JP6761690B2 - Column member mounting device, column member mounting method - Google Patents

Column member mounting device, column member mounting method Download PDF

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JP6761690B2
JP6761690B2 JP2016148795A JP2016148795A JP6761690B2 JP 6761690 B2 JP6761690 B2 JP 6761690B2 JP 2016148795 A JP2016148795 A JP 2016148795A JP 2016148795 A JP2016148795 A JP 2016148795A JP 6761690 B2 JP6761690 B2 JP 6761690B2
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columnar member
columnar
mask
flux
semiconductor substrate
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JP2018018985A (en
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昭隆 山岸
昭隆 山岸
矢沢　一郎
一郎 矢沢
研吾 宮坂
研吾 宮坂
満 千野
満 千野
雅彦 仙道
雅彦 仙道
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Athlete FA Corp
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Athlete FA Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

本発明は、柱状部材搭載装置および柱状部材搭載方法に関する。 The present invention relates to a columnar member mounting device and a columnar member mounting method.

半導体基板と回路基板などの基板を電気的に接合する場合、半導体基板上に形成された複数の半田バンプを回路基板との間で溶融して接合するものが知られている（たとえば、特許文献１）。しかしながら、特許文献１では、半田バンプを接合材として半導体基板と回路基板とを接合する際、半田バンプが潰れて径方向に拡がり、隣接する半田バンプ間の距離が縮まってしまうことから、微細化が進む基板の実装に対応できない場合がある（図８（Ａ）参照）。そこで、半導体基板に銅（Ｃｕ）ピラーを形成し回路基板との接合材として半田層を形成して接合するものが特許文献２に開示されている（たとえば、特許文献２参照）。特許文献２に開示される銅ピラーは、半導体基板と回路基板とを接合する際に直径が変化しないことから微細化に適している（図８（Ｂ）参照）。しかし、銅ピラーは、半導体基板に電界メッキなどによって柱状に形成されるため、形成に要する時間が多くかかり生産性が良好とは言えない。また、直近では、半導体基板上に形成される銅ピラーに替えて銅などの金属によって形成された柱状部材（導体ピン）を接合部材とするものが知られている。 When electrically bonding a semiconductor substrate and a substrate such as a circuit board, it is known that a plurality of solder bumps formed on the semiconductor substrate are melted and bonded to the circuit board (for example, Patent Documents). 1). However, in Patent Document 1, when a semiconductor substrate and a circuit board are joined using a solder bump as a bonding material, the solder bump is crushed and expands in the radial direction, and the distance between adjacent solder bumps is shortened. It may not be possible to support the mounting of the board on which the process progresses (see FIG. 8 (A)). Therefore, Patent Document 2 discloses a semiconductor substrate in which copper (Cu) pillars are formed and a solder layer is formed and bonded as a bonding material to the circuit board (see, for example, Patent Document 2). The copper pillar disclosed in Patent Document 2 is suitable for miniaturization because the diameter does not change when the semiconductor substrate and the circuit board are joined (see FIG. 8B). However, since the copper pillars are formed into columns on the semiconductor substrate by electric field plating or the like, it takes a long time to form the copper pillars, and the productivity cannot be said to be good. Further, recently, it is known that a columnar member (conductor pin) formed of a metal such as copper is used as a joining member instead of a copper pillar formed on a semiconductor substrate.

しかし、上記柱状部材（導体ピン）の長手方向の長さは、直径に対して長い（アスペクト比が大きい）ことから、半導体基板上に柱状部材を配列、搭載するのは困難であった。特許文献３には、導体ピンを半導体基板に配列、搭載する導体ピンの接合法が開示されている。 However, since the length of the columnar member (conductor pin) in the longitudinal direction is long with respect to the diameter (the aspect ratio is large), it is difficult to arrange and mount the columnar member on the semiconductor substrate. Patent Document 3 discloses a method for joining conductor pins in which conductor pins are arranged and mounted on a semiconductor substrate.

特開平５−２４３２３２号公報Japanese Unexamined Patent Publication No. 5-243232 特開２０１４−１５７９０６号公報Japanese Unexamined Patent Publication No. 2014-157906 特開２００２−３１４２９１号公報JP-A-2002-314291

特許文献３に記載の導体ピン（柱状部材）の接合方法は、まず、治具パレット、ピン立て治具および挿入案内治具を重ねて配置し、導体ピンを挿入案内治具の上方から落下させ、ピン立て治具が治具パレットと挿入案内治具との間をスライドするように治具パレットを振動させて、ピン立て治具のピン穴に導体ピンを配置する。そして、治具パレット、ピン立て治具および挿入案内治具を重ねた状態で上下を逆にして、プリント配線板に導体ピンを立設させた状態で接合している。このような導体ピンの接合方法では、治具パレットに振動を与えることによって導体ピンをピン穴に供給することから、導体ピン表面に傷がつきやすく接合不良が発生しやすいという課題がある。また、振動によって導体ピンが重なり合ったり、挿入案内治具上の一部に偏って供給されてしまったりすることで、全ての導体ピンを立設させるのに時間がかかり、生産性が良いとはいえない。 In the method of joining the conductor pin (columnar member) described in Patent Document 3, first, the jig pallet, the pin stand jig and the insertion guide jig are arranged in an overlapping manner, and the conductor pin is dropped from above the insertion guide jig. , The jig pallet is vibrated so that the pin stand jig slides between the jig pallet and the insertion guide jig, and the conductor pin is arranged in the pin hole of the pin stand jig. Then, the jig pallet, the pin stand jig, and the insertion guide jig are stacked and turned upside down, and the conductor pins are joined in a state where they are erected on the printed wiring board. Such a method of joining conductor pins has a problem that the surface of the conductor pins is easily scratched and poor joining is likely to occur because the conductor pins are supplied to the pin holes by applying vibration to the jig pallet. In addition, the conductor pins overlap due to vibration, or the conductor pins are unevenly supplied to a part of the insertion guide jig, so it takes time to erect all the conductor pins, and productivity is good. I can't say.

本発明は、かかる課題に鑑みてなされたものであり、その目的とするところは、アスペクト比が大きく微小な柱状部材を半導体基板などに傷をつけずに効率よく搭載することが可能な柱状部材搭載装置および柱状部材搭載方法を提供しようとするものである。 The present invention has been made in view of the above problems, and an object of the present invention is a columnar member capable of efficiently mounting a small columnar member having a large aspect ratio without damaging a semiconductor substrate or the like. It is intended to provide a mounting device and a method for mounting a columnar member.

上述の課題を解決するため、本発明に係る柱状部材搭載装置は、基板の所定位置に柱状部材を配列させる柱状部材搭載装置であって、複数の開口部を有し前記基板上に配置される柱状部材配列用マスクと、柱状部材配列用マスクの上方に配置されるブラシスキージとを有し、柱状部材配列用マスク上に供給された柱状部材をブラシスキージによって開口部内に導入し、フラックスが塗布された基板の所定位置に柱状部材を配列し、ブラシスキージは、取付け部に植え込まれた結束線状部材を有し、結束線状部材は、柱状部材を柱状部材配列用マスクの開口部に導入する機能を有する内側結束線状部材と、前記柱状部材を前記ブラシスキージの外側に逸脱させない機能を有する外側結束線状部材とで構成され、結束線状部材を回転しながら移動することによって、柱状部材配列用マスク上に供給された柱状部材を開口部に誘導することを特徴とする。 In order to solve the above-mentioned problems, the columnar member mounting device according to the present invention is a columnar member mounting device for arranging columnar members at predetermined positions on a substrate, and has a plurality of openings and is arranged on the substrate. It has a mask for arranging columnar members and a brush squeegee arranged above the mask for arranging columnar members, and the columnar members supplied on the mask for arranging columnar members are introduced into the opening by the brush squeegee, and flux is applied. The columnar members are arranged at predetermined positions on the substrate, the brush squeegee has a binding linear member implanted in the mounting portion, and the binding linear member places the columnar members in the opening of the mask for arranging the columnar members. It is composed of an inner binding linear member having a function to be introduced and an outer binding linear member having a function of preventing the columnar member from deviating to the outside of the brush squeegee, and by moving the binding linear member while rotating. It is characterized in that the columnar member supplied on the columnar member arrangement mask is guided to the opening .

また、上記発明に加えて、基板への柱状部材の配列状態を検査する検査装置を有することが好ましい。 Further, in addition to the above invention, it is preferable to have an inspection device for inspecting the arrangement state of the columnar members on the substrate.

また、上記発明に加えて、結束線状部材は、ブラシスキージの回転軌跡の径方向に２重に構成されていることが好ましい。 Further, in addition to the above invention, it is preferable that the binding linear member is doubly formed in the radial direction of the rotation locus of the brush squeegee.

また、上記発明に加えて、結束線状部材は、導電性を有する柔軟性を備えた細い撚糸の集合体であることが好ましい。 Further, in addition to the above invention, the binding linear member is preferably an aggregate of thin twisted yarns having conductivity and flexibility.

また、上記発明に加えて、フラックスは、基板の上方に配置され複数の開口部を有するフラックス印刷用マスクと、樹脂スキージとによるスクリーン印刷法で塗布されることが好ましい。 Further, in addition to the above invention, the flux is preferably applied by a screen printing method using a flux printing mask arranged above the substrate and having a plurality of openings and a resin squeegee.

本発明の柱状部材搭載方法は、基板の所定位置に柱状部材を搭載する方法であって、基板の上面にフラックス印刷用マスクを配置し、基板上の所定位置にフラックスを印刷する工程と、フラックスが塗布された基板の上方に、開口部を有する柱状部材配列用マスクを配置する工程と、柱状部材配列用マスク上に柱状部材を供給する工程と、柱状部材配列用マスク上に供給された柱状部材を、柱状部材配列用マスクの上方に配置され、取付け部に植え込まれた結束線状部材を有するブラシスキージによって開口部内に導入する工程と、柱状部材配列用マスクの開口部からフラックスが塗布された基板の所定位置に柱状部材を配列させる工程と、柱状部材の配列状態を検査する工程とを含み、結束線状部材は、柱状部材を柱状部材配列用マスクの開口部に導入する機能を有する内側結束線状部材と、柱状部材をブラシスキージの外側に逸脱させない機能を有する外側結束線状部材とで構成されていることを特徴とする。 The columnar member mounting method of the present invention is a method of mounting a columnar member at a predetermined position on a substrate, in which a mask for flux printing is placed on the upper surface of the substrate and the flux is printed at a predetermined position on the substrate, and the flux A step of arranging a columnar member arrangement mask having an opening above the substrate coated with the above, a step of supplying a columnar member on the columnar member arrangement mask, and a columnarity supplied on the columnar member arrangement mask. The process of introducing the member into the opening by a brush squeegee having a binding linear member implanted in the mounting portion, which is arranged above the columnar member arrangement mask, and the flux is applied from the opening of the columnar member arrangement mask. The binding linear member includes a step of arranging the columnar members at a predetermined position on the substrate and a step of inspecting the arrangement state of the columnar members, and the binding linear member has a function of introducing the columnar members into the opening of the mask for arranging the columnar members. It is characterized in that it is composed of an inner binding linear member having an inner binding linear member and an outer binding linear member having a function of preventing the columnar member from deviating to the outside of the brush squeegee.

本発明の実施の形態に係る柱状部材搭載装置の概略全体構成を示す平面図である。It is a top view which shows the schematic whole structure of the columnar member mounting apparatus which concerns on embodiment of this invention. 本発明の実施の形態に係る柱状部材振込部の概略構成を説明する図である。It is a figure explaining the schematic structure of the columnar member transfer part which concerns on embodiment of this invention. 本発明の実施の形態に係る柱状部材振込部の作用を表す説明図である。It is explanatory drawing which shows the action of the columnar member transfer part which concerns on embodiment of this invention. 本発明の実施の形態に係る柱状部材が配列、搭載された半導体基板の１例を示す斜視図である。It is a perspective view which shows an example of the semiconductor substrate which the columnar member which concerns on embodiment of this invention is arranged and mounted. 本発明の実施の形態に係る柱状部材搭載方法の主要工程を示すフローチャートである。It is a flowchart which shows the main process of the columnar member mounting method which concerns on embodiment of this invention. 本発明の実施の形態に係るフラックス印刷工程を示す説明図である。It is explanatory drawing which shows the flux printing process which concerns on embodiment of this invention. 本発明の実施の形態に係る柱状部材の他の複数例の形状を表した図である。It is a figure which showed the shape of the other plurality of examples of the columnar member which concerns on embodiment of this invention. 従来技術および本発明の実施の形態に係る柱状部材を用いた半導体基板と回路基板の実装例を示す説明図である。It is explanatory drawing which shows the mounting example of the semiconductor substrate and the circuit board using the columnar member which concerns on the prior art and the Embodiment of this invention.

以下、本発明の実施の形態に係る柱状部材搭載装置１および柱状部材搭載方法について図面を参照しながら説明する。本発明の実施の形態を説明する前に、既述した従来技術（特許文献１、特許文献２）および柱状部材１２を用いた実装形態について図８を参照しながら説明する。 Hereinafter, the columnar member mounting device 1 and the columnar member mounting method according to the embodiment of the present invention will be described with reference to the drawings. Before explaining the embodiment of the present invention, the above-described prior art (Patent Document 1 and Patent Document 2) and the mounting embodiment using the columnar member 12 will be described with reference to FIG.

図８は、従来技術および本実施の形態の柱状部材を用いた半導体基板（ウエハーなど）５と回路基板５０の実装例を示す説明図で、接合材として、（Ａ）は半田バンプ５１を用いるもの、（Ｂ）は、半導体基板５に形成された銅ピラー５２を用いるもの、（Ｃ）は、銅などで形成された柱状部材１２を用いるものである。図８（Ａ）に示すように、半田バンプ５１は、半導体基板５に形成された実装前の形状が図中二点鎖線で表す直径がＢ０のほぼ球形となっている。半導体基板５を回路基板５０に実装すると、半田バンプ５１が溶融されて高さ（厚み）方向に沈み込み径方向に直径がＢ１に膨らむ。隣接する半田バンプ５１間のピッチＰは変化しないので、実装前の半田バンプ５１間の距離Ｄ０は、実装後の距離Ｄ１に縮まる。したがって、さらにピッチＰを小さくする場合には、半田バンプ５１の膨らみが不利となる。なお、図中、半導体基板５には電極１６が形成されていて、回路基板５０には電極５３が形成されている。 FIG. 8 is an explanatory view showing a mounting example of a semiconductor substrate (wafer or the like) 5 and a circuit board 50 using the columnar members of the prior art and the present embodiment, and (A) uses a solder bump 51 as a bonding material. (B) uses a copper pillar 52 formed on the semiconductor substrate 5, and (C) uses a columnar member 12 formed of copper or the like. As shown in FIG. 8A, the solder bump 51 is formed on the semiconductor substrate 5 and has a substantially spherical shape having a diameter B0 represented by a two-dot chain line in the drawing. When the semiconductor substrate 5 is mounted on the circuit board 50, the solder bumps 51 are melted and sink in the height (thickness) direction, and the diameter expands to B1 in the radial direction. Since the pitch P between adjacent solder bumps 51 does not change, the distance D0 between the solder bumps 51 before mounting is reduced to the distance D1 after mounting. Therefore, when the pitch P is further reduced, the bulge of the solder bump 51 becomes disadvantageous. In the figure, the semiconductor substrate 5 is formed with the electrodes 16, and the circuit board 50 is formed with the electrodes 53.

図８（Ｂ）に示すように、銅ピラー５２は、半導体基板５上に形成された電極１６に積層形成されたＵＢＭ（アンダーバンプメタル）５４上に電界メッキによって銅を析出させることによって形成される。半導体基板５上の銅ピラー５２の周囲には絶縁層５５が形成されている。銅ピラー５２の回路基板５０側の先端には、半田層５６が形成されていて、半田層５６を回路基板５０側の接合材としている。隣接する銅ピラー５２間のピッチＰを半田バンプ５１（図８（Ａ）参照）と同じにしても、実装による銅ピラー５２の直径は変化しないので、実装後の銅ピラー５２間の距離Ｄ２は変化しない。すなわち、半田バンプ５１の場合に対してピッチＰが同じであればＤ２＞Ｄ１となることから、少なくともその差分はピッチＰを小さくでき、微細化に貢献する。しかし、銅ピラー５２を形成するのに多くの時間と専用の装置を要するという課題がある。 As shown in FIG. 8B, the copper pillar 52 is formed by depositing copper on a UBM (under bump metal) 54 laminated and formed on an electrode 16 formed on a semiconductor substrate 5 by electric field plating. To. An insulating layer 55 is formed around the copper pillar 52 on the semiconductor substrate 5. A solder layer 56 is formed at the tip of the copper pillar 52 on the circuit board 50 side, and the solder layer 56 is used as a bonding material on the circuit board 50 side. Even if the pitch P between the adjacent copper pillars 52 is the same as the solder bump 51 (see FIG. 8A), the diameter of the copper pillars 52 does not change due to mounting, so that the distance D2 between the copper pillars 52 after mounting is It does not change. That is, if the pitch P is the same as in the case of the solder bump 51, D2> D1. Therefore, at least the difference can reduce the pitch P and contribute to miniaturization. However, there is a problem that it takes a lot of time and a dedicated device to form the copper pillar 52.

図８（Ｃ）は、銅などの導電性が高い金属製の柱状部材１２を半導体基板５と回路基板５０との接合に用いた例である。柱状部材１２は、実装時において銅ピラー５２と同じように変形しないので、銅ピラー５２と同じ直径、同じピッチＰにすれば柱状部材１２間の距離はＤ２であり、半導体基板５の電極間ピッチを微細化できる。なお、半導体基板には電極１６が形成されていて、回路基板５０には電極５３が形成されていて、柱状部材１２によって半導体基板５と回路基板５０とが接続される。柱状部材１２は、機械加工などで形成できるので銅ピラー５２の形成に比べ短時間で容易に大量に製造可能である。しかし、前述した従来技術（特許文献３参照）のような方法で微細な柱状部材１２を半導体基板５の所定位置に配列搭載することは困難であった。そこで、以下に、本発明に係る柱状部材１２の半導体基板５への搭載装置および搭載方法について説明する。柱状部材１２を搭載する搭載対象部材としての基板としては、半導体基板（ウエハーなど）５や回路基板５０があり、そのうちのどちらか一方に搭載することが可能であるが、以下の説明では、半導体基板５に柱状部材１２を搭載する構造を例示して説明する。 FIG. 8C is an example in which a columnar member 12 made of a metal having high conductivity such as copper is used for joining the semiconductor substrate 5 and the circuit board 50. Since the columnar member 12 does not deform in the same manner as the copper pillar 52 at the time of mounting, the distance between the columnar members 12 is D2 if the diameter and pitch P are the same as those of the copper pillar 52, and the pitch between the electrodes of the semiconductor substrate 5 is set. Can be miniaturized. An electrode 16 is formed on the semiconductor substrate, an electrode 53 is formed on the circuit board 50, and the semiconductor substrate 5 and the circuit board 50 are connected by a columnar member 12. Since the columnar member 12 can be formed by machining or the like, it can be easily manufactured in large quantities in a shorter time than the formation of the copper pillar 52. However, it has been difficult to arrange and mount the fine columnar members 12 at predetermined positions on the semiconductor substrate 5 by a method as described in the prior art (see Patent Document 3). Therefore, the mounting device and mounting method of the columnar member 12 according to the present invention on the semiconductor substrate 5 will be described below. The substrate as the mounting target member on which the columnar member 12 is mounted includes a semiconductor substrate (wafer, etc.) 5 and a circuit board 50, and can be mounted on either of them. However, in the following description, the semiconductor A structure in which the columnar member 12 is mounted on the substrate 5 will be described as an example.

（柱状部材搭載装置１の全体構成）
図１は、柱状部材搭載装置１の概略全体構成を示す平面図である。図１に示すように、柱状部材搭載装置１は、フラックス印刷装置２と柱状部材振込装置３とを有する。また、柱状部材搭載装置１は、ローダ／アンローダ４から半導体基板５をプレアライナー６に搬送する基板搬送用ロボット７を有し、基板搬送用ロボット７はプレアライナー６から押し圧装置８に半導体基板５を搬送する。プレアライナー６は、半導体基板５のＸＹ座標位置を粗調整する。粗調整によって位置補正された半導体基板５は、基板搬送用ロボット７でステージ９に載置される。ステージ９に載置された半導体基板５は、押し圧装置８で上方からステージ９側に押圧して反り矯正しながらステージ９に減圧吸引される。ステージ９は、Ｙ軸レール１０上でＹ軸方向に位置調整され、半導体基板５を載置した状態でＸ軸レール１１上を移動してフラックス印刷装置２の所定位置に停止される。なお、図１の図示横方向をＸ軸、図示縦方向をＹ軸、高さ方向（厚み方向）をＺ軸とする。 (Overall configuration of columnar member mounting device 1)
FIG. 1 is a plan view showing a schematic overall configuration of the columnar member mounting device 1. As shown in FIG. 1, the columnar member mounting device 1 includes a flux printing device 2 and a columnar member transfer device 3. Further, the columnar member mounting device 1 has a substrate transfer robot 7 that transfers the semiconductor substrate 5 from the loader / unloader 4 to the pre-aligner 6, and the substrate transfer robot 7 transfers the semiconductor substrate from the pre-aligner 6 to the pressing device 8. 5 is transported. The pre-aligner 6 roughly adjusts the XY coordinate position of the semiconductor substrate 5. The semiconductor substrate 5 whose position has been corrected by rough adjustment is placed on the stage 9 by the substrate transfer robot 7. The semiconductor substrate 5 mounted on the stage 9 is pressed by the pressing device 8 from above toward the stage 9 side to correct the warp and is sucked into the stage 9 under reduced pressure. The stage 9 is position-adjusted in the Y-axis direction on the Y-axis rail 10, moves on the X-axis rail 11 with the semiconductor substrate 5 mounted, and is stopped at a predetermined position of the flux printing device 2. The horizontal direction shown in FIG. 1 is the X-axis, the vertical direction shown is the Y-axis, and the height direction (thickness direction) is the Z-axis.

フラックス印刷装置２は、図６（Ａ）に示すようにフラックス印刷用マスク１５の開口部４５から半導体基板５の電極１６上の所定位置にフラックス３５を印刷塗布する。フラックス３５を塗布された半導体基板５は、ステージ９に載置された状態で柱状部材振込装置３に搬送される。柱状部材振込装置３は、Ｘ軸駆動装置１７、Ｙ軸駆動装置１８およびＺ軸駆動装置１９を備えていて、柱状部材振込装置３をＸ軸方向、Ｙ軸方向およびＺ軸方向に移動させることが可能になっている。なお、Ｙ軸レール１０、Ｘ軸レール１１上には、Ｚ軸およびθ軸（不図示）があり、Ｚ軸およびθ軸の駆動によってフラックス印刷用マスク１５の開口部４５（図６（Ａ）参照）、柱状部材配列用マスク２０の開口部３４（図２参照）各々の下面と半導体基板５のＰＡＤ部（柱状部材を搭載をすべき電極部）を合わせて、フラックス印刷および半導体基板５への柱状部材１２の配列を行う。 As shown in FIG. 6A, the flux printing apparatus 2 prints and applies the flux 35 from the opening 45 of the flux printing mask 15 to a predetermined position on the electrode 16 of the semiconductor substrate 5. The semiconductor substrate 5 coated with the flux 35 is conveyed to the columnar member transfer device 3 in a state of being placed on the stage 9. The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and moves the columnar member transfer device 3 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Is possible. The Y-axis rail 10 and the X-axis rail 11 have a Z-axis and a θ-axis (not shown), and the opening 45 of the flux printing mask 15 (FIG. 6A) is driven by driving the Z-axis and the θ-axis. (See), the lower surface of each opening 34 (see FIG. 2) of the columnar member arranging mask 20 and the PAD portion (electrode portion on which the columnar member should be mounted) of the semiconductor substrate 5 are combined to perform flux printing and transfer to the semiconductor substrate 5. The columnar members 12 of the above are arranged.

図２に示すように、柱状部材計量装置（不図示）から柱状部材振込部２５に落下供給された柱状部材１２は、柱状部材振込部２５から逸脱しないように結束線状部材３１によって囲まれている。柱状部材１２は、柱状部材振込部２５を移動させることによって、柱状部材配列用マスク２０の開口部３４（図２参照）から半導体基板５上のフラックス３５が塗布された場所に振り込まれて配列搭載される。柱状部材１２が搭載された半導体基板５は、検査装置２６に搬送され画像認識カメラ（不図示）によって柱状部材１２の配列状態が検査し、ローダ／アンローダ４に排出される。戻りの行程では、プレアライナー６は通過しない。なお、以上説明した柱状部材搭載装置１では、半導体基板５に柱状部材１２を搭載する構成について説明したが、回路基板５０側に柱状部材１２を搭載する構成とすることが可能である。柱状部材１２としては、たとえば、直径が数十μｍで長さが１００μｍレベルのアスペクト比が大きい微細サイズのものがある。柱状部材１２の半導体基板５への搭載については、図２〜図７を参照して後述する。 As shown in FIG. 2, the columnar member 12 dropped and supplied from the columnar member measuring device (not shown) to the columnar member transfer portion 25 is surrounded by the binding linear member 31 so as not to deviate from the columnar member transfer portion 25. There is. By moving the columnar member transfer portion 25, the columnar member 12 is transferred from the opening 34 (see FIG. 2) of the columnar member arrangement mask 20 to a place on the semiconductor substrate 5 where the flux 35 is applied and mounted in an array. Will be done. The semiconductor substrate 5 on which the columnar member 12 is mounted is conveyed to the inspection device 26, inspected by an image recognition camera (not shown) for the arrangement state of the columnar member 12, and discharged to the loader / unloader 4. The pre-aligner 6 does not pass during the return process. In the columnar member mounting device 1 described above, the configuration in which the columnar member 12 is mounted on the semiconductor substrate 5 has been described, but the columnar member 12 can be mounted on the circuit board 50 side. As the columnar member 12, for example, there is a fine-sized member having a diameter of several tens of μm and a length of 100 μm and a large aspect ratio. The mounting of the columnar member 12 on the semiconductor substrate 5 will be described later with reference to FIGS. 2 to 7.

（柱状部材振込部２５の構成および作用）
図２は、柱状部材振込部２５の概略構成を説明する図である。柱状部材振込部２５は、Ｘ軸駆動装置１７に取り付けられた回転可能なブラシスキージ２８を有している。ブラシスキージ２８は、スキージ回転駆動装置２９に固定された取付け部３０に植え込まれた結束線状部材３１を有している。結束線状部材３１は、ブラシスキージ２８の回転軌跡の径方向に２重構造（２重の同心円）となっており、内側の結束線状部材３２と外側の結束線状部材３３とから構成されている。内側の結束線状部材３２と外側の結束線状部材３３は共に、取付け部３０から柱状部材配列用マスク２０に向かって末広がり形状のいわゆるブラシである。なお、図２では、結束線状部材３１は、簡略化して表している。 (Structure and action of columnar member transfer unit 25)
FIG. 2 is a diagram illustrating a schematic configuration of a columnar member transfer portion 25. The columnar member transfer unit 25 has a rotatable brush squeegee 28 attached to the X-axis drive device 17. The brush squeegee 28 has a binding linear member 31 implanted in a mounting portion 30 fixed to the squeegee rotation drive device 29. The binding linear member 31 has a double structure (double concentric circles) in the radial direction of the rotation locus of the brush squeegee 28, and is composed of an inner binding linear member 32 and an outer binding linear member 33. ing. Both the inner binding linear member 32 and the outer binding linear member 33 are so-called brushes having a divergent shape from the mounting portion 30 toward the columnar member arrangement mask 20. In FIG. 2, the binding linear member 31 is shown in a simplified manner.

内側の結束線状部材３２は、主として柱状部材１２を柱状部材配列用マスク２０の開口部３４に導入する機能を有し、外側の結束線状部材３３は、主として柱状部材１２をブラシスキージ２８の外側に逸脱させない、つまり、外側の結束線状部材３３の外側に逸脱させない機能を有する。さらに、外側の結束線状部材３３は、内側の結束線状部材３２との間にある柱状部材１２を開口部３４に導入しつつ、内側の結束線状部材３２内に戻す機能を有する。たとえば、ブラシスキージ２８を矢印方向に回転させて柱状部材１２を開口部３４に導入するとすれば、矢印の逆方向に回転させて柱状部材１２を内側の結束線状部材３２の内側に戻すように機能させることが可能である。 The inner binding linear member 32 mainly has a function of introducing the columnar member 12 into the opening 34 of the columnar member arranging mask 20, and the outer binding linear member 33 mainly introduces the columnar member 12 into the brush squeegee 28. It has a function of not deviating to the outside, that is, not deviating to the outside of the outer binding linear member 33. Further, the outer binding linear member 33 has a function of introducing the columnar member 12 between the outer binding linear member 32 and the inner binding linear member 32 into the opening 34 and returning it to the inside of the inner binding linear member 32. For example, if the brush squeegee 28 is rotated in the direction of the arrow to introduce the columnar member 12 into the opening 34, the columnar member 12 is rotated in the opposite direction of the arrow so as to return the columnar member 12 to the inside of the inner binding linear member 32. It is possible to make it work.

図２に示すように、ステージ９の上面には、半導体基板５が載置されており、半導体基板５の上面には柱状部材配列用マスク２０が配置されている。半導体基板５と柱状部材配列用マスク２０の間には、隙間Ｅが設けられている。なお、開口部３４が配置される位置には、フラックス３５（図３参照）が塗布されている。結束線状部材３２，３３は、導電性を有する柔軟性を備えた細い撚糸集合体であって、柱状部材配列用マスク２０の表面を掃くように回転およびＸ軸方向、Ｙ軸方向に移動する間に、柱状部材１２を柱状部材配列用マスク２０に設けられた開口部３４に導入する。したがって、柱状部材１２に傷がつくようなことがない。 As shown in FIG. 2, the semiconductor substrate 5 is placed on the upper surface of the stage 9, and the columnar member arrangement mask 20 is arranged on the upper surface of the semiconductor substrate 5. A gap E is provided between the semiconductor substrate 5 and the columnar member arrangement mask 20. Flux 35 (see FIG. 3) is applied to the position where the opening 34 is arranged. The binding linear members 32 and 33 are thin twisted yarn aggregates having conductivity and flexibility, and rotate and move in the X-axis direction and the Y-axis direction so as to sweep the surface of the columnar member arrangement mask 20. In the meantime, the columnar member 12 is introduced into the opening 34 provided in the columnar member arrangement mask 20. Therefore, the columnar member 12 is not damaged.

また、結束線状部材３２，３３は、導電性を有しているので静電気による埃など吸着がなく、クリーン度が高い実装を行うことができる。なお、図２では図示を簡略化しているが、外側の結束線状部材３３は、内側の結束線状部材３２よりも密に配置されている。図２に記載の柱状部材１２は、単純な円柱形状を例示しているが、柱状部材１２の形状としては、たとえば、図７に示すように様々な形状が適合可能である。そのような場合、柱状部材１２が、サイズ、比重、縦横比（アスペクト比）が大きいものや重心位置などによる転がりの異方性から内側の結束線状部材３２の外側に出てしまうことがあるが、外側の結束線状部材３３を設けることによって、外側の結束線状部材３３の外側に柱状部材１２が逸脱しないようにしている。次に、図３を参照しながら柱状部材振込部２５の作用について説明する。 Further, since the binding linear members 32 and 33 have conductivity, dust and the like due to static electricity are not adsorbed, and mounting with a high degree of cleanliness can be performed. Although the illustration is simplified in FIG. 2, the outer binding linear member 33 is arranged more densely than the inner binding linear member 32. The columnar member 12 shown in FIG. 2 exemplifies a simple cylindrical shape, but as the shape of the columnar member 12, for example, various shapes can be adapted as shown in FIG. 7. In such a case, the columnar member 12 may come out of the inner binding linear member 32 due to the anisotropy of rolling due to a large size, specific gravity, aspect ratio, or the position of the center of gravity. However, by providing the outer binding linear member 33, the columnar member 12 does not deviate to the outside of the outer binding linear member 33. Next, the operation of the columnar member transfer unit 25 will be described with reference to FIG.

図３は、柱状部材振込部２５の作用を表す説明図である。なお、図３は、柱状部材振込部２５の一部を簡略化して表している。ステージ９上に載置された半導体基板５には、複数の電極１６が形成されており、電極１６の上面にはフラックス３５が塗布されている。半導体基板５の上方には、柱状部材配列用マスク２０が配設される。柱状部材配列用マスク２０の上面には、多数の柱状部材１２がランダムに供給される。柱状部材１２は、柱状部材計量装置で計量され一定量（一定数）が柱状部材通路２７を落下し、柱状部材配列マスク２０上に供給される。ブラシスキージ２８は、柱状部材配列用マスク２０上をＸ軸駆動装置１７とＹ軸駆動装置１８（図１参照）によってＸ軸方向、Ｙ軸方向に移動可能であり、Ｚ軸駆動装置１９によってＺ軸方向に移動可能である。ブラシスキージ２８を所定の高さ位置で回転しながらＸ軸およびＹ軸方向に移動することによって、内側の結束線状部材３２および外側の結束線状部材３３によって柱状部材配列マスク２０表面上を掃くように移動しながら柱状部材１２を柱状部材配列用マスク２０に設けられた開口部３４内に落下させる。半導体基板５には、所定位置にフラックス３５が塗布されているので、柱状部材１２は、フラックス３５の粘性を利用して落下したときの姿勢が維持される。 FIG. 3 is an explanatory diagram showing the operation of the columnar member transfer unit 25. Note that FIG. 3 is a simplified representation of a part of the columnar member transfer portion 25. A plurality of electrodes 16 are formed on the semiconductor substrate 5 mounted on the stage 9, and a flux 35 is applied to the upper surface of the electrodes 16. A mask 20 for arranging columnar members is arranged above the semiconductor substrate 5. A large number of columnar members 12 are randomly supplied to the upper surface of the columnar member arrangement mask 20. The columnar member 12 is weighed by the columnar member weighing device, and a certain amount (a certain number) falls down the columnar member passage 27 and is supplied onto the columnar member arrangement mask 20. The brush squeegee 28 can be moved in the X-axis direction and the Y-axis direction by the X-axis drive device 17 and the Y-axis drive device 18 (see FIG. 1) on the columnar member arrangement mask 20, and is Z by the Z-axis drive device 19. It can be moved in the axial direction. By moving the brush squeegee 28 in the X-axis and Y-axis directions while rotating at a predetermined height position, the columnar member array mask 20 is swept on the surface by the inner binding linear member 32 and the outer binding linear member 33. While moving in this way, the columnar member 12 is dropped into the opening 34 provided in the columnar member arrangement mask 20. Since the flux 35 is applied to the semiconductor substrate 5 at a predetermined position, the columnar member 12 maintains its posture when dropped by utilizing the viscosity of the flux 35.

内側の結束線状部材３２と外側の結束線状部材３３は、柱状部材１２が開口部３４内に落下した後、フラックス３５によって柱状部材１２の位置、姿勢が保持できるように柱状部材１２を軽く下方に押すようにしてもよい。そのようにするために、柱状部材配列マスク２０の厚みを柱状部材１２の長手方向の長さ（以下、「全長」と呼ぶ。）に対して適切な寸法にすることが好ましい。また、フラックス３５としては、柱状部材１２の半導体基板５への搭載後、接合硬化させる工程までその姿勢を維持できる粘性を有するものが選択されることが好ましい。 The inner binding linear member 32 and the outer binding linear member 33 lightly reduce the columnar member 12 so that the position and posture of the columnar member 12 can be maintained by the flux 35 after the columnar member 12 has fallen into the opening 34. You may push it downwards. In order to do so, it is preferable that the thickness of the columnar member array mask 20 is set to an appropriate dimension with respect to the length in the longitudinal direction of the columnar member 12 (hereinafter, referred to as "total length"). Further, as the flux 35, it is preferable to select a flux 35 having a viscosity capable of maintaining the posture until the step of joining and curing the columnar member 12 after mounting it on the semiconductor substrate 5.

柱状部材１２が円柱の場合、柱状部材配列用マスク２０に設けられた開口部３４の大きさは、柱状部材１２の供給側の誘導口部４０が柱状部材１２の最大径より大きく、柱状部材１２の全長より小さい。また、開口部３４の半導体基板５側の直径は、フラックス３５の塗布範囲内で柱状部材１２の位置を規定できる大きさの位置規定孔部４１となっている。そして、誘導口部４０と位置規定孔部４１は、テーパ孔で接続されている。開口部３４をこのような形状にすれば、柱状部材１２を開口部３４にスムーズに落とし込むことができ、フラックス３５の塗布範囲の所定位置に正確に配列、搭載させることが可能となる。なお、開口部３４の形状は、柱状部材１２の形状に合わせて設定される。 When the columnar member 12 is a cylinder, the size of the opening 34 provided in the columnar member arrangement mask 20 is such that the guide port 40 on the supply side of the columnar member 12 is larger than the maximum diameter of the columnar member 12, and the columnar member 12 Is smaller than the total length of. Further, the diameter of the opening 34 on the semiconductor substrate 5 side is a position-determining hole 41 having a size capable of defining the position of the columnar member 12 within the application range of the flux 35. The guide port portion 40 and the position defining hole portion 41 are connected by a tapered hole. If the opening 34 has such a shape, the columnar member 12 can be smoothly dropped into the opening 34, and the flux 35 can be accurately arranged and mounted at a predetermined position in the coating range. The shape of the opening 34 is set according to the shape of the columnar member 12.

図４は、複数の柱状部材１２が配列、搭載された半導体基板５の１例を示す斜視図である。図４に示すように、半導体基板５には、柱状部材１２がフラックス３５上、つまり電極１６上の所定位置に配列されている。柱状部材１２は、フラックス３５の粘性によって姿勢が維持されている。その後、検査装置２６（図１参照）によって柱状部材１２の配列状態を検査し、ローダ／アンローダ４に排出される。柱状部材１２が搭載された半導体基板５は、たとえばリフロー装置に搬送され半導体基板５と柱状部材１２とが接合固定される。次に、柱状部材搭載装置１を用いた柱状部材搭載方法について図１〜図６を参照しながら説明する。 FIG. 4 is a perspective view showing an example of a semiconductor substrate 5 in which a plurality of columnar members 12 are arranged and mounted. As shown in FIG. 4, on the semiconductor substrate 5, columnar members 12 are arranged at predetermined positions on the flux 35, that is, on the electrodes 16. The posture of the columnar member 12 is maintained by the viscosity of the flux 35. After that, the arrangement state of the columnar members 12 is inspected by the inspection device 26 (see FIG. 1), and the column members 12 are discharged to the loader / unloader 4. The semiconductor substrate 5 on which the columnar member 12 is mounted is transported to, for example, a reflow device, and the semiconductor substrate 5 and the columnar member 12 are joined and fixed. Next, a columnar member mounting method using the columnar member mounting device 1 will be described with reference to FIGS. 1 to 6.

（柱状部材搭載方法）
図５は、柱状部材搭載方法の主要工程を示すフローチャート、図６は、フラックス印刷工程を示す説明図である。まず、ステージ９上に半導体基板５をセットする（ステップＳ１）。続いて、半導体基板５の位置を画像認識カメラ（不図示）で認識する（ステップＳ２）。次に、半導体基板５をステージ９に載置した状態でフラックス印刷装置２（図１参照）に搬送する。フラックス印刷装置２において、半導体基板５にフラックス印刷用マスク１５をセットし、半導体基板５とフラックス印刷用マスク１５の位置を合わせる（ステップＳ３）。つまり、半導体基板５の電極１６の位置と、フラックス印刷用マスク１５の開口部４５の位置を合わせる。フラックス印刷用マスク１５は、半導体基板５に密着させた状態でフラックス３５を印刷する（ステップＳ４）。フラックス３５は、開口部４５を有するフラックス印刷用マスク１５と樹脂スキージ４６を用いる、いわゆるスクリーン印刷法によって半導体基板５の電極１６上に印刷塗布される。印刷した後、版離れ（フラックス印刷用マスク１５を半導体基板５から分離すること）に、開口部３５内の一部のフラックス３５が、半導体基板５に転写される。転写されたフラックス３５の厚みは、フラックス３５の粘度、開口部３５の大きさおよび版離れのスピードなどで決まる。フラックス印刷用マスク１５は、ＳＵＳなどの金属製のマスクである（ステンシルマスクと呼ばれる）。フラックス印刷によって、半導体基板５の電極１６上にはフラックス３５が所定の面積および厚みで塗布される。フラックス印刷後に、半導体基板５をステージ９に載置した状態で柱状部材振込装置３に搬送する。 (Column member mounting method)
FIG. 5 is a flowchart showing a main process of the columnar member mounting method, and FIG. 6 is an explanatory diagram showing a flux printing process. First, the semiconductor substrate 5 is set on the stage 9 (step S1). Subsequently, the position of the semiconductor substrate 5 is recognized by an image recognition camera (not shown) (step S2). Next, the semiconductor substrate 5 is transferred to the flux printing apparatus 2 (see FIG. 1) in a state of being placed on the stage 9. In the flux printing apparatus 2, the flux printing mask 15 is set on the semiconductor substrate 5, and the positions of the semiconductor substrate 5 and the flux printing mask 15 are aligned (step S3). That is, the positions of the electrodes 16 of the semiconductor substrate 5 and the positions of the openings 45 of the flux printing mask 15 are aligned. The flux printing mask 15 prints the flux 35 in a state of being in close contact with the semiconductor substrate 5 (step S4). The flux 35 is printed and applied on the electrode 16 of the semiconductor substrate 5 by a so-called screen printing method using a flux printing mask 15 having an opening 45 and a resin squeegee 46. After printing, a part of the flux 35 in the opening 35 is transferred to the semiconductor substrate 5 at the plate release (separating the flux printing mask 15 from the semiconductor substrate 5). The thickness of the transferred flux 35 is determined by the viscosity of the flux 35, the size of the opening 35, the speed of plate release, and the like. The flux printing mask 15 is a metal mask such as SUS (called a stencil mask). By flux printing, the flux 35 is applied on the electrode 16 of the semiconductor substrate 5 with a predetermined area and thickness. After the flux printing, the semiconductor substrate 5 is transferred to the columnar member transfer device 3 in a state of being placed on the stage 9.

柱状部材振込装置３において、半導体基板５上に柱状部材配列用マスク２０をセットし、半導体基板５と柱状部材配列用マスク２０の位置を合わせる（ステップＳ５）。つまり、半導体基板５の電極１６の位置と、柱状部材配列用マスク２０の開口部３４の位置を合わせる。そして、図２に示すように、柱状部材計量装置から一定量の柱状部材１２を柱状部材配列用マスク２０上に供給する（ステップＳ６）。柱状部材配列用マスク２０は、ＳＵＳなどの金属製のマスクである。柱状部材１２は、内側の結束線状部材３２内に供給される。 In the columnar member transfer device 3, the columnar member arrangement mask 20 is set on the semiconductor substrate 5, and the positions of the semiconductor substrate 5 and the columnar member arrangement mask 20 are aligned (step S5). That is, the positions of the electrodes 16 of the semiconductor substrate 5 and the positions of the openings 34 of the columnar member arrangement mask 20 are aligned. Then, as shown in FIG. 2, a fixed amount of the columnar member 12 is supplied onto the columnar member arrangement mask 20 from the columnar member measuring device (step S6). The columnar member arrangement mask 20 is a metal mask such as SUS. The columnar member 12 is supplied into the inner binding linear member 32.

次いで、ブラシスキージ２８を回転しながらＸ軸、Ｙ軸方向に移動させて柱状部材１２を半導体基板５上に落下させ、配列する（ステップＳ７）。柱状部材１２は、内側の結束線状部材３２によって柱状部材配列用マスク２０に設けられた開口部３４内に落下され、フラックス３５の塗布部に達する。この際、柱状部材１２が、内側の結束線状部材３２の外側に出てしまうことがあるが、外側の結束線状部材３３から外側に逸脱することはない。外側の結束線状部材３３は、回転することによって内側の結束線状部材３２の内部に柱状部材１２を戻す機能も有している。柱状部材１２を半導体基板５に配列した（図４参照）後、ステージ９に半導体基板５をセットした状態で検査装置２６に搬送し、柱状部材１２の配列状態を検査する（ステップＳ８）。この検査は、検査装置２６に設けられている画像認識カメラおよび画像処理部（共に図示せず）によって行われる。検査結果は、不図示の制御部に送られる。検査工程が終了したところで、半導体基板５は、ローダ／アンローダ４に排出され、リフロー装置などで、半導体基板５と柱状部材１２とが接合固定される。 Next, the brush squeegee 28 is moved in the X-axis and Y-axis directions while rotating, and the columnar member 12 is dropped onto the semiconductor substrate 5 and arranged (step S7). The columnar member 12 is dropped into the opening 34 provided in the columnar member arrangement mask 20 by the inner binding linear member 32 and reaches the application portion of the flux 35. At this time, the columnar member 12 may come out to the outside of the inner binding linear member 32, but does not deviate to the outside from the outer binding linear member 33. The outer binding linear member 33 also has a function of returning the columnar member 12 to the inside of the inner binding linear member 32 by rotating. After arranging the columnar members 12 on the semiconductor substrate 5 (see FIG. 4), the columnar members 12 are conveyed to the inspection device 26 with the semiconductor substrate 5 set on the stage 9 to inspect the arrangement state of the columnar members 12 (step S8). This inspection is performed by an image recognition camera and an image processing unit (both not shown) provided in the inspection device 26. The inspection result is sent to a control unit (not shown). When the inspection process is completed, the semiconductor substrate 5 is discharged to the loader / unloader 4, and the semiconductor substrate 5 and the columnar member 12 are joined and fixed by a reflow device or the like.

なお、上記実施の形態で説明した柱状部材１２の材質は、銅、銅合金、銅に半田メッキが施されたものを使用することが可能である。また、既述した柱状部材１２は、単純な円柱形状をしているものを例示しているが、用途により様々な形状やサイズのものに応用可能であり、いずれもアスペクト比が大きい。図７に柱状部材１２の円柱以外の形状を有する柱状部材を例にあげ説明する。 As the material of the columnar member 12 described in the above embodiment, copper, a copper alloy, or copper plated with solder can be used. Further, although the columnar member 12 described above exemplifies a member having a simple cylindrical shape, it can be applied to various shapes and sizes depending on the application, and all of them have a large aspect ratio. In FIG. 7, a columnar member having a shape other than the columnar shape of the columnar member 12 will be described as an example.

図７は、柱状部材１２の他の複数例の形状を表した図である。図７（Ａ）に示す柱状部材１２は、円錐形状の本体部を底面１２Ａに平行な面１２Ｂでカットしたような側面視台形形状を有している。図７（Ｂ）に示す柱状部材１２は、長手方向の中央部が括れ部１２Ｃとなる略鼓形状をしたものである。また、図７（Ｃ）に示す柱状部材１２は、６角柱であるが、３角柱、４角柱あるいは５角柱などの多角柱であってもよく限定されない。さらに、図７（Ｄ）に示す柱状部材１２は、円柱の一方の端部に鍔１２Ｄを設けたものである。鍔１２Ｄは、他方側の端部に設けてもよく、両端部に設けるようにしてもよい。また、鍔１２Ｄの平面形状を多角形にしてもよく、図７（Ａ）〜図７（Ｄ）に示す各形状を組み合わせてもよい。図７に示す柱状部材の形状は１例であって、その形状やサイズは、搭載対象部材、使用場所あるいは使用方法によって様々な形状を任意に選択できる。 FIG. 7 is a diagram showing the shapes of other plurality of examples of the columnar member 12. The columnar member 12 shown in FIG. 7A has a side view trapezoidal shape as if a conical main body is cut by a surface 12B parallel to the bottom surface 12A. The columnar member 12 shown in FIG. 7B has a substantially drum shape in which the central portion in the longitudinal direction is the constricted portion 12C. The columnar member 12 shown in FIG. 7C is a hexagonal prism, but is not limited to a polygonal prism such as a triangular prism, a tetragonal prism, or a pentagonal prism. Further, the columnar member 12 shown in FIG. 7 (D) has a collar 12D provided at one end of the columnar. The collar 12D may be provided at the other end, or may be provided at both ends. Further, the planar shape of the collar 12D may be polygonal, and the shapes shown in FIGS. 7 (A) to 7 (D) may be combined. The shape of the columnar member shown in FIG. 7 is an example, and various shapes can be arbitrarily selected for the shape and size depending on the member to be mounted, the place of use, and the method of use.

以上説明した柱状部材搭載装置１は、複数の開口部３４を有し基板である半導体基板５上に配置される柱状部材配列用マスク２０と、柱状部材配列用マスク２０の上方に配置されるブラシスキージ２８とを有し、柱状部材配列用マスク２０上に供給された柱状部材１２をブラシスキージ２８によって開口部３４内に導入し、フラックス３５が塗布された半導体基板５の所定位置に柱状部材１２を配列する。 The columnar member mounting device 1 described above includes a columnar member arrangement mask 20 having a plurality of openings 34 and arranged on the semiconductor substrate 5 which is a substrate, and a brush arranged above the columnar member arrangement mask 20. The columnar member 12 having the squeegee 28 and supplied on the columnar member arranging mask 20 is introduced into the opening 34 by the brush squeegee 28, and the columnar member 12 is placed at a predetermined position on the semiconductor substrate 5 coated with the flux 35. Are arranged.

このように構成される柱状部材搭載装置１は、導体ピンである複数の柱状部材１２を柱状部材配置用マスク２０に設けられた開口部３４に導入することで、柱状部材１２の搭載姿勢を規定しながら半導体基板５への一括搭載が可能となる。しかも、柱状部材１２の仮固定材としてフラックス３５を用いているため位置と姿勢が維持されるため、搭載後にリフローに直結可能であることから高い生産性を実現できる。また、従来の半導体基板５に銅ピラー５２を電界メッキによって形成する方法に比べ、柱状部材１２は機械加工などによって短時間で大量に製造することが可能で、しかも、銅ピラー５２を形成するための専用の装置などを必要とせず、装置コストおよび製造コストを低減できる。さらに、柱状部材１２を形成過程、半導体基板５への搭載過程などにおいて、処理液などが発生しないことから環境に優しい装置、方法ともいえる。 The columnar member mounting device 1 configured in this way defines the mounting posture of the columnar member 12 by introducing a plurality of columnar members 12 which are conductor pins into the opening 34 provided in the mask 20 for arranging the columnar members. At the same time, it can be mounted on the semiconductor substrate 5 all at once. Moreover, since the flux 35 is used as the temporary fixing material for the columnar member 12, the position and posture are maintained, and since it can be directly connected to the reflow after mounting, high productivity can be realized. Further, as compared with the conventional method of forming the copper pillar 52 on the semiconductor substrate 5 by electroplating, the columnar member 12 can be mass-produced in a short time by machining or the like, and moreover, the copper pillar 52 is formed. Equipment costs and manufacturing costs can be reduced without the need for dedicated equipment. Further, it can be said that it is an environment-friendly device and method because no processing liquid or the like is generated in the process of forming the columnar member 12 or the process of mounting it on the semiconductor substrate 5.

また、柱状部材搭載装置１は、基板である半導体基板５への柱状部材１２の配列状態を検査する検査装置２６を有しているので、柱状部材１２の欠損や配列不良などの欠陥を検出でき、搭載品質を高めることができる。 Further, since the columnar member mounting device 1 has an inspection device 26 for inspecting the arrangement state of the columnar members 12 on the semiconductor substrate 5 which is a substrate, defects such as defects and arrangement defects of the columnar members 12 can be detected. , The mounting quality can be improved.

また、ブラシスキージ２８は、取付け部３０に植え込まれた結束線状部材３１を有し、結束線状部材３１を回転しながら移動することによって、柱状部材配列用マスク２０上に供給された柱状部材１２を開口部３４に誘導している。結束線状部材３１は、柔軟性を有するブラシである。したがって、従来技術のように柱状部材１２を振動させる方式に比べ、柱状部材１２に傷をつけたり、柱状部材１２の表面に施された接合材としての半田メッキに傷をつけたりする虞がない。 Further, the brush squeegee 28 has a binding linear member 31 implanted in the mounting portion 30, and the columnar members supplied on the columnar member arranging mask 20 by moving the binding linear member 31 while rotating. The member 12 is guided to the opening 34. The binding linear member 31 is a flexible brush. Therefore, as compared with the method of vibrating the columnar member 12 as in the prior art, there is no possibility of damaging the columnar member 12 or damaging the solder plating as the bonding material applied to the surface of the columnar member 12.

また、ブラシである結束線状部材３１は、ブラシスキージ２８の回転軌跡の径方向に２重に構成されている。つまり、結束線状部材３１は、主として柱状部材１２を開口部３４に誘導する内側の結束線状部材３２と、主として柱状部材１２をブラシスキージ２８外に逸脱させない外側の結束線状部材３３との２重構造を有している。このように、結束線状部材３１を２重構造にすれば、外側の結束線状部材３３からの逸脱による余剰柱状部材の発生や、柱状部材の過少によるミッシング（Ｍｉｓｓｉｎｇ／半導体基板５に搭載される柱状部材１２の数不足）などの不良が無くなり安定した柱状部材１２の搭載が可能になる。 Further, the binding linear member 31 which is a brush is doubly formed in the radial direction of the rotation locus of the brush squeegee 28. That is, the binding linear member 31 is mainly composed of an inner binding linear member 32 that guides the columnar member 12 to the opening 34 and an outer binding linear member 33 that mainly prevents the columnar member 12 from deviating from the brush squeegee 28. It has a double structure. In this way, if the binding linear member 31 has a double structure, excess columnar members are generated due to deviation from the outer binding linear member 33, and missing (mounted on the Missing / semiconductor substrate 5) due to insufficient columnar members. It is possible to stably mount the columnar member 12 by eliminating defects such as (insufficient number of columnar members 12).

また、結束線状部材３１は、導電性を有する柔軟性を備えた細い撚糸の集合体である。このように構成される結束線状部材３１（外側の結束線状部材３２と内側の結束線状部材３３）は、柔軟性を備えた細い撚糸の集合体であることから、柱状部材１２を損傷させることがない。また、結束線状部材３１は、導電性を有しているので静電気による埃など吸着がなく、クリーン度が高い実装を行うことができる。 Further, the binding linear member 31 is an aggregate of thin twisted yarns having conductivity and flexibility. Since the binding linear member 31 (the outer binding linear member 32 and the inner binding linear member 33) configured in this way is an aggregate of thin twisted yarns having flexibility, the columnar member 12 is damaged. I won't let you. Further, since the binding linear member 31 has conductivity, dust and the like due to static electricity are not adsorbed, and mounting with a high degree of cleanliness can be performed.

また、フラックス３５は、基板である半導体基板５の上方に配置され複数の開口部を有するフラックス印刷用マスク１５と、樹脂スキージ４６とによるスクリーン印刷法で塗布される。このようにすれば、フラックス３５を半導体基板５上の正確な位置および正確な量（範囲と厚み）で塗布することができる。フラックス印刷用マスク１５は、ステンシルマスクと呼ばれるメタルマスクであることから、耐久性を有し、フラックス塗布品質を維持できる。 Further, the flux 35 is applied by a screen printing method using a flux printing mask 15 arranged above the semiconductor substrate 5 which is a substrate and having a plurality of openings, and a resin squeegee 46. In this way, the flux 35 can be applied at an accurate position and an accurate amount (range and thickness) on the semiconductor substrate 5. Since the flux printing mask 15 is a metal mask called a stencil mask, it has durability and can maintain the flux coating quality.

また、本実施の形態に係る柱状部材搭載方法は、基板である半導体基板５の上面にフラックス印刷用マスク１５を配置し、半導体基板５の所定位置にフラックス３５を印刷する工程と、フラックス３５が塗布された半導体基板５の上方に柱状部材配列用マスク２０を配置する工程と、柱状部材配列用マスク２０上に柱状部材１２を供給する工程と、柱状部材配列用マスク２０の開口部３４からフラックス３５が塗布された半導体基板５の所定位置に柱状部材１２を導入して配列させる工程と、柱状部材１２の配列状態を検査する工程とを含む。 Further, the columnar member mounting method according to the present embodiment includes a step of arranging a flux printing mask 15 on the upper surface of the semiconductor substrate 5 which is a substrate and printing the flux 35 at a predetermined position of the semiconductor substrate 5, and the flux 35. A step of arranging the columnar member arranging mask 20 above the coated semiconductor substrate 5, a step of supplying the columnar member 12 on the columnar member arranging mask 20, and a flux from the opening 34 of the columnar member arranging mask 20. This includes a step of introducing and arranging the columnar members 12 at predetermined positions of the semiconductor substrate 5 coated with 35, and a step of inspecting the arrangement state of the columnar members 12.

上記の柱状部材搭載方法によれば、導体ピンである複数の柱状部材１２を柱状部材配置用マスク２０に設けられた開口部３４に導入することで、柱状部材１２の搭載姿勢を規定しながら半導体基板５への一括搭載が可能となり、しかも、柱状部材１２の仮固定材としてフラックスを用いているため、搭載後にリフローに直結可能であることから高い生産性を実現できる。半導体基板５への搭載の一連の行程において、処理液などが発生しないことから環境に優しい柱状部材搭載方法を実現できる。 According to the above-mentioned columnar member mounting method, by introducing a plurality of columnar members 12 which are conductor pins into the openings 34 provided in the columnar member arranging mask 20, the semiconductor while defining the mounting posture of the columnar members 12. Since it can be mounted on the substrate 5 all at once and flux is used as a temporary fixing material for the columnar member 12, it can be directly connected to the reflow after mounting, so that high productivity can be realized. Since no processing liquid or the like is generated in a series of steps of mounting on the semiconductor substrate 5, an environment-friendly columnar member mounting method can be realized.

なお、本発明は前述の実施の形態に限定されるものではなく、本発明の目的を達成できる範囲での変形、改良等は本発明に含まれるものである。前述した実施の形態では、半導体基板５に柱状部材１２を植立するように搭載しているが、たとえば、半導体基板５内において、下層の配線と上層の配線とを柱状部材１２によって３次元的に接続することや、回路基板５０において表面電極と裏面電極とを接続する、いわゆるビアの機能を備えることで、高密度実装を可能とする。また、複数層に配置される半導体基板や回路基板を柱状部材によって３次元的に接続することで、高密度な３次元回路素子の製造などに適合可能である。 The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the range in which the object of the present invention can be achieved are included in the present invention. In the above-described embodiment, the columnar member 12 is mounted on the semiconductor substrate 5 so as to be planted. For example, in the semiconductor substrate 5, the lower layer wiring and the upper layer wiring are three-dimensionally mounted by the columnar member 12. High-density mounting is possible by providing a so-called via function of connecting the front electrode and the back electrode on the circuit board 50. Further, by three-dimensionally connecting semiconductor substrates and circuit boards arranged in a plurality of layers with columnar members, it is possible to adapt to the manufacture of high-density three-dimensional circuit elements.

また、前述した柱状部材搭載装置１は、柱状部材１２が半導体基板５と回路基板５０とを接合する導体ピンである場合を例示して説明したがこれに限らず、たとえば、アスペクト比が大きい柱状部材を基板以外の搭載対象物に搭載したり、搭載対象物に設けられた孔に挿入したりする装置にもこの技術思想は応用可能である。 Further, the columnar member mounting device 1 described above has been described by way of example in the case where the columnar member 12 is a conductor pin for joining the semiconductor substrate 5 and the circuit board 50, but the present invention is not limited to this, and for example, a columnar member having a large aspect ratio. This technical idea can also be applied to a device for mounting a member on a mounting object other than a substrate or inserting a member into a hole provided in the mounting target.

１…柱状部材搭載装置
２…フラックス印刷装置
３…柱状部材振込装置
５…半導体基板（基板）
１２…柱状部材
１５…フラックス印刷用マスク
２０…柱状部材配列用マスク
２６…検査装置
２８…ブラシスキージ
３０…取付け部（ブラシスキージ）
３１…結束線状部材
３２…内側の結束線状部材
３３…外側の結束線状部材
３４…開口部（柱状部材配列用マスク）
３５…フラックス
４０…誘導口部（開口部）
４１…位置規定孔部（開口部）
４６…樹脂スキージ 1 ... Columnar member mounting device 2 ... Flux printing device 3 ... Columnar member transfer device 5 ... Semiconductor substrate (board)
12 ... Columnar member 15 ... Flux printing mask 20 ... Columnar member arrangement mask 26 ... Inspection device 28 ... Brush squeegee 30 ... Mounting part (brush squeegee)
31 ... Bundling linear member 32 ... Inner binding linear member 33 ... Outer binding linear member 34 ... Opening (mask for columnar member arrangement)
35 ... Flux 40 ... Induction port (opening)
41 ... Positioning hole (opening)
46 ... Resin squeegee

Claims (6)

基板の所定位置に柱状部材を配列させる柱状部材搭載装置であって、
複数の開口部を有し前記基板上に配置される柱状部材配列用マスクと、
前記柱状部材配列用マスクの上方に配置されるブラシスキージと、
を有し、
前記柱状部材配列用マスク上に供給された前記柱状部材を前記ブラシスキージによって前記開口部内に導入し、フラックスが塗布された前記基板の所定位置に前記柱状部材を配列し、
前記ブラシスキージは、取付け部に植え込まれた結束線状部材を有し、
前記結束線状部材は、前記柱状部材を前記柱状部材配列用マスクの開口部に導入する機能を有する内側結束線状部材と、前記柱状部材を前記ブラシスキージの外側に逸脱させない機能を有する外側結束線状部材とで構成され、
前記結束線状部材を回転しながら移動することによって、前記柱状部材配列用マスク上に供給された前記柱状部材を前記開口部に誘導する、
ことを特徴とする柱状部材搭載装置。 A columnar member mounting device that arranges columnar members at predetermined positions on a substrate.
A mask for arranging columnar members having a plurality of openings and arranged on the substrate,
A brush squeegee arranged above the columnar member arrangement mask and
Have,
The columnar member supplied on the columnar member arranging mask is introduced into the opening by the brush squeegee, and the columnar member is arranged at a predetermined position on the substrate to which flux is applied.
The brush squeegee has a binding linear member implanted in the mounting portion.
The binding linear member includes an inner binding linear member having a function of introducing the columnar member into the opening of the mask for arranging the columnar member, and an outer binding having a function of preventing the columnar member from deviating to the outside of the brush squeegee. Consists of linear members
By moving the binding linear member while rotating, the columnar member supplied on the columnar member arrangement mask is guided to the opening.
A columnar member mounting device characterized by this. 請求項１に記載の柱状部材搭載装置において、
前記基板への前記柱状部材の配列状態を検査する検査装置を有する、
ことを特徴とする柱状部材搭載装置。 In the columnar member mounting device according to claim 1,
It has an inspection device for inspecting the arrangement state of the columnar members on the substrate.
A columnar member mounting device characterized by this. 請求項１に記載の柱状部材搭載装置において、
前記結束線状部材は、前記ブラシスキージの回転軌跡の径方向に２重に構成されている、
ことを特徴とする柱状部材搭載装置。 In the columnar member mounting device according to claim 1,
The binding linear member is doubly formed in the radial direction of the rotation locus of the brush squeegee.
A columnar member mounting device characterized by this. 請求項３に記載の柱状部材搭載装置において、
前記結束線状部材は、導電性を有する柔軟性を備えた細い撚糸の集合体である、
ことを特徴とする柱状部材搭載装置。 In the columnar member mounting device according to claim 3,
The binding linear member is an aggregate of thin twisted yarns having conductivity and flexibility.
A columnar member mounting device characterized by this. 請求項１に記載の柱状部材搭載装置において、
前記フラックスは、前記基板の上方に配置され複数の開口部を有するフラックス印刷用マスクと、樹脂スキージとによるスクリーン印刷法で塗布される、
ことを特徴とする柱状部材搭載装置。 In the columnar member mounting device according to claim 1,
The flux is applied by a screen printing method using a flux printing mask arranged above the substrate and having a plurality of openings and a resin squeegee.
A columnar member mounting device characterized by this. 基板の所定位置に柱状部材を搭載する方法であって、
前記基板の上面にフラックス印刷用マスクを配置し、前記基板上の所定位置にフラックスを印刷する工程と、
前記フラックスが塗布された前記基板の上方に、開口部を有する柱状部材配列用マスクを配置する工程と、
前記柱状部材配列用マスク上に前記柱状部材を供給する工程と、
前記柱状部材配列用マスク上に供給された前記柱状部材を、前記柱状部材配列用マスクの上方に配置され、取付け部に植え込まれた結束線状部材を有するブラシスキージによって前記開口部内に導入する工程と、
前記柱状部材配列用マスクの開口部から前記フラックスが塗布された前記基板の所定位置に前記柱状部材を配列させる工程と、
前記柱状部材の配列状態を検査する工程とを含み、
前記結束線状部材は、前記柱状部材を前記柱状部材配列用マスクの開口部に導入する機能を有する内側結束線状部材と、前記柱状部材を前記ブラシスキージの外側に逸脱させない機能を有する外側結束線状部材とで構成されている、
ことを特徴とする柱状部材搭載方法。 This is a method of mounting a columnar member at a predetermined position on a substrate.
A step of arranging a flux printing mask on the upper surface of the substrate and printing the flux at a predetermined position on the substrate.
A step of arranging a mask for arranging columnar members having an opening above the substrate coated with the flux, and
A step of supplying the columnar member on the columnar member arrangement mask and
The columnar member supplied on the columnar member arrangement mask is introduced into the opening by a brush squeegee having a binding linear member arranged above the columnar member arrangement mask and implanted in the mounting portion. Process and
A step of arranging the columnar members at a predetermined position on the substrate to which the flux is applied from the opening of the columnar member arranging mask.
Including the step of inspecting the arrangement state of the columnar members.
The binding linear member includes an inner binding linear member having a function of introducing the columnar member into the opening of the mask for arranging the columnar member, and an outer binding having a function of preventing the columnar member from deviating to the outside of the brush squeegee. It is composed of linear members,
A method of mounting a columnar member, which is characterized in that.
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