JP6901061B2 - メッキ液補充装置 - Google Patents
メッキ液補充装置 Download PDFInfo
- Publication number
- JP6901061B2 JP6901061B2 JP2017160979A JP2017160979A JP6901061B2 JP 6901061 B2 JP6901061 B2 JP 6901061B2 JP 2017160979 A JP2017160979 A JP 2017160979A JP 2017160979 A JP2017160979 A JP 2017160979A JP 6901061 B2 JP6901061 B2 JP 6901061B2
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- JP
- Japan
- Prior art keywords
- plating solution
- plating
- copper
- copper oxide
- ejector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007747 plating Methods 0.000 title claims description 111
- 239000007788 liquid Substances 0.000 title description 21
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 239000005751 Copper oxide Substances 0.000 claims description 16
- 229910000431 copper oxide Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 238000004090 dissolution Methods 0.000 claims description 9
- 230000005587 bubbling Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000000243 solution Substances 0.000 description 60
- 238000003860 storage Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011978 dissolution method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Description
2 循環ライン
3 押しポンプ
4 引きポンプ
5 エジェクタ
6 銅粉定量供給機
7 流量計
8 圧力調整用レギュレータ
9 インラインミキサ
A メッキ槽
B,C,D,E メッキ液
G 空気
P 銅粉
Claims (3)
- 銅メッキを行うメッキ槽からメッキ液を吸引して酸化銅を添加し、メッキ槽に回帰させる循環ラインを具備するメッキ液補充装置において、
前記循環ライン上に配置され、前記メッキ槽からメッキ液を吸引して循環ライン上のメッキ液を循環させるポンプ手段と、
前記循環ライン上に配置され、前記メッキ液に酸化銅粉体を直接混合するエジェクタと、
前記エジェクタの下流側に配置され、前記メッキ液への酸化銅粉体の溶解を促進させるためのインラインミキサとを少なくとも具備することを特徴とするメッキ液補充装置。 - 前記エジェクタは、前記メッキ液を噴霧して減圧される吸入空間と、前記吸入空間に前記酸化銅粉体を吸入する吸入口を有すると共に、該吸入口に吸引される酸化銅粉体を空気と共に吸引され、吸入空間において酸化銅粉体をバブリングによってメッキ液に混合させることを特徴とする請求項1記載のメッキ液補充装置。
- 前記ポンプ手段は、前記エジェクタ及びインラインミキサの上流側に配置される押しポンプと、前記エジェクタ及びインラインミキサの下流側に配置される引きポンプとによって構成されることを特徴とする請求項1又は2記載のメッキ液補充装置。
Priority Applications (1)
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JP2017160979A JP6901061B2 (ja) | 2017-08-24 | 2017-08-24 | メッキ液補充装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2017160979A JP6901061B2 (ja) | 2017-08-24 | 2017-08-24 | メッキ液補充装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019039035A JP2019039035A (ja) | 2019-03-14 |
JP6901061B2 true JP6901061B2 (ja) | 2021-07-14 |
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JP2017160979A Active JP6901061B2 (ja) | 2017-08-24 | 2017-08-24 | メッキ液補充装置 |
Country Status (1)
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JP (1) | JP6901061B2 (ja) |
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2017
- 2017-08-24 JP JP2017160979A patent/JP6901061B2/ja active Active
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JP2019039035A (ja) | 2019-03-14 |
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