらに、制御フローチャートの各ブロックは、単一の制御動作とは限らず、複数のブロックで表現される複数の制御動作に置き換えることができる。
なお、各装置の動作は、コントローラ５０から各装置への指令の結果であり、これらはソフトウェア・アプリケーションの各ステップによって表現される。 The control flowchart described below is an example, and each step can be omitted or replaced as necessary. Further, a plurality of steps may be executed at the same time, or some or all of them may be executed in an overlapping manner.
Further, each block of the control flowchart is not limited to a single control operation, and can be replaced with a plurality of control operations represented by a plurality of blocks.
The operation of each device is the result of a command from the controller 50 to each device, which is represented by each step of the software application.

図３では、コントローラ５０は、下記のステップを実行する。
ステップＳ１では、整列駆動部７によって整列部材５を第１位置に配置させる。その結果、図１に示すように、整列部材５は、搬送面３ａから離れて配置される。
ステップＳ２では、コンベヤ装置３によって、複数の短冊状基板１１１を整列部材５の下方を搬送方向上流側から搬送方向下流側に通過させる。その結果、図１及び図９に示すように、複数の短冊状基板１１１が整列部材５より搬送方向下流側に位置する。図９では、複数の短冊状基板１１１の端面１１１ａの搬送方向位置が互いにずれていることが強調して示されている。 In FIG. 3, the controller 50 performs the following steps.
In step S1, the alignment member 5 is arranged at the first position by the alignment drive unit 7. As a result, as shown in FIG. 1, the alignment member 5 is arranged away from the transport surface 3a.
In step S2, the conveyor device 3 allows the plurality of strip-shaped substrates 111 to pass below the alignment member 5 from the upstream side in the transport direction to the downstream side in the transport direction. As a result, as shown in FIGS. 1 and 9, a plurality of strip-shaped substrates 111 are located downstream of the alignment member 5 in the transport direction. In FIG. 9, it is emphasized that the positions of the end faces 111a of the plurality of strip-shaped substrates 111 in the transport direction are deviated from each other.

ステップＳ３では、整列駆動部７によって、整列部材５を第２位置に移動させる。その結果、図４に示すように、整列部材５が搬送面３ａに当接又は近接する位置に配置される。
ステップＳ４では、コンベヤ装置３によって複数の短冊状基板１１１を搬送方向上流側に移動させることで、複数の短冊状基板１１１の端面１１１ａを整列部材５の整列端面５ａに当接させる。その結果、図５及び図１１に示すように、複数の短冊状基板１１１の端面１１１ａの搬送方向位置は同じになる。このようにして、複数の短冊状基板１１１が搬送方向に整列される。 In step S3, the alignment drive unit 7 moves the alignment member 5 to the second position. As a result, as shown in FIG. 4, the alignment member 5 is arranged at a position in contact with or close to the transport surface 3a.
In step S4, the conveyor device 3 moves the plurality of strip-shaped substrates 111 to the upstream side in the transport direction, so that the end faces 111a of the plurality of strip-shaped substrates 111 are brought into contact with the aligned end faces 5a of the aligning member 5. As a result, as shown in FIGS. 5 and 11, the positions of the end faces 111a of the plurality of strip-shaped substrates 111 in the transport direction are the same. In this way, the plurality of strip-shaped substrates 111 are aligned in the transport direction.

ステップＳ５では、整列駆動部７によって、整列部材５を第１位置に移動させる。その結果、図６に示すように、整列部材５が搬送面３ａから上方に離れる。
ステップＳ６では、コンベヤ装置３によって、複数の短冊状基板１１１を搬送方向下流側に移動させる。その結果、図７及び図１１に示すように、複数の短冊状基板１１１が整列部材５から搬送方向下流側に離れた位置に配置される。このときも複数の短冊状基板１１１の整列状態は維持される。
ステップＳ７では、吸着保持装置９が短冊状基板１１１を吸着して保持する。その結果、図８及び図１２に示すように、複数の短冊状基板１１１が搬送面３ａ上で固定される。具体的には、吸着保持装置９は、複数の短冊状基板１１１の端材部分を吸着する。この状態で図示しない基板分断装置が短冊状基板１１１のスクライブラインを分割していき、複数の単位基板を形成する。このときに、複数の短冊状基板１１１が整列されているので、スクライブラインも整列しており、したがって分断の精度が向上する。 In step S5, the alignment drive unit 7 moves the alignment member 5 to the first position. As a result, as shown in FIG. 6, the alignment member 5 is separated upward from the transport surface 3a.
In step S6, the conveyor device 3 moves the plurality of strip-shaped substrates 111 to the downstream side in the transport direction. As a result, as shown in FIGS. 7 and 11, a plurality of strip-shaped substrates 111 are arranged at positions separated from the alignment member 5 on the downstream side in the transport direction. Even at this time, the aligned state of the plurality of strip-shaped substrates 111 is maintained.
In step S7, the suction holding device 9 sucks and holds the strip-shaped substrate 111. As a result, as shown in FIGS. 8 and 12, a plurality of strip-shaped substrates 111 are fixed on the transport surface 3a. Specifically, the suction holding device 9 sucks the scrap portions of the plurality of strip-shaped substrates 111. In this state, a substrate dividing device (not shown) divides the scribe line of the strip-shaped substrate 111 to form a plurality of unit substrates. At this time, since the plurality of strip-shaped substrates 111 are aligned, the scribe lines are also aligned, and therefore the accuracy of division is improved.

以上に述べたように、基板整列装置１では、コンベヤ装置３が複数の短冊状基板１１１を整列部材５の下方を通過させた後に、整列部材５をコンベヤ装置３の搬送面３ａに当接又は近接させ、次に、コンベヤ装置３が複数の短冊状基板１１１を搬送して複数の短冊状基板１１１の端面１１１ａを整列部材５の整列端面５ａに当接させることで、複数の短冊状基板１１１の端面１１１ａを第２方向（基板搬送方向）に整列させる。この結果、次に複数の単位基板を形成するために分断するときに、複数の短冊状基板１１１が整列されているので、スクライブラインも整列しており、したがって分断の精度が向上する。 As described above, in the substrate alignment device 1, after the conveyor device 3 passes a plurality of strip-shaped substrates 111 under the alignment member 5, the alignment member 5 abuts on or abuts on the transport surface 3a of the conveyor device 3. Next, the conveyor device 3 conveys the plurality of strip-shaped substrates 111 and brings the end faces 111a of the plurality of strip-shaped substrates 111 into contact with the aligned end faces 5a of the aligning member 5, so that the plurality of strip-shaped substrates 111 are brought into close contact with each other. The end faces 111a of the above are aligned in the second direction (board transfer direction). As a result, the next time the strip-shaped substrate 111 is divided to form the plurality of unit substrates, the scribe lines are also aligned because the plurality of strip-shaped substrates 111 are aligned, and therefore the accuracy of the division is improved.

２．他の実施形態
以上、本発明の一実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、発明の要旨を逸脱しない範囲で種々の変更が可能である。特に、本明細書に書かれた複数の実施形態及び変形例は必要に応じて任意に組み合せ可能である。 2. 2. Other Embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. In particular, the plurality of embodiments and modifications described herein can be arbitrarily combined as needed.

（１）基板の変形例
２枚の脆性材料基板を貼り合せた貼り合せ脆性材料基板には、ガラス基板を貼り合わせた液晶パネル、プラズマディスプレイパネル、有機ＥＬディスプレイパネル等のフラットディスプレイパネルと、シリコン基板、サファイヤ基板等をガラス基板に貼り合わせた半導体基板とが含まれる。
基板の種類は特に限定されない。基板は、単板のガラス、半導体ウエハ、セラミック基板を含んでいる。 (1) Deformation example of substrate Bonding of two brittle material substrates The brittle material substrate includes a liquid crystal panel, a plasma display panel, an organic EL display panel, and other flat display panels with a glass substrate bonded together, and silicon. It includes a semiconductor substrate in which a substrate, a sapphire substrate, etc. are bonded to a glass substrate.
The type of substrate is not particularly limited. The substrate includes a single glass, a semiconductor wafer, and a ceramic substrate.

（２）各種装置の変形例
第１実施形態では整列後に吸着保持装置９が短冊状基板を保持していたが、必ずしも保持動作を行わなくてもよい。
吸着保持装置が設けられていなくてもよい。
短冊状基板以外の基板を整列してもよい。 (2) Modification Examples of Various Devices In the first embodiment, the suction holding device 9 holds the strip-shaped substrate after alignment, but the holding operation does not necessarily have to be performed.
The suction holding device may not be provided.
Substrates other than the strip-shaped substrate may be arranged.

本発明は、複数の基板を整列する基板整列装置に広く適用できる。 The present invention can be widely applied to a substrate aligning device for aligning a plurality of substrates.

１ ：基板整列装置
３ ：コンベヤ装置
３ａ ：搬送面
５ ：整列部材
５ａ ：整列端面
７ ：整列駆動部
９ ：吸着保持装置
１１ ：吸着部
１３ ：保持駆動部
１５ ：吸引装置
５０ ：コントローラ
１１１ ：短冊状基板
１１１ａ ：端面 1: Substrate alignment device 3: Conveyor device 3a: Conveyor surface 5: Alignment member 5a: Alignment end surface 7: Alignment drive unit 9: Suction holding device 11: Suction unit 13: Holding drive unit 15: Suction device 50: Controller 111: Strip Shaped substrate 111a: End face

Claims (2)

複数の基板の端面を直線状に整列するための基板整列装置であって、
複数の基板を搬送する搬送面を有するコンベヤ装置と、
前記搬送面の上方に配置され、搬送方向第１側に直線状の整列端面を有する整列部材と、
前記整列部材を、前記搬送面から上方に離れた第１位置と、前記搬送面に当接又は近接した第２位置との間で移動可能な駆動部と、
コントローラと、
を備え、
前記コントローラは、
前記駆動部によって前記整列部材を前記第１位置に配置させるステップと、
前記コンベヤ装置によって、前記複数の基板を前記整列部材の下方を搬送方向第２側から搬送方向第１側に通過させるステップと、
前記駆動部によって前記整列部材を前記第２位置に移動させるステップと、
前記コンベヤ装置によって前記複数の基板を搬送方向第２側に移動させることで、前記複数の基板の端面を前記整列部材の前記整列端面に当接させるステップと、
を実行する、基板整列装置。 A board alignment device for linearly aligning the end faces of multiple boards.
A conveyor device having a transport surface for transporting a plurality of substrates,
An alignment member arranged above the transport surface and having a linear alignment end surface on the first side in the transport direction,
A drive unit that can move the alignment member between a first position that is upwardly separated from the transport surface and a second position that is in contact with or close to the transport surface.
With the controller
Equipped with
The controller
A step of arranging the alignment member at the first position by the drive unit, and
A step of passing the plurality of substrates under the alignment member from the second side in the transport direction to the first side in the transport direction by the conveyor device.
A step of moving the alignment member to the second position by the drive unit,
A step of bringing the end faces of the plurality of substrates into contact with the alignment end faces of the alignment member by moving the plurality of substrates to the second side in the transport direction by the conveyor device.
A board aligner to perform. 前記複数の基板を前記搬送面上で保持することで前記複数の基板の位置を固定する基板保持部をさらに備え、
前記コントローラは、前記複数の基板を前記搬送面上で保持することで前記複数の基板の位置を固定するステップをさらに実行する、請求項１に記載の基板整列装置。
Further, a substrate holding portion for fixing the positions of the plurality of substrates by holding the plurality of substrates on the transport surface is provided.
The substrate alignment device according to claim 1 , wherein the controller further executes a step of fixing the positions of the plurality of substrates by holding the plurality of substrates on the transport surface.
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