JP6778330B2 - 中空型押出プロファイルを用いた真空ポンプ - Google Patents
中空型押出プロファイルを用いた真空ポンプ Download PDFInfo
- Publication number
- JP6778330B2 JP6778330B2 JP2019536799A JP2019536799A JP6778330B2 JP 6778330 B2 JP6778330 B2 JP 6778330B2 JP 2019536799 A JP2019536799 A JP 2019536799A JP 2019536799 A JP2019536799 A JP 2019536799A JP 6778330 B2 JP6778330 B2 JP 6778330B2
- Authority
- JP
- Japan
- Prior art keywords
- pump
- vacuum
- vacuum pump
- extrusion profile
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001125 extrusion Methods 0.000 title claims description 14
- 238000004891 communication Methods 0.000 claims description 15
- 230000000694 effects Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
- F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
- F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
- F04F5/16—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids
- F04F5/20—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids for evacuating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
- F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
- F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
- F04F5/00—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow
- F04F5/14—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid
- F04F5/16—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids
- F04F5/20—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids for evacuating
- F04F5/22—Jet pumps, i.e. devices in which flow is induced by pressure drop caused by velocity of another fluid flow the inducing fluid being elastic fluid displacing elastic fluids for evacuating of multi-stage type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Jet Pumps And Other Pumps (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Description
前記吸入ポート6がエジェクターポンプ側に直接連結されるため、ポンプ1で具現することができる真空速度及び真空度が高くなく、
特に、流入口5側の仕上げ部材3は構造上相当な程度の幅wを有するにもかかわらず、真空ポンプ1の特性に関連して効率的に活用できない、
などの問題がある。
長手方向に上側の装着ホールと下側の真空チャンバーが隣接して平行に形成され、前記真空チャンバーの一面には吸着手段と連通する多数の連通ホールが形成された中空型プロファイルと、
一端が圧縮空気流入口、他端がその排出口であり、側壁には一つ以上の通孔が形成されたシリンダー型ポンプであって、前記装着ホール内に長手方向に配置及び固定される一つ以上のエジェクターポンプと、
前記プロファイルの両側開口にそれぞれ提供され、前記流入口又は排出口に対応する貫通ホールが形成された第1キャップ及び第2キャップを含み、前記流入口側の第1キャップは前記真空チャンバーと装着ホールを連通させる通路を有するように設計されたエンドキャップと、
を含む。
20 プロファイル
21 装着ホール
22 真空チャンバー
23 連通ホール
24 T溝
25 包囲空間
30 エジェクターポンプ
31 流入口
32 排出口
33 通孔
34 固定部
35 シーリングリング
36 固定ボルト
37 環形溝
40 エンドキャップ
41 第1キャップ
42 第2キャップ
43、44 貫通ホール
45 通路
46 補助チャンバー
47 連通ホール
50 吸着手段
P 対象物
Claims (8)
- 長手方向に上側の装着ホール(21)と下側の真空チャンバー(22)が隣接して平行に形成され、前記真空チャンバーの一面には吸着手段(50)と連通する多数の連通ホール(23)が形成された中空型押出プロファイル(20)と、
一端が圧縮空気流入口(31)、他端がその排出口(32)であり、側壁には一つ以上の通孔(33)が形成されたシリンダー型ポンプであって、前記装着ホール(21)内に長手方向に配置及び固定される一つ以上のエジェクターポンプ(30)と、
前記中空型押出プロファイルの両側開口にそれぞれ提供され、前記流入口又は排出口に対応する貫通ホール(43、44)が形成された第1キャップ(41)及び第2キャップ(42)を含み、前記流入口側の第1キャップ(41)は真空チャンバー(22)と装着ホール(21)を連通させる連結通路(45)を有するように設計されたエンドキャップ(40)と、
を含み、
前記装着ホール(21)と真空チャンバー(22)は前記中空型押出プロファイル(20)自体内では互いに連通しない要素として存在することを特徴とする、中空型押出プロファイルを用いた真空ポンプ。 - 前記第1キャップ(41)は、その下部に、前記真空チャンバー(22)と空間的に連結されるように形成された補助チャンバー(46)を含み、前記補助チャンバー(46)の一側に前記連結通路(45)が形成されるように設計されたことを特徴とする、請求項1に記載の中空型押出プロファイルを用いた真空ポンプ。
- 前記補助チャンバー(46)の一面には吸着手段(50)と連通する連通ホール(47)が形成されたことを特徴とする、請求項2に記載の中空型押出プロファイルを用いた真空ポンプ。
- 前記吸着手段(50)は真空チャンバー(22)及び補助チャンバー(46)の連通ホール(23、47)側の一面に付着されるパッドタイプ手段、又は前記連通ホール(23、47)に装着又は連結されるコップタイプ手段であることを特徴とする、請求項3に記載の中空型押出プロファイルを用いた真空ポンプ。
- 前記エジェクターポンプ(30)は排出口(32)側の端部に形成されたリング形の固定部(34)を含み、前記固定部(34)はその外径部が装着ホール(21)の内面に密着して固定されることを特徴とする、請求項1に記載の中空型押出プロファイルを用いた真空ポンプ。
- 前記エジェクターポンプ(30)は固定部(34)を別に備え、排出口(32)側の端部が前記固定部(34)に挿合されることを特徴とする、請求項5に記載の中空型押出プロファイルを用いた真空ポンプ。
- 前記固定部(34)によって装着ホール(21)の一部に前記エジェクターポンプ(30)を取り囲む包囲空間(25)が形成され、前記連結通路(45)は真空チャンバー(22)と前記包囲空間(25)を連通させることを特徴とする、請求項5に記載の中空型押出プロファイルを用いた真空ポンプ。
- 前記固定部(34)は外径部に形成された溝(37)を含み、固定ボルト(36)が前記中空型押出プロファイル(20)の側壁を貫通し、その端部が前記溝(37)に挿入されることを特徴とする、請求項5に記載の中空型押出プロファイルを用いた真空ポンプ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0120525 | 2016-09-21 | ||
KR1020160120525A KR101685998B1 (ko) | 2016-09-21 | 2016-09-21 | 프로파일을 이용한 진공 펌프 |
PCT/KR2017/007006 WO2018056558A1 (ko) | 2016-09-21 | 2017-07-03 | 프로파일을 이용한 진공 펌프 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019529808A JP2019529808A (ja) | 2019-10-17 |
JP6778330B2 true JP6778330B2 (ja) | 2020-10-28 |
Family
ID=57574861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019536799A Active JP6778330B2 (ja) | 2016-09-21 | 2017-07-03 | 中空型押出プロファイルを用いた真空ポンプ |
Country Status (7)
Country | Link |
---|---|
US (1) | US11149752B2 (ja) |
EP (1) | EP3517788B1 (ja) |
JP (1) | JP6778330B2 (ja) |
KR (1) | KR101685998B1 (ja) |
CN (1) | CN109715959B (ja) |
ES (1) | ES2858455T3 (ja) |
WO (1) | WO2018056558A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102344214B1 (ko) | 2021-05-18 | 2021-12-28 | (주)브이텍 | 진공 이젝터 펌프 |
Family Cites Families (31)
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SE427955B (sv) | 1980-05-21 | 1983-05-24 | Piab Ab | Multiejektor |
IL70239A (en) | 1983-11-15 | 1988-03-31 | Dan Greenberg | Multichamber ejector |
FR2575678B1 (fr) * | 1985-01-04 | 1988-06-03 | Saint Gobain Vitrage | Ejecteur pneumatique de poudre |
US4790054A (en) | 1985-07-12 | 1988-12-13 | Nichols William O | Multi-stage venturi ejector and method of manufacture thereof |
US4759691A (en) | 1987-03-19 | 1988-07-26 | Kroupa Larry G | Compressed air driven vacuum pump assembly |
SE466561B (sv) | 1988-06-08 | 1992-03-02 | Peter Tell | Multiejektoranordning |
US4880358A (en) | 1988-06-20 | 1989-11-14 | Air-Vac Engineering Company, Inc. | Ultra-high vacuum force, low air consumption pumps |
US5228839A (en) | 1991-05-24 | 1993-07-20 | Gast Manufacturing Corporation | Multistage ejector pump |
US5683227A (en) * | 1993-03-31 | 1997-11-04 | Smc Corporation | Multistage ejector assembly |
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JP3630522B2 (ja) * | 1997-03-24 | 2005-03-16 | 株式会社荏原製作所 | 真空排気システム |
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KR100629994B1 (ko) | 2005-12-30 | 2006-10-02 | 한국뉴매틱(주) | 진공 이젝터 펌프 |
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KR100890191B1 (ko) | 2007-10-08 | 2009-03-25 | 한국뉴매틱(주) | 진공 지그 |
US8672644B2 (en) | 2008-09-09 | 2014-03-18 | Dresser-Rand Company | Supersonic ejector package |
DE202009019074U1 (de) | 2009-11-24 | 2016-05-23 | J. Schmalz Gmbh | Druckluftbetriebener Unterdruckerzeuger |
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KR101251825B1 (ko) | 2011-09-06 | 2013-04-09 | 이우승 | 진공펌프 |
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KR101472503B1 (ko) | 2014-04-24 | 2014-12-12 | 한국뉴매틱(주) | 이젝터 어셈블리 및 진공펌프 |
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KR101699721B1 (ko) * | 2016-09-01 | 2017-02-13 | (주)브이텍 | 진공 펌프 및 그 어레이 |
-
2016
- 2016-09-21 KR KR1020160120525A patent/KR101685998B1/ko active IP Right Grant
-
2017
- 2017-07-03 EP EP17853272.7A patent/EP3517788B1/en active Active
- 2017-07-03 JP JP2019536799A patent/JP6778330B2/ja active Active
- 2017-07-03 CN CN201780058190.4A patent/CN109715959B/zh active Active
- 2017-07-03 US US16/330,741 patent/US11149752B2/en active Active
- 2017-07-03 ES ES17853272T patent/ES2858455T3/es active Active
- 2017-07-03 WO PCT/KR2017/007006 patent/WO2018056558A1/ko unknown
Also Published As
Publication number | Publication date |
---|---|
EP3517788A4 (en) | 2020-03-04 |
CN109715959A (zh) | 2019-05-03 |
US20190203738A1 (en) | 2019-07-04 |
EP3517788A1 (en) | 2019-07-31 |
KR101685998B1 (ko) | 2016-12-13 |
US11149752B2 (en) | 2021-10-19 |
EP3517788B1 (en) | 2020-12-16 |
JP2019529808A (ja) | 2019-10-17 |
ES2858455T3 (es) | 2021-09-30 |
WO2018056558A1 (ko) | 2018-03-29 |
CN109715959B (zh) | 2020-02-28 |
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