JP6929060B2 - 研磨材及びその製造方法 - Google Patents
研磨材及びその製造方法 Download PDFInfo
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- JP6929060B2 JP6929060B2 JP2016255575A JP2016255575A JP6929060B2 JP 6929060 B2 JP6929060 B2 JP 6929060B2 JP 2016255575 A JP2016255575 A JP 2016255575A JP 2016255575 A JP2016255575 A JP 2016255575A JP 6929060 B2 JP6929060 B2 JP 6929060B2
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- Prior art keywords
- thermosetting resin
- resin powder
- heat
- abrasive
- expandable microspheres
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000003082 abrasive agent Substances 0.000 title description 15
- 229920005989 resin Polymers 0.000 claims description 63
- 239000011347 resin Substances 0.000 claims description 63
- 239000000843 powder Substances 0.000 claims description 60
- 229920001187 thermosetting polymer Polymers 0.000 claims description 59
- 229920000103 Expandable microsphere Polymers 0.000 claims description 47
- 239000006061 abrasive grain Substances 0.000 claims description 35
- 239000011812 mixed powder Substances 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 25
- 239000006260 foam Substances 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 14
- 239000004005 microsphere Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000005498 polishing Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 238000000227 grinding Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000004088 foaming agent Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/22—After-treatment of expandable particles; Forming foamed products
- C08J9/228—Forming foamed products
- C08J9/232—Forming foamed products by sintering expandable particles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/22—Expandable microspheres, e.g. Expancel®
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K2003/023—Silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本実施形態に係る研磨材は、多孔質体と多孔質体中に分散した砥粒とを含む。多孔質体は、熱硬化性樹脂粉体の硬化物を含有しており、熱膨張性微小球に由来する複数の気泡を有している。
本実施形態に係る研磨材の製造方法は、熱硬化性樹脂粉体、熱膨張性微小球及び砥粒を含有する混合粉体を、成形型に充填する充填工程と、成形型に充填された混合粉体を加熱して、熱硬化性樹脂粉体を溶融及び硬化させる加熱工程と、を備えている。
熱硬化性樹脂粉体として「ペルパウダー PCE−752」(ペルノックス社(神奈川県秦野市)製、平均粒径57μm)、熱膨張性微小球として「Expancel 930−120 DU」(日本フィライト社(大阪府大阪市)製、平均粒径28〜38μm)、砥粒としてシリコンカーバイト砥粒#36(南興セラミックス社(東京都板橋区)製、平均粒径500μm)を準備した。熱硬化性樹脂粉体30質量部、熱膨張性微小球3質量部、及び砥粒70質量部を、粉体混合機を用いて混合し、混合粉体を得た。
研磨材A−1を100φ用のディスクグラインダーに取り付けた。次に鉄板(一般構造用の鉄鋼材SS400、サイズ:300mm(長さ)×150mm(幅)×3mm(厚))を準備して、その表面に3kg荷重で3m/minの速度で往復研磨を行った。1分ごとに鉄板及び研磨材の重量を測定し、1分間で研磨された鉄板の量(すなわち、1分間での鉄板の減少量)及び1分間で摩耗した研磨材の量(すなわち、1分間での研磨材の減少量)を求めた。この往復研磨及び重量の測定を、研磨時間の合計が25分になるまで実施し、鉄板の減少量を切削性として評価し、研磨剤の減少量を耐久性として評価した。
混合粉体に熱膨張性微小球を配合しなかったこと以外は、実施例1と同様にして硬化発泡体を作製し、バックアップパッドを取付けて研磨材B−1とした。得られた研磨材B−1について、実施例1と同様の性能評価を行った。結果を表2に示す。
Claims (7)
- 熱硬化性樹脂粉体の硬化物を含有し、熱膨張性微小球に由来する複数の気泡を有する多孔質体と、
前記多孔質体中に分散した砥粒と、
を含み、
前記砥粒が、シリコーンカーバイト又は立方晶窒化ホウ素であり、
前記熱硬化性樹脂粉体の平均粒径に対する前記熱膨張性微小球の平均粒径の比が、0.1以上1未満である、研磨材。 - 前記熱硬化性樹脂粉体、前記熱膨張性微小球及び前記砥粒を含有する混合粉体の硬化発泡体を含む、請求項1に記載の研磨材。
- 前記熱膨張性微小球が、前記熱硬化性樹脂粉体の硬化温度以下の温度で膨張可能な微小球である、請求項1又は2に記載の研磨材。
- 前記熱硬化性樹脂粉体が、エポキシ樹脂を含有する、請求項1〜3のいずれか一項に記載の研磨材。
- 前記熱硬化性樹脂粉体の平均粒径が5〜300μmである、請求項1〜4のいずれか一項に記載の研磨材。
- 熱硬化性樹脂粉体、熱膨張性微小球及び砥粒を含有する混合粉体を、成形型に充填する充填工程と、
前記成形型に充填された前記混合粉体を加熱して、前記熱硬化性樹脂粉体を溶融及び硬化させる加熱工程と、
を備える、請求項1〜5のいずれか一項に記載の研磨材の製造方法。 - 前記熱膨張性微小球が、前記加熱工程における加熱温度以下の温度で膨張可能な微小球である、請求項6に記載の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016255575A JP6929060B2 (ja) | 2016-12-28 | 2016-12-28 | 研磨材及びその製造方法 |
US16/473,263 US20200148928A1 (en) | 2016-12-28 | 2017-12-20 | Abrasive material and method for manufacturing same |
CN201780081440.6A CN110121541A (zh) | 2016-12-28 | 2017-12-20 | 磨料及其制造方法 |
PCT/US2017/067505 WO2018125697A1 (en) | 2016-12-28 | 2017-12-20 | Abrasive material and method for manufacturing same |
EP17888422.7A EP3562906A4 (en) | 2016-12-28 | 2017-12-20 | ABRASIVE MATERIAL AND ITS MANUFACTURING PROCESS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016255575A JP6929060B2 (ja) | 2016-12-28 | 2016-12-28 | 研磨材及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018103342A JP2018103342A (ja) | 2018-07-05 |
JP6929060B2 true JP6929060B2 (ja) | 2021-09-01 |
Family
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Family Applications (1)
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JP2016255575A Active JP6929060B2 (ja) | 2016-12-28 | 2016-12-28 | 研磨材及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20200148928A1 (ja) |
EP (1) | EP3562906A4 (ja) |
JP (1) | JP6929060B2 (ja) |
CN (1) | CN110121541A (ja) |
WO (1) | WO2018125697A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024064495A (ja) | 2022-10-28 | 2024-05-14 | 株式会社コバックス | シート状研磨物品 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2806772A (en) * | 1954-09-15 | 1957-09-17 | Electro Refractories & Abrasiv | Abrasive bodies |
JPS5486892A (en) * | 1977-12-22 | 1979-07-10 | Heijirou Fukuda | Method of continuously making thin resinoid layer artificial grindstone for cutting off metal material |
US4799939A (en) * | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
JPH06278038A (ja) * | 1993-03-31 | 1994-10-04 | Tokyo Jiki Insatsu Kk | 多孔性研磨フィルム |
CA2251796A1 (en) * | 1996-05-03 | 1997-11-13 | Minnesota Mining And Manufacturing Company | Method of making a porous abrasive article |
JP3539854B2 (ja) * | 1997-11-28 | 2004-07-07 | 株式会社ノリタケカンパニーリミテド | レジノイド研削砥石 |
US6440185B2 (en) * | 1997-11-28 | 2002-08-27 | Noritake Co., Ltd. | Resinoid grinding wheel |
JP2001277133A (ja) * | 2000-03-28 | 2001-10-09 | Hitachi Chem Co Ltd | 半導体ウエハ研磨用樹脂砥石 |
US6454644B1 (en) * | 2000-07-31 | 2002-09-24 | Ebara Corporation | Polisher and method for manufacturing same and polishing tool |
JP2004181575A (ja) * | 2002-12-03 | 2004-07-02 | Noritake Co Ltd | レジノイド超砥粒ホイールの製造方法 |
JP4986590B2 (ja) * | 2006-12-04 | 2012-07-25 | クレトイシ株式会社 | レジノイド砥石 |
JP2009018375A (ja) * | 2007-07-11 | 2009-01-29 | Asahi Diamond Industrial Co Ltd | 超砥粒ホイールの製造方法及び超砥粒ホイール |
CN101148034B (zh) * | 2007-11-06 | 2010-12-22 | 浙江工业大学 | 多级粒度磨粒混合的半固着磨粒磨具 |
JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
JP5352933B1 (ja) * | 2012-05-24 | 2013-11-27 | 新栄製砥株式会社 | 可撓性エポキシスポンジ砥石 |
CN103537996A (zh) * | 2013-11-08 | 2014-01-29 | 谢泽 | 一种含磨料和热膨胀树脂空心微球的磨轮 |
JP6434266B2 (ja) * | 2013-12-17 | 2018-12-05 | 富士紡ホールディングス株式会社 | ラッピング用樹脂定盤及びそれを用いたラッピング方法 |
-
2016
- 2016-12-28 JP JP2016255575A patent/JP6929060B2/ja active Active
-
2017
- 2017-12-20 WO PCT/US2017/067505 patent/WO2018125697A1/en unknown
- 2017-12-20 EP EP17888422.7A patent/EP3562906A4/en not_active Withdrawn
- 2017-12-20 CN CN201780081440.6A patent/CN110121541A/zh active Pending
- 2017-12-20 US US16/473,263 patent/US20200148928A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN110121541A (zh) | 2019-08-13 |
JP2018103342A (ja) | 2018-07-05 |
EP3562906A1 (en) | 2019-11-06 |
US20200148928A1 (en) | 2020-05-14 |
EP3562906A4 (en) | 2020-11-04 |
WO2018125697A1 (en) | 2018-07-05 |
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