JP6854863B2 - Light source unit - Google Patents

Light source unit Download PDF

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JP6854863B2
JP6854863B2 JP2019201046A JP2019201046A JP6854863B2 JP 6854863 B2 JP6854863 B2 JP 6854863B2 JP 2019201046 A JP2019201046 A JP 2019201046A JP 2019201046 A JP2019201046 A JP 2019201046A JP 6854863 B2 JP6854863 B2 JP 6854863B2
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light source
substrate
led
support member
substrate support
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JP2020074291A (en
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野口　卓志
卓志 野口
広巳 村松
広巳 村松
昌寛 石田
昌寛 石田
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Mitsubishi Electric Lighting Corp
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Description

本発明は、ＬＥＤ基板を備える光源ユニットに関するものであり、特に、複数のＬＥＤを備えるライン形のＬＥＤ基板を備える光源ユニットに関する。 The present invention relates to a light source unit including an LED substrate, and more particularly to a light source unit including a line-shaped LED substrate including a plurality of LEDs.

従来技術として、金属ベース基板に複数のＬＥＤチップを所定の間隔で配置した線状光源装置がある（特許文献１参照）。
また、ＬＥＤ基板を装着するＬＥＤラインモジュールであり、ヒートシンクと反射面とが個々の独立な部品として構成されたＬＥＤラインモジュールがある（特許文献２参照）。 As a prior art, there is a linear light source device in which a plurality of LED chips are arranged at predetermined intervals on a metal base substrate (see Patent Document 1).
Further, there is an LED line module for mounting an LED substrate, and there is an LED line module in which a heat sink and a reflecting surface are configured as individual independent parts (see Patent Document 2).

特開２００７−１５００８０号公報Japanese Unexamined Patent Publication No. 2007-150080 特許第４３２８３７９号公報Japanese Patent No. 4328379 登録実用新案第３１３４４３２号公報Registered Utility Model No. 3134432 登録実用新案第３１４８７２１号公報Registered Utility Model No. 3148721 国際公開第２００９／６１１２４号International Publication No. 2009/6112 登録実用新案第３１５０９９７号公報Registered Utility Model No. 3150997 特許第４７６４９６０号公報Japanese Patent No. 4746960 特開２００３−９２０２２号公報Japanese Unexamined Patent Publication No. 2003-92022 米国特許出願公開第２００５／０２７０７７４号明細書U.S. Patent Application Publication No. 2005/0270774 特開２００８−２４３４９８号公報Japanese Unexamined Patent Publication No. 2008-2434898 米国特許出願公開第２００９／０２９０３３４号明細書U.S. Patent Application Publication No. 2009/0290334

従来技術では、ＬＥＤバックライトを想定したＬＥＤラインモジュールであり、金属ベースに複数のＬＥＤチップを設置して金属ベース基板としているので、ライン形のＬＥＤ基板を装着することができないという課題がある。 In the prior art, it is an LED line module assuming an LED backlight, and since a plurality of LED chips are installed on a metal base to form a metal base substrate, there is a problem that a line-shaped LED substrate cannot be mounted.

また、ヒートシンクと反射面とが個々の独立な部品として構成されたＬＥＤラインモジュールでは、部品数が増加しコストがかかるという課題がある。 Further, in the LED line module in which the heat sink and the reflecting surface are configured as individual independent parts, there is a problem that the number of parts increases and the cost increases.

本発明は、透光性カバーに覆われた空間に、光源基板、底面、側壁及び上面部があることで、光取り出し効率を向上させることを目的とする。 An object of the present invention is to improve the light extraction efficiency by having a light source substrate, a bottom surface, a side wall surface, and an upper surface portion in a space covered by a translucent cover.

本発明に係る光源ユニットは、光源が配された光源基板と、前記光源基板が取り付けられる長尺状の基板支持部材であって、前記光源基板がスライドされて着脱自在に収納される基板収納部、スライドされる方向における前記基板収納部の端部に設けられた端面開口部、及び、前記光源から発する光が妨げられないように前記基板収納部の照射方向の側に設けられた開口部を有する基板支持部材と、前記基板収納部よりも前記照射方向の側に設けられた反射部と、前記光源基板を覆うように、前記基板支持部材の幅方向の端部側に取り付けられた透光性カバーと、を備え、前記基板収納部は、前記光源基板の背面と対向する平面部分である底面、前記スライドされる方向と交差する方向において前記底面の両側に形成される側壁、及び、前記光源基板を間にして前記底面と対向するように前記反射部の前記光源基板の側に形成される上面部が前記透光性カバーに覆われた側に設けられた。 The light source unit according to the present invention is a light source substrate on which a light source is arranged and a long substrate support member to which the light source substrate is attached, and a substrate storage unit in which the light source substrate is slid and detachably stored. , The end face opening provided at the end of the substrate housing in the sliding direction, and the opening provided on the irradiation direction side of the substrate housing so that the light emitted from the light source is not obstructed. The light-transmitting member attached to the end side of the substrate support member in the width direction so as to cover the substrate support member, the reflection portion provided on the irradiation direction side of the substrate storage portion, and the light source substrate. The substrate accommodating portion includes a sex cover, and the substrate accommodating portion includes a bottom surface which is a flat surface portion facing the back surface of the light source substrate, side walls formed on both sides of the bottom surface in a direction intersecting the sliding direction, and said. An upper surface portion of the reflecting portion formed on the side of the light source substrate so as to face the bottom surface with the light source substrate in between is provided on the side covered by the translucent cover.

本発明に係る光源ユニットによれば、透光性カバーに覆われた空間に、光源基板、底面、側壁及び上面部があることで、光取り出し効率を向上させることができる。 According to the light source unit according to the present invention, the light extraction efficiency can be improved by having the light source substrate, the bottom surface, the side wall and the upper surface portion in the space covered by the translucent cover.

図１の（ａ）が実施の形態１に係るＬＥＤラインモジュールの平面図（光源の照射方向側から見た図、Ａ矢視図）であり、図１の（ｂ）が実施の形態１に係るＬＥＤラインモジュールの側面図（Ｂ矢視図）であり図１の（ｂ−１）が実施の形態１に係るＬＥＤラインモジュールの端面図であり、図１の（ｃ）が実施の形態１に係るＬＥＤラインモジュールの背面図（Ｃ矢視図）である。FIG. 1A is a plan view of the LED line module according to the first embodiment (a view seen from the irradiation direction side of the light source, a view taken along the line A), and FIG. 1B is the first embodiment. It is a side view (view B) of the LED line module, FIG. 1 (b-1) is an end view of the LED line module according to the first embodiment, and (c) of FIG. 1 is the first embodiment. It is a rear view (C arrow view) of the LED line module which concerns on. 実施の形態１に係るＬＥＤラインモジュールの端面図の詳細を示す図である。It is a figure which shows the detail of the end view of the LED line module which concerns on Embodiment 1. FIG. 実施の形態１に係るＬＥＤラインモジュールの備えるＬＥＤ基板支持部材の平面図である。It is a top view of the LED board support member included in the LED line module which concerns on Embodiment 1. FIG. 実施の形態１に係るＬＥＤ基板支持部材にＬＥＤ基板が装着されている状態を示す平面図である。It is a top view which shows the state which the LED board is attached to the LED board support member which concerns on Embodiment 1. FIG. 実施の形態１のＬＥＤラインモジュールの端面の各箇所の寸法の関係を示す図である。It is a figure which shows the relationship of the dimension of each part of the end face of the LED line module of Embodiment 1. FIG.

実施の形態１．
図１は、図１の（ａ）が本実施の形態に係るＬＥＤラインモジュール１００の平面図（光源の照射方向側から見た図、Ａ矢視図）であり、図１の（ｂ）がＬＥＤラインモジュール１００の側面図（Ｂ矢視図）であり図１の（ｂ−１）がＬＥＤラインモジュール１００の端面図であり、図１の（ｃ）がＬＥＤラインモジュール１００の背面図（Ｃ矢視図）である。図２は、本実施の形態に係るＬＥＤラインモジュール１００の端面図の詳細を示す図である。図３は、本実施の形態に係るＬＥＤラインモジュール１００の備えるＬＥＤ基板支持部材１１０の平面図である。図４は、本実施の形態に係るＬＥＤ基板支持部材１１０にＬＥＤ基板２００が装着されている状態を示す平面図である。図５は、本実施の形態に係るＬＥＤラインモジュール１００の端面の各箇所の寸法の関係を示す図である。 Embodiment 1.
1A is a plan view of the LED line module 100 according to the present embodiment (a view seen from the irradiation direction side of the light source, a view taken along the line A), and FIG. 1B is shown in FIG. It is a side view (B arrow view) of the LED line module 100, FIG. 1 (b-1) is an end view of the LED line module 100, and FIG. 1 (c) is a rear view (C) of the LED line module 100. It is a view of the arrow). FIG. 2 is a diagram showing details of an end view of the LED line module 100 according to the present embodiment. FIG. 3 is a plan view of the LED substrate support member 110 included in the LED line module 100 according to the present embodiment. FIG. 4 is a plan view showing a state in which the LED substrate 200 is mounted on the LED substrate support member 110 according to the present embodiment. FIG. 5 is a diagram showing the relationship between the dimensions of the end faces of the LED line module 100 according to the present embodiment.

図１〜図５を用いて、本実施の形態に係るＬＥＤラインモジュール１００の構成について説明する。ここで、図２に示す端面図は、照射方向略中心線１１３８に対して略線対称である。また、本実施の形態に係るＬＥＤラインモジュール１００の長手方向に直交する断面は、図２に示す端面図と略同様であるものとする。 The configuration of the LED line module 100 according to the present embodiment will be described with reference to FIGS. 1 to 5. Here, the end view shown in FIG. 2 is substantially line-symmetrical with respect to the irradiation direction substantially center line 1138. Further, it is assumed that the cross section of the LED line module 100 according to the present embodiment orthogonal to the longitudinal direction is substantially the same as the end view shown in FIG.

ＬＥＤラインモジュール１００は、ＬＥＤ２１０（光源の一例）を有するＬＥＤ基板２００（光源基板の一例）を支持するＬＥＤ基板支持部材１１０（光源基板支持部材の一例）を備える光源モジュールの一例である。本実施の形態では、ＬＥＤ基板２００として、複数のＬＥＤ２１０を備えるライン形のＬＥＤ基板を想定している。したがって、ＬＥＤラインモジュール１００は、ライン形のＬＥＤ基板２００を装着することのできるＬＥＤモジュールである。 The LED line module 100 is an example of a light source module including an LED substrate support member 110 (an example of a light source substrate support member) that supports an LED substrate 200 (an example of a light source substrate) having an LED 210 (an example of a light source). In the present embodiment, as the LED substrate 200, a line-shaped LED substrate including a plurality of LEDs 210 is assumed. Therefore, the LED line module 100 is an LED module to which the line-shaped LED substrate 200 can be mounted.

ＬＥＤラインモジュール１００は、図１の（ａ）〜図１の（ｃ）に示すように、長手方向に長い略円筒形である。図２は、図１の（ｂ−１）に示すＬＥＤラインモジュール１００の端面図の詳細を示す図である。 As shown in FIGS. 1A to 1C, the LED line module 100 has a substantially cylindrical shape that is long in the longitudinal direction. FIG. 2 is a diagram showing details of an end view of the LED line module 100 shown in FIG. 1 (b-1).

ＬＥＤラインモジュール１００は、図２に示すように、ＬＥＤ基板支持部材１１０と、ＬＥＤ基板支持部材１１０に収納されるＬＥＤ基板２００と、ＬＥＤ基板２００に設置（装着）されたＬＥＤ２１０を覆うようにＬＥＤ基板支持部材１１０に取り付けられる樹脂カバー１２０とを備える。 As shown in FIG. 2, the LED line module 100 covers the LED substrate support member 110, the LED substrate 200 housed in the LED substrate support member 110, and the LED 210 installed (mounted) on the LED substrate 200. A resin cover 120 attached to the substrate support member 110 is provided.

ＬＥＤ基板支持部材１１０は、ＬＥＤ２１０の照射方向Ｐ側が開口する基板収納部１１３（溝部の一例）であって、ＬＥＤ基板２００の両側の側部である基板側部２０１を収納する一対のガイド部１１３７を有する基板収納部１１３を備える。 The LED substrate support member 110 is a substrate accommodating portion 113 (an example of a groove portion) that opens on the irradiation direction P side of the LED 210, and is a pair of guide portions 1137 that accommodating the substrate side portions 201 that are side portions on both sides of the LED substrate 200. The board accommodating portion 113 is provided.

ＬＥＤ基板支持部材１１０は、基板収納部１１３の開口（以下、開口部１１３１）の縁部１１３３から照射方向Ｐ側に形成された反射部１１１を備える。また、ＬＥＤ基板支持部材１１０は、照射方向Ｐ側の反対側（ＬＥＤ基板２００の背面方向側、以下、背面方向Ｑ側という）に形成され、ＬＥＤ基板２００の発する熱を放熱する金属ヒートシンク１１２（放熱部の一例）を備える。 The LED substrate support member 110 includes a reflection portion 111 formed on the irradiation direction P side from the edge portion 1133 of the opening (hereinafter, opening portion 1131) of the substrate storage portion 113. Further, the LED substrate support member 110 is formed on the opposite side of the irradiation direction P side (the back surface direction side of the LED substrate 200, hereinafter referred to as the back surface direction Q side), and is a metal heat sink 112 (which dissipates heat generated by the LED substrate 200). An example of a heat radiating unit) is provided.

ＬＥＤ基板支持部材１１０は、例えば、アルミニウム等の金属で一体形成されている。ＬＥＤ基板支持部材１１０は、長手方向（スライド方向（図１，図３参照））に直交する断面が略半円筒形状（かまぼこ形状）である。ＬＥＤ基板支持部材１１０は、背面方向Ｑ側が半円筒形状の円弧形状部分となっており、金属ヒートシンク１１２を構成する放熱フィン１１２１が放射状に形成されている。金属ヒートシンク１１２については後述する。 The LED substrate support member 110 is integrally formed of, for example, a metal such as aluminum. The LED substrate support member 110 has a substantially semi-cylindrical shape (kamaboko shape) in a cross section orthogonal to the longitudinal direction (slide direction (see FIGS. 1 and 3)). The LED substrate support member 110 has a semi-cylindrical arc-shaped portion on the Q side in the back direction, and the heat radiation fins 1121 constituting the metal heat sink 112 are formed radially. The metal heat sink 112 will be described later.

また、ＬＥＤ基板支持部材１１０は、照射方向Ｐ側が半円筒形状の平面形状部分（以下、平面部分とも呼ぶ）であり、ＬＥＤ基板２００を収納する基板収納部１１３（溝部）とＬＥＤ２１０の発する光を反射する反射部１１１とが形成されている。図３は、ＬＥＤ基板支持部材１１０を照射方向Ｐから見た図である。すなわち、図３はＬＥＤ基板支持部材１１０の平面部分を示す図である。図３のＬＥＤ基板支持部材１１０の平面部は、長手方向に長く短手方向に短い略長方形である。長手方向に沿った側部を部材側部と呼ぶ。 Further, the LED substrate support member 110 is a planar portion having a semi-cylindrical shape on the irradiation direction P side (hereinafter, also referred to as a planar portion), and emits light emitted by the substrate accommodating portion 113 (groove portion) for accommodating the LED substrate 200 and the LED 210. A reflecting portion 111 that reflects is formed. FIG. 3 is a view of the LED substrate support member 110 as viewed from the irradiation direction P. That is, FIG. 3 is a diagram showing a flat portion of the LED substrate support member 110. The flat surface portion of the LED substrate support member 110 in FIG. 3 is a substantially rectangular shape that is long in the longitudinal direction and short in the lateral direction. The side portion along the longitudinal direction is called the member side portion.

樹脂カバーについて説明する。樹脂カバー１２０の素材は、ガラス等に比べて軽量で、かつ、割れにくいアクリル樹脂等である。図２に示すように、樹脂カバー１２０は、ＬＥＤ基板支持部材１１０の平面部分を覆うような略半円筒形状である。樹脂カバー１２０は、樹脂カバー１２０の開口部分（円弧形状部分に対向する開口部分）がＬＥＤ基板支持部材１１０の平面部分により塞がれるようにＬＥＤ基板支持部材１１０に取り付けられる。樹脂カバー１２０の両側の側辺１２２には、ＬＥＤ基板支持部材１１０に形成されたカバー取付部１１４（カバー取付ガイド部の一例）と係合するカバー突起部１２１が形成されている。カバー突起部１２１は、樹脂カバーの両側の側辺１２２の端部を内側に折り曲げるように形成された突起である。カバー突起部１２１がＬＥＤ基板支持部材１１０の部材側部に設けられた溝であるカバー取付部１１４に嵌合することにより、樹脂カバー１２０がＬＥＤ基板支持部材１１０に取り付けられる。 The resin cover will be described. The material of the resin cover 120 is acrylic resin or the like, which is lighter than glass or the like and is hard to break. As shown in FIG. 2, the resin cover 120 has a substantially semi-cylindrical shape that covers the flat surface portion of the LED substrate support member 110. The resin cover 120 is attached to the LED substrate support member 110 so that the opening portion (the opening portion facing the arc-shaped portion) of the resin cover 120 is closed by the flat surface portion of the LED substrate support member 110. Cover protrusions 121 that engage with the cover mounting portion 114 (an example of the cover mounting guide portion) formed on the LED substrate support member 110 are formed on the side sides 122 on both sides of the resin cover 120. The cover protrusion 121 is a protrusion formed so as to bend the ends of the side sides 122 on both sides of the resin cover inward. The resin cover 120 is attached to the LED substrate support member 110 by fitting the cover protrusion 121 into the cover attachment portion 114, which is a groove provided on the member side portion of the LED substrate support member 110.

すなわち、ＬＥＤ基板支持部材１１０は、樹脂カバー１２０を取り付けるカバー取付部１１４（カバー取付ガイド部）であって樹脂カバー１２０の両側辺（両側の側辺１２２）に形成されたカバー突起部１２１をスライドさせて取り付けるカバー取付部１１４を備える。 That is, the LED board support member 110 is a cover mounting portion 114 (cover mounting guide portion) for mounting the resin cover 120, and slides the cover protrusions 121 formed on both side sides (side sides 122 on both sides) of the resin cover 120. It is provided with a cover mounting portion 114 to be mounted.

ＬＥＤ基板支持部材１１０に樹脂カバー１２０が取り付けられると、図２に示すように長手方向に直交する断面（端面）が略円形となり、ＬＥＤラインモジュール１００は略円筒形状となる。このように、基板収納部１１３（溝部）に直交する断面が略円形状であるので、従来のライン形蛍光灯に変わるライン形ＬＥＤ照明として利用することができる。 When the resin cover 120 is attached to the LED substrate support member 110, the cross section (end face) orthogonal to the longitudinal direction becomes substantially circular as shown in FIG. 2, and the LED line module 100 has a substantially cylindrical shape. As described above, since the cross section orthogonal to the substrate storage portion 113 (groove portion) has a substantially circular shape, it can be used as a line-type LED illumination instead of the conventional line-type fluorescent lamp.

また、図２では、樹脂カバー１２０は略半円形状であり、両側の側辺１２２はＬＥＤ基板支持部材１１０の平面部分の面上に配置される。例えば、樹脂カバー１２０の形状を、樹脂カバー１２０の両側の側辺１２２がＬＥＤ基板支持部材１１０の平面部分の面よりも背面方向Ｑ側に配置されるような形状としても良い。つまり、樹脂カバー１２０の両側の側辺１２２が、放熱フィン１１２１ａ、１１２１ｅ（図５参照）近傍まで達するような形状である。半円形状では中心角が約１８０°の円弧形状であるが、この場合は約２４０°（あるいは、約１９０°以上約２５０°以下）の円弧形状となる。これにより、樹脂カバー１２０の両側の側辺１２２近傍で金属ヒートシンク１１２の一部が覆われ、美観が向上し、蛍光灯の代替品としてより利用性が向上する。 Further, in FIG. 2, the resin cover 120 has a substantially semicircular shape, and the side sides 122 on both sides are arranged on the surface of the flat surface portion of the LED substrate support member 110. For example, the shape of the resin cover 120 may be such that the side sides 122 on both sides of the resin cover 120 are arranged on the Q side in the back direction with respect to the surface of the flat surface portion of the LED substrate support member 110. That is, the shape is such that the side sides 122 on both sides of the resin cover 120 reach the vicinity of the heat radiation fins 1121a and 1121e (see FIG. 5). The semicircular shape is an arc shape with a central angle of about 180 °, but in this case, the arc shape is about 240 ° (or about 190 ° or more and about 250 ° or less). As a result, a part of the metal heat sink 112 is covered in the vicinity of the side sides 122 on both sides of the resin cover 120, the aesthetic appearance is improved, and the usability as a substitute for the fluorescent lamp is further improved.

次に、基板収納部１１３について説明する。ＬＥＤ基板支持部材１１０に形成された基板収納部１１３は、照射方向Ｐ側が開口する溝部であって、ＬＥＤ基板２００の両側の側部である基板側部２０１を収納する一対のガイド部１１３７を有する溝部である。また、基板収納部１１３は、ＬＥＤ基板支持部材１１０の両端面（両側の端面１１５）まで延在する。言い換えると、基板収納部１１３は、ＬＥＤ基板支持部材１１０の両端面まで貫通して形成された貫通孔であり、照射方向Ｐ側に長手方向に沿って直線状に開口する開口部１１３１（図３参照）を有する貫通孔である。 Next, the substrate storage unit 113 will be described. The substrate accommodating portion 113 formed in the LED substrate support member 110 has a groove portion opened on the irradiation direction P side, and has a pair of guide portions 1137 for accommodating the substrate side portions 201, which are side portions on both sides of the LED substrate 200. It is a groove. Further, the substrate storage portion 113 extends to both end faces (end faces 115 on both sides) of the LED board support member 110. In other words, the substrate accommodating portion 113 is a through hole formed so as to penetrate to both end surfaces of the LED substrate support member 110, and is an opening 1131 (FIG. 3) that opens linearly along the longitudinal direction on the irradiation direction P side. It is a through hole having (see).

基板収納部１１３は、溝部の底面１１３４と、溝部の両側の側壁である一対の側壁１１３５と、底面１１３４に対向する上面部１１３６であって開口部１１３１を挟んで両側に形成された一対の上面部１１３６とを有する。基板収納部１１３において、底面１１３４と一方の側壁１１３５と一方の上面部１１３６とにより囲まれた部分がガイド部１１３７である。ガイド部１１３７は、開口部１１３１を挟んで両側に存在し、一対のガイド部の一例である。 The substrate accommodating portion 113 is a bottom surface 1134 of the groove portion, a pair of side walls 1135 which are side walls on both sides of the groove portion, and a pair of upper surface portions 1136 facing the bottom surface 1134 and formed on both sides of the opening 1131. It has a portion 1136. In the substrate accommodating portion 113, a portion surrounded by a bottom surface 1134, one side wall 1135, and one upper surface portion 1136 is a guide portion 1137. The guide portions 1137 exist on both sides of the opening 1131 and are an example of a pair of guide portions.

ＬＥＤ基板２００がＬＥＤ基板支持部材１１０の基板収納部１１３に収納される際には、基板収納部１１３のガイド部１１３７にＬＥＤ基板２００の両側の側部（基板側部２０１）をスライドさせることにより、基板収納部１１３にＬＥＤ基板２００が収納される。 When the LED board 200 is housed in the board storage part 113 of the LED board support member 110, the side parts (board side part 201) on both sides of the LED board 200 are slid to the guide part 1137 of the board storage part 113. , The LED board 200 is housed in the board storage part 113.

基板収納部１１３は、ＬＥＤ基板支持部材１１０の両側の端面１１５（両端面）まで延在しているので、ＬＥＤ基板支持部材１１０の両側の端面１１５には基板収納部１１３により開口された端面開口部１１５１（ガイド開口部の一例）が形成される（図２参照）。つまり、基板収納部１１３の一対のガイド部１１３７は、両側の端面１１５まで延在して両側の端面１１５に一対の端面開口部１１５１を形成する。ＬＥＤ基板２００の両側の基板側部２０１は、両側の端面１１５のうちのいずれか一方の端面１１５に形成された端面開口部１１５１から挿入されガイド部１１３７をスライドすることにより、基板収納部１３１の一対のガイド部１１３７に収納される。 Since the board storage portion 113 extends to the end faces 115 (both end faces) on both sides of the LED board support member 110, the end face openings opened by the board storage portion 113 in the end faces 115 on both sides of the LED board support member 110. A portion 1151 (an example of a guide opening) is formed (see FIG. 2). That is, the pair of guide portions 1137 of the substrate accommodating portion 113 extend to the end faces 115 on both sides to form a pair of end face openings 1151 on the end faces 115 on both sides. The substrate side portions 201 on both sides of the LED substrate 200 are inserted from the end face opening 1151 formed in one of the end faces 115 on both sides and slide the guide portion 1137 to form the substrate storage portion 131. It is housed in a pair of guide portions 1137.

図２及び図４に示すように、ＬＥＤ基板２００がＬＥＤ基板支持部材１１０の基板収納部１１３に収納されると、ＬＥＤ基板２００に装着されたＬＥＤ２１０は開口部１１３１から照射方向Ｐ側に露出するように位置する。ＬＥＤ基板２００が基板収納部１１３に収納されると、複数のＬＥＤ２１０（図４では６つのＬＥＤ２１０）が、開口部１１３１に長手方向に並んで配置される。また、図２に示すように、ＬＥＤ２１０は、基板収納部１１３の開口部１１３１の両側の縁部１１３３に挟まれた部位近傍に位置する。あるいは、ＬＥＤ２１０は、開口部１１３１の両側の縁部１１３３に挟まれた部位よりもやや照射方向Ｐ側に位置する。つまり、開口部１１３１の縁部１１３３が、ＬＥＤ２１０の発する光を妨げないような位置に、ＬＥＤ２１０が配置されることが好ましい。そのため、ＬＥＤ基板支持部材１１０は、ＬＥＤ基板２００の高さ、ＬＥＤ２１０（ＬＥＤチップ）の高さ、ＬＥＤ２１０（ＬＥＤチップ）の幅等を考慮して、基板収納部１１３を設計し、基板収納部１１３を構成する底面１１３４、側壁１１３５、上面部１１３６、開口部１１３１、縁部１１３３等の寸法を（幅・高さ・厚さ・長さ等）決定することが好ましい。 As shown in FIGS. 2 and 4, when the LED board 200 is housed in the board storage portion 113 of the LED board support member 110, the LED 210 mounted on the LED board 200 is exposed from the opening 1131 to the irradiation direction P side. Positioned as. When the LED substrate 200 is housed in the board accommodating portion 113, a plurality of LEDs 210 (six LEDs 210 in FIG. 4) are arranged side by side in the opening portion 1131 in the longitudinal direction. Further, as shown in FIG. 2, the LED 210 is located in the vicinity of a portion sandwiched between the edge portions 1133 on both sides of the opening portion 1131 of the substrate storage portion 113. Alternatively, the LED 210 is located slightly on the irradiation direction P side of the portion sandwiched between the edge portions 1133 on both sides of the opening 1131. That is, it is preferable that the LED 210 is arranged at a position where the edge portion 1133 of the opening 1131 does not interfere with the light emitted by the LED 210. Therefore, the LED substrate support member 110 is designed in consideration of the height of the LED substrate 200, the height of the LED 210 (LED chip), the width of the LED 210 (LED chip), and the like, and the substrate storage portion 113 is designed. It is preferable to determine the dimensions (width, height, thickness, length, etc.) of the bottom surface 1134, the side wall 1135, the top surface portion 1136, the opening portion 1131, the edge portion 1133, and the like.

また、図４に示すように、ＬＥＤ基板２００は、２つのＬＥＤ２１０の間隔（一方のＬＥＤ２１０の略中心から他方のＬＥＤ２１０の略中心までを結んだ距離）を２Ｌとした場合、端のＬＥＤ２１０ｈとＬＥＤ基板支持部材１１０の端部（端面１１５）との間隔はＬとすることが望ましい。ＬＥＤラインモジュール１００を複数連結する場合でも、ＬＥＤ１０の間隔が均一となるからである。 Further, as shown in FIG. 4, when the distance between the two LEDs 210 (the distance connecting the substantially center of one LED 210 to the substantially center of the other LED 210) is 2L, the LED substrate 200 has the LED 210h and the LED at the ends. It is desirable that the distance from the end portion (end face 115) of the substrate support member 110 is L. This is because the intervals between the LEDs 10 are uniform even when a plurality of LED line modules 100 are connected.

次に、反射部１１１について説明する。図２に示すように、反射部１１１は開口部１１３１の両側の縁部１１３３から照射方向Ｐ側に形成される反射面である。反射部１１１の面は、縁部１１３３側（中心側）から外側（樹脂カバー１２０側）に向かって、徐々に照射方向Ｐに向かうように傾斜している。すなわち、反射部１１１は、断面が逆八の字状になっている。これにより、ＬＥＤ２１０から発せられる光は、反射部１１１によって反射され、照射方向Ｐに照射される。このように、反射部１１１がＬＥＤ基板支持部材１１０に一体形成されているので、少ない部品数で光の取り出し効率を向上させることができる。 Next, the reflection unit 111 will be described. As shown in FIG. 2, the reflecting portion 111 is a reflecting surface formed on the irradiation direction P side from the edge portions 1133 on both sides of the opening portion 1131. The surface of the reflecting portion 111 is inclined gradually toward the irradiation direction P from the edge portion 1133 side (center side) to the outside (resin cover 120 side). That is, the reflecting portion 111 has an inverted eight-shaped cross section. As a result, the light emitted from the LED 210 is reflected by the reflecting unit 111 and is irradiated in the irradiation direction P. Since the reflecting portion 111 is integrally formed with the LED substrate support member 110 in this way, the light extraction efficiency can be improved with a small number of parts.

次に、金属ヒートシンク１１２（放熱部）について説明する。金属ヒートシンク１１２（放熱部）は、照射方向Ｐ側の反対側（背面方向Ｑ側）に伸びた複数の放熱フィン１１２１を備える。放熱フィン１１２１は、ＬＥＤ基板支持部材１１０の両側の端面１１５まで延在して形成される（図１の（ｂ）、図１の（ｃ）参照）。 Next, the metal heat sink 112 (heat dissipation unit) will be described. The metal heat sink 112 (heat radiating portion) includes a plurality of heat radiating fins 1121 extending on the opposite side (backward direction Q side) of the irradiation direction P side. The heat radiation fin 1121 is formed so as to extend to the end faces 115 on both sides of the LED substrate support member 110 (see (b) in FIG. 1 and (c) in FIG. 1).

複数の放熱フィンの各放熱フィン１１２１は、基板収納部１１３の底面１１３４の幅方向の略中心線１１３２（図２，図３参照）を中心軸として略放射方向に伸びている。 Each of the heat radiating fins 1121 of the plurality of heat radiating fins extends in the substantially radiating direction about the substantially center line 1132 (see FIGS. 2 and 3) in the width direction of the bottom surface 1134 of the substrate housing portion 113.

図５は、本実施の形態のＬＥＤラインモジュール１００の端面の各箇所の寸法の関係を示す図である。本実施の形態では、図５に示すように、５枚の放熱フィン１１２１ａ〜１１２１ｅが、略中心線１１３２を中心軸として、放射状に伸びて形成されている。また、５枚の放熱フィン１１２１ａ〜１１２１ｅは、長さＬ５が略等しい。 FIG. 5 is a diagram showing the relationship between the dimensions of the end faces of the LED line module 100 of the present embodiment. In the present embodiment, as shown in FIG. 5, five heat radiation fins 1121a to 1121e are formed so as to extend radially with the substantially center line 1132 as the central axis. Further, the five heat radiation fins 1121a to 1121e have substantially the same length L5.

ＬＥＤ基板支持部材１１０の平面部分の面と放熱フィン１１２１ａとの角度はθ１、放熱フィン１１２１ａと放熱フィン１１２１ｂとの角度はθ２、放熱フィン１１２１ｂと放熱フィン１１２１ｃとの角度はθ３、放熱フィン１１２１ｃと放熱フィン１１２１ｄとの角度はθ４、放熱フィン１１２１ｄと放熱フィン１１２１ｅとの角度はθ５、放熱フィン１１２１ｅとＬＥＤ基板支持部材１１０の平面部分の面との角度はθ６である。ここでは、θ１〜θ６の角度を略均一とするのが好ましい。すなわち、θ１（≒θ２≒θ３≒θ４≒θ５≒θ６）≒３０°が好ましい。金属ヒートシンク１１２の放熱効率が均一となり、放熱効率の向上につながるからである。しかし、ＬＥＤラインモジュール１００の設置箇所等による金属ヒートシンク１１２近傍の気流の流れ等によってはθ１〜θ６の角度を変化させることにより、より放熱効率を向上させることができる。例えば、θ１≒θ６≒５０°とし、θ２≒θ３≒θ４≒θ５≒２０°としてもよい。あるいは、θ１≒５０°とし、θ２≒θ３≒θ４≒θ５≒θ６≒２６°としてもよい。また、放熱フィン１１２１は、５枚でなくてもよい。例えば、放熱フィン１１２１は、３枚、あるいは７枚、あるいはその他の枚数でも良い。 The angle between the flat surface of the LED substrate support member 110 and the heat radiation fin 1121a is θ1, the angle between the heat radiation fin 1121a and the heat radiation fin 1121b is θ2, the angle between the heat radiation fin 1121b and the heat radiation fin 1121c is θ3, and the heat radiation fin 1121c. The angle with the heat radiating fin 1121d is θ4, the angle between the heat radiating fin 1121d and the heat radiating fin 1121e is θ5, and the angle between the heat radiating fin 1121e and the flat surface of the LED substrate support member 110 is θ6. Here, it is preferable that the angles of θ1 to θ6 are substantially uniform. That is, θ1 (≈θ2≈θ3≈θ4≈θ5≈θ6) ≈30 ° is preferable. This is because the heat dissipation efficiency of the metal heat sink 112 becomes uniform, which leads to an improvement in the heat dissipation efficiency. However, the heat dissipation efficiency can be further improved by changing the angles of θ1 to θ6 depending on the flow of airflow in the vicinity of the metal heat sink 112 due to the installation location of the LED line module 100 or the like. For example, θ1≈θ6≈50 ° may be set, and θ2≈θ3≈θ4≈θ5≈20 ° may be established. Alternatively, θ1≈50 ° may be set, and θ2≈θ3≈θ4≈θ5≈θ6≈26 ° may be set. Further, the number of heat radiation fins 1121 does not have to be five. For example, the number of heat radiation fins 1121 may be 3, 7, or other.

ＬＥＤラインモジュール１００の断面は、図２に示す端面図と同様となる。ここで、図２に示すように、半円筒形状の樹脂カバー１２０の半径Ｌ１と、ＬＥＤ基板支持部材１１０の幅の１／２、すなわち、略中心線から部材側部までの距離（最短距離）Ｌ２と、略中心線１１３２から放熱フィン１１２１の先端までの距離（最短距離）Ｌ３とは略等しい。これにより、ＬＥＤラインモジュール１００の断面は、半径Ｌ１（≒Ｌ２≒Ｌ３）の略円形状となる。 The cross section of the LED line module 100 is the same as the end view shown in FIG. Here, as shown in FIG. 2, the radius L1 of the semi-cylindrical resin cover 120 and 1/2 of the width of the LED substrate support member 110, that is, the distance (shortest distance) from the substantially center line to the member side portion. L2 is substantially equal to the distance (shortest distance) L3 from the substantially center line 1132 to the tip of the heat radiation fin 1121. As a result, the cross section of the LED line module 100 becomes a substantially circular shape having a radius L1 (≈L2≈L3).

図５に示すように、Ｌ１：Ｌ２：Ｌ３の比は、約１：１：１である。例えば、Ｌ１：Ｌ２：Ｌ３の比を約２：３：２とすることで、断面が略楕円形状のＬＥＤラインモジュール１００を得ることができる。 As shown in FIG. 5, the ratio of L1: L2: L3 is about 1: 1: 1. For example, by setting the ratio of L1: L2: L3 to about 2: 3: 2, it is possible to obtain the LED line module 100 having a substantially elliptical cross section.

金属ヒートシンク１１２は、断面が半径Ｌ４の略半円形状の逆かまぼこ状である肉厚部１１２２を備える。放熱フィン１１２１ａ〜１１２１ｅは、肉厚部１１２２の表面から放射状に伸びており、長さはＬ５（＝Ｌ３−Ｌ４）である。放熱フィン１１２１ａ〜１１２１ｅは、アルミニウム等で形成されているため、変形しやすい。肉厚部１１２２を備えることにより、金属ヒートシンク１１２が変形しにくい構造となるとともに、放熱効率を向上にさせることもできる。 The metal heat sink 112 includes a thick portion 1122 having a substantially semicircular shape with a cross section of L4 and an inverted semicircular shape. The heat radiating fins 1121a to 1121e extend radially from the surface of the thick portion 1122 and have a length of L5 (= L3-L4). Since the heat radiating fins 1121a to 1121e are made of aluminum or the like, they are easily deformed. By providing the thick portion 1122, the metal heat sink 112 has a structure that is not easily deformed, and the heat dissipation efficiency can be improved.

図５に示すように、肉厚部１１２２の半径Ｌ４と放熱フィン１１２１の長さＬ５との比は、Ｌ４：Ｌ５は約５：６である。放熱効率やＬＥＤラインモジュール１００の設置場所等を考慮してＬ４：Ｌ５を変化させても良い。例えば、Ｌ４：Ｌ５は約１：１、あるいは約１：２、あるいは約２：３、あるいはその他の比でもよい。 As shown in FIG. 5, the ratio of the radius L4 of the thick portion 1122 to the length L5 of the heat radiation fin 1121 is about 5: 6 for L4: L5. L4: L5 may be changed in consideration of heat dissipation efficiency, the installation location of the LED line module 100, and the like. For example, L4: L5 may be about 1: 1 or about 1: 2, or about 2: 3, or some other ratio.

また、本実施にの形態では、放熱フィン１１２１は、ＬＥＤ基板支持部材１１０の両側の端面１１５まで延在するものとして説明した。しかし、図１の（ｃ）に示すように、長手方向の所定の位置に、放熱フィン１１２１を切り欠いた切り欠き部１１２３を形成しても良い。図１の（ｃ）に示す切り欠き部１１２３は、点線と点線との間に存在する放熱フィン１１２１の部分をカットする（切り欠く）ことを示している。これにより、金属ヒートシンク１１２は、短手方向の空気の流れを通すことができ放熱効率を向上させることができる。切り欠き部１１２３は、長手方向に略直交して形成されても良いし、長手方向に対して傾斜して形成されても良い。また、複数の切り欠き部１１２３が、長手方向に均一に並ぶように形成されるのが好ましい。例えば、５カ所の切り欠き部１１２３、あるいは１０カ所の切り欠き部、あるいは２０カ所の切り欠き部、あるいはその他の数の切り欠き部１１２３を形成しても良い。また、切り欠き部１１２３は、形成しなくても良い。 Further, in the present embodiment, the heat radiation fin 1121 has been described as extending to the end faces 115 on both sides of the LED substrate support member 110. However, as shown in FIG. 1 (c), a cutout portion 1123 in which the heat radiation fin 1121 is cut out may be formed at a predetermined position in the longitudinal direction. The cutout portion 1123 shown in FIG. 1 (c) indicates that the portion of the heat radiation fin 1121 existing between the dotted lines is cut (cut out). As a result, the metal heat sink 112 can pass the air flow in the lateral direction, and the heat dissipation efficiency can be improved. The cutout portion 1123 may be formed substantially orthogonal to the longitudinal direction, or may be formed so as to be inclined with respect to the longitudinal direction. Further, it is preferable that the plurality of cutout portions 1123 are formed so as to be uniformly arranged in the longitudinal direction. For example, 5 cutouts 1123, 10 cutouts, 20 cutouts, or any other number of cutouts 1123 may be formed. Further, the cutout portion 1123 does not have to be formed.

以上のように、本実施の形態におけるＬＥＤラインモジュール１００によれば、ＬＥＤ２１０を有するＬＥＤ基板２００を支持するＬＥＤ基板支持部材１１０を備える光源モジュールにおいて、ＬＥＤ基板支持部材１１０は、照射方向Ｐ側に開口部１１３１を有し、ＬＥＤ基板２００の両側の基板側部２０１を収納する一対のガイド部１１３７を有する基板収納部１１３（溝部）と、開口部１１３１の縁部１１３３から照射方向Ｐ側に徐々に傾斜するように形成された反射部１１１と、基板背面方向Ｑ側に形成され、ＬＥＤ基板２００の発する熱を放熱する金属ヒートシンク１１２（放熱部）とを備えるので、略正方形のＬＥＤ基板あってもライン形のＬＥＤ基板２００であっても収納することができる。 As described above, according to the LED line module 100 in the present embodiment, in the light source module including the LED substrate support member 110 that supports the LED substrate 200 having the LED 210, the LED substrate support member 110 is located on the irradiation direction P side. A substrate storage portion 113 (groove portion) having an opening portion 1131 and a pair of guide portions 1137 for accommodating the substrate side portions 201 on both sides of the LED substrate 200, and gradually from the edge portion 1133 of the opening portion 1131 to the irradiation direction P side. Since it is provided with a reflecting portion 111 formed so as to be inclined to the surface and a metal heat sink 112 (dissipating portion) formed on the Q side in the back surface direction of the substrate and dissipating heat generated by the LED substrate 200, there is a substantially square LED substrate. Even the line-shaped LED substrate 200 can be stored.

また、本実施の形態におけるＬＥＤラインモジュール１００によれば、ＬＥＤ基板支持部材１１０は、一体形成されているので、部品点数を増やすことなく、ＬＥＤの光の取り出し効率の高いＬＥＤラインモジュール１００を提供することができ、コストの低減を図ることができる。 Further, according to the LED line module 100 in the present embodiment, since the LED substrate support member 110 is integrally formed, the LED line module 100 having high LED light extraction efficiency is provided without increasing the number of parts. It is possible to reduce the cost.

また、本実施の形態におけるＬＥＤラインモジュール１００によれば、ＬＥＤ基板支持部材１１０の両端面１１５に一対の端面開口部１１５１（ガイド開口部）を形成し、ＬＥＤ基板２００の基板側部２０１は、両端面１１５のうちのいずれか一方の端面１１５に形成された端面開口部１１５１から挿入されガイド部１１３７をスライドすることにより、基板収納部１１３の一対のガイド部１１３７に収納されるので、ＬＥＤ基板を着脱可能に収納することができる。 Further, according to the LED line module 100 in the present embodiment, a pair of end face openings 1151 (guide openings) are formed on both end faces 115 of the LED board support member 110, and the board side portion 201 of the LED board 200 is formed. By being inserted from the end face opening 1151 formed in the end face 115 of either end face 115 and sliding the guide portion 1137, the LED board is housed in the pair of guide portions 1137 of the board storage portion 113. Can be detachably stored.

また、本実施の形態におけるＬＥＤラインモジュール１００によれば、金属ヒートシンク１１２は、基板背面方向Ｑ側に伸びた放熱フィン１１２１であって両側の端面１１５まで延在して形成された放熱フィン１１２１を複数備え、複数の放熱フィン１１２１ａ〜１１２１ｅの各放熱フィン１１２１は、底面１１３４の幅方向の略中心線１１３２から略放射方向に伸びているので、放熱効率を向上させることができる。 Further, according to the LED line module 100 in the present embodiment, the metal heat sink 112 is a radiating fin 1121 extending toward the Q side in the back surface direction of the substrate, and the radiating fin 1121 formed extending to the end faces 115 on both sides. Since each of the plurality of heat radiating fins 1121a to 1121e is provided and extends in the substantially radiating direction from the substantially center line 1132 in the width direction of the bottom surface 1134, the heat radiating efficiency can be improved.

また、本実施の形態におけるＬＥＤラインモジュール１００によれば、開口部１１３１を覆う半円筒状の樹脂カバー１２０を備え、ＬＥＤ基板支持部材１１０は、樹脂カバー１２０を取り付けるカバー取付部１１４（カバー取付ガイド部）であって樹脂カバー１２０の両側辺１２２に形成されたカバー突起部１２１（側辺部）をスライドさせて取り付けるカバー取付部１１４（カバー取付ガイド部）を備えるので、部品点数を増やすことなく樹脂カバー１２０を取り付けることができる。 Further, according to the LED line module 100 in the present embodiment, the semi-cylindrical resin cover 120 covering the opening 1131 is provided, and the LED substrate support member 110 is a cover mounting portion 114 (cover mounting guide) for mounting the resin cover 120. A cover mounting portion 114 (cover mounting guide portion) for sliding and mounting the cover protrusions 121 (side side portions) formed on both side 122s of the resin cover 120 is provided, so that the number of parts does not increase. The resin cover 120 can be attached.

また、本実施の形態におけるＬＥＤラインモジュール１００によれば、基板収納部１１３（溝部）に直交する断面が略円形状であるので、従来のライン形蛍光灯に変わるライン形ＬＥＤ照明として利用することができる。 Further, according to the LED line module 100 in the present embodiment, since the cross section orthogonal to the substrate storage portion 113 (groove portion) has a substantially circular shape, it can be used as a line type LED lighting instead of the conventional line type fluorescent lamp. Can be done.

本実施の形態では、光源を有する光源基板を支持する光源基板支持部材を備える光源モジュールにおいて、前記光源基板支持部材は、前記光源の照射方向側が開口する溝部であって前記光源基板の両側の側部を収納する一対のガイド部を有する溝部と、前記溝部の前記開口の縁部から前記照射方向側に形成された反射部と、前記照射方向側の反対側に形成され、前記光源基板の発する熱を放熱する放熱部とを備える光源モジュールの一例について説明した。 In the present embodiment, in a light source module including a light source substrate support member that supports a light source substrate having a light source, the light source substrate support member is a groove portion that opens on the irradiation direction side of the light source and is on both sides of the light source substrate. A groove portion having a pair of guide portions for accommodating the portions, a reflection portion formed on the irradiation direction side from the edge portion of the opening of the groove portion, and a light source substrate formed on the opposite side of the irradiation direction side to emit light. An example of a light source module including a heat radiating unit that dissipates heat has been described.

本実施の形態では、光源基板支持部材が一体形成されている光源モジュールの一例について説明した。 In this embodiment, an example of a light source module in which a light source substrate support member is integrally formed has been described.

本実施の形態では、光源基板支持部材が両端面を有し、溝部の一対のガイド部は両端面まで延在して両端面に一対のガイド開口部を形成し、光源基板の両側の側部は、両端面のうちのいずれか一方の端面に形成されたガイド開口部から挿入されガイド部をスライドすることにより、溝部の一対のガイド部に収納される光源モジュールの一例について説明した。 In the present embodiment, the light source substrate support member has both end faces, and the pair of guide portions of the groove portion extend to both end faces to form a pair of guide openings on both end faces, and the side portions on both sides of the light source substrate. Described an example of a light source module that is inserted through a guide opening formed in one of both end faces and is housed in a pair of guide portions of a groove portion by sliding the guide portion.

本実施の形態では、放熱部は、照射方向側の反対側に伸びた放熱フィンであって両端面まで延在して形成された放熱フィンを複数備え、複数の放熱フィンの各放熱フィンは、溝部の底面の幅方向の略中心線から略放射方向に伸びている光源モジュールの一例について説明した。 In the present embodiment, the heat radiating portion includes a plurality of heat radiating fins extending to the opposite side of the irradiation direction and extending to both end surfaces, and each radiating fin of the plurality of heat radiating fins is formed. An example of a light source module extending in a substantially radial direction from a substantially center line in the width direction of the bottom surface of the groove has been described.

本実施の形態では、さらに、前記開口を覆う半円筒状の樹脂カバーを備え、光源基板支持部材は、樹脂カバーを取り付けるカバー取付ガイド部であって樹脂カバーの両側辺である両側辺部をスライドさせて取り付けるカバー取付ガイド部を備える光源モジュールの一例について説明した。 In the present embodiment, a semi-cylindrical resin cover that covers the opening is further provided, and the light source substrate support member slides both side portions that are cover mounting guide portions for attaching the resin cover and are both sides of the resin cover. An example of a light source module provided with a cover mounting guide for mounting the cover has been described.

本実施の形態では、溝部に直交する断面が略円形状である光源モジュールの一例について説明した。 In the present embodiment, an example of a light source module having a substantially circular cross section orthogonal to the groove has been described.

１００ ＬＥＤラインモジュール、１１０ ＬＥＤ基板支持部材、１１１ 反射部、１１２ 金属ヒートシンク、１１３ 基板収納部、１１４ カバー取付部、１１５ 端面、１２０ 樹脂カバー、１２１ カバー突起部、１２２ 側辺、２００ ＬＥＤ基板、２０１ 基板側部、２１０ ＬＥＤ、２１０ｈ 端のＬＥＤ、１１２１，１１２１ａ，１１２１ｂ，１１２１ｃ，１１２１ｄ，１１２１ｅ 放熱フィン、１１２２ 肉厚部、１１２３
切り欠き部、１１３１ 開口部、１１３２ 略中心線、１１３３ 縁部、１１３４ 底面、１１３５ 側壁、１１３６ 上面部、１１３７ ガイド部、１１３８ 照射方向略中心線、１１５１ 端面開口部。 100 LED line module, 110 LED board support member, 111 reflection part, 112 metal heat sink, 113 board storage part, 114 cover mounting part, 115 end face, 120 resin cover, 121 cover protrusion, 122 side side, 200 LED board, 201 Board side, 210 LED, 210h end LED, 1121,1121a, 1121b, 1121c, 1121d, 1121e heat sink fins, 1122 thick part, 1123
Notch, 1131 opening, 1132 approximate center line, 1133 edge, 1134 bottom, 1135 side wall, 1136 top surface, 1137 guide, 1138 irradiation direction approximate center line, 1151 end face opening.

Claims (3)

光源が配された光源基板と、
前記光源基板が取り付けられる長尺状の基板支持部材であって、前記光源基板がスライドされて着脱自在に収納される基板収納部、スライドされる方向における前記基板収納部の端部に設けられた端面開口部、及び、前記光源から発する光が妨げられないように前記基板収納部の照射方向の側に設けられた開口部を有する基板支持部材と、
前記基板収納部よりも前記照射方向の側に設けられた反射部と、
前記光源基板を覆うように、前記基板支持部材の幅方向の端部側に取り付けられた透光性カバーと、
を備え、
前記基板収納部は、前記光源基板の背面と対向する平面部分である底面、前記スライドされる方向と交差する方向において前記底面の両側に形成される側壁、及び、前記光源基板を間にして前記底面と対向するように前記反射部の前記光源基板の側に形成される上面部が前記透光性カバーの内部に設けられた光源ユニット。 The light source board on which the light source is arranged and the light source
A long substrate support member to which the light source substrate is attached, which is provided at a substrate storage portion in which the light source substrate is slid and detachably stored, and an end portion of the substrate storage portion in the sliding direction. A substrate support member having an end face opening and an opening provided on the irradiation direction side of the substrate storage portion so that the light emitted from the light source is not obstructed.
A reflective portion provided on the irradiation direction side of the substrate storage portion and
A translucent cover attached to the end side of the substrate support member in the width direction so as to cover the light source substrate.
With
The substrate storage portion is sandwiched between a bottom surface which is a flat portion facing the back surface of the light source substrate, side walls formed on both sides of the bottom surface in a direction intersecting the sliding direction, and the light source substrate. A light source unit in which an upper surface portion formed on the side of the light source substrate of the reflecting portion so as to face the bottom surface is provided inside the translucent cover. 前記反射部は、
前記開口部より外側における前記照射方向の側の面が反射面であり、前記反射面の裏側の面が前記上面部となっている請求項１に記載の光源ユニット。 The reflective part
The light source unit according to claim 1, wherein a surface outside the opening on the side in the irradiation direction is a reflective surface, and a surface on the back side of the reflective surface is an upper surface portion. 前記基板支持部材は、
前記光源基板の、前記スライドされる方向に沿った側部である基板側部が収納されるガイド部を有しており、
前記反射部は、
前記ガイド部の前記照射方向の側に設けられている請求項１又は請求項２に記載の光源ユニット。 The substrate support member is
It has a guide portion for accommodating the substrate side portion, which is a side portion of the light source substrate along the sliding direction.
The reflective part
The light source unit according to claim 1 or 2, which is provided on the side of the guide unit in the irradiation direction.
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