JP6800768B2 - 半田付け装置 - Google Patents
半田付け装置 Download PDFInfo
- Publication number
- JP6800768B2 JP6800768B2 JP2017016631A JP2017016631A JP6800768B2 JP 6800768 B2 JP6800768 B2 JP 6800768B2 JP 2017016631 A JP2017016631 A JP 2017016631A JP 2017016631 A JP2017016631 A JP 2017016631A JP 6800768 B2 JP6800768 B2 JP 6800768B2
- Authority
- JP
- Japan
- Prior art keywords
- holding portion
- solder piece
- solder
- guide tube
- piece guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0615—Solder feeding devices forming part of a soldering iron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/025—Bits or tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims (5)
- 一方の端部から供給された半田片を通過させる空間を有する筒状の半田片誘導管の複数本と、
前記半田片誘導管を保持する第一保持部と、
前記第一保持部を加熱する加熱部と、を有し、
前記半田片誘導管の、半田付けする側の先端部が、前記第一保持部の内側に配設され、
前記半田片誘導管の半田付け側先端部は、前記第一保持部の端面と同一面上に配置されている
ことを特徴とする半田付け装置。 - 前記第一保持部は、複数個の孔部が形成された金属製の板状体であり、
前記半田片誘導管は、前記孔部に挿入されて、前記第一保持部に保持されていることを特徴とする請求項1に記載の半田付け装置。 - 前記第一保持部よりも半田片供給口側の位置に配設されて前記半田片誘導管を保持する第二保持部を有し、
前記半田片誘導管は、前記第一保持部により保持された部位と前記第二保持部により保持された部位との間に、外部に露出した領域を有することを特徴とする請求項1に記載の半田付け装置。 - 前記半田片誘導管の半田付け側先端部は、前記第一保持部の端面よりも、半田片供給口側の位置に配置されていることを特徴とする請求項1に記載の半田付け装置。
- 前記第一保持部は、アルミニウム又はステンレスにより形成され、
前記半田片誘導管は、ガラス、セラミック、アルミニウム、ステンレス又はチタンにより形成されることを特徴とする請求項1に記載の半田付け装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017016631A JP6800768B2 (ja) | 2017-02-01 | 2017-02-01 | 半田付け装置 |
PCT/JP2017/042460 WO2018142733A1 (ja) | 2017-02-01 | 2017-11-27 | 半田付け装置 |
US16/305,705 US11420282B2 (en) | 2017-02-01 | 2017-11-27 | Soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017016631A JP6800768B2 (ja) | 2017-02-01 | 2017-02-01 | 半田付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018122332A JP2018122332A (ja) | 2018-08-09 |
JP6800768B2 true JP6800768B2 (ja) | 2020-12-16 |
Family
ID=63040631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017016631A Active JP6800768B2 (ja) | 2017-02-01 | 2017-02-01 | 半田付け装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11420282B2 (ja) |
JP (1) | JP6800768B2 (ja) |
WO (1) | WO2018142733A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3533548B1 (en) * | 2016-10-28 | 2022-09-21 | AND Co,. Ltd. | Method and soldering device for determining the state of an iron tip |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS604029B2 (ja) * | 1980-09-18 | 1985-02-01 | 本田技研工業株式会社 | 自動二輪車のフエアリング装置 |
JP2874959B2 (ja) * | 1990-05-25 | 1999-03-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 搬送用回路基板保持部品およびその製造方法 |
JP3583462B2 (ja) * | 1993-04-05 | 2004-11-04 | フォード モーター カンパニー | 電子成分のための微小はんだ付け装置および方法 |
JP3528264B2 (ja) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | ソルダーボールのマウント装置 |
JP3592486B2 (ja) * | 1997-06-18 | 2004-11-24 | 株式会社東芝 | ハンダ付け装置 |
US6461136B1 (en) * | 1999-08-26 | 2002-10-08 | International Business Machines Corp. | Apparatus for filling high aspect ratio via holes in electronic substrates |
EP1326729B1 (de) * | 2000-10-06 | 2010-04-21 | Pac Tech - Packaging Technologies GmbH | Vorrichtung zur applikation von materialstücken auf ein werkstück |
SG106126A1 (en) * | 2002-03-08 | 2004-09-30 | Esec Trading Sa | Method and apparatus for dispensing solder on a substrate |
JP5184359B2 (ja) * | 2006-08-21 | 2013-04-17 | 満男 海老澤 | 半田鏝、それを用いて電子機器を製造する方法、及び製造装置 |
US20080179035A1 (en) * | 2007-01-25 | 2008-07-31 | International Business Machines Corporation | Flexible nozzle for injection molded solder |
US20110272452A1 (en) * | 2010-05-04 | 2011-11-10 | Kui Kam Lam | System for dispensing soft solder for mounting semiconductor chips using multiple solder wires |
KR102307528B1 (ko) * | 2014-07-21 | 2021-10-05 | 삼성전자주식회사 | 솔더 볼 흡착 장치 |
JP6010837B2 (ja) * | 2015-03-16 | 2016-10-19 | 株式会社アンド | 半田処理装置 |
JP6004029B1 (ja) * | 2015-03-26 | 2016-10-05 | 株式会社アンド | 半田処理装置 |
JP2017112243A (ja) * | 2015-12-17 | 2017-06-22 | 日本電産サンキョー株式会社 | ヒータチップおよび半田付け装置 |
US10730128B2 (en) * | 2016-01-20 | 2020-08-04 | Western Digital Technologies, Inc. | Reliable transportation mechanism for micro solder balls |
EP3533548B1 (en) * | 2016-10-28 | 2022-09-21 | AND Co,. Ltd. | Method and soldering device for determining the state of an iron tip |
US11247285B1 (en) * | 2020-04-03 | 2022-02-15 | Seagate Technology Llc | Fluidization of agglomerated solder microspheres |
-
2017
- 2017-02-01 JP JP2017016631A patent/JP6800768B2/ja active Active
- 2017-11-27 WO PCT/JP2017/042460 patent/WO2018142733A1/ja active Application Filing
- 2017-11-27 US US16/305,705 patent/US11420282B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11420282B2 (en) | 2022-08-23 |
WO2018142733A1 (ja) | 2018-08-09 |
JP2018122332A (ja) | 2018-08-09 |
US20200376580A1 (en) | 2020-12-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103962673A (zh) | 半导体器件的制造方法和烙铁 | |
CN105397222B (zh) | 一种火焰预热钨极氩弧钎焊方法 | |
WO2010116809A1 (ja) | X線検査用加熱装置 | |
JP6800768B2 (ja) | 半田付け装置 | |
TWI336606B (ja) | ||
TWI413472B (zh) | 導熱裝置 | |
US4194297A (en) | Method and apparatus for generating a controllably exposed vapor body for heating articles | |
JP2009277786A (ja) | リフローはんだ付け装置 | |
JP2008170070A (ja) | 加熱装置 | |
US20090289100A1 (en) | Method and apparatus for rework soldering | |
TWI608889B (zh) | 焊接裝置及焊接方法 | |
JP2009031111A (ja) | 半導体集積装置ソケットモジュール | |
JP6303433B2 (ja) | 電子部品のリワーク方法 | |
JP2009231379A (ja) | 半田付け方法 | |
JP4639353B2 (ja) | 電子部品実装用基板及び実装方法並びに装置 | |
JPH11307927A (ja) | はんだ付け装置とはんだ付け方法 | |
JP3495207B2 (ja) | リフローはんだ付け装置 | |
TWI768956B (zh) | 焊接方法 | |
JP2018019000A (ja) | パワー半導体モジュール | |
JP5082428B2 (ja) | リード線を有する部品と基板との間のスペース調整方法 | |
Pandey et al. | Thermal profile optimization for ceramic column grid array package assembly in selective reflow system for high reliability applications | |
JP2008177447A (ja) | リフロー炉 | |
WO2015151433A1 (ja) | 部品実装基板 | |
JP2016092202A (ja) | リフローハンダ付け方法とリフローハンダ付け装置 | |
JP2012134365A (ja) | フローろう付け用の電子部品冷却治具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190319 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200526 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200618 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200923 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201008 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201125 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6800768 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |