JP6755911B2 - 半導体素子パッケージ - Google Patents
半導体素子パッケージ Download PDFInfo
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- JP6755911B2 JP6755911B2 JP2018165079A JP2018165079A JP6755911B2 JP 6755911 B2 JP6755911 B2 JP 6755911B2 JP 2018165079 A JP2018165079 A JP 2018165079A JP 2018165079 A JP2018165079 A JP 2018165079A JP 6755911 B2 JP6755911 B2 JP 6755911B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
Claims (6)
- 底面および側壁を含むキャビティを含む金属胴体と、
前記キャビティ内に配置される発光素子と、
前記金属胴体の底面に配置され、第1貫通ホールおよび第2貫通ホールを含む樹脂部と、
前記金属胴体上に配置される透光部材と、を含み、
前記金属胴体は、第1金属胴体と、第2金属胴体と、前記第1金属胴体と前記第2金属胴体との間に配置される絶縁部材と、を含み、
前記第1金属胴体の一部、前記第2金属胴体の一部、および、前記絶縁部材の一部は、前記キャビティの底面に位置し、
前記発光素子は、前記第1金属胴体の一部および前記第2金属胴体の一部と電気的に連結され、
前記第1金属胴体および前記第2金属胴体それぞれは、前記金属胴体の底面から突出した第1突出部および第2突出部をそれぞれ含み、
前記金属胴体は、前記第1突出部および前記第2突出部と前記絶縁部材との間の第1領域と、前記第1突出部および前記第2突出部と前記キャビティの底面とが垂直に重なる第2領域と、前記キャビティの外側に配置されて前記金属胴体の最上部面と重なる第3領域と、を含み、
前記第1領域の厚さは前記第2領域の厚さより薄く、
前記第2領域の厚さは前記第3領域の厚さより薄く、
前記第3領域は、前記キャビティから最も遠い領域の厚さが、前記キャビティから最も近い領域の厚さより薄く、
前記第1突出部および前記第2突出部は、前記第1貫通ホールおよび前記第2貫通ホール内にそれぞれ配置され、
前記第1突出部は前記第2突出部より大きく、
前記発光素子は紫外線光を出射し、前記第1突出部および前記第2突出部はアルミニウムを含み、
前記金属胴体は、前記第1金属胴体および前記第2金属胴体の底面に設置されている第1溝と、前記第1突出部と前記第2突出部との間に設置されている第2溝と、を含み、
前記第1溝は前記金属胴体の周辺に沿って閉ループ形状に形成されて前記第1金属胴体および前記第2金属胴体の底面が露出し、
前記第2溝は両終端が前記第1溝と連結され、
前記第1溝および前記第2溝には前記樹脂部が配置され、
前記第2溝の水平方向の幅は前記絶縁部材の水平方向の幅より大きく、
前記第1溝および前記第2溝に配置された樹脂部の材質は前記絶縁部材の材質と異なる、発光素子パッケージ。 - 前記第1突出部と前記第2突出部の面積比は1:0.2〜1:0.6である、請求項1に記載の半導体素子パッケージ。
- 前記第1突出部と前記第2突出部との間の間隔は前記絶縁部材の幅より大きい、請求項1に記載の半導体素子パッケージ。
- 前記第2溝の水平方向の幅は前記第1溝に配置された樹脂部の水平方向の幅より大きい、請求項1に記載の発光素子パッケージ。
- 前記第1溝に配置された樹脂部の高さは前記第2溝に配置された樹脂部の高さより高い、請求項4に記載の発光素子パッケージ。
- 前記キャビティ内の前記発光素子は100nm〜280nmの範囲にピーク波長を含む光を放射するように構成される、請求項1に記載の発光素子パッケージ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0113439 | 2017-09-05 | ||
KR20170113439 | 2017-09-05 | ||
KR10-2018-0101576 | 2018-08-28 | ||
KR1020180101576A KR102641336B1 (ko) | 2017-09-05 | 2018-08-28 | 반도체 소자 패키지 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019047123A JP2019047123A (ja) | 2019-03-22 |
JP2019047123A5 JP2019047123A5 (ja) | 2019-06-13 |
JP6755911B2 true JP6755911B2 (ja) | 2020-09-16 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2018165079A Active JP6755911B2 (ja) | 2017-09-05 | 2018-09-04 | 半導体素子パッケージ |
Country Status (5)
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US (1) | US11335843B2 (ja) |
JP (1) | JP6755911B2 (ja) |
KR (1) | KR102641336B1 (ja) |
CN (1) | CN109427946B (ja) |
TW (1) | TWI802587B (ja) |
Families Citing this family (4)
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KR102650690B1 (ko) * | 2018-10-23 | 2024-03-25 | 주식회사 루멘스 | Uv led 패키지 |
CN113646908A (zh) * | 2019-07-25 | 2021-11-12 | 株式会社大真空 | 发光装置的盖构件、盖构件的制造方法及发光装置 |
JP7370274B2 (ja) * | 2020-02-18 | 2023-10-27 | 日機装株式会社 | 半導体パッケージ及び半導体発光装置 |
JP7450466B2 (ja) * | 2020-06-22 | 2024-03-15 | スタンレー電気株式会社 | 発光装置及び発光装置の製造方法 |
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KR101668353B1 (ko) * | 2014-11-03 | 2016-10-21 | (주)포인트엔지니어링 | 칩 기판 및 칩 패키지 모듈 |
JP6765804B2 (ja) * | 2014-11-28 | 2020-10-07 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
US10211378B2 (en) * | 2016-01-29 | 2019-02-19 | Nichia Corporation | Light emitting device and method for manufacturing same |
US9893250B1 (en) * | 2016-12-16 | 2018-02-13 | Nichia Corporation | Light emitting device having silicone resin-based sealing member |
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2018
- 2018-08-28 KR KR1020180101576A patent/KR102641336B1/ko active IP Right Grant
- 2018-08-31 US US16/119,469 patent/US11335843B2/en active Active
- 2018-09-04 JP JP2018165079A patent/JP6755911B2/ja active Active
- 2018-09-04 TW TW107131008A patent/TWI802587B/zh active
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TWI802587B (zh) | 2023-05-21 |
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CN109427946A (zh) | 2019-03-05 |
KR20190026581A (ko) | 2019-03-13 |
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US11335843B2 (en) | 2022-05-17 |
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