JP6852232B1 - Heat dissipation member and heat dissipation board using this - Google Patents

Heat dissipation member and heat dissipation board using this Download PDF

Info

Publication number
JP6852232B1
JP6852232B1 JP2020553554A JP2020553554A JP6852232B1 JP 6852232 B1 JP6852232 B1 JP 6852232B1 JP 2020553554 A JP2020553554 A JP 2020553554A JP 2020553554 A JP2020553554 A JP 2020553554A JP 6852232 B1 JP6852232 B1 JP 6852232B1
Authority
JP
Japan
Prior art keywords
heat radiating
heat
pillar
shaped body
radiating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020553554A
Other languages
Japanese (ja)
Other versions
JPWO2021255829A1 (en
Inventor
光昭 戸田
戸田　　光昭
良明 成沢
良明 成沢
琢哉 長谷川
琢哉 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Co Ltd
Original Assignee
Meiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Co Ltd filed Critical Meiko Co Ltd
Application granted granted Critical
Publication of JP6852232B1 publication Critical patent/JP6852232B1/en
Publication of JPWO2021255829A1 publication Critical patent/JPWO2021255829A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

放熱部材(2)は、発熱部材が配されている基板(1)内に埋設されるべき柱形状体(2)の一面であり発熱部材が配されている側の面である吸熱面(2a)と、該吸熱面(2a)の反対側の面である放熱面(2b)と、柱形状体(2)の側面に形成されたテーパ形状であるテーパ部(11)とを備えている。これにより、基板(1)の一方向、特に発熱部材側に引張られるような応力が働いたとしても放熱部材(2)がスルーホール(6)から抜けることを防止できる。The heat radiating member (2) is one surface of the pillar-shaped body (2) to be embedded in the substrate (1) on which the heat generating member is arranged, and is the endothermic surface (2a) on the side on which the heat generating member is arranged. ), A heat radiating surface (2b) which is a surface opposite to the endothermic surface (2a), and a tapered portion (11) which is a tapered shape formed on the side surface of the pillar-shaped body (2). As a result, it is possible to prevent the heat radiating member (2) from coming out of the through hole (6) even if a stress such as tension is applied to one direction of the substrate (1), particularly to the heat generating member side.

Description

本発明は、熱伝導素子等からなる放熱部材及びこの放熱部材が埋設された放熱基板に関する。 The present invention relates to a heat radiating member made of a heat conductive element or the like and a heat radiating substrate in which the heat radiating member is embedded.

いわゆる基板に熱伝導素子を埋設したものが知られている（例えば特許文献１及び２参照）。特許文献１でも特許文献２でも、熱伝導素子により、パッケージキャリア上に配置された熱発生素子により発生される熱を外界に伝導させることができるとされている。放熱部材は、基板を貫通するスルーホール内に埋設されている。このとき、放熱部材は接着剤やプリプレグ等の接着基材を用いてスルーホール内に固定されている。 It is known that a heat conductive element is embedded in a so-called substrate (see, for example, Patent Documents 1 and 2). In both Patent Document 1 and Patent Document 2, it is stated that the heat conductive element can conduct the heat generated by the heat generating element arranged on the package carrier to the outside world. The heat radiating member is embedded in a through hole penetrating the substrate. At this time, the heat radiating member is fixed in the through hole using an adhesive base material such as an adhesive or a prepreg.

特許文献１では、放熱部材として、金属且つ導体であって熱伝導率の大きいＣｕやＡｇが用いられると記載されている。また、放熱部材の形状は柱形状とされるが、円柱形状や四角柱形状でもよいと記載されている。特許文献２では、放熱部材の材料は例えばスルーシリコンビアを有する又は有さないセラミックス、ＴＳＶを有する又は有さないシリコン、シリコンカーバイド、ダイヤモンドあるいは金属と記載されている。特許文献２では、放熱部材の形状について特に記載はない。 Patent Document 1 describes that Cu or Ag, which is a metal and a conductor and has a high thermal conductivity, is used as the heat radiating member. Further, although the shape of the heat radiating member is a pillar shape, it is described that a cylindrical shape or a square pillar shape may be used. In Patent Document 2, the material of the heat radiating member is described as, for example, ceramics having or not having through silicon vias, silicon having or not having TSV, silicon carbide, diamond or metal. Patent Document 2 does not particularly describe the shape of the heat radiating member.

特許第３９２２６４２号公報Japanese Patent No. 3922642 特許第５３３１２１７号公報Japanese Patent No. 5331217

しかしながら、接着基材と放熱部材との間では熱膨張率（ＣＴＥ）が異なるため、接着界面で剥離が生じやすい。特に、放熱部材は電子部品等の発熱部材から発せられる熱を放熱するため、発熱部材の直下に配されることが多い。したがって、発熱部材を実装する際の半田による実装リフロー時や、発熱部材の動作時に、基板全体として発熱部材側に引張られるような応力が働く。また、このような発熱時のみだけでなく、基板搬送時の衝撃や、基板に対してビス留めをするときなどの組み立て時に、やはり基板のいずれかの面に向かって一方向に引張られるような応力が働くことがある。 However, since the coefficient of thermal expansion (CTE) differs between the adhesive base material and the heat radiating member, peeling is likely to occur at the adhesive interface. In particular, since the heat radiating member dissipates heat generated from the heat generating member such as an electronic component, it is often arranged directly under the heat generating member. Therefore, when the heat-generating member is mounted and reflowed by soldering, or when the heat-generating member is operated, a stress that causes the substrate as a whole to be pulled toward the heat-generating member acts. Further, not only at the time of such heat generation, but also at the time of impact during transfer of the board or at the time of assembly such as when screwing to the board, it is also pulled in one direction toward any surface of the board. Stress may work.

本発明は、上記従来技術を考慮したものであり、基板の一方向、特に発熱部材側に引張られるような応力が働いたとしても放熱部材がスルーホールから抜けることを防止できる放熱部材及びこれを用いた放熱基板を提供することを目的とする。 The present invention takes into consideration the above-mentioned prior art, and is a heat-dissipating member capable of preventing the heat-dissipating member from coming out of the through hole even if a stress such as tension is applied to one direction of the substrate, particularly to the heat-generating member side. It is an object of the present invention to provide the heat dissipation substrate used.

前記目的を達成するため、本発明では、発熱部材が配されている基板内に埋設されるべき柱形状体の一面であり前記発熱部材が配されている側の面である吸熱面と、該吸熱面の反対側の面である放熱面と、前記柱形状体の側面に形成されたテーパ形状であるテーパ部とを備えたことを特徴とする放熱部材を提供する。 In order to achieve the above object, in the present invention, the endothermic surface which is one surface of the pillar-shaped body to be embedded in the substrate on which the heat generating member is arranged and which is the surface on the side where the heat generating member is arranged, and the endothermic surface. Provided is a heat radiating member including a heat radiating surface which is a surface opposite to an endothermic surface and a tapered portion having a tapered shape formed on a side surface of the pillar-shaped body.

好ましくは、前記柱形状体の側面に前記吸熱面と平行な面を有する段差部が形成されている。 Preferably, a stepped portion having a surface parallel to the endothermic surface is formed on the side surface of the pillar-shaped body.

好ましくは、前記テーパ部は、前記柱形状体の側面全域に形成されている。 Preferably, the tapered portion is formed over the entire side surface of the pillar-shaped body.

好ましくは、前記柱形状体の側面は粗面処理されている。 Preferably, the side surface of the pillar-shaped body is roughened.

また、本発明では、前記基板を貫通して形成されているスルーホールと、該スルーホール内に配設されている前記柱形状体と、該柱形状体と前記スルーホールの内壁との間に配されていて前記柱形状体を前記スルーホール内に固定するための接着基材とを備えたことを特徴とする放熱部材を用いた放熱基板を提供する。 Further, in the present invention, between the through hole formed through the substrate, the pillar-shaped body arranged in the through hole, and the pillar-shaped body and the inner wall of the through hole. Provided is a heat-dissipating substrate using a heat-dissipating member, which is arranged and includes an adhesive base material for fixing the pillar-shaped body in the through-hole.

好ましくは、前記柱形状体が有する前記吸熱面及び前記放熱面は、前記柱形状体の外側に配されているめっき膜である蓋めっきと非接触である。 Preferably, the endothermic surface and the heat radiating surface of the pillar-shaped body are not in contact with the lid plating which is a plating film arranged on the outside of the pillar-shaped body.

本発明によれば、柱形状体の側面にテーパ部が形成されている。このため、柱形状体は吸熱面から放熱面に向けてその側面にていずれかの位置で徐々に拡径する部位を有することになる。このため、発熱部材が配される側の吸熱面側に引張られるような応力が働いたとしても、柱形状体の側面に存する拡径する部位（テーパ部）により柱形状体がスルーホールから抜けることを防止できる。 According to the present invention, a tapered portion is formed on the side surface of the pillar-shaped body. Therefore, the pillar-shaped body has a portion whose diameter gradually increases at any position on the side surface from the endothermic surface toward the heat radiating surface. Therefore, even if a stress such as tension is applied to the endothermic surface side on the side where the heat generating member is arranged, the column shape body comes out of the through hole due to the diameter-expanding portion (tapered portion) existing on the side surface of the column shape body. Can be prevented.

また、柱形状体の側面に段差部を設けることで、柱形状体が吸熱面側に引張られたとしても段差部の面が抜け方向に対して垂直方向を向いているのでこの面にて引っかかりの作用を発揮する。このため、柱形状体がスルーホールから抜けることをさらに防止できる。 Further, by providing a stepped portion on the side surface of the pillar-shaped body, even if the pillar-shaped body is pulled toward the endothermic surface side, the surface of the stepped portion faces in the direction perpendicular to the pull-out direction, so that the pillar-shaped body is caught on this surface. Demonstrate the action of. Therefore, it is possible to further prevent the pillar-shaped body from coming out of the through hole.

一方で、柱形状体の側面全域をテーパ形状とすれば、柱形状体が吸熱面側に引張られたとしても放熱面側に向けて徐々に拡径する側面の全面にて満遍なく引っ張り応力を受け止めることができる。このため、柱形状体がスルーホールから抜けることをさらに防止できる。 On the other hand, if the entire side surface of the column shape is tapered, even if the column shape is pulled toward the endothermic surface side, the tensile stress is evenly received by the entire surface of the side surface that gradually expands in diameter toward the heat dissipation surface side. be able to. Therefore, it is possible to further prevent the pillar-shaped body from coming out of the through hole.

また、柱形状体の側面を粗面処理することで、柱形状体が基板内に埋設された際に接する接着基材との間の密着性が高まる。このため、柱形状体が接着基材から剥離することを防止し、さらなる抜け防止の効果を得ることができる。 Further, by roughening the side surface of the column-shaped body, the adhesion between the column-shaped body and the adhesive base material that comes into contact with the column-shaped body when it is embedded in the substrate is enhanced. Therefore, it is possible to prevent the pillar-shaped body from peeling off from the adhesive base material, and to obtain a further effect of preventing the pillar shape from coming off.

また、本発明では、このような柱形状体からなる放熱部材を用いてスルーホール内に接着基材にて埋設することで、確実に一方向（吸熱面側）に向けて放熱部材が抜けてしまうことが防止された放熱基板を得ることができる。 Further, in the present invention, by embedding the heat radiating member made of such a pillar-shaped body in the through hole with the adhesive base material, the heat radiating member can be surely pulled out in one direction (heat absorbing surface side). It is possible to obtain a heat radiating substrate that is prevented from being stowed.

また、吸熱面及び放熱面が蓋めっきと非接触であるため、放熱部材がスルーホールから抜けてしまうことを防止するためにわざわざ蓋めっきを形成して吸熱面側や放熱面側から押えることが不要となる。さらに、蓋めっきがなかったとしても吸熱面側への抜け防止機能が放熱部材には備わっているので、蓋めっきを不要として基板設計の自由度を増すことができる。 In addition, since the heat absorbing surface and the heat radiating surface are not in contact with the lid plating, it is possible to form a lid plating to prevent the heat radiating member from coming out of the through hole and press it from the heat absorbing surface side or the heat radiating surface side. It becomes unnecessary. Further, even if there is no lid plating, the heat radiating member is provided with a function of preventing the heat absorbing surface from coming off, so that the lid plating is not required and the degree of freedom in substrate design can be increased.

本発明に係る放熱部材を用いた放熱基板の概略断面図である。It is the schematic sectional drawing of the heat dissipation substrate using the heat dissipation member which concerns on this invention. 本発明に係る放熱部材の概略図である。It is the schematic of the heat radiating member which concerns on this invention. 本発明に係る別の放熱部材の概略図である。It is the schematic of another heat dissipation member which concerns on this invention. 本発明に係るさらに別の放熱部材の概略図である。It is the schematic of the other heat dissipation member which concerns on this invention. 本発明に係るさらに別の放熱部材の概略図である。It is the schematic of the other heat dissipation member which concerns on this invention. 本発明に係るさらに別の放熱部材の概略図である。It is the schematic of the other heat dissipation member which concerns on this invention. 本発明に係る放熱部材を用いた別の放熱基板の概略断面図である。It is the schematic sectional drawing of another heat dissipation substrate using the heat dissipation member which concerns on this invention. 本発明に係る放熱部材を用いたさらに別の放熱基板の概略断面図である。It is the schematic sectional drawing of another heat dissipation substrate using the heat dissipation member which concerns on this invention.

図１を参照すれば明らかなように、本発明に係る放熱基板１は、内部にブロック状の放熱部材（柱形状体）２が埋設されているものである。以下、その構造について説明する。放熱基板１としては、図に示すような両面に導電層としての導体３が形成された両面板でもよいし、いわゆる多層板であってもよい。図１では、コア材４の両面に銅箔が形成された基板について、この銅箔が導体３として加工された例を示している。なお、コア材４とは、多層板の内部に芯として入れるための金属材料、あるいは両面にパターンである導体３を形成したものである。 As is clear from FIG. 1, the heat radiating substrate 1 according to the present invention has a block-shaped heat radiating member (pillar-shaped body) 2 embedded therein. The structure will be described below. The heat radiating substrate 1 may be a double-sided plate in which conductors 3 as conductive layers are formed on both sides as shown in the figure, or may be a so-called multilayer plate. FIG. 1 shows an example in which copper foil is processed as a conductor 3 on a substrate in which copper foil is formed on both sides of the core material 4. The core material 4 is a metal material for being inserted as a core inside a multilayer plate, or a conductor 3 having a pattern formed on both sides.

放熱基板１には、その両面方向にて貫通する貫通孔としてのスルーホール６が形成されている。具体的には、スルーホール６は放熱基板１のコア材４がくり抜かれて形成されている。このスルーホール６内に上述した放熱部材２が収容されている。したがってスルーホール６は放熱部材２にとってキャビティということもできる。スルーホール６の内壁と放熱部材２との間には接着基材５が充填されていて、この接着基材５により放熱部材２はスルーホール６内に固定されている。図１の例では、接着基材５は接着剤である。そして、放熱基板１はその両面に蓋めっき８を有している。この蓋めっき８は例えば金めっきや銅めっきであり、少なくとも放熱部材２の両面全域を覆うように形成されている。 The heat radiating substrate 1 is formed with a through hole 6 as a through hole penetrating in both sides thereof. Specifically, the through hole 6 is formed by hollowing out the core material 4 of the heat radiating substrate 1. The heat dissipation member 2 described above is housed in the through hole 6. Therefore, the through hole 6 can be said to be a cavity for the heat radiating member 2. An adhesive base material 5 is filled between the inner wall of the through hole 6 and the heat radiating member 2, and the heat radiating member 2 is fixed in the through hole 6 by the adhesive base material 5. In the example of FIG. 1, the adhesive base material 5 is an adhesive. The heat radiating substrate 1 has lid plating 8 on both sides thereof. The lid plating 8 is, for example, gold plating or copper plating, and is formed so as to cover at least the entire surface of both sides of the heat radiating member 2.

この放熱基板１には、はんだリフロー等を介して発熱する部品（発熱部材）である例えば電子部品が搭載される（不図示）。放熱部材２は通常、このような発熱部材の直下であって放熱基板１内に埋設される。図示したように、放熱部材２は柱形状体である。放熱部材２の一面（一方の面）は、発熱部材が配された側の面としての吸熱面２ａとなっている（図１の上側）。そして、この吸熱面２ａの反対側の面は放熱面２ｂとなっている（図１の下側）。 An electronic component, for example, a component (heating member) that generates heat via solder reflow or the like is mounted on the heat radiating substrate 1 (not shown). The heat radiating member 2 is usually directly under such a heat radiating member and is embedded in the heat radiating substrate 1. As shown in the figure, the heat radiating member 2 is a pillar-shaped body. One surface (one surface) of the heat radiating member 2 is an endothermic surface 2a as a surface on which the heat generating member is arranged (upper side in FIG. 1). The surface opposite to the endothermic surface 2a is the heat radiating surface 2b (lower side of FIG. 1).

放熱部材２の側面には、テーパ形状のテーパ部１１が形成されている。図２に示すように、テーパ部１１は側面の一部（下側）に形成されている。放熱部材２にはさらに段差部７が形成されている。この段差部７は吸熱面２ａと平行な面として放熱部材２の側面に形成されている。すなわち、図の例では吸熱面２ａの外縁から鉛直下方に向けて側面が延び、途中にて段差部７により径が広がり、この段差部７の外縁からさらにテーパ部１１によって徐々に拡径しながら下方に向けて側面が延びている。したがって、図の例では放熱面２ｂの径は吸熱面２ａの径よりも広がって形成される。なお、図２では円柱形状の放熱部材２を示しているが、図３に示すように角柱形状であってもテーパ部１１及び段差部７は形成可能であり、このような形状を採用してもよい。 A tapered portion 11 having a tapered shape is formed on the side surface of the heat radiating member 2. As shown in FIG. 2, the tapered portion 11 is formed on a part (lower side) of the side surface. A step portion 7 is further formed on the heat radiating member 2. The step portion 7 is formed on the side surface of the heat radiating member 2 as a surface parallel to the heat absorbing surface 2a. That is, in the example of the figure, the side surface extends vertically downward from the outer edge of the endothermic surface 2a, the diameter is expanded by the step portion 7 on the way, and the diameter is gradually increased by the tapered portion 11 from the outer edge of the step portion 7. The sides extend downward. Therefore, in the example of the figure, the diameter of the heat radiating surface 2b is formed to be wider than the diameter of the endothermic surface 2a. Although the heat radiating member 2 having a cylindrical shape is shown in FIG. 2, the tapered portion 11 and the stepped portion 7 can be formed even if the shape is a prism as shown in FIG. 3, and such a shape is adopted. May be good.

このように、放熱部材２は吸熱面２ａから放熱面２ｂに向けてその側面にていずれかの位置で拡径する部位（テーパ部１１）を有することになる。このため、発熱部材が配される側の吸熱面２ａ側に引張られるような応力が放熱基板１に働いたとしても、放熱部材２の側面に存する拡径する部位により放熱部材２がスルーホール６から抜けることを防止できる。この拡径する部位は、段差部７よりもまずはテーパ部１１があった方が好ましい。段差部７のみだと、接着基材５が段差部７の角にて充填されないことがあるからである。しかしながら抜け止め防止という観点では段差部７も効果を奏するので、テーパ部１１に付随して設けるとさらに効果的である。 As described above, the heat radiating member 2 has a portion (tapered portion 11) whose diameter is increased at any position on the side surface thereof from the endothermic surface 2a toward the heat radiating surface 2b. Therefore, even if a stress that is pulled toward the heat absorbing surface 2a on the side where the heat generating member is arranged acts on the heat radiating substrate 1, the heat radiating member 2 has a through hole 6 due to the diameter-expanding portion existing on the side surface of the heat radiating member 2. It can be prevented from coming out of. It is preferable that the portion to be expanded in diameter has a tapered portion 11 rather than a stepped portion 7. This is because if only the step portion 7 is used, the adhesive base material 5 may not be filled at the corners of the step portion 7. However, since the stepped portion 7 is also effective from the viewpoint of preventing the stopper from coming off, it is more effective if the stepped portion 7 is provided along with the tapered portion 11.

このようにテーパ部１１に加えて段差部７を設けることで、放熱部材２が吸熱面２ａ側に引張られたとしても段差部７の面が抜け方向（吸熱面２ａ側方向）に対して垂直方向を向いているので、この面にて引っかかりの作用を発揮する。具体的には、段差部７が接着基材５としっかりと噛み合い、応力による引っ張りをその引っ張り方向に対して段差部７の全面にて受け止めることができる。このため、放熱部材２が接着基材５から剥離することはなく、スルーホール６から抜けてしまうことを防止できる。これは、一方向に向けて抜けることを実現するものであり、機械的な作用によって一方向に力が働いたときも同様に抜け止めとしての機能を有する。 By providing the stepped portion 7 in addition to the tapered portion 11 in this way, even if the heat radiating member 2 is pulled toward the endothermic surface 2a, the surface of the stepped portion 7 is perpendicular to the exit direction (the endothermic surface 2a side direction). Since it faces in the direction, it exerts a catching action on this surface. Specifically, the stepped portion 7 firmly meshes with the adhesive base material 5, and the tension due to stress can be received by the entire surface of the stepped portion 7 with respect to the pulling direction. Therefore, the heat radiating member 2 does not peel off from the adhesive base material 5, and can be prevented from coming off from the through hole 6. This realizes that the force is pulled out in one direction, and also has a function as a retaining function even when a force is applied in one direction by a mechanical action.

段差部７としては、その幅が５μｍ以上１００μｍ以下あれば十分である。放熱部材２を銅などの金属で形成する場合は、段差部７の形状を有する成型金型を用いて製造可能である。放熱部材２をセラミックで形成する場合は、ダイシング時にハーフカットを行って段差部７を形成すれば製造可能である。なお、放熱部材２の材料は、セラミック、金属、カーボンナノチューブ、又はシリコンを適用可能である。このような材料を用いることで、効率よく放熱されることを確認している。 It is sufficient that the width of the step portion 7 is 5 μm or more and 100 μm or less. When the heat radiating member 2 is made of a metal such as copper, it can be manufactured by using a molding die having the shape of the step portion 7. When the heat radiating member 2 is made of ceramic, it can be manufactured by half-cutting at the time of dicing to form the stepped portion 7. As the material of the heat radiating member 2, ceramic, metal, carbon nanotube, or silicon can be applied. It has been confirmed that heat is efficiently dissipated by using such a material.

なお、図４に示すように、放熱部材２の側面全域がテーパ形状であってもよい。このように放熱部材２の側面をテーパ形状とすれば、放熱部材２が吸熱面２ａ側に引張られたとしても放熱面２ｂ側に向けて徐々に拡径する側面の全面にて満遍なく引っ張り応力を受け止めることができる。このため、放熱部材２が接着基材５からやはり剥離することはなく、スルーホール６から抜けてしまうことを防止できる。なお、図４では柱形状体の一種としての円錐台形状の放熱部材２を示したが、図５のような角柱形状を用いた錐台としてもよい。また、テーパ形状は図４のように放熱部材２の側面全体に形成してもよいし、図５のように一部にのみ形成してもよい。図４のように側面全体にテーパ形状を形成すれば、側面の全域において応力を受け止めることができる。また図５のように段差部７がなくてもテーパ部１１が一部にあっても応力を受け止めることができる。さらに、図６のように、吸熱面２ａ側にテーパ部１１があり、放熱面２ｂ側の側面が鉛直下方に延びている形状でもよい。どのような形状によってもテーパ形状が側面のどこかにある以上は放熱面２ｂは吸熱面２ａよりも広く形成されるので、テーパ形状が抜け止め防止機能を発揮することになる。 As shown in FIG. 4, the entire side surface of the heat radiating member 2 may have a tapered shape. If the side surface of the heat radiating member 2 is tapered in this way, even if the heat radiating member 2 is pulled toward the endothermic surface 2a, the tensile stress is evenly applied to the entire surface of the side surface whose diameter gradually increases toward the heat radiating surface 2b. I can take it. Therefore, the heat radiating member 2 does not peel off from the adhesive base material 5, and can be prevented from coming out of the through hole 6. Although FIG. 4 shows a truncated cone-shaped heat radiating member 2 as a kind of column-shaped body, a truncated cone using a prismatic shape as shown in FIG. 5 may be used. Further, the tapered shape may be formed on the entire side surface of the heat radiating member 2 as shown in FIG. 4, or may be formed only on a part as shown in FIG. If a tapered shape is formed on the entire side surface as shown in FIG. 4, stress can be received over the entire side surface. Further, as shown in FIG. 5, stress can be received even if the tapered portion 11 is partially present even if the step portion 7 is not provided. Further, as shown in FIG. 6, the shape may be such that the tapered portion 11 is provided on the endothermic surface 2a side and the side surface on the heat radiating surface 2b side extends vertically downward. Regardless of the shape, as long as the tapered shape is somewhere on the side surface, the heat radiating surface 2b is formed wider than the endothermic surface 2a, so that the tapered shape exerts a retaining function.

ここで、放熱部材２の表面が粗面処理されていてもよい（図１参照）。このように放熱部材２の表面を粗面処理することで、放熱部材２がスルーホール６内に埋設された際に接する接着基材５との間の密着性を高めることができる。このため、放熱部材２が接着基材５から剥離することを防止し、さらなる抜け防止の効果を得ることができる。この粗面処理としては、放熱部材２の表面に１μｍ以上５μｍ未満の凹凸を設ければ足りる。このような凹凸は、機械的にブラストやスクラブにて形成してもよいし、エッチング等の化学的処理を用いて形成してもよい。これにより放熱部材２の吸熱面２ａ、放熱面２ｂ、及び側面に凹凸形状が形成され、しっかりと接着基材５と噛み合って剥離することが防止される。この効果は、少なくとも放熱部材２の側面のみに粗面処理がなされていれば奏される。表面の全面に形成されていればなお好ましい。なお、他の例ではこの粗面処理された表面について図示を省略しているが、粗面処理するかしないかは適用する場面に応じて適宜決定できる。 Here, the surface of the heat radiating member 2 may be rough-treated (see FIG. 1). By roughening the surface of the heat radiating member 2 in this way, it is possible to improve the adhesion between the heat radiating member 2 and the adhesive base material 5 that comes into contact with the heat radiating member 2 when it is embedded in the through hole 6. Therefore, it is possible to prevent the heat radiating member 2 from peeling off from the adhesive base material 5, and further prevent the heat dissipation member 2 from coming off. For this rough surface treatment, it is sufficient to provide unevenness of 1 μm or more and less than 5 μm on the surface of the heat radiating member 2. Such irregularities may be mechanically formed by blasting or scrubbing, or may be formed by chemical treatment such as etching. As a result, uneven shapes are formed on the heat absorbing surface 2a, the heat radiating surface 2b, and the side surface of the heat radiating member 2, and the heat radiating member 2 is prevented from firmly engaging with the adhesive base material 5 and peeling off. This effect is exhibited if at least the side surface of the heat radiating member 2 is roughened. It is even more preferable if it is formed on the entire surface. In other examples, the roughened surface is not shown, but whether or not to roughen the surface can be appropriately determined depending on the application situation.

本発明に係る放熱基板１としては、図７に示すような例でも適用可能である。図の例では芯材たるコア材４が上下に二層形成され、その間にプリプレグ等の絶縁層たる接着基材５がそれぞれ配されているものを示している。コア材４の両面に導体３が形成されていれば、４層板ということになる。この例では、放熱部材２はスルーホール６に対して絶縁層を用いた接着基材５を介して固定されている。基板製造プロセスにおける積層プレスの際に、コア材４の間のプリプレグがスルーホール６内に流入し、充填される。したがって放熱部材２を固定するために別途接着剤を用いる必要がないので、接着剤を使用することによるクラックやボイドの発生を防止できる。このような構造の基板であっても、本発明の放熱部材２により、確実に一方向（吸熱面２ａ側）に向けて放熱部材２が抜けてしまうことが防止される。 As the heat radiating substrate 1 according to the present invention, the example shown in FIG. 7 can also be applied. In the example of the figure, two core materials 4 as core materials are formed in the upper and lower layers, and an adhesive base material 5 as an insulating layer such as a prepreg is arranged between them. If the conductors 3 are formed on both sides of the core material 4, it means a four-layer plate. In this example, the heat radiating member 2 is fixed to the through hole 6 via an adhesive base material 5 using an insulating layer. During the laminating press in the substrate manufacturing process, the prepreg between the core materials 4 flows into the through holes 6 and is filled. Therefore, since it is not necessary to use a separate adhesive for fixing the heat radiating member 2, it is possible to prevent the occurrence of cracks and voids due to the use of the adhesive. Even with a substrate having such a structure, the heat radiating member 2 of the present invention ensures that the heat radiating member 2 is prevented from coming off in one direction (the endothermic surface 2a side).

また、本発明に係る放熱基板１としては、図８に示すような例でも適用可能である。この例では、図７の放熱基板１の上下に、それぞれ絶縁層９を配している。絶縁層９の外側には導体３及び銅めっき１２が形成されている。そして、放熱部材２の吸熱面２ａにはフィルドビア１０がスタックされている。このように、放熱部材２はどのような構造の基板であっても適用可能であるが、この例のように、吸熱面２ａ及び放熱面２ｂがその外側に配されているめっき膜である蓋めっき８と非接触であってもよい（放熱部材２の吸熱面２ａ及び放熱面２ｂは直接プリプレグ等の接着基材５に接している）。すなわち、本願発明は図８のような蓋めっき８が存在しない基板にも適用可能ということになる。上述したように放熱部材２の形状のみでスルーホール６からの抜け防止が図られているので、吸熱面２ａ及び放熱面２ｂを蓋めっき８と非接触（蓋めっき８が不存在）としても、放熱部材２がスルーホール６から抜けてしまうことを防止するためにわざわざ放熱部材２に直接接する蓋めっき８を形成して吸熱面２ａ側や放熱面２ｂ側から押えなくてもよい。このように、蓋めっき８がなかったとしても吸熱面２ａ側への抜け防止機能が放熱部材２には備わっているので、放熱部材２に直接接する蓋めっき８を不要として基板設計の自由度を増すことができる。 Further, as the heat radiating substrate 1 according to the present invention, the example shown in FIG. 8 can also be applied. In this example, the insulating layers 9 are arranged above and below the heat radiating substrate 1 of FIG. A conductor 3 and a copper plating 12 are formed on the outside of the insulating layer 9. Then, the filled via 10 is stacked on the heat absorbing surface 2a of the heat radiating member 2. As described above, the heat radiating member 2 can be applied to a substrate having any structure, but as in this example, a lid which is a plating film in which the endothermic surface 2a and the heat radiating surface 2b are arranged on the outside thereof. It may be non-contact with the plating 8 (the heat absorbing surface 2a and the heat radiating surface 2b of the heat radiating member 2 are in direct contact with the adhesive base material 5 such as a prepreg). That is, the present invention can be applied to a substrate as shown in FIG. 8 in which the lid plating 8 does not exist. As described above, since the heat dissipation member 2 is used only to prevent the heat dissipation member 2 from coming off from the through hole 6, even if the endothermic surface 2a and the heat dissipation surface 2b are not in contact with the lid plating 8 (the lid plating 8 is absent). In order to prevent the heat radiating member 2 from coming out of the through hole 6, it is not necessary to form a lid plating 8 that is in direct contact with the heat radiating member 2 so that the heat radiating member 2 is not pressed from the heat absorbing surface 2a side or the heat radiating surface 2b side. In this way, even if the lid plating 8 is not provided, the heat radiating member 2 is provided with a function of preventing the heat absorbing surface 2a from coming off. Therefore, the lid plating 8 that is in direct contact with the heat radiating member 2 is not required, and the degree of freedom in substrate design is increased. Can be increased.

１：放熱基板、２：放熱部材（柱形状体）、２ａ：吸熱面、２ｂ：放熱面、３：導体、４：コア材、５：接着基材、６：スルーホール、７：段差部、８：蓋めっき、９：絶縁層、１０：フィルドビア、１１：テーパ部、１２：銅めっき 1: Heat dissipation substrate 2: Heat dissipation member (pillar-shaped body), 2a: Endothermic surface, 2b: Heat dissipation surface, 3: Conductor, 4: Core material, 5: Adhesive base material, 6: Through hole, 7: Stepped portion, 8: Lid plating, 9: Insulation layer, 10: Filled via, 11: Tapered part, 12: Copper plating

Claims (5)

発熱部材が配されている基板内に埋設されるべき柱形状体の一面であり前記発熱部材が配されている側の面である吸熱面と、
該吸熱面の反対側の面である放熱面と、
前記柱形状体の側面に形成されたテーパ形状であり、前記吸熱面から前記放熱面に向けて拡径するテーパ部とを備え、
前記柱形状体の側面に前記吸熱面と平行な面を有する段差部が形成されていることを特徴とする放熱部材。 The endothermic surface, which is one surface of the pillar-shaped body to be embedded in the substrate on which the heat generating member is arranged, and the surface on the side on which the heat generating member is arranged,
The heat dissipation surface, which is the surface opposite to the endothermic surface,
It has a tapered shape formed on the side surface of the pillar-shaped body, and includes a tapered portion whose diameter increases from the endothermic surface toward the heat radiating surface .
A heat radiating member characterized in that a stepped portion having a surface parallel to the endothermic surface is formed on a side surface of the pillar-shaped body. 前記テーパ部は、前記柱形状体の側面全域に形成されていることを特徴とする請求項１に記載の放熱部材。 The heat radiating member according to claim 1, wherein the tapered portion is formed on the entire side surface of the pillar-shaped body. 前記柱形状体の側面は粗面処理されていることを特徴とする請求項１に記載の放熱部材。 The heat radiating member according to claim 1, wherein the side surface of the pillar-shaped body is roughened. 前記基板を貫通して形成されているスルーホールと、
該スルーホール内に配設されている前記柱形状体と、
該柱形状体と前記スルーホールの内壁との間に配されていて前記柱形状体を前記スルーホール内に固定するための接着基材とを備えたことを特徴とする請求項１に記載の放熱部材を用いた放熱基板。 Through holes formed through the substrate and
The pillar-shaped body arranged in the through hole and
The first aspect of the present invention, wherein the pillar-shaped body is provided between the pillar-shaped body and the inner wall of the through hole, and an adhesive base material for fixing the pillar-shaped body in the through hole is provided. A heat dissipation board that uses a heat dissipation member. 前記柱形状体が有する前記吸熱面及び前記放熱面は、前記柱形状体の外側に配されているめっき膜である蓋めっきと非接触であることを特徴とする請求項４に記載の放熱基板。 The heat-dissipating substrate according to claim 4, wherein the endothermic surface and the heat-dissipating surface of the pillar-shaped body are not in contact with the lid plating which is a plating film arranged on the outside of the pillar-shaped body. ..
JP2020553554A 2020-06-16 2020-06-16 Heat dissipation member and heat dissipation board using this Active JP6852232B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/023607 WO2021255829A1 (en) 2020-06-16 2020-06-16 Heat-radiating member and heat-radiating substrate using same

Publications (2)

Publication Number Publication Date
JP6852232B1 true JP6852232B1 (en) 2021-03-31
JPWO2021255829A1 JPWO2021255829A1 (en) 2021-12-23

Family

ID=75154781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020553554A Active JP6852232B1 (en) 2020-06-16 2020-06-16 Heat dissipation member and heat dissipation board using this

Country Status (2)

Country Link
JP (1) JP6852232B1 (en)
WO (1) WO2021255829A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2009170493A (en) * 2008-01-11 2009-07-30 Hitachi Kokusai Electric Inc Wiring board
JP2013135168A (en) * 2011-12-27 2013-07-08 Ibiden Co Ltd Printed wiring board
JP2015144164A (en) * 2014-01-31 2015-08-06 京セラサーキットソリューションズ株式会社 Printed-circuit board and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2009170493A (en) * 2008-01-11 2009-07-30 Hitachi Kokusai Electric Inc Wiring board
JP2013135168A (en) * 2011-12-27 2013-07-08 Ibiden Co Ltd Printed wiring board
JP2015144164A (en) * 2014-01-31 2015-08-06 京セラサーキットソリューションズ株式会社 Printed-circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
WO2021255829A1 (en) 2021-12-23
JPWO2021255829A1 (en) 2021-12-23

Similar Documents

Publication Publication Date Title
US8735741B2 (en) Circuit board and mounting structure using the same
US9554462B2 (en) Printed wiring board
JP5788854B2 (en) Circuit board
JP5634185B2 (en) Hybrid heat dissipation board and method for manufacturing the same
JP2008177552A (en) Wiring board with built-in electronic component, and heat dissipation method for wiring board with built-in electronic component
WO2007126090A1 (en) Circuit board, electronic device and method for manufacturing circuit board
JP4878862B2 (en) Circuit equipment
JP2007096185A (en) Circuit board
US20140116759A1 (en) Printed wiring board and method for manufacturing printed wiring board
US20150257268A1 (en) Printed wiring board and method for manufacturing printed wiring board
JP6852232B1 (en) Heat dissipation member and heat dissipation board using this
JP2008042154A (en) Package board
JP2010062199A (en) Circuit board
JP2009158599A (en) Wiring board, its manufacturing method, and packaging structure
KR20080079384A (en) Active device embedded printed circuit board with improved heat dissipation and manufacturing method thereof
JP3862454B2 (en) Metal-based multilayer circuit board
JP5623364B2 (en) Wiring board, mounting structure, and electronic device
JP4459031B2 (en) Electronic component storage package and electronic device
CN108353498B (en) Substrate and method for manufacturing substrate
JP4511245B2 (en) Circuit equipment
JP2018207081A (en) Printed wiring board and manufacturing method therefor
JP2006100773A (en) Multilayer wiring board, its manufacturing method and electronic apparatus using the board
JP5303532B2 (en) Printed wiring board, manufacturing method thereof, multilayer printed wiring board, and manufacturing method thereof
JP2004289006A (en) Carbon aluminum core substrate
JP5307704B2 (en) Wiring board and method of manufacturing wiring board

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201008

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201008

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20201008

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20201109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201225

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210309

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210310

R150 Certificate of patent or registration of utility model

Ref document number: 6852232

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250