JP6800523B2 - Package substrate processing method - Google Patents
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- JP6800523B2 JP6800523B2 JP2016196287A JP2016196287A JP6800523B2 JP 6800523 B2 JP6800523 B2 JP 6800523B2 JP 2016196287 A JP2016196287 A JP 2016196287A JP 2016196287 A JP2016196287 A JP 2016196287A JP 6800523 B2 JP6800523 B2 JP 6800523B2
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- 239000000758 substrate Substances 0.000 title claims description 97
- 238000003672 processing method Methods 0.000 title claims description 7
- 238000007789 sealing Methods 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000003754 machining Methods 0.000 description 21
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Description
本発明は、パッケージ基板の加工方法に関し、特にバリの発生を低減可能なパッケージ基板の加工方法に関する。 The present invention relates to a method for processing a package substrate, and more particularly to a method for processing a package substrate capable of reducing the occurrence of burrs.
ＩＣ、ＬＳＩ等の回路が形成された半導体チップを複数配設し該複数の半導体チップを樹脂封止して形成されたデバイス領域を複数有し、隣接するデバイス領域間に非デバイス領域を有するＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）基板等のパッケージ基板は、切削装置によって分割予定ラインに沿って切削されて、半導体チップとほぼ同一サイズのＣＳＰパッケージに分割される。 A CSP having a plurality of device regions formed by disposing a plurality of semiconductor chips on which circuits such as ICs and LSIs are formed and sealing the plurality of semiconductor chips with a resin, and having a non-device region between adjacent device regions. A package substrate such as a (Chip Size Package) substrate is cut along a planned division line by a cutting device and divided into CSP packages having substantially the same size as a semiconductor chip.
樹脂封止による反りの発生を低減するために、パッケージ基板はデバイス領域（複数の半導体チップが配設され樹脂封止された領域）と、非デバイス領域（半導体チップが存在せず、樹脂封止されない領域）とが交互に隣接するように設計されている。 In order to reduce the occurrence of warpage due to resin sealing, the package substrate has a device region (a region in which a plurality of semiconductor chips are arranged and resin-sealed) and a non-device region (a region in which no semiconductor chip exists and resin-sealed). It is designed so that the areas that are not used are alternately adjacent to each other.
従来のパッケージ基板の加工方法では、パッケージ基板は複数の電極が形成された電極面側から切削ブレードにより切削されて、個々のパッケージに分割されていた。このように従来の加工方法では、切削ブレードによって電極面側からパッケージ基板を切削するため、切削時に電極にバリが発生するという問題があった。電極からバリが伸長すると、隣り合う電極同士が繋がりショートしたり、チップの電極が接続される相手側の電極との接触不良が発生するという問題がある。 In the conventional method of processing a package substrate, the package substrate is cut by a cutting blade from the electrode surface side on which a plurality of electrodes are formed, and is divided into individual packages. As described above, in the conventional processing method, since the package substrate is cut from the electrode surface side by the cutting blade, there is a problem that burrs are generated on the electrodes during cutting. When the burr extends from the electrodes, there is a problem that adjacent electrodes are connected to each other and short-circuited, or poor contact with the electrode on the other side to which the electrode of the chip is connected occurs.
そこで、特開２０１５−１０９３４９号公報では、分割ステップを実施したパッケージ基板に表面から粉末状のドライアイスを吹きかけて、切削により電極から伸長したバリを除去するバリ除去ステップを含むパッケージ基板の加工方法が提案されている。 Therefore, in Japanese Patent Application Laid-Open No. 2015-109349, a method for processing a package substrate including a deburring step of spraying powdered dry ice from the surface of the package substrate subjected to the division step to remove burrs extending from the electrodes by cutting. Has been proposed.
然し、特許文献１に記載されたパッケージ基板の加工方法でも、電極のバリを完全に除去するのは難しい。特に、キャビティが形成されたキャビティ電極の場合には、キャビティ内にバリが大きく発生するが、ドライアイスの噴射では除去が困難である。 However, even with the package substrate processing method described in Patent Document 1, it is difficult to completely remove the burr of the electrode. In particular, in the case of a cavity electrode in which a cavity is formed, large burrs are generated in the cavity, but it is difficult to remove them by spraying dry ice.
本発明はこのような点に鑑みてなされたものであり、その目的とするところは、電極に発生するバリを低減可能なパッケージ基板の加工方法を提供することである。 The present invention has been made in view of these respects, and an object of the present invention is to provide a method for processing a package substrate capable of reducing burrs generated on electrodes.
本発明によると、複数の分割予定ラインで区画された各領域にそれぞれデバイスが配設されたデバイス領域と、該デバイス領域を囲繞する外周余剰領域とを有するベース基板を備え、該各デバイスは樹脂封止部で封止され、該ベース基板は各分割予定ラインを横断する複数の電極が形成された電極面と、該電極面と反対側の該樹脂封止部が形成された封止面とを有するパッケージ基板の加工方法であって、パッケージ基板の該樹脂封止部側を保持して該ベース基板の該電極面を露出させる第１保持ステップと、該第１保持ステップを実施した後、該電極面の該外周余剰領域において該分割予定ラインに対応して該ベース基板を厚み方向に切断して該封止面に至る加工痕を形成する加工痕形成ステップと、該加工痕形成ステップを実施した後、紫外線の照射によって硬化する接着部材を介して該ベース基板の該電極面に支持部材を配設する支持部材配設ステップと、該支持部材配設ステップを実施した後、該支持部材を介して該パッケージ基板を吸引保持し、該ベース基板の該封止面を露出させる第２保持ステップと、該第２保持ステップを実施した後、該加工痕を検出することで該分割予定ラインを検出する分割予定ライン検出ステップと、該分割予定ライン検出ステップを実施した後、該分割予定ラインに沿って切削ブレードで該パッケージ基板を該ベース基板の該封止面側から切削してパッケージ基板を個々のチップへと分割する分割ステップと、該分割ステップを実施する前に、該接着部材に紫外線を照射して該接着部材を硬化させる接着部材硬化ステップと、を備えたことを特徴とするパッケージ基板の加工方法が提供される。 According to the present invention, a base substrate having a device area in which a device is arranged in each area partitioned by a plurality of planned division lines and an outer peripheral surplus area surrounding the device area is provided, and each device is made of a resin. The base substrate is sealed with a sealing portion, and the base substrate has an electrode surface on which a plurality of electrodes crossing each planned division line are formed and a sealing surface on which the resin sealing portion on the opposite side of the electrode surface is formed. The first holding step of holding the resin-sealed portion side of the package substrate to expose the electrode surface of the base substrate, and the first holding step after performing the first holding step. A machining mark forming step of cutting the base substrate in the thickness direction in the outer peripheral surplus region of the electrode surface corresponding to the planned division line to form a machining mark reaching the sealing surface, and a machining mark forming step. After the implementation, the support member disposing step for disposing the support member on the electrode surface of the base substrate via the adhesive member cured by irradiation with ultraviolet rays , and the support member disposing step, and then the support member. After performing the second holding step of sucking and holding the package substrate and exposing the sealing surface of the base substrate and the second holding step, the processing mark is detected to detect the planned division line. After performing the planned division line detection step and the planned division line detection step, the package substrate is cut from the sealing surface side of the base substrate with a cutting blade along the planned division line. It is characterized by comprising a dividing step for dividing the adhesive member into individual chips, and an adhesive member curing step for curing the adhesive member by irradiating the adhesive member with ultraviolet rays before carrying out the dividing step. A method for processing a package substrate is provided.
本発明のパッケージ基板の加工方法によると、パッケージ基板の電極面を支持部材で支持した状態でパッケージ基板を樹脂封止部側から切削する分割ステップを実施するので、支持部材が電極の伸びを抑制し、電極表面に発生するバリを低減できる。 According to the processing method of the package substrate of the present invention, since the division step of cutting the package substrate from the resin sealing portion side is performed while the electrode surface of the package substrate is supported by the support member, the support member suppresses the elongation of the electrode. However, burrs generated on the electrode surface can be reduced.
パッケージ基板の電極面側を支持部材で支持した状態では分割予定ラインは露出していないが、加工痕形成ステップを実施することにより、加工痕に基づいて分割予定ラインを検出することができる。 Although the planned division line is not exposed when the electrode surface side of the package substrate is supported by the support member, the planned division line can be detected based on the processing mark by performing the processing mark forming step.
以下、本発明の実施形態を図面を参照して詳細に説明する。図１を参照すると、本発明の加工方法の対象となるパッケージ基板の一例の平面図が示されている。パッケージ基板２は、例えば矩形状のベース基板４を有しており、ベース基板４は、複数の電極１２が形成された電極面４ａと、電極面４ａと反対側の封止面４ｂとを有している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. With reference to FIG. 1, a plan view of an example of a package substrate which is a target of the processing method of the present invention is shown. The package substrate 2 has, for example, a rectangular base substrate 4, and the base substrate 4 has an electrode surface 4a on which a plurality of electrodes 12 are formed and a sealing surface 4b on the opposite side of the electrode surface 4a. doing.
ベース基板４の外周余剰領域５及び非デバイス領域５ａによって囲繞された領域には、本実施形態では３つのデバイス領域６ａ，６ｂ，６ｃが存在する。ベース基板４は、例えば金属フレームから構成される。 In the present embodiment, three device regions 6a, 6b, and 6c exist in the region surrounded by the outer peripheral surplus region 5 and the non-device region 5a of the base substrate 4. The base substrate 4 is composed of, for example, a metal frame.
各デバイス領域６ａ，６ｂ，６ｃにおいては、互いに直交するように縦横に設けられた第１及び第２分割予定ライン８ａ，８ｂによって区画された複数のデバイス搭載部１０が画成され、個々のデバイス搭載部１０には複数の電極１２が形成されている。 In each device area 6a, 6b, 6c, a plurality of device mounting portions 10 partitioned by first and second planned division lines 8a, 8b provided vertically and horizontally so as to be orthogonal to each other are defined, and individual devices are defined. A plurality of electrodes 12 are formed on the mounting portion 10.
各電極１２同士は、ベース基板４にモールドされた樹脂により絶縁されている。第１分割予定ライン８ａ及び第２分割予定ライン８ｂを切削することにより、その両側に各デバイスの電極１２が現れる。 Each of the electrodes 12 is insulated from each other by a resin molded on the base substrate 4. By cutting the first scheduled division line 8a and the second scheduled division line 8b, the electrodes 12 of each device appear on both sides thereof.
図３に示すように、ベース基板４のデバイス搭載部１０にはデバイス１４が実装されており、各デバイス１４の電極とベース基板４の電極１２とは、例えば金ワイヤー１６で接続されている。 As shown in FIG. 3, the device 14 is mounted on the device mounting portion 10 of the base substrate 4, and the electrode of each device 14 and the electrode 12 of the base substrate 4 are connected by, for example, a gold wire 16.
図２及び図３に示すように、各デバイス領域６ａ，６ｂ，６ｃの裏面、即ちベース基板４の封止面４ｂ上には樹脂封止部１８が形成されており、各デバイス１４は樹脂により封止されている。 As shown in FIGS. 2 and 3, a resin sealing portion 18 is formed on the back surface of each device region 6a, 6b, 6c, that is, on the sealing surface 4b of the base substrate 4, and each device 14 is made of resin. It is sealed.
以下、図４乃至図１０を参照して、本発明実施形態のパッケージ基板の加工方法について説明する。まず、図４に示すように、パッケージ基板２の樹脂封止部１８に保護テープ３０を貼着し、切削装置のチャックテーブル２０で保護テープ３０を介してパッケージ基板２の樹脂封止部側を吸引保持する第１保持ステップを実施する。 Hereinafter, a method for processing the package substrate according to the embodiment of the present invention will be described with reference to FIGS. 4 to 10. First, as shown in FIG. 4, a protective tape 30 is attached to the resin sealing portion 18 of the package substrate 2, and the resin sealing portion side of the package substrate 2 is pressed via the protective tape 30 on the chuck table 20 of the cutting device. The first holding step of sucking and holding is performed.
図４において、チャックテーブル２０のポーラスセラミックス等から形成された吸引保持部２２は、吸引路２４及び電磁切替弁２６を介して吸引源２８に選択的に接続されている。 In FIG. 4, the suction holding portion 22 formed of porous ceramics or the like of the chuck table 20 is selectively connected to the suction source 28 via the suction path 24 and the electromagnetic switching valve 26.
従って、パッケージ基板２をチャックテーブル２０上に載置した状態で、図４に示すように、電磁切替弁２６を連通位置に切り替えることにより吸引保持部２２に負圧を導入し、パッケージ基板２を保護テープ３０を介して吸引保持することができる。 Therefore, with the package substrate 2 placed on the chuck table 20, negative pressure is introduced into the suction holding portion 22 by switching the electromagnetic switching valve 26 to the communication position as shown in FIG. 4, and the package substrate 2 is placed. It can be sucked and held via the protective tape 30.
第１保持ステップの他の実施形態として、複数の切削ブレード用逃げ溝が形成された治具テーブルでパッケージ基板２の樹脂封止部側を直接吸引保持するようにしてもよい。 As another embodiment of the first holding step, the resin sealing portion side of the package substrate 2 may be directly sucked and held by a jig table in which a plurality of relief grooves for cutting blades are formed.
第１保持ステップを実施した後、パッケージ基板２の外周余剰領域５において、分割予定ライン８ａ，８ｂに対応してパッケージ基板２のベース基板４を厚み方向に切断し、ベース基板４の封止面４ｂに至る加工痕３４を形成する加工痕形成ステップを実施する。 After performing the first holding step, the base substrate 4 of the package substrate 2 is cut in the thickness direction corresponding to the planned division lines 8a and 8b in the outer peripheral surplus region 5 of the package substrate 2, and the sealing surface of the base substrate 4 is cut. A machining mark forming step for forming the machining mark 34 up to 4b is carried out.
この加工痕形成ステップでは、図５に示すように、矢印Ｒ１方向に高速回転する切削ブレード３２を矢印Ｚ１方向に移動して、分割予定ライン８ａ，８ｂの延長線上の外周余剰領域５のベース基板４を厚み方向に切断して、ベース基板４の封止面４ｂに至る加工痕３４を形成する。この加工痕３４の形成位置は、例えば、図６に示すように、各デバイス領域６ａ，６ｂ，６ｃとも最初と最後の分割予定ライン８ａ，８ｂに対応して形成する。 In this machining mark forming step, as shown in FIG. 5, the cutting blade 32 rotating at high speed in the direction of arrow R1 is moved in the direction of arrow Z1 to move the base substrate of the outer peripheral excess region 5 on the extension lines of the planned division lines 8a and 8b. 4 is cut in the thickness direction to form a processing mark 34 reaching the sealing surface 4b of the base substrate 4. As shown in FIG. 6, for example, the processing marks 34 are formed at the respective device regions 6a, 6b, and 6c corresponding to the first and last scheduled division lines 8a, 8b.
そして、後に説明する分割予定ライン検出ステップでは、各デバイス領域の最初と最後の分割予定ラインに対応して形成された加工痕３４をそれぞれ検出し、検出した加工痕３４間の距離を分割したい領域数で割ることで割り出し送り量を算出する。 Then, in the scheduled division line detection step described later, the machining marks 34 formed corresponding to the first and last scheduled split lines of each device region are detected, and the distance between the detected machining marks 34 is desired to be divided. The index feed amount is calculated by dividing by the number.
代替実施形態として、全ての分割予定ライン８ａ，８ｃに対応する外周余剰領域５に加工痕３４を形成するようにしてもよい。この場合には、後に説明する分割予定ライン検出ステップでは、各分割予定ラインを検出できるため、より精度よくパッケージ基板の分割が可能となる。パッケージ基板２の精度に応じて加工痕形成位置を適宜設定する。各加工痕３４はベース基板４を厚み方向に完全切断したため、ベース基板４の封止面４ｂ側から検出可能である。 As an alternative embodiment, the machining marks 34 may be formed in the outer peripheral surplus region 5 corresponding to all the scheduled division lines 8a and 8c. In this case, since each scheduled division line can be detected in the scheduled division line detection step described later, the package substrate can be divided more accurately. The processing mark formation position is appropriately set according to the accuracy of the package substrate 2. Since each processing mark 34 is completely cut in the thickness direction of the base substrate 4, it can be detected from the sealing surface 4b side of the base substrate 4.
加工痕形成ステップを実施した後、接着部材を介してベース基板４の電極面４ａに支持部材を配設する支持部材配設ステップを実施する。図７（Ａ）は支持部材配設ステップの第１実施形態を示しており、ベース基板４の電極面４ａに接着部材及び支持部材としての紫外線硬化テープ（ＵＶテープ）３６を貼着する。 After performing the machining mark forming step, the support member disposing step of disposing the support member on the electrode surface 4a of the base substrate 4 via the adhesive member is performed. FIG. 7A shows a first embodiment of the support member disposing step, in which an adhesive member and an ultraviolet curable tape (UV tape) 36 as a support member are attached to the electrode surface 4a of the base substrate 4.
紫外線硬化テープ３６は、塩化ビニル等の樹脂からなり、支持部材に相当する基材３８上に接着部材に相当する紫外線硬化型の接着層（糊層）４０が配設されて構成されている。パッケージ基板２の電極１２にキャビティが形成されているキャビティ電極の場合には、キャビティを接着層４０で埋めるのが好ましい。従って、キャビティが接着部材で充填され得る厚みの接着層４０を有するＵＶテープ３６を選択する。 The ultraviolet curable tape 36 is made of a resin such as vinyl chloride, and is configured by disposing an ultraviolet curable adhesive layer (glue layer) 40 corresponding to an adhesive member on a base material 38 corresponding to a support member. In the case of a cavity electrode in which a cavity is formed in the electrode 12 of the package substrate 2, it is preferable to fill the cavity with the adhesive layer 40. Therefore, the UV tape 36 having the adhesive layer 40 having a thickness such that the cavity can be filled with the adhesive member is selected.
図７（Ｂ）を参照すると、支持部材配設ステップの第２実施形態の断面図が示されている。本実施形態の場合には、ガラス又は紫外線に対して透明な樹脂から形成されたサブストレート（支持部材）４２を紫外線硬化型接着剤（接着部材）４４でベース基板４の電極面４ａに貼着する。 With reference to FIG. 7B, a cross-sectional view of the second embodiment of the support member disposing step is shown. In the case of the present embodiment, a substrate (support member) 42 formed of glass or a resin transparent to ultraviolet rays is attached to the electrode surface 4a of the base substrate 4 with an ultraviolet curable adhesive (adhesive member) 44. To do.
キャビティ電極の場合には、紫外線硬化型接着剤でキャビティを埋めるのが好ましい。紫外線硬化型接着剤に替えて、熱硬化型接着剤を使用してサブストレート４２をベース基板４の電極面４ａに貼着するようにしてもよい。 In the case of a cavity electrode, it is preferable to fill the cavity with a UV curable adhesive. Instead of the ultraviolet curable adhesive, the thermosetting adhesive may be used to attach the substrate 42 to the electrode surface 4a of the base substrate 4.
図７（Ａ）に示す支持部材配設ステップを実施した後、図８に示すように、紫外線照射ランプ４６からＵＶテープ３６に紫外線を照射して、接着層４０を硬化させておくのが好ましい。硬化された接着層４０により電極１２に発生するバリの伸びを抑制できる。 After performing the support member disposing step shown in FIG. 7A, it is preferable to irradiate the UV tape 36 with ultraviolet rays from the ultraviolet irradiation lamp 46 to cure the adhesive layer 40 as shown in FIG. .. The cured adhesive layer 40 can suppress the elongation of burrs generated on the electrode 12.
支持部材配設ステップを実施した後、図９に示すように、支持部材３６をチャックテーブル２０で吸引保持してベース基板４の封止面４ｂ及び樹脂封止部１８を露出させる第２保持ステップを実施する。 After performing the support member disposing step, as shown in FIG. 9, a second holding step of sucking and holding the support member 36 on the chuck table 20 to expose the sealing surface 4b and the resin sealing portion 18 of the base substrate 4. To carry out.
第２保持ステップを実施した後、切削装置に装備されている撮像ユニットでパッケージ基板２を樹脂封止部１８側から撮像し、ベース基板４の封止面４ｂに各分割予定ラインの一端側と他端側に対応して形成されている対向する一対の加工痕３４を検出することで、一対の加工痕３４を結んだ直線に対応する分割予定ライン８ａ，８ｂを検出する分割予定ライン検出ステップを実施する。 After performing the second holding step, the package substrate 2 is imaged from the resin sealing portion 18 side by the imaging unit equipped in the cutting device, and the sealing surface 4b of the base substrate 4 is formed on one end side of each planned division line. A scheduled division line detection step of detecting a pair of scheduled division lines 8a and 8b corresponding to a straight line connecting the pair of machining marks 34 by detecting a pair of opposed machining marks 34 formed corresponding to the other end side. To carry out.
加工痕形成ステップで、図６に示すように、各デバイス領域６ａ，６ｂ，６ｃとも最初と最後の分割予定ライン８ａ，８ｂに対応して加工痕を形成した場合には、検出した最初と最後の加工痕３４間の距離を分割すべき領域数、即ち最初と最後の加工痕間にある分割予定ライン数に１を加えた数で割ることで各デバイス領域における割り出し送り量を算出する。 In the machining mark forming step, as shown in FIG. 6, when the machining marks are formed corresponding to the first and last scheduled division lines 8a and 8b in each of the device regions 6a, 6b and 6c, the detected first and last The index feed amount in each device region is calculated by dividing the distance between the machining marks 34 of No. 34 by the number of regions to be divided, that is, the number of scheduled division lines between the first and last machining marks plus one.
一方、加工痕形成ステップで全ての分割予定ライン８ａ，８ｃに対応する外周余剰領域５に加工痕３４を形成した場合には、検出した全ての分割予定ラインの位置を記憶しておき、記憶した位置に基づいて次の分割ステップでパッケージ基板を切削する。 On the other hand, when the machining marks 34 are formed in the outer peripheral surplus area 5 corresponding to all the scheduled division lines 8a and 8c in the machining mark forming step, the positions of all the detected scheduled division lines are stored and stored. The package substrate is cut in the next split step based on the position.
分割予定ライン検出ステップを実施した後、図１０に示すように、矢印Ｒ１方向に高速回転する切削ブレード３２でベース基板４の分割予定ライン８ａを支持部材３６に達するまで切り込み、チャックテーブル２０を矢印Ｘ１方向に加工送りすることにより、パッケージ基板２の分割予定ライン８ａを支持基板４の封止面４ｂ側から切削する（分割ステップ）。 After performing the planned division line detection step, as shown in FIG. 10, the cutting blade 32 rotating at high speed in the direction of arrow R1 cuts the planned division line 8a of the base substrate 4 until it reaches the support member 36, and the chuck table 20 is indicated by the arrow. By processing and feeding in the X1 direction, the planned division line 8a of the package substrate 2 is cut from the sealing surface 4b side of the support substrate 4 (division step).
切削ブレード３２を矢印Ｘ１方向に直交する方向に割り出し送りしながら、第１の方向に伸長する全ての分割予定ライン８ａをベース基板４の封止面４ｂ側から切削する。次いで、チャックテーブル２０を９０°回転してから、第１の方向に伸長する分割予定ライン８ａに直交する方向に伸長する第２の分割予定ライン８ｂに沿ってベース基板４を封止面４ｂ側から切削して、パッケージ基板２を個々のチップ（パッケージ）へと分割する。 While indexing and feeding the cutting blade 32 in the direction orthogonal to the arrow X1, all the scheduled division lines 8a extending in the first direction are cut from the sealing surface 4b side of the base substrate 4. Next, after rotating the chuck table 20 by 90 °, the base substrate 4 is placed on the sealing surface 4b side along the second scheduled division line 8b extending in the direction orthogonal to the planned division line 8a extending in the first direction. The package substrate 2 is divided into individual chips (packages).
上述した本実施形態のパッケージ基板の加工方法によると、パッケージ基板２の分割ステップを、支持部材３６がベース基板４の電極面４ａに貼着された状態でベース基板４の封止面４ｂ側から実施するため、支持部材３６で切削された電極８ａ，８ｂの伸びを抑制でき、電極８ａ，８ｂの表面に発生するバリを低減することができる。 According to the package substrate processing method of the present embodiment described above, the division step of the package substrate 2 is performed from the sealing surface 4b side of the base substrate 4 in a state where the support member 36 is attached to the electrode surface 4a of the base substrate 4. Therefore, the elongation of the electrodes 8a and 8b cut by the support member 36 can be suppressed, and the burrs generated on the surfaces of the electrodes 8a and 8b can be reduced.
ベース基板４の電極面４ａ側を支持部材３６で支持した状態では分割予定ライン８ａ，８ｂは露出していないが、加工痕形成ステップを実施することにより、加工痕３４がベース基板４の封止面４ｂ側に露出するため分割予定ライン８ａ，８ｂを明瞭に検出することができる。 Although the planned division lines 8a and 8b are not exposed when the electrode surface 4a side of the base substrate 4 is supported by the support member 36, the machining marks 34 seal the base substrate 4 by performing the machining mark forming step. Since it is exposed on the surface 4b side, the scheduled division lines 8a and 8b can be clearly detected.
２ パッケージ基板
４ ベース基板
４ａ 電極面
４ｂ 封止面
５ 外周余剰領域
６ａ，６ｂ，６ｃ デバイス領域
８ａ，８ｂ 分割予定ライン
１０ デバイス搭載部
１２ 電極
１４ デバイス
１８ 樹脂封止部
２０ チャックテーブル
３０ 保護テープ
３２ 切削ブレード
３４ 加工痕
３６ ＵＶテープ
４２ サブストレート
４６ 紫外線照射ランプ
2 Package substrate 4 Base substrate 4a Electrode surface 4b Encapsulation surface 5 Outer peripheral surplus area 6a, 6b, 6c Device area 8a, 8b Scheduled division line 10 Device mounting part 12 Electrode 14 Device 18 Resin sealing part 20 Chuck table 30 Protective tape 32 Cutting blade 34 Machining mark 36 UV tape 42 Substraight 46 Ultraviolet irradiation lamp
Claims (1)
パッケージ基板の該樹脂封止部側を保持して該ベース基板の該電極面を露出させる第１保持ステップと、
該第１保持ステップを実施した後、該電極面の該外周余剰領域において該分割予定ラインに対応して該ベース基板を厚み方向に切断して該封止面に至る加工痕を形成する加工痕形成ステップと、
該加工痕形成ステップを実施した後、紫外線の照射によって硬化する接着部材を介して該ベース基板の該電極面に支持部材を配設する支持部材配設ステップと、
該支持部材配設ステップを実施した後、該支持部材を介して該パッケージ基板を吸引保持し、該ベース基板の該封止面を露出させる第２保持ステップと、
該第２保持ステップを実施した後、該加工痕を検出することで該分割予定ラインを検出する分割予定ライン検出ステップと、
該分割予定ライン検出ステップを実施した後、該分割予定ラインに沿って切削ブレードで該パッケージ基板を該ベース基板の該封止面側から切削してパッケージ基板を個々のチップへと分割する分割ステップと、
該分割ステップを実施する前に、該接着部材に紫外線を照射して該接着部材を硬化させる接着部材硬化ステップと、
を備えたことを特徴とするパッケージ基板の加工方法。 A base substrate having a device area in which a device is arranged in each area divided by a plurality of planned division lines and an outer peripheral surplus area surrounding the device area is provided, and each device is sealed with a resin sealing portion. The base substrate is a package substrate having an electrode surface on which a plurality of electrodes crossing each planned division line are formed and a sealing surface on which the resin sealing portion on the opposite side of the electrode surface is formed. It ’s a processing method,
The first holding step of holding the resin-sealed portion side of the package substrate and exposing the electrode surface of the base substrate,
After performing the first holding step, the base substrate is cut in the thickness direction corresponding to the planned division line in the outer peripheral surplus region of the electrode surface to form a processing mark reaching the sealing surface. Formation steps and
After performing the processing mark forming step, a support member disposing step of disposing the support member on the electrode surface of the base substrate via an adhesive member that is cured by irradiation with ultraviolet rays, and a support member disposing step.
After performing the support member disposing step, a second holding step of sucking and holding the package substrate through the support member to expose the sealing surface of the base substrate, and
After performing the second holding step, a division schedule line detection step for detecting the division schedule line by detecting the processing mark, and a division schedule line detection step
After performing the planned division line detection step, the package substrate is cut from the sealing surface side of the base substrate with a cutting blade along the planned division line to divide the package substrate into individual chips. When,
Before carrying out the division step, the adhesive member curing step of irradiating the adhesive member with ultraviolet rays to cure the adhesive member, and
A method of processing a package substrate, which is characterized by being equipped with.
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