JP6777127B2 - Manufacturing method of light emitting device - Google Patents

Manufacturing method of light emitting device Download PDF

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JP6777127B2
JP6777127B2 JP2018172889A JP2018172889A JP6777127B2 JP 6777127 B2 JP6777127 B2 JP 6777127B2 JP 2018172889 A JP2018172889 A JP 2018172889A JP 2018172889 A JP2018172889 A JP 2018172889A JP 6777127 B2 JP6777127 B2 JP 6777127B2
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light
light emitting
reflecting
shielding frame
emitting device
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JP2019186513A (en
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賢介 山岡
賢介 山岡
博基 中井
博基 中井
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Nichia Corp
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Nichia Corp
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Description

本発明は、発光装置の製造方法に関する。 The present invention relates to a method for manufacturing a light emitting device.

近年、車載用途等の光源としてＬＥＤ等の発光素子を用いて構成した高出力の発光装置が用いられるようになってきている。例えば、特許文献１には、車載用の光源として用いられる高出力の発光装置において、発光素子の発光面の周縁部を覆うように放熱層を形成して、放熱効果を高めた発光装置が開示されている。特許文献１によれば、特許文献１の発光装置は、発光素子の発光面の周縁部を覆って放熱層を形成していることから、放熱特性の向上に加えシャープエッジの配光特性を得ることができ、例えば、車載用ヘッドランプ用途に適しているとされている。ここで、特許文献１における、シャープエッジの配光特性とは、光出射面の内側と外側における輝度差が大きいことと解される。 In recent years, a high-power light emitting device configured by using a light emitting element such as an LED has been used as a light source for in-vehicle applications. For example, Patent Document 1 discloses a high-power light-emitting device used as an in-vehicle light source, in which a heat-dissipating layer is formed so as to cover the peripheral edge of the light-emitting surface of the light-emitting element to enhance the heat-dissipating effect. Has been done. According to Patent Document 1, since the light emitting device of Patent Document 1 covers the peripheral edge of the light emitting surface of the light emitting element to form a heat radiating layer, the light radiating characteristics are improved and the light distribution characteristics of sharp edges are obtained. It can be used, for example, and is said to be suitable for in-vehicle headlamp applications. Here, the light distribution characteristic of the sharp edge in Patent Document 1 is understood to have a large difference in brightness between the inside and the outside of the light emitting surface.

特開２０１４−１２７６７９号公報Japanese Unexamined Patent Publication No. 2014-127679

しかしながら、車載用途等の高出力の光源としての使用される発光装置には発光素子が発光した光をより効率よく取り出すことが求められる。さらに、このような発光装置を安価に製造することができる製造方法が求められている。 However, a light emitting device used as a high-power light source for in-vehicle applications is required to more efficiently extract the light emitted by the light emitting element. Further, there is a demand for a manufacturing method capable of manufacturing such a light emitting device at low cost.

そこで、本発明は、光出射面の内側と外側における輝度差を大きくできかつ発光素子が発光した光を効率よく取り出すことができる発光装置を安価に製造することができる製造方法を提供することを目的とする。 Therefore, the present invention provides a manufacturing method capable of inexpensively manufacturing a light emitting device capable of increasing the brightness difference between the inside and the outside of the light emitting surface and efficiently extracting the light emitted by the light emitting element. The purpose.

本発明に係る第一実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、
開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、
第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さい板状の透光性部材を、前記第１面が前記シートと対向し、且つ前記透光性部材と前記開口部との間に空間を設けて前記開口部内に載置する透光性部材載置工程と、
第１光反射性樹脂を、前記空間に充填して第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが前記第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、
前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、
第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、
を含む。 The method for manufacturing a light emitting device according to the first embodiment according to the present invention includes a mounting step of mounting a light emitting element on a substrate and a mounting process.
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
A plate-shaped translucent member having a first surface and a second surface on the opposite side of the first surface, the outer periphery of the first surface being smaller than the inner circumference of the opening, and the first surface being said. A translucent member mounting step of facing the sheet and providing a space between the translucent member and the opening and mounting the translucent member in the opening.
The space is filled with the first light-reflecting resin to form the first light-reflecting member, and the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member. And the process of forming the light guide support member
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
including.

また、本発明に係る第二実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、
開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、
前記遮光フレーム上に第１光反射性樹脂を塗布する第１光反射性樹脂塗布工程と、
第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さく、前記第２面の外周が前記開口部の内周より大きい板状の透光性部材を、前記透光性部材と前記開口部との間に空間が形成される位置で前記第１面が前記シートと対向するように前記塗布した第１光反射性樹脂と接触させた後押圧して且つ前記空間に前記第１光反射性樹脂を流入させて第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、
前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、
第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、
を含む。 Further, the method of manufacturing the light emitting device of the second embodiment according to the present invention includes a mounting step of mounting a light emitting element on a substrate and a mounting process.
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and the outer circumference of the second surface is smaller than the inner circumference of the opening. The first light reflective member coated with a large plate-shaped translucent member so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first light-reflecting. A light guide support member forming step for producing a light guide support member supported by the member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
including.

また、本発明に係る第三実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、
開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、
前記遮光フレーム上に第１光反射性樹脂を塗布する第１光反射性樹脂塗布工程と、
第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さく、前記第２面の外周の一部が前記開口部の内周より大きい板状の透光性部材を、前記透光性部材と前記開口部との間に空間が形成される位置で前記第１面が前記シートと対向するように前記塗布した第１光反射性樹脂と接触させた後押圧して且つ前記空間に前記第１光反射性樹脂を流入させて第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、
前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、
第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、
を含む。 Further, the method for manufacturing the light emitting device of the third embodiment according to the present invention includes a mounting step of mounting the light emitting element on the substrate and
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and a part of the outer circumference of the second surface is the opening. The first coating of a plate-shaped translucent member larger than the inner circumference so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the light-reflecting resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first. A light guide support member forming step for producing a light guide support member supported by a light reflective member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
including.

以上のように構成された本発明に係る第一〜第三実施形態の発光装置の製造方法によれば、光出射面の内側と外側における輝度差を大きくできかつ発光素子が発光した光を効率よく取り出すことができる発光装置を安価に製造することができる。 According to the method for manufacturing the light emitting device according to the first to third embodiments according to the present invention configured as described above, the brightness difference between the inside and the outside of the light emitting surface can be increased, and the light emitted by the light emitting element can be made efficient. A light emitting device that can be taken out well can be manufactured at low cost.

第一又は第二実施形態に係る発光装置の製造方法により製造された発光装置の平面図の一例である。This is an example of a plan view of a light emitting device manufactured by the method for manufacturing a light emitting device according to the first or second embodiment. 第一又は第三実施形態に係る発光装置の製造方法により製造された発光装置の平面図の一例である。This is an example of a plan view of a light emitting device manufactured by the method for manufacturing a light emitting device according to the first or third embodiment. 第一実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ａに示すＡ−Ａ線に沿って切断したときの断面図である。It is sectional drawing when it cut along the line AA shown in FIG. 1A of the light emitting device when it was manufactured by the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第一実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ｂに示すＢ−Ｂ線に沿って切断したときの断面図である。It is sectional drawing when cut along the line BB shown in FIG. 1B of the light emitting device when manufactured by the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第一実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ｂに示すＣ−Ｃ線に沿って切断したときの断面図である。It is sectional drawing when it cut along the CC line shown in FIG. 1B of the light emitting device when it was manufactured by the manufacturing method of the light emitting device which concerns on 1st Embodiment. 第二実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ａに示すＡ−Ａ線に沿って切断したときの断面図である。It is sectional drawing when cut along the line AA shown in FIG. 1A of the light emitting device when manufactured by the manufacturing method of the light emitting device which concerns on 2nd Embodiment. 第三実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ｂに示すＢ−Ｂ線に沿って切断したときの断面図である。It is sectional drawing when cut along the line BB shown in FIG. 1B of the light emitting device when manufactured by the manufacturing method of the light emitting device which concerns on 3rd Embodiment. 第三実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ｂに示すＣ−Ｃ線に沿って切断したときの断面図である。It is sectional drawing when it cut along the CC line shown in FIG. 1B of the light emitting device when it was manufactured by the manufacturing method of the light emitting device which concerns on 3rd Embodiment. 第二実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ａに示すＡ−Ａ線に沿って切断したときの断面図の一例である。This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. 第二実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ａに示すＡ−Ａ線に沿って切断したときの断面図の一例である。This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. 第二実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ａに示すＡ−Ａ線に沿って切断したときの断面図の一例である。This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. 第二実施形態に係る発光装置の製造方法により製造された場合の発光装置の図１Ａに示すＡ−Ａ線に沿って切断したときの断面図の一例である。This is an example of a cross-sectional view of the light emitting device manufactured by the method for manufacturing the light emitting device according to the second embodiment when cut along the line AA shown in FIG. 1A. 第一実施形態の発光装置の製造方法において、発光素子を実装したときの断面図である。It is sectional drawing when the light emitting element is mounted in the manufacturing method of the light emitting device of 1st Embodiment. 第一実施形態の発光装置の製造方法において、遮光フレームをシートに載置したときの断面図である。It is sectional drawing when the light-shielding frame is placed on the sheet in the manufacturing method of the light emitting device of 1st Embodiment. 第一実施形態の発光装置の製造方法において、透光性部材をシートに載置したときの断面図である。It is sectional drawing when the translucent member is placed on the sheet in the manufacturing method of the light emitting device of 1st Embodiment. 第一実施形態の発光装置の製造方法において、導光支持部材を形成したときの断面図である。It is sectional drawing when the light guide support member was formed in the manufacturing method of the light emitting device of 1st Embodiment. 第一実施形態の発光装置の製造方法において、導光支持部材を発光素子上に固定したときの断面図である。It is sectional drawing when the light guide support member is fixed on the light emitting element in the manufacturing method of the light emitting device of 1st Embodiment. 第一実施形態の発光装置の製造方法において、光反射性樹脂を充填する様子を示す断面図である。It is sectional drawing which shows the state of filling with the light reflective resin in the manufacturing method of the light emitting device of 1st Embodiment. 第二実施形態の発光装置の製造方法において、遮光フレーム上に第１光反射性樹脂を塗布したときの断面図である。It is sectional drawing when the 1st light reflective resin was applied on the light shielding frame in the manufacturing method of the light emitting device of 2nd Embodiment. 第二実施形態の発光装置の製造方法において、透光性部材を光反射性樹脂と接触させた後押圧したときの断面図である。It is sectional drawing when the translucent member was brought into contact with a light-reflecting resin and then pressed in the manufacturing method of the light emitting device of 2nd Embodiment. 第二実施形態の発光装置の製造方法において、導光支持部材を形成したときの断面図である。It is sectional drawing when the light guide support member was formed in the manufacturing method of the light emitting device of 2nd Embodiment.

本発明に係る実施形態の製造方法では、まず、発光素子が実装された基板と、遮光フレーム及び透光性部材が光反射性部材で支持された導光支持部材とを準備する。次いで、当該基板に実装された発光素子上に導光支持部材を転写し、その後、発光素子を囲む光反射性部材を形成する。このような方法であれば、複数の発光装置を製造する際、複数の単位領域を含む発光素子が実装された基板を準備し、基板の各単位領域に遮光フレーム及び透光性部材が光反射性部材で支持された状態の導光支持部材をそれぞれ載置することができるため、より効率よく発光装置を製造することが可能となる。 In the manufacturing method of the embodiment according to the present invention, first, a substrate on which a light emitting element is mounted and a light guide support member in which a light-shielding frame and a light-transmitting member are supported by a light-reflecting member are prepared. Next, the light guide support member is transferred onto the light emitting element mounted on the substrate, and then the light reflecting member surrounding the light emitting element is formed. According to such a method, when manufacturing a plurality of light emitting devices, a substrate on which a light emitting element including a plurality of unit regions is mounted is prepared, and a light-shielding frame and a translucent member reflect light in each unit region of the substrate. Since each of the light guide support members in a state of being supported by the sex member can be placed, it becomes possible to manufacture the light emitting device more efficiently.

以下、本発明に係る第一〜第三実施形態の発光装置の製造方法、及び該製造方法により得られる発光装置（以下、「実施形態の発光装置」と呼ぶことがある）について図面を参照しながら説明する。但し、以下に説明する実施形態は、本発明の技術思想を具体化するためのものであって、本発明を限定するものではない。以下の説明において参照する図面は、本発明に係る実施形態を概略的に示したものであるため、各部材のスケールや間隔及び位置関係等が誇張、あるいは、部材の一部の図示が省略されている場合がある。 Hereinafter, the drawings of the method for manufacturing the light emitting device according to the first to third embodiments according to the present invention and the light emitting device obtained by the manufacturing method (hereinafter, may be referred to as “light emitting device of the embodiment”) will be referred to. I will explain while. However, the embodiments described below are for embodying the technical idea of the present invention and do not limit the present invention. Since the drawings referred to in the following description schematically show the embodiment according to the present invention, the scale, spacing, positional relationship, etc. of each member are exaggerated, or a part of the members is not shown. May be.

＜実施形態の発光装置＞
実施形態の発光装置は、図１Ａ、図１Ｂ、図２Ａ〜図２Ｆに示すように、基板１０と基板１０上に設けられた発光素子１と、第２面が発光素子１の発光面に対向するように設けられた板状の透光性部材３と、を含み、さらに発光装置の光出射面を構成する透光性部材３の第１面３ａを露出させて、開口部を有する遮光フレームの開口部５ａと透光性部材３の側面の一部とを結合するように第１光反射性部材９ａが設けられており、第１光反射性部材９ａと基板１０との間に、発光素子１の側面を覆うように第２光反射性部材９ｂが設けられている。以下、第１光反射性部材９ａと第２光反射性部材９ｂとを合わせて「光反射性部材」と呼ぶことがある。
実施形態の発光装置では、透光性部材３の周りの光反射性部材の上面に、開口部５ａを有する遮光フレーム５が、開口部５ａの内側に透光性部材３の第１面３ａが位置するように設けられ、透光性部材３の第１面３ａが第１光反射性部材９ａ及び遮光フレーム５から露出している。 <Light emitting device of the embodiment>
In the light emitting device of the embodiment, as shown in FIGS. 1A, 1B, 2A to 2F, the substrate 10 and the light emitting element 1 provided on the substrate 10 and the second surface face the light emitting surface of the light emitting element 1. A light-shielding frame having an opening by exposing the first surface 3a of the translucent member 3 which includes a plate-shaped translucent member 3 provided so as to perform the light emitting device and further constitutes a light emitting surface of the light emitting device. A first light-reflecting member 9a is provided so as to connect the opening 5a of the above and a part of the side surface of the translucent member 3, and light is emitted between the first light-reflecting member 9a and the substrate 10. A second light reflective member 9b is provided so as to cover the side surface of the element 1. Hereinafter, the first light-reflecting member 9a and the second light-reflecting member 9b may be collectively referred to as a "light-reflecting member".
In the light emitting device of the embodiment, a light-shielding frame 5 having an opening 5a on the upper surface of the light-reflecting member around the translucent member 3 and a first surface 3a of the translucent member 3 inside the opening 5a. The first surface 3a of the translucent member 3 is exposed from the first light-reflecting member 9a and the light-shielding frame 5.

ここで特に、実施形態の発光装置では、上方から（つまり発光装置の光出射面側から）平面視したときに、開口部５ａの内周が発光装置の光出射面を構成する透光性部材３の第１面３ａの外周から離れて位置し、開口部５ａの内周と第１面３ａの外周との間に第１光反射性部材９ａが露出している。このようにして、発光装置の上面において、透光性部材３と遮光フレーム５とを、第１光反射性部材９ａの表面を介在させることにより分離し、かつ発光素子１の側面及び透光性部材３の側面と遮光フレーム５との間を、光反射性部材を介在させることにより分離している。 Here, in particular, in the light emitting device of the embodiment, when viewed in a plan view from above (that is, from the light emitting surface side of the light emitting device), the inner circumference of the opening 5a constitutes the light emitting surface of the light emitting device. The first light reflecting member 9a is exposed between the inner circumference of the opening 5a and the outer circumference of the first surface 3a, which is located away from the outer circumference of the first surface 3a of 3. In this way, on the upper surface of the light emitting device, the translucent member 3 and the light-shielding frame 5 are separated by interposing the surface of the first light reflecting member 9a, and the side surface of the light emitting element 1 and the translucent property. The side surface of the member 3 and the light-shielding frame 5 are separated by interposing a light-reflecting member.

以上のように構成された実施形態の発光装置は、光出射面と光出射面を取り囲む領域における輝度差を大きくでき、かつ発光素子が発光した光を効率よく取り出すことができる。実施形態の発光装置において、開口部５ａの内周と光出射面３ａの外周の間隔は、光出射面３ａの内側と外側における輝度差を大きくすることと発光素子が発光した光を効率よく取り出すこととを両立させるために５μｍ以上１５０μｍ以下であることが好ましく、より好ましくは４０μｍ以上６０μｍ以下とする。 The light emitting device of the embodiment configured as described above can increase the brightness difference between the light emitting surface and the region surrounding the light emitting surface, and can efficiently take out the light emitted by the light emitting element. In the light emitting device of the embodiment, the distance between the inner circumference of the opening 5a and the outer circumference of the light emitting surface 3a increases the difference in brightness between the inside and the outside of the light emitting surface 3a and efficiently extracts the light emitted by the light emitting element. In order to achieve both of these, it is preferably 5 μm or more and 150 μm or less, and more preferably 40 μm or more and 60 μm or less.

以下、実施形態の発光装置の種々の形態について説明する。
実施形態の発光装置では、平面視において、透光性部材３の第２面３ｂの面積は透光性部材３の第１面（つまり実質的に発光装置の光出射面）３ａの面積より大きくなっている。
透光性部材３の第１面３ａの面積を第２面３ｂよりも小さくすることにより、透光性部材３の第２面３ｂから入射される発光素子１からの出射光を、より小さな面積である第１面３aから放出させることができる。つまり、透光性部材３を通過することにより発光面の面積が絞られて、高輝度でより遠くを照らすことが可能となる。正面輝度の高い発光装置は、特にヘッドライト等の車載照明に適している。なお、車載照明においては、その灯火類の色についての様々な規定が有り、例えば前照灯（ヘッドライト）の灯光の色は白色または淡黄色であり、そのすべてが同一であることが定められている。 Hereinafter, various embodiments of the light emitting device of the embodiment will be described.
In the light emitting device of the embodiment, in a plan view, the area of the second surface 3b of the translucent member 3 is larger than the area of the first surface (that is, substantially the light emitting surface of the light emitting device) 3a of the translucent member 3. It has become.
By making the area of the first surface 3a of the translucent member 3 smaller than that of the second surface 3b, the light emitted from the light emitting element 1 incident from the second surface 3b of the translucent member 3 has a smaller area. It can be emitted from the first surface 3a. That is, by passing through the translucent member 3, the area of the light emitting surface is narrowed down, and it becomes possible to illuminate a farther distance with high brightness. A light emitting device having a high front brightness is particularly suitable for in-vehicle lighting such as a headlight. In addition, in in-vehicle lighting, there are various regulations regarding the colors of the lights, for example, it is stipulated that the color of the headlights is white or pale yellow, and all of them are the same. ing.

さらに、透光性部材３の第２面３ｂの外周の少なくとも一部は、上方から平面視したときに遮光フレーム５の開口部５ａの内周の外側に位置することが好ましい。図１Ａに示す実施形態の発光装置では、第２面３ｂの外周の全てが、上方から平面視したときに開口部５ａの内周の外側に位置する。また、図１Ｂに示す実施形態の発光装置では、第２面３ｂの外周の一部が、上方から平面視したときに開口部５ａの内周の外側に位置する。透光性部材３の第２面３ｂの外周が矩形である場合、外周の少なくとも一辺、好ましくは対向する２辺が遮光フレーム５の開口部５ａの内周の外側に位置するように構成することが好ましい。さらに、透光性部材３の第２面３ｂの外周が長辺と短辺を有する矩形である場合、図１Ｂに示すように、外周の長辺が遮光フレーム５の開口部５ａの内周の外側に位置するように構成することが好ましい。透光性部材３の側面は、厚さが一定の鍔部が形成されるように段差を有していてもよいし、図２Ａ、図２Ｃ、図２Ｄ、図２Ｆ及び図３〜図６に示すように、一部又は全部が傾斜した面になっていてもよい。透光性部材３の側面が傾斜面を有する場合、傾斜面は平面でもよいし曲面でもよい。また、透光性部材３の少なくとも一側面は、図２Ｂ及び図２Ｅに示すように、略矩形状であってよい。 Further, it is preferable that at least a part of the outer circumference of the second surface 3b of the translucent member 3 is located outside the inner circumference of the opening 5a of the light-shielding frame 5 when viewed in a plan view from above. In the light emitting device of the embodiment shown in FIG. 1A, the entire outer circumference of the second surface 3b is located outside the inner circumference of the opening 5a when viewed in a plan view from above. Further, in the light emitting device of the embodiment shown in FIG. 1B, a part of the outer circumference of the second surface 3b is located outside the inner circumference of the opening 5a when viewed in a plan view from above. When the outer circumference of the second surface 3b of the translucent member 3 is rectangular, at least one side of the outer circumference, preferably two opposing sides, is configured to be located outside the inner circumference of the opening 5a of the light-shielding frame 5. Is preferable. Further, when the outer circumference of the second surface 3b of the translucent member 3 is a rectangle having a long side and a short side, as shown in FIG. 1B, the long side of the outer circumference is the inner circumference of the opening 5a of the light shielding frame 5. It is preferably configured to be located on the outside. The side surface of the translucent member 3 may have a step so that a collar portion having a constant thickness is formed, and FIGS. 2A, 2C, 2D, 2F and 3 to 6 show. As shown, part or all of it may be an inclined surface. When the side surface of the translucent member 3 has an inclined surface, the inclined surface may be a flat surface or a curved surface. Further, at least one side surface of the translucent member 3 may have a substantially rectangular shape as shown in FIGS. 2B and 2E.

このように、透光性部材３の第２面３ｂの外周の一部又は全てが上方から平面視したときに開口部５ａの内周の外側に位置するようにし、透光性部材３の第１面３ａの外周が平面視したときに開口部５ａの内周の内側に位置するようにすると、以下のような効果が得られる。
つまり、発光装置を上方（つまり発光面側）から平面視したときに、開口部５ａの内側には、透光性部材３の第１面３ａと透光性部材３の第１面３ａの外周を取り囲む第１光反射性部材９ａの上面を視認することができる。この際、開口部５ａの内側の領域において、光反射性部材の下方の少なくとも一部に、透光性部材３の傾斜面及び／又は鍔部が位置する。これにより、仮に第１光反射性部材９ａにクラックや剥離等が生じたとしても、透光性部材３の傾斜面及び／又は鍔部が開口部５ａの内側に位置する部分については、開口部５ａから漏れる光は透光性部材３から出射される光のみとすることができる。このような効果を高める観点から、図１Ａに示すように、透光性部材３の第２面３ｂの外周の全てが、上方から平面視したときに遮光フレーム５の開口部５ａの内周の外側に位置することがより好ましい。また、透光性部材３の第２面３ｂの外周が長辺と短辺を有する矩形である場合には、上述したように、少なくとも第２面３ｂの外周の長辺が遮光フレーム５の開口部５ａの内周の外側に位置するように構成することが好ましい。
さらに、遮光フレーム５に覆われる領域では光反射性部材からの漏れ光は遮光されるため、例えば発光素子１の側方に位置する第２光反射性部材９ｂにクラックや剥離が生じたとしても、発光素子１の側面から出射された光がクラックや剥離箇所を通過して発光面側に漏れ伝わることをより一層効果的に抑制することができる。
例えば、発光素子１から出射された青色光と、その青色光の一部が波長変換された黄色光とを混色させることにより白色光を発する発光装置を車両照明として用いた際に、発光面から出射される白色光の他に、発光素子１から出射された青色光が漏れると、開口部５ａ内において色度差が生じ、照射エリア内に発光色むらが生じる虞がある。さらに、青色の漏れ光が視認されると、上述した車載照明としての規定が満たされず、車両の安全性が損なわれる虞がある。 In this way, a part or all of the outer circumference of the second surface 3b of the translucent member 3 is located outside the inner circumference of the opening 5a when viewed in a plan view from above, and the translucent member 3 is the first. If the outer circumference of the surface 3a is located inside the inner circumference of the opening 5a when viewed in a plan view, the following effects can be obtained.
That is, when the light emitting device is viewed in a plan view from above (that is, the light emitting surface side), the outer periphery of the first surface 3a of the translucent member 3 and the first surface 3a of the translucent member 3 is inside the opening 5a. The upper surface of the first light reflective member 9a surrounding the above can be visually recognized. At this time, in the region inside the opening 5a, the inclined surface and / or the collar portion of the translucent member 3 is located at least a part below the light reflecting member. As a result, even if the first light-reflecting member 9a is cracked or peeled off, the inclined surface and / or the flange portion of the translucent member 3 is located inside the opening 5a. The light leaking from the 5a can be only the light emitted from the translucent member 3. From the viewpoint of enhancing such an effect, as shown in FIG. 1A, the entire outer circumference of the second surface 3b of the translucent member 3 is the inner circumference of the opening 5a of the light-shielding frame 5 when viewed in a plan view from above. It is more preferably located on the outside. Further, when the outer circumference of the second surface 3b of the translucent member 3 is a rectangle having a long side and a short side, at least the long side of the outer circumference of the second surface 3b is the opening of the light shielding frame 5 as described above. It is preferable to configure the portion 5a so as to be located outside the inner circumference.
Further, since the light leaking from the light-reflecting member is blocked in the region covered by the light-shielding frame 5, for example, even if the second light-reflecting member 9b located on the side of the light-emitting element 1 is cracked or peeled off. It is possible to more effectively suppress the light emitted from the side surface of the light emitting element 1 from passing through cracks and peeling points and leaking to the light emitting surface side.
For example, when a light emitting device that emits white light by mixing blue light emitted from the light emitting element 1 and yellow light whose wavelength is partially converted from the blue light is used as vehicle illumination, the light emitting surface is used. If the blue light emitted from the light emitting element 1 leaks in addition to the emitted white light, a difference in chromaticity may occur in the opening 5a, and uneven emission color may occur in the irradiation area. Further, when the blue leaked light is visually recognized, the above-mentioned regulation as in-vehicle lighting is not satisfied, and the safety of the vehicle may be impaired.

実施形態の発光装置の一形態では、透光性部材３の第１面３ａの外周は、図１Ａに示すように、上方から平面視したときに発光素子１の外周の内側に位置する。ここで、図１Ａに示すように、複数の発光素子１を含む発光装置において発光素子１の外周という場合には、複数の発光素子１を一体として見て外周を規定するものとし、隣接する発光素子間で対向する個々の発光素子の外周は含まない。
このようにすると、複数の発光素子１から出た光を集光して、透光性部材３の第１面３ａから出射することができる。これにより、発光素子１が発光した光をより光束密度の高い状態で出射面３ａから出射することができる。
また、実施形態の発光装置の他の形態では、透光性部材３の第１面３ａの外周は、図１Ｂに示すように、上方から平面視したときに発光素子１の外周の内側に位置する。このように、発光素子の発光面の面積と透光性部材３の第１面３ａ（発光装置の発光面）の面積を適宜設定することにより、発光装置の発光面における光束密度を所望の光束密度に調整することができる。 In one embodiment of the light emitting device of the embodiment, the outer circumference of the first surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed in a plan view from above, as shown in FIG. 1A. Here, as shown in FIG. 1A, in a light emitting device including a plurality of light emitting elements 1, when the outer circumference of the light emitting element 1 is referred to, the outer circumference is defined by looking at the plurality of light emitting elements 1 as a unit, and adjacent light emission is performed. The outer circumference of each light emitting element facing each other is not included.
In this way, the light emitted from the plurality of light emitting elements 1 can be collected and emitted from the first surface 3a of the translucent member 3. As a result, the light emitted by the light emitting element 1 can be emitted from the exit surface 3a in a state of having a higher luminous flux density.
Further, in another embodiment of the light emitting device of the embodiment, the outer circumference of the first surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed from above in a plan view, as shown in FIG. 1B. To do. In this way, by appropriately setting the area of the light emitting surface of the light emitting element and the area of the first surface 3a (light emitting surface of the light emitting device) of the translucent member 3, the light flux density on the light emitting surface of the light emitting device is a desired luminous flux. It can be adjusted to the density.

実施形態の発光装置では、図２Ａ〜図２Ｆ及び図４〜６に示すように、透光性部材３の第１面３ａは、遮光フレーム５の上面と実質的に同じ高さ（つまり同一平面上）に位置していてもよいし、図３に示すように、遮光フレーム５の上面より下方に位置していてもよい。透光性部材３の第１面３ａが遮光フレーム５の上面より下方に位置している場合、透光性部材３の第１面３ａと遮光フレーム５の上面とは互いに平行であることが好ましい。透光性部材３の第１面３ａが遮光フレーム５の上面より下方に位置している場合にも、光反射性部材は発光装置の光出射面である透光性部材３の第１面３ａを露出させて発光素子１の側面と透光性部材３の側面とを覆うように設けられていることが好ましい。またこの際、光反射性部材は、透光性部材３の第１面３ａより上方に位置する遮光フレームの開口部の内周を覆うように設けられていることが好ましい。遮光フレーム５の開口部の内周端面は、図４及び図５に示すように傾斜していてもよい。図２Ａ〜５のように樹脂壁７を有しない発光装置は、樹脂壁７を有する発光装置より小型化できるという利点がある。 In the light emitting device of the embodiment, as shown in FIGS. 2A to 2F and FIGS. 4 to 6, the first surface 3a of the translucent member 3 has substantially the same height (that is, the same plane as the upper surface of the light shielding frame 5). It may be located above), or as shown in FIG. 3, it may be located below the upper surface of the light-shielding frame 5. When the first surface 3a of the translucent member 3 is located below the upper surface of the light-shielding frame 5, it is preferable that the first surface 3a of the translucent member 3 and the upper surface of the light-shielding frame 5 are parallel to each other. .. Even when the first surface 3a of the translucent member 3 is located below the upper surface of the light-shielding frame 5, the light-reflecting member is the first surface 3a of the translucent member 3, which is the light emitting surface of the light emitting device. Is preferably provided so as to expose the side surface of the light emitting element 1 and the side surface of the translucent member 3. At this time, it is preferable that the light-reflecting member is provided so as to cover the inner circumference of the opening of the light-shielding frame located above the first surface 3a of the translucent member 3. The inner peripheral end surface of the opening of the light-shielding frame 5 may be inclined as shown in FIGS. 4 and 5. The light emitting device having no resin wall 7 as shown in FIGS. 2A to 5 has an advantage that it can be made smaller than the light emitting device having the resin wall 7.

実施形態の発光装置では、図６に示すように、基板１０と遮光フレーム５との間に樹脂壁７が設けられてよい。樹脂壁７は、光反射性部材の外側に、例えば、光反射性部材の周りを囲むように、または光反射性部材を間において対向するように設けられてよい。これにより、遮光フレーム５の剥離をより防止することができる In the light emitting device of the embodiment, as shown in FIG. 6, a resin wall 7 may be provided between the substrate 10 and the light shielding frame 5. The resin wall 7 may be provided on the outside of the light-reflecting member, for example, so as to surround the light-reflective member or to face the light-reflective member in between. Thereby, peeling of the light-shielding frame 5 can be further prevented.

以下に、実施形態の発光装置の各構成部材について説明する。
（基板１０）
基板１０は、発光素子１等を支持する部材であり、少なくともその表面に発光素子１の外部電極に電気的に接続される配線を有する。基板１０の主な材料としては、絶縁性材料であって、発光素子１からの光及び外からの光が透過しにくい材料が好ましい。具体的には、例えば、アルミナや窒化アルミニウム等のセラミックス、フェノール樹脂、エポキシ樹脂、シリコーン樹脂、ポリイミド樹脂、ＢＴレジン、ポリフタルアミド等の樹脂を挙げることができる。なお、樹脂を用いる場合には、必要に応じて、ガラス繊維、酸化ケイ素、酸化チタン、アルミナ等の無機フィラーを樹脂に混合してもよい。これにより、機械的強度の向上や熱膨張率の低減、光反射率の向上を図ることができる。また、基板１０は、金属部材の表面に絶縁性材料を形成したものでもよい。配線は、上記絶縁性材料の上に、所定のパターンで形成される。配線の材料として、金、銀、銅、チタン、パラジウム、ニッケルおよびアルミニウムから選択された少なくとも一種とすることができる。配線は、めっき、蒸着、スパッタ等によって形成することができる。 Hereinafter, each component of the light emitting device of the embodiment will be described.
(Board 10)
The substrate 10 is a member that supports the light emitting element 1 and the like, and has at least a wiring on its surface that is electrically connected to an external electrode of the light emitting element 1. As the main material of the substrate 10, a material which is an insulating material and which is difficult for light from the light emitting element 1 and light from the outside to pass through is preferable. Specific examples thereof include ceramics such as alumina and aluminum nitride, phenol resins, epoxy resins, silicone resins, polyimide resins, BT resins, and resins such as polyphthalamide. When a resin is used, an inorganic filler such as glass fiber, silicon oxide, titanium oxide, or alumina may be mixed with the resin, if necessary. As a result, it is possible to improve the mechanical strength, reduce the coefficient of thermal expansion, and improve the light reflectance. Further, the substrate 10 may have an insulating material formed on the surface of a metal member. The wiring is formed in a predetermined pattern on the insulating material. The wiring material can be at least one selected from gold, silver, copper, titanium, palladium, nickel and aluminum. The wiring can be formed by plating, vapor deposition, sputtering, or the like.

（発光素子１）
発光素子１としては、発光ダイオードを用いるのが好ましい。発光素子は、任意の波長のものを選択することができる。例えば、青色、緑色の発光素子としては、窒化物系半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）やＺｎＳｅ、ＧａＰを用いたものを用いることができる。また、赤色の発光素子としては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰなどを用いることができる。さらに、これ以外の材料からなる半導体発光素子を用いることもできる。用いる発光素子の組成や発光色、大きさや、個数などは目的に応じて適宜選択することができる。蛍光体を有する発光装置とする場合には、その蛍光体を効率良く励起できる短波長が発光可能な窒化物半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）が好適に挙げられる。半導体層の材料やその混晶度によって発光波長を種々選択することができる。 (Light emitting element 1)
It is preferable to use a light emitting diode as the light emitting element 1. As the light emitting element, one having an arbitrary wavelength can be selected. For example, as the blue and green light emitting elements, nitride semiconductors (In X Al Y Ga 1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), ZnSe, and GaP are used. be able to. Further, as the red light emitting element, GaAlAs, AlInGaP and the like can be used. Further, a semiconductor light emitting device made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting elements to be used can be appropriately selected according to the purpose. In the case of a light emitting device having a phosphor, a nitride semiconductor capable of emitting a short wavelength capable of efficiently exciting the phosphor (In X Al Y Ga 1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably mentioned. Various emission wavelengths can be selected depending on the material of the semiconductor layer and its mixed crystallinity.

実施形態の発光装置に用いる発光素子１は、例えば、同一面側に正負の電極を有するものである。図２Ａに示すように、発光素子１は、導電性接合部材１１を介して基板１０上にフリップチップ実装されている。尚、図２Ａでは、発光素子１の正負の電極に接続される導電性接合部材１１を簡略化して描いているが、実際には、同一面側に設けられた正負の電極それぞれに接続するように設けられる。発光素子１の正負の電極がそれぞれ導電性接合部材１１を介して基板１０上に設けられた正負の配線（図示省略）に接続されている。また、発光素子１は、電極の形成された面を下面として基板に実装され、下面と対向する上面を主な光出射面としている。このような発光素子１は、上述したように、バンプや導電ペーストなどの導電性接合部材を用いて基板上に接続されるため、金属ワイヤなどで接続される発光素子と比較して、電極と基板との接触面積を大きくでき、接続抵抗を低くできる。 The light emitting element 1 used in the light emitting device of the embodiment has, for example, positive and negative electrodes on the same surface side. As shown in FIG. 2A, the light emitting element 1 is flip-chip mounted on the substrate 10 via the conductive bonding member 11. In FIG. 2A, the conductive bonding member 11 connected to the positive and negative electrodes of the light emitting element 1 is simplified, but in reality, it is connected to each of the positive and negative electrodes provided on the same surface side. It is provided in. The positive and negative electrodes of the light emitting element 1 are connected to positive and negative wiring (not shown) provided on the substrate 10 via the conductive bonding member 11, respectively. Further, the light emitting element 1 is mounted on the substrate with the surface on which the electrodes are formed as the lower surface, and the upper surface facing the lower surface is the main light emitting surface. As described above, such a light emitting element 1 is connected to the substrate by using a conductive bonding member such as a bump or a conductive paste, and therefore, as compared with a light emitting element connected by a metal wire or the like, the light emitting element 1 is connected to an electrode. The contact area with the substrate can be increased and the connection resistance can be lowered.

発光素子１は、例えば、透光性の成長用のサファイア基板上に窒化物半導体層を積層させて形成された発光素子であり、サファイア基板が発光素子１の上面側となり、主な光出射面となる。なお、成長用基板は除去してもよく、例えば、研磨、レーザーリフトオフ等で除去することができる。 The light emitting element 1 is, for example, a light emitting element formed by laminating a nitride semiconductor layer on a sapphire substrate for translucent growth, and the sapphire substrate is on the upper surface side of the light emitting element 1 and is a main light emitting surface. It becomes. The growth substrate may be removed, for example, by polishing, laser lift-off, or the like.

（透光性部材３）
透光性部材３は、発光素子１から出射される光を透過して外部に放出する部材である。透光性部材３は、光拡散材や、入射された光の少なくとも一部を波長変換可能な蛍光体を含有させてもよい。透光性部材３は、例えば、樹脂、ガラス、無機物等により形成することができる。蛍光体を含有する透光性部材は、例えば、蛍光体の焼結体や、樹脂、ガラス、セラミック又は他の無機物に蛍光体を含有させたもの等が挙げられる。また、樹脂、ガラス、セラミック等の成形体の表面に蛍光体を含有する樹脂層を形成したものでもよい。透光性部材３の厚みは、例えば、５０〜３００μｍ程度である。
透光性部材３と発光素子との接合は、図２Ａに示すように、例えば、導光部材１３を介して接合することができる。また、透光性部材３と発光素子１との接合には、導光部材１３を用いることなく、圧着、焼結、表面活性化接合、原子拡散接合、水酸基接合による直接接合法を用いてもよい。 (Translucent member 3)
The translucent member 3 is a member that transmits the light emitted from the light emitting element 1 and emits it to the outside. The translucent member 3 may contain a light diffusing material or a phosphor capable of wavelength-converting at least a part of the incident light. The translucent member 3 can be formed of, for example, a resin, glass, an inorganic substance, or the like. Examples of the translucent member containing a fluorescent substance include a sintered body of the fluorescent substance, a resin, glass, ceramic, or another inorganic substance containing the fluorescent substance. Further, a resin layer containing a phosphor may be formed on the surface of a molded product such as resin, glass or ceramic. The thickness of the translucent member 3 is, for example, about 50 to 300 μm.
As shown in FIG. 2A, the translucent member 3 and the light emitting element can be joined via, for example, the light guide member 13. Further, for the bonding between the translucent member 3 and the light emitting element 1, a direct bonding method using crimping, sintering, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding can be used without using the light guide member 13. Good.

（蛍光体）
上述したように、透光性部材３は、蛍光体を含んでいてもよい。透光性部材３に含有させることができる蛍光体としては、発光素子１からの発光で励起可能なものが使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体（ＹＡＧ：Ｃｅ）、セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体（ＬＡＧ：Ｃｅ）、ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体（ＣａＯ−Ａｌ２Ｏ３−ＳｉＯ２：Ｅｕ）、ユウロピウムで賦活されたシリケート系蛍光体（（Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕ）、βサイアロン蛍光体、ＣａＡｌＳｉＮ３：Ｅｕで表されるＣＡＳＮ系蛍光体、（Ｓｒ，Ｃａ）ＡｌＳｉＮ３：Ｅｕで表されるＳＣＡＳＮ系蛍光体等の窒化物系蛍光体、Ｋ２ＳｉＦ６：Ｍｎで表されるＫＳＦ系蛍光体、硫化物系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、所望の発光色の発光装置（例えば白色系の発光装置）を製造することができる。 (Fluorescent material)
As described above, the translucent member 3 may contain a phosphor. As the phosphor that can be contained in the translucent member 3, a phosphor that can be excited by light emission from the light emitting element 1 is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, an yttrium / aluminum / garnet-based phosphor (YAG: Ce) activated with cerium and a lutethium / aluminum / garnet-based phosphor activated with cerium are used. (LAG: Ce), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate-based phosphor (CaO-Al 2 O 3- SiO 2 : Eu), europium-activated silicate-based phosphor ((Sr, Sr,) Ba) 2 SiO 4 : Eu), β-sialon phosphor, CaAlSiN 3 : CASN-based fluorescence represented by Eu, (Sr, Ca) AlSiN 3 : SCASN-based fluorescence represented by Eu, etc. Body, K 2 SiF 6 : KSF-based phosphor represented by Mn, sulfide-based phosphor, quantum dot phosphor, and the like. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device having a desired emission color (for example, a white light emitting device) can be manufactured.

（遮光フレーム５）
遮光フレーム５は、発光装置の上面において光出射面を除いた部分の輝度を下げるために設けられる部材である。光出射面を除いた部分の輝度を下げるためには、透光性部材３の第１面３ａ以外から外部に漏れる光を遮光する必要がある。この機能を考慮すると、遮光フレーム５は、例えば、光を透過させずに、反射及び／又は吸収する材料からなる部材または表面に光を反射及び／又は吸収する材料からなる膜を備えた部材により構成することが好ましい。
遮光フレーム５を構成する材料としては、樹脂（繊維強化樹脂を含む）、セラミックス、ガラス、紙、金属等、及びこれらの材料の２種以上からなる複合材料などから選択して構成することができる。具体的には、遮光性に優れ、劣化しにくい材料として、例えば、遮光フレーム５は、金属からなる金属フレームまたは表面に金属膜を備えたフレームにより構成されることが好ましい。金属材料としては、銅、鉄、ニッケル、クロム、アルミニウム、金、銀、チタン、またはこれらの合金等が挙げられる。
さらに、遮光フレーム５は、発光装置内部からの漏れ光を抑制するだけでなく、外部からの光の反射を抑制する機能を備えていることがより好ましい。外部からの光の反射を抑制する機能としては、例えば、光出射面側の表面に微細な凹凸を有すること、光吸収率の高い材料を用いること、などが挙げられる。微細な凹凸としては例えば平均算術粗さＲａが０．５μm以上１．０μm以下が挙げられる。なお、遮光フレームの表面が微細な凹凸を有する場合、遮光フレーム表面の液体に対する濡れ性が高くなり、未硬化の樹脂材料が遮光フレームの表面に濡れ広がりやすくなる。このため、例えば、遮光フレームの上面の縁には微細な凹凸加工を施さないことが好ましい。また、光吸収率の高い材料としては、黒色ニッケルめっき、黒色クロムめっき等が挙げられる。
また、遮光フレーム５の厚み（つまり遮光フレーム５の下面から上面までの高さ）は、発光装置として使用するときの強度を保ちつつ、軽さ、変形しにくさ、等を考慮して、２０μｍ〜２００μｍ程度とすることが好ましく、３０〜８０μｍ程度とすることがより好ましい。 (Shading frame 5)
The light-shielding frame 5 is a member provided on the upper surface of the light emitting device to reduce the brightness of the portion excluding the light emitting surface. In order to reduce the brightness of the portion excluding the light emitting surface, it is necessary to block the light leaking to the outside from other than the first surface 3a of the translucent member 3. Considering this function, the light-shielding frame 5 is made of, for example, a member made of a material that reflects and / or absorbs light without transmitting light, or a member having a film made of a material that reflects and / or absorbs light on the surface. It is preferable to configure it.
The material constituting the light-shielding frame 5 can be selected from resin (including fiber reinforced resin), ceramics, glass, paper, metal, etc., and a composite material composed of two or more of these materials. .. Specifically, as a material having excellent light-shielding property and not easily deteriorated, for example, the light-shielding frame 5 is preferably composed of a metal frame made of metal or a frame having a metal film on the surface. Examples of the metal material include copper, iron, nickel, chromium, aluminum, gold, silver, titanium, and alloys thereof.
Further, it is more preferable that the light-shielding frame 5 has a function of not only suppressing light leakage from the inside of the light emitting device but also suppressing reflection of light from the outside. Examples of the function of suppressing the reflection of light from the outside include having fine irregularities on the surface on the light emitting surface side and using a material having a high light absorption rate. Examples of the fine unevenness include an average arithmetic roughness Ra of 0.5 μm or more and 1.0 μm or less. When the surface of the light-shielding frame has fine irregularities, the surface of the light-shielding frame becomes more wettable with liquid, and the uncured resin material easily wets and spreads on the surface of the light-shielding frame. For this reason, for example, it is preferable that the edge of the upper surface of the light-shielding frame is not subjected to fine uneven processing. Examples of the material having a high light absorption rate include black nickel plating and black chrome plating.
Further, the thickness of the light-shielding frame 5 (that is, the height from the lower surface to the upper surface of the light-shielding frame 5) is 20 μm in consideration of lightness, resistance to deformation, etc. while maintaining strength when used as a light emitting device. It is preferably about 200 μm, more preferably about 30 to 80 μm.

遮光フレーム５は、平面視において、遮光フレーム５の外周が発光装置の外周と一致するように設けられていてもよいが、遮光フレーム５の外周が発光装置の外周の内側に位置するように設けられていていることが好ましい。これにより、後述する発光装置を単位領域ごと（つまり個々の発光装置ごと）に分割する分割工程において、分割線上に遮光フレーム５が配置されないため、分割時の遮光フレーム５の位置ずれ等が抑制される。
ここで、遮光フレーム５の外周が発光装置の外周の内側に位置するように遮光フレーム５が設けられていているとは、遮光フレーム５の外周の一部分が発光装置の外周の内側に位置するように遮光フレーム５が設けられていていることを含む。
平面視における遮光フレーム５の幅は、光出射面３ａの内側と外側における輝度差を大きくすることを考慮して、少なくとも１３０μｍ以上であることが好ましい。また、製造工程における取り扱いの容易さを考慮すると、５００μｍ以上であることがより好ましい。遮光フレーム５の幅は、全周に亘って一定の幅であってもよいが、部分的に異なっていてもよく、遮光フレーム５の幅が部分的に異なる場合、少なくとも全周に亘って１３０μｍ以上の幅を有し、かつ、部分的に５００μｍ以上の幅を有することがより好ましい。 The light-shielding frame 5 may be provided so that the outer circumference of the light-shielding frame 5 coincides with the outer circumference of the light-emitting device in a plan view, but the light-shielding frame 5 is provided so that the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device. It is preferable that it is. As a result, in the dividing step of dividing the light emitting device described later into each unit region (that is, for each individual light emitting device), the light shielding frame 5 is not arranged on the dividing line, so that the displacement of the light emitting frame 5 at the time of division is suppressed. To.
Here, the fact that the light-shielding frame 5 is provided so that the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device means that a part of the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device. Includes that the light-shielding frame 5 is provided in the.
The width of the light-shielding frame 5 in a plan view is preferably at least 130 μm or more in consideration of increasing the difference in brightness between the inside and the outside of the light emitting surface 3a. Further, considering the ease of handling in the manufacturing process, it is more preferably 500 μm or more. The width of the light-shielding frame 5 may be a constant width over the entire circumference, but may be partially different. When the width of the light-shielding frame 5 is partially different, at least 130 μm over the entire circumference. It is more preferable to have a width of 500 μm or more and a width of 500 μm or more.

（第１光反射性部材９ａ、第２光反射性部材９ｂ）
光反射性部材、すなわち第１光反射性部材９ａ及び第２光反射性部材９ｂは、発光素子１の側面および透光性部材３の側面を被覆し、発光素子１の側面および透光性部材３の側面から出射される光を反射して光発光面から出射させる。このように発光素子１の側面および透光性部材３の側面を被覆する光反射性部材を設けることにより光の取りだし効率を高くできる。光反射性部材は、例えば、光反射率の高い光反射性材料から形成する。具体的には、光反射性部材は、発光素子からの光に対する反射率が６０％以上、より好ましくは８０％又は９０％以上である光反射性材料を用いることができる。光反射性材料は、例えば、光反射性物質を含む樹脂からなる。詳細を後述するように、第１光反射性部材９ａ及び第２光反射性部材９ｂは別個に形成されるものであり、互いに異なる光反射性材料から形成してよく、同一の光反射性材料から形成してもよい。 (1st light reflecting member 9a, 2nd light reflecting member 9b)
The light-reflecting member, that is, the first light-reflecting member 9a and the second light-reflecting member 9b covers the side surface of the light emitting element 1 and the side surface of the translucent member 3, and the side surface of the light emitting element 1 and the translucent member. The light emitted from the side surface of No. 3 is reflected and emitted from the light emitting surface. By providing the light-reflecting member that covers the side surface of the light emitting element 1 and the side surface of the translucent member 3 in this way, the light extraction efficiency can be increased. The light-reflecting member is formed from, for example, a light-reflecting material having a high light reflectance. Specifically, as the light-reflecting member, a light-reflecting material having a reflectance of 60% or more, more preferably 80% or 90% or more with respect to light from the light emitting element can be used. The light-reflecting material is made of, for example, a resin containing a light-reflecting substance. As will be described in detail later, the first light-reflecting member 9a and the second light-reflecting member 9b are formed separately, may be formed from different light-reflecting materials, and are the same light-reflecting material. It may be formed from.

第１光反射性部材９ａを形成する第１光反射性樹脂９ｃ、及び第２光反射性部材９ｂを形成する第２光反射性樹脂９ｄについて、これらの樹脂を構成する母体の樹脂としては、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、また、これらの樹脂を少なくとも一種以上含むハイブリッド樹脂等の樹脂を用いることができ、その樹脂からなる母材に光反射性物質を含有させることで形成することができる。光反射性物質としては、酸化チタン、酸化ケイ素、酸化ジルコニウム、酸化マグネシウム、酸化イットリウム、イットリア安定化ジルコニア、炭酸カルシウム、水酸化カルシウム、珪酸カルシウム、酸化ニオブ、酸化亜鉛、チタン酸バリウム、チタン酸カリウム、フッ化マグネシウム、アルミナ、窒化アルミニウム、窒化ホウ素、ムライトなどを用いることができる。好ましくは酸化チタン（ＴｉＯ２）を用いる。また、好ましくは、光反射性物質として、母材の樹脂の屈折率と異なる粒子を母材の樹脂中に分散させる。光反射性物質の含有濃度、密度により光の反射量、透過量が異なるため、発光装置の形状、大きさに応じて、適宜濃度、密度を調整することができる。また、光反射性部材は光反射性物質に加え、その他の顔料、蛍光体等を含有してもよい。特に、透光性部材３が蛍光体を含有する際には、第２光反射性樹脂９ｄにも同様の蛍光体を含有させることにより、発光装置の側面から、発光素子からの出射光の漏れが視認されることを抑制することができる。 Regarding the first light-reflecting resin 9c forming the first light-reflecting member 9a and the second light-reflecting resin 9d forming the second light-reflecting member 9b, the base resin constituting these resins is Resins such as silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, and hybrid resin containing at least one of these resins can be used, and a light-reflecting substance is used as a base material made of the resin. It can be formed by containing it. Photoreflecting substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, yttrium oxide, yttria-stabilized zirconia, calcium carbonate, calcium hydroxide, calcium silicate, niobium oxide, zinc oxide, barium titanate, potassium titanate. , Magnesium fluoride, alumina, aluminum nitride, boron nitride, mulite and the like can be used. Titanium oxide (TiO 2 ) is preferably used. Further, preferably, as a light-reflecting substance, particles having a refractive index different from that of the resin of the base material are dispersed in the resin of the base material. Since the amount of light reflected and the amount transmitted differs depending on the concentration and density of the light-reflecting substance, the concentration and density can be appropriately adjusted according to the shape and size of the light emitting device. Further, the light-reflecting member may contain other pigments, phosphors and the like in addition to the light-reflecting substance. In particular, when the translucent member 3 contains a phosphor, the second light-reflecting resin 9d also contains the same phosphor, so that the light emitted from the light emitting element leaks from the side surface of the light emitting device. Can be suppressed from being visually recognized.

（導光部材１３）
発光装置において、上述したように、透光性部材３と発光素子との接合は、例えば、導光部材１３を介して接合される。導光部材１３は、図２Ａに示すように、発光素子１の側面の一部または全部を被覆していてもよい。透光性部材３の第２面３ｂの一部が発光素子１の主な光出射面である上面に対向していないような場合、導光部材１３は、発光素子の上面と対向していない透光性部材３の一部を被覆するように形成することが好ましい。なお、導光部材１３は発光素子と透光性部材３との間にも介在し、両者を接合する。以上のように構成された導光部材１３は、発光素子１の上面及び側面からの出射光を透光性部材３へと効率よく導光させることができる。 (Light guide member 13)
In the light emitting device, as described above, the light transmitting member 3 and the light emitting element are joined via, for example, the light guide member 13. As shown in FIG. 2A, the light guide member 13 may cover a part or all of the side surface of the light emitting element 1. When a part of the second surface 3b of the translucent member 3 does not face the upper surface which is the main light emitting surface of the light emitting element 1, the light guide member 13 does not face the upper surface of the light emitting element. It is preferably formed so as to cover a part of the translucent member 3. The light guide member 13 is also interposed between the light emitting element and the translucent member 3 to join the two. The light guide member 13 configured as described above can efficiently guide the light emitted from the upper surface and the side surface of the light emitting element 1 to the translucent member 3.

導光部材１３は、取り扱いおよび加工が容易であるという観点から、樹脂材料を用いることが好ましい。樹脂材料としては、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、フッ素樹脂の１種以上を含む樹脂またはハイブリッド樹脂等からなる樹脂材料を用いることができる。導光部材１３は、導光部材１３を形成するための樹脂材料の粘性、樹脂材料と発光素子１との濡れ性を適宜調整して上述した形状に形成することができる。 It is preferable to use a resin material for the light guide member 13 from the viewpoint of easy handling and processing. As the resin material, a resin material including a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, a resin containing at least one of a fluororesin, a hybrid resin, or the like can be used. The light guide member 13 can be formed into the above-described shape by appropriately adjusting the viscosity of the resin material for forming the light guide member 13 and the wettability between the resin material and the light emitting element 1.

（その他の部材）
発光装置は、任意に、保護素子等の別の素子、電子部品等を有していてもよい。これらの素子及び電子部品は、光反射性部材内に埋設されていることが好ましい。 (Other parts)
The light emitting device may optionally have another element such as a protective element, an electronic component, or the like. It is preferable that these elements and electronic components are embedded in a light-reflecting member.

＜第一実施形態の発光装置の製造方法＞
第一実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さい板状の透光性部材を、前記第１面が前記シートと対向し、且つ前記透光性部材と前記開口部との間に空間を設けて前記開口部内に載置する透光性部材載置工程と、第１光反射性樹脂を、前記空間に充填して第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが前記第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、を含む。
第一実施形態の発光装置の製造方法により、例えば、図１Ａ、図１Ｂ及び図２Ａ〜図２Ｃに示す実施形態の発光装置を製造することができる。
以下、第一実施形態の発光装置の製造方法について図面を参照しながら説明する。 <Manufacturing method of the light emitting device of the first embodiment>
The method for manufacturing the light emitting device of the first embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a first surface and the first surface thereof. A plate-shaped translucent member having a second surface opposite to one surface and having an outer periphery of the first surface smaller than the inner circumference of the opening, and the first surface facing the sheet and A step of placing a translucent member in which a space is provided between the translucent member and the opening and the translucent member is placed in the opening, and a first light-reflecting resin is filled in the space and the first light A light guide support member forming step of forming a reflective member and producing a light guide support member in which the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member, and a light emitting element mounted. A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface and the second surface, and a second light reflective resin are placed between the substrate and the light shielding frame. It includes a second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling.
According to the method for manufacturing the light emitting device of the first embodiment, for example, the light emitting device of the embodiment shown in FIGS. 1A, 1B and 2A to 2C can be manufactured.
Hereinafter, the method for manufacturing the light emitting device of the first embodiment will be described with reference to the drawings.

（実装工程）
ここでは、図７Ａに示すように、基板１０上に発光素子１をフリップチップ実装する。
具体的には、例えば、同一面側の下面に正負の電極（図示省略）を有する発光素子１を、正の電極が基板１０上に設けられた正の配線に対向し、負の電極が基板１０上に設けられた負の配線に対向するようにそれぞれ導電性接合部材１１により接合する。尚、図７Ａ、７Ｅ及び７Ｆでは、図２Ａ等と同様、発光素子１の正負の電極及び基板１０上に設けられた正負の配線（図示省略）に接続される導電性接合部材１１を区別することなく簡略化して描いている。 (Mounting process)
Here, as shown in FIG. 7A, the light emitting element 1 is flip-chip mounted on the substrate 10.
Specifically, for example, a light emitting element 1 having positive and negative electrodes (not shown) on the lower surface on the same surface side, the positive electrode faces the positive wiring provided on the substrate 10, and the negative electrode is the substrate. Each of the conductive joining members 11 is joined so as to face the negative wiring provided on the 10. In addition, in FIGS. 7A, 7E and 7F, as in FIG. 2A and the like, the positive and negative electrodes of the light emitting element 1 and the conductive joining member 11 connected to the positive and negative wiring (not shown) provided on the substrate 10 are distinguished. It is drawn in a simplified manner without any need.

（遮光フレーム載置工程）
ここでは、開口部５ａを有する遮光フレーム５及びシート４を準備し、図７Ｂに示すように、シート４に遮光フレーム５を載置する。
遮光フレームは、予め所望の形状に加工された遮光フレームを準備し、複数の遮光フレームをシート上に個々に配置してもよいし、複数の遮光フレームが単位領域ごとに行方向及び／又は列方向に連結した遮光フレームを準備し、一括してシート上に配置してもよい。シートは、表面に粘着性を有する耐熱性のシートを用いることが好ましい。シートの基材としては、例えばポリイミドが挙げられる。 (Shading frame mounting process)
Here, a light-shielding frame 5 and a sheet 4 having an opening 5a are prepared, and as shown in FIG. 7B, the light-shielding frame 5 is placed on the sheet 4.
As the light-shielding frame, a light-shielding frame processed into a desired shape may be prepared in advance, and a plurality of light-shielding frames may be individually arranged on the sheet, or a plurality of light-shielding frames may be arranged in a row direction and / or a column for each unit area. Light-shielding frames connected in the direction may be prepared and collectively arranged on the sheet. As the sheet, it is preferable to use a heat-resistant sheet having an adhesive surface. Examples of the base material of the sheet include polyimide.

（透光性部材載置工程）
ここでは、第１面３ａと該第１面３ａの反対側の第２面３ｂとを有し、第１面の外周が遮光フレーム５の開口部５ａの内周より小さい板状の透光性部材３を用い、図７Ｃに示すように、透光性部材３の第１面３ａがシートと対向し、且つ透光性部材３と遮光フレーム５の開口部５ａとの間に空間を設けて開口部内に透光性部材３を載置する。
具体的には、例えば、吸着コレットに透光性部材３を吸着して、遮光フレーム５の開口部５ａの内周が透光性部材の第１面３ａの外周の外側に位置するように位置決めして吸着コレットを下方に移動させて、透光性部材３をシート上に載置する。
図１Ａ及び図２Ａに示す実施形態の発光装置を製造する場合には、透光性部材３として、第２面３ｂの外周が遮光フレーム５の開口部５ａの内周より大きいものを用いる。例えば、開口部５ａ及び透光性部材３の第２面３ｂがいずれも長辺と短辺を有する矩形である場合には、第２面３ｂの長辺及び短辺がいずれも開口部５ａの長辺及び短辺より大きいものを用いる。また、図１Ｂ及び図２Ｂに示す実施形態の発光装置を製造する場合には、透光性部材３として、第２面３ｂの外周の一部が遮光フレーム５の開口部５ａの内周の、第２面３ｂの外周の一部に対応する一部より大きいものを用いる。例えば、開口部５ａ及び透光性部材３の第２面３ｂが長辺と短辺を有する矩形である場合には、第２面３ｂの短辺が開口部５ａの短辺より大きいものを用いる。 (Translucent member mounting process)
Here, it has a first surface 3a and a second surface 3b on the opposite side of the first surface 3a, and the outer circumference of the first surface is smaller than the inner circumference of the opening 5a of the light-shielding frame 5. Using the member 3, as shown in FIG. 7C, the first surface 3a of the translucent member 3 faces the sheet, and a space is provided between the translucent member 3 and the opening 5a of the light-shielding frame 5. The translucent member 3 is placed in the opening.
Specifically, for example, the translucent member 3 is adsorbed on the suction collet and positioned so that the inner circumference of the opening 5a of the light-shielding frame 5 is located outside the outer circumference of the first surface 3a of the translucent member. Then, the suction collet is moved downward, and the translucent member 3 is placed on the sheet.
In the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1A and 2A, as the translucent member 3, a member whose outer circumference of the second surface 3b is larger than the inner circumference of the opening 5a of the light shielding frame 5 is used. For example, when the opening 5a and the second surface 3b of the translucent member 3 are both rectangular having a long side and a short side, both the long side and the short side of the second surface 3b are the openings 5a. Use one that is larger than the long side and short side. Further, in the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1B and 2B, as the translucent member 3, a part of the outer circumference of the second surface 3b is formed on the inner circumference of the opening 5a of the light shielding frame 5. The one larger than the part corresponding to the part of the outer circumference of the second surface 3b is used. For example, when the second surface 3b of the opening 5a and the translucent member 3 is a rectangle having a long side and a short side, the short side of the second surface 3b is larger than the short side of the opening 5a. ..

（導光支持部材形成工程）
ここでは、図７Ｄに示すように、遮光フレーム５と透光性部材３とが第１光反射性部材９ａにより支持された導光支持部材を作製する。
具体的には、例えば、透光性部材３と遮光フレーム５の開口部５ａとの間の空間に、樹脂吐出装置のノズルの先端から第１光反射性樹脂９ｃを吐出し、第１光反射性樹脂９ｃを充填する。第1光反射性樹脂９ｃは、透光性部材３を伝って遮光フレーム5の開口部５ａとの間へ流入するように充填される。
透光性部材３と遮光フレーム５の開口部５ａとの間に空間に第１光反射性樹脂９ｃを充填した後、充填した第１光反射性樹脂９ｃを硬化させ、第１光反射性部材９ａを形成する。 (Light guide support member forming process)
Here, as shown in FIG. 7D, a light guide support member in which the light-shielding frame 5 and the light-transmitting member 3 are supported by the first light-reflecting member 9a is produced.
Specifically, for example, the first light-reflecting resin 9c is discharged from the tip of the nozzle of the resin discharge device into the space between the translucent member 3 and the opening 5a of the light-shielding frame 5, and the first light is reflected. The sex resin 9c is filled. The first light-reflecting resin 9c is filled so as to flow through the translucent member 3 and into the opening 5a of the light-shielding frame 5.
After filling the space between the translucent member 3 and the opening 5a of the light-shielding frame 5 with the first light-reflecting resin 9c, the filled first light-reflecting resin 9c is cured to cure the first light-reflecting member. Form 9a.

（導光支持部材接合工程）
ここでは、図７Ｅに示すように、実装した発光素子１の発光面（つまり上面）に透光性部材３の第２面３ｂを接合することにより、発光素子１上に導光支持部材を固定する。
上述のようにして得られた導光支持部材の透光性部材３を発光素子１に対して位置合わせをして、透光性部材３を、例えば、導光部材１３により発光素子１の発光面に接合する。
図１Ａ及び図２Ａに示す実施形態の発光装置を製造する場合には、導光支持部材は、例えば、
（ｉ）透光性部材３の第２面３ｂの外周が、上方から平面視したときに発光素子１の外周の外側に位置するように、
（ｉｉ）透光性部材３の第１面３ａの外周が、上方から平面視したときに発光素子１の外周の内側に位置するように、
位置合わせをする。
図１Ｂ及び図２Ｂに示す実施形態の発光装置を製造する場合には、導光支持部材は、例えば、
（ｉ）透光性部材３の第２面３ｂの外周が、上方から平面視したときに発光素子１の外周の外側に位置するように、
（ｉｉ）透光性部材３の第１面３ａの外周が、上方から平面視したときに発光素子１の外周の外側に位置するように、
位置合わせをする。 (Light guide support member joining process)
Here, as shown in FIG. 7E, the light guide support member is fixed on the light emitting element 1 by joining the second surface 3b of the translucent member 3 to the light emitting surface (that is, the upper surface) of the mounted light emitting element 1. To do.
The translucent member 3 of the light guide support member obtained as described above is aligned with the light emitting element 1, and the translucent member 3 emits light from the light emitting element 1 by, for example, the light guide member 13. Join to the surface.
In the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1A and 2A, the light guide support member is, for example,
(I) The outer circumference of the second surface 3b of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
(Ii) The outer circumference of the first surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
Align.
In the case of manufacturing the light emitting device of the embodiment shown in FIGS. 1B and 2B, the light guide support member is, for example,
(I) The outer circumference of the second surface 3b of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
(Ii) The outer circumference of the first surface 3a of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed in a plan view from above.
Align.

導光支持部材の透光性部材３と発光素子１とを接合する際、予め第２面３ｂに導光部材１３を塗布した透光性部材３を発光素子１上に載置するようにしてもよいし、発光素子１の上面に導光部材１３を塗布した後に導光支持部材の透光性部材３を発光素子１上に載置するようにしてもよい。導光部材１３の塗布量、透光性部材３を発光素子１上に載置して押圧する際の荷重、導光部材１３として樹脂材料を用いる場合にはその塗布時の粘度等は、導光支持部材の透光性部材３を発光素子１上に接合した後の導光部材１３の望ましい形状を考慮して適宜設定してよい。 When joining the translucent member 3 of the light guide support member and the light emitting element 1, the translucent member 3 having the light guide member 13 coated on the second surface 3b in advance is placed on the light emitting element 1. Alternatively, the light guide member 13 may be applied to the upper surface of the light emitting element 1 and then the light transmissive member 3 of the light guide support member may be placed on the light emitting element 1. The coating amount of the light guide member 13, the load when the translucent member 3 is placed on the light emitting element 1 and pressed, and the viscosity at the time of coating when a resin material is used as the light guide member 13 are derived. It may be appropriately set in consideration of the desired shape of the light guide member 13 after the translucent member 3 of the light support member is joined on the light emitting element 1.

（シート除去工程）
シート４は、導光支持部材接合工程後、あるいは第２光反射性部材形成工程後のシート除去工程にて除去してよい。 (Sheet removal process)
The sheet 4 may be removed in a sheet removing step after the light guide support member joining step or after the second light reflective member forming step.

（第２光反射性部材形成工程）
ここでは、第２光反射性部材９ｂを形成する未硬化の第２光反射性樹脂９ｄを、基板１０と遮光フレーム５との間の空間に充填することにより、基板１０と遮光フレーム５との間で発光素子１と透光性部材３とを囲む光反射性部材（つまり第１光反射性部材９ａ及び第２光反射性部材９ｂ）を形成する。実施形態の発光装置の製造方法では、例えば、基板１０よりも一回り小さい（つまり平面視において外縁が基板１０に内包される大きさの）遮光フレーム５を用い、遮光フレームの外周側から、基板１０と遮光フレーム５との間の空間に第２光反射性樹脂９ｄを充填する。なお、図７Ｆは、第２光反射性部材形成工程前にシート４が除去された例である。
基板１０と遮光フレーム５との間の空間に第２光反射性樹脂９ｄを充填した後、充填した第２光反射性樹脂９ｄを硬化させる。 (Second light reflective member forming step)
Here, the uncured second light-reflecting resin 9d forming the second light-reflecting member 9b is filled in the space between the substrate 10 and the light-shielding frame 5, so that the substrate 10 and the light-shielding frame 5 are joined. A light-reflecting member (that is, a first light-reflecting member 9a and a second light-reflecting member 9b) that surrounds the light-emitting element 1 and the translucent member 3 is formed between them. In the method of manufacturing the light emitting device of the embodiment, for example, a light-shielding frame 5 that is one size smaller than the substrate 10 (that is, a size in which the outer edge is included in the substrate 10 in a plan view) is used, and the substrate is viewed from the outer peripheral side of the light-shielding frame. The space between the light-shielding frame 5 and the light-shielding frame 5 is filled with the second light-reflecting resin 9d. Note that FIG. 7F is an example in which the sheet 4 is removed before the second light-reflecting member forming step.
After filling the space between the substrate 10 and the light-shielding frame 5 with the second light-reflecting resin 9d, the filled second light-reflecting resin 9d is cured.

以上のようにして、実施形態の発光装置は製造される。 As described above, the light emitting device of the embodiment is manufactured.

（その他の工程）
実施形態の発光装置では、図６に示すように、基板１０と遮光フレーム５との間に樹脂壁７が設けられてよい。このような実施形態の発光装置を製造する場合には、製造方法として、導光支持部材接合工程の前に樹脂壁形成工程を含む。樹脂壁形成工程では遮光フレーム５の開口部及び透光性部材３から所定の間隔を隔て、且つ開口部及び透光性部材を挟んで対向する位置に樹脂壁を形成する。樹脂壁７として、所定の高さの樹脂壁７を遮光フレーム５及び／又は基板１０上に形成する。樹脂壁７は、基板１０と遮光フレーム５との間に挟まれた状態でその形状を保持可能な粘度の樹脂材料を用いて形成する。また、樹脂壁７は完全に硬化させずに、押圧による変形が可能な柔軟性を維持した状態とする。 (Other processes)
In the light emitting device of the embodiment, as shown in FIG. 6, a resin wall 7 may be provided between the substrate 10 and the light shielding frame 5. In the case of manufacturing the light emitting device of such an embodiment, the manufacturing method includes a resin wall forming step before the light guide support member joining step. In the resin wall forming step, the resin wall is formed at a predetermined distance from the opening of the light-shielding frame 5 and the translucent member 3 and at positions facing each other across the opening and the translucent member. As the resin wall 7, a resin wall 7 having a predetermined height is formed on the light-shielding frame 5 and / or the substrate 10. The resin wall 7 is formed by using a resin material having a viscosity capable of maintaining its shape while being sandwiched between the substrate 10 and the light-shielding frame 5. Further, the resin wall 7 is not completely cured, but is kept flexible so that it can be deformed by pressing.

このように、未硬化の樹脂材料を用いた樹脂壁７を基板１０と遮光フレーム５との間に介在させ、導光支持部材を押圧して樹脂壁７を変形させた状態で硬化する。これにより、遮光フレーム５を所定の高さ位置に容易に固定することができるため、発光装置の製造工程において、各発光装置の高さばらつきを抑えることができる。
なお、樹脂壁７は最終的に除去されていてもよい。樹脂壁７を除去する場合、製造方法として、第２反射部材形成工程の後に樹脂壁除去工程を含む。樹脂壁除去工程は、樹脂壁と共に、樹脂壁上の遮光フレームの外周部分を除去してもよく、これにより、より小型の発光装置を得ることができる。 In this way, the resin wall 7 using the uncured resin material is interposed between the substrate 10 and the light-shielding frame 5, and the light guide support member is pressed to cure the resin wall 7 in a deformed state. As a result, the light-shielding frame 5 can be easily fixed at a predetermined height position, so that the height variation of each light-emitting device can be suppressed in the manufacturing process of the light-emitting device.
The resin wall 7 may be finally removed. When removing the resin wall 7, the manufacturing method includes a resin wall removing step after the second reflective member forming step. In the resin wall removing step, the outer peripheral portion of the light-shielding frame on the resin wall may be removed together with the resin wall, whereby a smaller light emitting device can be obtained.

＜第二実施形態の発光装置の製造方法＞
第二実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、前記遮光フレーム上に第１光反射性樹脂を塗布する第１光反射性樹脂塗布工程と、第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さく、前記第２面の外周が前記開口部の内周より大きい板状の透光性部材を、前記透光性部材と前記開口部との間に空間が形成される位置で前記第１面が前記シートと対向するように前記塗布した第１光反射性樹脂と接触させた後押圧して且つ前記空間に前記第１光反射性樹脂を流入させて第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、を含む。
第二実施形態の発光装置の製造方法において、例えば、遮光フレーム５の開口部５ａ及び透光性部材３の第２面３ｂがいずれも長辺と短辺を有する矩形である場合には、第２面３ｂの長辺及び短辺がいずれも開口部５ａの長辺及び短辺より大きいものを用いることにより、例えば、図１Ａ及び図２Ｄに示す実施形態の発光装置を製造することができる。
以下、第二実施形態の発光装置の製造方法について図面を参照しながら説明する。 <Manufacturing method of the light emitting device of the second embodiment>
The method for manufacturing the light emitting device of the second embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a first method on the light shielding frame. It has a first light-reflecting resin coating step of applying one light-reflecting resin, and a first surface and a second surface opposite to the first surface, and the outer periphery of the first surface is inside the opening. A plate-shaped translucent member smaller than the circumference and having an outer circumference of the second surface larger than the inner circumference of the opening is provided at a position where a space is formed between the translucent member and the opening. The first light-reflecting member is formed by contacting and then pressing the coated first light-reflecting resin so that one surface faces the sheet and allowing the first light-reflecting resin to flow into the space. A step of forming a light guide support member in which the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member, an upper surface of the mounted light emitting element, and the second surface. By joining the light guide support member joining step of fixing the light guide support member on the light emitting element by joining the two, and by filling the second light reflective resin between the substrate and the light shielding frame. It includes a second light-reflecting member forming step of forming a second light-reflecting member surrounding the light emitting element.
In the method for manufacturing the light emitting device of the second embodiment, for example, when the opening 5a of the light-shielding frame 5 and the second surface 3b of the translucent member 3 are both rectangular having a long side and a short side, the first By using those having both the long side and the short side of the two surfaces 3b larger than the long side and the short side of the opening 5a, for example, the light emitting device of the embodiment shown in FIGS. 1A and 2D can be manufactured.
Hereinafter, a method for manufacturing the light emitting device of the second embodiment will be described with reference to the drawings.

（発光素子実装工程、遮光フレーム載置工程）
発光素子実装工程及び遮光フレーム載置工程については、第一実施形態の発光装置の製造方法と同様であるため、説明を省略する。 (Light emitting element mounting process, shading frame mounting process)
Since the light emitting element mounting step and the light shielding frame mounting step are the same as the manufacturing method of the light emitting device of the first embodiment, the description thereof will be omitted.

（第１光反射性樹脂塗布工程）
ここでは、図８Ａに示すように、遮光フレーム５上に第１光反射性樹脂９ｃを塗布する。
第１光反射性樹脂９ｃの塗布量は、次の導光支持部材形成工程において、透光性部材３と遮光フレーム５との間に第１光反射性部材９ａを隙間なく形成できる量であることが好ましい。但し、発光装置の発光面となる透光性部材３の第１面３ａからの光の放出を妨げないため、透光性部材３の第１面３ａに第１光反射性樹脂９ｃが付着しないように、第１光反射性樹脂９ｃの塗布量及び粘度を調整することが好ましい。
第１光反射性樹脂９ｃは、例えば、樹脂吐出装置のノズルを用いて、そのノズルの先端から吐出し、遮光フレーム５上に塗布することができる。第１光反射性樹脂９ｃは、例えば、遮光フレーム５の開口に沿って開口を取り囲むように枠状に塗布してもよいし、開口に沿って線状、点状に塗布してもよい。
遮光フレーム５上に塗布された第１光反射性樹脂９ｃに透光性部材３が接触することにより、未硬化の第１光反射性樹脂９ｃが、遮光フレーム５及び透光性部材３の表面を伝って移動し、遮光フレーム５の開口部５ａの内側面と透光性部材３の側面を被覆しながら、透光性部材と開口部との間の空間に充填される。
未硬化の第１光反射性樹脂９ｃの粘度は、例えば５Ｐａ・ｓ以上１５Pａ・ｓ以下とすることが好ましい。樹脂材料に低粘度なものを用いることにより、ボイド等の発生を抑制しながら、樹脂材料のより細部への流動を確保することができる。 (1st light reflective resin coating process)
Here, as shown in FIG. 8A, the first light-reflecting resin 9c is applied onto the light-shielding frame 5.
The amount of the first light-reflecting resin 9c applied is an amount capable of forming the first light-reflecting member 9a between the light-transmitting member 3 and the light-shielding frame 5 without a gap in the next light guide support member forming step. Is preferable. However, since the light emission from the first surface 3a of the translucent member 3 which is the light emitting surface of the light emitting device is not hindered, the first light reflective resin 9c does not adhere to the first surface 3a of the translucent member 3. As described above, it is preferable to adjust the coating amount and viscosity of the first light-reflecting resin 9c.
The first light-reflecting resin 9c can be discharged from the tip of the nozzle of the resin ejection device, for example, and applied onto the light-shielding frame 5. The first light-reflecting resin 9c may be applied in a frame shape so as to surround the opening along the opening of the light-shielding frame 5, or may be applied in a linear or dot shape along the opening.
When the light-transmitting member 3 comes into contact with the first light-reflecting resin 9c coated on the light-shielding frame 5, the uncured first light-reflecting resin 9c becomes the surface of the light-shielding frame 5 and the light-transmitting member 3. The space between the translucent member and the opening is filled while covering the inner side surface of the opening 5a of the light-shielding frame 5 and the side surface of the translucent member 3.
The viscosity of the uncured first light-reflecting resin 9c is preferably, for example, 5 Pa · s or more and 15 Pa · s or less. By using a resin material having a low viscosity, it is possible to secure the flow of the resin material to more details while suppressing the generation of voids and the like.

（導光支持部材形成工程）
ここでは、第１面３ａと該第１面３ａの反対側の第２面３ｂとを有し、第１面３ａの外周が遮光フレーム５の開口部５ａの内周より小さく、第２面３ｂの外周が遮光フレーム５の開口部５ａの内周より大きい板状の透光性部材３を用いる。
透光性部材３と遮光フレーム５の開口部５ａとの間に空間が形成される位置で透光性部材３の第１面３ａがシート４と対向するように、透光性部材３を遮光フレーム５上に塗布した第１光反射性樹脂９ｃと接触させることにより、第１光反射性樹脂９ｃが流動し、図８Ｂに示すように上記空間に配置される。第１光反射性樹脂９ｃの遮光フレーム５上への塗布は、開口部５ａを囲むように枠状に塗布してもよいし、開口部５ａに沿って、平面視円状、線状に複数個所塗布してもよい。
例えば、平面視で透光性部材３の第２面３ｂの外周全体が遮光フレーム５の開口部５ａの内周の外側に位置するように配置し、透光性部材３の側面を遮光フレーム５上に塗布した第１光反射性樹脂９ｃと接触させると、第１光反射性樹脂９ｃが透光性部材３の第１面３ａ側に向かって流動し、短時間で透光性部材３の側面と遮光フレーム５の開口部５ａとの間の空間に第１光反射性樹脂９ｃを充填することができる。遮光フレーム５の開口部５ａ及び透光性部材３の第２面３ｂがいずれも長辺と短辺を有する矩形である場合には、平面視で第２面３ｂの長辺と開口部５ａの長辺間の距離及び第２面３ｂの短辺と開口部５ａの短辺間の距離が等しくなるように透光性部材３と遮光フレーム５とを配置することが好ましい。 (Light guide support member forming process)
Here, it has a first surface 3a and a second surface 3b on the opposite side of the first surface 3a, and the outer circumference of the first surface 3a is smaller than the inner circumference of the opening 5a of the light shielding frame 5, and the second surface 3b A plate-shaped translucent member 3 whose outer circumference is larger than the inner circumference of the opening 5a of the light-shielding frame 5 is used.
The translucent member 3 is shielded from light so that the first surface 3a of the translucent member 3 faces the sheet 4 at a position where a space is formed between the translucent member 3 and the opening 5a of the light-shielding frame 5. By contacting the first light-reflecting resin 9c coated on the frame 5, the first light-reflecting resin 9c flows and is arranged in the above space as shown in FIG. 8B. The first light-reflecting resin 9c may be applied on the light-shielding frame 5 in a frame shape so as to surround the opening 5a, or may be formed in a circular or linear shape along the opening 5a. It may be applied in places.
For example, in a plan view, the entire outer periphery of the second surface 3b of the translucent member 3 is arranged so as to be located outside the inner circumference of the opening 5a of the light-shielding frame 5, and the side surface of the translucent member 3 is arranged on the side surface of the light-shielding frame 5. When brought into contact with the first light-reflecting resin 9c coated above, the first light-reflecting resin 9c flows toward the first surface 3a side of the light-transmitting member 3, and the light-transmitting member 3 in a short time. The space between the side surface and the opening 5a of the light-shielding frame 5 can be filled with the first light-reflecting resin 9c. When both the opening 5a of the light-shielding frame 5 and the second surface 3b of the translucent member 3 are rectangular having a long side and a short side, the long side and the opening 5a of the second surface 3b in a plan view It is preferable to arrange the translucent member 3 and the light-shielding frame 5 so that the distance between the long sides and the distance between the short side of the second surface 3b and the short side of the opening 5a are equal.

透光性部材３を遮光フレーム５の開口部５ａ内に配置し、上述した空間が第１光反射性樹脂９ｃで充填された後、第１光反射性樹脂９ｃを硬化させて、第１光反射性部材９ａを形成する。これにより、図８Ｃ又は図８Ｄに示すように、遮光フレーム５と透光性部材３とが第１光反射性部材９ａにより支持された導光支持部材を作製することができる。 The translucent member 3 is arranged in the opening 5a of the light-shielding frame 5, the above-mentioned space is filled with the first light-reflecting resin 9c, and then the first light-reflecting resin 9c is cured to obtain the first light. The reflective member 9a is formed. As a result, as shown in FIG. 8C or FIG. 8D, a light guide support member in which the light-shielding frame 5 and the translucent member 3 are supported by the first light-reflecting member 9a can be produced.

シート４は、導光支持部材接合工程後、あるいは第２光反射性部材形成工程後に除去してよい。 The sheet 4 may be removed after the light guide support member joining step or after the second light reflective member forming step.

（導光支持部材接合工程、第２光反射性部材形成工程）
導光支持部材接合工程及び第２光反射性部材形成工程については、第一実施形態の発光装置の製造方法と同様であるため、説明を省略する。 (Light guide support member joining process, second light reflective member forming process)
Since the light guide support member joining step and the second light reflecting member forming step are the same as the manufacturing method of the light emitting device of the first embodiment, the description thereof will be omitted.

＜第三実施形態の発光装置の製造方法＞
第三実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、前記遮光フレーム上に第１光反射性樹脂を塗布する第１光反射性樹脂塗布工程と、第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さく、前記第２面の外周の一部が前記開口部の内周より大きい板状の透光性部材を、前記透光性部材と前記開口部との間に空間が形成される位置で前記第１面が前記シートと対向するように前記塗布した第１光反射性樹脂と接触させた後押圧して且つ前記空間に前記第１光反射性樹脂を流入させて第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、を含む。
第三実施形態の発光装置の製造方法において、透光性部材３の第２面３ｂの外周及び透光性部材３の第２面３ｂの外周がいずれも略矩形状である場合には、第２面３ｂの少なくとも一辺、好ましくは対向する２辺が、対応する開口部５ａの内周の辺より大きいものを用いる。例えば、遮光フレーム５の開口部５ａ及び透光性部材３の第２面３ｂがいずれも長辺と短辺を有する矩形である場合には、第２面３ｂの短辺が開口部５ａの短辺より大きいものを用いることにより、図１Ｂ、図２Ｅ及び図２Ｆに示す実施形態の発光装置を製造することができる。
例えば、導光支持部材形成工程において、平面視で透光性部材３の第２面３ｂの外周の一辺が遮光フレーム５の開口部５ａの内周の一辺の外側に位置するように、透光性部材３を遮光フレーム５上に塗布した第１光反射性樹脂９ｃと接触させる。これにより、第１光反射性樹脂９ｃを透光性部材３に向かって流動させることができ、遮光フレーム５の開口部５ａとの間の空間に第１光反射性樹脂９ｃを充填することができる。 <Manufacturing method of the light emitting device of the third embodiment>
The method for manufacturing the light emitting device of the third embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a first method on the light shielding frame. It has a first light-reflecting resin coating step of applying one light-reflecting resin, and a first surface and a second surface opposite to the first surface, and the outer periphery of the first surface is inside the opening. A plate-shaped translucent member smaller than the circumference and a part of the outer periphery of the second surface larger than the inner circumference of the opening, and a position where a space is formed between the translucent member and the opening. The first light-reflecting resin is brought into contact with the coated first light-reflecting resin so that the first surface faces the sheet and then pressed, and the first light-reflecting resin is allowed to flow into the space to have the first light-reflecting property. A light guide support member forming step of forming a member and producing a light guide support member in which the light-shielding frame and the light-transmitting member are supported by a first light-reflecting member, an upper surface of the mounted light emitting element, and the above. A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the second surface, and filling a second light reflective resin between the substrate and the light shielding frame. This includes a second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element.
In the method for manufacturing the light emitting device of the third embodiment, when the outer circumference of the second surface 3b of the translucent member 3 and the outer circumference of the second surface 3b of the translucent member 3 are both substantially rectangular, the first At least one side of the two surfaces 3b, preferably two opposing sides, is larger than the inner peripheral side of the corresponding opening 5a. For example, when the opening 5a of the light-shielding frame 5 and the second surface 3b of the translucent member 3 are both rectangular having a long side and a short side, the short side of the second surface 3b is the short side of the opening 5a. By using a device larger than the side, the light emitting device of the embodiment shown in FIGS. 1B, 2E and 2F can be manufactured.
For example, in the light guide support member forming step, light transmission is performed so that one side of the outer circumference of the second surface 3b of the light transmission member 3 is located outside one side of the inner circumference of the opening 5a of the light shielding frame 5 in a plan view. The sex member 3 is brought into contact with the first light-reflecting resin 9c coated on the light-shielding frame 5. As a result, the first light-reflecting resin 9c can be made to flow toward the light-transmitting member 3, and the space between the light-shielding frame 5 and the opening 5a can be filled with the first light-reflecting resin 9c. it can.

第三実施形態の発光装置の製造方法は、透光性部材３の形状が第二実施形態の発光装置の製造方法と異なる点で相違しており、その他の製造方法は同じである。すなわち、第二実施形態の発光装置の製造方法では、第２面３ｂの外周全体が遮光フレーム５の開口部５ａの内周より大きい透光性部材３を用いるのに対し、第三実施形態の発光装置の製造方法では、第２面３ｂの外周の一部が開口部５ａの内周より大きい透光性部材３を用いる。これにより、一部で接触した第１光反射性樹脂９ｃを透光性部材３に向かって流入させることができ、また、第１光反射性樹脂９ｃの流動状態を第２面３ｂ側から容易に視認することができる。このようにして、図１Ｂに示す、透光性部材３の第２面の外周の一部が遮光フレーム５の開口部５ａの内周の外側に位置し、且つ第２面の外周の残部が開口部５ａの内周の内側に位置する構成の発光装置を製造することができる。 The method for manufacturing the light emitting device of the third embodiment is different from the method for manufacturing the light emitting device of the second embodiment in that the shape of the translucent member 3 is different, and the other manufacturing methods are the same. That is, in the method for manufacturing the light emitting device of the second embodiment, the translucent member 3 in which the entire outer circumference of the second surface 3b is larger than the inner circumference of the opening 5a of the light shielding frame 5 is used, whereas in the third embodiment In the method of manufacturing the light emitting device, a translucent member 3 in which a part of the outer circumference of the second surface 3b is larger than the inner circumference of the opening 5a is used. As a result, the first light-reflecting resin 9c that is partially contacted can flow toward the light-transmitting member 3, and the flow state of the first light-reflecting resin 9c can be easily changed from the second surface 3b side. Can be visually recognized. In this way, a part of the outer circumference of the second surface of the translucent member 3 shown in FIG. 1B is located outside the inner circumference of the opening 5a of the light-shielding frame 5, and the rest of the outer circumference of the second surface is located. A light emitting device having a configuration located inside the inner circumference of the opening 5a can be manufactured.

上述のように、第三実施形態の発光装置の製造方法は、用いる透光性部材３が異なる以外は第二実施形態の発光装置の製造方法と同様であるため、他の説明を省略する。 As described above, the method for manufacturing the light emitting device of the third embodiment is the same as the method for manufacturing the light emitting device of the second embodiment except that the translucent member 3 used is different, and thus other description will be omitted.

以上のようにして、実施形態の発光装置は製造される。 As described above, the light emitting device of the embodiment is manufactured.

以上の説明では、単一の発光装置を図示した図面を参照しながら説明した。
しかしながら、第一〜第三実施形態の発光装置の製造方法では、基板及び遮光フレームとして、それぞれ個々の発光装置に対応する複数の単位領域に区分されたものを用いて複数の発光装置を一括して作製した後に個々の発光装置に分離するようにすることが好ましい。
例えば、基板及び遮光フレームとして、複数の行（ｎ行）及び複数の列（ｍ列）を成すように複数（ｎ×ｍ）の単位領域を含む基板を用いてよい。
また、例えば、遮光フレームとして、基板に対応する複数の行（ｎ行）及び複数の列（ｍ列）を成すように複数（ｎ×ｍ）の単位領域を含む遮光フレームを用いてよい。あるいは、例えば、遮光フレームとして、基板に対応する複数の行（ｎ行）及び複数の列（ｍ列）を成すように複数（ｎ×ｍ）の遮光フレームを用い、各遮光フレームを単位領域としてよい。 In the above description, a single light emitting device has been described with reference to the illustrated drawings.
However, in the method for manufacturing the light emitting device of the first to third embodiments, a plurality of light emitting devices are collectively divided into a plurality of unit areas corresponding to the individual light emitting devices as the substrate and the light shielding frame. It is preferable that the light emitting device is separated into individual light emitting devices after the production.
For example, as the substrate and the light-shielding frame, a substrate containing a plurality of (n × m) unit areas so as to form a plurality of rows (n rows) and a plurality of columns (m columns) may be used.
Further, for example, as the light-shielding frame, a light-shielding frame including a plurality of (n × m) unit areas so as to form a plurality of rows (n rows) and a plurality of columns (m columns) corresponding to the substrate may be used. Alternatively, for example, as a light-shielding frame, a plurality of (n × m) light-shielding frames are used so as to form a plurality of rows (n rows) and a plurality of columns (m columns) corresponding to the substrate, and each light-shielding frame is used as a unit area. Good.

以下のようにして複数の発光装置を作成する。
（１）発光素子実装工程において、上記単位領域にそれぞれ１又は２以上の発光素子１を実装する。
（２）第一実施形態の発光装置の製造方法について、導光支持部材形成工程前に樹脂形成工程を行う場合には、開口部及び透光性部材から所定の間隔を隔て、且つ前記開口部及び透光性部材を挟んで対向する位置に単位領域ごとに樹脂壁を形成する。
遮光フレームとして、複数の行（ｎ行）及び複数の列（ｍ列）を成すように複数（ｎ×ｍ）の単位領域を含むものを用いる場合、例えば、互いに平行な複数の樹脂壁を列方向に形成することにより、列方向に配列された複数の単位領域の樹脂壁を連続した一本の樹脂壁により形成することが可能になり、効率良く樹脂壁を形成することができる。
（３）導光支持部材接合工程において、上記単位領域に実装された１又は２以上の発光素子１を一括して覆うようにそれぞれ導光支持部材を接合する。
（４）第２光反射性部材形成工程において、各単位領域の基板と遮光フレームの間の空間にそれぞれ光反射性樹脂を充填する。
そして、光反射性部材形成工程後に、分割工程において、光反射性部材及び基板を単位領域ごとに分割することで、発光装置を個片化する。分割は、例えばブレード等を用いた切断により行うことができる。
この単位領域ごとに分割することを考慮すると、単位領域ごとに分割する際の分割位置が遮光フレーム５の外周から離れていることが好ましい。言い換えれば、遮光フレーム５は、発光装置の外形より一回り小さいことが好ましい。この場合、例えば、遮光フレームとして、発光装置の外形より一回り小さい複数の遮光フレームを用いてよい。 Create a plurality of light emitting devices as follows.
(1) In the light emitting element mounting step, one or two or more light emitting elements 1 are mounted in the unit regions, respectively.
(2) Regarding the method for manufacturing the light emitting device of the first embodiment, when the resin forming step is performed before the light guide support member forming step, the opening is separated from the opening and the translucent member by a predetermined distance, and the opening. A resin wall is formed for each unit region at positions facing each other across the translucent member.
When a light-shielding frame containing a plurality of (n × m) unit areas so as to form a plurality of rows (n rows) and a plurality of columns (m columns), for example, a plurality of resin walls parallel to each other are arranged in columns. By forming in the direction, it becomes possible to form the resin walls of a plurality of unit regions arranged in the row direction by one continuous resin wall, and the resin wall can be efficiently formed.
(3) In the light guide support member joining step, the light guide support members are joined so as to collectively cover one or more light emitting elements 1 mounted in the unit region.
(4) In the second light-reflecting member forming step, the space between the substrate and the light-shielding frame in each unit region is filled with the light-reflecting resin.
Then, after the light-reflecting member forming step, in the dividing step, the light-reflecting member and the substrate are divided into unit regions to individualize the light emitting device. The division can be performed, for example, by cutting with a blade or the like.
Considering that the unit region is divided, it is preferable that the division position when the unit region is divided is separated from the outer periphery of the light-shielding frame 5. In other words, the light-shielding frame 5 is preferably one size smaller than the outer shape of the light emitting device. In this case, for example, as the light-shielding frame, a plurality of light-shielding frames that are one size smaller than the outer shape of the light emitting device may be used.

以上の発光装置の製造方法によれば、複数の発光装置を一括して作製した後に個々の発光装置に分離するようにしているので、発光装置を安価に製造することができる。 According to the above method for manufacturing a light emitting device, since a plurality of light emitting devices are collectively manufactured and then separated into individual light emitting devices, the light emitting device can be manufactured at low cost.

１ 発光素子
３ 透光性部材
３ａ 第１面（発光装置の光出射面）
３ｂ 第２面（発光装置の光入射面）
４ シート
５ 遮光フレーム
５ａ 開口部
５ｂ 窪み部
７ 樹脂壁
９ａ 第１光反射性部材
９ｂ 第２光反射性部材
９ｃ 第１光反射性樹脂
９ｄ 第２光反射性樹脂
１０ 基板
１１ 導電性接合部材
１３ 導光部材
３０ 吸着コレット
３５ ノズル 1 Light emitting element 3 Translucent member 3a First surface (light emitting surface of light emitting device)
3b Second surface (light incident surface of light emitting device)
4 Sheet 5 Light-shielding frame 5a Opening 5b Recess 7 Resin wall 9a 1st light-reflecting member 9b 2nd light-reflective member 9c 1st light-reflective resin 9d 2nd light-reflective resin 10 Substrate 11 Conductive joining member 13 Light guide member 30 Suction collet 35 Nozzle

Claims (11)

基板上に発光素子を実装する実装工程と、
開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、
第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さい板状の透光性部材を、前記第１面が前記シートと対向し、且つ前記透光性部材と前記開口部との間に空間を設けて前記開口部内に載置する透光性部材載置工程と、
第１光反射性樹脂を、前記空間に充填して第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが前記第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、
前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、
第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、
を含む発光装置の製造方法。 The mounting process for mounting the light emitting element on the substrate,
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
A plate-shaped translucent member having a first surface and a second surface on the opposite side of the first surface, the outer periphery of the first surface being smaller than the inner circumference of the opening, and the first surface being said. A translucent member mounting step of facing the sheet and providing a space between the translucent member and the opening and mounting the translucent member in the opening.
The space is filled with the first light-reflecting resin to form the first light-reflecting member, and the light-shielding frame and the light-transmitting member are supported by the first light-reflecting member. And the process of forming the light guide support member
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
A method for manufacturing a light emitting device including. 前記透光性部材の前記第２面は前記第１面より大きくなっており、
前記透光性部材載置工程において、前記第２面の外周の少なくとも一部が上方から平面視したときに前記開口部の内周の外側に位置するように前記透光性部材を載置する請求項１に記載の発光装置の製造方法。 The second surface of the translucent member is larger than the first surface.
In the translucent member mounting step, the translucent member is mounted so that at least a part of the outer periphery of the second surface is located outside the inner circumference of the opening when viewed in a plan view from above. The method for manufacturing a light emitting device according to claim 1. 前記導光支持部材形成工程前に、前記開口部及び前記透光性部材から所定の間隔を隔て、且つ前記開口部及び前記透光性部材を挟んで対向する位置に樹脂壁を形成する樹脂壁形成工程を含む請求項１又は２に記載の発光装置の製造方法。 Before the light guide support member forming step, a resin wall is formed at a position facing the opening and the translucent member at a predetermined distance from the opening and the translucent member. The method for manufacturing a light emitting device according to claim 1 or 2, which includes a forming step. 前記樹脂壁を除去する樹脂壁除去工程を含む請求項３に記載の発光装置の製造方法。 The method for manufacturing a light emitting device according to claim 3, further comprising a resin wall removing step of removing the resin wall. 基板上に発光素子を実装する実装工程と、
開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、
前記遮光フレーム上に第１光反射性樹脂を塗布する第１光反射性樹脂塗布工程と、
第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さく、前記第２面の外周が前記開口部の内周より大きい板状の透光性部材を、前記透光性部材と前記開口部との間に空間が形成される位置で前記第１面が前記シートと対向するように前記塗布した第１光反射性樹脂と接触させた後押圧して且つ前記空間に前記第１光反射性樹脂を流入させて第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、
前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、
第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、
を含む発光装置の製造方法。 The mounting process for mounting the light emitting element on the substrate,
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and the outer circumference of the second surface is smaller than the inner circumference of the opening. The first light reflective member coated with a large plate-shaped translucent member so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first light-reflecting. A light guide support member forming step for producing a light guide support member supported by the member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
A method for manufacturing a light emitting device including. 基板上に発光素子を実装する実装工程と、
開口部を有する遮光フレームを、シートに載置する遮光フレーム載置工程と、
前記遮光フレーム上に第１光反射性樹脂を塗布する第１光反射性樹脂塗布工程と、
第１面と該第１面の反対側の第２面とを有し、前記第１面の外周が前記開口部の内周より小さく、前記第２面の外周の一部が前記開口部の内周より大きい板状の透光性部材を、前記透光性部材と前記開口部との間に空間が形成される位置で前記第１面が前記シートと対向するように前記塗布した第１光反射性樹脂と接触させた後押圧して且つ前記空間に前記第１光反射性樹脂を流入させて第１光反射性部材を形成し、前記遮光フレームと前記透光性部材とが第１光反射性部材により支持された導光支持部材を作製する導光支持部材形成工程と、
前記実装した発光素子の上面と前記第２面とを接合することにより前記発光素子上に前記導光支持部材を固定する導光支持部材接合工程と、
第２光反射性樹脂を、前記基板と前記遮光フレームの間に充填することにより、前記発光素子を囲む第２光反射性部材を形成する第２光反射性部材形成工程と、
を含む発光装置の製造方法。 The mounting process for mounting the light emitting element on the substrate,
A light-shielding frame mounting process in which a light-shielding frame having an opening is placed on a sheet,
The first light-reflecting resin coating step of applying the first light-reflecting resin on the light-shielding frame, and
It has a first surface and a second surface opposite to the first surface, the outer circumference of the first surface is smaller than the inner circumference of the opening, and a part of the outer circumference of the second surface is the opening. The first coating of a plate-shaped translucent member larger than the inner circumference so that the first surface faces the sheet at a position where a space is formed between the translucent member and the opening. After contacting with the light-reflecting resin, the first light-reflecting resin is pressed and the first light-reflecting resin flows into the space to form the first light-reflecting member, and the light-shielding frame and the translucent member are first. A light guide support member forming step for producing a light guide support member supported by a light reflective member, and
A light guide support member joining step of fixing the light guide support member on the light emitting element by joining the upper surface of the mounted light emitting element and the second surface.
A second light-reflecting member forming step of forming a second light-reflecting member surrounding the light-emitting element by filling the second light-reflecting resin between the substrate and the light-shielding frame.
A method for manufacturing a light emitting device including. 前記導光支持部材形成工程において、前記透光性部材の前記第１面を前記シートと接触させて前記透光性部材を配置する請求項５又は６に記載の発光装置の製造方法。 The method for manufacturing a light emitting device according to claim 5 or 6, wherein in the light guide support member forming step, the first surface of the translucent member is brought into contact with the sheet to arrange the translucent member. 前記基板及び遮光フレームは、複数の単位領域に区分されており、
前記実装工程において、前記単位領域にそれぞれ１又は２以上の発光素子を実装し、
前記導光支持部材形成工程において、前記単位領域にそれぞれ導光支持部材を形成し、
前記導光支持部材接合工程において、前記単位領域に実装された前記１又は２以上の発光素子を一括して覆うように前記導光支持部材を接合し、
前記第２光反射性部材形成工程において、各単位領域の前記基板と前記遮光フレームの間に前記第２光反射性樹脂を充填し、
前記第２光反射性部材形成工程後に、単位領域ごとに分割する分割工程を含む請求項１〜７のいずれか１つに記載の発光装置の製造方法。 The substrate and the light-shielding frame are divided into a plurality of unit areas.
In the mounting step, one or two or more light emitting elements are mounted in the unit region, respectively.
In the light guide support member forming step, the light guide support members are formed in the unit regions, respectively.
In the light guide support member joining step, the light guide support member is joined so as to collectively cover the one or more light emitting elements mounted in the unit region.
In the second light-reflecting member forming step, the second light-reflecting resin is filled between the substrate and the light-shielding frame in each unit region.
The method for manufacturing a light emitting device according to any one of claims 1 to 7 , further comprising a dividing step of dividing each unit region after the second light reflecting member forming step. 前記導光支持部材接合工程後に、前記シートを除去するシート除去工程を含む請求項１〜８のいずれか１つに記載の発光装置の製造方法。 The method for manufacturing a light emitting device according to any one of claims 1 to 8 , further comprising a sheet removing step of removing the sheet after the light guide support member joining step. 前記導光支持部材接合工程において、前記透光性部材の第１面の外周が、上方から平面視したときに前記発光素子の外周の内側に位置するように前記透光性部材を接合する請求項１〜９のいずれか１つに記載の発光装置の製造方法。 A claim for joining the translucent member so that the outer periphery of the first surface of the translucent member is located inside the outer periphery of the light emitting element when viewed from above in a plan view in the light guide support member joining step. Item 8. The method for manufacturing a light emitting device according to any one of Items 1 to 9 . 前記透光性部材は、蛍光体を含む請求項１〜１０のいずれか１つに記載の発光装置の製造方法。 The method for manufacturing a light emitting device according to any one of claims 1 to 10 , wherein the translucent member includes a phosphor.
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