JP6888912B2 - 窓付きのケミカルメカニカルポリッシングパッド - Google Patents
窓付きのケミカルメカニカルポリッシングパッド Download PDFInfo
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- JP6888912B2 JP6888912B2 JP2016046719A JP2016046719A JP6888912B2 JP 6888912 B2 JP6888912 B2 JP 6888912B2 JP 2016046719 A JP2016046719 A JP 2016046719A JP 2016046719 A JP2016046719 A JP 2016046719A JP 6888912 B2 JP6888912 B2 JP 6888912B2
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- polishing
- opening
- avg
- openings
- window
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Description
驚くべきことに出願人は、本発明により構成されるケミカルメカニカルポリッシングパッドの窓が、窓の突出及び不均等な窓の摩耗の両方に抵抗性であり、このことが、窓の突出に起因する研磨欠陥を最小限に抑え、そして不均等な窓の摩耗及び関連する早過ぎる研磨パッド交換を減少させることにより研磨パッド寿命を最大化する助けとなることを見い出した。
0.75×Ao−avg≦Ai−avg≦1.25×Ao−avg
(好ましくは、0.9×Ao−avg≦Ai−avg≦1.1×Ao−avg;更に好ましくは、0.95×Ao−avg≦Ai−avg≦1.05×Ao−avg;最も好ましくは、Ao−avg=Ai−avg)である。(図4〜10を参照のこと)。
0.5×(Ai−avg+Ao−avg)≦Ac≦1.25×(Ai−avg+Ao−avg)
(好ましくは、0.75×(Ai−avg+Ao−avg)≦Ac−avg≦1.1×(Ai−avg+Ao−avg);更に好ましくは、0.9×(Ai−avg+Ao−avg)≦Ac−avg≦0.95×(Ai−avg+Ao−avg))である。(図4〜10を参照のこと)。
0.75×Ao−avg≦Ai−avg≦1.25×Ao−avg
(好ましくは、0.9×Ao−avg≦Ai−avg≦1.1×Ao−avg;更に好ましくは、0.95×Ao−avg≦Ai−avg≦1.05×Ao−avg;最も好ましくは、Ao−avg=Ai−avg)であり;そして
0.5×(Ai−avg+Ao−avg)≦Ac≦1.25×(Ai−avg+Ao−avg)
(好ましくは、0.75×(Ai−avg+Ao−avg)≦Ac−avg≦1.1×(Ai−avg+Ao−avg);更に好ましくは、0.9×(Ai−avg+Ao−avg)≦Ac−avg≦0.95×(Ai−avg+Ao−avg))である。(図4〜10を参照のこと)。
比較実施例C1及び実施例1〜5:研磨パッド
砥粒コンディショニング
比較実施例C1及び実施例3からの終点検出窓(30)の窓厚さは、コンディショニングの前後に、中心線(61)に沿って、中央(65)、前縁(63)及び後縁(67)で;そして外線(62)に沿って、中央(65)、前縁(63)及び後縁(67)で測定した。(図15を参照のこと)。結果は、表2に提供される。
Claims (2)
- 中心軸、外周、研磨面、ベース面、及び、研磨層厚さTPを有する研磨層であって、前記研磨面が平面を有し、前記研磨層厚さT P が前記研磨面の平面に垂直に前記研磨面から前記ベース面まで測定され、前記研磨層が前記中心軸と交わる前記研磨面の前記平面上に前記研磨層の前記外周を通過するように延伸される研磨層放射線PL R を有する、前記研磨層;
研磨側面、プラテン側面、及び、前記研磨側面に垂直に前記研磨側面から前記プラテン側面まで測定される窓厚さTWを有する1個の終点検出窓;
上面、底面、複数の開口部、外縁、及び、前記上面に垂直に前記上面から前記底面まで測定されるサブパッド厚さTSを有するサブパッド;並びに
積層接着剤
を含むケミカルメカニカルポリッシングパッドであって、
前記研磨側面が、前記研磨層の前記研磨面と同じ側であり、
前記終点検出窓が、前記研磨層内で、前記研磨面の前記平面上の窓長寸法射影pLDWが、前記研磨層放射線PLRと実質的に一致するように配置され;
前記積層接着剤が、前記研磨層の前記ベース面と前記サブパッドの前記上面の間に挿入され;
前記複数の開口部が、前記サブパッド内で統合され、複数の横材により分離されており、前記研磨面の前記平面に平行である開口部長寸法射影pLDAが、前記終点検出窓と光学的に連通されて前記窓長寸法射影pLDWと実質的に一致するように配置され;そして
前記研磨層の前記研磨面が、基板の研磨に適合させられる、
ように組み込まれたケミカルメカニカルポリッシングパッド。 - 前記複数の開口部が、3個の隣接開口部よりなり;
前記3個の隣接開口部が、内側開口部、中央開口部及び外側開口部よりなり;
前記内側開口部が、前記研磨面の前記平面に平行な内側開口部断面積Aiを有しており;
前記中央開口部が、前記研磨面の前記平面に平行な中央開口部断面積Acを有しており;
前記外側開口部が、前記研磨面の前記平面に平行な外側開口部断面積Aoを有しており;
前記複数の横材が、内側部材及び外側部材よりなり;
前記内側部材が、前記中央開口部から前記内側開口部を分離し;そして
前記外側部材が、前記外側開口部から前記中央開口部を分離している、請求項1記載のケミカルメカニカルポリッシングパッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/657,123 US9446498B1 (en) | 2015-03-13 | 2015-03-13 | Chemical mechanical polishing pad with window |
US14/657,123 | 2015-03-13 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016168670A JP2016168670A (ja) | 2016-09-23 |
JP2016168670A5 JP2016168670A5 (ja) | 2019-04-04 |
JP6888912B2 true JP6888912B2 (ja) | 2021-06-18 |
Family
ID=56800677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016046719A Active JP6888912B2 (ja) | 2015-03-13 | 2016-03-10 | 窓付きのケミカルメカニカルポリッシングパッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US9446498B1 (ja) |
JP (1) | JP6888912B2 (ja) |
KR (1) | KR102492448B1 (ja) |
CN (1) | CN105965382B (ja) |
DE (1) | DE102016002339A1 (ja) |
FR (1) | FR3033512A1 (ja) |
TW (1) | TWI696517B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD785339S1 (en) * | 2014-10-23 | 2017-05-02 | Griot's Garage, Inc. | Hand applicator buffing pad |
US10569383B2 (en) * | 2017-09-15 | 2020-02-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Flanged optical endpoint detection windows and CMP polishing pads containing them |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
KR102674027B1 (ko) * | 2019-01-29 | 2024-06-12 | 삼성전자주식회사 | 재생 연마패드 |
JP2024525537A (ja) * | 2021-07-06 | 2024-07-12 | アプライド マテリアルズ インコーポレイテッド | 化学機械研磨のための音響センサの結合 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
US6716085B2 (en) | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
JP4570286B2 (ja) | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
JP2003133270A (ja) | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
US7306507B2 (en) | 2005-08-22 | 2007-12-11 | Applied Materials, Inc. | Polishing pad assembly with glass or crystalline window |
US7520797B2 (en) * | 2005-09-06 | 2009-04-21 | Freescale Semiconductor, Inc. | Platen endpoint window with pressure relief |
WO2007091439A1 (ja) * | 2006-02-06 | 2007-08-16 | Toray Industries, Inc. | 研磨パッドおよび研磨装置 |
US8182312B2 (en) * | 2008-09-06 | 2012-05-22 | Strasbaugh | CMP system with wireless endpoint detection system |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
CN102281990A (zh) | 2009-01-16 | 2011-12-14 | 应用材料股份有限公司 | 具有窗口支撑件的研磨垫与*** |
CN101934150A (zh) * | 2009-06-29 | 2011-01-05 | 鸿富锦精密工业(深圳)有限公司 | 瞳孔模拟机构及玩具眼睛 |
US9108290B2 (en) * | 2013-03-07 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad |
-
2015
- 2015-03-13 US US14/657,123 patent/US9446498B1/en active Active
-
2016
- 2016-02-26 DE DE102016002339.2A patent/DE102016002339A1/de not_active Withdrawn
- 2016-03-07 TW TW105106942A patent/TWI696517B/zh active
- 2016-03-07 CN CN201610127791.3A patent/CN105965382B/zh active Active
- 2016-03-09 KR KR1020160028356A patent/KR102492448B1/ko active IP Right Grant
- 2016-03-10 JP JP2016046719A patent/JP6888912B2/ja active Active
- 2016-03-10 FR FR1651996A patent/FR3033512A1/fr active Pending
Also Published As
Publication number | Publication date |
---|---|
US9446498B1 (en) | 2016-09-20 |
TW201632302A (zh) | 2016-09-16 |
US20160263721A1 (en) | 2016-09-15 |
JP2016168670A (ja) | 2016-09-23 |
FR3033512A1 (fr) | 2016-09-16 |
KR20160110190A (ko) | 2016-09-21 |
KR102492448B1 (ko) | 2023-01-30 |
CN105965382A (zh) | 2016-09-28 |
CN105965382B (zh) | 2018-05-22 |
DE102016002339A1 (de) | 2016-09-15 |
TWI696517B (zh) | 2020-06-21 |
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