JP6744432B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
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- JP6744432B2 JP6744432B2 JP2018563227A JP2018563227A JP6744432B2 JP 6744432 B2 JP6744432 B2 JP 6744432B2 JP 2018563227 A JP2018563227 A JP 2018563227A JP 2018563227 A JP2018563227 A JP 2018563227A JP 6744432 B2 JP6744432 B2 JP 6744432B2
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- shield
- conductor
- magnetic field
- power conversion
- conversion device
- Prior art date
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- 239000004020 conductor Substances 0.000 claims description 56
- 238000001514 detection method Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 239000012212 insulator Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/207—Constructional details independent of the type of device used
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0003—Details of control, feedback or regulation circuits
- H02M1/0009—Devices or circuits for detecting current in a converter
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inverter Devices (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
Claims (6)
- 電力を変換する電力変換回路と、
前記電力変換回路に電流を伝達する導体と、
前記電流を検出するコアレス電流センサと、を備え、
前記コアレス電流センサは、前記電流の磁界を検出する磁界検出部と、当該磁界検出部と向き合うシールド部と、を有し、
前記導体は、前記磁界検出部と前記シールド部の間の空間を通る第1導体部と、第1屈曲部を介して当該第1導体部と接続される第2導体部と、を備え、
前記第1屈曲部は、前記第2導体部のうち前記シールド部に最も近い面に対して直角方向の領域が前記磁界検出部と前記シールド部の間の空間に配置されないように形成される電力変換装置。 - 請求項1に記載の電力変換装置であって、
前記導体は、前記第1導体部を挟んで前記第1屈曲部とは反対側に配置された第2屈曲部を介して当該第1導体部と接続される第3導体部を備え、
前記第2屈曲部は、前記第3導体部のうち前記シールド部に最も近い面に対して直角方向の領域が前記磁界検出部と前記シールド部の間の空間に配置されないように形成される電力変換装置。 - 請求項1に記載の電力変換装置であって、
前記シールド部と前記導体を支持する第1絶縁体と、
前記第1絶縁体を埋設する第2絶縁体と、を備え、
前記第1絶縁体は、前記導体のうち前記第1導体部と前記第1屈曲部を支持する位置まで延在される電力変換装置。 - 請求項1ないし3に記載のいずれかの電力変換装置であって、
前記シールド部は、第1シールド部と第2シールド部により前記磁界検出部を囲み、
前記第2シールド部は、当該第2シールド部の端部が前記第1シールド部の端部と前記第1導体部に挟まれるように形成され、
前記磁界検出部と前記シールド部の間の前記空間は、前記磁界検出部と前記第2シールド部に対応する電力変換装置。 - 請求項1ないし4に記載のいずれかの電力変換装置であって、
前記第2導体部は、断面が矩形状の平面導体であり、
前記第1屈曲部は、前記第2導体部の最も広い面に対して直角方向において、前記磁界検出部と前記シールド部の間の空間が配置されないように形成される電力変換装置。 - 請求項1ないし5に記載のいずれかの電力変換装置であって、
前記第2導体部は、断面が略円形又は楕円形を為す電力変換装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017005515 | 2017-01-17 | ||
JP2017005515 | 2017-01-17 | ||
PCT/JP2017/045438 WO2018135213A1 (ja) | 2017-01-17 | 2017-12-19 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018135213A1 JPWO2018135213A1 (ja) | 2019-11-07 |
JP6744432B2 true JP6744432B2 (ja) | 2020-08-19 |
Family
ID=62908305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018563227A Active JP6744432B2 (ja) | 2017-01-17 | 2017-12-19 | 電力変換装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10794937B2 (ja) |
JP (1) | JP6744432B2 (ja) |
CN (1) | CN110178303B (ja) |
DE (1) | DE112017006380T5 (ja) |
WO (1) | WO2018135213A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021208350A1 (de) | 2021-08-02 | 2023-02-02 | Zf Friedrichshafen Ag | AC-Stromschienenträger für Inverter zum Betreiben eines elektrischen Antriebs eines Elektrofahrzeugs oder eines Hybridfahrzeugs, Inverter |
DE102021208787A1 (de) | 2021-08-11 | 2023-02-16 | Zf Friedrichshafen Ag | AC-Stromschienenträger für Inverter zum Betreiben eines elektrischen Antriebs eines Elektrofahrzeugs oder eines Hybridfahrzeugs, Inverter |
WO2024132216A1 (en) * | 2022-12-22 | 2024-06-27 | Eaton Intelligent Power Limited | Packaging of integrated power modules |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005321206A (ja) * | 2004-05-06 | 2005-11-17 | Mitsubishi Electric Corp | 電流検出装置 |
JP4833111B2 (ja) | 2006-09-20 | 2011-12-07 | 株式会社東海理化電機製作所 | 電流検出器 |
JP5418811B2 (ja) * | 2009-01-30 | 2014-02-19 | アイシン・エィ・ダブリュ株式会社 | 電流検出装置 |
JP5207085B2 (ja) | 2010-03-09 | 2013-06-12 | アイシン・エィ・ダブリュ株式会社 | 電流検出装置 |
JP5692899B2 (ja) * | 2010-09-24 | 2015-04-01 | 矢崎総業株式会社 | 電流検出装置およびその取付構造 |
JP5632078B2 (ja) * | 2011-05-20 | 2014-11-26 | 本田技研工業株式会社 | コアレス電流センサ構造体、コアレス電流センサ及び電流検知方法 |
JP5338932B2 (ja) * | 2011-07-26 | 2013-11-13 | 株式会社デンソー | 電力変換装置 |
JP2015175757A (ja) | 2014-03-17 | 2015-10-05 | トヨタ自動車株式会社 | 電流センサ |
JP6416571B2 (ja) * | 2014-09-25 | 2018-10-31 | 日立オートモティブシステムズ株式会社 | 電流検出装置 |
JP2016100943A (ja) * | 2014-11-19 | 2016-05-30 | 株式会社ケーヒン | 電力変換装置 |
JP6190835B2 (ja) * | 2015-03-06 | 2017-08-30 | 株式会社タムラ製作所 | 電流センサ装置 |
-
2017
- 2017-12-19 JP JP2018563227A patent/JP6744432B2/ja active Active
- 2017-12-19 WO PCT/JP2017/045438 patent/WO2018135213A1/ja active Application Filing
- 2017-12-19 DE DE112017006380.9T patent/DE112017006380T5/de active Pending
- 2017-12-19 US US16/478,467 patent/US10794937B2/en active Active
- 2017-12-19 CN CN201780083223.0A patent/CN110178303B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10794937B2 (en) | 2020-10-06 |
CN110178303A (zh) | 2019-08-27 |
DE112017006380T5 (de) | 2019-09-05 |
WO2018135213A1 (ja) | 2018-07-26 |
JPWO2018135213A1 (ja) | 2019-11-07 |
US20190361053A1 (en) | 2019-11-28 |
CN110178303B (zh) | 2021-04-23 |
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