JP6856472B2 - Display device - Google Patents

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JP6856472B2
JP6856472B2 JP2017147867A JP2017147867A JP6856472B2 JP 6856472 B2 JP6856472 B2 JP 6856472B2 JP 2017147867 A JP2017147867 A JP 2017147867A JP 2017147867 A JP2017147867 A JP 2017147867A JP 6856472 B2 JP6856472 B2 JP 6856472B2
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light
substrate
light emitting
display device
shielding member
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崇司 清水
崇司 清水
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Kyocera Corp
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Description

本発明は、発光ダイオード(Light Emitting Diode:LED)等の発光素子を有する表示装置に関するものである。 The present invention relates to a display device having a light emitting element such as a light emitting diode (LED).

従来、LED等の発光素子を複数有する、バックライト装置が不要な自発光型の表示装置が知られている。そのような表示装置の基本構成のブロック回路図を図3に示す。また、図3の構成の表示装置の下面図を図4に示し、図3のA1−A2線における断面図を図5に示す。表示装置は、ガラス基板等から成る基板1と、基板1上の所定の方向(例えば、行方向)に配置された走査信号線2と、走査信号線2と交差させて所定の方向と交差する方向(例えば、列方向)に配置された発光制御信号線3と、走査信号線2と発光制御信号線3によって区分けされた画素部(Pmn)の複数から構成された表示部11と、表示部11を覆う絶縁層上に配置された複数の発光領域(Lmn)と、を有する構成である。走査信号線2および発光制御信号線3は、基板1の側面に配置された側面配線1sを介して基板1の裏面にある裏面配線9に接続される。裏面配線9は、基板1の裏面に設置されたIC,LSI等の駆動素子6に接続される。すなわち、表示装置は基板1の裏面にある駆動素子6によって表示が駆動制御される。駆動素子6は、例えば、基板1の裏面側にCOG(Chip On Glass)方式等の手段によって搭載される。また、基板1の裏面側には、駆動素子6との間で引き出し線を介して駆動信号、制御信号等を入出力するためのFPCが設置される場合がある。また側面配線1sに替えてスルーホール等の貫通導体を用いる場合がある。 Conventionally, a self-luminous display device having a plurality of light emitting elements such as LEDs and which does not require a backlight device is known. A block circuit diagram of the basic configuration of such a display device is shown in FIG. Further, a bottom view of the display device having the configuration of FIG. 3 is shown in FIG. 4, and a cross-sectional view taken along the line A1-A2 of FIG. 3 is shown in FIG. The display device intersects the substrate 1 made of a glass substrate or the like, the scanning signal line 2 arranged in a predetermined direction (for example, the row direction) on the substrate 1, and the scanning signal line 2 and intersects the predetermined direction. A display unit 11 composed of a plurality of light emission control signal lines 3 arranged in a direction (for example, column direction), a plurality of pixel units (Pmn) divided by a scanning signal line 2 and a light emission control signal line 3, and a display unit. It is configured to have a plurality of light emitting regions (Lmn) arranged on an insulating layer covering 11. The scanning signal line 2 and the light emission control signal line 3 are connected to the back surface wiring 9 on the back surface of the substrate 1 via the side surface wiring 1s arranged on the side surface of the substrate 1. The back surface wiring 9 is connected to a drive element 6 such as an IC or LSI installed on the back surface of the substrate 1. That is, the display of the display device is driven and controlled by the drive element 6 on the back surface of the substrate 1. The drive element 6 is mounted on the back surface side of the substrate 1 by means such as a COG (Chip On Glass) method. Further, on the back surface side of the substrate 1, an FPC for inputting / outputting a drive signal, a control signal, or the like to / from the drive element 6 via a lead wire may be installed. Further, a through conductor such as a through hole may be used instead of the side wiring 1s.

それぞれの画素部15(Pmn)には、発光領域(Lmn)にある発光素子14(LDmn)の発光、非発光、発光強度等を制御するための発光制御部22が配置されている。この発光制御部22は、発光素子14のそれぞれに発光信号を入力するためのスイッチ素子としての薄膜トランジスタ(Thin Film Transistor:TFT)12(図6に示す)と、発光制御信号(発光制御信号線3を伝達する信号)のレベル(電圧)に応じた、正電圧(アノード電圧:3〜5V程度)と負電圧(カソード電圧:−3V〜0V程度)の電位差(発光信号)から発光素子14を電流駆動するための駆動素子としてのTFT13(図6に示す)と、を含む。TFT13のゲート電極とソース電極とを接続する接続線上には容量素子が配置されており、容量素子はTFT13のゲート電極に入力された発光制御信号の電圧を次の書き換えまでの期間(1フレームの期間)保持する保持容量として機能する。 A light emission control unit 22 for controlling light emission, non-light emission, light emission intensity, etc. of the light emitting element 14 (LDmn) in the light emission region (Lmn) is arranged in each pixel unit 15 (Pmn). The light emission control unit 22 includes a thin film transistor (TFT) 12 (shown in FIG. 6) as a switch element for inputting a light emission signal to each of the light emission elements 14, and a light emission control signal (light emission control signal line 3). The current is applied to the light emitting element 14 from the potential difference (light emitting signal) between the positive voltage (anode voltage: about 3 to 5V) and the negative voltage (cathode voltage: about -3V to 0V) according to the level (voltage) of the signal to be transmitted. Includes a TFT 13 (shown in FIG. 6) as a driving element for driving. A capacitive element is arranged on the connection line connecting the gate electrode and the source electrode of the TFT 13, and the capacitive element changes the voltage of the light emission control signal input to the gate electrode of the TFT 13 until the next rewriting (one frame). Period) Functions as a holding capacity to hold.

発光素子14は、表示部11を覆う絶縁層41(図5に示す)を貫通するスルーホール等の貫通導体23a,23bを介して、発光制御部22、正電圧入力線16、負電圧入力線17に電気的に接続されている。すなわち、発光素子14の正電極は、貫通導体23aおよび発光制御部22を介して正電圧入力線16に接続されており、発光素子14の負電極は、貫通導体23bを介して負電圧入力線17に接続されている。 The light emitting element 14 has a light emitting control unit 22, a positive voltage input line 16, and a negative voltage input line via through conductors 23a and 23b such as through holes that penetrate the insulating layer 41 (shown in FIG. 5) that covers the display unit 11. It is electrically connected to 17. That is, the positive electrode of the light emitting element 14 is connected to the positive voltage input line 16 via the through conductor 23a and the light emission control unit 22, and the negative electrode of the light emitting element 14 is connected to the negative voltage input line via the through conductor 23b. It is connected to 17.

また表示装置は、平面視において、表示部11と基板1の端1tとの間に表示に寄与しない額縁部1gがあり、この額縁部1gに発光制御信号線駆動回路、走査信号線駆動回路等が配置される場合がある。この額縁部1gの幅はできるだけ小さくすることが要望されている。さらに、一般に、一枚の母基板を切断して複数枚の基板1を切り出すことが行われているが、発光制御部22に対する切断線の影響を抑えるために、図7のブロック回路図に示すように、最外周部の画素部15において発光制御部22を発光素子14よりも平面視で基板1の内側に配置する構成が提案されている(例えば、特許文献1を参照)。 Further, in the display device, in a plan view, there is a frame portion 1g that does not contribute to the display between the display unit 11 and the end 1t of the substrate 1, and the frame portion 1g includes a light emission control signal line drive circuit, a scanning signal line drive circuit, and the like. May be placed. It is requested that the width of the frame portion 1 g be as small as possible. Further, generally, one mother substrate is cut to cut out a plurality of substrates 1, but in order to suppress the influence of the cutting line on the light emission control unit 22, the block circuit diagram of FIG. 7 is shown. As described above, a configuration has been proposed in which the light emission control unit 22 is arranged inside the substrate 1 in a plan view of the light emitting element 14 in the pixel unit 15 on the outermost periphery (see, for example, Patent Document 1).

なお、画素部15は、それぞれが赤色発光用の副画素部、緑色発光用の副画素部、青色発光用の副画素部から成る場合がある。赤色発光用の副画素部は赤色LED等から成る赤色発光素子を有し、緑色発光用の副画素部は緑色LED等から成る緑色発光素子を有し、青色発光用の副画素部は青色LED等から成る青色発光素子を有している。例えば、これらの副画素部は、行方向あるいは列方向に並んでいる。 The pixel unit 15 may be composed of a sub-pixel unit for red light emission, a sub-pixel unit for green light emission, and a sub-pixel unit for blue light emission, respectively. The sub-pixel part for red light emission has a red light emitting element composed of a red LED or the like, the sub pixel part for green light emission has a green light emitting element composed of a green LED or the like, and the sub pixel part for blue light emission has a blue LED. It has a blue light emitting element made of such as. For example, these sub-pixel portions are arranged in the row direction or the column direction.

図8は、図7の表示装置における最外周部にある画素部15(P11)を拡大して示す部分拡大平面図であり、図9は、図8のB1−B2線における断面図である。これらの図に示すように、表示装置において、表示部11の周囲にある表示に寄与しない額縁部1gを目立たなくするために、額縁部1gにブラックマトリクス等から成る遮光部25を配置している。 FIG. 8 is a partially enlarged plan view showing an enlarged pixel portion 15 (P11) on the outermost peripheral portion of the display device of FIG. 7, and FIG. 9 is a cross-sectional view taken along the line B1-B2 of FIG. As shown in these figures, in the display device, in order to make the frame portion 1g that does not contribute to the display around the display unit 11 inconspicuous, a light-shielding portion 25 made of a black matrix or the like is arranged on the frame portion 1g. ..

図9に示すように、ガラス基板等から成る基板1上にアクリル樹脂等から成る樹脂絶縁層51が配置され、樹脂絶縁層51上に発光素子14が搭載されている。発光素子14は基板1の端1tから55μm〜130μm程度離れた位置にある。すなわち、図8における発光素子14の基板1の端1tからの離隔幅L1は55μm程度であり、離隔幅L2は130μm程度である。 As shown in FIG. 9, a resin insulating layer 51 made of acrylic resin or the like is arranged on a substrate 1 made of a glass substrate or the like, and a light emitting element 14 is mounted on the resin insulating layer 51. The light emitting element 14 is located at a position about 55 μm to 130 μm away from the edge 1t of the substrate 1. That is, the separation width L1 from the end 1t of the substrate 1 of the light emitting element 14 in FIG. 8 is about 55 μm, and the separation width L2 is about 130 μm.

発光素子14は、樹脂絶縁層51上に配置された正電極54aと負電極54bにハンダ等の導電性接続部材を介して電気的に接続されて、樹脂絶縁層51上に搭載される。正電極54aは、Mo層/Al層/Mo層(Mo層上にAl層、Mo層が順次積層された積層構造を示す)等から成る電極層52aと、それを覆う酸化インジウム錫(Indium Tin Oxide:ITO)等から成る透明電極53aと、から成る。負電極54bも同様の構成であり、Mo層/Al層/Mo層等から成る電極層52bと、それを覆うITO等から成る透明電極53bと、から成る。また、樹脂絶縁層層51上の正電極54a及び負電極54bよりも基板1の端1t寄りの部位に、電極パッド2pが配置されており、電極パッド2pは電極層52cとそれを覆うITO等から成る透明電極53cとから成る。電極パッド2pは、正電極54aに電気的に接続されるとともに、側面配線1sを介して裏面配線9に電気的に接続される中継電極として機能する。 The light emitting element 14 is electrically connected to the positive electrode 54a and the negative electrode 54b arranged on the resin insulating layer 51 via a conductive connecting member such as solder, and is mounted on the resin insulating layer 51. The positive electrode 54a is an electrode layer 52a composed of a Mo layer / Al layer / Mo layer (indicating a laminated structure in which an Al layer and a Mo layer are sequentially laminated on the Mo layer) and the like, and indium tin oxide (Indium Tin) covering the electrode layer 52a. It is composed of a transparent electrode 53a made of Oxide: ITO) and the like. The negative electrode 54b has the same configuration, and is composed of an electrode layer 52b made of a Mo layer / Al layer / Mo layer or the like, and a transparent electrode 53b made of ITO or the like covering the electrode layer 52b. Further, the electrode pad 2p is arranged on the resin insulating layer 51 at a portion closer to the end 1t of the substrate 1 than the positive electrode 54a and the negative electrode 54b, and the electrode pad 2p is the electrode layer 52c and ITO or the like covering it. It is composed of a transparent electrode 53c and is composed of. The electrode pad 2p functions as a relay electrode that is electrically connected to the positive electrode 54a and electrically connected to the back surface wiring 9 via the side wiring 1s.

樹脂絶縁層51と、透明電極53a,53bのそれぞれの一部(発光素子14が重ならない部位)と、透明電極53cの周縁部と、を覆って、酸化珪素(SiO2),窒化珪素(SiNx)等から成る絶縁層55が配置されている。絶縁層55上において、発光素子14の搭載部と、遮光部材25の配置部と、を除く部位に、ブラックマトリクス等から成る遮光層56が配置されている。遮光層56は、表示装置を平面視したときに発光素子14の部位以外の部位が黒色等の暗色の背景色となるようにする目的で設けられる。 Silicon oxide (SiO 2 ) and silicon nitride (SiN) cover the resin insulating layer 51, a part of each of the transparent electrodes 53a and 53b (the portion where the light emitting element 14 does not overlap), and the peripheral edge of the transparent electrode 53c. An insulating layer 55 made of x) or the like is arranged. On the insulating layer 55, a light-shielding layer 56 made of a black matrix or the like is arranged at a portion other than the mounting portion of the light emitting element 14 and the arranging portion of the light-shielding member 25. The light-shielding layer 56 is provided for the purpose of allowing a portion other than the portion of the light emitting element 14 to have a dark background color such as black when the display device is viewed in a plan view.

絶縁層55上における平面視で電極パッド2pを覆う部位から、基板1の側面を経て基板1の裏面にかけて、電極パッド2pと裏面配線9を電気的に接続する側面配線1sが配置されている。側面配線1sは、例えば銀等の導電性粒子を含む導電性ペーストを塗布し焼成することによって形成される。遮光部材25は電極パッド2pおよび側面配線1sを覆って配置されている。そして、発光素子14の正電極がハンダ等の導電性接続部材を介して正電極54aに接続され、発光素子14の負電極がハンダ等の導電性接続部材を介して負電極54bに接続されることによって、発光素子14が基板1上に搭載される。 Side wiring 1s for electrically connecting the electrode pad 2p and the back surface wiring 9 is arranged from a portion of the insulating layer 55 that covers the electrode pad 2p in a plan view to the back surface of the substrate 1 through the side surface of the substrate 1. The side wiring 1s is formed by applying and firing a conductive paste containing conductive particles such as silver. The light-shielding member 25 is arranged so as to cover the electrode pad 2p and the side wiring 1s. Then, the positive electrode of the light emitting element 14 is connected to the positive electrode 54a via a conductive connecting member such as solder, and the negative electrode of the light emitting element 14 is connected to the negative electrode 54b via a conductive connecting member such as solder. As a result, the light emitting element 14 is mounted on the substrate 1.

特開2001−75511号公報Japanese Unexamined Patent Publication No. 2001-75511

しかしながら、図3〜図9に示す上記従来の表示装置においては、以下の問題点があった。基板1を平面視したときに、表示部11の周囲に表示に寄与しない額縁部1gがあるために、図8、図9に示すように、額縁部1gにブラックマトリクス等から成る遮光部材25を配置することによって額縁部1gを目立たなくしていた。しかしながら、基板1の厚み方向(基板1の主面に直交する方向)における基板1の主面からの遮光部材25の高さが、最外周部にある発光素子14の基板1の主面からの高さ位置よりも高いと、発光素子14から放射された光の一部および外光が遮光部材25で反射するために、コントラスト低下、画面の額縁が目立つことによる表示品位の低下の問題点があった。すなわち、遮光部材25は黒色等の暗色系の色合いであったとしも、遮光部材25の表面はある程度の艶があるために、遮光部材25に入射した光は完全には吸収されず、光の一部が反射されるからである。 However, the conventional display devices shown in FIGS. 3 to 9 have the following problems. When the substrate 1 is viewed in a plan view, there is a frame portion 1g that does not contribute to the display around the display unit 11. Therefore, as shown in FIGS. 8 and 9, a light-shielding member 25 made of a black matrix or the like is attached to the frame portion 1g. By arranging it, 1 g of the frame portion was made inconspicuous. However, the height of the light-shielding member 25 from the main surface of the substrate 1 in the thickness direction of the substrate 1 (the direction orthogonal to the main surface of the substrate 1) is from the main surface of the substrate 1 of the light emitting element 14 on the outermost periphery. If it is higher than the height position, a part of the light radiated from the light emitting element 14 and the outside light are reflected by the light-shielding member 25, so that there are problems that the contrast is lowered and the display quality is lowered because the frame of the screen is conspicuous. there were. That is, even if the light-shielding member 25 has a dark color such as black, the light incident on the light-shielding member 25 is not completely absorbed because the surface of the light-shielding member 25 has a certain degree of luster. This is because part of it is reflected.

また、表示装置を製造する際に、多数の発光素子14をそれぞれ凹部、貫通孔等に収容して配列させた治具を用い、その治具を基板1上で裏返して発光素子14を基板1上の各搭載部にそれぞれ配置させる搭載方法、あるいは多数の発光素子14を粘着シート上に配列させ、その粘着シートを基板1上で裏返して発光素子14を基板1上の各搭載部にそれぞれ配置させる搭載方法、所謂転写法を採用することが多いが、遮光部材25が障害となって最外周部の発光素子14が搭載部に配置され難くなるという問題点があった。 Further, when manufacturing a display device, a jig in which a large number of light emitting elements 14 are housed and arranged in recesses, through holes, etc., respectively, is used, and the jig is turned over on the substrate 1 to place the light emitting element 14 on the substrate 1. A mounting method in which each of the above mounting portions is arranged, or a large number of light emitting elements 14 are arranged on an adhesive sheet, the adhesive sheet is turned over on the substrate 1, and the light emitting elements 14 are arranged in each mounting portion on the substrate 1. In many cases, a so-called transfer method is adopted, but there is a problem that the light-shielding member 25 becomes an obstacle and it becomes difficult for the light emitting element 14 at the outermost periphery to be arranged in the mounting portion.

例えば、図8に示す離隔幅L1(55μm程度)である基板1の周縁部における額縁部1gの幅は20μm〜50μm程度であり、額縁部1gに遮光部材25を配置すると、最外周部の発光素子14と遮光部材25との距離L11は35μm〜5μm程度となり、最外周部の発光素子14から放射された光の一部が遮光部材25によって容易に吸収される。また、転写法で製造する際に遮光部材25が障害となりやすい。また、離隔幅L2(130μm程度)である基板1の周縁部における額縁部1gの幅は110μm程度であり、額縁部1gに遮光部材25を配置すると、最外周部の発光素子14と遮光部材25との距離L21は20μm程度となり、最外周部の発光素子14から放射された光の一部が遮光部材25によって反射されやすい。また、転写法で製造する際に遮光部材25が障害となりやすい。 For example, the width of the frame portion 1g at the peripheral edge portion of the substrate 1 having the separation width L1 (about 55 μm) shown in FIG. 8 is about 20 μm to 50 μm. The distance L11 between the element 14 and the light-shielding member 25 is about 35 μm to 5 μm, and a part of the light radiated from the light-emitting element 14 at the outermost periphery is easily absorbed by the light-shielding member 25. In addition, the light-shielding member 25 tends to be an obstacle during manufacturing by the transfer method. Further, the width of the frame portion 1g at the peripheral edge portion of the substrate 1 having a separation width L2 (about 130 μm) is about 110 μm, and when the light-shielding member 25 is arranged on the frame portion 1g, the light emitting element 14 and the light-shielding member 25 at the outermost peripheral portion are arranged. The distance L21 to and from the light emitting element L21 is about 20 μm, and a part of the light radiated from the light emitting element 14 at the outermost periphery is easily reflected by the light shielding member 25. In addition, the light-shielding member 25 tends to be an obstacle during manufacturing by the transfer method.

そこで、図10に示すように、樹脂絶縁層51の側面51sが基板1の端1tに達しない構成とし、側面51sと端1tの間の基板1上の部位に遮光部材25を配置することによって、上記の問題点を解消することが考えられる。しかしながら、電極パッド2pおよび側面配線1sが遮光部材25から露出しているために、表示装置を視認したときに電極パッド2pcおよび側面配線1sが銀色、白色等の明るい色合いで視認されて目立つこととなる。その結果、表示部11のコントラストが低下して表示品質が劣化するという問題点があった。 Therefore, as shown in FIG. 10, the side surface 51s of the resin insulating layer 51 does not reach the end 1t of the substrate 1, and the light-shielding member 25 is arranged at a portion on the substrate 1 between the side surface 51s and the end 1t. , It is conceivable to solve the above problems. However, since the electrode pad 2p and the side wiring 1s are exposed from the light-shielding member 25, the electrode pad 2pc and the side wiring 1s are visually recognized in bright colors such as silver and white and are conspicuous when the display device is visually recognized. Become. As a result, there is a problem that the contrast of the display unit 11 is lowered and the display quality is deteriorated.

本発明は、上記の問題点に鑑みて完成されたものであり、その目的は、表示部のコントラストが低下して表示品質が劣化することを抑えることであり、また転写法によって表示装置を製造する際に遮光部材が障害となって最外周部の発光素子が搭載部に配置され難くなることを抑えることである。 The present invention has been completed in view of the above problems, and an object of the present invention is to prevent the contrast of the display unit from being lowered and the display quality from being deteriorated, and to manufacture a display device by a transfer method. This is to prevent the light-shielding member from becoming an obstacle and making it difficult for the light emitting element on the outermost periphery to be arranged on the mounting portion.

本発明の表示装置は、基板と、前記基板上に搭載される発光素子と、前記基板上に配置され、前記発光素子に接続されて信号を入力する入力電極と、前記基板上の前記入力電極の外側に配置され、前記入力電極に電気的に接続される電極パッドと、前記電極パッドから前記基板の側面へ引き出されている側面配線と、前記基板上の前記入力電極の外側に配置された遮光部材と、を有する表示装置であって、前記入力電極と前記電極パッドと前記側面配線の前記基板からの高さを比較したときに、前記入力電極は前記電極パッド及び前記側面配線よりも高い位置にあり、前記電極パッド及び前記側面配線は、前記遮光部材によって覆われている構成である。 The display device of the present invention includes a substrate, a light emitting element mounted on the substrate, an input electrode arranged on the substrate and connected to the light emitting element to input a signal, and the input electrode on the substrate. An electrode pad arranged outside the input electrode and electrically connected to the input electrode, side wiring drawn from the electrode pad to the side surface of the substrate, and arranged outside the input electrode on the substrate. In a display device having a light-shielding member, the input electrode is higher than the electrode pad and the side wiring when the heights of the input electrode, the electrode pad, and the side wiring from the substrate are compared. At the position, the electrode pad and the side surface wiring are covered with the light-shielding member.

本発明の表示装置は、好ましくは、前記基板上に複数の層状部材が積層されており、前記遮光部材と、前記複数の層状部材のうち最上層の層状部材と、の前記基板からの高さを比較したときに、前記遮光部材の頂上は前記最上層の層状部材の頂上以下の高さである。 In the display device of the present invention, preferably, a plurality of layered members are laminated on the substrate, and the height of the light-shielding member and the uppermost layered member of the plurality of layered members from the substrate. The top of the light-shielding member is at a height equal to or lower than the top of the uppermost layered member.

また本発明の表示装置は、好ましくは、前記最上層の層状部材は、前記発光素子の周囲に配置された遮光層である。 Further, in the display device of the present invention, preferably, the uppermost layered member is a light-shielding layer arranged around the light emitting element.

また本発明の表示装置は、好ましくは、前記発光素子は、光放射部を有しており、前記光放射部と前記遮光層との前記基板からの高さを比較したときに、前記光放射部は前記遮光層の頂上よりも高い位置にある。 Further, in the display device of the present invention, preferably, the light emitting element has a light emitting unit, and when the heights of the light emitting unit and the light shielding layer from the substrate are compared, the light radiation is emitted. The portion is located higher than the top of the light-shielding layer.

また本発明の表示装置は、好ましくは、前記基板と前記入力電極との間に樹脂絶縁層が配置されており、前記樹脂絶縁層は、その端面が前記基板の端に達しておらず、前記電極パッドと前記側面配線と前記遮光部材は、前記基板上において前記樹脂絶縁層の端面と前記基板の端との間に配置されている。 Further, in the display device of the present invention, preferably, a resin insulating layer is arranged between the substrate and the input electrode, and the end face of the resin insulating layer does not reach the end of the substrate. The electrode pad, the side surface wiring, and the light-shielding member are arranged on the substrate between the end surface of the resin insulating layer and the end of the substrate.

また本発明の表示装置は、好ましくは、前記樹脂絶縁層は、複数のものが積層された積層構造とされている。 Further, the display device of the present invention preferably has a laminated structure in which a plurality of resin insulating layers are laminated.

本発明の発光装置は、基板と、前記基板上に搭載される発光素子と、前記基板上に配置され、前記発光素子に接続されて信号を入力する入力電極と、前記基板上の前記入力電極の外側に配置され、前記入力電極に電気的に接続される電極パッドと、前記電極パッドから前記基板の側面へ引き出されている側面配線と、前記基板上の前記入力電極の外側に配置された遮光部材と、を有する表示装置であって、前記入力電極と前記電極パッドと前記側面配線の前記基板からの高さを比較したときに、前記入力電極は前記電極パッド及び前記側面配線よりも高い位置にあり、前記電極パッド及び前記側面配線は、前記遮光部材によって覆われている構成であることから、以下の効果を奏する。表示装置を視認したときに電極パッド及び側面配線が銀色、白色等の明るい色合いで視認されて目立つことがなくなる。その結果、表示部のコントラストの低下を防いで表示品質を高品質のものとすることができる。また、遮光部材は、入力電極よりも低い位置にある、電極パッド及び側面配線を覆っているので、遮光部材の頂上の高さが入力電極の位置よりも高くなることを抑えることができる。その結果、発光素子から放射された光の一部が遮光部材によって反射されにくくなる。また、転写法によって表示装置を製造する際に遮光部材が障害となりにくくなるので、最外周部の発光素子を基板上に配置することが容易になる。 The light emitting device of the present invention includes a substrate, a light emitting element mounted on the substrate, an input electrode arranged on the substrate and connected to the light emitting element to input a signal, and the input electrode on the substrate. An electrode pad arranged outside the input electrode and electrically connected to the input electrode, side wiring drawn from the electrode pad to the side surface of the substrate, and arranged outside the input electrode on the substrate. In a display device having a light-shielding member, the input electrode is higher than the electrode pad and the side wiring when the heights of the input electrode, the electrode pad, and the side wiring from the substrate are compared. Since the electrode pad and the side surface wiring are located at the position and are covered with the light-shielding member, the following effects are obtained. When the display device is visually recognized, the electrode pads and the side wiring are visually recognized in bright colors such as silver and white, and are not noticeable. As a result, it is possible to prevent a decrease in the contrast of the display unit and improve the display quality. Further, since the light-shielding member covers the electrode pad and the side wiring located at a position lower than the input electrode, it is possible to prevent the height of the top of the light-shielding member from becoming higher than the position of the input electrode. As a result, a part of the light emitted from the light emitting element is less likely to be reflected by the light-shielding member. Further, since the light-shielding member is less likely to be an obstacle when the display device is manufactured by the transfer method, it becomes easy to arrange the light emitting element at the outermost periphery on the substrate.

本発明の表示装置は、前記基板上に複数の層状部材が積層されており、前記遮光部材と、前記複数の層状部材のうち最上層の層状部材と、の前記基板からの高さを比較したときに、前記遮光部材の頂上は前記最上層の層状部材の頂上以下の高さである場合、発光素子から放射された光の一部が遮光部材によって反射されることをより確実に抑えることができる。また、転写法によって表示装置を製造する際に遮光部材がより障害となりにくくなるので、最外周部の発光素子を基板上に配置することがより容易になる。 In the display device of the present invention, a plurality of layered members are laminated on the substrate, and the heights of the light-shielding member and the uppermost layered member of the plurality of layered members from the substrate are compared. Sometimes, when the top of the light-shielding member is at a height equal to or lower than the top of the uppermost layered member, it is possible to more reliably suppress that a part of the light emitted from the light emitting element is reflected by the light-shielding member. it can. Further, since the light-shielding member is less likely to be an obstacle when the display device is manufactured by the transfer method, it becomes easier to arrange the light emitting element at the outermost periphery on the substrate.

また本発明の表示装置は、前記最上層の層状部材は、前記発光素子の周囲に配置された遮光層である場合、発光素子から放射された光の大部分を遮光層で吸収することができ、表示部を視認したときに発光素子以外のものが目立たないようにすることができるとともにコントラストを向上させることができ、表示品質を良好なものとし得る。 Further, in the display device of the present invention, when the uppermost layered member is a light-shielding layer arranged around the light-emitting element, most of the light radiated from the light-emitting element can be absorbed by the light-shielding layer. It is possible to make things other than the light emitting element inconspicuous when the display unit is visually recognized, and to improve the contrast, so that the display quality can be improved.

また本発明の表示装置は、前記発光素子は、光放射部を有しており、前記光放射部と前記遮光層との前記基板からの高さを比較したときに、前記光放射部は前記遮光層の頂上よりも高い位置にある場合、発光素子から放射された光の一部が遮光層で反射されることを抑えて、コントラスト低下を抑えることができる。 Further, in the display device of the present invention, the light emitting element has a light emitting unit, and when the heights of the light emitting unit and the light shielding layer from the substrate are compared, the light emitting unit is said to be said. When it is located higher than the top of the light-shielding layer, it is possible to suppress a part of the light radiated from the light emitting element from being reflected by the light-shielding layer and suppress a decrease in contrast.

また本発明の表示装置は、前記基板と前記入力電極との間に樹脂絶縁層が配置されており、前記樹脂絶縁層は、その端面が前記基板の端に達しておらず、前記電極パッドと前記側面配線と前記遮光部材は、前記基板上において前記樹脂絶縁層の端面と前記基板の端との間に配置されている場合、樹脂絶縁層が入力電極の位置を高くする嵩上げ部材として機能し、また樹脂絶縁層の端面が遮光部材の配置位置を規定する堤防、仕切り壁等として機能するので、遮光部材が樹脂絶縁層上に乗り上げて遮光部材の頂上が入力電極よりも高い位置に誤配置されることを効果的に抑えることができる。 Further, in the display device of the present invention, a resin insulating layer is arranged between the substrate and the input electrode, and the end face of the resin insulating layer does not reach the end of the substrate, and the resin insulating layer and the electrode pad When the side surface wiring and the light-shielding member are arranged between the end face of the resin insulating layer and the edge of the substrate on the substrate, the resin insulating layer functions as a raising member for raising the position of the input electrode. In addition, since the end face of the resin insulating layer functions as a bank, a partition wall, etc. that defines the placement position of the light-shielding member, the light-shielding member rides on the resin insulating layer and the top of the light-shielding member is misplaced at a position higher than the input electrode. It can be effectively suppressed.

また本発明の表示装置は、前記樹脂絶縁層は、複数のものが積層された積層構造とされている場合、樹脂絶縁層が入力電極の位置を高くする嵩上げ部材として機能し、また樹脂絶縁層の端面が遮光部材の配置位置を規定する堤防、仕切り壁等として機能するという効果が向上する。 Further, in the display device of the present invention, when the resin insulating layer has a laminated structure in which a plurality of the resin insulating layers are laminated, the resin insulating layer functions as a raising member for raising the position of the input electrode, and the resin insulating layer also functions as a raising member. The effect that the end face of the light-shielding member functions as a dike, a partition wall, etc. that defines the arrangement position of the light-shielding member is improved.

図1は、本発明の表示装置について実施の形態の1例を示す図であり、表示装置の遮光部材およびそれに最も近い発光素子の部分断面図である。FIG. 1 is a diagram showing an example of an embodiment of the display device of the present invention, and is a partial cross-sectional view of a light-shielding member of the display device and a light emitting element closest thereto. 図2は、本発明の表示装置について実施の形態の他例を示す図であり、表示装置の遮光部材およびそれに最も近い発光素子の部分断面図である。FIG. 2 is a diagram showing another example of the embodiment of the display device of the present invention, and is a partial cross-sectional view of a light-shielding member of the display device and a light emitting element closest thereto. 図3は、従来の表示装置の一例を示す図であり、表示装置の基本構成のブロック回路図である。FIG. 3 is a diagram showing an example of a conventional display device, and is a block circuit diagram of a basic configuration of the display device. 図4は、図3の表示装置の下面図である。FIG. 4 is a bottom view of the display device of FIG. 図5は、図3の表示装置のA1−A2線における断面図である。FIG. 5 is a cross-sectional view taken along the line A1-A2 of the display device of FIG. 図6は、図3の表示装置において一つの発光素子とそれに接続された発光制御部の回路図である。FIG. 6 is a circuit diagram of one light emitting element and a light emitting control unit connected to the light emitting element in the display device of FIG. 図7は、従来の表示装置の他例を示す図であり、表示装置の基本構成のブロック回路図である。FIG. 7 is a diagram showing another example of the conventional display device, and is a block circuit diagram of a basic configuration of the display device. 図8は、図7の表示装置において一つの発光素子とそれに接続された発光制御部の回路図である。FIG. 8 is a circuit diagram of one light emitting element and a light emitting control unit connected to the light emitting element in the display device of FIG. 7. 図9は、図8のB1−B2線における断面図である。FIG. 9 is a cross-sectional view taken along the line B1-B2 of FIG. 図10は、従来の表示装置の他例を示す図であり、図8のB1−B2線における断面図に相当する断面図である。FIG. 10 is a view showing another example of the conventional display device, and is a cross-sectional view corresponding to the cross-sectional view taken along the line B1-B2 of FIG.

以下、本発明の表示装置の実施の形態について、図面を参照しながら説明する。但し、以下で参照する各図は、本発明の表示装置の実施の形態における構成部材のうち、本発明の表示装置を説明するための主要部を示している。従って、本発明に係る表示装置は、図に示されていない回路基板、配線導体、制御IC,LSI等の周知の構成部材を備えていてもよい。なお、本発明の表示装置の実施の形態を示す図1、図2において、図3〜図10と同じ部位には同じ符号を付しており、それらの詳細な説明は省く。 Hereinafter, embodiments of the display device of the present invention will be described with reference to the drawings. However, each figure referred to below shows a main part for explaining the display device of the present invention among the constituent members in the embodiment of the display device of the present invention. Therefore, the display device according to the present invention may include well-known components such as a circuit board, a wiring conductor, a control IC, and an LSI (not shown in the figure). In FIGS. 1 and 2 showing the embodiment of the display device of the present invention, the same parts as those in FIGS. 3 to 10 are designated by the same reference numerals, and detailed description thereof will be omitted.

図1、図2は、本発明の表示装置について実施の形態の各種例を示す図である。これらの図に示すように、本発明の表示装置は、ガラス基板等から成る基板1と、基板1上に搭載される発光素子14と、基板1上に配置され、発光素子14に接続された信号を入力する入力電極としての正電極54aおよび負電極54bと、基板1上の正電極54aおよび負電極54bの外側に配置され、正電極54aに電気的に接続される電極パッド2pと、電極パッド2pから基板1の側面へ引き出されている側面配線1sと、基板1上の正電極54aおよび負電極54bの外側に配置された遮光部材25と、を有する表示装置であって、正電極54aおよび負電極54bと電極パッド2pと側面配線1sの基板1からの高さを比較したときに、正電極54aおよび負電極54bは電極パッド2p及び側面配線1sよりも高い位置にあり、電極パッド2p及び側面配線1sは、遮光部材25によって覆われている構成である。 1 and 2 are diagrams showing various examples of embodiments of the display device of the present invention. As shown in these figures, the display device of the present invention is arranged on a substrate 1 made of a glass substrate or the like, a light emitting element 14 mounted on the substrate 1, and connected to the light emitting element 14. Positive electrodes 54a and negative electrodes 54b as input electrodes for inputting signals, electrode pads 2p arranged outside the positive electrodes 54a and negative electrodes 54b on the substrate 1 and electrically connected to the positive electrodes 54a, and electrodes. A display device having a side surface wiring 1s drawn from the pad 2p to the side surface of the substrate 1 and a light-shielding member 25 arranged outside the positive electrode 54a and the negative electrode 54b on the substrate 1, wherein the positive electrode 54a is provided. When the heights of the negative electrode 54b, the electrode pad 2p, and the side wiring 1s from the substrate 1 are compared, the positive electrode 54a and the negative electrode 54b are located higher than the electrode pad 2p and the side wiring 1s, and the electrode pad 2p The side wiring 1s and the side wiring 1s are covered with a light-shielding member 25.

上記の構成により、以下の効果を奏する。表示装置を視認したときに電極パッド2p及び側面配線1sが銀色、白色等の明るい色合いで視認されて目立つことがなくなる。その結果、表示部11のコントラストの低下を防いで表示品質を高品質のものとすることができる。また、遮光部材25は、正電極54aおよび負電極54bよりも低い位置にある、電極パッド2p及び側面配線1sを覆っているので、遮光部材25の頂上の高さが正電極54aおよび負電極54bの位置よりも高くなることを抑えることができる。その結果、発光素子14から放射された光の一部が遮光部材25によって反射されにくくなり、また転写法によって表示装置を製造する際に遮光部材25が障害となりにくくなるので、最外周部の発光素子14を基板1上に配置することが容易になる。 The above configuration produces the following effects. When the display device is visually recognized, the electrode pad 2p and the side wiring 1s are visually recognized in bright colors such as silver and white, and are not noticeable. As a result, it is possible to prevent a decrease in the contrast of the display unit 11 and improve the display quality. Further, since the light-shielding member 25 covers the electrode pad 2p and the side wiring 1s located lower than the positive electrode 54a and the negative electrode 54b, the height of the top of the light-shielding member 25 is the positive electrode 54a and the negative electrode 54b. It can be suppressed that it becomes higher than the position of. As a result, a part of the light radiated from the light emitting element 14 is less likely to be reflected by the light-shielding member 25, and the light-shielding member 25 is less likely to be an obstacle when manufacturing the display device by the transfer method. It becomes easy to arrange the element 14 on the substrate 1.

本発明の表示装置において、発光素子14としては、マイクロチップ型の発光ダイオード(LED)、モノリシック型の発光ダイオード、有機EL、無機EL、半導体レーザ素子等の自発光型のものであれば採用し得る。 In the display device of the present invention, as the light emitting element 14, any self-luminous element such as a microchip type light emitting diode (LED), a monolithic type light emitting diode, an organic EL, an inorganic EL, or a semiconductor laser element is adopted. obtain.

遮光部材25は、額縁部1gが目立たないようにする目的、また基板1の側面に配置される側面配線1sを保護する目的で配置される。従って、遮光部材25は基板1の側面に延出させて配置することが好ましい。また、複数の発光素子14を搭載した基板1の複数を、同じ面上において縦横に配置するとともにそれらの側面同士を接着材等によって結合(タイリング)させることによって、複合型かつ大型の表示装置、所謂マルチディスプレイを製造する場合に、遮光部材25が存在することによってタイリングの継ぎ目が目立ちにくくなる。 The light-shielding member 25 is arranged for the purpose of making the frame portion 1g inconspicuous and for the purpose of protecting the side wiring 1s arranged on the side surface of the substrate 1. Therefore, it is preferable that the light-shielding member 25 is arranged so as to extend to the side surface of the substrate 1. Further, by arranging a plurality of substrates 1 on which a plurality of light emitting elements 14 are mounted vertically and horizontally on the same surface and connecting (tiling) the side surfaces thereof with an adhesive or the like, a composite type and large-sized display device. In the case of manufacturing a so-called multi-display, the presence of the light-shielding member 25 makes the tiling seams less noticeable.

遮光部材25は、黒色、黒褐色、濃褐色、濃青色、濃紫色等の暗色系のもので可視光を効率良く吸収し遮光する色合いのものであり、例えば透明な樹脂層中に暗色系の顔料、染料等を混入させて構成された遮光膜、または接着、粘着等によって設置されるシール状のもの、または接着、粘着等によって設置されるプラスチック等から成る枠状体などから構成される。この遮光部材25によって、可視光の大部分を吸収して遮光することができる。 The light-shielding member 25 is a dark-colored material such as black, black-brown, dark brown, dark blue, or dark purple, and has a color that efficiently absorbs visible light and blocks light. For example, a dark-colored pigment in a transparent resin layer. , A light-shielding film formed by mixing dyes, etc., a seal-like material installed by adhesion, adhesion, etc., or a frame-like body made of plastic, etc., installed by adhesion, adhesion, etc. The light-shielding member 25 can absorb most of the visible light to block light.

遮光部材25は、上記の遮光膜である場合、暗色系の顔料、染料等を混入させた未硬化の樹脂ペーストを、基板1上の額縁部1gに、塗布法、マスクを用いた印刷法、ローラー印刷法等によって塗布、印刷して配置し、熱硬化法、紫外線等の照射による光硬化法、光熱硬化法等によって硬化させることにより形成される。 When the light-shielding member 25 is the above-mentioned light-shielding film, an uncured resin paste mixed with a dark-colored pigment, a dye, or the like is applied to 1 g of a frame portion on the substrate 1 by a coating method or a printing method using a mask. It is formed by applying, printing, and arranging by a roller printing method or the like, and curing by a thermosetting method, a photocuring method by irradiating ultraviolet rays, a photocuring method, or the like.

遮光部材25の幅は、額縁部1gの幅とほぼ同じである。例えば、幅の小さい方の額縁部1g、例えば図8において基板1の上側の辺部にある額縁部1g、の幅が20μm〜50μm程度であることから、幅の小さい方の額縁部1gに配置される遮光部材25の幅は20μm〜50μm程度である。幅の大きい方の額縁部1g、例えば図8において基板1の左側の辺部にある額縁部1g、の幅が110μm程度であることから、幅の大きい方の額縁部1gに配置される遮光部材25の幅は110μm程度である。 The width of the light-shielding member 25 is substantially the same as the width of the frame portion 1 g. For example, since the width of the smaller frame portion 1 g, for example, the frame portion 1 g on the upper side portion of the substrate 1 in FIG. 8 is about 20 μm to 50 μm, it is arranged in the smaller width frame portion 1 g. The width of the light-shielding member 25 to be formed is about 20 μm to 50 μm. Since the width of the wider frame portion 1 g, for example, the frame portion 1 g on the left side side of the substrate 1 in FIG. 8 is about 110 μm, the light-shielding member arranged on the wider frame portion 1 g. The width of 25 is about 110 μm.

また本発明の表示装置は、基板1上に複数の層状部材が積層されており、遮光部材25と、複数の層状部材のうち最上層の層状部材と、の基板1からの高さを比較したときに、遮光部材25の頂上は最上層の層状部材の頂上以下の高さであることが好ましい。図1の構成の場合、遮光部材25の頂上の高さh1が、最上層の層状部材である遮光層56の頂上の高さh3以下の高さであることが好ましい。この場合、発光素子14から放射された光の一部が遮光部材25によって反射されることをより確実に抑えることができる。また、転写法によって表示装置を製造する際に遮光部材がより障害となりにくくなるので、最外周部の発光素子を基板上に配置することがより容易になる。なお、複数の層状部材は、図1の構成の場合、樹脂絶縁層51、絶縁層55、遮光層56であり、図2の構成の場合、樹脂絶縁層51a,51b、絶縁層55、遮光層56である。 Further, in the display device of the present invention, a plurality of layered members are laminated on the substrate 1, and the heights of the light-shielding member 25 and the uppermost layered member among the plurality of layered members are compared with respect to the substrate 1. Occasionally, the top of the light-shielding member 25 is preferably at a height equal to or lower than the top of the uppermost layered member. In the case of the configuration of FIG. 1, the height h1 of the top of the light-shielding member 25 is preferably a height h3 or less of the height of the top of the light-shielding layer 56, which is the uppermost layered member. In this case, it is possible to more reliably suppress that a part of the light emitted from the light emitting element 14 is reflected by the light shielding member 25. Further, since the light-shielding member is less likely to be an obstacle when the display device is manufactured by the transfer method, it becomes easier to arrange the light emitting element at the outermost periphery on the substrate. In the case of the configuration of FIG. 1, the plurality of layered members are the resin insulating layer 51, the insulating layer 55, and the light-shielding layer 56, and in the case of the configuration of FIG. 2, the resin insulating layers 51a and 51b, the insulating layer 55, and the light-shielding layer 56. 56.

また本発明の表示装置は、最上層の層状部材は、発光素子14の周囲に配置された遮光層56であることが好ましい。この場合、発光素子14から放射された光の大部分を遮光層56で吸収することができ、表示部を視認したときに発光素子14以外のものが目立たないようにすることができるとともにコントラストを向上させることができ、表示品質を良好なものとし得る。遮光層56は、必ずしも最上層でなくてもよく、基板1の発光素子搭載面上に配置されていてもよい。 Further, in the display device of the present invention, the layered member of the uppermost layer is preferably a light-shielding layer 56 arranged around the light emitting element 14. In this case, most of the light radiated from the light emitting element 14 can be absorbed by the light shielding layer 56, so that when the display unit is visually recognized, anything other than the light emitting element 14 can be made inconspicuous and the contrast can be improved. It can be improved and the display quality can be improved. The light-shielding layer 56 does not necessarily have to be the uppermost layer, and may be arranged on the light emitting element mounting surface of the substrate 1.

また本発明の表示装置は、発光素子14は、その上面等に光放射部14aを有しており、光放射部14aと遮光層25との基板1からの高さを比較したときに、光放射部14aは遮光層25の頂上よりも高い位置にあることが好ましい。この場合、発光素子14から放射された光の一部が遮光層25で反射されることを抑えて、コントラスト低下を抑えることができる。 Further, in the display device of the present invention, the light emitting element 14 has a light emitting portion 14a on its upper surface or the like, and when the heights of the light emitting portion 14a and the light shielding layer 25 from the substrate 1 are compared, the light is emitted. The radiation portion 14a is preferably located higher than the top of the light shielding layer 25. In this case, it is possible to suppress a part of the light radiated from the light emitting element 14 from being reflected by the light-shielding layer 25, and to suppress a decrease in contrast.

また、光放射部14aは発光素子14の上面にあることが多いが、横断面でみたときに発光素子14の内部にあってもよく、その場合光放射部14aの高さが遮光部材25の頂上よりも高い位置にあってもよい。この場合、発光素子14から放射された光の一部は、遮光部材25で反射されにくくなるので、コントラスト低下、画面の額縁部が目立つことによる表示品位の低下を抑えることができる。 Further, although the light emitting portion 14a is often located on the upper surface of the light emitting element 14, it may be inside the light emitting element 14 when viewed in cross section. In that case, the height of the light emitting portion 14a is the light shielding member 25. It may be higher than the top. In this case, a part of the light radiated from the light emitting element 14 is less likely to be reflected by the light-shielding member 25, so that it is possible to suppress a decrease in contrast and a decrease in display quality due to the conspicuous frame portion of the screen.

正電極54aおよび負電極54bが遮光部材25の頂上以上の高さの位置にある(h2≧h1である)ことがより好ましく、この場合、発光素子14から放射された光の一部が遮光部材25によって反射されることをより確実に抑えることができ、また転写法によって表示装置を製造する際に遮光部材25がより障害となりにくくなるので、最外周部の発光素子14を基板1上に配置することがより容易になる。 It is more preferable that the positive electrode 54a and the negative electrode 54b are located at a height higher than the top of the light-shielding member 25 (h2 ≧ h1). In this case, a part of the light emitted from the light emitting element 14 is the light-shielding member. Since it is possible to more reliably suppress the reflection by the 25 and the light-shielding member 25 is less likely to be an obstacle when manufacturing the display device by the transfer method, the light emitting element 14 at the outermost periphery is arranged on the substrate 1. It will be easier to do.

また遮光部材25は、基板1からの高さについて、基板1の発光素子14が搭載される側の面(発光素子搭載面)からの頂上の高さh1が2μm〜10μm程度である。また正電極54aおよび負電極54bは、上記の通り基板1からの高さを比較したときに遮光部材25の頂上以上の高さ位置にあることがより好ましく、正電極54aおよび負電極54bの発光素子搭載面からの高さh2はh1と同程度であるか3μm程度高い。 The height h1 of the top of the light-shielding member 25 from the surface of the substrate 1 on which the light-emitting element 14 is mounted (the surface on which the light-emitting element is mounted) is about 2 μm to 10 μm. Further, the positive electrode 54a and the negative electrode 54b are more preferably located at a height above the top of the light-shielding member 25 when the heights from the substrate 1 are compared as described above, and the positive electrode 54a and the negative electrode 54b emit light. The height h2 from the element mounting surface is about the same as h1 or about 3 μm higher.

本発明の表示装置は、複数の発光素子14がある場合に、それらのすべてについて正電極54aおよび負電極54bが遮光部材25の頂上以上の高さの位置にある(h2≧h1である)ことが好ましい。この場合、複数の発光素子14から放射された光の一部が遮光部材25によって反射することを抑えることができ、コントラスト低下を抑えることができる。さらには、複数の発光素子14のすべてについて正電極54aおよび負電極54bが同じ高さであることが良い。この場合、転写法によって表示装置を製造する際に、遮光部材25が障害となることがなく、複数の発光素子14のすべてをそれらの搭載部(正電極54aおよび負電極54b)上にほぼ同時に設置することができる。その結果、複数の発光素子14のどれかが設置タイミングがずれることによって設置位置がずれやすくなることを抑えることができる。 In the display device of the present invention, when there are a plurality of light emitting elements 14, the positive electrode 54a and the negative electrode 54b are located at a height higher than the top of the light-shielding member 25 (h2 ≧ h1) for all of them. Is preferable. In this case, it is possible to suppress that a part of the light radiated from the plurality of light emitting elements 14 is reflected by the light-shielding member 25, and it is possible to suppress a decrease in contrast. Further, it is preferable that the positive electrode 54a and the negative electrode 54b have the same height for all of the plurality of light emitting elements 14. In this case, when the display device is manufactured by the transfer method, the light-shielding member 25 does not become an obstacle, and all of the plurality of light emitting elements 14 are placed on their mounting portions (positive electrode 54a and negative electrode 54b) substantially at the same time. Can be installed. As a result, it is possible to prevent the installation position of any of the plurality of light emitting elements 14 from being easily displaced due to the deviation of the installation timing.

また本発明の表示装置は、複数の発光素子14がある場合に、それらのうち遮光部材25に最も近い発光素子14は、基板1からの高さを比較したときに基板1上のすべての部材のなかで最も高い位置にあることが好ましい。この場合、遮光部材25に最も近い発光素子14から放射された光の一部は、基板1上の他の部材によって反射されにくくなるので、コントラスト低下をより抑えることができる。また転写法によって表示装置を製造する際に基板1上の部材が障害となりにくくなるので、最外周部の発光素子14をその搭載部に配置することがより容易になる。例えば、図1、図2に示すように、基板1上の最上部には遮光層56があるが、遮光部材25に最も近い発光素子14が遮光層56の頂上よりも高い位置にあることがよい。 Further, in the display device of the present invention, when there are a plurality of light emitting elements 14, the light emitting element 14 closest to the light shielding member 25 is all the members on the substrate 1 when the heights from the substrate 1 are compared. It is preferably in the highest position among them. In this case, a part of the light radiated from the light emitting element 14 closest to the light-shielding member 25 is less likely to be reflected by other members on the substrate 1, so that the decrease in contrast can be further suppressed. Further, since the member on the substrate 1 is less likely to be an obstacle when the display device is manufactured by the transfer method, it becomes easier to arrange the light emitting element 14 on the outermost peripheral portion on the mounting portion thereof. For example, as shown in FIGS. 1 and 2, there is a light-shielding layer 56 at the uppermost portion on the substrate 1, but the light emitting element 14 closest to the light-shielding member 25 may be located higher than the top of the light-shielding layer 56. Good.

また、複数の発光素子14がある場合に、それらのすべてが基板1上のすべての部材のなかで最も高い位置にあることが好ましい。この場合、複数の発光素子14から放射された光は、基板1上の他の部材によって反射されにくくなるので、コントラスト低下をさらに抑えることができる。さらには、複数の発光素子14のすべてについて正電極54aおよび負電極54bが同じ高さであることが良く、転写法によって表示装置を製造する際に、基板1上の他の部材が障害となることがなく、複数の発光素子14のすべてをそれらの搭載部(正電極54aおよび負電極54b)上にほぼ同時に設置することができる。その結果、複数の発光素子14のどれかが設置タイミングがずれることによって設置位置がずれやすくなることを抑えることができる。 Further, when there are a plurality of light emitting elements 14, it is preferable that all of them are at the highest position among all the members on the substrate 1. In this case, the light radiated from the plurality of light emitting elements 14 is less likely to be reflected by other members on the substrate 1, so that the decrease in contrast can be further suppressed. Further, it is preferable that the positive electrode 54a and the negative electrode 54b have the same height for all of the plurality of light emitting elements 14, and other members on the substrate 1 become obstacles when the display device is manufactured by the transfer method. All of the plurality of light emitting elements 14 can be installed on their mounting portions (positive electrode 54a and negative electrode 54b) at substantially the same time. As a result, it is possible to prevent the installation position of any of the plurality of light emitting elements 14 from being easily displaced due to the deviation of the installation timing.

また本発明の表示装置は、図1に示すように、基板1と正電極54aおよび負電極54bとの間に樹脂絶縁層51が配置されており、樹脂絶縁層51は、その端面51tが基板1の端1tに達しておらず、電極パッド2pと側面配線1sと遮光部材25は、基板1上において樹脂絶縁層51の端面51tと基板1の端1tとの間に配置されていることが好ましい。この場合、樹脂絶縁層51が正電極54aおよび負電極54bの位置を高くする嵩上げ部材と機能し、また樹脂絶縁層51の端面51tが遮光部材25の配置位置を規定する堤防、仕切り壁等として機能するので、遮光部材25が樹脂絶縁層51上に乗り上げて遮光部材25の頂上が正電極54aおよび負電極54bよりも高い位置に誤配置されることを効果的に抑えることができる。また、電極パッド2pが側面配線1sに近接しているので、それらの接続性が向上し、断線等の接続不良の発生を抑えることができる。 Further, in the display device of the present invention, as shown in FIG. 1, a resin insulating layer 51 is arranged between the substrate 1 and the positive electrode 54a and the negative electrode 54b, and the resin insulating layer 51 has an end face 51t of the substrate. The electrode pad 2p, the side wiring 1s, and the light-shielding member 25 are arranged on the substrate 1 between the end surface 51t of the resin insulating layer 51 and the end 1t of the substrate 1, not reaching the end 1t of 1. preferable. In this case, the resin insulating layer 51 functions as a raising member for raising the positions of the positive electrode 54a and the negative electrode 54b, and the end surface 51t of the resin insulating layer 51 serves as an embankment, a partition wall, or the like that defines the arrangement position of the light-shielding member 25. Since it functions, it is possible to effectively prevent the light-shielding member 25 from riding on the resin insulating layer 51 and erroneously arranging the top of the light-shielding member 25 at a position higher than the positive electrode 54a and the negative electrode 54b. Further, since the electrode pads 2p are close to the side wiring 1s, their connectivity is improved, and the occurrence of poor connection such as disconnection can be suppressed.

また本発明の表示装置は、樹脂絶縁層51の端面51tは、基板1の端1t側に向かうに伴って厚みが薄くなる傾斜面とされており、遮光部材25は、樹脂絶縁層51の端面51tに重なっていることが好ましい。この場合、樹脂絶縁層51の端面51tの長さが長くなる。その結果、遮光部材25が樹脂絶縁層51上に乗り上げて遮光部材25の頂上が正電極54aおよび負電極54bよりも高い位置に誤配置されることをより効果的に抑えることができる。すなわち、遮光部材25を塗布法、印刷法等によって形成する際に、端面51tが垂直面よりも長さが長い斜面であることから、遮光部材25の発光素子14側への侵入を効果的に阻止することができる。斜面とされた端面51tの基板1の発光素子搭載面に対する傾斜角度は20°〜70°程度が良い。20°未満では、樹脂絶縁層51の端面51tの長さ(幅)が長くなり額縁部1gが大きくなる傾向がある。70°を超えると、端面51tの長さが垂直面の長さに近くなるために、遮光部材25の発光素子14側への侵入を阻止する効果が低下しやすくなる傾向がある。 Further, in the display device of the present invention, the end surface 51t of the resin insulating layer 51 is an inclined surface whose thickness becomes thinner toward the end 1t side of the substrate 1, and the light-shielding member 25 is the end surface of the resin insulating layer 51. It is preferable that it overlaps with 51t. In this case, the length of the end face 51t of the resin insulating layer 51 becomes long. As a result, it is possible to more effectively prevent the light-shielding member 25 from riding on the resin insulating layer 51 and erroneously arranging the top of the light-shielding member 25 at a position higher than the positive electrode 54a and the negative electrode 54b. That is, when the light-shielding member 25 is formed by a coating method, a printing method, or the like, since the end surface 51t is a slope having a length longer than the vertical surface, the light-shielding member 25 effectively penetrates into the light emitting element 14 side. It can be stopped. The inclination angle of the end surface 51t, which is a slope, with respect to the light emitting element mounting surface of the substrate 1 is preferably about 20 ° to 70 °. If it is less than 20 °, the length (width) of the end face 51t of the resin insulating layer 51 tends to be long, and the frame portion 1g tends to be large. If it exceeds 70 °, the length of the end surface 51t becomes close to the length of the vertical surface, so that the effect of preventing the light-shielding member 25 from entering the light emitting element 14 side tends to be reduced.

また、樹脂絶縁層51が複数の樹脂絶縁層を積層させた積層構造とされていてもよい。この場合、樹脂絶縁層51が正電極54aおよび負電極54bの位置を高くする嵩上げ部材として機能し、また樹脂絶縁層51の端面51tが遮光部材25の配置位置を規定する堤防、仕切り壁等として機能するという効果が向上する。さらに、樹脂絶縁層51が複数の樹脂絶縁層を積層させた積層構造とされており、図2の構成を採ることもできる。図2の場合、樹脂絶縁層51a,51bの2層であるが、3層以上であってもよい。下層である樹脂絶縁層51aの端面51atは基板1の端1tにほぼ達しているが、上層である樹脂絶縁層51bの端面51btは基板1の端1tに達していない。樹脂絶縁層51a上において、樹脂絶縁層51bの端面51btと基板1の端1tとの間の部位に、電極パッド2pと側面配線1sと遮光部材25が配置される。この場合、樹脂絶縁層51の厚みをより厚くすることが容易になる。また、樹脂絶縁層51bの厚みを樹脂絶縁層51aの厚みより厚くすることによって、遮光部材25の高さが正電極54aおよび負電極54bの高さよりも低くなるように調整することが容易になる。 Further, the resin insulating layer 51 may have a laminated structure in which a plurality of resin insulating layers are laminated. In this case, the resin insulating layer 51 functions as a raising member for raising the positions of the positive electrode 54a and the negative electrode 54b, and the end surface 51t of the resin insulating layer 51 serves as a dike, a partition wall, or the like that defines the arrangement position of the light-shielding member 25. The effect of functioning is improved. Further, the resin insulating layer 51 has a laminated structure in which a plurality of resin insulating layers are laminated, and the configuration shown in FIG. 2 can be adopted. In the case of FIG. 2, the resin insulating layers 51a and 51b are two layers, but may be three or more layers. The end surface 51at of the resin insulating layer 51a, which is the lower layer, substantially reaches the end 1t of the substrate 1, but the end surface 51bt of the resin insulating layer 51b, which is the upper layer, does not reach the end 1t of the substrate 1. On the resin insulating layer 51a, the electrode pad 2p, the side wiring 1s, and the light-shielding member 25 are arranged at a portion between the end surface 51bt of the resin insulating layer 51b and the end 1t of the substrate 1. In this case, it becomes easy to increase the thickness of the resin insulating layer 51. Further, by making the thickness of the resin insulating layer 51b thicker than the thickness of the resin insulating layer 51a, it becomes easy to adjust the height of the light-shielding member 25 to be lower than the heights of the positive electrode 54a and the negative electrode 54b. ..

なお、図2の構成において、樹脂絶縁層51が1層であって、段差を有しており、段差から低い方の部位に電極パッド2pと側面配線1sと遮光部材25が配置され、段差から高い方の部位に正電極54aおよび負電極54bが配置されていてもよい。 In the configuration of FIG. 2, the resin insulating layer 51 is one layer and has a step, and the electrode pad 2p, the side wiring 1s, and the light-shielding member 25 are arranged at a portion lower than the step, and from the step. The positive electrode 54a and the negative electrode 54b may be arranged at the higher portion.

本発明の表示装置における発光制御部22は、発光素子14のそれぞれに発光信号を入力するためのTFT等から成るスイッチ素子を少なくとも1つ有する。発光制御部22は、例えば図8に示すように、発光素子14のそれぞれに発光信号を入力するためのスイッチ素子としてのTFT12と、発光制御信号(発光制御信号線3を伝達する信号)のレベル(電圧)に応じた、正電圧(アノード電圧:3〜5V程度)と負電圧(カソード電圧:−3V〜0V程度)の電位差(発光信号)から発光素子14を電流駆動するための駆動素子としてのTFT13と、を含む。TFT13のゲート電極とソース電極とを接続する接続線上には容量素子が配置されており、容量素子はTFT13のゲート電極に入力された発光制御信号の電圧を次の書き換えまでの期間(1フレームの期間)保持する保持容量として機能する。 The light emission control unit 22 in the display device of the present invention has at least one switch element including a TFT or the like for inputting a light emission signal to each of the light emitting elements 14. As shown in FIG. 8, for example, the light emission control unit 22 has a TFT 12 as a switch element for inputting a light emission signal to each of the light emission elements 14, and a level of the light emission control signal (a signal transmitted through the light emission control signal line 3). As a driving element for driving the light emitting element 14 with a current from a potential difference (light emitting signal) between a positive voltage (anode voltage: about 3 to 5V) and a negative voltage (cathode voltage: about -3V to 0V) according to (voltage). Includes TFT 13 and. A capacitive element is arranged on the connection line connecting the gate electrode and the source electrode of the TFT 13, and the capacitive element changes the voltage of the light emission control signal input to the gate electrode of the TFT 13 until the next rewriting (one frame). Period) Functions as a holding capacity to hold.

また本発明の表示装置は、基板1の側面に、走査信号線2、発光制御信号線3に接続される側面配線1sが配置されているが、これにより貫通導体と比較して額縁部1gの幅を小さくすることができる。 Further, in the display device of the present invention, the side wiring 1s connected to the scanning signal line 2 and the light emission control signal line 3 is arranged on the side surface of the substrate 1, whereby the frame portion 1 g is arranged as compared with the through conductor. The width can be reduced.

本発明の表示装置において、一つの画素部15に、異なる発光波長(発光色)の発光素子14が複数配置されており、それぞれに接続される発光制御部がある構成であってもよい。例えば、一つの画素部15に、赤色LED(RLED)等から成る赤色発光素子と緑色LED(GLED)等から成る緑色発光素子と青色LED(BLED)等から成る青色発光素子と、が配置されており、それぞれに接続される発光制御部(Rドライバ、Gドライバ、Bドライバ)がある構成であってもよい。この場合、例えば、画素部15の中心部にRLED、GLED、BLEDが集約的に正三角形の各頂点に位置するように配置されており、RドライバとGドライバとBドライバが、RLEDとGLEDとBLEDよりも基板1の内側に配置される構成とし得る。また、画素部15の中心部にRLED、GLED、BLEDが、走査信号線2または発光制御信号線3に平行な一直線上、すなわち行方向または列方向に平行な一直線上、に配列された構成とすることもできる。 In the display device of the present invention, a plurality of light emitting elements 14 having different emission wavelengths (emission colors) are arranged in one pixel unit 15, and a light emission control unit connected to each of them may be provided. For example, a red light emitting element composed of a red LED (RLED) or the like, a green light emitting element composed of a green LED (GLED) or the like, and a blue light emitting element composed of a blue LED (BLED) or the like are arranged in one pixel unit 15. There may be a configuration in which there are light emission control units (R driver, G driver, B driver) connected to each of them. In this case, for example, the RLED, GLED, and BLED are collectively arranged at the vertices of the equilateral triangle at the center of the pixel portion 15, and the R driver, the G driver, and the B driver are the RLED and the GLED. It may be configured to be arranged inside the substrate 1 with respect to the BLED. Further, the RLED, GLED, and BLED are arranged in the center of the pixel unit 15 on a straight line parallel to the scanning signal line 2 or the light emission control signal line 3, that is, on a straight line parallel to the row direction or the column direction. You can also do it.

また、隣接する3つの画素部15のそれぞれに、互いに異なる発光波長(発光色)の発光素子14が配置されており、それぞれに接続される発光制御部がある構成であってもよい。例えば、第1の画素部15に赤色LED(RLED)等から成る赤色発光素子が配置され、第2の画素部15に緑色LED(GLED)等から成る緑色発光素子が配置され、第3の画素部15に青色LED(BLED)等から成る青色発光素子が配置されており、それぞれに接続される発光制御部(Rドライバ、Gドライバ、Bドライバ)が各画素部15にある構成であってもよい。第1の画素部15と第2の画素部15と第3の画素部15は、行方向に並んでいてもよく、列方向に並んでいてもよい。 Further, light emitting elements 14 having different emission wavelengths (emission colors) are arranged in each of the three adjacent pixel units 15, and a light emission control unit connected to each of them may be provided. For example, a red light emitting element composed of a red LED (RLED) or the like is arranged in the first pixel unit 15, a green light emitting element composed of a green LED (GLED) or the like is arranged in the second pixel unit 15, and a third pixel. Even if a blue light emitting element composed of a blue LED (BLED) or the like is arranged in the unit 15, and a light emitting control unit (R driver, G driver, B driver) connected to each is provided in each pixel unit 15. Good. The first pixel portion 15, the second pixel portion 15, and the third pixel portion 15 may be arranged in the row direction or may be arranged in the column direction.

なお、本発明の表示装置は、上記実施の形態に限定されるものではなく、適宜の変更、改良を含んでいてもよい。例えば、基板1は透明なガラス基板であってもよいが、不透明なものであってもよい。基板1が不透明なものである場合、基板1は着色されたガラス基板、摺りガラスから成るガラス基板、プラスチック基板、セラミック基板、金属基板、あるいはそれらの基板を積層した複合基板であってもよい。基板1が金属基板から成る場合、あるいは基板1が金属基板を含む複合基板である場合には、基板1の熱伝導性が向上し放熱性に有利なものとなる。 The display device of the present invention is not limited to the above-described embodiment, and may include appropriate changes and improvements. For example, the substrate 1 may be a transparent glass substrate, but may be an opaque one. When the substrate 1 is opaque, the substrate 1 may be a colored glass substrate, a glass substrate made of frosted glass, a plastic substrate, a ceramic substrate, a metal substrate, or a composite substrate in which these substrates are laminated. When the substrate 1 is made of a metal substrate, or when the substrate 1 is a composite substrate including the metal substrate, the thermal conductivity of the substrate 1 is improved and the heat dissipation is advantageous.

本発明の表示装置は、LED表示装置、有機EL表示装置等の表示装置として構成し得る。また本発明の表示装置は、各種の電子機器に適用できる。その電子機器としては、複合型かつ大型の表示装置(マルチディスプレイ)、自動車経路誘導システム(カーナビゲーションシステム)、船舶経路誘導システム、航空機経路誘導システム、スマートフォン端末、携帯電話、タブレット端末、パーソナルデジタルアシスタント(PDA)、ビデオカメラ、デジタルスチルカメラ、電子手帳、電子書籍、電子辞書、パーソナルコンピュータ、複写機、ゲーム機器の端末装置、テレビジョン、商品表示タグ、価格表示タグ、産業用のプログラマブル表示装置、カーオーディオ、デジタルオーディオプレイヤー、ファクシミリ、プリンター、現金自動預け入れ払い機(ATM)、自動販売機、ヘッドマウントディスプレイ(HMD)、デジタル表示式腕時計、スマートウォッチなどがある。 The display device of the present invention can be configured as a display device such as an LED display device and an organic EL display device. Further, the display device of the present invention can be applied to various electronic devices. The electronic devices include a complex and large display device (multi-display), an automobile route guidance system (car navigation system), a ship route guidance system, an aircraft route guidance system, a smartphone terminal, a mobile phone, a tablet terminal, and a personal digital assistant. (PDA), video cameras, digital still cameras, electronic notebooks, electronic books, electronic dictionaries, personal computers, copiers, game equipment terminals, televisions, product display tags, price display tags, industrial programmable display devices, Car audio, digital audio players, facsimiles, printers, automatic cash deposit / payment machines (ATMs), vending machines, head-mounted displays (HMDs), digital display watches, smart watches, etc.

1 基板
1g 額縁部
1s 側面配線
1t 基板の端
2 走査信号線
2p 電極パッド
3 発光制御信号線
14 発光素子
14a 光放射部
25 遮光部材
51 樹脂絶縁層
51t 樹脂絶縁層の端面
54a 正電極
54b 負電極
1 Substrate 1g Frame 1s Side wiring 1t Edge of substrate 2 Scanning signal line 2p Electrode pad 3 Light emitting control signal line 14 Light emitting element 14a Light emitting part 25 Light-shielding member 51 Resin insulating layer 51t End face of resin insulating layer 54a Positive electrode 54b Negative electrode

Claims (6)

基板と、
前記基板上に搭載される発光素子と、
前記基板上に配置され、前記発光素子に接続されて信号を入力する入力電極と、
前記基板上の前記入力電極の外側に配置され、前記入力電極に電気的に接続される電極パッドと、
前記電極パッドから前記基板の側面へ引き出されている側面配線と、
前記基板上の前記入力電極の外側に配置された遮光部材と、を有する表示装置であって、
前記入力電極と前記電極パッドと前記側面配線の前記基板からの高さを比較したときに、前記入力電極は前記電極パッド及び前記側面配線よりも高い位置にあり、
前記電極パッド及び前記側面配線は、前記遮光部材によって覆われている表示装置。
With the board
The light emitting element mounted on the substrate and
An input electrode arranged on the substrate, connected to the light emitting element, and inputting a signal,
An electrode pad located outside the input electrode on the substrate and electrically connected to the input electrode.
Side wiring that is pulled out from the electrode pad to the side surface of the substrate, and
A display device having a light-shielding member arranged outside the input electrode on the substrate.
When comparing the heights of the input electrode, the electrode pad, and the side wiring from the substrate, the input electrode is located higher than the electrode pad and the side wiring.
A display device in which the electrode pads and the side wiring are covered with the light-shielding member.
前記基板上に複数の層状部材が積層されており、
前記遮光部材と、前記複数の層状部材のうち最上層の層状部材と、の前記基板からの高さを比較したときに、前記遮光部材の頂上は前記最上層の層状部材の頂上以下の高さである請求項1に記載の表示装置。
A plurality of layered members are laminated on the substrate.
When the heights of the light-shielding member and the uppermost layered member among the plurality of layered members are compared from the substrate, the top of the light-shielding member is equal to or lower than the top of the uppermost layered member. The display device according to claim 1.
前記最上層の層状部材は、前記発光素子の周囲に配置された遮光層である請求項2に記載の表示装置。 The display device according to claim 2, wherein the layered member of the uppermost layer is a light-shielding layer arranged around the light emitting element. 前記発光素子は、光放射部を有しており、
前記光放射部と前記遮光層との前記基板からの高さを比較したときに、前記光放射部は前記遮光層の頂上よりも高い位置にある請求項3に記載の表示装置。
The light emitting element has a light emitting unit and has a light emitting unit.
The display device according to claim 3, wherein the light emitting unit is located higher than the top of the light emitting layer when the heights of the light emitting unit and the light emitting layer from the substrate are compared.
前記基板と前記入力電極との間に樹脂絶縁層が配置されており、
前記樹脂絶縁層は、その端面が前記基板の端に達しておらず、
前記電極パッドと前記側面配線と前記遮光部材は、前記基板上において前記樹脂絶縁層の端面と前記基板の端との間に配置されている請求項1乃至請求項4のいずれか1項に記載の表示装置。
A resin insulating layer is arranged between the substrate and the input electrode.
The end face of the resin insulating layer does not reach the edge of the substrate, and the resin insulating layer does not reach the edge of the substrate.
The aspect of any one of claims 1 to 4, wherein the electrode pad, the side wiring, and the light-shielding member are arranged between the end surface of the resin insulating layer and the end of the substrate on the substrate. Display device.
前記樹脂絶縁層は、複数のものが積層された積層構造とされている請求項5に記載の表示装置。 The display device according to claim 5, wherein the resin insulating layer has a laminated structure in which a plurality of the resin insulating layers are laminated.
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