JP6761215B2 - Optical elements, etalons, and diffraction gratings, and methods for manufacturing optical elements - Google Patents

Optical elements, etalons, and diffraction gratings, and methods for manufacturing optical elements Download PDF

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JP6761215B2
JP6761215B2 JP2015174187A JP2015174187A JP6761215B2 JP 6761215 B2 JP6761215 B2 JP 6761215B2 JP 2015174187 A JP2015174187 A JP 2015174187A JP 2015174187 A JP2015174187 A JP 2015174187A JP 6761215 B2 JP6761215 B2 JP 6761215B2
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海老塚　昇
昇 海老塚
山形　豊
豊 山形
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RIKEN Institute of Physical and Chemical Research
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本発明は、光学素子およびその製造方法に関連し、特に、複数のミラー膜が所定の面間隔で形成されたＱｕａｓｉ−Ｂｒａｇｇ回折格子やエタロン（ファブリ・ペロー干渉計）などの光学素子およびその製造方法に関連する。 The present invention relates to an optical element and a method for manufacturing the same, and in particular, an optical element such as a Quasi-Bragg diffraction grating or an etalon (Fabry-Perot interferometer) in which a plurality of mirror films are formed at predetermined surface intervals and the production thereof. Related to the method.

従来より、各種計測装置、波長可変レーザーや極短パルスレーザーの共振器に回折格子が用いられているが、こうした回折格子として、例えば、特許文献１（国際公開第２００４／１１１６９３号パンフレット）に開示されている本願発明者により発明された回折格子がある。この回折格子は、Ｑｕａｓｉ−Ｂｒａｇｇ（ＱＢ）回折格子と称される。なお、Ｑｕａｓｉ−は「類似、半、準、疑似」を意味する接頭語であり、Ｑｕａｓｉ−Ｂｒａｇｇ回折格子に入射した光束が、周期的に屈折率が変化するブラッグ回折格子に入射したように振る舞うことから命名された。 Conventionally, a diffraction grating has been used for various measuring devices, a resonator of a tunable laser and an ultra-short pulse laser, and as such a diffraction grating, for example, it is disclosed in Patent Document 1 (International Publication No. 2004/111693 pamphlet). There is a diffraction grating invented by the inventor of the present application. This diffraction grating is called a Quasi-Bragg (QB) diffraction grating. In addition, Quasi- is a prefix meaning "similar, semi-, quasi-, pseudo", and the light beam incident on the Quasi-Bragg diffraction grating behaves as if it were incident on the Bragg diffraction grating whose refractive index changes periodically. It was named after that.

ここで、図７（ａ）には、特許文献１に開示された回折格子の概念構成説明図が示されており、図７（ｂ）には、図７（ａ）のＡ−Ａ線における断面図が示されている。 Here, FIG. 7A shows a conceptual configuration explanatory diagram of the diffraction grating disclosed in Patent Document 1, and FIG. 7B shows the line AA in FIG. 7A. A cross section is shown.

この回折格子１０は、全体が板状体に形成されており、略矩形形状の回折格子に光束が入射する面１０ａと、回折格子に光束が入射する面１０ａと対向する略矩形形状の回折格子出射面１０ｂと、回折格子に光束が入射する面１０ａと回折格子出射面１０ｂとの間に形成された複数の反射面１０ｃとを有して構成されている。 The entire diffraction grating 10 is formed into a plate-like body, and the substantially rectangular diffraction grating facing the surface 10a on which the light beam is incident on the substantially rectangular diffraction grating and the surface 10a on which the light beam is incident on the diffraction grating It is configured to have an emission surface 10b, a plurality of reflection surfaces 10c formed between a surface 10a on which a light beam is incident on the diffraction grating, and a diffraction grating emission surface 10b.

そして、回折格子１０は、透過型の回折格子であり平面回折格子として設計されている。 The diffraction grating 10 is a transmission type diffraction grating and is designed as a planar diffraction grating.

より詳細には、図７（ａ）（ｂ）に示す座標系を参照して説明すると、回折格子に光束が入射する面１０ａと回折格子出射面１０ｂとはそれぞれ、Ｚ軸方向の異なる高さに位置するＸＹ平面に沿って延長された平面に略一致し、回折格子に光束が入射する面１０ａと回折格子出射面１０ｂとは互いに所定の間隔を有し略平行して対向している。 More specifically, to explain with reference to the coordinate system shown in FIGS. 7A and 7B, the surface 10a on which the light beam is incident on the diffraction grating and the diffraction grating exit surface 10b have different heights in the Z-axis direction, respectively. The surface 10a on which the light beam is incident on the diffraction grating and the emission surface 10b of the diffraction grating are opposed to each other with a predetermined interval so as to substantially coincide with the plane extended along the XY plane located at.

一方、反射面１０ｃは、Ｘ軸方向における所定の間隔毎に形成されており、Ｚ軸方向に沿って延長された平面に略一致するとともに、回折格子に光束が入射する面１０ａならびに回折格子出射面１０ｂのＹ軸方向における全長にわたって延長されている。つまり、反射面１０ｃの延長方向は、回折格子に光束が入射する面１０ａならびに回折格子出射面１０ｂの延長方向と略直交している。従って、回折格子１０は、回折格子に光束が入射する面１０ａならびに回折格子出射面１０ｂに対して略垂直に等間隔で形成された複数の反射面１０ｃを備えているものである。 On the other hand, the reflecting surface 10c is formed at predetermined intervals in the X-axis direction, substantially coincides with a plane extended along the Z-axis direction, and the surface 10a on which the light beam is incident on the diffraction grating and the diffraction grating exit. The surface 10b is extended over the entire length in the Y-axis direction. That is, the extension direction of the reflection surface 10c is substantially orthogonal to the extension direction of the surface 10a on which the light flux is incident on the diffraction grating and the diffraction grating emission surface 10b. Therefore, the diffraction grating 10 includes a surface 10a on which a light beam is incident on the diffraction grating and a plurality of reflection surfaces 10c formed at equal intervals substantially perpendicular to the diffraction grating exit surface 10b.

以上の構成において、この回折格子１０においては、回折格子１０の回折格子に光束が入射する面１０ａから光が入射され、回折格子１０内に入射された光は回折格子１０内を通過して、回折格子出射面１０ｂから出射される。 In the above configuration, in the diffraction grating 10, light is incident from the surface 10a on which the light beam is incident on the diffraction grating of the diffraction grating 10, and the light incident on the diffraction grating 10 passes through the diffraction grating 10. It is emitted from the diffraction grating exit surface 10b.

そして、図８（ａ）に示すように、回折格子１０の屈折率を「ｎ２」とし、回折次数を「ｍ」とし、波長を「λ」とし、格子間隔を「ｄ」とし、回折格子に光束が入射する面１０ａからの入射光、即ち、反射面１０ｃに入射する光と反射面１０ｃとにより形成される角を「θ２」とすると、回折格子１０については、下記に示す式（１）の関係が成り立つことになる。
ｍλ＝２ｎ２ｄｓｉｎθ２ ・・・式（１） Then, as shown in FIG. 8A, the refractive index of the diffraction grating 10 is "n 2 ", the diffraction order is "m", the wavelength is "λ", the lattice spacing is "d", and the diffraction grating is used. Assuming that the incident light from the surface 10a on which the light beam is incident, that is, the angle formed by the light incident on the reflecting surface 10c and the reflecting surface 10c is “θ 2 ”, the diffraction grating 10 is described by the following equation ( The relationship of 1) will be established.
mλ = 2n 2 dsinθ 2 ... Equation (1)

この際、反射面１０ｃに入射する光と反射面１０ｃとにより形成される角θ２の大きさは、反射面１０ｃによって反射された光と反射面１０ｃとにより形成される角の大きさと一致するものである。また、格子間隔ｄは、従来の回折格子においては、回折格子に形成された溝の間隔を示すものであるが、回折格子１０においては、溝は形成されていないので、回折格子１０に形成された反射面１０ｃの間隔を示すものである。 At this time, the size of the angle θ 2 formed by the light incident on the reflecting surface 10c and the reflecting surface 10c coincides with the size of the angle formed by the light reflected by the reflecting surface 10c and the reflecting surface 10c. It is a thing. Further, the lattice spacing d indicates the spacing of the grooves formed in the diffraction grating in the conventional diffraction grating, but since the grooves are not formed in the diffraction grating 10, it is formed in the diffraction grating 10. It shows the distance between the reflecting surfaces 10c.

ここで、式（１）は、ブラッグ回折の式と同じ式で表されており、θ２はブラッグ角に対応する。 Here, the equation (1) is expressed by the same equation as the Bragg diffraction equation, and θ 2 corresponds to the Bragg angle.

そして、反射面１０ｃの厚み（反射面１０ｃの図８（ａ）に示す座標系のＸ軸方向に沿った長さ）を「ｗ」とし、反射面１０ｃの高さ（反射面１０ｃの図８（ａ）に示す座標系のＺ軸方向に沿った長さ）を「ｔ」とすると、
ｔａｎθ２＝（ｄ−ｗ）／ｔ ・・・式（２）
の条件を満たす場合には、図８（ｂ）に示すように、回折格子に光束が入射する面１０ａから入射して回折格子１０を通過する光束のほとんどが、反射面１０ｃにより１回反射されて回折に寄与し、回折光として利用することができるので、回折効率が最も高くなる。 Then, the thickness of the reflecting surface 10c (the length of the reflecting surface 10c along the X-axis direction of the coordinate system shown in FIG. 8A) is defined as "w", and the height of the reflecting surface 10c (FIG. 8 of the reflecting surface 10c). Let "t" be the length of the coordinate system shown in (a) along the Z-axis direction).
tan θ 2 = (d−w) / t ・ ・ ・ Equation (2)
When the condition of the above is satisfied, as shown in FIG. 8B, most of the light beam incident from the surface 10a on which the light beam is incident on the diffraction grating and passing through the diffraction grating 10 is reflected once by the reflecting surface 10c. It contributes to diffraction and can be used as diffracted light, so that the diffraction efficiency is the highest.

一方、上記した式（２）の条件を満たさない場合、即ち、ｔａｎθ２＞（ｄ−ｗ）／ｔの場合や、ｔａｎθ２＜（ｄ−ｗ）／ｔの場合には、入射光が回折光に寄与する方向以外にも分配されるために、回折効率が低下する。 On the other hand, when the condition of the above equation (2) is not satisfied, that is, when tanθ 2 > (dw) / t or when tanθ 2 <(dw) / t, the incident light is diffracted. Diffraction efficiency is reduced because it is distributed in directions other than those that contribute to light.

なお、反射面１０ｃの厚さｗは反射面の間隔ｄと比較して十分薄くすることもできる。たとえば、反射面１０ｃを基板表面に設けた金属膜によって構成する場合には反射面１０ｃの厚さｗが数十ｎｍ〜数百ｎｍ程度、反射面間隔ｄが数百μｍ〜数ｍｍとしてもよい。この場合、厚さｗは間隔ｄと比べて無視できるので、上記式（１）〜（３）におけるｄ−ｗはｄで近似してもよい。 The thickness w of the reflecting surface 10c can be made sufficiently thinner than the distance d between the reflecting surfaces. For example, when the reflecting surface 10c is composed of a metal film provided on the substrate surface, the thickness w of the reflecting surface 10c may be about several tens nm to several hundred nm, and the reflecting surface spacing d may be several hundred μm to several mm. .. In this case, since the thickness w can be ignored as compared with the interval d, d-w in the above equations (1) to (3) may be approximated by d.

このような回折格子１０の外部から回折格子に光束が入射する面１０ａに光束を入射すると、入射光束は反射面１０ｃにより反射し、波長λと格子間隔ｄとで規定される回折分布で広がる。 When a luminous flux is incident on the surface 10a on which the luminous flux is incident on the diffraction grating from the outside of such a diffraction grating 10, the incident luminous flux is reflected by the reflecting surface 10c and spreads in a diffraction distribution defined by the wavelength λ and the lattice spacing d.

特に、高次回折光を利用する場合には、反射面１０ｃに対して正反射の方向に干渉の条件を満足する各次数の波長の光束に対して、最も高い回折効率を有し、その最も高い回折効率の波長の前後の波長の光束は、隣り合う反射面の間を開口とする光束の回折強度分布に比例した効率を示す。 In particular, when high-order diffracted light is used, it has the highest diffraction efficiency and the highest diffraction efficiency for light beams of wavelengths of each order that satisfy the conditions of interference in the direction of specular reflection with respect to the reflecting surface 10c. The light beam having a wavelength before and after the diffraction efficiency wavelength shows an efficiency proportional to the diffraction intensity distribution of the light beam having an opening between adjacent reflecting surfaces.

従って、上記した回折格子１０によれば、高分散で高い回折効率を実現することができ、高次回折光のような高い次数であっても回折効率を高くすることができる。 Therefore, according to the above-mentioned diffraction grating 10, it is possible to realize high diffraction efficiency with high dispersion, and it is possible to increase the diffraction efficiency even at a high order such as high-order diffracted light.

特許文献１は、このような回折格子１０の製造方法として半導体製造プロセスと同様の手法による製造方法を開示する。特許文献１の製造方法は製造コストが比較的高い方法である。これに対して、特許文献２（特開２００７−２６４１０９号公報）はより簡便な製造方法を開示する。特許文献２に記載された回折格子１０の製造方法について図９、図１０を参照して説明する。 Patent Document 1 discloses a manufacturing method of such a diffraction grating 10 by a method similar to that of the semiconductor manufacturing process. The manufacturing method of Patent Document 1 is a method having a relatively high manufacturing cost. On the other hand, Patent Document 2 (Japanese Unexamined Patent Publication No. 2007-264109) discloses a simpler manufacturing method. The method for manufacturing the diffraction grating 10 described in Patent Document 2 will be described with reference to FIGS. 9 and 10.

まず、基板１０００の一方の面に、反射面１０ｃを構成するミラー膜１００２を形成したミラー膜付基板１００４を複数枚準備する（図９（ａ）参照）。基板１０００は、誘電体材料あるいは半導体により形成されており、回折格子１０全体の大きさや格子間隔ｄ、
反射面１０ｃの高さｔなどに応じて寸法設定されている。基板１０００を形成する誘電体材料としては、例えば、石英、ＢＫ−７などのガラス素材、ＰＭＭＡやポリイミドなどの樹脂、水晶やフッ化マグネシウムなどの結晶材料、一方、半導体材料としてはシリコン、ゲルマニウム、ガリウム砒素（ＧａＡｓ）、カドミウム・テルル（ＣｄＴｅ）などの各種結晶材料を用いることができる。ミラー膜１００２の材料としては、例えば、アルミニウム、金、銀などを用いることができる。ミラー膜１００２は、スパッタリング法などによって所定の厚さに形成すればよい。 First, a plurality of substrates 1004 with a mirror film having a mirror film 1002 forming a reflecting surface 10c formed on one surface of the substrate 1000 are prepared (see FIG. 9A). The substrate 1000 is made of a dielectric material or a semiconductor, and the size of the entire diffraction grating 10 and the lattice spacing d,
The dimensions are set according to the height t of the reflective surface 10c and the like. Examples of the dielectric material forming the substrate 1000 include glass materials such as quartz and BK-7, resins such as PMMA and polyimide, and crystal materials such as crystal and magnesium fluoride, while semiconductor materials include silicon and germanium. Various crystalline materials such as gallium arsenide (GaAs) and cadmium telluride (CdTe) can be used. As the material of the mirror film 1002, for example, aluminum, gold, silver and the like can be used. The mirror film 1002 may be formed to a predetermined thickness by a sputtering method or the like.

次に図１０に示すように、対向する一方のミラー膜付基板１００４と他方のミラー膜付基板１００４との間に接着剤１１００を塗布しながら、多数のミラー膜付基板１００４を積層して接着し、ミラー膜付基板積層ブロック１００６を形成する（図９（ｂ）参照）。ここで、接着層の厚さが一定となるように、接着剤１１００には、所定の直径Ｄに調製されたビーズ（小球体）１１０２が混入されている。ビーズ１１０２は、たとえば、誘電体材料、具体的には、石英系などのガラス素材、ＰＭＭＡやポリイミドなどの樹脂などを用いることができる。 Next, as shown in FIG. 10, a large number of mirror film-attached substrates 1004 are laminated and bonded while applying the adhesive 1100 between one mirror film-attached substrate 1004 and the other mirror film-attached substrate 1004. Then, a substrate laminated block 1006 with a mirror film is formed (see FIG. 9B). Here, beads (small spheres) 1102 prepared to have a predetermined diameter D are mixed in the adhesive 1100 so that the thickness of the adhesive layer is constant. For the beads 1102, for example, a dielectric material, specifically, a glass material such as quartz, a resin such as PMMA or polyimide, or the like can be used.

このようにして形成されたミラー膜付基板積層ブロック１００６を、切断・研磨して所望の大きさにすることで、回折格子１０が得られる。 The diffraction grating 10 can be obtained by cutting and polishing the substrate laminated block 1006 with a mirror film thus formed to a desired size.

国際公開第２００４／１１１６９３号パンフレットInternational Publication No. 2004/111693 Pamphlet 特開２００７−２６４１０９号公報JP-A-2007-264109 特開２００７−１６４０１３号公報Japanese Unexamined Patent Publication No. 2007-164013 特開２００９−０６３７５４号公報JP-A-2009-063754

回折格子は、格子の周期誤差による位相誤差が１／８波長（ｒｍｓ）以下であれば実用的であり、理想的には位相誤差が１／２０波長（ｒｍｓ）以下であることが望ましい。たとえば、波長４００ｎｍよりも長波長の可視光用の回折格子として実用に供するためには格子周期誤差が５０ｎｍ（ｒｍｓ）以下である必要があり、理想的には格子周期誤差が２０ｎｍ（ｒｍｓ）以下であることが望ましい。 The diffraction grating is practical if the phase error due to the periodic error of the grating is 1/8 wavelength (rms) or less, and ideally, the phase error is preferably 1/20 wavelength (rms) or less. For example, in order to put it into practical use as a diffraction grating for visible light having a wavelength longer than 400 nm, the lattice period error needs to be 50 nm (rms) or less, and ideally the lattice period error is 20 nm (rms) or less. Is desirable.

特許文献２に記載の製造方法は簡易であるが、格子周期の精度は、接着層のスペーサーとして用いるビーズ（小球体）の直径の精度によって支配される。ビーズの製造誤差が、基板の製造誤差よりも大きいためである。一般的なビーズの直径誤差は１００ｎｍ程度のため、特許文献２に記載の製造方法によって製造される回折格子は可視光用回折格子としては機能しない。 Although the manufacturing method described in Patent Document 2 is simple, the accuracy of the lattice period is governed by the accuracy of the diameter of the beads (small spheres) used as the spacer of the adhesive layer. This is because the manufacturing error of the beads is larger than the manufacturing error of the substrate. Since a general bead diameter error is about 100 nm, the diffraction grating manufactured by the manufacturing method described in Patent Document 2 does not function as a visible light diffraction grating.

なお、上記では多数のミラー膜を有する回折格子を例に挙げて説明したが、エタロンも２枚の部分透過の高反射面（部分透過ミラー膜）の間隔を高精度に作る必要がある。エタロンを製造するためには、従来は、クリーン度の高い環境でオプティカルコンタクト（光学密着）によって接合したり（エアギャップエタロンの場合）、基板両面に多層膜コーティングを施したり（ソリッドエタロンの場合）して製造しており、熟練を要し歩留まりが悪く製造コストが高いという問題がある。 In the above description, a diffraction grating having a large number of mirror films has been described as an example, but it is also necessary to make the distance between the two partially transmissive high reflection surfaces (partially transmissive mirror films) with high accuracy for Etalon. Conventionally, in order to manufacture etalon, bonding is performed by optical contact (optical adhesion) in a highly clean environment (in the case of air gap etalon), or multilayer coating is applied to both sides of the substrate (in the case of solid etalon). There is a problem that skill is required, the yield is poor, and the manufacturing cost is high.

このような問題を考慮して、本発明は、複数のミラー膜が所定の面間隔で略平行に形成された光学素子の精度の高い製造方法を提供することを目的とする。 In consideration of such a problem, an object of the present invention is to provide a highly accurate manufacturing method of an optical element in which a plurality of mirror films are formed substantially parallel to each other at predetermined surface intervals.

本発明の第１の態様は、複数のミラー膜が所定の面間隔で平行に形成された光学素子の製造方法である。このような光学素子の例として、多数のミラー膜が平行に形成された回折格子や、２つのミラー膜が平行に形成されたエタロンが挙げられる。 A first aspect of the present invention is a method for manufacturing an optical element in which a plurality of mirror films are formed in parallel at predetermined surface intervals. Examples of such an optical element include a diffraction grating in which a large number of mirror films are formed in parallel, and an etalon in which two mirror films are formed in parallel.

本態様に係る製造方法は、平行平面基板の一方あるいは両方の表面を部分的に除去して複数の微小突起（エンボスとも称する）を設けてエンボス付基板を用意し、ミラー膜の間に前記エンボス付基板を介在させて複数のミラー膜を積層させる、ことを特徴とする。 In the manufacturing method according to this aspect, one or both surfaces of a parallel flat substrate are partially removed to provide a plurality of microprojections (also referred to as embossing) to prepare an embossed substrate, and the embossing is performed between the mirror films. It is characterized in that a plurality of mirror films are laminated with an attached substrate interposed therebetween.

なお、平行平面基板とは、上面と下面とが平行な平面であればその形状は特に限定されず、矩形や円形であってよく、また、リング形状のような貫通穴を有してもよい。 The shape of the parallel flat substrate is not particularly limited as long as the upper surface and the lower surface are parallel to each other, and may be rectangular or circular, and may have a through hole such as a ring shape. ..

複数の微小突起を設ける方法としては、基板の表面を部分的に除去できる手法であれば任意の手法が採用可能であり、例えば、ウェットエッチング、ドライエッチング（反応性プラズマエッチング、イオンミリング）、サンドブラスト、切削加工などを採用可能である。 As a method for providing a plurality of microprojections, any method can be adopted as long as the surface of the substrate can be partially removed. For example, wet etching, dry etching (reactive plasma etching, ion milling), sandblasting can be adopted. , Cutting, etc. can be adopted.

このように、平行平面基板の表面を部分的に除去して複数の微小突起を設けるので、複数の微小突起の頂部は除去加工前の平行平面基板の表面と等しい同一平面内に位置する。したがって、一方の面のみに複数の微小突起が設けられている場合は、一方の面の複数の微小突起の頂部を含む平面と微小突起が設けられていない他方の面とが所定の面間隔で平行であり、両方の面に複数の微小突起が設けられている場合には、一方の面の複数の微小突起の頂部を含む平面と他方の面の複数の微小突起の頂部を含む平面が所定の面間隔で平行であるようにできる。すなわちエンボス付基板の厚さおよび平行度を、平行平面基板の厚さおよび平行度と同じ精度で作ることができる。したがって、当該エンボス付基板を介在させて複数のミラー膜を積層させて作った光学素子における複数のミラー膜の間の間隔と平行度を極めて精度良くすることができる。 In this way, since the surface of the parallel plane substrate is partially removed to provide the plurality of microprojections, the tops of the plurality of microprojections are located in the same plane as the surface of the parallel plane substrate before the removal process. Therefore, when a plurality of microprojections are provided on only one surface, a plane including the tops of the plurality of microprojections on one surface and the other surface on which the microprojections are not provided are spaced apart from each other. When it is parallel and a plurality of microprojections are provided on both surfaces, a plane containing the tops of the plurality of microprojections on one surface and a plane including the tops of the plurality of microprojections on the other surface are predetermined. Can be made parallel at the plane spacing of. That is, the thickness and parallelism of the embossed substrate can be made with the same accuracy as the thickness and parallelism of the parallel plane substrate. Therefore, the distance and parallelism between the plurality of mirror films in the optical element formed by laminating the plurality of mirror films with the embossed substrate interposed therebetween can be made extremely accurate.

また、基板を積層する際に基板間に異物（塵芥等）が混入しても、この異物は基板表面と微小突起の頂部との間に挟まれるよりも、エッチング加工などによりできた空間に位置する確率が高いので、異物によって基板が押し上げられてしまうことを抑制できる。このような理由からも、ミラー膜の間の間隔と平行度を精度良く製造することができる。 In addition, even if foreign matter (dust, etc.) is mixed between the substrates when laminating the substrates, the foreign matter is located in the space created by etching rather than being sandwiched between the substrate surface and the top of the microprojections. Since there is a high probability of this, it is possible to prevent the substrate from being pushed up by foreign matter. For this reason as well, the spacing and parallelism between the mirror films can be manufactured with high accuracy.

本態様に係る製造方法の第１の例は、基板の一方の面に複数の微小突起が設けられ他方の面にミラー膜が設けられた基板（エンボスおよびミラー膜付基板）を複数用意する工程と、このエンボスおよびミラー膜付基板を積層する工程とを含むことができる。基板を用意する工程は、より具体的には、平行平面基板の一方の表面を部分的に除去して複数の微小突起を設ける工程と、前記平行平面基板の他方の面にスパッタリング法によりミラー膜を設ける工程と、を含むことができる。また、基板を積層する工程は、前記エンボスおよびミラー膜付基板を、複数の微小突起が設けられた面とミラー膜が設けられた面とが接触するように積層する工程と、を含むことができる。 The first example of the manufacturing method according to this aspect is a step of preparing a plurality of substrates (embossed and mirror film-attached substrates) in which a plurality of microprojections are provided on one surface of the substrate and a mirror film is provided on the other surface. And the step of laminating the embossed substrate and the substrate with the mirror film can be included. More specifically, the steps of preparing the substrate include a step of partially removing one surface of the parallel plane substrate to provide a plurality of microprojections, and a mirror film on the other surface of the parallel plane substrate by a sputtering method. And the steps of providing. Further, the step of laminating the substrate may include a step of laminating the embossed and mirror film-attached substrate so that the surface provided with the plurality of microprojections and the surface provided with the mirror film are in contact with each other. it can.

このような製造方法によれば、複数とくに３つ以上のミラー膜が平行に形成された光学素子を容易かつ精度良く製造することができる。このような光学素子には回折格子が含まれる。 According to such a manufacturing method, it is possible to easily and accurately manufacture an optical element in which a plurality of mirror films, particularly three or more mirror films, are formed in parallel. Such an optical element includes a diffraction grating.

本態様において、前記エンボスおよびミラー膜付基板を複数用意する工程は、エンボスおよびミラー膜が設けられた前記平行平面基板を複数に切断する工程を含むことができる。 In this embodiment, the step of preparing a plurality of the embossed and mirror film-attached substrates can include a step of cutting the parallel plane substrate provided with the embossed and mirror films into a plurality of pieces.

このように平行平面基板にミラー膜と複数の微小突起とを設けた後に切断することで、厚さが均一なエンボスおよびミラー膜付基板を簡単に用意することができる。 By providing the mirror film and the plurality of microprojections on the parallel flat substrate and then cutting the substrate in this way, it is possible to easily prepare an embossed substrate having a uniform thickness and a substrate with a mirror film.

なお、厚さが均一の複数の平行平面基板に対して、スパッタリングとエッチング加工によりミラー膜と複数の微小突起を設けてもよい。このようにしても、厚さが均一なエンボスおよびミラー膜付基板を複数用意できる。厚さが均一の複数の平行平面基板は、同一バッチで研磨処理を行うことで得ることができる。 A mirror film and a plurality of microprojections may be provided on a plurality of parallel plane substrates having a uniform thickness by sputtering and etching. Even in this way, a plurality of substrates with embossing and a mirror film having a uniform thickness can be prepared. A plurality of parallel flat substrates having a uniform thickness can be obtained by performing polishing treatment in the same batch.

本態様における前記積層する工程は、前記エンボスおよびミラー膜付基板の表面に接着剤を塗布する工程と、接着剤が塗布された複数の前記エンボスおよびミラー膜付基板を積層する工程と、前記エンボスおよびミラー膜付基板に対して荷重をかける工程と、を含むことができる。また、当該接着剤として紫外線硬化接着剤を用いる場合には、基板に対して荷重をかけた状態で紫外線を露光する工程をさらに含むとよい。 The laminating step in this embodiment includes a step of applying an adhesive to the surface of the embossed and mirror film-coated substrate, a step of laminating a plurality of the embossed and mirror film-coated substrates to which the adhesive is applied, and the embossing. And the step of applying a load to the substrate with the mirror film can be included. Further, when an ultraviolet curable adhesive is used as the adhesive, it is preferable to further include a step of exposing ultraviolet rays while applying a load to the substrate.

基板に対して荷重をかけることで、余分な接着剤を除去して、基板と基板の間の接着剤を原子数層のレベルまで薄くすることができる。また、基板の間に複数の微小突起の高さよりも大きな異物が混入した場合であっても、異物を押しつぶしてエッチング加工によりできた空間内に収めて、基板の押し上げを抑制できる。 By applying a load to the substrate, excess adhesive can be removed and the adhesive between the substrates can be thinned to the level of several layers of atoms. Further, even when a foreign substance larger than the height of a plurality of minute protrusions is mixed between the substrates, the foreign matter can be crushed and stored in the space created by the etching process to suppress the pushing up of the substrate.

本態様に係る製造方法の第２の例は、平行平面基板の一方の面の表面を部分的に除去して複数の微小突起を設ける工程と、前記平行平面基板の他方の面に誘電体または金属の部分透過ミラー膜を設ける工程と、を含む、第１基板を用意する工程と、基板の一方の面の一部に誘電体または金属の部分透過ミラー膜を設けて、第２基板を用意する工程と、前記第１基板と前記第２基板とを、前記第1基板の複数の微小突起の頂部が前記第２基板の表
面と接触するように接合する工程と、を含むことができる。 A second example of the manufacturing method according to this embodiment includes a step of partially removing the surface of one surface of the parallel surface substrate to provide a plurality of microprojections, and a dielectric or a dielectric or a dielectric material on the other surface of the parallel surface substrate. A step of preparing a first substrate including a step of providing a partially transparent mirror film of metal, and a step of providing a partially transparent mirror film of a dielectric or metal on a part of one surface of the substrate to prepare a second substrate. A step of joining the first substrate and the second substrate so that the tops of a plurality of microprojections of the first substrate are in contact with the surface of the second substrate can be included.

このような製造方法によれば、２つのミラー膜が所定の面間隔で平行に形成された光学素子を容易かつ精度良く製造することができる。このような光学素子の例として、エタロンが挙げられる。 According to such a manufacturing method, it is possible to easily and accurately manufacture an optical element in which two mirror films are formed in parallel at a predetermined surface spacing. Etalon is an example of such an optical element.

第１基板と第２基板は、例えば、第２基板の部分透過ミラー膜が設けられた面のうち部分透過ミラーが設けられていない部分の基板表面と、前記第１基板の複数の微小突起の頂部とが接触するように接合することができる。また、第１基板と第２基板は、第２基板の部分透過ミラー膜が設けられていない面の基板表面と、第１基板の複数の微小突起の頂部とが接触するように接合することもできる。後者の場合は、２つの部分透過ミラー膜を平行とするためには第２基板が平行平面基板である必要がある。このような光学素子の例として、エタロンが挙げられる。 The first substrate and the second substrate are, for example, a substrate surface of a portion of the surface of the second substrate provided with the partially transmissive mirror film on which the partially transmissive mirror is not provided, and a plurality of microprojections of the first substrate. It can be joined so that it is in contact with the top. Further, the first substrate and the second substrate may be joined so that the substrate surface of the surface of the second substrate on which the partially transparent mirror film is not provided is in contact with the tops of a plurality of microprojections of the first substrate. it can. In the latter case, the second substrate needs to be a parallel plane substrate in order to make the two partially transmissive mirror films parallel. Etalon is an example of such an optical element.

本態様に係る製造方法の第３の例は、平行平面基板の両方の表面を部分的に除去して複数の微小突起を設けてスペーサーとなる第１基板（スペーサー基板）を用意する工程と、一方の面の誘電体または金属の部分透過ミラー膜が設けられた２つの第２基板（部分透過ミラー膜付基板）を用意する工程と、前記第１基板を挟んで前記第２基板の前記部分透過ミラー膜が設けられた面同士が対向するように、前記２つの第２基板および前記第１基板を積層する工程と、を含むことができる。 A third example of the manufacturing method according to this embodiment includes a step of partially removing both surfaces of a parallel flat substrate to provide a plurality of microprojections to prepare a first substrate (spacer substrate) to be a spacer. A step of preparing two second substrates (a substrate with a partially transmissive mirror film) provided with a dielectric or metal partially transmissive mirror film on one surface, and the portion of the second substrate sandwiching the first substrate. A step of laminating the two second substrates and the first substrate so that the surfaces provided with the transmission mirror film face each other can be included.

このような製造方法によれば、２つのミラー膜が所定の面間隔で平行に形成された光学素子を容易かつ精度良く製造することができる。このような光学素子の例として、エタロン（ファブリ・ペロー干渉計）が挙げられる。 According to such a manufacturing method, it is possible to easily and accurately manufacture an optical element in which two mirror films are formed in parallel at a predetermined surface spacing. An example of such an optical element is an etalon (Fabry-Perot interferometer).

このようにすれば、２つのミラー膜の間の間隔および平行度は、スペーサー基板の一方
の面の複数の微小突起の頂部から他方の面の複数の微小突起の頂部までの間隔および平行度によって決定される。そして、所定の厚さの平行平面基板に対してエッチング加工により複数の微小突起を設けているので、両面にある複数の微小突起の頂部間の厚さは、平行平面基板の厚さおよび同じ精度で作ることができる。 In this way, the spacing and parallelism between the two mirror films depends on the spacing and parallelism from the tops of the plurality of microprojections on one surface of the spacer substrate to the tops of the plurality of microprojections on the other surface. It is determined. Since a plurality of microprojections are provided by etching on a parallel plane substrate having a predetermined thickness, the thickness between the tops of the plurality of microprojections on both sides is the same as the thickness of the parallel plane substrate. Can be made with.

本製造方法において、前記部分透過ミラー膜は、前記第２基板の一方の表面の一部に設けられ、前記第１基板の複数の微小突起の頂部は、前記第２基板の前記部分透過ミラー膜が設けられた面のうち前記部分透過ミラーが設けられていない部分と接触するように接合されることが好ましい。複数の微小突起の頂部と部分透過ミラー膜との接触による２つのミラー膜の平行度および間隔精度の悪化を防止するためである。 In the present manufacturing method, the partially transmissive mirror film is provided on a part of one surface of the second substrate, and the tops of a plurality of microprojections on the first substrate are formed on the partially transmissive mirror film of the second substrate. It is preferable that the surface is joined so as to be in contact with the portion of the surface provided with the above, which is not provided with the partial transmission mirror. This is to prevent deterioration of the parallelism and spacing accuracy of the two mirror films due to contact between the tops of the plurality of microprojections and the partially transparent mirror film.

また、本製造方法において、スペーサー基板に設けられる複数の微小突起は、スペーサー基板の一方の面と他方の面の両面において同じ位置に設けられることが好ましい。上面と下面から異なる位置にスペーサー基板に力が加えられると、スペーサー基板がたわむおそれがあるからである。なお逆に、上面と下面の複数の微小突起の位置を異ならせ基板に加える力を調整して２つのミラー膜の間隔を変えることによって、波長可変エタロン（ファブリ・ペロー干渉計）を製造することもできる。 Further, in the present manufacturing method, it is preferable that the plurality of microprojections provided on the spacer substrate are provided at the same positions on both one surface and the other surface of the spacer substrate. This is because if a force is applied to the spacer substrate at different positions from the upper surface and the lower surface, the spacer substrate may bend. On the contrary, a tunable etalon (Fabry-Perot interferometer) is manufactured by changing the positions of a plurality of microprojections on the upper surface and the lower surface and adjusting the force applied to the substrate to change the distance between the two mirror films. You can also.

本発明の第２の態様は、複数のミラー膜が所定の面間隔で平行に形成された光学素子であって、複数のミラー膜と、一方の面に複数の微小突起が基板と一体に設けられ他方の面が平面であるか、両方の面に複数の微小突起が基板と一体に設けられたエンボス付き付基板と、を含み、前記エンボス付基板のそれぞれの面に設けられた複数の微小突起の頂部は同一平面内に位置し、一方の面の複数の微小突起の頂部を含む平面と他方の表面（平面）が所定の面間隔で平行であるか、一方の面の複数の微小突起の頂部を含む平面と他方の面の複数の微小突起の頂部を含む平面が所定の面間隔で平行であり、前記複数のミラー膜の間に前記エンボス付基板が配置されている、ことを特徴とする。 A second aspect of the present invention is an optical element in which a plurality of mirror films are formed in parallel at predetermined surface intervals, and the plurality of mirror films and a plurality of microprojections on one surface are integrally provided with the substrate. A plurality of microscopic substrates provided on each surface of the embossed substrate, including an embossed substrate in which the other surface is flat or a plurality of microprojections are provided integrally with the substrate on both surfaces. The tops of the protrusions are located in the same plane, and the plane containing the tops of the plurality of microprojections on one surface and the other surface (plane) are parallel at a predetermined plane spacing, or the plurality of microprojections on one surface are parallel. The plane including the top of the mirror and the plane including the tops of the plurality of microprojections on the other surface are parallel to each other at a predetermined surface spacing, and the embossed substrate is arranged between the plurality of mirror films. And.

本態様に係る光学素子の第１の例は、回折格子であって、前記エンボス付基板には、一方の面に前記複数の微小突起が設けられており、他方の面にミラー膜が設けられており、複数の前記エンボス付基板が、複数の微小突起の頂部とミラー膜が設けられた面とが接触するように積層されている、ことを特徴とする。 The first example of the optical element according to this embodiment is a diffraction grating, in which the embossed substrate is provided with the plurality of microprojections on one surface and a mirror film on the other surface. The embossed substrate is laminated so that the tops of the plurality of microprojections and the surface provided with the mirror film are in contact with each other.

本態様に係る光学素子の第２の例は、エタロンであって、一方の面に複数の微小突起が設けられ、他方の面に部分透過ミラー膜が設けられた前記エンボスおよび部分透過ミラー膜付基板と、片面に部分透過ミラー膜が設けられた部分透過ミラー付基板と、を有し、前記エンボスおよび部分透過ミラー膜付基板と前記部分透過ミラー付基板とが、前記エンボス付基板の前記複数の微小突起の頂部が前記部分透過ミラー付基板と接触するように接合されている、ことを特徴とする。 A second example of an optical element according to this embodiment is an etalon with the embossed and partially transmissive mirror film provided with a plurality of microprojections on one surface and a partially transmissive mirror film on the other surface. The substrate has a substrate and a substrate with a partially transmissive mirror provided on one side thereof, and the embossed and partially transmissive mirror film-equipped substrate and the partially transmissive mirror-equipped substrate are the plurality of the embossed substrate. The top of the microprojection is joined so as to be in contact with the substrate with a partially transmissive mirror.

上記のエタロンにおいて、複数の微小突起および部分透過膜付基板と部分透過ミラー付基板とは、例えば、部分透過ミラー付基板の部分透過ミラー膜が設けられた面のうち部分透過ミラーが設けられていない部分の基板表面と、前記エンボスおよび部分透過ミラー膜付基板の複数の微小突起の頂部とが接触するように接合されていてもよい。また、前記エンボスおよび部分透過膜付基板と部分透過ミラー付基板は、部分透過ミラー付基板の部分透過ミラー膜が設けられていない面の基板表面と、エンボスおよび部分透過ミラー膜付基板の複数の微小突起の頂部とが接触するように接合されていてもよい。後者の場合は、２つの部分透過ミラー膜を平行とするためには、部分透過ミラー膜付基板が平行平面基板に部分透過ミラーが設けられたものである必要がある。 In the above-mentioned etalon, the plurality of microprojections and the substrate with the partially transmissive film and the substrate with the partially transmissive mirror are, for example, provided with the partially transmissive mirror among the surfaces of the substrate with the partially transmissive mirror on which the partially transmissive mirror film is provided. The surface of the substrate which is not provided may be joined so that the tops of the plurality of microprojections of the embossed and partially transparent mirror film-attached substrate are in contact with each other. Further, the embossed and partially transmissive film-equipped substrate and the partially transmissive mirror-equipped substrate include a plurality of substrate surfaces of the partially transmissive mirror-equipped substrate on which the partially transmissive mirror film is not provided, and a plurality of embossed and partially transmissive mirror film-equipped substrates. It may be joined so as to be in contact with the top of the microprojection. In the latter case, in order to make the two partially transmissive mirror films parallel, the substrate with the partially transmissive mirror film needs to be a parallel plane substrate provided with the partially transmissive mirror.

本態様に係る光学素子の第３の例は、エタロンであって、基板の片面の部分透過ミラー
膜が設けられた２つの部分透過ミラー付基板と、両面に複数の微小突起が設けられた前記エンボス付基板（スペーサー）と、を有し、前記エンボス付基板を挟んで前記部分透過ミラー付基板の前記部分透過ミラー膜が設けられた面同士が対向するように、前記２つの部分透過ミラー付基板と前記エンボス付基板とが積層されている、ことを特徴とする。 A third example of the optical element according to this embodiment is an etalon, which is a substrate with two partially transmissive mirrors provided with a partially transmissive mirror film on one side of the substrate, and a plurality of microprojections provided on both sides. With an embossed substrate (spacer), the two partially transmissive mirrors are provided so that the surfaces of the partially transmissive mirror-equipped substrate on which the partially transmissive mirror film is provided face each other with the embossed substrate interposed therebetween. It is characterized in that the substrate and the embossed substrate are laminated.

上記のエタロンにおいて、部分透過ミラー膜は、前記部分透過ミラー付基板の一方の表面の一部のみに設けられ、前記エンボス付基板の複数の微小突起の頂部は、前記部分透過ミラー付基板の前記部分透過ミラー膜が設けられた面のうち前記部分透過ミラー膜が設けられていない部分と接触するように接合されていることが好ましい。 In the above-mentioned etalon, the partially transmissive mirror film is provided only on a part of one surface of the partially transmissive mirror-equipped substrate, and the tops of a plurality of microprojections of the embossed substrate are formed on the partial transmissive mirror-equipped substrate. Of the surfaces provided with the partially transmissive mirror film, it is preferable that the surfaces are joined so as to be in contact with the portion not provided with the partially transmissive mirror film.

本態様において、前記エンボス付基板の前記複数の微小突起は、平行平面基板の表面を部分的に除去することにより設けられることが好ましい。より具体的には、エッチング加工により表面を部分的に除去して前記複数の微小突起が設けられることが好ましい。 In this embodiment, it is preferable that the plurality of microprojections of the embossed substrate are provided by partially removing the surface of the parallel plane substrate. More specifically, it is preferable that the surface is partially removed by etching to provide the plurality of microprojections.

また、本態様において、微小突起の頂部の平面形状は、直径が１μｍ以上１００μｍ以下、より好ましくは直径が１０μｍ以上３０μｍ以下の略円形形状とするとよい。 Further, in the present embodiment, the planar shape of the top of the microprojection may be a substantially circular shape having a diameter of 1 μm or more and 100 μm or less, more preferably 10 μm or more and 30 μm or less.

また、本態様において、微小突起の数密度は、１ｃｍ２あたり１個以上１０００００個以下、より好ましくは１ｃｍ２あたり１００個以上１０００個以下とするとよい。 Further, in this embodiment, the number density of the microprojections is preferably 1 or more and 100,000 or less per 1 cm 2 , and more preferably 100 or more and 1000 or less per 1 cm 2 .

また、本態様において、微小突起の高さは、１μｍ以上５０μｍ以下とするとよい。なお、微小突起の高さは、基板間に混入する異物の大きさに応じて決定することが好ましい。例えば、クリーンな環境で製造する場合には微小突起の高さを小さくすることができる。 Further, in this embodiment, the height of the microprojections is preferably 1 μm or more and 50 μm or less. The height of the microprojections is preferably determined according to the size of foreign matter mixed between the substrates. For example, when manufacturing in a clean environment, the height of the microprojections can be reduced.

本発明によれば、複数のミラー膜が所定の面間隔で略平行に形成された光学素子を精度良く製造することができる。 According to the present invention, it is possible to accurately manufacture an optical element in which a plurality of mirror films are formed substantially in parallel at predetermined surface intervals.

図１は、第１の実施形態にかかる回折格子の製造方法を説明する図である。FIG. 1 is a diagram illustrating a method for manufacturing a diffraction grating according to the first embodiment. 図２は、第１の実施形態にかかる回折格子の製造方法を説明する図である。FIG. 2 is a diagram illustrating a method for manufacturing a diffraction grating according to the first embodiment. 図３（ａ）（ｂ）は、エッチング加工により設けられる複数の微小突起のパターンを説明する図である。FIGS. 3 (a) and 3 (b) are views for explaining a pattern of a plurality of microprojections provided by etching. 図４（ａ）は第１の実施形態にかかる回折格子による点光源の回折像であり、図４（ｂ）は従来手法により製造された回折格子による点光源の回折像である。FIG. 4A is a diffraction image of a point light source using a diffraction grating according to the first embodiment, and FIG. 4B is a diffraction image of a point light source using a diffraction grating manufactured by a conventional method. 図５（ａ）−５（ｅ）第１の実施形態の変形例としてのエタロンの製造方法を説明する図である。5 (a) -5 (e) is a diagram illustrating a method for producing etalon as a modification of the first embodiment. 図６（ａ）−６（ｄ）は、第２の実施形態にかかるエタロンの構成および製造方法を説明する図である。6 (a) and 6 (d) are diagrams for explaining the configuration and manufacturing method of etalon according to the second embodiment. 図７（ａ）は複数のミラー膜が所定の間隔を空けて平行に形成された回折格子の概念構成図であり、図７（ｂ）は図７（ａ）のＡ−Ａ断面図である。FIG. 7A is a conceptual configuration diagram of a diffraction grating in which a plurality of mirror films are formed in parallel at predetermined intervals, and FIG. 7B is a cross-sectional view taken along the line AA of FIG. 7A. .. 図８（ａ）（ｂ）は、図７（ａ）（ｂ）に示す回折格子を説明する図である。8 (a) and 8 (b) are diagrams illustrating the diffraction gratings shown in FIGS. 7 (a) and 7 (b). 図９は、図７（ａ）（ｂ）に示す回折格子の製造方法の例を示す図である。FIG. 9 is a diagram showing an example of a method for manufacturing a diffraction grating shown in FIGS. 7A and 7B. 図１０は、図７（ａ）（ｂ）に示す回折格子の製造方法の例を示す図である。FIG. 10 is a diagram showing an example of a method for manufacturing a diffraction grating shown in FIGS. 7A and 7B.

以下、図面を参照しながら、本発明に係る光学素子およびその製造方法の実施形態につ
いて説明する。 Hereinafter, embodiments of an optical element and a method for manufacturing the same according to the present invention will be described with reference to the drawings.

＜第１の実施形態＞
本発明の第１の実施形態は、上述したＱｕａｓｉ−Ｂｒａｇｇ回折格子およびその製造方法に関する。図１および図２は、本実施形態における回折格子の製造方法を示す図である。 <First Embodiment>
The first embodiment of the present invention relates to the above-mentioned Quasi-Bragg diffraction grating and a method for producing the same. 1 and 2 are diagrams showing a method of manufacturing a diffraction grating in the present embodiment.

まずステップＳ１において基板１００を用意する。基板１００は、上面と下面が平行な平行平面基板であり、均一の厚さＴ１を有する。基板１００は、誘電体材料または半導体材料により形成されており、回折格子１０全体の大きさや格子間隔ｄなどに応じて寸法設定されており、たとえば、横幅Ｌ１を１０ｍｍ〜２００ｍｍ程度、横幅Ｗ１を１０ｍｍ〜２００ｍｍ程度とすることができる。基板の厚さＴ１の望ましい範囲は、回折格子が対象とする波長と基板の屈折率によって決まり、たとえば、波長／基板屈折率の１０倍〜２０００倍とすることが望ましい。波長や基板屈折率にもよるがこの範囲は１０μｍ〜２ｍｍ程度である。 First, the substrate 100 is prepared in step S1. The substrate 100 is a parallel flat substrate whose upper surface and lower surface are parallel to each other, and has a uniform thickness T1. The substrate 100 is made of a dielectric material or a semiconductor material, and its dimensions are set according to the size of the entire diffraction grating 10 and the lattice spacing d. For example, the width L1 is about 10 mm to 200 mm and the width W1 is 10 mm. It can be about 200 mm. The desirable range of the substrate thickness T1 is determined by the wavelength targeted by the diffraction grating and the refractive index of the substrate, and is preferably 10 to 2000 times the wavelength / substrate refractive index, for example. This range is about 10 μm to 2 mm, although it depends on the wavelength and the refractive index of the substrate.

なお、基板１００を形成する誘電体材料としては、たとえば、石英、ＢＫ−７などのガラス素材、ＰＭＭＡやポリイミドなどの樹脂、水晶やフッ化マグネシウムなどの結晶材料、一方、半導体材料としてはシリコン、ゲルマニウム、ガリウム砒素（ＧａＡｓ）、カドミウム・テルル（ＣｄＴｅ）などの各種結晶材料を用いることができる。 Examples of the dielectric material forming the substrate 100 include glass materials such as quartz and BK-7, resins such as PMMA and polyimide, crystal materials such as crystal and magnesium fluoride, and silicon as the semiconductor material. Various crystalline materials such as germanium, gallium arsenide (GaAs), and cadmium telluride (CdTe) can be used.

以下の説明では、基板１００は、一辺が１００ｍｍの正方形で、厚さＴ１が０．５ｍｍの石英ガラスの平行平面基板であるものとする。 In the following description, it is assumed that the substrate 100 is a quartz glass parallel plane substrate having a side of 100 mm and a thickness T1 of 0.5 mm.

用意する基板１００は、１枚であっても複数枚であっても良いが、基板の厚さが均一であることが重要である。したがって、複数枚の基板１００を用意する場合には、同一バッチによって研磨されたものを用いることが好ましい。 The substrate 100 to be prepared may be one or a plurality of substrates, but it is important that the thickness of the substrate is uniform. Therefore, when preparing a plurality of substrates 100, it is preferable to use those polished by the same batch.

ステップＳ２において基板１００の両面に金属膜１０２をスパッタリング法によって堆積させる。金属膜１０２として、金、銀、クロム、アルミニウムなどを採用することができる。金属膜１０２の厚さＴ２は、設計によって適宜に設定すれば良く、たとえば、１０ｎｍ〜２００ｎｍとすることができる。また、厚さＴ２は均一とすることが必要である。本実施形態では、金属膜１０２として、クロムの薄膜をスパッタリング法によって精密に１００ｎｍ程度堆積させる。スパッタリング法では、金属膜１０２の厚さ誤差を全体厚さの５％以下で精度良く堆積可能であり、２００ｎｍ堆積させた場合でも厚さの誤差は１０ｎｍ以下とすることができる。 In step S2, the metal film 102 is deposited on both sides of the substrate 100 by a sputtering method. As the metal film 102, gold, silver, chromium, aluminum, or the like can be adopted. The thickness T2 of the metal film 102 may be appropriately set according to the design, and can be, for example, 10 nm to 200 nm. Further, the thickness T2 needs to be uniform. In the present embodiment, as the metal film 102, a thin film of chromium is precisely deposited at about 100 nm by a sputtering method. In the sputtering method, the thickness error of the metal film 102 can be accurately deposited at 5% or less of the total thickness, and the thickness error can be 10 nm or less even when 200 nm is deposited.

ステップＳ３〜Ｓ５の工程により、湿式エッチングで基板１００の一方の表面を部分的に除去することにより、スペーサーとして機能する複数の微小突起１０８を設ける。まず、ステップＳ３において、基板１００の両面にフォトレジスト１０４を塗布し、コンタクトマスク露光装置やマスクレス露光装置、ステッパー等を用いてフォトレジストに所定のパターンのリソグラフを行い、レジストマスクを形成する。レジストマスクのパターンは、直径１μｍ〜１００μｍ、より好ましくは１０μｍ〜３０μｍの円形パターンが、１ｃｍ２あたり１〜１０００００個程度、より好ましくは１００〜１０００個程度描かれたものを利用するとよい。微小突起の数が少ないと強い衝撃や大きな圧力が加わった場合に微小突起が座屈したり、微小突起がミラー膜に食い込んだりすることによって基板を平行に支持することが困難となり、微小突起の数が多いと異物を挟み込む確率が高くなり、格子周期ｄの誤差が大きくなる。上記の範囲であれば両者のバランスが取れる。 By the steps S3 to S5, one surface of the substrate 100 is partially removed by wet etching to provide a plurality of microprojections 108 that function as spacers. First, in step S3, the photoresist 104 is applied to both surfaces of the substrate 100, and a predetermined pattern lithograph is performed on the photoresist using a contact mask exposure apparatus, a maskless exposure apparatus, a stepper, or the like to form a resist mask. As the pattern of the resist mask, it is preferable to use a circular pattern having a diameter of 1 μm to 100 μm, more preferably 10 μm to 30 μm, in which about 1 to 100,000 pieces, more preferably about 100 to 1000 pieces, are drawn per 1 cm 2 . If the number of microprojections is small, it becomes difficult to support the substrate in parallel because the microprojections buckle when a strong impact or large pressure is applied, or the microprojections bite into the mirror film, and the number of microprojections If the number is large, the probability of sandwiching foreign matter increases, and the error of the lattice period d increases. Within the above range, the two can be balanced.

ステップＳ４において、フォトレジスト１０４を残したままフッ酸等を用いて基板１０
０自体に等方性エッチングを行い、高さＴ３が１μｍ〜５０μｍ程度の複数の微小突起１０８を形成させる。 In step S4, the substrate 10 is made of hydrofluoric acid or the like while leaving the photoresist 104.
The 0 itself is isotropically etched to form a plurality of microprojections 108 having a height T3 of about 1 μm to 50 μm.

複数の微小突起１０８の高さＴ３（エッチング深さ）は、製造環境のクリーン度を考慮して決定すればよい。たとえば、高さＴ３が５μｍ程度であれば、後述の積層工程において１０μｍ程度の異物（塵芥等）が混入した場合でも、異物はつぶされて複数の微小突起によって形成される隙間に収まるので基板１００間隔の精度が保たれる。製造環境のクリーン度が低いほど微小突起の高さＴ３を大きくすることが好ましい。 The height T3 (etching depth) of the plurality of microprojections 108 may be determined in consideration of the cleanliness of the manufacturing environment. For example, if the height T3 is about 5 μm, even if foreign matter (dust, etc.) of about 10 μm is mixed in the laminating step described later, the foreign matter is crushed and fits in the gap formed by the plurality of microprojections. The accuracy of the interval is maintained. It is preferable to increase the height T3 of the microprojections as the cleanliness of the manufacturing environment is lower.

ステップＳ５において、フォトレジストを除去する。基板１００の複数の微小突起１０８が形成されていない方に残存する金属膜１０２はミラー膜として機能する。このようにして、一方の面に複数の微小突起が形成され、他方の面にミラー膜が形成されたエンボスおよびミラー膜付基板１１０が得られる。 In step S5, the photoresist is removed. The metal film 102 remaining on the side of the substrate 100 on which the plurality of microprojections 108 are not formed functions as a mirror film. In this way, an embossed substrate 110 with a mirror film is obtained, in which a plurality of microprojections are formed on one surface and a mirror film is formed on the other surface.

図３（ａ）（ｂ）は、複数の微小突起１０８のパターン例を説明する図である。図３（ａ）は複数の微小突起の光学顕微鏡写真であり、図３（ｂ）に示すように、直径１２μｍの円形が、一辺３００μｍの正六角形格子状に配列されたパターンを有する。この例では、複数の微小突起１０８の数密度は約８６０個／ｃｍ２となる。 3A and 3B are diagrams for explaining a pattern example of a plurality of microprojections 108. FIG. 3A is an optical micrograph of a plurality of microprojections, and as shown in FIG. 3B, it has a pattern in which circles having a diameter of 12 μm are arranged in a regular hexagonal lattice pattern having a side of 300 μm. In this example, the number density of the plurality of microprojections 108 is about 860 pieces / cm 2 .

複数の微小突起１０８の表面に残存する金属膜を無視すれば、複数の微小突起１０８の頂部はエッチング処理前の基板１００の表面であり、全ての複数の微小突起１０８の頂部は同一平面内に位置する。なお、金属膜は均一の厚さで成膜できるので、複数の微小突起１０８表面に金属膜が残存していても複数の微小突起１０８の頂部を含む平面とミラー膜１０２の平行度（すなわち、エンボスおよびミラー膜付基板１１０の上面と下面の平行度）は、基板１００の平行度と同等の精度とできる。 Ignoring the metal film remaining on the surface of the plurality of microprojections 108, the tops of the plurality of microprojections 108 are the surface of the substrate 100 before the etching process, and the tops of all the plurality of microprojections 108 are in the same plane. To position. Since the metal film can be formed with a uniform thickness, even if the metal film remains on the surface of the plurality of microprojections 108, the plane including the tops of the plurality of microprojections 108 and the parallelism of the mirror film 102 (that is, that is). The parallelism between the upper surface and the lower surface of the embossed and mirror film-attached substrate 110) can be as accurate as the parallelism of the substrate 100.

ステップＳ６において、エンボスおよびミラー膜付基板１１０を切断機によって切断する。切断のサイズは、設計によって適宜に設定すればよい。本実施形態では、１００ｍｍ×１００ｍｍ×０．５ｍｍのエンボスおよびミラー膜付基板１１０を、２５ｍｍ×４ｍｍ×０．５ｍｍに切断して、１００枚の分割基板１１２を得る。なお、切断機として、一般にシリコンウェアから集積回路の切り出しなどに用いられている外周歯切断機（ダイシングソー）を利用することができる。 In step S6, the embossed and mirror film-attached substrate 110 is cut by a cutting machine. The size of the cut may be appropriately set according to the design. In the present embodiment, the 100 mm × 100 mm × 0.5 mm embossed and mirror film-attached substrate 110 is cut into 25 mm × 4 mm × 0.5 mm to obtain 100 divided substrates 112. As the cutting machine, an outer peripheral tooth cutting machine (dicing saw) generally used for cutting out an integrated circuit from silicon wear can be used.

ステップＳ７において、分割基板１１２の表面に接着剤１１４を塗布しながら、多数の分割基板１１２を積層してミラー膜付基板積層ブロック１１５を得る。積層枚数は設計によって適宜に設定すればよい。本実施形態では４７枚の基板を積層する。接着剤１１４は、分割基板１１２と屈折率がほぼ等しい樹脂製の紫外線硬化接着剤である。 In step S7, while applying the adhesive 114 to the surface of the divided substrate 112, a large number of divided substrates 112 are laminated to obtain a substrate laminated block 115 with a mirror film. The number of layers may be appropriately set depending on the design. In this embodiment, 47 substrates are laminated. The adhesive 114 is a resin-made ultraviolet curable adhesive having a refractive index substantially equal to that of the divided substrate 112.

分割基板１１２の積層後、ステップＳ８において基板間に荷重をかける。本実施形態では、２００ｇ／ｃｍ２（＝約０．２気圧）程度の荷重を１時間印加することで、複数の微小突起１０８とミラー膜１０２との間の余分な接着剤を取り除く。また、荷重印加により、基板間に混入した異物（塵芥）をつぶして異物による基板の押し上げを抑制できる。この荷重をかけたままの状態で、ステップＳ９において、紫外線露光を行い、接着剤１１４を硬化させる。 After laminating the divided substrates 112, a load is applied between the substrates in step S8. In the present embodiment, an excess adhesive between the plurality of microprojections 108 and the mirror film 102 is removed by applying a load of about 200 g / cm 2 (= about 0.2 atm) for 1 hour. Further, by applying a load, foreign matter (dust) mixed between the substrates can be crushed and the pushing up of the substrate by the foreign matter can be suppressed. With this load still applied, in step S9, ultraviolet exposure is performed to cure the adhesive 114.

ステップＳ１０において、ミラー膜付基板積層ブロック１１５を所望の厚さに切断する。本実施形態では、２５ｍｍ×２３．５ｍｍ×厚さ４ｍｍのミラー膜付基板積層ブロック１１５を２枚（最終仕上げの厚さｔ＝２．０ｍｍとｔ＝０．９ｍｍが１枚づつ）に縦割りに切断する。切断機として、一般にシリコンウェアの切り出しなどに用いられているワイヤーソーや内周歯切断機を利用することができる。切断後に研削・研磨工程を施して回折
格子が得られる。 In step S10, the substrate laminated block 115 with a mirror film is cut to a desired thickness. In the present embodiment, the substrate laminated block 115 with a mirror film of 25 mm × 23.5 mm × thickness 4 mm is vertically divided into two (one each having a final finishing thickness of t = 2.0 mm and t = 0.9 mm). Cut to. As the cutting machine, a wire saw or an inner peripheral tooth cutting machine generally used for cutting out silicon wear can be used. A diffraction grating is obtained by performing a grinding / polishing process after cutting.

図４（ａ）は、本実施形態によって製造された回折格子による回折像（格子周期ｄ＝０．５ｍｍ、厚さｔ＝２．０ｍｍ）を示す図である。図４（ｂ）は、比較例であり、特許文献２に記載された方法によって製造された回折格子（格子周期ｄ＝０．２ｍｍ、厚さｔ＝１．６１ｍｍ）による回折像を示す図である。図４（ａ）は回折角が２０．７°、図４（ｂ）は回折角が１０．４°の回折像であり、図４（ａ）（ｂ）のいずれも、波長６３３ｎｍ、結像レンズの焦点距離８００ｍｍの測定条件により得られたものである。図４（ａ）に示すように、本実施形態にかかる回折格子を用いた回折像は回折次数に対応する等間隔の明暗縞が現れ、かつ良好な対称性を示しており、ミラー膜が等間隔かつ平行に形成できていることが分かる。一方、格子周期ｄ＝０．２ｍｍの回折格子は格子周期と平行度が可視光において充分な精度である場合には図４（ａ）の約２．５倍周期の明暗縞が現れるが、特許文献２に記載された方法によって製造された回折格子を用いた回折像は図４（ｂ）に示すように、明暗縞が見られない。 FIG. 4A is a diagram showing a diffraction image (lattice period d = 0.5 mm, thickness t = 2.0 mm) by the diffraction grating manufactured according to the present embodiment. FIG. 4B is a comparative example and is a diagram showing a diffraction image by a diffraction grating (lattice period d = 0.2 mm, thickness t = 1.61 mm) manufactured by the method described in Patent Document 2. is there. FIG. 4A is a diffraction image having a diffraction angle of 20.7 ° and FIG. 4B is a diffraction image having a diffraction angle of 10.4 °. In each of FIGS. 4A and 4B, a wavelength of 633 nm is formed. It was obtained under the measurement conditions of the focal length of the lens of 800 mm. As shown in FIG. 4A, the diffraction image using the diffraction grating according to the present embodiment shows bright and dark fringes at equal intervals corresponding to the diffraction order, and shows good symmetry, and the mirror film is equal. It can be seen that they are formed at intervals and in parallel. On the other hand, in a diffraction grating having a lattice period d = 0.2 mm, when the lattice period and parallelism are sufficiently accurate in visible light, bright and dark stripes having a period of about 2.5 times as shown in FIG. 4A appear. As shown in FIG. 4B, the diffraction image using the diffraction grating produced by the method described in Document 2 does not show light and dark fringes.

本実施形態によれば、一方の面に基板１００と一体に設けられた複数の微小突起１０８を有し、他方の面にミラー膜１０２を有する基板１００が多数積層した構造の回折格子（光学素子）を製造することができる。この回折格子は、別の表現をすれば、複数のミラー膜１０２が複数の微小突起１０８付の基板１００を間に挟んで複数積層した構造を有する。このようにして製造される回折格子では、複数のミラー膜の平行度が高く、かつ、複数のミラー膜の面間隔を高精度に均一とすることができる。その理由は、複数の微小突起を石英ガラス基板に対するエッチング加工により形成しているので、基板の一方の面に設けられた複数の微小突起の頂部（表面）から他方の面に設けられたミラー膜までの間隔および平行度を、ガラス基板と同様の高い精度とすることができるためである。また、基板間に異物が混入した場合であっても、当該異物は複数の微小突起によって形成される基板間の空隙部分に逃げるので、異物が基板を押し上げることも抑制できるためでもある。 According to this embodiment, a diffraction grating (optical element) having a structure in which a large number of substrates 100 having a plurality of microprojections 108 provided integrally with the substrate 100 on one surface and a mirror film 102 on the other surface are laminated. ) Can be manufactured. In other words, this diffraction grating has a structure in which a plurality of mirror films 102 are laminated with a substrate 100 having a plurality of microprojections 108 sandwiched between them. In the diffraction grating manufactured in this way, the parallelism of the plurality of mirror films is high, and the surface spacing of the plurality of mirror films can be made uniform with high accuracy. The reason is that since a plurality of microprojections are formed by etching a quartz glass substrate, a mirror film provided from the top (surface) of the plurality of microprojections provided on one surface of the substrate to the other surface. This is because the spacing and parallelism up to can be set to the same high accuracy as the glass substrate. Further, even when a foreign substance is mixed between the substrates, the foreign substance escapes to a gap portion between the substrates formed by a plurality of minute protrusions, so that the foreign substance can be suppressed from pushing up the substrate.

本実施形態によれば、ミラー膜の膜厚誤差を１〜２０ｎｍ程度とすることができる。すなわち、本実施形態によれば回折格子を高い精度で製造することができる。回折格子の周期誤差は１／２０波長とすることが望まれる。本実施形態によって製造された回折格子は、約４００ｎｍまでの波長の光（すなわち可視光）に対して回折格子として機能する。 According to this embodiment, the film thickness error of the mirror film can be set to about 1 to 20 nm. That is, according to this embodiment, the diffraction grating can be manufactured with high accuracy. It is desirable that the periodic error of the diffraction grating be 1/20 wavelength. The diffraction grating produced by the present embodiment functions as a diffraction grating for light having a wavelength up to about 400 nm (that is, visible light).

なお、上記の実施形態は、以下のように変形することができる。 The above embodiment can be modified as follows.

上記の実施形態では、複数の微小突起とミラー膜が形成された基板をステップＳ６で切断してから積層しているが、ステップＳ６を省略して切断することなく複数の基板を積層してもよい。この場合、積層枚数分の平行平面基板に対してミラー膜形成と複数の微小突起形成を行う必要がある。 In the above embodiment, the substrates on which the plurality of microprojections and the mirror film are formed are cut in step S6 and then laminated. However, even if the plurality of substrates are laminated without cutting by omitting step S6. Good. In this case, it is necessary to form a mirror film and a plurality of microprojections on the parallel flat substrate for the number of stacked sheets.

また、ステップＳ１０において切断処理を施すことなく研磨して、ミラー膜付基板積層ブロック１１５全体で回折格子を構成するようにしてもよい。 Further, in step S10, the diffraction grating may be formed by the entire substrate laminated block 115 with a mirror film by polishing without performing the cutting process.

また、上記の実施形態では、ステップＳ２で設けたクロム膜のみをミラー膜として用いているが、ステップＳ５の後に、クロム膜の上にさらにアルミニウム、金、銀などの薄膜をスパッタリング法により厚さを精密に堆積させて、ミラー膜の反射率を向上させても良い。この場合、ステップＳ２において設けるクロム膜の厚さは、エッチングの際に石英ガラスの保護膜として機能する程度の厚さがあれば十分である。これにより、複数の微小突起１０８の表面に残存するクロム膜を薄いものとすることができる。 Further, in the above embodiment, only the chrome film provided in step S2 is used as the mirror film, but after step S5, a thin film of aluminum, gold, silver or the like is further thickened on the chrome film by a sputtering method. May be precisely deposited to improve the reflectance of the mirror film. In this case, the thickness of the chromium film provided in step S2 is sufficient as long as it functions as a protective film for quartz glass during etching. As a result, the chrome film remaining on the surface of the plurality of microprojections 108 can be made thin.

また、上記の実施形態では、複数の微小突起１０８の表面に設けられているクロム膜１
０２をそのまま残しているが、複数の微小突起１０８上のクロム膜を除去する工程を設けることも好ましい。この場合、ミラー膜として機能する他方の面のクロム膜を保護した上で、複数の微小突起１０８上のクロム膜を除去すればよい。 Further, in the above embodiment, the chromium film 1 provided on the surface of the plurality of microprojections 108
Although 02 is left as it is, it is also preferable to provide a step of removing the chromium film on the plurality of microprojections 108. In this case, the chrome film on the other surface that functions as a mirror film may be protected, and then the chrome film on the plurality of microprojections 108 may be removed.

また、上記の実施形態においては、ミラー膜を光束が入射する面および出射面に対して概垂直であったが、特許文献３（特開２００７−１６４０１３号公報）や特許文献４（特開２００９−０６３７５４号公報）のようにミラー膜を光束が入射する面および出射面に対して傾斜させてもよい。 Further, in the above embodiment, the mirror film is approximately perpendicular to the surface on which the light flux is incident and the surface on which the light flux is emitted, but Patent Document 3 (Japanese Patent Laid-Open No. 2007-164013) and Patent Document 4 (Japanese Patent Laid-Open No. 2009). The mirror film may be tilted with respect to the surface on which the light flux is incident and the surface on which the light flux is emitted, as in (063754).

また、上記の実施形態においては、光束が出射面から出射するようになっていたが、特許文献３（特開２００７−１６４０１３号公報）のように出射面を反射面として、光束をミラー膜に戻しても良い。 Further, in the above embodiment, the light flux is emitted from the emission surface, but as in Patent Document 3 (Japanese Unexamined Patent Publication No. 2007-164013), the emission surface is used as the reflection surface and the light flux is used as the mirror film. You may put it back.

また、上記の実施形態においては、光束が入射する面と出射面が平行であるが、いずれかの面、あるいは両方の面が傾斜してプリズム形状であっても良い。 Further, in the above embodiment, the surface on which the luminous flux is incident and the surface on which the light flux is emitted are parallel, but either surface or both surfaces may be inclined to form a prism shape.

本実施形態にかかる製造方法は、大気環境学、天文学、地球惑星科学、化学、生命科学あるいは医学などの各種の分野において使用される分光計測装置や分析装置などに用いる高次の高分散回折格子や、化学製品、食品、衛生関連製品の製造装置や品質管理装置などに用いる高次の高分散回折格子の製造に利用することができる。また、光通信や光コンピューティングなどに使用されるビーム分配器、波長混合器・弁別器などとして用いることのできる回折格子の製造に利用することもできる。特に、光通信における波長多重型光通信用の光インターコネクションとして普及している平面導波路の光スイッチや波長混合・弁別器などに用いられる高次の回折格子として用いて好適な回折格子の製造に利用することができる。 The manufacturing method according to this embodiment is a high-order high-order diffraction grating used for a spectroscopic measuring device or an analyzer used in various fields such as atmospheric environment science, astronomy, earth and planetary science, chemistry, life science, or medicine. It can also be used to manufacture high-order high-dispersion diffraction gratings used in manufacturing equipment and quality control equipment for chemical products, foods, and hygiene-related products. It can also be used to manufacture a diffraction grating that can be used as a beam distributor, wavelength mixer / discriminator, etc. used for optical communication, optical computing, and the like. In particular, production of a diffraction grating suitable for use as a high-order diffraction grating used in an optical switch of a planar waveguide or a wavelength mixer / discriminator, which is widely used as an optical interconnection for wavelength multiplex optical communication in optical communication. Can be used for.

＜第１の実施形態の変形例＞
上記では、エンボス付基板（スペーサー基板）を用いて多数のミラー膜が平行に配置された回折格子を製造する例を説明したが、同様の製造方法によって２枚の部分透過ミラー膜が平行に配置されたエタロンを製造することもできる。第１の実施形態の変形例として、図５を参照して、エタロンの製造方法を説明する。 <Modified example of the first embodiment>
In the above, an example of manufacturing a diffraction grating in which a large number of mirror films are arranged in parallel using an embossed substrate (spacer substrate) has been described, but two partially transmissive mirror films are arranged in parallel by the same manufacturing method. It is also possible to produce the etalon. As a modified example of the first embodiment, a method for producing etalon will be described with reference to FIG.

図５（ｃ）に示す構造のエタロン１７０の製造方法を説明する。エタロン１７０は、エンボスおよび部分透過ミラー膜付基板１５０と部分透過ミラー膜付基板１６０を用意しこれらを接合することにより製造される。 A method for producing Etalon 170 having the structure shown in FIG. 5C will be described. The etalon 170 is manufactured by preparing a substrate 150 with an embossed and partially transparent mirror film and a substrate 160 with a partially transparent mirror film and joining them together.

図５（ａ）は、エンボスおよび部分透過ミラー膜付基板１５０を示す図である。基板１５０は、円形の平行平面基板１５１の一方の表面のうち周縁部１５２に、第１の実施形態と同様の手法により複数の微小突起１５３が設けられる。また、平行平面基板１５１の他方の面のうち中心部１５４（周縁部１５２以外の部分）に、誘電体または金属により部分透過ミラー膜１５５（例えば、９９．９％反射、０．１％透過）が設けられる。 FIG. 5A is a diagram showing a substrate 150 with an embossed and partially transmissive mirror film. The substrate 150 is provided with a plurality of microprojections 153 on the peripheral edge portion 152 of one surface of the circular parallel plane substrate 151 by the same method as in the first embodiment. Further, a partially transparent mirror film 155 (for example, 99.9% reflection, 0.1% transmission) is formed on the central portion 154 (a portion other than the peripheral portion 152) of the other surface of the parallel flat substrate 151 by a dielectric or metal. Is provided.

図５（ｂ）は、微小突起を有さず部分透過ミラー膜のみを有する部分透過ミラー膜付基板１６０を示す図である。基板１６０は、円形のウェッジ基板１６１の一方の面の中心部（基板１５０の中心部１５４と同等）に、誘電体または金属により部分透過ミラー膜１６２が設けられる。また、ウェッジ基板１６１の反対の面に反射防止膜１６３が設けられる。 FIG. 5B is a diagram showing a substrate 160 with a partially transmissive mirror film having only a partially transmissive mirror film without microprojections. The substrate 160 is provided with a partially transparent mirror film 162 made of a dielectric or a metal at the center of one surface of the circular wedge substrate 161 (equivalent to the center 154 of the substrate 150). Further, an antireflection film 163 is provided on the opposite surface of the wedge substrate 161.

図５（ｃ）に示すように、基板１５０と基板１６０とを、基板１５０の複数の微小突起１５３が設けられた面と、基板１６０の部分透過ミラー膜１６２が設けられた面が向かい
合うように接合することにより、エタロン１７０が得られる。基板１５０の複数の微小突起１５３は周縁部１５２に設けられ、基板１６０の部分透過ミラー膜１６２は中心部１５４に設けられているので、複数の微小突起１５３の頂部は、基板１６０の部分透過ミラー膜１６２が設けられた面のうち部分透過ミラー膜１６２が設けられていない部分の基板表面と接触する。基板１５０と基板１６０の接合は、第１の実施形態と同様に基板間に接着剤１７１を塗布することにより行えばよい。 As shown in FIG. 5C, the substrate 150 and the substrate 160 are opposed to each other so that the surface of the substrate 150 provided with the plurality of microprojections 153 and the surface of the substrate 160 provided with the partially transmissive mirror film 162 face each other. By joining, Etalon 170 is obtained. Since the plurality of microprojections 153 of the substrate 150 are provided on the peripheral edge portion 152 and the partial transmission mirror film 162 of the substrate 160 is provided on the central portion 154, the tops of the plurality of microprojections 153 are the partial transmission mirrors of the substrate 160. It comes into contact with the substrate surface of the portion of the surface provided with the film 162 on which the partially transmissive mirror film 162 is not provided. The bonding of the substrate 150 and the substrate 160 may be performed by applying the adhesive 171 between the substrates as in the first embodiment.

このような製造方法によれば、２つの部分透過ミラー膜１６２を、平行平面基板１５１と略同一の面間隔および平行度で配置されたエタロンを容易に製造することができる。 According to such a manufacturing method, it is possible to easily manufacture an etalon in which the two partially transmissive mirror films 162 are arranged at substantially the same surface spacing and parallelism as the parallel plane substrate 151.

次に、図５（ｅ）に示すエタロン１９０の製造方法を説明する。エタロン１９０は、エンボスおよび部分透過ミラー膜付基板１５０と部分透過ミラー膜付基板１８０を用意しこれらを接合することにより製造される。 Next, a method for producing the etalon 190 shown in FIG. 5 (e) will be described. The etalon 190 is manufactured by preparing a substrate 150 with an embossed and partially transparent mirror film and a substrate 180 with a partially transparent mirror film and joining them together.

図５（ｄ）は、微小突起を有さず部分透過ミラー膜のみを有する部分透過ミラー膜付基板１８０を示す図である。基板１８０は、平行平面基板１８１の一方の表面の中心部（基板１５０の中心部１５４と同等）に、誘電体または金属により部分透過ミラー膜１８２が設けられる。 FIG. 5D is a diagram showing a substrate 180 with a partially transmissive mirror film having only a partially transmissive mirror film without microprojections. The substrate 180 is provided with a partially transmissive mirror film 182 made of a dielectric or a metal at the center of one surface of the parallel plane substrate 181 (equivalent to the center 154 of the substrate 150).

図５（ｅ）に示すように、基板１５０と基板１８０を、基板１５０の複数の微小突起１５３が設けられた面と、基板１８０の部分透過ミラー膜が設けられていない側の面とが向かい合うように接合することにより、エタロン１９０が得られる。基板１５０と基板１８０の接合は、第１の実施形態と同様に基板間に接着剤１９１を塗布することにより行えばよい。 As shown in FIG. 5 (e), the surface of the substrate 150 and the substrate 180 on which the plurality of microprojections 153 of the substrate 150 are provided and the surface of the substrate 180 on which the partially transparent mirror film is not provided face each other. By joining in this manner, Etalon 190 is obtained. The bonding of the substrate 150 and the substrate 180 may be performed by applying the adhesive 191 between the substrates as in the first embodiment.

このような製造方法によれば、２つの部分透過ミラー膜１６２を、平行平面基板１５１，１８１と略同一の面間隔および平行度で配置されたエタロンを容易に製造することができる。 According to such a manufacturing method, etalon in which the two partially transmissive mirror films 162 are arranged at substantially the same surface spacing and parallelism as the parallel plane substrates 151 and 181 can be easily manufactured.

本実施形態にかかる製造方法は、大気環境学、天文学、地球惑星科学、化学、生命科学あるいは医学などの各種の分野において使用される分光計測装置や分析装置などに用いるナローバンドフィルタや、化学製品、食品、衛生関連製品の製造装置や品質管理装置などに用いるナローバンドフィルタの製造に利用することができる。また、レーザー発信器に組み込むことによってレーザー光の波長選択および狭線化のための光学素子として利用することができる。 The manufacturing method according to this embodiment includes narrow band filters and chemical products used in spectroscopic measurement devices and analyzers used in various fields such as atmospheric environment science, astronomy, earth and planetary science, chemistry, life science, and medicine. It can be used for manufacturing narrow band filters used in manufacturing equipment for food and hygiene-related products and quality control equipment. Further, by incorporating it into a laser transmitter, it can be used as an optical element for wavelength selection and narrowing of laser light.

＜第２の実施形態＞
本発明の第２の実施形態は、平行に設けられた２枚の部分透過ミラー膜を有するエタロンおよびその製造方法に関する。 <Second embodiment>
A second embodiment of the present invention relates to an etalon having two partially permeable mirror membranes provided in parallel and a method for producing the same.

第１の実施形態においては、一方の面に部分透過ミラー膜（例えば、９９．９％反射、０．１％透過する膜）を設け他方の面に複数の微小突起を設けた基板を積層させているが、本実施形態では、部分透過ミラー膜が設けられた基板の間に、両面に複数の微小突起が設けられた基板を挟んで積層する。 In the first embodiment, a substrate provided with a partially transparent mirror film (for example, a film having 99.9% reflection and 0.1% transmission) on one surface and a plurality of microprojections on the other surface is laminated. However, in the present embodiment, a substrate provided with a plurality of microprojections on both sides is sandwiched between substrates provided with a partially transmissive mirror film and laminated.

図６は、空隙型エタロン２１０の製造方法を説明する図である。図６（ａ）は、平行平面基板２０２の両面に複数の微小突起２０３が設けられたスペーサー基板２０１の正面図および側面図である。図６（ａ）に示すように、スペーサー基板２０１は、円盤状であり、上面と下面が平行な基板である。スペーサー基板２０１（平行平面基板２０２）の直径は、部分透過ミラー膜付基板２０５の部分透過ミラー膜が設けられない周縁部の幅以下と
する。基板の具体的な大きさや材料は第１の実施形態と同様に設計に応じて適宜決めればよい。 FIG. 6 is a diagram illustrating a method for producing the void type etalon 210. FIG. 6A is a front view and a side view of the spacer substrate 201 provided with a plurality of microprojections 203 on both sides of the parallel plane substrate 202. As shown in FIG. 6A, the spacer substrate 201 has a disk shape, and the upper surface and the lower surface are parallel to each other. The diameter of the spacer substrate 201 (parallel plane substrate 202) is set to be equal to or less than the width of the peripheral portion of the substrate 205 with the partially transmissive mirror film where the partially transmissive mirror film is not provided. The specific size and material of the substrate may be appropriately determined according to the design as in the first embodiment.

基板２０１の上下両面には、複数の微小突起２０３が設けられる。この微小突起は、直径１μｍ〜１００μｍ、より好ましくは１０μｍ〜３０μｍの円形であり、１ｃｍ２あたり１〜１０００００個程度、より好ましくは１００〜１０００個設けられる。微小突起２０３の高さは５μｍ〜数１０μｍとする。なお、上面と下面とで、同じ位置に微小突起２０３を設けることが好ましい。力が加えられた時の基板２０１のたわみを抑制し、部分透過ミラー膜間の距離を一定に保てるためである。ただし、上面と下面とで複数の微小突起２０３を設ける位置をずらして、基板に加える力を調整することで基板２０１をたわませて部分透過ミラー膜間の距離を可変とする波長可変エタロン（ファブリ・ペロー干渉計）を製造しても良い。 A plurality of microprojections 203 are provided on both the upper and lower surfaces of the substrate 201. The microprojections are circular with a diameter of 1 μm to 100 μm, more preferably 10 μm to 30 μm, and about 1 to 100,000 per 1 cm 2 are provided, more preferably 100 to 1000. The height of the microprojection 203 is 5 μm to several tens of μm. It is preferable to provide the minute protrusions 203 at the same positions on the upper surface and the lower surface. This is because the deflection of the substrate 201 when a force is applied is suppressed, and the distance between the partially transmitted mirror films can be kept constant. However, a tunable etalon (wavelength variable etalon) that bends the substrate 201 by adjusting the force applied to the substrate by shifting the positions where the plurality of microprojections 203 are provided on the upper surface and the lower surface to change the distance between the partially transmitted mirror films. A Fabry-Perot interferometer) may be manufactured.

スペーサー基板２０１の製造方法は、第１の実施形態におけるエンボスおよび部分透過ミラー膜付基板の製造方法と、部分透過ミラー膜を設ける工程を含まない点を除いて同様である。具体的には、厚さおよび平行度が精密に作られた平行平面基板２０２に対してエッチング加工を施すことによって複数の微小突起２０３を作ればよい。エッチング加工前の平行平面基板２０２の厚さがエタロンの部分透過ミラー膜間の間隔を決定するので、この厚さは製造するエタロンに応じて決定すればよい。 The method for manufacturing the spacer substrate 201 is the same as the method for manufacturing the substrate with the embossed and partially transmissive mirror film in the first embodiment, except that the step of providing the partially transmissive mirror film is not included. Specifically, a plurality of microprojections 203 may be formed by etching the parallel plane substrate 202 whose thickness and parallelism are precisely formed. Since the thickness of the parallel flat substrate 202 before etching determines the distance between the partially transmitted mirror films of etalon, this thickness may be determined according to the etalon to be manufactured.

図６（ｂ）は、部分透過ミラー膜付基板２０５の正面図および側面図である。部分透過ミラー膜付基板２０５は、ウェッジ基板２０６と、ウェッジ基板の２０６の一方の面２０６ａに設けられた反射防止膜２０７および他方の面２０６ｂに設けられた部分透過ミラー膜２０８から構成される。ウェッジ基板２０６は、一方の面２０６ａが他方の面２０６ｂに対して傾斜した構成となっている。反射防止膜２０７や部分透過ミラー膜２０８は、蒸着法やスパッタリング法などを用いて形成すればよい。エタロン２１０の製造のために、図６（ｂ）に示す部分透過ミラー膜付基板２０５を２つ用意する。 FIG. 6B is a front view and a side view of the substrate 205 with a partially transparent mirror film. The substrate 205 with a partially transmissive mirror film is composed of a wedge substrate 206, an antireflection film 207 provided on one surface 206a of the wedge substrate 206, and a partially transmissive mirror film 208 provided on the other surface 206b. The wedge substrate 206 has a configuration in which one surface 206a is inclined with respect to the other surface 206b. The antireflection film 207 and the partially transmissive mirror film 208 may be formed by a vapor deposition method, a sputtering method, or the like. For the production of the etalon 210, two substrates 205 with a partially transparent mirror film shown in FIG. 6B are prepared.

本実施形態においては、図６（ｃ）に示すように２枚のウェッジ基板の部分透過ミラー膜２０８が設けられた面の間に複数の微小突起付のスペーサー基板２０１を挟んで重ね合わせて空隙型エタロン２１０を製造する。図６（ｃ）に示すように、例えば、両面に接着剤を塗布した３つのスペーサー基板２０１を、部分透過ミラー膜付基板２０５の周縁部に１２０度の間隔で配置する。このように配置することで、スペーサー基板２０１の複数の微小突起２０３の頂部は、部分透過ミラー膜付基板２０５の部分透過ミラー膜が設けられた面のうち、部分透過ミラー膜が設けられていない部分の表面と接触するように接合される。このようにして製造することで、２枚の部分透過ミラー膜２０８の間の間隔と平行度を精度良く製造することができる。 In the present embodiment, as shown in FIG. 6C, a spacer substrate 201 having a plurality of microprojections is sandwiched between the surfaces of the two wedge substrates provided with the partially transparent mirror film 208, and the gaps are overlapped. Manufacture mold etalon 210. As shown in FIG. 6C, for example, three spacer substrates 201 coated with adhesive on both sides are arranged at intervals of 120 degrees on the peripheral edge of the substrate 205 with a partially transparent mirror film. By arranging in this way, the tops of the plurality of microprojections 203 of the spacer substrate 201 are not provided with the partially transmissive mirror film among the surfaces of the substrate 205 with the partially transmissive mirror film provided with the partially transmissive mirror film. It is joined so that it is in contact with the surface of the portion. By manufacturing in this way, the distance and parallelism between the two partially transmissive mirror films 208 can be manufactured with high accuracy.

この製造方法によれば、空隙型エタロン２１０を簡易に製造することができる。高精度の空隙型エタロンの従来の製造方法は、ミラー膜を数ｎｍの精度に平行に保つために、精密に研磨されたスペーサーを半導体製造レベルのクリーンルームにおいてオプティカルコンタクト（光学接着）を用いて接合しているが、この作業は熟練を要し歩留まりが低い。本実施形態の製造方法では、ほとんどの異物が複数の微小突起によって形成される空隙（エッチング等により除去された部分）に留まり、複数の微小突起と部分透過ミラー膜側の基板表面の間に異物を挟む確率が低いためクリーンベンチ程度の環境において、非熟練者であっても高い歩留まりを達成できる。そのため、製造コストを半分〜十分の一程度に低減可能である。 According to this manufacturing method, the void type etalon 210 can be easily manufactured. The conventional method of manufacturing high-precision void etalons is to join precision-polished spacers using optical contacts in a semiconductor-manufacturing-level clean room to keep the mirror film parallel to an accuracy of a few nm. However, this work requires skill and the yield is low. In the manufacturing method of the present embodiment, most of the foreign matter stays in the voids (portions removed by etching or the like) formed by the plurality of microprojections, and the foreign matter is between the plurality of microprojections and the substrate surface on the partially transmissive mirror film side. Since the probability of sandwiching is low, even an unskilled person can achieve a high yield in an environment such as a clean bench. Therefore, the manufacturing cost can be reduced to about half to one tenth.

また、基板の両面に部分透過ミラー膜を成膜するタイプのソリッドエタロンは、一般に、厚さを薄くすると面精度が悪くなるため、次数と次数の間の間隔（FSR: Free spectral
range）が狭く、半値全幅（FWMH）が広いため、フィネス（= FSR/FWMH）が小さくなってしまう。また、ソリッドエタロンの従来の製造方法は、数十層の多層膜コーティングを両面に施すために蒸着の歩留まりが低いという欠点がある。 In addition, solid etalon of the type that forms a partially transparent mirror film on both sides of the substrate generally has poor surface accuracy when the thickness is reduced, so the interval between orders (FSR: Free spectral)
Since the range) is narrow and the full width at half maximum (FWMH) is wide, the finesse (= FSR / FWMH) becomes small. Further, the conventional method for producing solid etalon has a drawback that the yield of vapor deposition is low because several tens of layers of multilayer coating are applied to both surfaces.

これに対して、本実施形態の製造方法を用いて製造される空隙型エタロン２１０は、面精度が高く、また、部分透過ミラー膜同士の間隔も狭くできるので、ソリッドエタロンよりも高いフィネスを達成することが可能である。また本実施形態では、部分透過ミラー膜を成膜する際の数十層の多層膜コーティング工程が１回で済む。したがって、基板の両面に部分透過ミラー膜が成膜された従来のソリッドエタロンよりも数割程度の歩留まり向上および製造コスト削減が可能である。 On the other hand, the void-type etalon 210 manufactured by the manufacturing method of the present embodiment achieves higher finesse than the solid etalon because the surface accuracy is high and the distance between the partially transmitted mirror films can be narrowed. It is possible to do. Further, in the present embodiment, only one multi-layer film coating step of several tens of layers is required when forming the partially transmissive mirror film. Therefore, it is possible to improve the yield and reduce the manufacturing cost by about several percent as compared with the conventional solid etalon in which the partially transparent mirror film is formed on both sides of the substrate.

上記の例では、接着剤を用いて部分透過ミラー膜付基板２０５とスペーサー基板２０１を接合しているが、接着剤を使用せずにボールプランジャなどを用いて基板を押さえつけて部分透過ミラー膜付基板２０５とスペーサー基板２０１とを固定しても良い。この場合、部分透過ミラー膜付基板２０５の周縁部（部分透過ミラー膜が設けられていない部分）と略同形状の、リング型のスペーサー基板を用いることも好ましい。スペーサー基板の位置ズレを抑制できるためである。 In the above example, the substrate 205 with a partially transparent mirror film and the spacer substrate 201 are joined using an adhesive, but the substrate is pressed down with a ball plunger or the like without using an adhesive to have a partially transparent mirror film. The substrate 205 and the spacer substrate 201 may be fixed. In this case, it is also preferable to use a ring-shaped spacer substrate having substantially the same shape as the peripheral portion of the substrate 205 with the partially transmissive mirror film (the portion where the partially transmissive mirror film is not provided). This is because the positional deviation of the spacer substrate can be suppressed.

本実施形態にかかる製造方法は、大気環境学、天文学、地球惑星科学、化学、生命科学あるいは医学などの各種の分野において使用される分光計測装置や分析装置などに用いるナローバンドフィルタや、化学製品、食品、衛生関連製品の製造装置や品質管理装置などに用いるナローバンドフィルタの製造に利用することができる。また、レーザー発信器に組み込むことによってレーザー光の波長選択および狭線化のための光学素子として利用することができる。 The manufacturing method according to this embodiment includes narrow band filters and chemical products used in spectroscopic measuring devices and analyzers used in various fields such as atmospheric environment science, astronomy, earth and planetary science, chemistry, life science, and medicine. It can be used for manufacturing narrow band filters used in manufacturing equipment for food and hygiene-related products and quality control equipment. Further, by incorporating it into a laser transmitter, it can be used as an optical element for wavelength selection and narrowing of laser light.

１０ 回折格子
１００ 基板（平行平面）１０２ 金属膜（ミラー膜） １０４ フォトレジスト
１０８ 微小突起 １１０ エンボスおよびミラー膜付基板 １１２ 分割基板
１１４ 接着剤 １１５ ミラー膜付基板積層ブロック １１６ 回折格子
１５０ エンボスおよび部分透過ミラー膜付基板 １５１ 平行平面基板
１５２ 周縁部 １５３ 微小突起 １５４ 中心部 １５５ 部分透過ミラー膜１６０ 部分透過ミラー膜付基板 １６１ ウェッジ基板 １６２ 部分透過ミラー膜１６３ 反射防止膜 １７０ エタロン １７１ 接着剤
１８０ 部分透過ミラー膜付基板 １８１ 平行平面基板 １８２ 部分透過ミラー膜１９０ エタロン １９１ 接着剤
２０１ スペーサー基板 ２０２ 平行平面基板 ２０３ 微小突起
２０５ 部分透過ミラー膜付基板 ２０６ ウェッジ基板 ２０７ 反射防止膜
２０８ 部分透過ミラー膜 ２１０ 空隙型エタロン
１０００ 平行平面基板 １００２ ミラー膜 １００４ ミラー膜付基板１００６ ミラー膜付基板積層ブロック １１００ 接着剤 １１０２ ビーズ（小球体） 10 Diffraction grating 100 Substrate (parallel plane) 102 Metal film (mirror film) 104 Photoresist 108 Microprojection 110 Embossed and mirror film substrate 112 Divided substrate 114 Adhesive 115 Mirror film substrate laminated block 116 Diffraction grating 150 Embossed and partially transparent Substrate with mirror film 151 Parallel plane substrate
152 Peripheral part 153 Micro-projection 154 Central part 155 Partial transmission mirror film 160 Partial transmission mirror film board 161 Wedge board 162 Partial transmission mirror film 163 Anti-reflection film 170 Etalon 171 Adhesive 180 Partial transmission mirror film board 181 Parallel plane substrate 182 Partially transparent mirror film 190 Etalon 191 Adhesive
201 Spacer substrate 202 Parallel plane substrate 203 Microprojection 205 Partial transmission mirror film substrate 206 Wedge substrate 207 Antireflection film 208 Partial transmission mirror film 210 Void type Etalon 1000 Parallel plane substrate 1002 Mirror film 1004 Mirror film substrate 1006 Mirror film substrate 1006 Laminated block 1100 Adhesive 1102 beads (small spheres)

Claims (12)

複数のミラー膜が所定の面間隔で平行に形成された光学素子の製造方法であって、
平行平面基板の一方あるいは両方の表面を部分的に除去して複数の微小突起（エンボス）を設けてエンボス付基板を用意し、
ミラー膜の間に前記エンボス付基板を介在させて複数のミラー膜を積層させ、
前記エンボス付基板を介在させて複数のミラー膜を積層させる際には、前記エンボス付基板の微小突起が設けられた表面に接着剤を塗布し、かつ、前記エンボス付基板と前記ミラー膜に対して荷重をかける、
ことを特徴とする光学素子の製造方法。 A method for manufacturing an optical element in which a plurality of mirror films are formed in parallel at predetermined surface intervals.
A substrate with embossing is prepared by partially removing one or both surfaces of the parallel flat substrate and providing a plurality of microprojections (embossing).
A plurality of mirror films are laminated by interposing the embossed substrate between the mirror films.
When a plurality of mirror films are laminated with the embossed substrate interposed therebetween, an adhesive is applied to the surface of the embossed substrate provided with microprojections, and the embossed substrate and the mirror film are covered with an adhesive. And apply load,
A method for manufacturing an optical element. 前記微小突起の頂部の平面形状は、直径が１０μｍ以上３０μｍ以下の略円形形状であり、
前記微小突起の数密度は、１ｃｍ２あたり１個以上１０００００個以下である、
請求項１に記載の光学素子の製造方法。 The planar shape of the top of the microprojection is a substantially circular shape having a diameter of 10 μm or more and 30 μm or less.
The number density of the microprojections is 1 or more and 100,000 or less per 1 cm 2 .
The method for manufacturing an optical element according to claim 1. ２つの部分透過ミラー膜が所定の面間隔で平行に形成された光学素子の製造方法であって、
平行平面基板の両方の表面を部分的に除去して複数の微小突起を設けてスペーサーとなる第１基板を用意する工程と、
一方の面に誘電体または金属の部分透過ミラー膜が設けられた２つの第２基板を用意する工程と、
前記第１基板を挟んで前記第２基板の前記部分透過ミラー膜が設けられた面同士が対向するように、前記２つの第２基板および前記第１基板を積層することにより、前記第１の基板を介在させて前記２つの部分透過ミラー膜を積層する工程と、
を含み、
前記第１の基板を介在させて２つの部分透過ミラー膜を積層させる際には、前記第１基板の微小突起が設けられた表面に接着剤を塗布し、かつ、前記第１基板と前記部分透過ミラー膜に対して荷重をかける、
ことを特徴とする光学素子の製造方法。 A method for manufacturing an optical element in which two partially transmissive mirror films are formed in parallel at a predetermined surface spacing.
A process of partially removing both surfaces of a parallel flat substrate and providing a plurality of microprojections to prepare a first substrate as a spacer.
A process of preparing two second substrates provided with a partially transparent mirror film of a dielectric or metal on one surface, and
The first substrate is formed by laminating the two second substrates and the first substrate so that the surfaces of the second substrate provided with the partially transmissive mirror film face each other with the first substrate interposed therebetween. The process of laminating the two partially transmissive mirror films with a substrate interposed therebetween.
Including
When laminating two partially transmissive mirror films with the first substrate interposed therebetween, an adhesive is applied to the surface of the first substrate provided with microprojections, and the first substrate and the portion are provided. Apply a load to the transmissive mirror film,
A method for manufacturing an optical element. ２つの部分透過ミラー膜が所定の面間隔で平行に形成された光学素子の製造方法であっ
て、
平行平面基板の一方の面の表面を部分的に除去して複数の微小突起を設ける工程と、前記平行平面基板の他方の面に誘電体または金属の部分透過ミラー膜を設ける工程と、を含む、第１基板を用意する工程と、
基板の一方の面の一部に誘電体または金属の部分透過ミラー膜を設けて、第２基板を用意する工程と、
前記第１基板を介在させて前記第１基板の部分透過ミラー膜と前記第２基板の部分透過ミラー膜を積層し、前記第１基板と前記第２基板とを、前記第１基板の複数の微小突起の頂部が前記第２基板の前記部分透過ミラー膜が設けられた面と接触するように接合する工程と、
を含み、
前記第１基板を介在させて前記第１基板の部分透過ミラー膜と前記第２基板の部分透過ミラー膜を積層する際には、前記第１基板と前記第２基板の間に接着剤を塗布し、かつ、前記第１基板と前記第２基板の前記部分透過ミラー膜とに対して荷重をかける、
ことを特徴とする光学素子の製造方法。 A method for manufacturing an optical element in which two partially transmissive mirror films are formed in parallel at a predetermined surface spacing.
The process includes a step of partially removing the surface of one surface of the parallel plane substrate to provide a plurality of microprojections, and a step of providing a dielectric or metal partially transparent mirror film on the other surface of the parallel plane substrate. , The process of preparing the first substrate,
A process of preparing a second substrate by providing a partially transparent mirror film of a dielectric or metal on a part of one surface of the substrate.
The partially transmissive mirror film of the first substrate and the partially transmissive mirror film of the second substrate are laminated with the first substrate interposed therebetween, and the first substrate and the second substrate are combined with a plurality of the first substrate. A step of joining the tops of the microprojections so as to be in contact with the surface of the second substrate provided with the partially transparent mirror film.
Including
When the partially transmissive mirror film of the first substrate and the partially transmissive mirror film of the second substrate are laminated with the first substrate interposed therebetween , an adhesive is applied between the first substrate and the second substrate. In addition, a load is applied to the first substrate and the partially transparent mirror film of the second substrate.
A method for manufacturing an optical element. ２つの部分透過ミラー膜が所定の面間隔で平行に形成された光学素子の製造方法であって、
平行平面基板の一方の面の表面を部分的に除去して複数の微小突起を設ける工程と、前記平行平面基板の他方の面に誘電体または金属の部分透過ミラー膜を設ける工程と、を含む、第１基板を用意する工程と、
平行平面基板の一方の面の一部に誘電体または金属の部分透過ミラー膜を設けて、第２基板を用意する工程と、
前記第１基板および前記第２基板を介在させて前記第１基板の部分透過ミラー膜と前記第２基板の部分透過ミラー膜を積層し、前記第１基板と前記第２基板とを、前記第１基板の複数の微小突起の頂部が前記第２基板の前記部分透過ミラー膜が設けられていない面と接触するように接合する工程と、
を含み、
前記第１基板および前記第２基板を介在させて前記第１基板の部分透過ミラー膜と前記第２基板の部分透過ミラー膜を積層する際には、前記第１基板と前記第２基板の間に接着剤を塗布し、かつ、前記第１基板と前記第２基板とに対して荷重をかける、
ことを特徴とする光学素子の製造方法。 A method for manufacturing an optical element in which two partially transmissive mirror films are formed in parallel at a predetermined surface spacing.
The process includes a step of partially removing the surface of one surface of the parallel plane substrate to provide a plurality of microprojections, and a step of providing a dielectric or metal partially transparent mirror film on the other surface of the parallel plane substrate. , The process of preparing the first substrate,
A process of preparing a second substrate by providing a dielectric or metal partially transmissive mirror film on a part of one surface of the parallel plane substrate.
The partially transmissive mirror film of the first substrate and the partially transmissive mirror film of the second substrate are laminated with the first substrate and the second substrate interposed therebetween, and the first substrate and the second substrate are combined with each other. A step of joining the tops of a plurality of microprojections on one substrate so as to be in contact with a surface of the second substrate on which the partially transparent mirror film is not provided.
Including
When the partially transmissive mirror film of the first substrate and the partially transmissive mirror film of the second substrate are laminated with the first substrate and the second substrate interposed therebetween, between the first substrate and the second substrate. An adhesive is applied to the first substrate and a load is applied to the first substrate and the second substrate.
A method for manufacturing an optical element. 複数のミラー膜が所定の面間隔で平行に形成された光学素子の製造方法であって、
平行平面基板の一方の表面を部分的に除去して複数の微小突起を設ける工程と、前記平行平面基板の他方の面にスパッタリング法によりミラー膜を設ける工程と、を含む、複数の微小突起およびミラー膜が設けられたエンボスおよびミラー膜付基板を複数用意する工程と、
前記複数のエンボスおよびミラー膜付基板を、複数の微小突起が設けられた面とミラー膜が設けられた面とが接触するように積層することにより、前記平行平面基板を介在させて複数のミラー膜を積層する工程と、
を含み、
前記平行平面基板を介在させて複数のミラー膜を積層する際には、前記複数のエンボスおよびミラー膜付基板の間に接着剤を塗布し、かつ、互いに接触している前記平行平面基板と前記ミラー膜に対して荷重をかける、
ことを特徴とする光学素子の製造方法。 A method for manufacturing an optical element in which a plurality of mirror films are formed in parallel at predetermined surface intervals.
A plurality of microprojections and a step of providing a plurality of microprojections by partially removing one surface of the parallel plane substrate and a step of providing a mirror film on the other surface of the parallel plane substrate by a sputtering method. A process of preparing a plurality of embossed and mirror film-attached substrates provided with a mirror film, and
By laminating the plurality of embossed and mirror film-attached substrates so that the surface provided with the plurality of microprojections and the surface provided with the mirror film are in contact with each other, the plurality of mirrors are interposed with the parallel plane substrate interposed therebetween. The process of laminating the film and
Including
When a plurality of mirror films are laminated with the parallel plane substrate interposed therebetween, an adhesive is applied between the plurality of embossed and mirror film-attached substrates, and the parallel plane substrate and the above are in contact with each other. Apply a load to the mirror film,
A method for manufacturing an optical element. 複数のミラー膜が所定の面間隔で平行に形成された光学素子であって、
複数のミラー膜と、
一方の面に複数の微小突起が基板と一体に設けられ他方の面が平面であるか、両方の面
に複数の微小突起が基板と一体に設けられたエンボス付基板と、
を含み、
前記エンボス付基板のそれぞれの面に設けられた複数の微小突起の頂部は同一平面内に位置し、
一方の面の複数の微小突起の頂部を含む平面と他方の表面（平面）が所定の面間隔で平行であるか、一方の面の複数の微小突起の頂部を含む平面と他方の面の複数の微小突起の頂部を含む平面が所定の面間隔で平行であり、
前記複数のミラー膜の間に前記エンボス付基板が配置されている、
光学素子。 An optical element in which a plurality of mirror films are formed in parallel at predetermined surface intervals.
With multiple mirror films,
An embossed substrate in which a plurality of microprojections are integrally provided with a substrate on one surface and the other surface is flat, or a plurality of microprojections are provided integrally with a substrate on both surfaces.
Including
The tops of the plurality of microprojections provided on the respective surfaces of the embossed substrate are located in the same plane.
A plane containing the tops of a plurality of microprojections on one surface and the other surface (plane) are parallel to each other at a predetermined surface spacing, or a plane containing the tops of a plurality of microprojections on one surface and a plurality of the other surface. The planes containing the tops of the microprojections are parallel at predetermined surface spacing,
The embossed substrate is arranged between the plurality of mirror films.
Optical element. 前記微小突起の頂部の平面形状は、直径が１０μｍ以上３０μｍ以下の略円形形状であり、
前記微小突起の数密度は、１ｃｍ２あたり１個以上１０００００個以下である、
請求項７に記載の光学素子。 The planar shape of the top of the microprojection is a substantially circular shape having a diameter of 10 μm or more and 30 μm or less.
The number density of the microprojections is 1 or more and 100,000 or less per 1 cm 2 .
The optical element according to claim 7. ２つの部分透過ミラー膜が所定の面間隔で平行に形成されたエタロンであって、
基板の片面に部分透過ミラー膜が設けられた２つの部分透過ミラー付基板と、
両面に複数の微小突起が基板と一体に設けられたスペーサーとなるエンボス付基板と、
を有し、
前記エンボス付基板のそれぞれの面に設けられた複数の微小突起の頂部は同一平面内に位置し、
前記エンボス付基板の一方の面の複数の微小突起の頂部を含む平面と他方の面の複数の微小突起の頂部を含む平面が所定の面間隔で平行であり、
前記２つの部分透過ミラー付基板の部分透過ミラー膜の間に前記エンボス付基板が配置されており、
前記エンボス付基板を挟んで前記部分透過ミラー付基板の前記部分透過ミラー膜が設けられた面同士が対向するように、前記２つの部分透過ミラー付基板と前記エンボス付基板とが積層されている、
ことを特徴とするエタロン。 Etalon in which two partially transmissive mirror films are formed in parallel at a predetermined surface spacing.
A substrate with two partially transmissive mirrors provided with a partially transmissive mirror film on one side of the substrate,
An embossed substrate that serves as a spacer with multiple microprojections on both sides integrally provided with the substrate.
Have,
The tops of the plurality of microprojections provided on the respective surfaces of the embossed substrate are located in the same plane.
The plane including the tops of the plurality of microprojections on one surface of the embossed substrate and the plane including the tops of the plurality of microprojections on the other surface are parallel at a predetermined surface spacing.
The embossed substrate is arranged between the partially transmissive mirror films of the two partially transmissive mirror-equipped substrates.
The two partially transmissive mirror-equipped substrates and the embossed substrate are laminated so that the surfaces of the partially transmissive mirror-equipped substrate on which the partially transmissive mirror film is provided face each other with the embossed substrate interposed therebetween. ,
Etalon characterized by that. ２つの部分透過ミラー膜が所定の面間隔で平行に形成されたエタロンであって、
一方の面に複数の微小突起が基板と一体に設けられ、他方の面が平面であり、当該他方の面に部分透過ミラー膜が設けられたエンボス付基板と、
片面に部分透過ミラー膜が設けられた部分透過ミラー付基板と、
を有し、
前記エンボス付基板の前記一方の面に設けられた複数の微小突起の頂部は同一平面内に位置し、
前記エンボス付基板の一方の面の複数の微小突起の頂部を含む平面と他方の表面（平面）が所定の面間隔で平行であり、
前記エンボス付基板の部分透過ミラー膜と前記部分透過ミラー付基板の部分透過ミラー膜の間に前記基板が配置されており、
前記エンボス付基板と前記部分透過ミラー付基板とが、前記エンボス付基板の前記複数の微小突起の頂部が前記部分透過ミラー付基板の前記部分透過ミラー膜が設けられた面と接触するように接合されている、
ことを特徴とするエタロン。 Etalon in which two partially transmissive mirror films are formed in parallel at a predetermined surface spacing.
An embossed substrate in which a plurality of microprojections are provided integrally with the substrate on one surface, the other surface is a flat surface, and a partially transparent mirror film is provided on the other surface.
A substrate with a partially transmissive mirror provided with a partially transmissive mirror film on one side,
Have,
The tops of the plurality of microprojections provided on the one surface of the embossed substrate are located in the same plane.
The plane including the tops of the plurality of microprojections on one surface of the embossed substrate and the other surface (plane) are parallel at a predetermined surface spacing.
The substrate is arranged between the partially transmissive mirror film of the embossed substrate and the partially transmissive mirror film of the partially transmissive mirror-equipped substrate.
The embossed substrate and the partially transmissive mirror-equipped substrate are joined so that the tops of the plurality of microprojections of the embossed substrate are in contact with the surface of the partially transmissive mirror-equipped substrate provided with the partially transmissive mirror film. Has been
Etalon characterized by that. ２つの部分透過ミラー膜が所定の面間隔で平行に形成されたエタロンであって、
一方の面に複数の微小突起が基板と一体に設けられ、他方の面が平面であり、当該他方の面に部分透過ミラー膜が設けられたエンボス付基板と、
平行平面基板の片面に部分透過ミラー膜が設けられた部分透過ミラー付基板と、
を有し、
前記エンボス付基板の前記一方の面に設けられた複数の微小突起の頂部は同一平面内に位置し、
前記エンボス付基板の一方の面の複数の微小突起の頂部を含む平面と他方の表面（平面）が所定の面間隔で平行であり、
前記エンボス付基板の部分透過ミラー膜と前記部分透過ミラー付基板の部分透過ミラー膜の間に前記基板および前記平行平面基板が配置されており、
前記エンボス付基板と前記部分透過ミラー付基板とが、前記エンボス付基板の前記複数の微小突起の頂部が前記部分透過ミラー付基板の前記部分透過ミラー膜が設けられていない面と接触するように接合されている、
ことを特徴とするエタロン。 Etalon in which two partially transmissive mirror films are formed in parallel at a predetermined surface spacing.
Provided multiple microprotrusions integrally with the substrate on one surface, a second surface plane, and the embossed substrate with a partial transmission mirror film to the other surface is provided,
A substrate with a partially transmissive mirror provided with a partially transmissive mirror film on one side of a parallel plane substrate,
Have,
The tops of the plurality of microprojections provided on the one surface of the embossed substrate are located in the same plane.
The plane including the tops of the plurality of microprojections on one surface of the embossed substrate and the other surface (plane) are parallel at a predetermined surface spacing.
The substrate and the parallel plane substrate are arranged between the partially transmissive mirror film of the embossed substrate and the partially transmissive mirror film of the partially transmissive mirror-equipped substrate.
The embossed substrate and the partially transmissive mirror-equipped substrate contact the tops of the plurality of microprojections of the embossed substrate with the surface of the partially transmissive mirror-equipped substrate on which the partially transmissive mirror film is not provided. Joined,
Etalon characterized by that. 複数のミラー膜が所定の面間隔で平行に形成された回折格子であって、
一方の面に複数の微小突起が基板と一体に設けられており、他方の面が平面であり、当該他方の面にミラー膜が設けられた、複数のエンボス付基板を有し、
前記エンボス付基板の前記一方の面に設けられた複数の微小突起の頂部は同一平面内に位置し、
前記エンボス付基板の一方の面の複数の微小突起の頂部を含む平面と他方の表面（平面）が所定の面間隔で平行であり、
前記複数のミラー膜の間に前記基板が配置されており、
複数の前記エンボス付基板が、複数の微小突起の頂部とミラー膜が設けられた面とが接触するように積層されている、
ことを特徴とする回折格子。 A diffraction grating in which a plurality of mirror films are formed in parallel at predetermined surface intervals.
Provided multiple microprotrusions integrally with the substrate on one surface, a second surface is planar, has a mirror layer on the other surface are provided, a plurality of the embossed substrate with,
The tops of the plurality of microprojections provided on the one surface of the embossed substrate are located in the same plane.
The plane including the tops of the plurality of microprojections on one surface of the embossed substrate and the other surface (plane) are parallel at a predetermined surface spacing.
The substrate is arranged between the plurality of mirror films.
A plurality of the embossed substrates are laminated so that the tops of the plurality of microprojections and the surface provided with the mirror film are in contact with each other.
A diffraction grating characterized in that.
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