JP6900593B2 - Adhesive structure, its manufacturing method and peeling method - Google Patents
Adhesive structure, its manufacturing method and peeling method Download PDFInfo
- Publication number
- JP6900593B2 JP6900593B2 JP2017068538A JP2017068538A JP6900593B2 JP 6900593 B2 JP6900593 B2 JP 6900593B2 JP 2017068538 A JP2017068538 A JP 2017068538A JP 2017068538 A JP2017068538 A JP 2017068538A JP 6900593 B2 JP6900593 B2 JP 6900593B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- layer
- melt adhesive
- thermoplastic hot
- hot melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims description 107
- 230000001070 adhesive effect Effects 0.000 title claims description 107
- 238000000034 method Methods 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000010410 layer Substances 0.000 claims description 114
- 239000004831 Hot glue Substances 0.000 claims description 75
- 229920001169 thermoplastic Polymers 0.000 claims description 70
- 239000004416 thermosoftening plastic Substances 0.000 claims description 70
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 24
- 230000005674 electromagnetic induction Effects 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 7
- -1 polyethylene Polymers 0.000 description 41
- 229920001187 thermosetting polymer Polymers 0.000 description 39
- 239000003822 epoxy resin Substances 0.000 description 20
- 229920000647 polyepoxide Polymers 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- 239000004014 plasticizer Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 229920000728 polyester Polymers 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- 150000003077 polyols Chemical class 0.000 description 10
- 229920001155 polypropylene Polymers 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000012943 hotmelt Substances 0.000 description 9
- 238000005304 joining Methods 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- 230000032683 aging Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000123 paper Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 239000001993 wax Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000003851 corona treatment Methods 0.000 description 6
- 238000002788 crimping Methods 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004567 concrete Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000010985 leather Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Natural products OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000002431 foraging effect Effects 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 230000000415 inactivating effect Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052901 montmorillonite Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 150000002979 perylenes Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910021647 smectite Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N 1,5-Pentadiol Natural products OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- KJOIQMXGNUKOLD-UHFFFAOYSA-N 1-[diacetyl(ethenyl)silyl]ethanone Chemical compound CC(=O)[Si](C=C)(C(C)=O)C(C)=O KJOIQMXGNUKOLD-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RYRZSXJVEILFRR-UHFFFAOYSA-N 2,3-dimethylterephthalic acid Chemical compound CC1=C(C)C(C(O)=O)=CC=C1C(O)=O RYRZSXJVEILFRR-UHFFFAOYSA-N 0.000 description 1
- DSGDPBCLVIXZIY-UHFFFAOYSA-N 2,5-di(butan-2-yl)benzene-1,4-diol Chemical compound CCC(C)C1=CC(O)=C(C(C)CC)C=C1O DSGDPBCLVIXZIY-UHFFFAOYSA-N 0.000 description 1
- FHTGJZOULSYEOB-UHFFFAOYSA-N 2,6-di(butan-2-yl)phenol Chemical compound CCC(C)C1=CC=CC(C(C)CC)=C1O FHTGJZOULSYEOB-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- IYBOGQYZTIIPNI-UHFFFAOYSA-N 2-methylhexano-6-lactone Chemical compound CC1CCCCOC1=O IYBOGQYZTIIPNI-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SYEOWUNSTUDKGM-YFKPBYRVSA-N 3-methyladipic acid Chemical compound OC(=O)C[C@@H](C)CCC(O)=O SYEOWUNSTUDKGM-YFKPBYRVSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- LJKQIQSBHFNMDV-UHFFFAOYSA-N 7-thiabicyclo[4.1.0]hepta-2,4-dien-6-ol Chemical compound C1=CC=CC2(O)C1S2 LJKQIQSBHFNMDV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- KYXHKHDZJSDWEF-LHLOQNFPSA-N CCCCCCC1=C(CCCCCC)C(\C=C\CCCCCCCC(O)=O)C(CCCCCCCC(O)=O)CC1 Chemical compound CCCCCCC1=C(CCCCCC)C(\C=C\CCCCCCCC(O)=O)C(CCCCCCCC(O)=O)CC1 KYXHKHDZJSDWEF-LHLOQNFPSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical class CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 235000013527 bean curd Nutrition 0.000 description 1
- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical compound C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- XYHUIOCRXXWEAX-UHFFFAOYSA-N cyclopenta-1,3-diene;phenol Chemical compound C1C=CC=C1.OC1=CC=CC=C1 XYHUIOCRXXWEAX-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical class CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- AVIYEYCFMVPYST-UHFFFAOYSA-N hexane-1,3-diol Chemical compound CCCC(O)CCO AVIYEYCFMVPYST-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical class C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical class CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical class CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 229910017059 organic montmorillonite Inorganic materials 0.000 description 1
- SOWBFZRMHSNYGE-UHFFFAOYSA-N oxamic acid Chemical class NC(=O)C(O)=O SOWBFZRMHSNYGE-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229940058287 salicylic acid derivative anticestodals Drugs 0.000 description 1
- 150000003872 salicylic acid derivatives Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 235000013618 yogurt Nutrition 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明は、電磁誘導加熱により金属層を加熱することにより熱可塑性ホットメルト接着剤層を、軟化ないし溶融し、厚みが1mm以上の被着体を迅速にかつ強固に接着し得る接着技術及び接着構造物を簡単に解体する方法を提供する。 The present invention provides an adhesion technique and adhesion capable of softening or melting a thermoplastic hot melt adhesive layer by heating a metal layer by electromagnetic induction heating to quickly and firmly bond an adherend having a thickness of 1 mm or more. Provides an easy way to disassemble a structure.
ホットメルト接着構造物とは溶剤不含の粘着剤を用いて、粘着剤が加熱されて溶融した状態で接着すべき基材に塗布され、そして固化後に粘着作用を発揮するものである。乾燥不要等の多彩な利点から、ホットメルト接着構造物における使用される粘着剤は、慣用の溶剤に基づく接着剤に対する経済的でかつ環境に優しい代替品として、特にラベル、包装、家具、繊維材料及び履き物など工業的に益々使用されつつある。
例えば、プリン、ゼリー、みつ豆、ヨーグルト、乳酸飲料、豆腐などの食品の包装分野には、ポリエチレン、ポリプロピレン、ポリスチレン、ポリエステルなどの硬質乃至半硬質樹脂のブロー成形、インジエクシヨン成形、インジエクシヨンブロー成形法などによる容器、更にはこれらの樹脂やポリ塩化ビニル樹脂などの単層シートまたはこれらの樹脂をそれの一層とする共押出法などによる積層シートを、真空成形、圧空成形などの適当な二次成形法によって成形したカツプやトレーなどの容器が使用されており、これらの容器の蓋材のシール層のような接着構造物を得た。(特許文献1)しかし、その接着構造物において、被着体の厚みが1mm未満の樹脂フィルムやシート状の物のみである。
The hot-melt adhesive structure is a structure in which a solvent-free pressure-sensitive adhesive is used, and the pressure-sensitive adhesive is applied to a base material to be bonded in a heated and melted state, and exerts a pressure-sensitive action after solidification. Due to various advantages such as no need for drying, the adhesives used in hot melt adhesive structures are economical and environmentally friendly alternatives to conventional solvent-based adhesives, especially labels, packaging, furniture and textile materials. And footwear are being used more and more industrially.
For example, in the field of packaging foods such as pudding, jelly, honey beans, yogurt, lactic acid drinks, and tofu, blow molding, injection molding, and injection blow molding methods for hard to semi-hard resins such as polyethylene, polypropylene, polystyrene, and polyester. A single-layer sheet such as these resins or polyvinyl chloride resin, or a laminated sheet by a co-extrusion method using these resins as one layer, is appropriately used for secondary molding such as vacuum molding and pressure molding. Containers such as cups and trays molded by the method are used, and adhesive structures such as a sealing layer for the lid material of these containers have been obtained. (Patent Document 1) However, in the adhesive structure, only a resin film or a sheet-like material having an adherend with a thickness of less than 1 mm is available.
その一方、接着構造物の被着体の厚みが1mm以上の場合、例えば、建築やリフォームや木工などの分野にも存在する。
従来、建築物、構造物の外表面、内壁、間仕切壁等の表面に合板、石膏ボード、珪酸カルシュウム板、陶磁器タイル、金属板等の内外装材を接合する方法としては、釘やボルト等の接合部品を用いる方法が古くから用いられている。この接合方法は、作業が比較的簡易ではあるが、点接合であるために応力がその一点に集中してしまい、これを分散させるには広範囲に釘やボルトを打ち込まなければならないし、作業的にも煩雑になる。また、接合部分に突起や肉盛が表れて美観を損ねる。これらの方法に変わって、溶剤系、水系又はエポキシ樹脂等の液状接着剤を使用した接合方法が用いられるようになってきた。この接着剤による接合方法では、面接合になるため接合部分全体に応力が均一になり、耐久性が向上した。しかも接合部分の表面が平滑になり、美観の面からも好ましい。しかし、これらの液状接着剤を使用した接合方法は、接着剤を塗布した後、接着力が発現するまでに一定の時間が必要であり、接着剤塗布後に所定時間の養生が必要である。このために大量作業をする場合には連続的な接合作業が行なえない問題がある。このような問題を改善する接合方法として、両面粘着テープを使用する方法が行なわれるようになってきた。しかし、この接合方法は、両面粘着テープの貼着と同時に接着性が発現するため、所望の位置からずれた際の修正が困難である。さらに被着体の表面が粗面になっている場合に、粘着面との接触面積が充分ではなく、材料の重量による応力や、接着後の温度、湿度等の気候変化による建築材料の伸縮や反りにより発生する応力によって、貼着した粘着テープが経時的に剥がれやすくなる等の問題がある。従って、両面粘着テープを使用した接合方法においても、長時間の接合力には信頼性が得られないといった問題があった。
On the other hand, when the thickness of the adherend of the adhesive structure is 1 mm or more, it also exists in fields such as construction, remodeling, and woodworking.
Conventionally, as a method of joining interior and exterior materials such as plywood, gypsum board, calcium silicate board, ceramic tile, and metal plate to the outer surface, inner wall, partition wall, etc. of buildings and structures, nails, bolts, etc. have been used. The method of using joint parts has been used for a long time. This joining method is relatively easy to work with, but because it is a point joining, stress is concentrated on that one point, and in order to disperse this, it is necessary to drive nails and bolts over a wide area, and it is workable. It also becomes complicated. In addition, protrusions and overlays appear at the joints, spoiling the aesthetic appearance. Instead of these methods, a bonding method using a solvent-based, water-based, or liquid adhesive such as an epoxy resin has come to be used. In this bonding method using an adhesive, since surface bonding is performed, the stress becomes uniform over the entire bonded portion, and the durability is improved. Moreover, the surface of the joint portion becomes smooth, which is preferable from the viewpoint of aesthetics. However, the joining method using these liquid adhesives requires a certain amount of time after the adhesive is applied until the adhesive force is developed, and requires a predetermined time of curing after the adhesive is applied. For this reason, there is a problem that continuous joining work cannot be performed when a large amount of work is performed. As a joining method for improving such a problem, a method using double-sided adhesive tape has come to be used. However, in this joining method, adhesiveness is exhibited at the same time as the double-sided adhesive tape is attached, so that it is difficult to correct when the position deviates from a desired position. Furthermore, when the surface of the adherend is rough, the contact area with the adhesive surface is not sufficient, and the stress due to the weight of the material and the expansion and contraction of the building material due to climate change such as temperature and humidity after adhesion may occur. There is a problem that the adhered adhesive tape is easily peeled off over time due to the stress generated by the warp. Therefore, even in the bonding method using the double-sided adhesive tape, there is a problem that reliability cannot be obtained for a long-time bonding force.
以上のような問題点を改善する方法として、導電性材料と熱可塑性樹脂系接着剤層を予め建築基材に設けておくか、またはテープ或いはフィルム状の接着剤と導電性シートを建築基材と内外装材の間に挟んで、電磁誘導加熱による接合方法が最近行なわれている。この方法は、電磁誘導で生じる渦電流によって導電性材料が発熱し、この発熱によって熱可塑性樹脂系接着剤が溶融して被着体と接着される方法である。この方法によると、建築基材面と内外装材面の中間に熱可塑性樹脂を介在させ、その上部から高周波発信機を接触させるだけで、熱可塑性樹脂が加熱溶融し、発信機を取り去れば直ちに固結して接着されるために、短時間で接合が完了し、作業が簡便であるばかりでなく、解体の場合にも使用済みの材料を再利用できる等のメリットが大きい。 As a method for improving the above problems, a conductive material and a thermoplastic resin adhesive layer are provided on the building base material in advance, or a tape or film-like adhesive and a conductive sheet are used as the building base material. Recently, a joining method by electromagnetic induction heating has been performed by sandwiching it between the inner and outer materials. In this method, the conductive material generates heat due to the eddy current generated by electromagnetic induction, and the heat generated melts the thermoplastic resin adhesive and adheres to the adherend. According to this method, if a thermoplastic resin is interposed between the building substrate surface and the interior / exterior material surface and a high-frequency transmitter is brought into contact with the high-frequency transmitter from above, the thermoplastic resin is heated and melted, and the transmitter is removed. Since it is immediately solidified and bonded, the joining is completed in a short time, and not only the work is simple, but also the used material can be reused even in the case of dismantling.
電磁誘導加熱方式を用いた接着剤の溶融装置(特許文献2)が開発された。しかし、特許文献2で提案されている方法では、部材と部材との接合強度が十分なものではなく、優れた施工性および貼り直し性の点で問題もあった。また、接着構造を解体する時は、再度電磁誘導装置を用いて接着剤層を加熱させて、ホットメルト接着剤層が固化する前に被着体同士を引き剥がすことできたと報告もある(特許文献3)が、水性エマルジョン系接着剤から成ることを特徴とする熱膨張性微粒中空体を含む接着剤が使用されており、接着剤の種類も限定される。 An adhesive melting device (Patent Document 2) using an electromagnetic induction heating method has been developed. However, the method proposed in Patent Document 2 does not have sufficient joint strength between members, and has problems in terms of excellent workability and reattachability. It is also reported that when the adhesive structure was disassembled, the adhesive layer was heated again using an electromagnetic induction device, and the adherends could be peeled off before the hot melt adhesive layer solidified (patented). Document 3) uses an adhesive containing a heat-expandable fine-grained hollow body, which comprises an aqueous emulsion-based adhesive, and the type of the adhesive is also limited.
本発明の目的とは、厚みが1mm以上の被着体、熱可塑性ホットメルト接着剤層、金属層の順で積層させることにより、優れた施工性、貼り直し性を有し、被着体に十分な接着力を付与することができる接着構造物を提供すること。また、接着構造物の解体方法を提供することである。 An object of the present invention is to have excellent workability and reattachability by laminating an adherend having a thickness of 1 mm or more, a thermoplastic hot melt adhesive layer, and a metal layer in this order, and to make the adherend. To provide an adhesive structure capable of imparting sufficient adhesive force. It is also to provide a method of disassembling the adhesive structure.
本発明者らは、鋭意研究を重ねた結果、課題を解決するホットメルト接着シート、それを用いた接着構造物を見出した。 As a result of intensive research, the present inventors have found a hot melt adhesive sheet that solves the problem and an adhesive structure using the hot melt adhesive sheet.
すなわち、本発明は、厚みが1mm以上である被着体、熱可塑性ホットメルト接着剤層、金属層の順で積層されてなる接着構造物に関する。 That is, the present invention relates to an adhesive structure in which an adherend having a thickness of 1 mm or more, a thermoplastic hot melt adhesive layer, and a metal layer are laminated in this order.
また、厚みが1mm以上である被着体、熱可塑性ホットメルト接着剤層、熱硬化した接着剤層、金属層の順で積層されてなる前記の接着構造物に関する。 The present invention also relates to the above-mentioned adhesive structure in which an adherend having a thickness of 1 mm or more, a thermoplastic hot-melt adhesive layer, a thermosetting adhesive layer, and a metal layer are laminated in this order.
また、本発明は、さらに金属層の外側に、金属層側から絶縁層、パターニングされた導電層の順で積層されてなる前記の接着構造物。 Further, the present invention is the above-mentioned adhesive structure in which an insulating layer and a patterned conductive layer are further laminated on the outside of the metal layer in this order from the metal layer side.
また、熱可塑性ホットメルト接着剤層の厚さが、10μm以上500μm以下であることを特徴とする前記の接着構造物に関する。 The present invention also relates to the above-mentioned adhesive structure, wherein the thickness of the thermoplastic hot-melt adhesive layer is 10 μm or more and 500 μm or less.
また、金属層の厚さが、1μm以上1000μm以下であることを特徴とする前記の接着構造物に関する。 The present invention also relates to the above-mentioned adhesive structure, wherein the thickness of the metal layer is 1 μm or more and 1000 μm or less.
また、金属層の外部から、電磁誘導加熱装置により加熱し、熱可塑性ホットメルト接着剤層、金属層の順で積層されてなる積層物と、厚みが1mm以上である被着体とを、接着することを特徴とする接着構造物の製造方法に関する。 Further, from the outside of the metal layer, a laminate formed by heating with an electromagnetic induction heating device and laminating the thermoplastic hot melt adhesive layer and the metal layer in this order and an adherend having a thickness of 1 mm or more are adhered to each other. The present invention relates to a method for producing an adhesive structure.
更に、前記の接着構造物を、電磁誘導加熱装置により加熱し、固体状態にある熱可塑性ホットメルト接着剤層を、軟化ないし溶融させ、被着体と熱可塑性ホットメルト接着剤層とを、剥がす方法に関する。 Further, the adhesive structure is heated by an electromagnetic induction heating device to soften or melt the thermoplastic hot melt adhesive layer in a solid state, and the adherend and the thermoplastic hot melt adhesive layer are peeled off. Regarding the method.
本発明により、優れた施工性、貼り直し性を有し、被着体に十分な接着力を付与することができる接着構造物の提供が可能となる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an adhesive structure having excellent workability and reattachability and capable of imparting sufficient adhesive force to an adherend.
以下、本発明の接着構造物について、更に詳細に説明する。 Hereinafter, the adhesive structure of the present invention will be described in more detail.
<熱可塑性ホットメルト層>
本発明の熱可塑性ホットメルト接着剤層を作製するために、使用できる熱可塑性ホットメルト接着剤は、ABS、ポリアミド、ポリエステル、ポリウレタン、アクリル、ポリカーボネート、ポリスチレン、ポリエチレン、ポリプロピレン、ポリ−1−ブテン、ポリイソブチレン、ポリメチルペンテン、プロピレン−エチレン共重合体、エチレン−プロピレン−ジエン共重合体、エチレン/ブテン−1共重合体、エチレン/オクテン共重合体などのポリオレフィン、シクロペンタジエンとエチレン及び/又はプロピレンとの共重合体などの環状ポリオレフィン、エチレン/酢酸ビニル共重合体(EVA)、エチレン/アクリル酸エチル共重合体(EEA)、イソブチレン/無水マレイン酸共重合体などの極性基が導入されたポリオレフィン、無水マレイン酸変性ポリプロピレン、マレイン酸変性ポリプロピレン、アクリル酸変性ポリプロピレン、スチレン系エラストマー、ゴムなどの酸変性ポリプロピレンなどがあげられる。好ましくは、ポリアミドである。
<Thermoplastic hot melt layer>
The thermoplastic hot melt adhesives that can be used to make the thermoplastic hot melt adhesive layer of the present invention are ABS, polyamide, polyester, polyurethane, acrylic, polycarbonate, polystyrene, polyethylene, polypropylene, poly-1-butene, Polyisobutylene, polymethylpentene, propylene-ethylene copolymer, ethylene-propylene-diene copolymer, ethylene / butene-1 copolymer, polyolefins such as ethylene / octene copolymer, cyclopentadiene and ethylene and / or propylene Cyclic polyolefin such as copolymer with, ethylene / vinyl acetate copolymer (EVA), ethylene / ethyl acrylate copolymer (EEA), polyolefin with polar groups introduced such as isobutylene / maleic anhydride copolymer , Maleic anhydride-modified polypropylene, maleic acid-modified polypropylene, acrylic acid-modified polypropylene, styrene-based elastomer, acid-modified polypropylene such as rubber, and the like. Polyamide is preferred.
本発明の熱可塑性ホットメルト接着剤には、接着性を向上させる為に粘着付与剤などを添加しても良い。主な粘着付与剤は、特に限定されないがフェノール樹脂、変性フェノール樹脂、テルペンフェノール樹脂、キシレンフェノール樹脂、シクロペンタジエン−フェノール樹脂、キシレン樹脂、脂肪族系、脂環族系、芳香族系等の石油樹脂、水素添加された脂肪族系、脂環族系、芳香族系等の石油樹脂、フェノール−変性石油樹脂、ロジンエステル樹脂、水素添加されたロジンエステル樹脂、低分子量ポリスチレン系樹脂、テルペン樹脂、水素添加されたテルペン樹脂などの粘着付与樹脂が含まれていることが好ましい。粘着付与樹脂は、単独で用いても、2種類以上を併用してもよい。 A tackifier or the like may be added to the thermoplastic hot melt adhesive of the present invention in order to improve the adhesiveness. The main tackifier is not particularly limited, but petroleum such as phenol resin, modified phenol resin, terpene phenol resin, xylenephenol resin, cyclopentadiene-phenol resin, xylene resin, aliphatic, alicyclic, aromatic, etc. Resins, hydrogenated aliphatic, alicyclic, aromatic and other petroleum resins, phenol-modified petroleum resins, rosin ester resins, hydrogenated rosin ester resins, low molecular weight polystyrene resins, terpene resins, It is preferable that a tackifier resin such as hydrogenated terpene resin is contained. The tackifier resin may be used alone or in combination of two or more.
本発明の熱可塑性ホットメルト接着剤は、低粘度化するなどの目的でワックスなどを添加しても良い。主なワックスは、特に限定されないが、カルナバワックス、キャンデリアワックス、モンタンワックス、パラフィンワックス、マイクロワックス、フィッシャートロプシュワックス、ポリエチレンワックス、ポリプロピレンワックス、これらのワックスの酸化物、エチレンーアクリル酸共重合体、エチレンーメタクリル酸共重合体等が挙げられる。ワックスは、単独もしくは2種類以上を組み合わせて使用できる。 The thermoplastic hot melt adhesive of the present invention may be added with wax or the like for the purpose of reducing the viscosity. The main wax is not particularly limited, but is carnauba wax, canderia wax, montan wax, paraffin wax, microwax, Fishertropch wax, polyethylene wax, polypropylene wax, oxides of these waxes, ethylene-acrylic acid copolymer. , Polyethylene-methacrylic acid copolymer and the like. The wax can be used alone or in combination of two or more.
本発明の熱可塑性ホットメルト接着剤層は、表面にコロナ処理を行うことが好ましく、特に極性が低いポリエチレン、ポリプロピレン等は、コロナ処理面に熱硬化性接着剤を塗布して熱硬化させることで、より強固に接着する。コロナ処理は、熱硬化性接着剤塗工する直前に行ってもコロナ処理を前もって行っておいても差し支えない。 The surface of the thermoplastic hot-melt adhesive layer of the present invention is preferably corona-treated, and polyethylene, polypropylene, etc., which have low polarity, are heat-cured by applying a thermosetting adhesive to the corona-treated surface. , Adhere more firmly. The corona treatment may be performed immediately before the application of the thermosetting adhesive or the corona treatment may be performed in advance.
本発明の熱可塑性ホットメルト接着剤層は、フィルム状にしたものを好適に用いることができる。本発明の熱可塑性ホットメルト接着剤層の厚さは、10μm以上500μm以下であることが好ましい。さらに好ましくは20μm以上300μm以下である。熱可塑性ホットメルト接着剤層の厚さが10μm未満又は500μmより厚い場合は、接着不良が発生する場合がある。熱可塑性ホットメルト接着剤層の添加剤として、必要により各種のものが使用可能である。例えば、着色剤、ブロッキング防止剤、無機フィラー、酸化防止剤、充填剤、難燃剤、可塑剤、帯電防止剤、光安定剤、紫外線吸収剤や重金属不活性化剤などである。 As the thermoplastic hot melt adhesive layer of the present invention, a film-like one can be preferably used. The thickness of the thermoplastic hot-melt adhesive layer of the present invention is preferably 10 μm or more and 500 μm or less. More preferably, it is 20 μm or more and 300 μm or less. If the thickness of the thermoplastic hot melt adhesive layer is less than 10 μm or thicker than 500 μm, poor adhesion may occur. Various types of additives can be used as an additive for the thermoplastic hot melt adhesive layer, if necessary. For example, colorants, antiblocking agents, inorganic fillers, antioxidants, fillers, flame retardants, plasticizers, antistatic agents, light stabilizers, UV absorbers and heavy metal inactivating agents.
着色剤としては、赤、青、緑、黄などの慣用公知の着色剤を使用することができ、顔料、染料、色素のいずれでもよく、例えば、モノアゾ系、ジズアゾ系、アゾレーキ系、ベンズイミダゾロン系、ペリレン系、ジケトピロロピロール系、縮合アゾ系、アントラキノン系、キナクリドン系、フタロシアニン系、アントラキノン系があり、顔料系はピグメント、ペリレン系、モノアゾ系、縮合アゾ系、イソインドリノン系、酸化チタン、カーボンなどが挙げられる。
ブロッキング防止剤としてはシリコーン、エルカ酸アミドやオレイン酸アミドなどの不飽和脂肪酸アミド、ステアリン酸アミドやベヘニン酸アミドなどの飽和脂肪酸アミドなどが挙げられる。
As the colorant, commonly known colorants such as red, blue, green, and yellow can be used, and any of pigments, dyes, and pigments may be used. For example, monoazo, dizuazo, azolake, and benzimidazolone. There are pigments, perylenes, diketopyrrolopyrroles, condensed azos, anthraquinones, quinacridones, phthalocyanines, and anthraquinones, and pigments are pigments, perylenes, monoazos, condensed azos, isoindolinones, and oxidations. Examples include titanium and carbon.
Examples of the blocking inhibitor include silicones, unsaturated fatty acid amides such as erucic acid amides and oleic acid amides, and saturated fatty acid amides such as stearic acid amides and behenic acid amides.
無機フィラーとしては、金属、金属酸化物及び金属水酸化物など粒子、繊維状などが挙げられる。具体的には、ガラス繊維、炭素繊維、珪酸カルシウム、チタン酸カルシウム、ホウ酸アルミニウム繊維、フレーク状ガラス、タルク、カオリン、マイカ、ハイドロタルサイト、炭酸カルシウム、炭酸亜鉛、酸化亜鉛、リン酸一水素カルシウム、ワラストナイト、シリカ、ゼオライト、アルミナ、ベーマイト、水酸化アルミニウム、酸化チタン、酸化ケイ素、酸化マグネシウム、珪酸カルシウム、アルミナ珪酸ナトリウム、珪酸マグネシウム、カーボンナノチーブ、グラファイト、銅、銀、アルミニウム、ニッケル、鉄、フッ化カルシウム、雲母、モンモリナイト、アパタイトなどが挙げられる。 Examples of the inorganic filler include particles such as metals, metal oxides and metal hydroxides, and fibrous materials. Specifically, glass fiber, carbon fiber, calcium silicate, calcium titanate, aluminum borate fiber, flaky glass, talc, kaolin, mica, hydrotalcite, calcium carbonate, zinc carbonate, zinc oxide, monohydrogen phosphate. Calcium, Wallastonite, Silica, Zeolite, Alumina, Boehmite, Aluminum Hydroxide, Titanium Oxide, Silicon Oxide, Magnesium Oxide, Calcium Silica, Sodium Alumina Silica, Magnesium Silica, Carbon Nanochieve, Graphite, Copper, Silver, Aluminum, Nickel , Iron, calcium fluoride, mica, montmorillonite, apatite and the like.
酸化防止剤としては、高分子量ヒンダード多価フェノール、トリアジン誘導体、高分子量ヒンダード・フェノール、ジアルキル・フェノール・スルフィド、2,2−メチレン−ビス−(4−メチル−6−第三−ブチルフェノール)、4,4−メチレン−ビス−(2,6−ジ−第三−ブチルフェノール)、2,6−ジ−第三−ブチルフェノール−p−クレゾール、2,5−ジ−第三−ブチルヒドロキノン、2,2,4−トリメチル−1,2−ジヒドロキノン、2,2,4−トリメチル−1,2−ジヒドロキノン、ジブチル・ジチオカルバミン酸ニッケル、1−オキシ−3−メチル−4−イソプロピルベンゼン、4,4−ブチリデンビス−(3−メチル−6−第三−ブチルフェノール)、2−メルカプトベンゾイミダゾールなどが挙げられる。 Antioxidants include high molecular weight hindered polyhydric phenol, triazine derivative, high molecular weight hindered phenol, dialkyl phenol sulfide, 2,2-methylene-bis- (4-methyl-6-tri-butylphenol), 4 , 4-Methyl-bis- (2,6-di-3-butylphenol), 2,6-di-3-butylphenol-p-cresol, 2,5-di-3-butylhydroquinone, 2,2 , 4-trimethyl-1,2-dihydroquinone, 2,2,4-trimethyl-1,2-dihydroquinone, nickel dibutyl dithiocarbamate, 1-oxy-3-methyl-4-isopropylbenzene, 4,4- Butylidenebis- (3-methyl-6-3-butylphenol), 2-mercaptobenzoimidazole and the like can be mentioned.
充填剤としては、湿式シリカ、水酸化アルミニウム、酸化アルミニウム、酸化マグネシウム、モンモリロナイト、マイカ、スメクタイト、有機化モンモリロナイト、有機化マイカ、有機化スメクタイト等が挙げられる。
難燃剤としては、燐含有化合物系難燃剤、ハロゲン含有化合物系難燃剤、スルホン酸金属塩系難燃剤、珪素含有化合物系難燃剤等が挙げられる。
可塑剤としては、フタル酸エステル系可塑剤、ポリエステル系可塑剤、脂肪族二塩基酸エステル系可塑剤、脂肪族一塩基酸エステル系可塑剤、リン酸エステル系可塑剤、クエン酸エステル系可塑剤、エポキシ系可塑剤、トリメリット酸エステル系可塑剤、テトラヒドロフタル酸エステル系可塑剤、グリコール系可塑剤、及びビスフェノールAアルキレンオキサイド誘導体などが挙げられる。
帯電防止剤としては、プラスチックの帯電防止剤として汎用されているものでよく、具体的には、非イオン界面活性剤(例えば、多価アルコールの脂肪酸エステル、アルキルアミンのエチレンオキサイド付加物、及びアルキルアミンのエチレンオキサイド付加物の脂肪酸エステルなど)、陰イオン界面活性剤(例えば、アルキルベンゼンスルホン酸塩、高級アルコール硫酸エステル塩など)、陽イオン界面活性剤(例えば、脂肪族アミン塩、4級アンモニウム塩など)、両性界面活性剤(例えばイミダゾリン型、ベタイン型など)が挙げられる。
光安定剤としては、ヒンダードアミン系化合物及びベンゾエイト系化合物などが挙げられる。
Examples of the filler include wet silica, aluminum hydroxide, aluminum oxide, magnesium oxide, montmorillonite, mica, smectite, organic montmorillonite, organic mica, and organic smectite.
Examples of the flame retardant include a phosphorus-containing compound-based flame retardant, a halogen-containing compound-based flame retardant, a sulfonic acid metal salt-based flame retardant, and a silicon-containing compound-based flame retardant.
Examples of plasticizers include phthalate ester plasticizers, polyester plasticizers, aliphatic dibasic acid ester plasticizers, aliphatic monobasic acid ester plasticizers, phosphoric acid ester plasticizers, and citric acid ester plasticizers. , Epoxy plasticizers, trimellitic acid ester plasticizers, tetrahydrophthalate ester plasticizers, glycol plasticizers, bisphenol A alkylene oxide derivatives and the like.
The antistatic agent may be a general-purpose antistatic agent for plastics, and specifically, a nonionic surfactant (for example, a fatty acid ester of a polyhydric alcohol, an ethylene oxide adduct of an alkylamine, and an alkyl). Amine ethylene oxide adduct fatty acid esters, etc.), anionic surfactants (eg, alkylbenzene sulfonates, higher alcohol sulfates, etc.), cationic surfactants (eg, aliphatic amine salts, quaternary ammonium salts) Etc.), amphoteric surfactants (eg, imidazoline type, betaine type, etc.).
Examples of the light stabilizer include hindered amine compounds and benzoate compounds.
紫外線吸収剤としては、ベンゾフェノン系紫外線吸収剤、トリアジン系紫外線吸収剤、ベンゾトリアゾール系紫外線吸収剤などが挙げられる。
重金属不活性化剤としては、サリチル酸誘導体、ヒドラジド誘導体又はシュウ酸アミド誘導体などが挙げられる。
Examples of the ultraviolet absorber include a benzophenone-based ultraviolet absorber, a triazine-based ultraviolet absorber, and a benzotriazole-based ultraviolet absorber.
Examples of the heavy metal inactivating agent include salicylic acid derivatives, hydrazide derivatives, oxalic acid amide derivatives and the like.
上記添加剤は、1種を単独で、又は必要に応じて任意の比率で2種以上混合して用いることができる。 The above additives may be used alone or in admixture of two or more at any ratio as required.
上記の熱可塑性ホットメルト接着剤をインフレーション法、Tダイ法、溶液流延法、カレンダー法などの他、離型紙又はフィルムなどの上にスリットコーティングして得られた熱可塑性ホットメルト層を、金属層で積層して得られる。 In addition to the inflation method, T-die method, solution casting method, calendar method, etc., the above-mentioned thermoplastic hot-melt adhesive is slit-coated on a release paper or film, and the thermoplastic hot-melt layer obtained is made of metal. Obtained by laminating in layers.
<金属層>
本発明の金属層は、電磁誘導加熱装置による高周波磁束によって渦電流が誘導され、金属層のジュール加熱により、熱可塑性ホットメルト接着層を溶融させ、コンクリートと接着させるためのものである。この金属層磁性体、非磁性体のいずれの金属材料も使用ことができ、例えば、鉄、銅、銀、金、アルミニウム、ニッケル、ステンレス、亜鉛、鉛、マグネシウム及びそれら合金などから選ばれる導電性金属であることが好ましく、アルミニウム、銅、鉄、ステンレスがより好ましく、アルミニウム、銅、が特に好ましい。
これら金属は、フィルム状にしたものを好適に用いることができる。金属層の厚みは、1
μm以上1000μm以下が好ましく、より好ましくは10μm以上500μm以下であり、さらに好ましくは20μm以上100μm以下である。上記の範囲だと特に、素早い発熱と最適な発熱温度が達成される。
<Metal layer>
The metal layer of the present invention is for inducing an eddy current by a high-frequency magnetic flux generated by an electromagnetic induction heating device and heating the metal layer with Joule to melt the thermoplastic hot-melt adhesive layer and bond it to concrete. Any metal material of this metal layer magnetic material or non-magnetic material can be used, and for example, conductivity selected from iron, copper, silver, gold, aluminum, nickel, stainless steel, zinc, lead, magnesium and their alloys. It is preferably a metal, more preferably aluminum, copper, iron and stainless steel, and particularly preferably aluminum and copper.
As these metals, those in the form of a film can be preferably used. The thickness of the metal layer is 1
It is preferably μm or more and 1000 μm or less, more preferably 10 μm or more and 500 μm or less, and further preferably 20 μm or more and 100 μm or less. Especially in the above range, quick heat generation and optimum heat generation temperature are achieved.
<熱硬化接着層>
本発明の接着構造物において、必要に応じて、熱硬化接着層を設けることができる。
本発明の熱硬化接着層の構成に用いることが可能な接着剤の一例について説明する。熱硬化接着剤としては、例えば、ポリエステル樹脂、ポリウレタン樹脂、アクリル系樹脂、エポキシ樹脂等の官能基を有する主剤と硬化剤とをベース樹脂とした熱硬化性接着剤が挙げられる。
ポリエステル樹脂として、モノマー組成の酸成分としては、例えばジメチルテレフタル酸、テレフタル酸、イソフタル酸、フタル酸などの芳香族二塩基性酸や、コハク酸、グルタル酸、アジピン酸、β−メチルアジピン酸、ピメリン酸、1,6−ヘキサンジカルボン酸、
アゼライン酸、セバチン酸、ノナンジカルボン酸、デカンジカルボン酸、ヘキサデカンジカルボン酸などの脂肪族二塩基性酸と、グルコール成分としては、エチレングリール、1,2−プロパンジオール、1,3−プロパンジオール、1,3ブタンジオール、1,4−ブタンジオール、1,2−ペンタジオール、1,5−ペンタジオール、3−メチルペンタジオール、1,3−ヘキサンジオール、1,6−ヘキサンジオール、1,4−シクロヘキサンジオール、水添ビスフェノールA、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール、ジプロピレングリコール、ポリプロピレングリコール、ポリテトラメチレングリコールなどのグリコールもしくはその残基形成誘導体もしくはカプロラクトンなどのα,ω−オキシ酸もしくはその残基形成誘導体よりなる飽和二官能性モノマーとを適宜選択して常法により共重合して得ることが可能である。
<Thermosetting adhesive layer>
In the adhesive structure of the present invention, a thermosetting adhesive layer can be provided, if necessary.
An example of an adhesive that can be used in the construction of the thermosetting adhesive layer of the present invention will be described. Examples of the thermosetting adhesive include a thermosetting adhesive using a main agent having a functional group such as a polyester resin, a polyurethane resin, an acrylic resin, and an epoxy resin and a curing agent as a base resin.
As the polyester resin, as the acid component of the monomer composition, for example, aromatic dibasic acids such as dimethyl terephthalic acid, terephthalic acid, isophthalic acid, and phthalic acid, succinic acid, glutaric acid, adipic acid, β-methyladipic acid, Pimelic acid, 1,6-hexanedicarboxylic acid,
Aliper dibasic acids such as azelaic acid, sebatic acid, nonandicarboxylic acid, decandicarboxylic acid, and hexadecanedicarboxylic acid, and glycol components such as ethylene glycol, 1,2-propanediol, and 1,3-propanediol. 1,3 butanediol, 1,4-butanediol, 1,2-pentadiol, 1,5-pentadiol, 3-methylpentadiol, 1,3-hexanediol, 1,6-hexanediol, 1,4 -Glycol such as cyclohexanediol, hydrogenated bisphenol A, diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, polytetramethylene glycol or its residue-forming derivative or α, ω-oxyic acid such as caprolactone or its It can be obtained by appropriately selecting a saturated difunctional monomer composed of a residue-forming derivative and copolymerizing it by a conventional method.
ポリウレタン樹脂としては、ポリエーテル系ポリオール、ポリエステル系ポリオール、ポリマーポリオール等のポリオールとポリイソシアネートからなるイソシアネート化合物を上記ポリオール過剰で反応させて得られるが、上記エーテル系ポリオールとしては、例えば、ビスフェノールA、エチレングリコール、プロピレングリコール、ブチレングリコール、1,6−ヘキサンジオール等のジオール類、グリセリン、トリメチロールプロパン等のトリオール類、エチレンジアミン、ブチレンジアミン等のアミン類等からなる活性水素2個以上を有する低分子量活性水素化合物の1種又は2種以上の存在下に、プロピレンオキサイド、エチレンオキサイド、テトラヒドロフラン等のアルキレンオキサイドの1種又は2種以上を開環重合させて得られる重合体が挙げられる。
上記ポリエステル系ポリオールとしては、例えばアジピン酸、アゼライン酸、セバシン酸、テレフタル酸、イソフタル酸、コハク酸等の多塩基性酸と、例えばビスフェノールA、エチレングリコール、1,2−プロピレングリコール、1,4−ブタンジオール、ジエチレングリコール、1,6−ヘキサンジオール、ネオペンチルグリコール等の多価アルコールとを脱水縮合して得られる重合体、又、例えばε−カプロラクトン、α−メチル−ε−カプロラクトン等のラクトンの重合体、又、例えばひまし油、ひまし油とエチレングリコールの反応生成物等のヒドロキシカルボン酸と上記多価アルコールなどの縮合物が挙げられる。
上記ポリマーポリオールとしては、例えば前記ポリエーテル系ポリオールないしはポリエステル系ポリオールにアクリロニトリル、スチレン、メチル(メタ)アクリレートなどのエチレン性不飽和化合物をグラフト重合させたものや、1,2−もしくは1,4−ポリブタジエンポリオール、又はこれらの水素添加物が挙げられる。
上記ポリイソシアネートとしては、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、ヘキサメチレンジイソシアネート、キシリレンジイソシアネート、ジシクロヘキシルメタンジイソシアネート等のジイソシアネート類、又、上記ジイソシアネート類の3量体、トリフェニルメタントリイソシアネート等のトリイソシアネート類、又、ジフェニルメタンジイソシアネート、トリフェニルメタントリイソシアネート等の混合物であるクルードMDIなどが挙げられる。これらのポリイソシアネートは1種類で使用されてもよいが、2種類以上を併用してもよい。上記水酸基末端ポリウレタンポリマーの水酸基1に対し、イソシアネート化合物のイソシアネート基2〜8となるように配合されて上記接着剤として使用される。
The polyurethane resin is obtained by reacting a polyol such as a polyether polyol, a polyester-based polyol, or a polymer polyol with an isocyanate compound composed of a polyisocyanate in excess of the above-mentioned polyol. Low molecular weight having 2 or more active hydrogens consisting of diols such as ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, triols such as glycerin and trimethylolpropane, and amines such as ethylenediamine and butylene diamine. Examples thereof include polymers obtained by ring-opening polymerization of one or more alkylene oxides such as propylene oxide, ethylene oxide, and tetrahydrofuran in the presence of one or more active hydrogen compounds.
Examples of the polyester-based polyol include polybasic acids such as adipic acid, azelaic acid, sebacic acid, terephthalic acid, isophthalic acid and succinic acid, and bisphenol A, ethylene glycol, 1,2-propylene glycol and 1,4. Polymers obtained by dehydration condensation with polyhydric alcohols such as -butanediol, diethylene glycol, 1,6-hexanediol and neopentyl glycol, and lactones such as ε-caprolactone and α-methyl-ε-caprolactone. Examples thereof include polymers and condensates of hydroxycarboxylic acids such as castor oil and reaction products of castor oil and ethylene glycol and the above-mentioned polyhydric alcohols.
Examples of the polymer polyol include those obtained by graft-polymerizing the above-mentioned polyether-based polyol or polyester-based polyol with an ethylenically unsaturated compound such as acrylonitrile, styrene, or methyl (meth) acrylate, or 1,2- or 1,4-. Examples thereof include polybutadiene polyols or hydrogenated products thereof.
Examples of the polyisocyanate include diisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and dicyclohexylmethane diisocyanate, trimerics of the diisocyanates, and triisocyanates such as triphenylmethane triisocyanate. Further, crude MDI which is a mixture of diphenylmethane diisocyanate, triphenylmethane triisocyanate and the like can be mentioned. These polyisocyanates may be used alone or in combination of two or more. It is blended with hydroxyl groups 1 of the hydroxyl-terminated polyurethane polymer so as to form isocyanate groups 2 to 8 of the isocyanate compound, and is used as the adhesive.
エポキシ樹脂としては、1分子中にエポキシ基を2個以上有するものであればよく、具体的には、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、脂環式エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレートエポキシ樹脂、アクリル酸変性エポキシ樹脂(エポキシアクリレート)、リン含有エポキシ樹脂及びこれらハロゲン樹脂(臭素化エポキシ樹脂など)や水素添加物などが挙げられる。これらのエポキシ樹脂は、単独で用いてもよ
く、2種以上を併用してもよい。臭素化エポキシ樹脂などは、接着剤に難燃性が要求される場合に、特に有効である。アクリル酸変性エポキシ(エポキシアクリレート)は、感光性を有する為エポキシ系樹脂組成物に光硬化性を付与する為に有効である。
硬化剤としては、エポキシ樹脂の硬化に用い得るものであれば、特に制限なく使用することが可能であるが、例えば、脂肪族アミン系硬化剤、脂環式アミン系硬化剤、芳香族アミン系硬化剤、酸無水物硬化剤、ジシアンジアミド、三フッ化ホウ素アミン錯塩、イミダゾール化合物などが挙げられる。これらは単独で用いてもよく、2種以上を併用してもよい。硬化剤の配合量はエポキシ樹脂に応じて定めることができる。
The epoxy resin may have two or more epoxy groups in one molecule, and specifically, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, and a cresol novolac type epoxy resin. , Alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hidden in type epoxy resin, isocyanurate epoxy resin, acrylic acid modified epoxy resin (epoxy acrylate), phosphorus-containing epoxy resin and these halogen resins (bromination) (Epoxy resin, etc.) and hydrogen additives. These epoxy resins may be used alone or in combination of two or more. Brominated epoxy resin and the like are particularly effective when flame retardancy is required for the adhesive. Since acrylic acid-modified epoxy (epoxy acrylate) has photosensitivity, it is effective for imparting photocurability to an epoxy resin composition.
The curing agent can be used without particular limitation as long as it can be used for curing an epoxy resin. For example, an aliphatic amine-based curing agent, an alicyclic amine-based curing agent, and an aromatic amine-based curing agent can be used. Examples thereof include a curing agent, an acid anhydride curing agent, dicyandiamide, a boron trifluoride amine complex salt, and an imidazole compound. These may be used alone or in combination of two or more. The blending amount of the curing agent can be determined according to the epoxy resin.
熱硬化接着層の添加剤としてシランカップリング剤、酸化防止剤等などが挙げられる。シランカップリング剤としては、3−アミノプロピルトリエトキシシラン、3−グリシドキシプロピルトリメトキシシラン、3−メタクリロキシプロピルトリメトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリス(β−メトキシエトキシ)シラン、ビニルトリアセチルシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトエチルトリエトキシシラン、γ−クロロプロピルトリメトキシシラン、γ−クロロプロピルトリエトキシシラン、ビニルトリクロロシランなどが挙げられる。
酸化防止剤としては、上記記載の熱可塑性ホットメルト接着層に用いられる酸化防止剤が用いられる。
本発明の熱硬化性接着剤は、各種の溶剤を含有しても良い。例えば、アセトン、メチルエチルケトン(MEK)、メチルイソブチルケトンなどのケトン系化合物、テトラヒドロフラン(THF)、ジオキソランなどの環状エーテル系化合物、酢酸エチル、酢酸エチル、酢酸ブチルなどのエステル系化合物、トルエン、キシレンなどの芳香族系化合物、カルビトール、セロソルブ、メタノール、イソプロパノール、ブタノール、プロピレンコールモノメチルエーテルなどのアルコール系化合物などが挙げられる。これらは、単独でも使用しても二種類以上を併用しても良い。
エポキシ接着剤を金属層または、熱可塑性ホットメルト層に塗工する装置としては、コンマコーター、ロールナイフコーター、ダイコーター、ロールコーター、バーコーター、グラビアロールコーター、リバースロールコーター、ブレードコーター、グラビアコーター、マイクログラビアコーターなどが挙げられる。熱硬化性接着剤の塗布量は、乾燥膜厚で1〜50μm程度であることが好ましい。さらに好ましくは2〜25μmである。さらに好ましくは2〜10μmである。
Examples of the additive for the thermosetting adhesive layer include a silane coupling agent and an antioxidant. Examples of the silane coupling agent include 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltris (β-methoxyethoxy). ) Silane, vinyl triacetylsilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptoethyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ-chloro Examples thereof include propyltriethoxysilane and vinyltrichlorosilane.
As the antioxidant, the antioxidant used for the thermoplastic hot melt adhesive layer described above is used.
The thermosetting adhesive of the present invention may contain various solvents. For example, ketone compounds such as acetone, methyl ethyl ketone (MEK) and methyl isobutyl ketone, cyclic ether compounds such as tetrahydrofuran (THF) and dioxolane, ester compounds such as ethyl acetate, ethyl acetate and butyl acetate, toluene, xylene and the like. Examples include aromatic compounds, alcohol compounds such as carbitol, cellosolve, methanol, isopropanol, butanol, and propylene coal monomethyl ether. These may be used alone or in combination of two or more.
As a device for applying the epoxy adhesive to the metal layer or the thermoplastic hot melt layer, a comma coater, a roll knife coater, a die coater, a roll coater, a bar coater, a gravure roll coater, a reverse roll coater, a blade coater, and a gravure coater. , Micro gravure coater and the like. The amount of the thermosetting adhesive applied is preferably about 1 to 50 μm in terms of dry film thickness. More preferably, it is 2 to 25 μm. More preferably, it is 2 to 10 μm.
熱可塑性ホットメルト接着層または金属層どちらかに熱硬化性接着剤を塗工して、乾燥させた後に最表面が熱可塑性ホットメルト接着剤層になるように金属フィルムを貼り合せた後に熱硬化性接着剤を硬化させる為にエージングを行う必要がある。熱硬化性接着剤は硬化速度が遅い為エージングを行う。
具体的にいえば、熱硬化性接着剤を介して熱可塑性ホットメルトと接着剤フィルムを貼り合わせた後35〜80℃の保温室にて3〜5日間程度保存してエージングすることにより接着剤を硬化させる。この際、保存温度が高すぎると例えばロール状にした時に接している熱可塑性ホットメルト接着剤層同士がブロッキングを起こすことがあるので巻圧と保存温度は注意する必要がある。また、エージング条件によって熱硬化性接着剤の硬化の度合いが変わってくる為、ホットメルト接着シートの熱可塑性ホットメルト接着剤層と金属層の接着強度に影響を及ぼすことがあり、エージングが不十分な場合には、接着剤の硬化不良によるデラミネーション(層剥離)を引き起こすことがある。
ブロッキングを防止する為に熱可塑性ホットメルト接着シート表面にエンボス処理,剥離紙又は剥離フィルムを入れるなどすると効果的である。熱可塑性ホットメルト接着シートの表面粗さが0.01μ以上100μm以下であることが好ましい。熱可塑性ホットメルト接着シートの表面粗さRaが0.01μm未満の場合熱可塑性ホットメルト接着シートがブロッキングして、使用できなくなることがあり、熱可塑性ホットメルト接着シートの表面粗さ100μmより大きい場合熱可塑性ホットメルト接着シートの強度が低くなり、塗工する時熱可塑性ホットメルト接着シートが切れてしまうなど問題が生じることがある。
熱可塑性ホットメルト接着層と熱硬化接着層の接着強度を強くする為に熱可塑性ホットメルト接着剤層面にコロナ処理を行うことは、有効である。特に、ポリエチレンフィルム、ポリプロピレンフィルムなど極性が低いフィルムを金属単層フィルムと接着させるには、効果がある。しかしながら、熱硬化しうる接着剤層を硬化させることも可能である為必ずしも電磁誘導加熱する前に熱硬化しうる接着剤層にエージングする必要はない。
A thermosetting adhesive is applied to either the thermoplastic hot-melt adhesive layer or the metal layer, dried, and then the metal film is bonded so that the outermost surface becomes the thermoplastic hot-melt adhesive layer, and then the thermosetting is performed. It is necessary to perform aging to cure the sex adhesive. Thermosetting adhesives have a slow curing rate and are therefore aged.
Specifically, the thermoplastic hot melt and the adhesive film are bonded to each other via a thermosetting adhesive, and then stored in a greenhouse at 35 to 80 ° C. for about 3 to 5 days for aging. To cure. At this time, if the storage temperature is too high, for example, the thermoplastic hot-melt adhesive layers in contact with each other when rolled may cause blocking, so care must be taken in the winding pressure and the storage temperature. In addition, since the degree of curing of the thermosetting adhesive changes depending on the aging conditions, it may affect the adhesive strength between the thermoplastic hot-melt adhesive layer and the metal layer of the hot-melt adhesive sheet, resulting in insufficient aging. In this case, delamination (layer peeling) may occur due to poor curing of the adhesive.
In order to prevent blocking, it is effective to emboss the surface of the thermoplastic hot-melt adhesive sheet or put a release paper or release film on it. The surface roughness of the thermoplastic hot melt adhesive sheet is preferably 0.01 μm or more and 100 μm or less. When the surface roughness Ra of the thermoplastic hot melt adhesive sheet is less than 0.01 μm The thermoplastic hot melt adhesive sheet may block and become unusable, and when the surface roughness of the thermoplastic hot melt adhesive sheet is larger than 100 μm The strength of the thermoplastic hot melt adhesive sheet becomes low, which may cause problems such as the thermoplastic hot melt adhesive sheet being cut off during coating.
It is effective to perform corona treatment on the surface of the thermoplastic hot melt adhesive layer in order to increase the adhesive strength between the thermoplastic hot melt adhesive layer and the thermosetting adhesive layer. In particular, it is effective for adhering a film having low polarity such as a polyethylene film or a polypropylene film to a metal single layer film. However, since it is also possible to cure the thermosetting adhesive layer, it is not always necessary to age the thermosetting adhesive layer before electromagnetic induction heating.
被着体とは、プラスチック、紙、紙とプラスチックの複合体、コンクリート、タイル、舗装材、木材、布、皮革、ゴム、ガラスなどが挙げられる。
本発明の被着体の厚みは、1mm以上であることが好ましい。
Examples of the adherend include plastic, paper, a composite of paper and plastic, concrete, tile, paving material, wood, cloth, leather, rubber, glass and the like.
The thickness of the adherend of the present invention is preferably 1 mm or more.
<絶縁層>
絶縁層は、PETフィルム,塩化ビニルフィルム,PENフィルムなどを接着剤などで金属層と接着する方法によって、金属層と導電層との間に形成できる。また、絶縁塗料を塗布することによっても、形成することができ、絶縁塗料としては、樹脂を溶剤に溶かしたものが一般的である。
また、絶縁層としてPETフィルムなどを、熱可塑性ホットメルト接着剤層(C2)上に形成する場合には、熱ラミによって形成する事も出来る。
絶縁層の乾燥膜厚は、1〜1,000μm程度であることが好ましく、10〜500μmがより好ましく、さらに好ましくは10〜200μmである。
<Insulation layer>
The insulating layer can be formed between the metal layer and the conductive layer by a method of adhering a PET film, a vinyl chloride film, a PEN film or the like to the metal layer with an adhesive or the like. It can also be formed by applying an insulating paint, and the insulating paint is generally a resin dissolved in a solvent.
Further, when a PET film or the like is formed as an insulating layer on the thermoplastic hot melt adhesive layer (C2), it can also be formed by thermal laminating.
The dry film thickness of the insulating layer is preferably about 1 to 1,000 μm, more preferably 10 to 500 μm, and even more preferably 10 to 200 μm.
<パターニングされた導電層>
パターニングされた導電層の形成方法としては、導電性塗料をフォトリソグラフィーする方法、各種印刷によるパターニング方法、導電材料を貼り付ける方法などが挙げられる。
導電性塗料としては、導電性フィラーを樹脂などに分散させた組成物が用いられ、導電性フィラーとしては、銀系,銀・銅複合系,ニッケル系,カーボン系,銅系などが挙げられる。
印刷によるパターニング方法としては、スクリーン印刷、スロットコート、インクジェットなどの方法が採用可能である。
導電層の乾燥膜厚は、1〜1,000μm程度であることが好ましく、5〜500μmがより好ましく、さらに好ましくは50〜200μmである。
また、導電層の外側には、保護層を有することが好ましい。
<Patterned conductive layer>
Examples of the method for forming the patterned conductive layer include a method of photolithography of a conductive paint, a patterning method by various printing, and a method of pasting a conductive material.
As the conductive coating material, a composition in which a conductive filler is dispersed in a resin or the like is used, and examples of the conductive filler include silver-based, silver-copper composite-based, nickel-based, carbon-based, and copper-based.
As a patterning method by printing, a method such as screen printing, slot coating, or inkjet can be adopted.
The dry film thickness of the conductive layer is preferably about 1 to 1,000 μm, more preferably 5 to 500 μm, and even more preferably 50 to 200 μm.
Further, it is preferable to have a protective layer on the outside of the conductive layer.
積層物とは、可塑性ホットメルト接着剤を離型紙又はフィルムなどの上にスリットコーティングして得られた熱可塑性ホットメルト接着剤を、金属層に接着させて得るものであり、形状としてはシート状やテープ状などが挙げられる。 The laminate is obtained by adhering a thermoplastic hot-melt adhesive obtained by slit-coating a plastic hot-melt adhesive on a release paper or a film to a metal layer, and has a sheet shape. And tape-like.
接着構造物の製造方法:
(1)上記の熱可塑性ホットメルト接着剤をインフレーション法、Tダイ法、溶液流延法、カレンダー法などの他、離型紙又はフィルムなどの上にスリットコーティングして得られた熱可塑性ホットメルト接着剤を、金属層に接着させ、積層物を得る。
(2)金属層の外側に支持体をおいて、支持体の外側から、上記の積層物、被着体の順で入力電圧: 100V、消費電力: 550Wの電磁誘導加熱装置により加熱し、熱可塑性ホットメルト接着剤を軟化させ、加熱を終了することにより、熱可塑性ホットメルト接着剤を固化させ、被着体と上記の積層物とを密着させ、接着構造物が得られる。(接着構造物の構造: 被着体/熱可塑性ホットメルト接着剤/金属層)
支持体としては、プラスチック、紙、紙とプラスチックの複合体、コンクリート、タイル、舗装材、木材、布、皮革、ゴム、ガラスなどが挙げられる。
必要に応じて、熱硬化しうる接着剤を用いることが好ましい。この場合の接着構造物の製造は、熱可塑性ホットメルト接着剤層または金属層どちらかに熱硬化しうる接着剤を塗工して、乾燥させた後に最表面が熱可塑性ホットメルト接着剤層になるように金属層を貼り合せた後に、熱硬化しうる接着剤は硬化速度が遅い為、熱硬化しうる接着剤を硬化させる目的でエージングを行う必要がある。
具体的にいえば、熱硬化しうる接着剤を介して熱可塑性ホットメルト層と熱硬化した接着剤層を貼り合わせた後35〜80℃の保温室にて3〜5日間程度保存してエージングすることにより熱硬化した接着剤層の接着剤を硬化させる。この際、保存温度が高すぎると例えばロール状にした時に接している熱可塑性ホットメルト接着剤層同士がブロッキングを起こすことがあるので巻圧と保存温度は注意する必要がある。また、エージング条件によって熱硬化性接着剤の硬化の度合いが変わってくる為、ホ熱可塑性ホットメルト接着剤層と金属層の接着強度に影響を及ぼすことがあり、エージングが不十分な場合には、接着剤の硬化不良によるデラミネーション(層剥離)を引き起こすことがある。
熱可塑性ホットメルト接着層と熱硬化接着層の接着強度を強くする為に熱可塑性ホットメルト接着剤層面にコロナ処理を行うことは、有効である。特に、ポリエチレンフィルム、ポリプロピレンフィルムなど極性が低いフィルムを金属層と接着させるには、効果がある。
Manufacturing method of adhesive structure:
(1) Thermoplastic hot melt adhesive obtained by slit-coating the above thermoplastic hot melt adhesive on a release paper or film in addition to the inflation method, T-die method, solution casting method, calendar method, etc. The agent is adhered to the metal layer to obtain a laminate.
(2) A support is placed on the outside of the metal layer, and the above laminate and the adherend are heated in this order from the outside of the support by an electromagnetic induction heating device having an input voltage of 100 V and a power consumption of 550 W. By softening the plastic hot-melt adhesive and terminating the heating, the thermoplastic hot-melt adhesive is solidified and the adherend and the above-mentioned laminate are brought into close contact with each other to obtain an adhesive structure. (Structure of adhesive structure: adherend / thermoplastic hot melt adhesive / metal layer)
Examples of the support include plastic, paper, a composite of paper and plastic, concrete, tile, paving material, wood, cloth, leather, rubber, glass and the like.
If necessary, it is preferable to use an adhesive that can be thermoset. In the production of the adhesive structure in this case, either the thermoplastic hot melt adhesive layer or the metal layer is coated with a thermosetting adhesive, and after drying, the outermost surface becomes the thermoplastic hot melt adhesive layer. Since the heat-curable adhesive has a slow curing rate after the metal layers are bonded together, it is necessary to perform aging for the purpose of curing the thermosetting adhesive.
Specifically, after the thermoplastic hot melt layer and the thermosetting adhesive layer are bonded to each other via a thermosetting adhesive, they are stored in a greenhouse at 35 to 80 ° C. for about 3 to 5 days for aging. This cures the adhesive in the thermosetting adhesive layer. At this time, if the storage temperature is too high, for example, the thermoplastic hot-melt adhesive layers in contact with each other when rolled may cause blocking, so care must be taken in the winding pressure and the storage temperature. In addition, since the degree of curing of the thermosetting adhesive changes depending on the aging conditions, it may affect the adhesive strength between the thermoplastic hot-melt adhesive layer and the metal layer, and if aging is insufficient, , May cause delamination (layer peeling) due to poor curing of the adhesive.
It is effective to perform corona treatment on the surface of the thermoplastic hot melt adhesive layer in order to increase the adhesive strength between the thermoplastic hot melt adhesive layer and the thermosetting adhesive layer. In particular, it is effective for adhering a film having low polarity such as a polyethylene film or a polypropylene film to a metal layer.
接着構造物の解体方法:
接着構造物を、被着体の外側、および/または、支持体の外側から電磁誘導加熱装置により加熱し、固体状態にある熱可塑性ホットメルト接着剤層を、軟化ないし溶融させ、被着体と熱可塑性ホットメルト接着剤層を剥がす。
How to disassemble the adhesive structure:
The adhesive structure is heated from the outside of the adherend and / or the outside of the support by an electromagnetic induction heating device to soften or melt the thermoplastic hot-melt adhesive layer in a solid state, and the adherend is formed with the adherend. Peel off the thermoplastic hot melt adhesive layer.
以下、本発明を、実施例を挙げてさらに具体的に説明する。しかし、本発明は、以下の実施例に限定されるものではない。なお、本発明では、特に断らない限り、部は重量部、%は重量%を表す。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples. In the present invention, unless otherwise specified, parts represent parts by weight and% represents% by weight.
実施例1〜2に使用された熱可塑性ホットメルト層は、下記の通りである。
・LDPE単層フィルム(コロナ処理有) 膜厚:50μm 北越化成(株)社製
・LDPE単層フィルム(コロナ処理有) 膜厚:100μm 北越化成(株)社製
The thermoplastic hot melt layer used in Examples 1 and 2 is as follows.
・ LDPE single layer film (with corona treatment) Film thickness: 50 μm manufactured by Hokuetsu Kasei Co., Ltd. ・ LDPE single layer film (with corona treatment) Film thickness: 100 μm manufactured by Hokuetsu Kasei Co., Ltd.
実施例3〜24に使用された熱可塑性ホットメルト層は、下記ポリマーを製膜することによって得られた。
・ポリアミド(ナイロンベース):アルケマ社(株)製プラタミドM1276
・ポリアミド(ダイマー酸ベース) :ヘンケル社(株)製マクロメルト6239
・結晶性ポリエステル:東洋紡社(株)製バイロンGA6300
・非結晶ポリエステル:東洋紡社(株)製バイロン600
・ポリウレタン(ポリエーテルタイプ):BASF(株)社製エラストランET−370
・アクリル(メタクリル酸メチル):住友化学(株)社製スミペックスEX
・エチレン-酢酸ビニル共重合体:東ソー(株)社製ウルトラセン540
・変性ポリオレフィン:三井化学(株)社製アドマーSE810
The thermoplastic hot melt layer used in Examples 3 to 24 was obtained by forming a film of the following polymer.
-Polyamide (nylon base): Platamide M1276 manufactured by Arkema Co., Ltd.
-Polyamide (dimeric acid base): Macromelt 6239 manufactured by Henkel Co., Ltd.
-Crystalline polyester: Byron GA6300 manufactured by Toyobo Co., Ltd.
-Amorphous polyester: Byron 600 manufactured by Toyobo Co., Ltd.
-Polyurethane (polyether type): Elastran ET-370 manufactured by BASF Ltd.
-Acrylic (methyl methacrylate): Sumipex EX manufactured by Sumitomo Chemical Co., Ltd.
-Ethylene-vinyl acetate copolymer: Ultrasen 540 manufactured by Tosoh Corporation
-Modified polyolefin: Admer SE810 manufactured by Mitsui Chemicals, Inc.
本発明に使用した熱硬化接着剤は、下記の通りである。
主剤
・TM−585−60:(ポリエステル系)不揮発分60% 東洋モートン(株)社製
・TM−K55:(ポリエステル系)不揮発分30% 東洋モートン(株)社製
・TM−K76:(ポリエステル系)不揮発分51% 東洋モートン(株)社製
硬化剤
・CAT−10L:(芳香族系)不揮発分52.5% 東洋モートン(株)社製
・CAT−RT85:(脂肪族系)不揮発分70% 東洋モートン(株)社製
The thermosetting adhesive used in the present invention is as follows.
Main agent TM-585-60: (polyester) non-volatile content 60% Toyo Morton Co., Ltd. TM-K55: (polyester) non-volatile content 30% Toyo Morton Co., Ltd. TM-K76: (polyester) Non-volatile content 51% Toyo Morton Co., Ltd. Hardener CAT-10L: (Aromatic) Non-volatile content 52.5% Toyo Morton Co., Ltd. CAT-RT85: (Aliphatic) Non-volatile content 70% Made by Toyo Morton Co., Ltd.
本発明に使用される支持体は、下記の通りである。
・粘着剤層:オリバインBPS8170(トーヨーケム(株)社製)
・基材:木材(厚さ:10mm)、皮革(厚さ:3mm)、硬質塩ビ(厚さ:3mm)、ガラス(厚さ:3mm)
The supports used in the present invention are as follows.
-Adhesive layer: Oliveine BPS8170 (manufactured by Toyochem Co., Ltd.)
-Base material: wood (thickness: 10 mm), leather (thickness: 3 mm), hard PVC (thickness: 3 mm), glass (thickness: 3 mm)
熱硬化性接着剤の作製方法
(接着剤A)
熱硬化性接着剤の主剤TM−K55と硬化剤CAT-10Lを重量比100/7の割合で配合し、固形分が30%になるように酢酸エチルで希釈した。
(接着剤B)
熱硬化性接着剤の主剤TM−585−60と硬化剤CAT-10Lを重量比100/7の割合で配合し、固形分が30%になるように酢酸エチルで希釈した。
(接着剤C)
熱硬化性接着剤の主剤TM−K76と硬化剤CAT-10Lを重量比100/7の割合で配合し、固形分が30%になるように酢酸エチルで希釈した。
(接着剤D)
熱硬化性接着剤の主剤TM−K76と硬化剤CAT-RT85を重量比100/7の割合で配合し、固形分が30%になるように酢酸エチルで希釈した。
金属層の種類と厚みは、表1、2に記載した。
Method for producing thermosetting adhesive (adhesive A)
The main agent TM-K55 of the thermosetting adhesive and the curing agent CAT-10L were blended at a weight ratio of 100/7 and diluted with ethyl acetate so that the solid content was 30%.
(Adhesive B)
The main agent TM-585-60 of the thermosetting adhesive and the curing agent CAT-10L were mixed at a weight ratio of 100/7 and diluted with ethyl acetate so that the solid content was 30%.
(Adhesive C)
The main agent TM-K76 of the thermosetting adhesive and the curing agent CAT-10L were blended at a weight ratio of 100/7 and diluted with ethyl acetate so that the solid content was 30%.
(Adhesive D)
The main agent TM-K76 of the thermosetting adhesive and the curing agent CAT-RT85 were blended at a weight ratio of 100/7 and diluted with ethyl acetate so that the solid content was 30%.
The types and thicknesses of the metal layers are shown in Tables 1 and 2.
(導電塗料の調整)
導電塗料(1):トーヨーケム(株)社製REXALPHA RAFS045(トーヨーケム(株)社製 銀ペースト)
(絶縁層の調整)
絶縁層(1):厚さ188μmのPETフィルム
(Adjustment of conductive paint)
Conductive paint (1): REXALPHA RAFS045 manufactured by Toyochem Co., Ltd. (silver paste manufactured by Toyochem Co., Ltd.)
(Adjustment of insulation layer)
Insulation layer (1): PET film with a thickness of 188 μm
(実施例1〜22)
熱可塑性ホットメルト層のコロナ処理面と、アルミ箔を、表面温度を120℃に加熱した圧着ロールを用いて貼り合せて、積層物を得た。
熱硬化しうる接着剤を使用した場合、アルミ層に熱硬化性接着剤を塗工量Dry(乾燥後)で3〜10g/m2になるようにハンドアプリケーターを用いて塗工した。乾燥条件は、80℃1分であった。次に、熱可塑性ホットメルト接着剤フィルムと圧着ロールを用いて圧着した(圧着ロールは、60℃に加熱した)。その後40℃4日間の環境下でエージングを行い、ホットメルト接着シートを得た。コロナ処理を行った熱可塑性ホットメルト接着フィルムを用いる場合は、コロナ処理面に熱硬化しうる接着剤面が接するように行った。
上記の積層物を電磁誘導加熱装置(アキレス社製、オールオーバー接着装置)を用いて、被着体及び/または支持体に押し当てて1〜10秒間加熱して、加熱が終了しても熱可塑性ホットメルト接着剤層が冷えるまで約5秒程度電磁誘導加熱装置のアプリケータ部(コイル)を押し当てたままにして、接着した。
(Examples 1 to 22)
The corona-treated surface of the thermoplastic hot-melt layer and the aluminum foil were bonded together using a pressure-bonding roll whose surface temperature was heated to 120 ° C. to obtain a laminate.
When a thermosetting adhesive was used, the thermosetting adhesive was applied to the aluminum layer using a hand applicator so as to have a coating amount of Dry (after drying) of 3 to 10 g / m2. The drying conditions were 80 ° C. for 1 minute. Next, crimping was performed using a thermoplastic hot melt adhesive film and a crimping roll (the crimping roll was heated to 60 ° C.). Then, aging was carried out in an environment of 40 ° C. for 4 days to obtain a hot melt adhesive sheet. When a corona-treated thermoplastic hot-melt adhesive film was used, the corona-treated surface was brought into contact with a thermosetting adhesive surface.
The above laminate is pressed against an adherend and / or a support using an electromagnetic induction heating device (all-over adhesive device manufactured by Achilles Corporation) and heated for 1 to 10 seconds. The applicator portion (coil) of the electromagnetic induction heating device was kept pressed for about 5 seconds until the plastic hot-melt adhesive layer cooled, and the adhesive was adhered.
(実施例23)
熱可塑性ホットメルト層のコロナ処理面と、アルミ層に熱硬化性接着剤Cを塗工量Dry(乾燥後)で4g/m2になるようにハンドアプリケーターを用いて塗工した。乾燥条件は、80℃1分であった。次に、熱可塑性ホットメルト接着剤フィルムと圧着ロールを用いて圧着した(圧着ロールは、60℃に加熱した)。その後40℃4日間の環境下でエージングを行い、ホットメルト接着シートを得た。コロナ処理を行った熱可塑性ホットメルト接着フィルムを用いる場合は、コロナ処理面に熱硬化しうる接着剤面が接するように行った。
上記の積層物を、電磁誘導加熱装置(アキレス社製、オールオーバー接着装置)を用いて、被着体に押し当てて2秒間加熱して、加熱が終了しても熱可塑性ホットメルト接着剤層が冷えるまで約5秒程度電磁誘導加熱装置のアプリケータ部(コイル)を押し当てたままにして、接着した。
アルミ層の上に、絶縁層(1)である188μm厚のPETフィルムを120℃に加熱した熱ラミで接着し、その上に導電塗料(1)をスクリーン印刷で印刷した。更に保護層として188μm厚のPETフィルムを熱硬化した熱着剤Cで接着した。
(Example 23)
The thermosetting adhesive C was applied to the corona-treated surface of the thermoplastic hot-melt layer and the aluminum layer using a hand applicator so that the amount of application Dry (after drying) was 4 g / m2. The drying conditions were 80 ° C. for 1 minute. Next, crimping was performed using a thermoplastic hot melt adhesive film and a crimping roll (the crimping roll was heated to 60 ° C.). Then, aging was carried out in an environment of 40 ° C. for 4 days to obtain a hot melt adhesive sheet. When a corona-treated thermoplastic hot-melt adhesive film was used, the corona-treated surface was brought into contact with a thermosetting adhesive surface.
The above laminate is pressed against the adherend using an electromagnetic induction heating device (all-over adhesive device manufactured by Achilles Corporation) and heated for 2 seconds. Even after the heating is completed, the thermoplastic hot melt adhesive layer is used. The applicator part (coil) of the electromagnetic induction heating device was kept pressed for about 5 seconds until it cooled down, and the adhesive was adhered.
A 188 μm-thick PET film, which is an insulating layer (1), was adhered onto the aluminum layer with a thermal lamina heated to 120 ° C., and the conductive paint (1) was printed on the aluminum layer by screen printing. Further, as a protective layer, a PET film having a thickness of 188 μm was adhered with a thermosetting agent C.
実施例1〜23、比較例1、2の各層で使用した材料の種類、厚さなどは、表1、2に示す。 The types and thicknesses of the materials used in each of the layers of Examples 1 to 23 and Comparative Examples 1 and 2 are shown in Tables 1 and 2.
(接着力の測定方法)
接着強度は、引張り試験機(株式会社エー・アンド・エー社製、商品名RTA−100)を用いて、剥離速度300mm/分でせん断強度を測定した(測定温度:23℃、湿度50%)。剥離力は、10N/25mm以上(基材破壊含む)を「〇」、10N/25mm未満を「×」とした。評価結果は、表1、2に示す。
(Measuring method of adhesive strength)
For the adhesive strength, the shear strength was measured at a peeling speed of 300 mm / min using a tensile tester (manufactured by A & A Co., Ltd., trade name RTA-100) (measurement temperature: 23 ° C., humidity 50%). .. The peeling force was “◯” for 10 N / 25 mm or more (including substrate destruction) and “x” for less than 10 N / 25 mm. The evaluation results are shown in Tables 1 and 2.
(剥離試験)
実施例1〜23の接着構造体は、それぞれ、接着工程と同様の電磁誘導加熱条件で加熱したところ、いずれも、容易に被着体より剥離でき、接着構造物の解体ができた。評価結果は、表1、2に示す。
(Peeling test)
When each of the adhesive structures of Examples 1 to 23 was heated under the same electromagnetic induction heating conditions as in the adhesive step, all of them could be easily peeled off from the adherend, and the adhesive structure could be disassembled. The evaluation results are shown in Tables 1 and 2.
(比較例1)
比較例1として、市販品の屋内平滑床面用ラインテープE−SD (日東電工製)をコンクリートに貼りつけて、実施例1〜23と同様の評価方法で、接着構造物の物性を実施例1〜23の結果と比較した。
評価:実施例1〜23と比べ、コンクリートと熱可塑性ホットメルト接着剤層、金属層の積層物との接着強度が弱く、評価結果は「×」となった。
(Comparative Example 1)
As Comparative Example 1, a commercially available line tape E-SD (manufactured by Nitto Denko) for indoor smooth floors was attached to concrete, and the physical properties of the adhesive structure were evaluated by the same evaluation method as in Examples 1 to 23. It was compared with the results of 1 to 23.
Evaluation: Compared with Examples 1 to 23, the adhesive strength between the concrete and the laminate of the thermoplastic hot melt adhesive layer and the metal layer was weak, and the evaluation result was “x”.
(比較例2)
比較例2として、厚みが0.5mmのPEシートを被着体として使用し、実施例1〜23と同様の評価方法で、接着構造物の物性を実施例1〜23の結果と比較した。
評価:実施例1〜23と比べ、厚みが0.5mmのPEシートと熱可塑性ホットメルト接着剤層、金属層の積層物との接着強度が弱く、評価結果は「×」となった。
(Comparative Example 2)
As Comparative Example 2, a PE sheet having a thickness of 0.5 mm was used as an adherend, and the physical characteristics of the adhesive structure were compared with the results of Examples 1 to 23 by the same evaluation method as in Examples 1 to 23.
Evaluation: Compared with Examples 1 to 23, the adhesive strength between the PE sheet having a thickness of 0.5 mm and the laminate of the thermoplastic hot melt adhesive layer and the metal layer was weak, and the evaluation result was “x”.
Claims (6)
金属層の外部から、電磁誘導加熱装置により加熱し、熱可塑性ホットメルト接着剤層、熱硬化した接着剤層、金属層の順で積層されてなる積層物と、厚みが1mm以上である被着体とを、接着することを特徴とする接着構造物の製造方法。 The method for manufacturing an adhesive structure according to any one of claims 1 to 4.
A laminate having a thickness of 1 mm or more, which is heated from the outside of the metal layer by an electromagnetic induction heating device and is laminated in the order of a thermoplastic hot melt adhesive layer, a heat-cured adhesive layer, and a metal layer. A method for manufacturing an adhesive structure, which comprises adhering a body to an adhesive structure.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016114083 | 2016-06-08 | ||
JP2016114083 | 2016-06-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017222155A JP2017222155A (en) | 2017-12-21 |
JP6900593B2 true JP6900593B2 (en) | 2021-07-07 |
Family
ID=60686175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017068538A Active JP6900593B2 (en) | 2016-06-08 | 2017-03-30 | Adhesive structure, its manufacturing method and peeling method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6900593B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7207581B2 (en) * | 2018-04-26 | 2023-01-18 | 凸版印刷株式会社 | Floor material and its construction method |
JP7374027B2 (en) | 2019-03-12 | 2023-11-06 | マクセル株式会社 | Structural deterioration control system and its usage |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001262085A (en) * | 2000-03-15 | 2001-09-26 | Konishi Co Ltd | Induction heating adhesive sheet |
JP6353670B2 (en) * | 2013-05-08 | 2018-07-04 | 昭和電工パッケージング株式会社 | Molding packaging material |
JP2015136811A (en) * | 2014-01-20 | 2015-07-30 | 東洋インキScホールディングス株式会社 | Laminate member, production method thereof and adhesion method as well as peeling method |
JP5958610B1 (en) * | 2015-06-23 | 2016-08-02 | 東洋インキScホールディングス株式会社 | Hot melt adhesive sheet, method for producing adhesive structure using the same, and method for peeling |
-
2017
- 2017-03-30 JP JP2017068538A patent/JP6900593B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017222155A (en) | 2017-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5958610B1 (en) | Hot melt adhesive sheet, method for producing adhesive structure using the same, and method for peeling | |
JP5644896B2 (en) | Adhesive layer and adhesive sheet | |
KR102058944B1 (en) | Double-sided adhesive tape | |
JP6582904B2 (en) | Hot melt adhesive sheet for electromagnetic induction heating, adhesive structure using the same, and method for producing adhesive structure | |
KR102292340B1 (en) | Double-sided adhesive tape and electronic device | |
TW201837092A (en) | Adhesive sheet for high-frequency dielectric heating and method for producing the same | |
JP2011178879A (en) | Protective sheet and use thereof | |
TWI780199B (en) | Next, the method of dismantling the structure | |
JP6900593B2 (en) | Adhesive structure, its manufacturing method and peeling method | |
WO2007013461A1 (en) | Laminate film having adhesive for use in electrical material | |
JP5560746B2 (en) | Adhesive sheet | |
JP2013040299A (en) | Adhesive composition and adhesive sheet using the same | |
JP6812878B2 (en) | Adhesive sheet and adhesive structure using it, manufacturing method of adhesive structure, and peeling method | |
JP6690416B2 (en) | Laminate having hot-melt adhesive layer for electromagnetic induction heating, adhesive structure using the same, and peeling method | |
JP6582881B2 (en) | Hot melt adhesive sheet for electromagnetic induction heating, adhesive structure using the same, and method for producing adhesive structure | |
JP6464683B2 (en) | Concrete repair or reinforcement method | |
JP6269034B2 (en) | Double-sided adhesive tape | |
JP5560747B2 (en) | Adhesive sheet | |
JP6900592B2 (en) | Adhesive structures, methods of manufacturing and peeling adhesive structures | |
JP2017218495A (en) | Hot-melt adhesive sheet for electromagnetic induction heating, methods for producing and peeling adhesion structure using the same | |
CN108735649A (en) | Cut die bonding film | |
JP6955959B2 (en) | Peeling prevention sheet for electromagnetic induction heating, adhesive structure and its manufacturing method, and manufacturing method of structure | |
JP2020100043A (en) | Hot-melt adhesive sheet for electromagnetic induction heating, bonded structure using the same, method for manufacturing bonded structure, and peeling method | |
JP2020093451A (en) | Laminated stretched film, base material for decorative sheet, decorative sheet and decorative plate | |
JP6972901B2 (en) | Hot melt adhesive sheet for electromagnetic induction heating and its manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200117 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201021 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201117 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201215 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210420 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20210423 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210423 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20210423 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6900593 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |