JP6943690B2 - Printed board - Google Patents

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JP6943690B2
JP6943690B2 JP2017170383A JP2017170383A JP6943690B2 JP 6943690 B2 JP6943690 B2 JP 6943690B2 JP 2017170383 A JP2017170383 A JP 2017170383A JP 2017170383 A JP2017170383 A JP 2017170383A JP 6943690 B2 JP6943690 B2 JP 6943690B2
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slit
main board
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JP2019047033A (en
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越湖　雅一
雅一 越湖
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Tabuchi Electric Co Ltd
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Description

本発明は、メイン基板とサブ基板とを組み合わせて構成されるプリント基板に関し、とりわけ、メイン基板へのサブ基板の取り付けを安定的かつ効率的におこなうことができるプリント基板に関する。 The present invention relates to a printed circuit board formed by combining a main board and a sub-board, and more particularly to a printed circuit board capable of stably and efficiently attaching the sub-board to the main board.

電子回路の分野においても製品の小型化が進行している。プリント基板に小信号用などの目的でサブ基板を設けるに際して、サブ基板をプリント基板のメイン基板に固定するに当り、コネクタ等の部品を用いることなく、直接サブ基板をメイン基板の取り付け用の溝に挿入する手法が知られている。 Products are also becoming smaller in the field of electronic circuits. When a sub-board is provided on a printed circuit board for the purpose of small signals, etc., when fixing the sub-board to the main board of the printed circuit board, the sub-board is directly mounted on the main board without using components such as connectors. The method of inserting into is known.

しかし、サブ基板を挿入する為のメイン基板に開口された取り付け用の溝(スリット)はサブ基板を取り付けた際に両者に結合部分に「がたつき」が生じないようにする必要がある。そのためには、メイン基板のスリットとサブ基板の表面との間の隙間(クリアランス)が極力少なくすることが望ましい。しかしながら、メイン基板のスリット、すなわち開口の大きさ及びサブ基板の板厚の各々には公差がある為に一定の隙間を設けて設計せざるを得ず、この隙間(クリアランス)がサブ基板取り付け時の「がたつき」の原因となる。 However, the mounting groove (slit) opened in the main board for inserting the sub board needs to prevent "rattling" at the joint portion between the two when the sub board is mounted. For that purpose, it is desirable to minimize the gap (clearance) between the slit of the main substrate and the surface of the sub substrate. However, since there are tolerances in the slits of the main board, that is, the size of the opening and the plate thickness of the sub board, it is necessary to design with a certain gap, and this gap (clearance) is when the sub board is attached. It causes "rattle" of.

この「がたつき」分の隙間はサブ基板がメイン基板に半田付けされると、その半田によって固定される。しかし、製品としてのプリント回路基板に全体が振動するような場合には、サブ基板も振動する。しかし、サブ基板がメイン基板のスリットに挿入されている構造ではサブ基板が振動するとその衝撃が半田付け部に集中することになる。したがって、このような状況を回避するためには、振動が生じた場合のメイン基板とサブ基板との間の「がたつき」を防止でき、かつサブ基板とメイン基板の間の導電パターンを接合する半田への衝撃(ストレス)を軽減することが製品の長寿命化・品質の向上の為に必要である。 When the sub-board is soldered to the main board, this "rattling" gap is fixed by the solder. However, when the printed circuit board as a product vibrates as a whole, the sub-board also vibrates. However, in a structure in which the sub-board is inserted into the slit of the main board, when the sub-board vibrates, the impact is concentrated on the soldered portion. Therefore, in order to avoid such a situation, it is possible to prevent "rattle" between the main board and the sub board when vibration occurs, and the conductive pattern between the sub board and the main board is joined. It is necessary to reduce the impact (stress) on the solder to extend the life and improve the quality of the product.

特許文献１には補助基板（サブ基板）下部の表裏両面に母基板（メイン基板）と半田接続するための端子パッドを設け、母基板（メイン基板）に空けたスリットに補助基板（サブ基板）を直接挿入して接続するようにした構造が開示されている。そして、スリットには、補助基板（サブ基板）と半田接続するための第１スリット幅の部位と、補助基板（サブ基板）を母基板（メイン基板）に対して略垂直に保持するための第２スリット幅の部位とを設け、第１スリット幅Ａは第２スリット幅よりも大きく、第２スリット幅は補助基板（サブ基板）の厚みとほぼ同等以下としたものが開示されている。 In Patent Document 1, terminal pads for solder connection to the mother board (main board) are provided on both the front and back sides of the lower part of the auxiliary board (sub board), and the auxiliary board (sub board) is formed in a slit made in the mother board (main board). The structure is disclosed in which the solder is directly inserted and connected. Then, in the slit, a portion having a width of the first slit for solder connection with the auxiliary substrate (sub-board) and a first for holding the auxiliary substrate (sub-board) substantially perpendicular to the mother substrate (main board). It is disclosed that a portion having a two-slit width is provided, the first slit width A is larger than the second slit width, and the second slit width is substantially equal to or less than the thickness of the auxiliary substrate (sub-board).

特許文献２には、サブ基板とメイン基板の接合部分に取付孔を設けてプラグピンをサブ基板に直交状態に貫通し、該プラグピンとサブ基板の配線パターンとを半田付けし、メイン基板の取付孔に挿通した接続片とメイン基板との各々の配線パターンを半田付けしてプリント基板（配線板）の機械的強度を増大させる構造が開示されている。 In Patent Document 2, a mounting hole is provided at the joint portion between the sub-board and the main board, the plug pin is penetrated perpendicularly to the sub-board, and the plug pin and the wiring pattern of the sub-board are soldered to form the mounting hole of the main board. A structure is disclosed in which the wiring patterns of the connection piece inserted into the main board and the main board are soldered to increase the mechanical strength of the printed circuit board (wiring board).

また、引用文献３には、引用文献２と類似した構成を開示しておりサブ基板端子部へ端子の代わりにジャンパー線を配置してサブ基板の両面側を半田付けすることによりサブ基板のメイン基板に対する取り付けの誤挿入を防止しつつ機械的強度を増大させるものが開示されている。 Further, Cited Document 3 discloses a configuration similar to that of Cited Document 2, and the main of the sub-board is formed by arranging jumper wires instead of terminals on the sub-board terminal portion and soldering both sides of the sub-board. Those that increase the mechanical strength while preventing erroneous insertion into the substrate are disclosed.

特開２００４−１５３１７８号公報Japanese Unexamined Patent Publication No. 2004-153178 特開平５−１９８９１１号公報Japanese Unexamined Patent Publication No. 5-198911 特開平５−１９８９１０号公報Japanese Unexamined Patent Publication No. 5-198910

上記特許文献１に開示されたものでは「がたつき」の問題については解消することはできると考えることができる。しかしながら、サブ基板の厚さよりも同等以下となっている部分が多いため、サブ基板をメイン基板のスリットへの挿入時に、却って、圧入動作の負担が大きくなる、あるいはスリットの互いの干渉部分が損傷し易くなるという別の問題が発生する。 It can be considered that the problem of "rattling" can be solved by the one disclosed in Patent Document 1. However, since there are many parts that are equal to or less than the thickness of the sub-board, when the sub-board is inserted into the slit of the main board, the load of press-fitting operation becomes heavier, or the interference parts of the slits are damaged. Another problem arises: it is easier to do.

また、サブ基板の振動によるサブ基板とメイン基板とをつなぐ半田への負荷が大きくなるという問題は依然として解消することができない。 Further, the problem that the load on the solder connecting the sub-board and the main board due to the vibration of the sub-board becomes large cannot be solved yet.

引用文献２に開示されている構造では、サブ基板及びメイン基板のサブ基板挿入用開口部（スリット）を特別に加工するための工程が増えるという問題が生じる。 The structure disclosed in Cited Document 2 has a problem that the number of steps for specially processing the sub-board insertion opening (slit) of the sub-board and the main board is increased.

引用文献３においても同様にメイン基板の開口部を特別に加工するための工程が増えるという問題が生じる。 Similarly, in Cited Document 3, there is a problem that the number of steps for specially processing the opening of the main substrate is increased.

したがって、本件発明は、サブ基板とメイン基板の結合動作の負担を極力軽減することができ、かつ、メイン基板とサブ基板の導電パターンを接続する半田への負荷も軽減することができるプリント基板を提供することを目的とする。 Therefore, the present invention provides a printed circuit board that can reduce the burden of coupling operation between the sub-board and the main board as much as possible and also reduce the load on the solder that connects the conductive patterns of the main board and the sub-board. The purpose is to provide.

本件発明の上記目的は、電子部品が配置されるメイン基板と、
該メイン基板の補助的な役割をするサブ基板と、前記サブ基板の導電パターンに取り付けられる導電性材料からなる係合部材と、を備えたプリント基板において、
前記サブ基板は、前記メイン基板に設けられた開口を形成するスリットに挿入されることによってメイン基板と組み合わせられるようになっており、
前記係合部材の一端側は該サブ基板の導電パターンに固定され、他端側は自由端になっており、前記サブ基板がメイン基板に挿入されて組み合わされたとき、前記サブ基板の係合部材と前記メイン基板のスリットとが係合関係を形成し、
前記挿入動作が完了した後前記係合部材と前記メイン基板の導電パターンとの間が半田結合される、プリント基板により達成することができる。 The above object of the present invention is to provide a main board on which electronic components are arranged.
In a printed circuit board provided with a sub-board that serves as an auxiliary role of the main board and an engaging member made of a conductive material attached to the conductive pattern of the sub-board.
The sub-board can be combined with the main board by being inserted into a slit forming an opening provided in the main board.
One end side of the engaging member is fixed to the conductive pattern of the sub-board, and the other end side is a free end. When the sub-board is inserted into the main board and combined, the sub-board is engaged. The member and the slit of the main substrate form an engaging relationship, and the member and the slit of the main substrate form an engaging relationship.
This can be achieved with a printed circuit board in which the engaging member and the conductive pattern of the main board are solder-bonded after the insertion operation is completed.

好ましい態様ではサブ基板がメイン基板に挿入されたとき、前記係合部材がメイン基板のスリットの内側からメイン基板を挟み込む爪部を備える。 In a preferred embodiment, when the sub-board is inserted into the main board, the engaging member includes a claw portion that sandwiches the main board from the inside of the slit of the main board.

別の態様では、サブ基板がメイン基板に挿入されたとき、前記係合部材がメイン基板のスリットの内側と当接状態となる突出部を備えていてもよい。 In another aspect, the engaging member may include a protrusion that is in contact with the inside of the slit of the main board when the sub-board is inserted into the main board.

本件発明よれば、メイン基板とサブ基板を備え、メイン基板に設けたスリットにサブ基板を挿入する構造のプリント基板において、振動、衝撃等の負荷がプリント基板に加わった場合に、メイン基板とサブ基板との間のがたつきを有効に抑えることができる。同時に係合部材をサブ基板の導電パターンに取り付けるとともに、係合部材を含んで半田付けをおこなうので、基板とサブ基板の導電パターンを連結する半田の応力負担を軽減することもできる。 According to the present invention, in a printed circuit board having a main board and a sub board and having a structure in which the sub board is inserted into a slit provided in the main board, the main board and the sub board are subjected to a load such as vibration or impact. The rattling between the substrate and the substrate can be effectively suppressed. At the same time, since the engaging member is attached to the conductive pattern of the sub-board and soldering is performed including the engaging member, the stress load of the solder connecting the conductive pattern of the substrate and the sub-board can be reduced.

本発明の１つの実施例にかかるプリント基板を構成するメイン基板及び係合部材を取り付けたサブ基板を示す斜視図である。It is a perspective view which shows the main board which constitutes the printed circuit board which concerns on one Example of this invention, and the sub-board which attached the engaging member. 図１のプリント基板においてサブ基板をメイン基板に挿入し、さらにハンダ付け後の状態を示す断面図である。FIG. 5 is a cross-sectional view showing a state after the sub-board is inserted into the main board and further soldered in the printed circuit board of FIG. 1. 他の実施例にかかる図２と同様の断面図である。It is the same cross-sectional view as FIG. 2 which concerns on another Example.

以下、図面を参照して、本件発明を実施例に基づいて説明する。図１を参照するとプリント基板１０を構成するメイン基板２０とサブ基板３０の部品面側からの斜視図が示されている。図１では、メイン基板２０のスリット２１に部品面側から挿入されようとしているサブ基板３０の状態が示されている。本例のサブ基板３０はスリット２１の長手方向の長さよりも全体的には長くなっている。そして、サブ基板３０の挿入側の中心部の先端は突出した形状になっており、突出した部分はスリット２１の長手方向の長さより小さくなっている。 Hereinafter, the present invention will be described with reference to the drawings based on examples. With reference to FIG. 1, a perspective view of the main board 20 and the sub board 30 constituting the printed circuit board 10 from the component side is shown. FIG. 1 shows a state of the sub-board 30 that is about to be inserted into the slit 21 of the main board 20 from the component surface side. The sub-board 30 of this example is generally longer than the length of the slit 21 in the longitudinal direction. The tip of the central portion of the sub-board 30 on the insertion side has a protruding shape, and the protruding portion is smaller than the length of the slit 21 in the longitudinal direction.

この突出した部分は、メイン基板２０のスリット２１に挿入されるサブ基板３０の挿入部３１を構成している。すなわち、サブ基板３０の挿入部３１の両側は外側に向かって張り出した肩部３２、３２を形成している。スリット２１の幅は、挿入作業の効率を考慮して全体としてはサブ基板３０の厚さより若干大きく設定されている。 This protruding portion constitutes an insertion portion 31 of the sub-board 30 that is inserted into the slit 21 of the main board 20. That is, both sides of the insertion portion 31 of the sub-board 30 form shoulder portions 32, 32 protruding outward. The width of the slit 21 is set to be slightly larger than the thickness of the sub-board 30 as a whole in consideration of the efficiency of the insertion work.

また、本例のサブ基板３０の側面には複数の導電パターン３３が形成されており、それぞれの導電パターン３３には導電性の係合部材４０が取り付けられている。本例では係合部材４０はリフロー半田（図示せず）により、サブ基板３０の導電パターン３３に接着されている。本例の係合部材４０は平板４１を加工して形成されている。本例にかかる係合部材４０の原材を構成する平板４１の両端部に一対の爪状の突出部４２、４２が形成されている。 Further, a plurality of conductive patterns 33 are formed on the side surface of the sub-board 30 of this example, and a conductive engaging member 40 is attached to each of the conductive patterns 33. In this example, the engaging member 40 is adhered to the conductive pattern 33 of the sub-board 30 by reflow soldering (not shown). The engaging member 40 of this example is formed by processing a flat plate 41. A pair of claw-shaped protrusions 42, 42 are formed at both ends of the flat plate 41 constituting the raw material of the engaging member 40 according to this example.

この状態で本例の係合部材４０はその厚み分をなす背面においてサブ基板３０の導電パターン３３にそれぞれリフロー半田により、貼り付けられている。 In this state, the engaging member 40 of this example is attached to the conductive pattern 33 of the sub-board 30 by reflow soldering on the back surface forming the thickness thereof.

本例では、サブ基板３０の両側面には導電パターン３３が形成されており、導電パターン３３には上記導電性の係合部材４０が、上記のように貼り付け状態で取り付けられている。そして、サブ基板３０をメイン基板２０のスリット２１に挿入する前の状態では、サブ基板３０の両側面に係合部材４０が取り付けられた状態になっており、その状態でのサブ基板３０の厚さすなわち、両側面に取り付けられている係合部材４０の先端の間隔は、スリット２１の幅よりは大きくなっている。 In this example, the conductive patterns 33 are formed on both side surfaces of the sub-board 30, and the conductive engaging member 40 is attached to the conductive pattern 33 in the attached state as described above. In the state before the sub-board 30 is inserted into the slit 21 of the main board 20, the engaging members 40 are attached to both side surfaces of the sub-board 30, and the thickness of the sub-board 30 in that state. That is, the distance between the tips of the engaging members 40 attached to both side surfaces is larger than the width of the slit 21.

したがって、サブ基板３０をメイン基板２０のスリット２１に挿入する際には、係合部材４０の両端部の爪状の突出部４２、４２の一対の先端はスリットの内面に接触しつつ移動する。場合によっては、スリット２１の内面を削りながらあるいは、爪状の突出部４２、４２の一対の先端を変形させながら、移動する。そして、サブ基板３０の挿入部３１と一体化した係合部材４０の挿入が完了した時点では、サブ基板３０の爪状の突出部４２、４２は、両側からスリット２１の内側からメイン基板２０を挟み込むような状態でサブ基板３０はメイン基板２０に組み込まれる。 Therefore, when the sub-board 30 is inserted into the slit 21 of the main board 20, the pair of tips of the claw-shaped protrusions 42, 42 at both ends of the engaging member 40 move while being in contact with the inner surface of the slit. In some cases, the slit 21 is moved while scraping the inner surface or deforming a pair of tips of the claw-shaped protrusions 42, 42. Then, when the insertion of the engaging member 40 integrated with the insertion portion 31 of the sub-board 30 is completed, the claw-shaped protrusions 42, 42 of the sub-board 30 insert the main board 20 from the inside of the slit 21 from both sides. The sub-board 30 is incorporated into the main board 20 in a sandwiched state.

図２を参照すると、サブ基板３０がメイン基板２０のスリット２１に挿入された状態が断面図の形で説明的に示されている。 With reference to FIG. 2, a state in which the sub-board 30 is inserted into the slit 21 of the main board 20 is explanatoryly shown in the form of a cross-sectional view.

図に示すように、メイン基板２０の半田面側にも、サブ基板３０の導電パターン３３に対応する位置に導電パターン２３が設けられている。 As shown in the figure, the conductive pattern 23 is also provided on the solder surface side of the main substrate 20 at a position corresponding to the conductive pattern 33 of the sub substrate 30.

ここで、重要なことは、サブ基板３０に取り付けられた係合部材４０の爪状の突出部４２、４２の先端がメイン基板２０の半田面側の導電パターン２３に圧接していることである。すなわち、サブ基板３０は図２において、係合部材４０の爪状の突出部４２、４２から圧力により一対の爪状の突出部４２、４２の間にメイン基板２０を挟み込むような形で、サブ基板３０はメイン基板２０に保持される。 Here, what is important is that the tips of the claw-shaped protrusions 42, 42 of the engaging member 40 attached to the sub-board 30 are pressed against the conductive pattern 23 on the solder surface side of the main board 20. .. That is, in FIG. 2, the sub-board 30 is formed so that the main board 20 is sandwiched between the pair of claw-shaped protrusions 42, 42 by pressure from the claw-shaped protrusions 42, 42 of the engaging member 40. The substrate 30 is held by the main substrate 20.

また、スリット２１を金型によるプレスによって加工する場合には、スリット２１の中央部が断面において、やや広がった状態に仕上がるため、本例の係合部材４０のように、中央部が凹んだ形状を有することにより、密着度合いの向上が得られる。 Further, when the slit 21 is processed by pressing with a die, the central portion of the slit 21 is finished in a slightly expanded state in the cross section, so that the central portion is recessed like the engaging member 40 of this example. By having the above, the degree of adhesion can be improved.

この状態でメイン基板２０の導電パターン２３とサブ基板３０の表面上に形成された導電パターン３３の端子部とをハンダ付けする。 In this state, the conductive pattern 23 of the main substrate 20 and the terminal portion of the conductive pattern 33 formed on the surface of the sub substrate 30 are soldered.

図２の状態は、サブ基板３０をメイン基板２０のスリット２１に係合部材４０を圧接しつつ挿入して、さらに半田５０により、ハンダ付け後の状態である。ハンダ付けは半田面側において行われるので、ハンダ付け後においても部品面側からみたプリント基板１０の状態には変わりはない。図２に示すように半田５０は係合部材４０を一体化するとともに、メイン基板２０の導電パターン２３の端子部とサブ基板３０の表面上に形成された導電パターン３３を接続する。 The state of FIG. 2 is a state after inserting the sub-board 30 into the slit 21 of the main board 20 while pressing the engaging member 40, and further soldering with the solder 50. Since soldering is performed on the solder side, the state of the printed circuit board 10 as seen from the component side does not change even after soldering. As shown in FIG. 2, the solder 50 integrates the engaging member 40 and connects the terminal portion of the conductive pattern 23 of the main substrate 20 and the conductive pattern 33 formed on the surface of the sub substrate 30.

この結果として、従来から問題であった「がたつき」がない状態でサブ基板３０はメイン基板２０に保持されるとともに、メイン基板２０及びサブ基板３０の導電パターン２３、３３を半田付けすることによってサブ基板３０のメイン基板２０とを強固に固定することができる。したがって、プリント基板１０に振動、衝撃等が加わった場合でも、端子間の半田５０にかかる応力負荷を有効に抑えることができる。 As a result, the sub-board 30 is held by the main board 20 in a state where there is no "rattling" which has been a problem in the past, and the conductive patterns 23 and 33 of the main board 20 and the sub-board 30 are soldered. The sub-board 30 can be firmly fixed to the main board 20. Therefore, even when vibration, impact, or the like is applied to the printed circuit board 10, the stress load applied to the solder 50 between the terminals can be effectively suppressed.

図３には、本件発明の別の実施例が示されている。図３に示すように、本例の係合部材６０の原材を構成する平板６１において、先端がとがった複数の歯形６２を備えた構造を有する。 FIG. 3 shows another embodiment of the present invention. As shown in FIG. 3, the flat plate 61 constituting the raw material of the engaging member 60 of this example has a structure including a plurality of tooth profiles 62 having sharp tips.

本例においては、サブ基板３０をメイン基板２０のスリット２１に挿入した後の状態では、図示にように係合部材６０の先端の歯形６２の部分が、スリット２１の内面に当接状態になっており、この状態でサブ基板３０とメイン基板２０とが結合される。そして、両者の結合後において、メイン基板２０及びサブ基板３０の導電パターン２３、３３を半田付けすることによって図に示すように半田５０が導電パターン２３、３３を一体的に結合する。 In this example, in the state after the sub-board 30 is inserted into the slit 21 of the main board 20, the portion of the tooth profile 62 at the tip of the engaging member 60 is in contact with the inner surface of the slit 21 as shown in the figure. In this state, the sub-board 30 and the main board 20 are coupled. Then, after the two are bonded, the conductive patterns 23 and 33 of the main substrate 20 and the sub substrate 30 are soldered so that the solder 50 integrally bonds the conductive patterns 23 and 33 as shown in the figure.

本例の示した実施例以外にも、請求項に記載されている範囲の様々な形状の係合部材を使用することができる。 In addition to the embodiments shown in this example, engaging members having various shapes within the range described in the claims can be used.

１０ プリント基板
２０ メイン基板
２１ スリット
３２ 肩部
２３ 導電パターン（銅箔）
３０ サブ基板
３３ 導電パターン
４０ 係合部材
４１ 原材
５０ 半田
６０ 係合部材 10 Printed circuit board 20 Main board 21 Slit 32 Shoulder 23 Conductive pattern (copper foil)
30 Sub-board 33 Conductive pattern 40 Engagement member 41 Raw material 50 Solder 60 Engagement member

Claims (1)

電子部品が配置されるメイン基板と、
該メイン基板の補助的な役割をするサブ基板と、前記サブ基板の導電パターンに取り付けられる導電性材料からなる係合部材と、を備えたプリント基板において、
前記サブ基板は、前記メイン基板に設けられた開口を形成するスリットに挿入されることによってメイン基板と組み合わせられるようになっており、
前記係合部材は該サブ基板の導電パターンに固定され、前記サブ基板がメイン基板に挿入されて、前記サブ基板の係合部材と前記メイン基板のスリットとが係合関係を形成し、
前記係合部材が、少なくとも一対の突出部を具備し、該突出部によって前記スリットの内側から前記メイン基板を挟み込み、 前記挿入動作が完了した後前記係合部材と前記メイン基板の導電パターンとの間が半田結合されている、プリント基板。 The main board on which electronic components are placed and
In a printed circuit board provided with a sub-board that serves as an auxiliary role of the main board and an engaging member made of a conductive material attached to the conductive pattern of the sub-board.
The sub-board can be combined with the main board by being inserted into a slit forming an opening provided in the main board.
The engaging member is fixed to the conductive pattern of the sub-board, the sub-board is inserted into the main board, and the engaging member of the sub-board and the slit of the main board form an engaging relationship.
The engaging member includes at least a pair of protruding portions, the main substrate is sandwiched from the inside of the slit by the protruding portions , and after the insertion operation is completed, the engaging member and the conductive pattern of the main substrate are combined. A printed circuit board that is solder-bonded between them.
JP2017170383A 2017-09-05 2017-09-05 Printed board Active JP6943690B2 (en)

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