JP6717351B2 - Method for manufacturing light emitting module - Google Patents

Method for manufacturing light emitting module Download PDF

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JP6717351B2
JP6717351B2 JP2018191219A JP2018191219A JP6717351B2 JP 6717351 B2 JP6717351 B2 JP 6717351B2 JP 2018191219 A JP2018191219 A JP 2018191219A JP 2018191219 A JP2018191219 A JP 2018191219A JP 6717351 B2 JP6717351 B2 JP 6717351B2
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light
light emitting
recess
guide plate
emitting element
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JP2020057748A (en
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大輔 笠井
大輔 笠井
章 三木
章 三木
啓 橋本
啓 橋本
真一 大黒
真一 大黒
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Nichia Corp
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Nichia Corp
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Description

本発明は、発光モジュールの製造方法に関する。 The present invention relates to a method for manufacturing a light emitting module.

発光ダイオード等の発光素子を用いた発光装置は、液晶ディスプレイのバックライトやディスプレイ等の各種の光源として広く利用されている。
例えば、特許文献１に開示される光源装置は、実装基板に実装される複数の発光素子と、複数の発光素子のそれぞれを封止する半球状のレンズ部材とその上に配置された発光素子からの光が入射される拡散部材を備える。
さらに、特許文献２に開示される発光装置は、封止樹脂層と蛍光体層を一体化した２層シートを発光素子の上面に固着して、その側面を反射樹脂で覆っている。 A light emitting device using a light emitting element such as a light emitting diode is widely used as various light sources such as a backlight of a liquid crystal display and a display.
For example, the light source device disclosed in Patent Document 1 includes a plurality of light emitting elements mounted on a mounting substrate, a hemispherical lens member that seals each of the plurality of light emitting elements, and a light emitting element arranged on the hemispherical lens member. Is provided with a diffusing member.
Further, in the light emitting device disclosed in Patent Document 2, a two-layer sheet in which a sealing resin layer and a phosphor layer are integrated is fixed to the upper surface of the light emitting element, and the side surface thereof is covered with a reflective resin.

特開２０１５−３２３７３号公報JP, 2015-32373, A 特開２０１６−１１５７０３号公報JP, 2016-115703, A

しかしながら、特許文献１のような光源装置では、実装基板と拡散板との間の距離をレンズ部材の厚みよりも大きくする必要があり、十分な薄型化が達成できない可能性がある。また、特許文献２の発光装置では、複数の発光素子からの光を均一に分散して照射できず、輝度ムラの少ない発光特性が要求される用途に使用できない。 However, in the light source device as in Patent Document 1, it is necessary to make the distance between the mounting substrate and the diffusion plate larger than the thickness of the lens member, and there is a possibility that sufficient thinning cannot be achieved. Further, the light emitting device of Patent Document 2 cannot uniformly disperse and irradiate light from a plurality of light emitting elements, and cannot be used for applications requiring light emitting characteristics with less unevenness in brightness.

本発明は、輝度ムラの少ない発光特性を実現可能な発光モジュールの製造方法を提供することを目的とする。 An object of the present invention is to provide a method for manufacturing a light emitting module capable of realizing a light emitting characteristic with less uneven brightness.

以上の目的を達成するために、本発明に係る発光モジュールの製造方法は、発光素子を含む発光体と、外部に光を放射する発光面となる第一主面と、第一主面の反対側の面であって凹部を備える第二主面とを有し、断面視において、凹部が、凹部の開口部の大きさよりも小さい底面と、側面とを含む、透光性の導光板とを準備する工程と、発光体を、接合部材を介して凹部の底面に固着する工程と、発光素子の電極に配線を形成する工程と、を含む、発光モジュールの製造方法。 In order to achieve the above object, a method for manufacturing a light emitting module according to the present invention includes a light emitting body including a light emitting element, a first main surface serving as a light emitting surface that emits light to the outside, and an opposite of the first main surface. A second main surface that is a surface on the side and has a recess, and in a cross-sectional view, the recess has a bottom surface smaller than the size of the opening of the recess, and a translucent light guide plate that includes a side surface. A method of manufacturing a light emitting module, comprising: a step of preparing, a step of fixing a light emitting body to a bottom surface of a recess via a bonding member, and a step of forming wiring on an electrode of a light emitting element.

本発明に係る発光モジュールの製造方法によれば、輝度ムラの少ない発光モジュールを実現できる。 According to the method for manufacturing a light emitting module of the present invention, it is possible to realize a light emitting module with less uneven brightness.

実施形態にかかる液晶ディスプレイ装置の各構成を示す構成図である。It is a block diagram which shows each structure of the liquid crystal display device concerning embodiment. 一実施形態にかかる発光モジュールの模式平面図である。It is a schematic plan view of the light emitting module concerning one embodiment. 一実施形態にかかる発光モジュールの一部拡大模式断面図であって、導光板を下にして上下を反転した図である。FIG. 3 is a partially enlarged schematic cross-sectional view of a light emitting module according to one embodiment, and is a diagram in which a light guide plate is turned down and the top and bottom are inverted. 他の実施形態にかかる発光モジュールの模式底面図である。It is a schematic bottom view of the light emitting module concerning other embodiment. 凹部の変形例を示す模式断面図である。It is a schematic cross section which shows the modification of a recessed part. 凹部の変形例を示す模式断面図である。It is a schematic cross section which shows the modification of a recessed part. 凹部の変形例を示す模式断面図である。It is a schematic cross section which shows the modification of a recessed part. 他の実施形態にかかる発光モジュールの拡大模式断面図である。It is an expansion schematic cross section of the light emitting module concerning other embodiment. 他の実施形態にかかる発光モジュールの拡大模式断面図である。It is an expansion schematic cross section of the light emitting module concerning other embodiment. 発光ユニットの製造工程の一例を示す拡大模式断面図である。It is an expansion schematic cross section which shows an example of the manufacturing process of a light emitting unit. 発光ユニットの製造工程の一例を示す拡大模式断面図である。It is an expansion schematic cross section which shows an example of the manufacturing process of a light emitting unit. 発光モジュールの製造工程の一例を示す拡大模式断面図である。It is an expanded schematic cross section which shows an example of the manufacturing process of a light emitting module. 発光モジュールの製造工程の一例を示す拡大模式断面図である。It is an expanded schematic cross section which shows an example of the manufacturing process of a light emitting module. 発光モジュールの製造工程の一例を示す拡大模式断面図である。It is an expanded schematic cross section which shows an example of the manufacturing process of a light emitting module. マスクの変形例を示す模式断面図である。It is a schematic cross section which shows the modification of a mask. 他の実施形態にかかる発光体の製造工程の一例を示す拡大模式断面図である。It is an expanded schematic cross section which shows an example of the manufacturing process of the light-emitting body concerning other embodiment. 他の実施形態にかかる発光体の製造工程の一例を示す拡大模式断面図である。It is an expanded schematic cross section which shows an example of the manufacturing process of the light-emitting body concerning other embodiment. 他の実施形態にかかる発光体の製造工程の一例を示す拡大模式断面図である。It is an expanded schematic cross section which shows an example of the manufacturing process of the light-emitting body concerning other embodiment. 他の実施形態にかかる発光モジュールの拡大模式断面図である。It is an expansion schematic cross section of the light emitting module concerning other embodiment. 図３に示す発光モジュールに回路基板を接続する一例を示す拡大模式断面図である。FIG. 4 is an enlarged schematic cross-sectional view showing an example of connecting a circuit board to the light emitting module shown in FIG. 3.

以下、図面に基づいて本発明を詳細に説明する。なお、以下の説明では、必要に応じて特定の方向や位置を示す用語（例えば、「上」、「下」、及びそれらの用語を含む別の用語）を用いるが、それらの用語の使用は図面を参照した発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が制限されるものではない。また、複数の図面に表れる同一符号の部分は同一もしくは同等の部分又は部材を示す。 Hereinafter, the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a particular direction or position (eg, “upper”, “lower”, and other terms including those terms) are used as necessary, but the use of those terms is not allowed. The purpose is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the invention is not limited by the meanings of the terms. Further, the portions having the same reference numerals appearing in a plurality of drawings indicate the same or equivalent portions or members.

さらに、以下に示す実施形態は、本発明の技術思想を具体化するための発光モジュールを例示するものであって、本発明を以下に限定するものではない。また、以下に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、例示することを意図したものである。また、一の実施の形態、実施例において説明する内容は、他の実施の形態、実施例にも適用可能である。また、図面が示す部材の大きさや位置関係等は、説明を明確にするため、誇張していることがある。 Furthermore, the embodiments described below exemplify a light emitting module for embodying the technical idea of the present invention, and the present invention is not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention thereto, unless specifically stated, and are merely exemplified. It was intended. Further, the contents described in one embodiment and example can be applied to other embodiments and examples. In addition, the sizes and positional relationships of members shown in the drawings may be exaggerated in order to clarify the explanation.

（液晶ディスプレイ装置１０００）
図１は、発光モジュールを備える液晶ディスプレイ装置１０００の各構成を示す構成図を示す。この液晶ディスプレイ装置１０００は、上側から順に、液晶パネル１２０と、２枚のレンズシート１１０ａ、１１０ｂ、拡散シート１１０ｃと、発光モジュール１００とを備える。図１に示す液晶ディスプレイ装置１０００は、液晶パネル１２０の下方に発光モジュール１００を積層する、いわゆる直下型の液晶ディスプレイ装置である。液晶ディスプレイ装置１０００は、発光モジュール１００から照射される光を、液晶パネル１２０に照射する。なお、上述の構成部材以外に、さらに偏光フィルムやカラーフィルタ等の部材を備えてもよい。 (Liquid crystal display device 1000)
FIG. 1 is a configuration diagram showing each configuration of a liquid crystal display device 1000 including a light emitting module. The liquid crystal display device 1000 includes a liquid crystal panel 120, two lens sheets 110a and 110b, a diffusion sheet 110c, and a light emitting module 100 in order from the upper side. The liquid crystal display device 1000 shown in FIG. 1 is a so-called direct type liquid crystal display device in which the light emitting module 100 is laminated below the liquid crystal panel 120. The liquid crystal display device 1000 irradiates the liquid crystal panel 120 with the light emitted from the light emitting module 100. In addition to the above-mentioned constituent members, members such as a polarizing film and a color filter may be further provided.

（発光モジュール１００）
本実施形態の発光モジュール１００の構成を図２と図３に示す。本実施形態の発光モジュール１００は白色の面発光である。図２は、本実施形態にかかる発光モジュールの模式平面図である。図３は、本実施形態にかかる発光モジュールを示す一部拡大模式断面図である。これらの図に示す発光モジュール１００は、発光素子を含む発光体３と、外部に光を放射する発光面となる第一主面１ｃと、発光体３が配置される凹部１７を備える第二主面１ｄとを有する導光板１とを備えている。凹部１７は、凹部１７の開口部の大きさよりも小さい底面と、側面とを含む。発光体３は、接合部材を介して凹部１７の底面に固着されている。接合部材は、凹部１７の側面、および発光体３の外側面と接している。
さらに、発光モジュール１００は、発光体に、外周面を透光性部材の外周面と同一平面とし、かつ発光素子を埋設する第一光反射性部材１５を設けて、導光板１の第二主面１ｄには、導光板１の第二主面１ｄの一部と発光体３の一部を覆う第二光反射性部材１６を備えている。 (Light emitting module 100)
The configuration of the light emitting module 100 of this embodiment is shown in FIGS. 2 and 3. The light emitting module 100 of this embodiment emits white surface light. FIG. 2 is a schematic plan view of the light emitting module according to this embodiment. FIG. 3 is a partially enlarged schematic sectional view showing the light emitting module according to the present embodiment. The light emitting module 100 shown in these drawings includes a light emitting body 3 including a light emitting element, a first main surface 1c serving as a light emitting surface for emitting light to the outside, and a second main body having a recess 17 in which the light emitting body 3 is arranged. A light guide plate 1 having a surface 1d. The recess 17 includes a bottom surface and a side surface that are smaller than the size of the opening of the recess 17. The light emitting body 3 is fixed to the bottom surface of the recess 17 via a joining member. The joining member is in contact with the side surface of the recess 17 and the outer side surface of the light emitting body 3.
Further, in the light emitting module 100, the light emitting body is provided with the first light reflecting member 15 having the outer peripheral surface flush with the outer peripheral surface of the translucent member and the light emitting element embedded therein. The surface 1d is provided with a second light reflecting member 16 that covers a part of the second main surface 1d of the light guide plate 1 and a part of the light emitting body 3.

図２と図３に示す発光モジュール１００は、１枚の導光板１に複数の凹部１７を設けて、各々の凹部１７に発光体３を配置している。ただし、発光モジュールは、図４の模式底面図に示すように、導光板１’に一つの凹部１７を設けて、凹部１７に発光体３を配置したものを複数配列して発光モジュール１００’とすることもできる。 In the light emitting module 100 shown in FIGS. 2 and 3, a plurality of recesses 17 are provided in one light guide plate 1, and the light emitter 3 is arranged in each recess 17. However, in the light emitting module, as shown in the schematic bottom view of FIG. 4, one recess 17 is provided in the light guide plate 1 ′, and a plurality of light emitting members 3 are disposed in the recess 17 to form a light emitting module 100 ′. You can also do it.

（発光体３）
発光体３は、発光素子１１と、発光素子１１の主発光面１１ｃを覆う透光性部材１０と、を備えている。発光素子１１の側面を覆う第一光反射性部材１５とを備えている。
発光素子１１は、主発光面１１ｃと、主発光面１１ｃの反対側に電極形成面１１ｄと、主発光面１１ｃと電極形成面１１ｄの間に側面を有している。さらに、電極形成面１１ｄには一対の電極１１ｂを有している。
発光素子１１は、主として主発光面１１ｃから光を放射し、主発光面１１ｃを覆う透光性部材１０に光を照射する。 (Light emitter 3)
The light emitting body 3 includes a light emitting element 11 and a translucent member 10 that covers the main light emitting surface 11 c of the light emitting element 11. The first light reflecting member 15 that covers the side surface of the light emitting element 11 is provided.
The light emitting element 11 has a main light emitting surface 11c, an electrode forming surface 11d opposite to the main light emitting surface 11c, and a side surface between the main light emitting surface 11c and the electrode forming surface 11d. Further, the electrode forming surface 11d has a pair of electrodes 11b.
The light emitting element 11 mainly emits light from the main light emitting surface 11c, and irradiates the light transmitting member 10 that covers the main light emitting surface 11c with light.

図３の発光体３は、発光素子１１の主発光面１１ｃを透光性部材１０が被覆している。
さらに、発光体３は、発光素子１１の側面を第一光反射性部材１５で被覆している。図に示す発光体３は、第一光反射性部材１５の外側面と透光性部材１０の外側面を略同一平面としている。 In the light emitting body 3 of FIG. 3, the main light emitting surface 11c of the light emitting element 11 is covered with the translucent member 10.
Further, in the light emitting body 3, the side surface of the light emitting element 11 is covered with the first light reflecting member 15. In the light-emitting body 3 shown in the figure, the outer surface of the first light reflecting member 15 and the outer surface of the translucent member 10 are substantially flush with each other.

（発光素子１１）
発光素子１１は、正負一対の電極１１ｂを備える電極形成面１１ｄと、電極形成面１１ｄと反対側に主発光面１１ｃを有する。なお、本実施形態の発光モジュールは、発光素子１１をフリップチップ実装したものでもよいし、ワイヤを使用して実装したものでもよい。 (Light emitting element 11)
The light emitting element 11 has an electrode forming surface 11d provided with a pair of positive and negative electrodes 11b, and a main light emitting surface 11c on the side opposite to the electrode forming surface 11d. The light emitting module of the present embodiment may be the one in which the light emitting element 11 is flip-chip mounted or the one mounted by using a wire.

発光素子１１は、例えば、サファイア等の透光性基板と、透光性基板の上に積層された半導体積層構造とを有する。半導体積層構造は、発光層と、発光層を挟むｎ型半導体層およびｐ型半導体層とを含み、ｎ型半導体層およびｐ型半導体層に、電極１１ｂであるｎ側電極およびｐ側電極がそれぞれ電気的に接続される。発光素子１１は、例えば透光性基板を備える主発光面１１ｃが導光板１と対向して配置され、主発光面１１ｃと反対側の電極形成面１１ｄに一対の電極１１ｂを有する。 The light emitting element 11 has, for example, a transparent substrate such as sapphire, and a semiconductor laminated structure laminated on the transparent substrate. The semiconductor laminated structure includes a light emitting layer and an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light-emitting layer. The n-type semiconductor layer and the p-type semiconductor layer have an n-side electrode and a p-side electrode that are electrodes 11b, respectively. It is electrically connected. The light emitting element 11 has, for example, a main light emitting surface 11c provided with a light-transmissive substrate facing the light guide plate 1, and has a pair of electrodes 11b on an electrode forming surface 11d opposite to the main light emitting surface 11c.

発光素子１１としては、縦、横および高さの寸法に特に制限は無いが、好ましくは平面視において縦および横の寸法が１０００μｍ以下の半導体発光素子を用い、より好ましくは縦および横の寸法が５００μｍ以下であり、さらに好ましくは、縦および横の寸法が２００μｍ以下の発光素子を用いる。このような発光素子を用いると、液晶ディスプレイ装置のローカルディミングを行った際に、高精細な映像を実現することができる。また、縦および横の寸法が５００μｍ以下の発光素子を用いると、発光素子を安価に調達することができるため、発光モジュール１００を安価にすることができる。なお、縦および横の寸法の両方が２５０μｍ以下である発光素子は、発光素子の上面の面積が小さくなるため、相対的に発光素子の側面からの光の出射量が多くなる。つまり、このような発光素子は発光がバットウィング形状になりやすくなるため、発光素子が導光板に接合され、発光素子と導光板との距離がごく短い本実施形態の発光モジュールに好ましく用いられる。 The light emitting element 11 is not particularly limited in vertical, horizontal and height dimensions, but preferably a semiconductor light emitting element having a vertical and horizontal dimension of 1000 μm or less in plan view is used, and more preferably a vertical and horizontal dimension. It is 500 μm or less, and more preferably, a light emitting element having vertical and horizontal dimensions of 200 μm or less is used. When such a light emitting element is used, a high-definition image can be realized when the liquid crystal display device is locally dimmed. In addition, when a light emitting element having a vertical dimension and a horizontal dimension of 500 μm or less is used, the light emitting element can be obtained at low cost, so that the light emitting module 100 can be made at low cost. Note that a light emitting element having a vertical dimension and a horizontal dimension of 250 μm or less has a smaller area of the upper surface of the light emitting element, so that the amount of light emitted from the side surface of the light emitting element is relatively large. That is, since such a light emitting element easily emits light in a batwing shape, the light emitting element is bonded to the light guide plate and is preferably used in the light emitting module of the present embodiment in which the distance between the light emitting element and the light guide plate is very short.

発光素子１１は、平面視においてどのような形状でもよく、例えば、正方形又は長方形である。高精細な液晶ディスプレイ装置に使用される発光素子は、好ましくは、長方形の発光素子を使用して、その上面形状が長手と短手を有することが好ましい。高精細な液晶ディスプレイ装置の場合、使用する発光素子の数は数千個以上となり、発光素子の実装工程は重要な工程となる。発光素子の実装工程において、複数の発光素子の一部の発光素子に回転ずれ（例えば±９０度方向のずれ）が発生したとしても、平面視において長方形の発光素子を用いることで目視での確認が容易となる。また、ｐ型電極とｎ型電極の距離を離して形成することができるため、後述する配線の形成を容易に行うことができる。一方、平面視において正方形の発光素子を用いる場合は、小さい発光素子を量産性良く製造することができる。発光素子１１の密度（配列ピッチ）、すなわち発光素子１１間の距離は、例えば、０．０５ｍｍ〜２０ｍｍ程度とすることができ、１ｍｍ〜１０ｍｍ程度が好ましい。 The light emitting element 11 may have any shape in plan view, and is, for example, a square or a rectangle. The light emitting element used in the high-definition liquid crystal display device is preferably a rectangular light emitting element, and it is preferable that the shape of the upper surface of the light emitting element has a long side and a short side. In the case of a high-definition liquid crystal display device, the number of light emitting elements used is several thousand or more, and the mounting process of the light emitting elements becomes an important step. In the mounting process of the light emitting element, even if some light emitting elements of the plurality of light emitting elements are rotationally displaced (for example, misalignment in the direction of ±90 degrees), it can be visually confirmed by using the rectangular light emitting element in plan view. Will be easier. Further, since the p-type electrode and the n-type electrode can be formed apart from each other, it is possible to easily form the wiring described later. On the other hand, when a square light emitting element is used in plan view, a small light emitting element can be manufactured with high productivity. The density (arrangement pitch) of the light emitting elements 11, that is, the distance between the light emitting elements 11 can be, for example, about 0.05 mm to 20 mm, and preferably about 1 mm to 10 mm.

発光素子１１には、公知の半導体発光素子を利用することができる。本実施形態においては、発光素子１１としてフィリップチップ実装された発光ダイオードを例示する。発光素子１１は、例えば青色光を出射する。発光素子１１には、青色以外の光を出射する素子も使用できる。また、複数の発光素子１１として異なる色の光を発する発光素子を用いてもよい。発光素子１１から出射される光は、波長変換部材１２で外部に放射される発光色が調整される。 A known semiconductor light emitting element can be used for the light emitting element 11. In this embodiment, a light emitting diode mounted with a Philip chip is used as the light emitting element 11. The light emitting element 11 emits blue light, for example. An element that emits light other than blue can be used as the light emitting element 11. Further, as the plurality of light emitting elements 11, light emitting elements that emit light of different colors may be used. The emission color of the light emitted from the light emitting element 11 is adjusted by the wavelength conversion member 12 to the outside.

発光素子１１として、任意の波長の光を出射する素子を選択することができる。例えば、青色、緑色の光を出射する素子としては、窒化物系半導体（ＩｎｘＡｌｙＧａ１−ｘ−ｙＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）またはＧａＰを用いた発光素子を用いることができる。また、赤色の光を出射する素子としては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰなどの半導体を含む発光素子を用いることができる。さらに、これら以外の材料からなる半導体発光素子を用いることもできる。半導体層の材料およびその混晶度を変更することによって発光波長を変化させることができる。用いる発光素子の組成、発光色、大きさ、個数などは、目的に応じて適宜選択すればよい。 As the light emitting element 11, an element that emits light having an arbitrary wavelength can be selected. For example, blue, as the device for emitting green light, a nitride-based semiconductor (In x Al y Ga 1- x-y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) light emitting device using or GaP Can be used. Further, as an element that emits red light, a light emitting element including a semiconductor such as GaAlAs or AlInGaP can be used. Furthermore, a semiconductor light emitting element made of a material other than these can also be used. The emission wavelength can be changed by changing the material of the semiconductor layer and the mixed crystallinity thereof. The composition, emission color, size, number, and the like of the light emitting element to be used may be appropriately selected according to the purpose.

（透光性部材１０）
透光性部材１０は、発光素子１１の主発光面１１ｃを被覆しており、主発光面１１ｃから出射される光を透過させる。この透光性部材１０は、発光素子１１から出射される光を励起する物質が含まれていてもよいし、拡散または／および反射する物質が含まれていてもよい。図３の透光性部材１０は、波長変換部材１２を備えると共に、波長変換部材１２に光拡散部１３を積層して設けている。図の透光性部材１０は、波長変換部材１２を発光素子１１側に、光拡散部１３を導光板１側に積層している。この透光性部材１０は、発光素子１１から照射される光の波長を波長変換部材１２で調整し、波長変換部材１２を透過する光を光拡散部１３で拡散して導光板１に照射する。これにより、導光板１から放射される光をより均一にできる。 (Translucent member 10)
The translucent member 10 covers the main light emitting surface 11c of the light emitting element 11, and transmits the light emitted from the main light emitting surface 11c. The translucent member 10 may contain a substance that excites the light emitted from the light emitting element 11, or may contain a substance that diffuses and/or reflects light. The translucent member 10 in FIG. 3 includes the wavelength conversion member 12, and the light diffusion portion 13 is laminated on the wavelength conversion member 12. In the translucent member 10 of the figure, the wavelength conversion member 12 is laminated on the light emitting element 11 side, and the light diffusion portion 13 is laminated on the light guide plate 1 side. In the translucent member 10, the wavelength of the light emitted from the light emitting element 11 is adjusted by the wavelength conversion member 12, and the light transmitted through the wavelength conversion member 12 is diffused by the light diffusion portion 13 and applied to the light guide plate 1. .. Thereby, the light emitted from the light guide plate 1 can be made more uniform.

図３に示す発光体３は、波長変換部材１２と光拡散部１３を備える透光性部材１０を、発光素子１１に接合している。このように、透光性部材１０は、波長変換部材１２と光拡散部１３とを備えることが好ましい。また、透光性部材１０は、複数の波長変換部材１２や光拡散部１３を積層することもできる。なお、透光性部材１０は、波長変換部材のみで構成することも、光拡散部のみで構成することも、あるいは、透光性部材や光拡散部を備えることなく透光性を有する樹脂のみで構成することもできる。 In the light-emitting body 3 shown in FIG. 3, the light-transmissive member 10 including the wavelength conversion member 12 and the light diffusion portion 13 is joined to the light-emitting element 11. As described above, it is preferable that the translucent member 10 includes the wavelength conversion member 12 and the light diffusion portion 13. Further, the translucent member 10 can also be formed by laminating a plurality of wavelength conversion members 12 and light diffusion portions 13. The translucent member 10 may be composed of only the wavelength conversion member, or may be composed of only the light diffusing portion, or may be made of a resin having translucency without the translucent member or the light diffusing portion. It can also be configured with.

（波長変換部材１２）
波長変換部材１２は、発光素子１１が発する光を受けて、異なる波長の光に変換するための部材である。波長変換部材１２は、波長変換物質を母材に分散させたものである。また、波長変換部材１２は、複数層で構成していてもよい。例えば波長変換部材１２を、母材に波長変換物質を添加した第一層と、母材に拡散材を添加した光拡散部を第二層とする二層構造とすることができる。 (Wavelength conversion member 12)
The wavelength conversion member 12 is a member for receiving the light emitted from the light emitting element 11 and converting it into light of a different wavelength. The wavelength conversion member 12 is obtained by dispersing a wavelength conversion substance in a base material. The wavelength conversion member 12 may be composed of a plurality of layers. For example, the wavelength conversion member 12 may have a two-layer structure including a first layer in which a wavelength conversion material is added to the base material and a light diffusion portion in which a diffusion material is added to the base material as the second layer.

母材の材料は、例えばエポキシ樹脂、シリコーン樹脂、これらを混合した樹脂、またはガラスなどの透光性材料を用いることができる。波長変換部材の耐光性および成形容易性の観点からは、母材としてシリコーン樹脂を選択すると有益である。また、波長変換部材１２の母材としては、導光板１の材料よりも高い屈折率を有する材料が好ましい。 As the material of the base material, for example, a translucent material such as epoxy resin, silicone resin, a resin obtained by mixing these, or glass can be used. From the viewpoint of light resistance and ease of molding of the wavelength conversion member, it is useful to select a silicone resin as the base material. Moreover, as the base material of the wavelength conversion member 12, a material having a higher refractive index than the material of the light guide plate 1 is preferable.

波長変換部材１２が含有する波長変換物質の一例として、蛍光体がある。例えば、ＹＡＧ蛍光体、βサイアロン蛍光体またはＫＳＦ系蛍光体等のフッ化物系蛍光体などが挙げられる。波長変換部材１２は、単数の波長変換物質が含有されていてもよいし、複数の波長変換物質が含有されていてもよい。複数の波長変換物質を含有する場合は、例えば、波長変換部材が緑色系の発光をするβサイアロン蛍光体と赤色系の発光をするＫＳＦ系蛍光体等のフッ化物系蛍光体とを含むことができる。これにより、発光モジュール１００の色再現範囲を広げることができる。この場合、発光素子１１は、波長変換部材１２を効率良く励起できる短波長の光を出射することが可能な窒化物系半導体（ＩｎｘＡｌｙＧａ１−ｘ−ｙＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）を備えることが好ましい。また、例えば、青色系の光を出射する発光素子１１を用いた際に、電池モジュールとして赤色系の光を得たい場合は、波長変換部材１２にＫＳＦ系蛍光体（赤色蛍光体）を６０重量％以上、好ましくは９０重量％以上含有させてもよい。つまり、特定の色の光を出射する波長変換部材を波長変換部材１２に含有させることで、特定の色の光を出射するようにしてもよい。また、波長変換物質は量子ドットであってもよい。波長変換部材１２内において、波長変換物質はどのように配置されていてもよい。例えば、略均一に分布していてもよく、一部に偏在してもよい。また、波長変換部材をそれぞれ含有する複数の層が積層されて設けられていてもよい。 A phosphor is an example of the wavelength conversion material contained in the wavelength conversion member 12. For example, a YAG fluorescent substance, a β-sialon fluorescent substance, a fluoride type fluorescent substance such as a KSF type fluorescent substance and the like can be mentioned. The wavelength conversion member 12 may contain a single wavelength conversion substance, or may contain a plurality of wavelength conversion substances. When a plurality of wavelength conversion substances are contained, for example, the wavelength conversion member may include a β-sialon phosphor that emits green light and a fluoride phosphor such as a KSF phosphor that emits red light. it can. As a result, the color reproduction range of the light emitting module 100 can be expanded. In this case, the light emitting element 11 is efficiently excited possible short wavelength capable nitride semiconductor that emits light wavelength conversion member 12 (In x Al y Ga 1 -x-y N, 0 ≦ X, 0 ≦Y, X+Y≦1) are preferably provided. Further, for example, when using the light emitting element 11 that emits blue light, when it is desired to obtain red light as a battery module, the wavelength conversion member 12 contains 60 weight of KSF phosphor (red phosphor). % Or more, preferably 90% by weight or more. That is, the wavelength conversion member 12 may include a wavelength conversion member that emits light of a specific color to emit light of a specific color. Further, the wavelength conversion substance may be a quantum dot. The wavelength converting material may be arranged in any manner within the wavelength converting member 12. For example, it may be distributed substantially uniformly, or may be partially distributed. Further, a plurality of layers each containing a wavelength conversion member may be provided in a laminated manner.

（光拡散部１３）
光拡散部１３は、発光素子１１から照射される光を拡散および／または反射させることで、主発光面１１ｃに局部的に光が集中するのを阻止し、輝度ムラが生じるのを防止する。この光拡散部１３は、母材に拡散材を添加している。光拡散部１３は、例えば上述した樹脂材料を母材として、これにＳｉＯ2やＴｉＯ2等の白色の無機微粒子を含有させたものを用いることができる。また、拡散材には、光反射性部材である白色系の樹脂や金属を微粒子状に加工したものを使用することもできる。これらの拡散材は、母材の内部に不規則に含有されることで、光拡散部の内部を通過する光を不規則に、かつ繰り返し反射させて、透過光を多方向に拡散することで、照射光が局部的に集中するのを抑制して、輝度ムラが生じるのを防止する。
なお、光拡散部は、発光素子１１から出射される光に対して６０％以上の反射率を有し、好ましくは９０％以上の反射率を有する。 (Light diffuser 13)
The light diffusing unit 13 diffuses and/or reflects the light emitted from the light emitting element 11 to prevent the light from locally concentrating on the main light emitting surface 11c and prevent uneven brightness. The light diffusing section 13 has a base material added with a diffusing material. For the light diffusing section 13, for example, the above-mentioned resin material as a base material and white inorganic fine particles such as SiO 2 or TiO 2 contained therein can be used. Further, as the diffusing material, it is also possible to use a light-reflecting member such as white resin or metal processed into fine particles. Since these diffusing materials are irregularly contained inside the base material, the light passing through the inside of the light diffusing portion is irregularly and repeatedly reflected, and the transmitted light is diffused in multiple directions. , It is possible to prevent the irradiation light from being locally concentrated and prevent uneven brightness.
The light diffusing section has a reflectance of 60% or more, preferably 90% or more, with respect to the light emitted from the light emitting element 11.

図３の発光体３は、平面視において、波長変換部材１２や光拡散部１３で構成される透光性部材１０の外形を発光素子１１の外形よりも大きくしている。この発光体３は、発光素子１１の主発光面１１ｃから出射されるより多くの光を波長変換部材１２や光拡散部１３に透過させて導光板１に入射して色ムラや輝度ムラを少なくできる。 In the light-emitting body 3 of FIG. 3, the outer shape of the light-transmissive member 10 including the wavelength conversion member 12 and the light diffusion portion 13 is larger than the outer shape of the light-emitting element 11 in plan view. The light emitting body 3 transmits more light emitted from the main light emitting surface 11c of the light emitting element 11 to the wavelength conversion member 12 and the light diffusing portion 13 and enters the light guide plate 1 to reduce color unevenness and brightness unevenness. it can.

（透光性接着部材１９）
図３に示すように、発光素子１１の側面の一部および透光性部材１０の一部を透光性接着部材１９が被覆している。なお、透光性接着部材１９の外側面は、発光素子１１の側面から透光性部材１０に向かって広がる傾斜面であることが好ましく、発光素子１１側に凸状の曲面であることがより好ましい。これにより、発光素子１１の側面から出る光をより透光性部材１０に導くことができ、光取り出し効率を高めることができる。
また、発光素子１１の主発光面１１ｃと透光性部材１０の間には、透光性接着部材１９を有してもよい。これにより、例えば、透光性接着部材１９に拡散剤等を含有することで発光素子１１の主発光面１１ｃから出る光が、透光性接着部材１９で拡散され、透光性部材１０に入ることで輝度ムラを少なくできる。
透光性接着部材１９は、後述する接合部材１４と同じ部材を使用することができる。 (Translucent adhesive member 19)
As shown in FIG. 3, a part of the side surface of the light emitting element 11 and a part of the translucent member 10 are covered with the translucent adhesive member 19. The outer surface of the translucent adhesive member 19 is preferably an inclined surface that spreads from the side surface of the light emitting element 11 toward the translucent member 10, and is more preferably a convex curved surface on the light emitting element 11 side. preferable. Thereby, the light emitted from the side surface of the light emitting element 11 can be further guided to the translucent member 10, and the light extraction efficiency can be improved.
Further, a translucent adhesive member 19 may be provided between the main light emitting surface 11c of the light emitting element 11 and the translucent member 10. Thereby, for example, when the translucent adhesive member 19 contains a diffusing agent or the like, light emitted from the main light emitting surface 11c of the light emitting element 11 is diffused by the translucent adhesive member 19 and enters the translucent member 10. Therefore, uneven brightness can be reduced.
As the translucent adhesive member 19, the same member as the joining member 14 described later can be used.

（第一光反射性部材１５）
さらに、発光体３は、発光素子１１に透光性部材１０を設けた状態で、発光素子１１の側面を第一光反射性部材１５で被覆している。詳細には、透光性接着部材１９で覆われていない発光素子１１の側面および透光性接着部材１９の外側面を第一光反射性部材１５で被覆している。
第一光反射性部材１５は、光反射性に優れた材質で、好ましくは、光を反射する添加物である白色粉末等を透明樹脂に添加している白色樹脂である。発光体３は、発光素子１１の主発光面１１ｃを除く他の面をこの第一光反射性部材１５で被覆することにより、主発光面１１ｃ以外の方向への光の漏れを抑制している。すなわち、第一光反射性部材１５は、発光素子１１の側面や電極形成面１１ｄから出射される光を反射して、発光素子１１の発光を有効に導光板１の第一主面１ｃから外部に放射させて、発光モジュール１００の光取り出し効率を高めることができる。 (First light reflecting member 15)
Further, in the light-emitting body 3, the side surface of the light-emitting element 11 is covered with the first light-reflecting member 15 with the light-transmissive member 10 provided on the light-emitting element 11. In detail, the side surface of the light emitting element 11 not covered with the translucent adhesive member 19 and the outer side surface of the translucent adhesive member 19 are covered with the first light reflecting member 15.
The first light-reflecting member 15 is made of a material having excellent light-reflecting property, and is preferably a white resin in which white powder, which is an additive that reflects light, is added to the transparent resin. The light-emitting body 3 covers the other surfaces of the light-emitting element 11 excluding the main light-emitting surface 11c with the first light-reflecting member 15 to suppress light leakage in directions other than the main light-emitting surface 11c. .. That is, the first light reflecting member 15 reflects the light emitted from the side surface of the light emitting element 11 or the electrode forming surface 11 d to effectively emit the light of the light emitting element 11 from the first main surface 1 c to the outside. The light extraction efficiency of the light emitting module 100 can be improved.

第一光反射性部材１５は、発光素子１１から出射される光に対して６０％以上の反射率を有し、好ましくは９０％以上の反射率を有する白色樹脂が適している。この第一光反射性部材１５は、白色粉末等の白色の顔料を含有させた樹脂であることが好ましい。特に、酸化チタン等の無機白色粉末を含有させたシリコーン樹脂が好ましい。 The first light reflecting member 15 is preferably a white resin having a reflectance of 60% or more, and preferably 90% or more with respect to the light emitted from the light emitting element 11. The first light-reflecting member 15 is preferably a resin containing a white pigment such as white powder. In particular, a silicone resin containing an inorganic white powder such as titanium oxide is preferable.

第一光反射性部材１５は、発光素子１１の側面の少なくとも一部に接しており、発光素子１１の周囲にあって発光素子１１を埋設して、発光素子１１の電極１１ｂを表面に露出させている。第一光反射性部材１５は、透光性部材１０と接しており、第一光反射性部材１５の外側面と透光性部材１０の外側面は同一平面である。第一光反射性部材１５は、発光素子１１と透光性部材１０と一体構造に接合された発光体３を導光板１に配置される。 The first light-reflecting member 15 is in contact with at least a part of the side surface of the light emitting element 11, is embedded around the light emitting element 11 and exposes the electrode 11b of the light emitting element 11 on the surface. ing. The first light reflecting member 15 is in contact with the light transmitting member 10, and the outer surface of the first light reflecting member 15 and the outer surface of the light transmitting member 10 are flush with each other. The first light-reflecting member 15 has the light-emitting element 3 and the light-emitting element 11 and the light-transmissive member 10 integrally bonded to each other, and the light-emitting body 3 is disposed on the light guide plate 1.

（導光板１）
導光板１は、光源から入射される光を面状にして外部に放射する透光性の部材である。導光板１は、図３に示すように、発光面となる第一主面１ｃと、第一主面１ｃと反対側に第二主面１ｄとを備える。この導光板１は、第二主面１ｄに複数の凹部１７を設けている。また、本実施形態では隣接する凹部１７の間に溝１ｅを設けている。
また、凹部１７内には、発光体３の一部を配置している。詳細には、透光性部材１０が、凹部１７の底面と対向するように発光体３の一部を導光板１の凹部１７に配置する。これにより、発光モジュール全体は薄型化が可能になる。導光板１は、図２及び図３に示すように、複数の凹部１７を設けて各々の凹部１７に発光体３の一部を配置して発光モジュール１００とすることができる。
あるいは、図４に示すように、ひとつの凹部１７のある導光板１’にひとつの発光体３の一部を配置し、複数の導光板１’を平面形状に配置して発光モジュール１００’とすることができる。複数の凹部１７を設けている導光板１は、図３に示すように、凹部１７の間に格子状の溝１ｅを設けている。ひとつの凹部１７を設けている導光板１’は、図４に示すように、第二主面１ｄの外周部に、外周縁に向かって傾斜面１ｆを設けている。 (Light guide plate 1)
The light guide plate 1 is a translucent member that makes the light incident from the light source into a planar shape and radiates the light to the outside. As shown in FIG. 3, the light guide plate 1 includes a first main surface 1c serving as a light emitting surface and a second main surface 1d on the side opposite to the first main surface 1c. The light guide plate 1 has a plurality of recesses 17 on the second main surface 1d. Further, in this embodiment, the groove 1e is provided between the adjacent recesses 17.
In addition, a part of the light-emitting body 3 is arranged in the recess 17. Specifically, the translucent member 10 arranges a part of the light emitting body 3 in the recess 17 of the light guide plate 1 so as to face the bottom surface of the recess 17. As a result, the entire light emitting module can be thinned. As shown in FIGS. 2 and 3, the light guide plate 1 can be provided as a light emitting module 100 by providing a plurality of recesses 17 and disposing a part of the light emitter 3 in each recess 17.
Alternatively, as shown in FIG. 4, a part of one light emitting body 3 is arranged in a light guide plate 1′ having one recess 17, and a plurality of light guide plates 1′ are arranged in a planar shape to form a light emitting module 100′. can do. As shown in FIG. 3, the light guide plate 1 having the plurality of recesses 17 has the grid-like grooves 1 e provided between the recesses 17. As shown in FIG. 4, the light guide plate 1'provided with one recess 17 is provided with an inclined surface 1f toward the outer peripheral edge on the outer peripheral portion of the second main surface 1d.

溝１ｅや傾斜面１ｆは、その表面に、第二光反射性部材１６が設けられる。溝１ｅに配置される第二光反射性部材１６は、詳細には後述するが、好ましくは発光体３からの光を反射する白色樹脂で、発光素子１１の発光が、溝１ｅで区画された隣の導光板１に入射するのを防止して、各々の発光素子１１の光が隣に漏れるのを防止する。ひとつの導光板１’の第二主面１ｄの外周部に設けている傾斜面１ｆに接合される第二光反射性部材１６は、導光板１の周囲に光が漏れるのを防止して、導光板１の第一主面１ｃからの発光強度が低下するのを防止する。 The second light reflecting member 16 is provided on the surface of the groove 1e and the inclined surface 1f. The second light reflecting member 16 arranged in the groove 1e is preferably a white resin that reflects the light from the light emitting body 3, and the light emission of the light emitting element 11 is partitioned by the groove 1e, which will be described later in detail. It prevents the light of each light emitting element 11 from leaking to the adjacent light guide plate 1 by preventing the light from entering the adjacent light guide plate 1. The second light-reflecting member 16 joined to the inclined surface 1f provided on the outer peripheral portion of the second main surface 1d of one light guide plate 1′ prevents light from leaking around the light guide plate 1, It is prevented that the light emission intensity from the first major surface 1c of the light guide plate 1 is reduced.

導光板１の大きさは、液晶ディスプレイ装置１０００の大きさにより適宜設定されるが、例えば、複数の凹部１７のある導光板１にあっては、一辺が１ｃｍ〜２００ｃｍ程度とすることができ、３ｃｍ〜３０ｃｍ程度が好ましい。厚みは０．１ｍｍ〜５ｍｍ程度とすることができ、０．１ｍｍ〜３ｍｍが好ましい。導光板１の平面形状は、例えば、略矩形や略円形等とすることができる。 The size of the light guide plate 1 is appropriately set according to the size of the liquid crystal display device 1000. For example, in the light guide plate 1 having the plurality of recesses 17, one side can be about 1 cm to 200 cm, It is preferably about 3 cm to 30 cm. The thickness can be about 0.1 mm to 5 mm, preferably 0.1 mm to 3 mm. The planar shape of the light guide plate 1 can be, for example, a substantially rectangular shape or a substantially circular shape.

導光板１の材料としては、アクリル、ポリカーボネート、環状ポリオレフィン、ポリエチレンテレフタレート、ポリエステル等の熱可塑性樹脂、エポキシ、シリコーン等の熱硬化性樹脂等の樹脂材料やガラスなどの光学的に透明な材料を用いることができる。特に、熱可塑性の樹脂材料は、射出成型によって効率よく製造することができるため、好ましい。中でも、透明性が高く、安価なポリカーボネートが好ましい。製造工程において、半田リフローのような高温環境にさらされることなく製造される発光モジュールは、ポリカーボネートのような熱可塑性であり耐熱性の低い材料であっても用いることができる。 As the material of the light guide plate 1, a resin material such as a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate or polyester, a thermosetting resin such as epoxy or silicone, or an optically transparent material such as glass is used. be able to. In particular, a thermoplastic resin material is preferable because it can be efficiently manufactured by injection molding. Among them, polycarbonate, which has high transparency and is inexpensive, is preferable. In the manufacturing process, the light emitting module manufactured without being exposed to a high temperature environment such as solder reflow can be used even if it is made of a material such as polycarbonate that is thermoplastic and has low heat resistance.

また、導光板１は、単層で形成されていてもよく、複数の透光性の層が積層されて形成されていてもよい。複数の透光性の層が積層されている場合には、任意の層間に屈折率の異なる層、例えば空気の層等を設けることが好ましい。これにより、光をより拡散させやすくなり、輝度ムラを低減した発光モジュールとすることができる。このような構成は、例えば、任意の複数の透光性の層の間にスペーサを設けて離間させ、空気の層を設けることで実現することができる。また、導光板１の第一主面１ｃ上に透光性の層と、導光板１の第一主面１ｃと該透光性の層の間に屈折率の異なる層、例えば空気の層等を設けてもよい。これにより、光をより拡散させやすくなり、輝度ムラを低減した液晶ディスプレイ装置とすることができる。このような構成は、例えば、任意の導光板１と透光性の層の間にスペーサを設けて離間させ、空気の層を設けることで実現することができる。 Further, the light guide plate 1 may be formed as a single layer or may be formed by stacking a plurality of translucent layers. When a plurality of translucent layers are laminated, it is preferable to provide a layer having a different refractive index, such as an air layer, between arbitrary layers. As a result, the light can be more easily diffused, and a light emitting module with reduced luminance unevenness can be obtained. Such a configuration can be realized by, for example, providing a spacer between arbitrary plural light-transmissive layers to separate them from each other and providing an air layer. Further, a translucent layer is provided on the first major surface 1c of the light guide plate 1, and a layer having a different refractive index between the first major surface 1c of the light guide plate 1 and the translucent layer, such as an air layer. May be provided. This makes it easier to diffuse the light and makes it possible to obtain a liquid crystal display device in which uneven brightness is reduced. Such a configuration can be realized, for example, by providing a spacer between an arbitrary light guide plate 1 and a light-transmissive layer to separate them from each other and providing an air layer.

（凹部１７）
導光板１は、第二主面１ｄ側に、凹部１７を設けている。発光体３の一部を、透光性部材１０が凹部１７の底面と対向するように凹部１７内に配置する。
凹部１７は、平面視において、凹部の底面の大きさが開口部の大きさよりも小さい。これにより、導光板の凹部に接合部材を充填する工程において、凹部１７と接合部材１４との間に発生するボイドを排出し易くなる。これにより、ボイドがない発光モジュールを実現することができる。凹部１７の底面は、平面視において、発光体３の大きさよりも大きい。図３に示すように、凹部１７の側面は、発光体３の外側面より外側に位置する。 (Recess 17)
The light guide plate 1 is provided with a recess 17 on the second main surface 1d side. A part of the light emitting body 3 is arranged in the recess 17 so that the translucent member 10 faces the bottom surface of the recess 17.
The size of the bottom surface of the recess 17 is smaller than the size of the opening in plan view. As a result, in the step of filling the concave portion of the light guide plate with the joining member, voids generated between the concave portion 17 and the joining member 14 can be easily discharged. Thereby, a light emitting module without voids can be realized. The bottom surface of the recess 17 is larger than the size of the light emitting body 3 in a plan view. As shown in FIG. 3, the side surface of the recess 17 is located outside the outer surface of the light emitting body 3.

図２〜図４の導光板１、１’は、平面視において、凹部１７の底面及び開口部の内形を角部が丸みを帯びた四角形として、ここに配置する発光体３の外形も四角形としている。四角形の凹部１７に配置される四角形の発光体３は、発光体３の各側面が、対向する凹部１７の側面が平行となるように配置してもよい。また、図４に示すように、発光体３の各外側面が、凹部１７の各側面に対し４５°回転するように配置することがより好ましい。さらに、平面視において、凹部１７の底面の中心と発光体３の中心がほぼ一致するように配置されることが好ましい。これにより、発光体３の側面から凹部１７の側面までの距離を一定にすることができ、発光モジュールの色ムラを改善することができる。ただ、外形を四角形とする発光体は、四角形の凹部に対して各々の辺が交差、いいかえると、四角形の凹部に対して回転する姿勢で配置することもできる。 In the plan view, the light guide plates 1 and 1 ′ of FIGS. 2 to 4 have a quadrangular shape with a rounded corner at the inner shape of the bottom surface of the recess 17 and the opening, and a quadrangular outer shape of the light-emitting body 3 placed here. I am trying. The quadrangular light emitters 3 arranged in the quadrangular recesses 17 may be arranged such that the side surfaces of the light emitter 3 are parallel to the side surfaces of the facing recesses 17. Further, as shown in FIG. 4, it is more preferable that each outer side surface of the light emitting body 3 is arranged so as to rotate by 45° with respect to each side surface of the recess 17. Further, it is preferable that the center of the bottom surface of the recess 17 and the center of the light emitting body 3 are substantially aligned in a plan view. Thereby, the distance from the side surface of the light emitting body 3 to the side surface of the recess 17 can be made constant, and the color unevenness of the light emitting module can be improved. However, the light-emitting body having a quadrangular outer shape can also be arranged in such a manner that each side intersects the quadrangular recess, that is, the rotator is rotated with respect to the quadrangular recess.

図２〜図４に示す凹部１７の側面は、凹部の外側に向かって凸の湾曲面を含む。湾曲面は、凹部の底面側に設けられ、凹部の底面に連続している。また、凹部１７の側面は、凹部の開口部側に、垂直な面を含む。 The side surface of the recess 17 shown in FIGS. 2 to 4 includes a curved surface that is convex toward the outside of the recess. The curved surface is provided on the bottom surface side of the recess and is continuous with the bottom surface of the recess. The side surface of the recess 17 includes a vertical surface on the opening side of the recess.

ここで、凹部１７の底面の平面視における大きさは、発光体３の外形によっても変更されるが、円形にあっては直径、楕円形にあっては長径、四角形にあっては対角線の長さを、例えば、０．０５ｍｍ〜１０ｍｍとすることができ、好ましくは０．１ｍｍ〜２ｍｍが好ましい。深さは０．０５ｍｍ〜４ｍｍとすることができ、０．１ｍｍ〜１ｍｍが好ましい。凹部１７の底面の平面視形状は、例えば、略矩形、略円形とすることができ、凹部１７の配列ピッチ等によって選択可能である。凹部１７の配列ピッチ（最も近接した２つの凹部１７の中心間の距離）が略均等である場合には、略円形または略正方形が好ましい。 Here, the size of the bottom surface of the concave portion 17 in plan view is changed depending on the outer shape of the light emitting body 3, but it is a diameter in the case of a circle, a long diameter in the case of an ellipse, and a length of a diagonal line in the case of a quadrangle. The thickness can be, for example, 0.05 mm to 10 mm, preferably 0.1 mm to 2 mm. The depth can be 0.05 mm to 4 mm, preferably 0.1 mm to 1 mm. The plan view shape of the bottom surface of the recess 17 can be, for example, substantially rectangular or substantially circular, and can be selected depending on the arrangement pitch of the recesses 17 and the like. When the arrangement pitch of the recesses 17 (distance between the centers of the two recesses 17 closest to each other) is substantially equal, a substantially circular shape or a substantially square shape is preferable.

凹部１７の底面から第二主面１ｄまでの凹部１７の高さは、断面視において、より好ましくは、図３に示すように、発光素子１１の主発光面１１ｃと第二主面１ｄが略同一平面になる凹部１７の高さである。 The height of the recess 17 from the bottom surface of the recess 17 to the second main surface 1d is more preferably, as shown in FIG. 3, the main light emitting surface 11c and the second main surface 1d of the light emitting element 11 are substantially the same. It is the height of the recesses 17 that are flush with each other.

（凹部１７の変形例）
さらに、凹部１７の側面は、底面から開口部に向かって傾斜した平面を含んでいてもよい。図５に示す凹部１７は、図２〜４に示す凹部１７と比較して、凹部の開口部側の側面が底面から開口部に向かって傾斜した平面である点が異なる。このような凹部１７においても、後述する導光板の凹部に接合部材を充填する工程において、凹部１７と接合部材１４との間に発生するボイドを排出し易くなる。 (Modification of the recess 17)
Furthermore, the side surface of the recess 17 may include a flat surface inclined from the bottom surface toward the opening. The recess 17 shown in FIG. 5 is different from the recess 17 shown in FIGS. 2 to 4 in that the side surface of the recess on the opening side is a flat surface inclined from the bottom surface toward the opening. Even in such a recess 17, voids generated between the recess 17 and the joining member 14 can be easily discharged in the step of filling the joining member in the recess of the light guide plate described later.

図６に示すように、凹部１７は、側面が凹部の外側に向かって凸の湾曲面のみで構成してもよい。また、図７に示すように、凹部１７は、側面が底面から開口部に向かって傾斜した平面のみで構成してもよい。このような凹部１７においても、後述する導光板の凹部に接合部材を充填する工程において、凹部１７と接合部材１４との間に発生するボイドを排出し易くなる。 As shown in FIG. 6, the concave portion 17 may be configured only by a curved surface whose side surface is convex toward the outside of the concave portion. Further, as shown in FIG. 7, the concave portion 17 may be configured only by a flat surface whose side surface is inclined from the bottom surface toward the opening. Even in such a recess 17, voids generated between the recess 17 and the joining member 14 can be easily discharged in the step of filling the joining member in the recess of the light guide plate described later.

（接合部材１４）
透光性の接合部材１４は、凹部１７の内側面および発光体３の外側面と接している。また、接合部材１４は、凹部１７の外側に位置する第一光反射性部材１５の一部と接するように、言い換えると、透光性部材１０の外側面から第一光反射性部材１５の外側面に跨がる領域を被覆するように配置されている。さらに、接合部材１４の外側面は、傾斜面１４ａである。この傾斜面１４ａは、第一光反射性部材１５の外側面との間でなす傾斜角αが鋭角となるようにしている。
また接合部材１４は、透光性部材１０と凹部１７の底面の間に配置されてもよい。 (Joining member 14)
The translucent joining member 14 is in contact with the inner surface of the recess 17 and the outer surface of the light emitting body 3. Further, the joining member 14 is in contact with a part of the first light reflecting member 15 located outside the recess 17, in other words, from the outer surface of the light transmitting member 10 to the outside of the first light reflecting member 15. It is arranged so as to cover the region extending over the side surface. Further, the outer side surface of the joining member 14 is the inclined surface 14a. The inclined surface 14a is formed so that the inclination angle α formed with the outer surface of the first light reflecting member 15 is an acute angle.
The joining member 14 may be arranged between the translucent member 10 and the bottom surface of the recess 17.

さらに、図３に示すように、接合部材１４は、導光板１の第二主面１ｄと接している。これにより、傾斜面１４ａが形成される領域を広くして、多くの光を反射できるようになり、輝度ムラを低減できるようにしている。ここで、接合部材１４の傾斜面１４ａが第一光反射性部材１５の外側面となす傾斜角αは、５°〜５０°、好ましくは１０°〜４５°とすることができる。
また、図３に示すように、接合部材１４は、断面視において傾斜面１４ａを有している。この形状は、接合部材１４を透過して傾斜面１４ａに入射する光を一様な状態で発光面側に反射できる。 Further, as shown in FIG. 3, the joining member 14 is in contact with the second major surface 1d of the light guide plate 1. As a result, the area in which the inclined surface 14a is formed can be widened so that a large amount of light can be reflected and uneven brightness can be reduced. Here, the inclination angle α formed by the inclined surface 14a of the joining member 14 and the outer side surface of the first light-reflecting member 15 can be 5° to 50°, preferably 10° to 45°.
Further, as shown in FIG. 3, the joining member 14 has an inclined surface 14a in a sectional view. With this shape, light that passes through the joining member 14 and enters the inclined surface 14a can be reflected to the light emitting surface side in a uniform state.

接合部材１４として、エポキシ樹脂、シリコーン樹脂等の透光性の熱硬化性の樹脂材料等を用いることができる。また、接合部材１４は、光の透過率を６０％以上とし、好ましくは９０％以上とする。さらに、接合部材１４は、拡散材等を含み、あるいは光を反射する添加物である白色粉末等を含んでもよいし、拡散材や白色粉末等を含まない透光性の樹脂材料のみで構成されてもよい。 As the joining member 14, a translucent thermosetting resin material such as an epoxy resin or a silicone resin can be used. Further, the joining member 14 has a light transmittance of 60% or more, preferably 90% or more. Furthermore, the joining member 14 may include a diffusing material or the like, or may include a white powder or the like that is an additive that reflects light, or is composed only of a translucent resin material that does not include the diffusing material or the white powder. May be.

（傾斜面１４ａの変形例）
さらに、透光性の接合部材１４は、傾斜面１４ａを、断面視において、曲面とすることもできる。図８に示す接合部材１４は、傾斜面１４ａを凹部１７側に向かって凸状となる曲面としている。この傾斜面１４ａは、傾斜面１４ａにおける反射光の進行方向を広範囲にし、輝度ムラを低減できる。 (Modification of inclined surface 14a)
Further, in the translucent joining member 14, the inclined surface 14a can be a curved surface in a cross-sectional view. In the joining member 14 shown in FIG. 8, the inclined surface 14a is a curved surface that is convex toward the concave portion 17 side. The inclined surface 14a can widen the traveling direction of the reflected light on the inclined surface 14a and reduce uneven brightness.

さらに、図９に示す接合部材１４は、傾斜面１４ａが、図８に示す状態よりも導光板１の第二主面１ｄの外側まで被覆している。詳細には、断面視において、接合部材１４が第二主面１ｄをより多く被覆していることが好ましい。ただし、１つの導光板１が複数の発光体３を有している場合、接合部材１４は、隣接する発光体３を被覆する接合部材１４と接しないことが好ましい。
これにより、傾斜面１４ａの面積を広くしてより多くの光を反射できる。また、この図に示す接合部材１４も、傾斜面１４ａを、断面視において、凹部１７側に向かって凸状の曲面とすることで、反射光を広範囲に拡散して、輝度ムラを低減できる。 Further, in the joining member 14 shown in FIG. 9, the inclined surface 14a covers the outside of the second main surface 1d of the light guide plate 1 more than the state shown in FIG. Specifically, it is preferable that the joining member 14 cover more of the second main surface 1d in a cross-sectional view. However, when one light guide plate 1 has a plurality of light emitters 3, it is preferable that the joining member 14 does not contact the joining member 14 that covers the adjacent light emitters 3.
This makes it possible to increase the area of the inclined surface 14a and reflect more light. Also, in the joining member 14 shown in this figure, the inclined surface 14a is a curved surface that is convex toward the recess 17 side in a cross-sectional view, whereby the reflected light can be diffused over a wide range, and uneven brightness can be reduced.

なお、図９に示す発光モジュール２００では、発光体３Ａの透光性部材１０の外側面に透光性樹脂部２０をさらに有している。この透光性樹脂部２０は、後述する発光ユニット３に個片化する工程において、波長変換部材１２及び光拡散部１３の外側面を保護できる。このような透光性樹脂部２０として、例えば、光の透過率を６０％以上とし、好ましくは９０％以上とする透光性の樹脂が使用できる。この発光体３Ａは、透光性部材１０と透光性樹脂部２０に接するように第一光反射性部材１５を設けている。 The light emitting module 200 shown in FIG. 9 further includes a light transmitting resin portion 20 on the outer surface of the light transmitting member 10 of the light emitting body 3A. The translucent resin portion 20 can protect the outer side surfaces of the wavelength conversion member 12 and the light diffusion portion 13 in the step of dividing the light emitting unit 3 into pieces, which will be described later. As such a translucent resin portion 20, for example, a translucent resin having a light transmittance of 60% or more, preferably 90% or more can be used. The light-emitting body 3A is provided with the first light-reflecting member 15 so as to be in contact with the translucent member 10 and the translucent resin portion 20.

（光学機能部１ａ）
導光板１は、第一主面１ｃ側に、発光体３からの光の反射や拡散機能を有する光学機能部１ａを設けることができる。この導光板１は、発光体３からの光を側方に広げ、導光板１の面内における発光強度を平均化させることができる。光学機能部１ａは、例えば、光を導光板１の面内で広げる機能を有することができる。光学機能部１ａは、例えば、第一主面１ｃ側に設けられた円錐や四角錐、六角錐等の多角錐形等の凹み、あるいは、円錐台（図３参照）、多角錐台、円錐台の側面が内側に向かって凸の湾曲面で構成されているもの（図９参照）等の凹みである。これにより、導光板１と、光学機能部１ａ内にある屈折率の異なる材料（例えば空気）と凹みの傾斜面との界面で照射された光を発光体３の側方方向に反射するものを用いることができる。また、例えば、傾斜面を有する凹みに光反射性の材料（例えば金属等の反射膜や白色の樹脂）等を設けたものであってもよい。光学機能部１ａの傾斜面は、断面視において平面でもよく、曲面でもよい。さらに、光学機能部１ａである凹みの深さは、前述の凹部１７の深さを考慮して決定される。すなわち、光学機能部１ａと凹部１７の深さは、これらが離間している範囲で適宜設定できる。 (Optical function part 1a)
The light guide plate 1 can be provided with an optical function portion 1a having a function of reflecting and diffusing light from the light emitting body 3 on the first main surface 1c side. The light guide plate 1 can spread the light from the light emitting body 3 laterally and average the light emission intensity in the plane of the light guide plate 1. The optical function unit 1a can have a function of spreading light within the surface of the light guide plate 1, for example. The optical function unit 1a is, for example, a recess such as a cone, a quadrangular pyramid, or a polygonal pyramid such as a hexagonal pyramid provided on the first principal surface 1c side, or a truncated cone (see FIG. 3), a truncated pyramid, a truncated cone Is a dent such as one having a curved surface convex toward the inside (see FIG. 9). As a result, the light emitted from the interface between the light guide plate 1 and the material (for example, air) having different refractive indices in the optical function portion 1a and the inclined surface of the recess is reflected in the lateral direction of the light emitter 3. Can be used. Further, for example, a material having a light-reflecting property (for example, a reflective film such as a metal or a white resin) may be provided in the recess having the inclined surface. The inclined surface of the optical function part 1a may be a flat surface or a curved surface in a sectional view. Further, the depth of the recess that is the optical function unit 1a is determined in consideration of the depth of the recess 17 described above. That is, the depths of the optical function portion 1a and the concave portion 17 can be appropriately set within a range where they are separated from each other.

光学機能部１ａは、後述するように、それぞれの発光体３に対応する位置、つまり、第二主面１ｄ側に配置された発光体３と反対側の位置に設けられることが好ましい。特に、発光体３の光軸と、光学機能部１ａの中心軸とが略一致することが好ましい。したがって、第一主面１ｃに形成される光学機能部１ａは、その中心が第二主面１ｄに形成される凹部１７の底面の中心と一致するように設けられる。これにより、凹部１７の中心に発光体３を配置することで、発光体３の光軸を光学機能部１ａの中心軸に容易に一致させることが可能となる。光学機能部１ａの大きさは、適宜設定することができる。 As will be described later, the optical function portion 1a is preferably provided at a position corresponding to each light emitting body 3, that is, at a position opposite to the light emitting body 3 arranged on the second main surface 1d side. In particular, it is preferable that the optical axis of the light emitting body 3 and the central axis of the optical function part 1a substantially coincide with each other. Therefore, the optical function portion 1a formed on the first main surface 1c is provided so that its center coincides with the center of the bottom surface of the recess 17 formed on the second main surface 1d. Accordingly, by disposing the light emitting body 3 in the center of the recess 17, it becomes possible to easily align the optical axis of the light emitting body 3 with the central axis of the optical function portion 1a. The size of the optical function unit 1a can be set appropriately.

導光板１に複数の凹部１７と光学機能部１ａを設けて、凹部１７に発光体３を配置する構造によって、発光体３と光学機能部１ａとの両方を高い位置精度で配置できる。このことにより、発光素子１１からの光を光学機能部１ａで精度よく均一化させ、輝度ムラや色ムラの少ない良質なバックライト用光源とすることができる。発光体３を配置する凹部１７の反対側の面に光学機能部１ａを設ける導光板１は、発光体３を配置する凹部１７の位置に光学機能部１ａを設けることで、発光素子１１と光学機能部１ａとの位置決めをより容易にすることができ、位置ずれを抑制し配置できる。 Due to the structure in which the light guide plate 1 is provided with the plurality of recesses 17 and the optical function part 1a and the light emitter 3 is disposed in the recess 17, both the light emitter 3 and the optical function part 1a can be disposed with high positional accuracy. As a result, the light from the light emitting element 11 can be made uniform in the optical function section 1a with high accuracy, and a high-quality backlight light source with less uneven brightness and uneven color can be obtained. The light guide plate 1 in which the optical function portion 1a is provided on the surface opposite to the concave portion 17 in which the light emitting body 3 is arranged has the optical function portion 1a provided in the concave portion 17 in which the light emitting body 3 is arranged. Positioning with the functional unit 1a can be made easier, and positional displacement can be suppressed and arranged.

複数の凹部１７のある導光板１に複数の発光体３を配置する発光モジュール１００は、導光板１の平面視において、発光体３を二次元に配列する。好ましくは、複数の発光体３は、図２に示すように、直交する二方向、つまり、ｘ方向およびｙ方向に沿って二次元的に配列される凹部１７に配設される。複数の発光体３を配置する凹部１７のｘ方向の配列ピッチｐｘと、ｙ方向の配列ピッチｐｙは、図２の例に示すように、ｘ方向およびｙ方向の間でピッチが同じであってもよいし、異なっていてもよい。また、配列の二方向は必ずしも直交していなくてもよい。また、ｘ方向またはｙ方向の配列ピッチは等間隔に限られず、不等間隔であってもよい。例えば、導光板１の中央から周辺に向かって間隔が広くなるように発光体３を配置する凹部１７が配列されていてもよい。なお、凹部１７に配置される発光体３間のピッチとは、発光体３の光軸間の距離、すなわち中心間の距離である。 In the light emitting module 100 in which the plurality of light emitters 3 are arranged on the light guide plate 1 having the plurality of recesses 17, the light emitters 3 are two-dimensionally arranged in a plan view of the light guide plate 1. Preferably, as shown in FIG. 2, the plurality of light emitters 3 are arranged in the recesses 17 that are two-dimensionally arranged along two orthogonal directions, that is, the x direction and the y direction. The x-direction of the array pitch p x recess 17 to place a plurality of light emitters 3, the arrangement pitch p y in the y direction, as shown in the example of FIG. 2, the pitch is the same between the x and y directions It can be different or different. Also, the two directions of the array do not necessarily have to be orthogonal. Further, the arrangement pitch in the x direction or the y direction is not limited to equal intervals and may be unequal intervals. For example, the recesses 17 for arranging the light emitters 3 may be arranged such that the distance from the center of the light guide plate 1 increases toward the periphery. The pitch between the light emitters 3 arranged in the recesses 17 is the distance between the optical axes of the light emitters 3, that is, the distance between the centers.

（第二光反射性部材１６）
第二光反射性部材１６は、図３に示すように、導光板１の第二主面１ｄおよび発光体３を被覆する。詳細には、第二光反射性部材１６は、導光板１の第二主面１ｄ、透光性の接合部材１４の傾斜面１４ａおよび第一光反射性部材１５の外側面で、接合部材１４で被覆していない領域を被覆する。 (Second light reflecting member 16)
As shown in FIG. 3, the second light reflecting member 16 covers the second major surface 1d of the light guide plate 1 and the light emitting body 3. Specifically, the second light-reflecting member 16 includes the second main surface 1d of the light guide plate 1, the inclined surface 14a of the translucent joining member 14 and the outer surface of the first light-reflecting member 15, and the joining member 14 The area not covered with is covered.

第二光反射性部材１６は、発光素子１１から出射する光、導光板１内に入射した光を反射し、外部に光を放射する発光面となる第一主面１ｃ側に光を導くことで、光取り出し効率を向上することができる。また、導光板１に積層することで、導光板１を補強する。さらに、発光素子１１を保護する部材と導光板１の第二主面１ｄの表面を反射する層とを兼ねることにより、発光モジュール１００の薄型化を図ることができる。 The second light reflecting member 16 reflects the light emitted from the light emitting element 11 and the light entering the light guide plate 1, and guides the light to the first main surface 1c side which is a light emitting surface for emitting light to the outside. Therefore, the light extraction efficiency can be improved. Moreover, by stacking the light guide plate 1 on the light guide plate 1, the light guide plate 1 is reinforced. Further, the light emitting module 100 can be thinned by also serving as a member that protects the light emitting element 11 and a layer that reflects the surface of the second main surface 1d of the light guide plate 1.

第二光反射性部材１６は、前述の第一光反射性部材１５と同じ材料、すなわち、光を反射する添加物である白色粉末等を透明樹脂に添加している白色樹脂が好適に使用できる。第二光反射性部材１６は、発光素子１１の発光を有効に導光板１の第一主面１ｃから外部に放射させる。
また、第二光反射性部材１６は、第一光反射性部材１５と同じように発光素子１１から出射される光に対して６０％以上の反射率を有し、好ましくは９０％以上の反射率を有する白色樹脂が適している。この白色樹脂は、白色粉末等の白色の顔料を含有させた樹脂であることが好ましい。特に、酸化チタン等の無機白色粉末を含有させたシリコーン樹脂が好ましい。これにより、導光板１の一面を被覆するために比較的大量に用いられる材料として酸化チタンのような安価な原材料を多く用いることで、発光モジュール１００を安価にすることができる。 For the second light reflecting member 16, the same material as that of the first light reflecting member 15 described above, that is, a white resin in which a white powder that is an additive that reflects light is added to a transparent resin can be preferably used. .. The second light reflecting member 16 effectively radiates the light emitted from the light emitting element 11 from the first main surface 1c of the light guide plate 1 to the outside.
The second light-reflecting member 16 has a reflectance of 60% or more, and preferably 90% or more, with respect to the light emitted from the light emitting element 11, like the first light-reflecting member 15. A white resin having an index is suitable. This white resin is preferably a resin containing a white pigment such as white powder. In particular, a silicone resin containing an inorganic white powder such as titanium oxide is preferable. Accordingly, the light emitting module 100 can be made inexpensive by using a large amount of inexpensive raw materials such as titanium oxide as a material used in a relatively large amount to cover one surface of the light guide plate 1.

以上の発光モジュール１００は、導光板１に凹部１７を設けて、この凹部１７に、発光体３を配置するので、全体を薄型化できる。また、導光板１に凹部１７を設けて、凹部１７に発光体３を配置するので、発光体３と導光板１との実装精度が向上する。とくに、発光素子１１に波長変換部材１２を接合して、発光素子１１と透光性部材１０とが一体構造となった発光体３を導光板１の凹部１７に配置する構造とすることで、波長変換部材１２と発光素子１１の導光板１への実装精度が向上し、優れた発光特性を実現できる。また、発光素子１１の光を波長変換部材１２に透過させて導光板１に導光し、外部に放射する発光モジュール１００においては、発光素子１１と波長変換部材１２と導光板１とを精度よく配置できることから、導光板１から外部に放射される光の色ムラや輝度ムラ等の発光特性を改善して、特に優れた発光特性を実現する。 In the light emitting module 100 described above, since the light guide plate 1 is provided with the concave portion 17 and the light emitting body 3 is disposed in the concave portion 17, the entire thickness can be reduced. Further, since the recess 17 is provided in the light guide plate 1 and the light emitter 3 is arranged in the recess 17, mounting accuracy of the light emitter 3 and the light guide plate 1 is improved. In particular, the wavelength conversion member 12 is joined to the light emitting element 11, and the light emitting body 3 in which the light emitting element 11 and the translucent member 10 are integrated is arranged in the recess 17 of the light guide plate 1. The mounting accuracy of the wavelength conversion member 12 and the light emitting element 11 on the light guide plate 1 is improved, and excellent light emitting characteristics can be realized. Further, in the light emitting module 100 that transmits the light of the light emitting element 11 to the wavelength converting member 12 to guide it to the light guide plate 1 and radiates it to the outside, the light emitting element 11, the wavelength converting member 12, and the light guide plate 1 are accurately arranged. Since they can be arranged, the light emission characteristics such as color unevenness and brightness unevenness of the light emitted from the light guide plate 1 are improved, and particularly excellent light emission characteristics are realized.

透光性の接合部材１４が、透光性部材１０の外側面、導光板１の内側面と接し、さらに、凹部１７の外に位置する第一光反射性部材１５と接することで、透光性部材１０から出射光で、第二光反射性部材１６側に出た光をより発光体３の側方に導くことができ輝度ムラが改善される。また、透光性部材１０から出射光をより導光板１に入射することができ、光取り出し効率を向上することができる。 The translucent joining member 14 is in contact with the outer surface of the translucent member 10, the inner surface of the light guide plate 1, and further with the first light reflecting member 15 located outside the recess 17 to allow translucency. The light emitted from the flexible member 10 can guide the light emitted toward the second light reflecting member 16 to the side of the light emitting body 3 to improve the uneven brightness. Further, the emitted light from the translucent member 10 can be further incident on the light guide plate 1, and the light extraction efficiency can be improved.

直下型の液晶ディスプレイ装置では、液晶パネルと発光モジュールとの距離が近いため、発光モジュールの色ムラや輝度ムラが液晶ディスプレイ装置の色ムラや輝度ムラに影響を及ぼす可能性がある。そのため、直下型の液晶ディスプレイ装置の発光モジュールとして、色ムラや輝度ムラの少ない発光モジュールが望まれている。本実施形態の発光モジュール１００の構成をとれば、発光モジュール１００の厚みを、５ｍｍ以下、３ｍｍ以下、１ｍｍ以下等と、薄くしながら、輝度ムラや色ムラを少なくできる。 In the direct type liquid crystal display device, since the liquid crystal panel and the light emitting module are close to each other, the color unevenness and the brightness unevenness of the light emitting module may affect the color unevenness and the brightness unevenness of the liquid crystal display device. Therefore, as a light emitting module of a direct type liquid crystal display device, a light emitting module with less color unevenness and brightness unevenness is desired. With the configuration of the light emitting module 100 of the present embodiment, it is possible to reduce the unevenness in brightness and the unevenness in color while reducing the thickness of the light emitting module 100 to 5 mm or less, 3 mm or less, 1 mm or less.

以上の実施形態では、発光体３が透光性部材１０に波長変化部材１２と光拡散部１３とを備えており、この発光体３の一部を導光板１の凹部１７に配置することで、発光素子１１から照射される光を波長変化部材１２と光拡散部１３とに透過させて導光板１に照射する構造としている。ただ、発光モジュールは、必ずしも発光体の透光性部材が、波長変化部材と光拡散部の両方を備える必要はない。発光モジュールは、例えば発光体の透光性部材に波長変化部材のみを設けて、導光板の凹部の底面に光拡散部を設けることもできる。 In the above-described embodiment, the light emitting body 3 includes the wavelength changing member 12 and the light diffusing portion 13 in the light transmitting member 10. By disposing a part of the light emitting body 3 in the recess 17 of the light guide plate 1. The light emitted from the light emitting element 11 is transmitted through the wavelength changing member 12 and the light diffusing section 13 to irradiate the light guide plate 1. However, in the light emitting module, the light transmissive member of the light emitter does not necessarily have to include both the wavelength changing member and the light diffusing section. In the light emitting module, for example, the light transmissive member of the light emitting body may be provided with only the wavelength changing member, and the light diffusing portion may be provided on the bottom surface of the recess of the light guide plate.

（発光モジュール１００の製造工程）
まず、発光体３を準備する。以下、図１０及び図１１は、本実施形態にかかる発光体３の製造工程を示している。
図１０（ａ）と（ｂ）に示す工程で、発光素子１１の主発光面１１ｃを覆う透光性部材１０を形成する。図に示す透光性部材１０は、波長変換部材１２と光拡散部１３の積層体としている。
図１０（ａ）に示す工程で、ベースシート３０の表面に均一な厚さで波長変換部材１２を配置した第１のシート３１と、ベースシート３０の表面に均一な厚さに光拡散部１３を配置した第２のシート３２とを、波長変換部材１２と光拡散部１３とを接合する状態で積層する。波長変換部材１２および光拡散部１３が熱硬化樹脂を母材とする場合は、半硬化状態で２つを積層し硬化させることで接合することができる。また、波長変換部材１２と光拡散部１３は透光性接合部材で接合してもよい。ベースシート３０には、たとえば粘着層を介して剥離できるように波長変換部材１２と光拡散部１３を付着してもよい。
さらに、図１０（ｂ）に示す工程で、第２のシート３２のベースシート３０をプレート３３に剥離できるように配置し、第１のシート３１の波長変換部材１２に接合しているベースシート３０を剥離する。 (Manufacturing process of the light emitting module 100)
First, the light emitting body 3 is prepared. Hereinafter, FIG. 10 and FIG. 11 show a manufacturing process of the light emitting body 3 according to the present embodiment.
In the steps shown in FIGS. 10A and 10B, the translucent member 10 that covers the main light emitting surface 11c of the light emitting element 11 is formed. The translucent member 10 shown in the figure is a laminated body of the wavelength conversion member 12 and the light diffusion portion 13.
In the step shown in FIG. 10A, the first sheet 31 in which the wavelength conversion member 12 is arranged on the surface of the base sheet 30 with a uniform thickness, and the light diffusion portion 13 with a uniform thickness on the surface of the base sheet 30. And the second sheet 32 on which the wavelength conversion member 12 and the light diffusing portion 13 are bonded to each other. When the wavelength conversion member 12 and the light diffusion part 13 use a thermosetting resin as a base material, they can be joined by stacking and curing the two in a semi-cured state. Further, the wavelength conversion member 12 and the light diffusing portion 13 may be joined by a translucent joining member. The wavelength conversion member 12 and the light diffusing section 13 may be attached to the base sheet 30 so as to be peelable via an adhesive layer, for example.
Further, in the step shown in FIG. 10B, the base sheet 30 of the second sheet 32 is arranged on the plate 33 so that it can be peeled off, and is bonded to the wavelength conversion member 12 of the first sheet 31. Peel off.

図１０（ｃ）に示す工程で、透光性部材１０に発光素子１１が接合される。発光素子１１は、主発光面１１ｃ側を透光性部材１０に接合する。透光性部材１０が、波長変換部材１２および光拡散部１３で形成されている場合には、発光素子１１は、透光性部材１０の波長変換部材１２に所定の間隔で接合される。
発光素子１１は、透光性接着部材１９を介して透光性部材１０に接合する。透光性接着部材１９は、透光性部材１０上および／または発光素子１１の主発光面１１ｃ上に塗布されて、発光素子１１と透光性部材１０を接合する。この時、図１０（ｃ）に示すように、塗布された透光性接着部材１９が発光素子１１の側面に這い上がり、発光素子１１の側面の一部を透光性接着部材１９が被覆する。また、透光性部材１０と発光素子１１の主発光面１１ｃの間にも透光性接着部材１９を配置してもよい。
発光素子１１の間隔は、図１１（ｆ）で示すように、発光素子１１の間を切断して、透光性部材１０の外形が所定の大きさとなる寸法に設定される。発光素子１１の間隔が、透光性部材１０の外形を特定するからである。 In the step shown in FIG. 10C, the light emitting element 11 is bonded to the translucent member 10. The light emitting element 11 has the main light emitting surface 11c side bonded to the translucent member 10. When the translucent member 10 is formed of the wavelength conversion member 12 and the light diffusion portion 13, the light emitting element 11 is bonded to the wavelength conversion member 12 of the translucent member 10 at a predetermined interval.
The light emitting element 11 is bonded to the translucent member 10 via the translucent adhesive member 19. The translucent adhesive member 19 is applied on the translucent member 10 and/or on the main light emitting surface 11 c of the light emitting element 11 to bond the light emitting element 11 and the translucent member 10. At this time, as shown in FIG. 10C, the applied translucent adhesive member 19 crawls onto the side surface of the light emitting element 11, and the translucent adhesive member 19 covers a part of the side surface of the light emitting element 11. .. Further, the translucent adhesive member 19 may be arranged between the translucent member 10 and the main light emitting surface 11c of the light emitting element 11.
As shown in FIG. 11F, the intervals between the light emitting elements 11 are set such that the light emitting elements 11 are cut and the outer shape of the translucent member 10 has a predetermined size. This is because the interval between the light emitting elements 11 specifies the outer shape of the translucent member 10.

図１１（ｄ）に示す工程で、発光素子１１を埋設するように、第一光反射性部材１５を形成する。第一光反射性部材１５は、好ましくは白色樹脂である。第一光反射性部材１５は、透光性部材１０上に配置され、発光素子１１を埋設する状態で硬化する。第一光反射性部材１５は、発光素子１１を完全に埋設する厚さ、図１１（ｄ）にあっては発光素子１１の電極１１ｂを埋設する厚さに配置される。第一光反射性部材１５は、圧縮成形、トランスファー成形または塗布等で成形することができる。 In the step shown in FIG. 11D, the first light reflecting member 15 is formed so as to embed the light emitting element 11. The first light reflecting member 15 is preferably white resin. The first light-reflecting member 15 is disposed on the light-transmitting member 10 and is cured in a state where the light emitting element 11 is embedded. The first light-reflecting member 15 is arranged to have a thickness that completely embeds the light emitting element 11, and in FIG. 11D, a thickness that embeds the electrode 11b of the light emitting element 11. The first light reflecting member 15 can be formed by compression molding, transfer molding, coating, or the like.

図１１（ｅ）に示す工程で、硬化した第一光反射性部材１５の一部を除去して発光素子１１の電極１１ｂを露出させる。さらに、第一光反射性部材１５から露出する電極１１ｂには、図示しないが、導電膜を用いて電極保護端子を形成してもよい。この場合、第一光反射性部材１５の表面に、銅、ニッケル、金等の導電膜をスパッタなどで設けて電極１１ｂに接続し、その後、導電膜の一部を除去して、電極１１ｂに導電膜を積層して発光体３の電極保護端子とする。導電膜の除去は、ドライエッチング、ウエットエッチング、レーザアブレーション等を用いることができる。 In the step shown in FIG. 11E, a part of the cured first light reflecting member 15 is removed to expose the electrode 11b of the light emitting element 11. Further, although not shown, a conductive film may be used to form an electrode protection terminal on the electrode 11b exposed from the first light reflecting member 15. In this case, a conductive film of copper, nickel, gold or the like is provided on the surface of the first light reflecting member 15 by sputtering or the like to connect to the electrode 11b, and then a part of the conductive film is removed to form the electrode 11b. A conductive film is laminated to serve as an electrode protection terminal of the light emitting body 3. For removing the conductive film, dry etching, wet etching, laser ablation, or the like can be used.

図１１（ｆ）に示す工程で、第一光反射性部材１５と、透光性部材１０を裁断して発光体３に個片化する。個片化された発光体３は、透光性部材１０に発光素子１１が接合され、発光素子１１の周囲には第一光反射性部材１５が設けられて、電極１１ｂを第一光反射性部材１５の表面に露出させている。
以上、発光体の準備について、上述の全ての工程を行ってもよいし、一部の工程を行ってもよい。あるいは、発光体を購入によって準備してもよい。 In the step shown in FIG. 11F, the first light-reflecting member 15 and the light-transmitting member 10 are cut into individual light-emitting bodies 3. In the light-emitting body 3 that has been separated into individual pieces, the light-emitting element 11 is joined to the light-transmissive member 10, the first light-reflecting member 15 is provided around the light-emitting element 11, and the electrode 11b is provided with the first light-reflecting property. It is exposed on the surface of the member 15.
As described above, with respect to the preparation of the light emitting body, all the above steps may be performed, or some steps may be performed. Alternatively, the light emitter may be prepared by purchase.

以上の工程で製造された発光体３は、図１２〜図１４に示す工程で、導光板１の凹部１７の底面に固着される。
まず、第二主面１ｄに凹部１７が設けられた導光板１を準備する。
導光板１は、例えば、ポリカーボネートなどの熱可塑性樹脂からなり、図１２（ａ）に示すように、第二主面１ｄに凹部１７が設けられている。
導光板１は、例えば、射出成型やトランスファーモールド、圧縮成形等で成形することができる。導光板１は、凹部１７のある形状に金型で形成して、凹部１７の位置ずれを低減しながら、安価に多量生産できる。ただし、導光板は、板状に成形した後、ＮＣ加工機等で切削加工して凹部を設けることもできる。また、第一主面１ｃに、例えば円錐状の光学機能部１ａを設けることもできる。 The light-emitting body 3 manufactured in the above steps is fixed to the bottom surface of the recess 17 of the light guide plate 1 in the steps shown in FIGS.
First, the light guide plate 1 having the concave portion 17 on the second principal surface 1d is prepared.
The light guide plate 1 is made of, for example, a thermoplastic resin such as polycarbonate, and has a recess 17 in the second main surface 1d as shown in FIG. 12(a).
The light guide plate 1 can be formed by injection molding, transfer molding, compression molding, or the like. The light guide plate 1 is formed in a shape having the concave portion 17 by a mold, and can be mass-produced inexpensively while reducing the positional deviation of the concave portion 17. However, the light guide plate may be formed into a plate shape and then cut by an NC processing machine or the like to form the recess. In addition, for example, a conical optical function portion 1a can be provided on the first main surface 1c.

図１２（ｂ）に示す工程で、導光板１の凹部１７に対応する開口部を備えたマスクＭを、導光板１の第二主面１ｄ上に配置する。
マスクＭの開口部は、導光板１の凹部１７の開口部と同じ大きさ及び形状とすることができる。図１２（ｂ）に示す例では、マスクＭの開口部は、凹部１７の開口部よりも大きい。これにより、マスクＭの開口部と凹部１７の位置合わせの精度が低い場合であっても、凹部１７内に接合部材１４を容易に配置することができる。マスクＭの開口部の形状は、凹部１７の開口部の形状の相似形であることが好ましい。 In the step shown in FIG. 12B, the mask M having an opening corresponding to the recess 17 of the light guide plate 1 is arranged on the second main surface 1d of the light guide plate 1.
The opening of the mask M can have the same size and shape as the opening of the recess 17 of the light guide plate 1. In the example shown in FIG. 12B, the opening of the mask M is larger than the opening of the recess 17. Thereby, even when the alignment accuracy between the opening of the mask M and the recess 17 is low, the joining member 14 can be easily placed in the recess 17. The shape of the opening of the mask M is preferably similar to the shape of the opening of the recess 17.

図１２（ｂ）に示すように、導光板１の第二主面１ｄの端部には、突起部１ｈが設けられており、マスクＭは、この突起部１ｈに対応する篏合部Ｍｂが設けられている。また、マスクＭは、図１５に示すように導光板１の突起部１ｈの厚みよりも薄いものを用いてもよい。 As shown in FIG. 12B, a protrusion 1h is provided at the end of the second main surface 1d of the light guide plate 1, and the mask M has a mating portion Mb corresponding to the protrusion 1h. It is provided. Further, as the mask M, one having a thickness smaller than the thickness of the protrusion 1h of the light guide plate 1 may be used as shown in FIG.

次に、未硬化状態の流動性のあるペースト状又は液状の接合部材１４をマスクＭの開口部内及び導光板１の凹部１７内に配置する。その後、図１２（ｃ）に示すように、スキージ等でマスクＭの開口部及び導光板１の凹部１７にすり込むことで、量産性良く接合部材を凹部１７内に充填することができる。 Next, the fluid paste-like or liquid joining member 14 in the uncured state is placed in the opening of the mask M and in the recess 17 of the light guide plate 1. Then, as shown in FIG. 12C, the joint member can be filled in the recess 17 with good mass productivity by rubbing the opening of the mask M and the recess 17 of the light guide plate 1 with a squeegee or the like.

凹部１７に接合部材１４を配置する際、凹部１７と接合部材１４との間にボイドが残存する場合がある。これにより、ボイドの界面で発光体３からの光が反射あるいは屈折し、所望の光学特性を有する発光モジュールが得られ難い。図７（ａ）に示すように、凹部１７は、断面視において、凹部の底面の大きさが開口部の大きさよりも小さい。これにより、凹部１７の側面が底面１７ａに垂直な平面のみで構成される場合に比べて、凹部１７と接合部材１４との間に発生するボイドを排出し易くなるため、ボイドに起因する輝度ムラを低減させることができる。 When the joining member 14 is arranged in the recess 17, a void may remain between the recess 17 and the joining member 14. As a result, the light from the light emitting body 3 is reflected or refracted at the void interface, and it is difficult to obtain a light emitting module having desired optical characteristics. As shown in FIG. 7A, in the recess 17, the size of the bottom surface of the recess is smaller than the size of the opening in a cross-sectional view. As a result, voids generated between the recess 17 and the joining member 14 are more easily discharged than in the case where the side surface of the recess 17 is composed of only a plane perpendicular to the bottom surface 17a, and thus uneven brightness caused by the void is generated. Can be reduced.

図１２（ｄ）に示す工程で、マスクを除去する。 The mask is removed in the step shown in FIG.

図１３（ｅ）及び図１３（ｆ）に示す工程で、接合部材１４を塗布した凹部１７内に、発光体３の一部を配置する。詳細には、図１３（ｆ）に示すように、発光体３の透光性部材１０が、凹部１７の底面に対向するように配置する。また、第一光反射性部材の一部は、凹部１７の外に位置する。
発光体３は、平面視において、透光性部材１０の中心と凹部１７の中心が一致するように配置し、接合部材１４を硬化させて導光板１に接合される。 In the process shown in FIGS. 13E and 13F, a part of the light emitting body 3 is arranged in the recess 17 coated with the joining member 14. Specifically, as shown in FIG. 13F, the translucent member 10 of the light-emitting body 3 is arranged so as to face the bottom surface of the recess 17. Further, a part of the first light reflecting member is located outside the recess 17.
The light-emitting body 3 is arranged so that the center of the translucent member 10 and the center of the recess 17 coincide with each other in plan view, and the joining member 14 is cured to be joined to the light guide plate 1.

ここで、平面視において、凹部１７の開口部の内形は、発光体３の透光性部材１０の外形よりも大きく、凹部１７内に発光体３の一部を配置した際、凹部１７の内周と発光体３の透光性部材１０の外周との間に隙間１８が形成される。この隙間１８は、凹部１７に塗布される未硬化状態の接合部材１４で充填される。 Here, in plan view, the inner shape of the opening of the recess 17 is larger than the outer shape of the translucent member 10 of the light emitter 3, and when a part of the light emitter 3 is arranged in the recess 17, the recess 17 has a shape larger than that of the recess 17. A gap 18 is formed between the inner circumference and the outer circumference of the translucent member 10 of the light emitter 3. The gap 18 is filled with the uncured joining member 14 applied to the recess 17.

また、凹部１７内に塗布する接合部材１４の塗布量を調整することで、凹部１７の内側面と発光体３の外側面との間の隙間１８から凹部１７の外側まで接合部材１４が押し出される。凹部１７から押し出される接合部材１４は、第一光反射性部材１５の一部と接する位置まで這い上がって第一光反射性部材１５の一部を被覆する。さらに、接合部材１４は、第二主面１ｄと接する位置まで広がって、第二主面１ｄの一部を被覆するこの状態で、接合部材１４の上面は、垂直断面視において、発光体３の上端部から外側に向かって傾斜面１４ａが形成される。接合部材１４の傾斜面１４ａは、第一光反射性部材１５の外側面との間でなす角を鋭角とし、好ましくは傾斜角αが５°〜５０°となるように形成される。 Further, by adjusting the application amount of the joining member 14 applied to the inside of the recess 17, the joining member 14 is pushed out to the outside of the recess 17 from the gap 18 between the inner surface of the recess 17 and the outer surface of the light emitter 3. .. The joining member 14 extruded from the recess 17 crawls up to a position in contact with a part of the first light reflecting member 15 and covers a part of the first light reflecting member 15. Further, the joining member 14 spreads to a position in contact with the second principal surface 1d and covers a part of the second principal surface 1d. In this state, the upper surface of the joining member 14 is a vertical cross-sectional view of the luminous body 3. An inclined surface 14a is formed from the upper end portion toward the outside. The inclined surface 14a of the joining member 14 is formed such that an angle formed with the outer surface of the first light reflecting member 15 is an acute angle, and the inclination angle α is preferably 5° to 50°.

凹部１７に塗布する接合部材１４の塗布量は、発光体３を凹部１７に接合する状態で、発光体３の外側面を被覆する接合部材１４が導光板１の第二主面１ｄよりも高くなる量、すなわち凹部１７から外側に溢れるような量とすることができる。ただし、接合部材１４の塗布量は、接合部材１４の傾斜面１４ａと第一光反射性部材１５の外側面と接する位置が、発光体３の外側面の電極側の縁よりも低くなるように調整される。 The application amount of the joining member 14 applied to the recess 17 is higher than that of the second main surface 1d of the light guide plate 1 when the joining member 14 covering the outer surface of the light emitter 3 is in the state where the light emitter 3 is joined to the recess 17. That is, the amount can be such that it overflows from the recess 17 to the outside. However, the application amount of the joining member 14 is set so that the position where the inclined surface 14a of the joining member 14 and the outer surface of the first light reflecting member 15 contact each other is lower than the edge of the outer surface of the light emitting body 3 on the electrode side. Adjusted.

また、未硬化状態の接合部材１４は、発光体３を導光板１に接合した後、隙間１８に塗布して第一光反射性部材１５の一部を被覆する位置まで設けてもよい。換言すると、凹部１７内に発光体３の一部を配置する際、接合部材１４が凹部１７内に収まる量を塗布する。その後、発光体３の外側面、詳細には、第一光反射性部材１５の外側面を被覆するように、接合部材１４をさらに塗布する。この時、接合部材１４の塗布量は、発光体３の外側面すべてを被覆しない量とする。また、接合部材１４が導光板１の第二主面１ｄの一部を被覆するように接合部材１４を塗布することがより好ましい。 In addition, the uncured joining member 14 may be applied to the gap 18 after the light emitting body 3 is joined to the light guide plate 1, and may be provided up to a position where a part of the first light reflecting member 15 is covered. In other words, when disposing a part of the light-emitting body 3 in the recess 17, the joining member 14 is applied in an amount that fits in the recess 17. After that, the joining member 14 is further applied so as to cover the outer surface of the light emitting body 3, more specifically, the outer surface of the first light reflecting member 15. At this time, the application amount of the joining member 14 is an amount that does not cover the entire outer surface of the light emitting body 3. It is more preferable to apply the joining member 14 so that the joining member 14 covers a part of the second main surface 1d of the light guide plate 1.

発光体３を導光板１に配置した後、図１３（ｇ）に示す工程で、第二光反射性部材１６を導光板１の第二主面１ｄに形成する。第二光反射性部材１６は発光体３を内部に埋設する厚さに形成される。 After disposing the light emitting body 3 on the light guide plate 1, the second light reflecting member 16 is formed on the second main surface 1d of the light guide plate 1 in a step shown in FIG. The second light-reflecting member 16 is formed to have a thickness in which the light emitting body 3 is embedded.

図１４（ｈ）に示す工程で、硬化した第二光反射性部材１６の一部を除去して、電極１１ｂを表面に露出させる。
なお、図１３（ｇ）に示す工程では、第二光反射性部材１６を、発光体３を内部に埋設する厚さに形成したが、電極１１ｂの表面と同一平面、または電極１１ｂの表面よりも低い位置となる厚さに形成して、上述した除去工程を省略してもよい。 In the step shown in FIG. 14H, a part of the cured second light reflecting member 16 is removed to expose the electrode 11b on the surface.
In the step shown in FIG. 13G, the second light-reflecting member 16 was formed to a thickness in which the light emitting body 3 is embedded, but the second light reflecting member 16 is flush with the surface of the electrode 11b or the surface of the electrode 11b. The removal step described above may be omitted by forming it to a lower thickness.

図１４（ｉ）に示す工程で、第二光反射性部材１６及び第一光反射性部材１５の表面に導電膜２４を積層する。この工程では、発光素子１１の電極１１ｂと第一光反射性部材１５と第二光反射性部材１６の上の略全面に、例えば、Ｃｕ／Ｎｉ／Ａｕの導電膜２４をスパッタ等で形成する。 In the step shown in FIG. 14I, the conductive film 24 is laminated on the surfaces of the second light reflecting member 16 and the first light reflecting member 15. In this step, a conductive film 24 of, for example, Cu/Ni/Au is formed by sputtering or the like on substantially the entire surface of the electrode 11b of the light emitting element 11, the first light reflecting member 15, and the second light reflecting member 16. ..

図１４（ｊ）に示す工程で、電極１１ｂ間の導電膜２４の一部を除去する。 In the step shown in FIG. 14J, a part of the conductive film 24 between the electrodes 11b is removed.

以上の工程では、１枚の導光板１に１または複数の発光体３を配置している発光モジュール１００を製造する。 In the above steps, the light emitting module 100 in which one or a plurality of light emitting bodies 3 are arranged on one light guide plate 1 is manufactured.

（発光モジュール２００の製造方法）
図９に示す発光モジュール２００の発光体３Ａは、以下のようにして製造される。
図１６（ａ）に示す工程で、透光性部材１０を形成する。図に示す透光性部材１０は、所定の大きさの波長変換部材１２と光拡散部１３を積層してなる積層体としている。 (Method of manufacturing light emitting module 200)
The light-emitting body 3A of the light-emitting module 200 shown in FIG. 9 is manufactured as follows.
In the process shown in FIG. 16A, the translucent member 10 is formed. The translucent member 10 shown in the figure is a laminated body formed by laminating a wavelength converting member 12 and a light diffusing portion 13 having a predetermined size.

図１６（ｂ）に示す工程で、透光性部材１０を埋設するように、透光性樹脂部２０を形成する。このように、波長変換部材１２と光拡散部１３の外側面を透光性樹脂部２０で被覆して保護する。その後、図１６（ｃ）に示す工程で、硬化した透光性樹脂部２０の一部を除去して光拡散部１３を露出させる。 In the step shown in FIG. 16B, the translucent resin portion 20 is formed so as to embed the translucent member 10. In this way, the outer surfaces of the wavelength conversion member 12 and the light diffusion portion 13 are covered and protected by the transparent resin portion 20. Then, in the step shown in FIG. 16C, a part of the cured transparent resin portion 20 is removed to expose the light diffusion portion 13.

図１６（ｄ）で示すように、透光性部材１０をプレート３３に配置したベースシート３０の上に光拡散部１３が接するように配置する。その後、透光性部材１０に発光素子１１を接合させる。透光性部材１０上および／または発光素子１１の主発光面１１ｃ上に透光性接着部材１９を塗布し、主発光面１１ｃ側を透光性部材１０に接合する。発光素子１１は、１つの透光性部材１０の波長変換部材１２上に、上面視において、発光素子１１の主発光面１１ｃの中心と透光性部材１０の中心がほぼ一致するように接合される。 As shown in FIG. 16D, the translucent member 10 is arranged on the base sheet 30 arranged on the plate 33 so that the light diffusion portion 13 is in contact therewith. After that, the light emitting element 11 is bonded to the translucent member 10. A translucent adhesive member 19 is applied on the translucent member 10 and/or on the main light emitting surface 11c of the light emitting element 11, and the main light emitting surface 11c side is bonded to the translucent member 10. The light emitting element 11 is bonded onto the wavelength conversion member 12 of one light transmissive member 10 so that the center of the main light emitting surface 11c of the light emitting element 11 and the center of the light transmissive member 10 are substantially aligned in a top view. It

図１７（ｅ）に示す工程で、発光素子１１を埋設するように、第一光反射性部材１５を形成する。第一光反射性部材１５は、透光性部材１０上に塗布され、発光素子１１を埋設する状態で硬化する。その後、図１７（ｆ）に示す工程で、硬化した第一光反射性部材１５の一部を除去して発光素子１１の電極１１ｂを露出させる。 In the step shown in FIG. 17E, the first light reflecting member 15 is formed so as to embed the light emitting element 11. The first light-reflecting member 15 is applied onto the light-transmitting member 10 and cured in a state where the light emitting element 11 is embedded. Then, in the step shown in FIG. 17F, a part of the cured first light reflecting member 15 is removed to expose the electrode 11b of the light emitting element 11.

図１７（ｇ）に示す工程で、第一光反射性部材１５と透光性樹脂部２０とを切断して発光体３Ａに個片化する。個片化された発光体３Ａは、波長変換部材１２と光拡散部１３の積層体の外周面が透光性樹脂部２０で被覆された透光性部材１０が発光素子１１に接合され、さらに、発光素子１１の周囲には第一光反射性部材１５が設けられて、電極１１ｂを第一光反射性部材１５の表面に露出させている。 In the step shown in FIG. 17G, the first light-reflecting member 15 and the translucent resin portion 20 are cut into individual light-emitting bodies 3A. In the individual light-emitting body 3A, the light-transmissive member 10 in which the outer peripheral surface of the laminated body of the wavelength conversion member 12 and the light diffusion portion 13 is covered with the light-transmissive resin portion 20 is joined to the light-emitting element 11, and A first light reflecting member 15 is provided around the light emitting element 11 to expose the electrode 11 b on the surface of the first light reflecting member 15.

以上の工程で製造された発光体３Ａは、図１２〜図１４に示す前述の工程と同様にして、導光板１の凹部１７に接合された後、導光板１の第二主面１ｄと発光体３Ａを被覆する第二光反射性部材１６が形成されて発光モジュール２００が製造される。 The light-emitting body 3A manufactured in the above process is bonded to the recess 17 of the light guide plate 1 and then emits light with the second main surface 1d of the light guide plate 1 in the same manner as the above-described process shown in FIGS. The second light reflecting member 16 that covers the body 3A is formed, and the light emitting module 200 is manufactured.

（他の製造方法）
図１８は、透光性部材１０が波長変換部材１２のみを備える発光体３Ｂを使用し、この発光体３Ｂを導光板１に設けた凹部１７に接合して製造される、図１９に示す発光モジュール３００の製造工程を示している。この発光モジュール３００は、発光体３Ｂが配置される凹部１７の底面に光拡散部１３を配置して製造される。この発光体３Ｂは、波長変換部材１２の表面に発光素子１１を接合した後、図１１に示す工程と同様にして、波長変換部材１２と発光素子１１の表面に第一光反射性部材１５を配置し、透光性部材１０が波長変換部材１２のみを備える発光体３Ｂを製造する。 (Other manufacturing methods)
FIG. 18 shows the light emission shown in FIG. 19, in which the light-transmissive member 10 uses the light-emitting body 3B provided only with the wavelength conversion member 12, and the light-emitting body 3B is bonded to the recess 17 provided in the light guide plate 1. The manufacturing process of the module 300 is shown. This light emitting module 300 is manufactured by arranging the light diffusion portion 13 on the bottom surface of the recess 17 in which the light emitting body 3B is arranged. In this light emitting body 3B, after bonding the light emitting element 11 to the surface of the wavelength conversion member 12, the first light reflecting member 15 is provided on the surfaces of the wavelength conversion member 12 and the light emitting element 11 in the same manner as the process shown in FIG. Then, the light-transmitting member 10 is provided, and the light-emitting body 3B including only the wavelength conversion member 12 is manufactured.

この発光モジュール３００は、以下の工程で製造される。
図１８（ａ）に示す工程で、導光板１の凹部１７の底面に光拡散部１３を設ける。この光拡散部１３は、所定のサイズに成形された板状もしくはシート状の光拡散部を、凹部１７の底面に接合してもよいし、印刷、塗布等で凹部１７の底面に配置することで設けられてもよい。 The light emitting module 300 is manufactured by the following steps.
In the step shown in FIG. 18A, the light diffusion portion 13 is provided on the bottom surface of the recess 17 of the light guide plate 1. The light diffusing portion 13 may be formed by bonding a plate-like or sheet-like light diffusing portion formed in a predetermined size to the bottom surface of the concave portion 17, or by arranging the light diffusing portion on the bottom surface of the concave portion 17 by printing or coating. May be provided.

図１８（ｂ）に示すように、底面に光拡散部１３が設けられた凹部１７に、発光体３Ｂが接合される。発光体３Ｂは、未硬化状態で液状である透光性の接合部材１４を塗布した凹部１７に、発光体３Ｂの一部を透光性部材１０が光拡散部１３に対向するように配置し、接合部材１４を硬化させて導光板１に配置される。 As shown in FIG. 18B, the light emitting body 3B is joined to the concave portion 17 having the light diffusion portion 13 on the bottom surface. The light-emitting body 3B is disposed in a recess 17 coated with a translucent bonding member 14 which is liquid in an uncured state, and a part of the light-emitting body 3B is arranged so that the light-transmissive member 10 faces the light diffusion portion 13. The bonding member 14 is cured and placed on the light guide plate 1.

凹部１７に塗布される未硬化状態の接合部材１４は、発光体３Ｂの一部を凹部１７に配置した際に、凹部１７の内周と発光体３Ｂの外周との間にできる隙間１８に充填される。この時、凹部１７の外側まで押し出されて接合部材１４が形成される。凹部１７から押し出される接合部材１４は、前述と同様にして、第一光反射性部材１５の一部と接する位置まで這い上がって第一光反射性部材１５の一部を被覆する。さらに、接合部材１４の上面は、垂直断面視において、発光体３の上端部から外側に向かって傾斜面１４ａが形成される。 The uncured joining member 14 applied to the recess 17 is filled in a gap 18 formed between the inner circumference of the recess 17 and the outer circumference of the light emitter 3B when a part of the light emitter 3B is arranged in the recess 17. To be done. At this time, the joining member 14 is formed by being pushed out to the outside of the recess 17. In the same manner as described above, the joining member 14 extruded from the concave portion 17 crawls up to a position in contact with a part of the first light reflecting member 15 and covers a part of the first light reflecting member 15. Further, the upper surface of the joining member 14 is formed with an inclined surface 14a from the upper end of the light emitting body 3 toward the outside in a vertical sectional view.

発光体３を導光板１に配置した後、図１８（ｄ）に示す工程で、第二光反射性部材１６を導光板１の第二主面１ｄに形成する。第二光反射性部材１６には白色樹脂が使用され、発光体３を内部に埋設する厚さに形成される。 After disposing the light-emitting body 3 on the light guide plate 1, the second light reflecting member 16 is formed on the second main surface 1d of the light guide plate 1 in a step shown in FIG. A white resin is used for the second light reflecting member 16 and is formed to have a thickness in which the light emitting body 3 is embedded.

その後、図１４（ｈ）〜（ｊ）と同様にして、第二光反射性部材１６の表面を研磨して、電極１１ｂを表面に露出させた後、第二光反射性部材１６及び第一光反射性部材１５の表面に導電膜２４を積層し、導電膜２４の一部を除去して、図１９に示す構造の発光モジュール３００が製造される。 Then, in the same manner as in FIGS. 14H to 14J, the surface of the second light reflecting member 16 is polished to expose the electrode 11b on the surface, and then the second light reflecting member 16 and the first By laminating the conductive film 24 on the surface of the light reflecting member 15 and removing a part of the conductive film 24, the light emitting module 300 having the structure shown in FIG. 19 is manufactured.

本実施形態の発光モジュール１００は、複数の発光体３を、それぞれが独立で駆動するように配線されてもよい。また、導光板１を複数の範囲に分割し、１つの範囲内に実装された複数の発光体３を１つのグループとし、該１つのグループ内の複数の発光体３同士を直列または並列に電気的に接続することで同じ回路に接続し、このような発光体グループを複数備えるようにしてもよい。このようなグループ分けを行うことで、ローカルディミング可能な発光モジュールとすることができる。 The light emitting module 100 of the present embodiment may be wired so that each of the plurality of light emitting bodies 3 is independently driven. In addition, the light guide plate 1 is divided into a plurality of ranges, the plurality of light emitting bodies 3 mounted in one range are grouped, and the plurality of light emitting bodies 3 in the one group are electrically connected in series or in parallel. It is also possible to provide a plurality of such light emitter groups by connecting them in the same circuit by electrically connecting the light emitter groups. By performing such grouping, a light emitting module capable of local dimming can be obtained.

本実施形態の発光モジュール１００は、１つが１つの液晶ディスプレイ装置のバックライトとして用いられてもよい。また、複数の発光モジュール１００が並べられて１つの液晶ディスプレイ装置１０００のバックライトとして用いられてもよい。小さい発光モジュール１００を複数作り、それぞれ検査等を行うことで、大きく実装される発光素子１１の数が多い発光モジュール１００を作成する場合と比べて、歩留まりを向上させることができる。 One of the light emitting modules 100 of this embodiment may be used as a backlight of one liquid crystal display device. Further, a plurality of light emitting modules 100 may be arranged and used as a backlight of one liquid crystal display device 1000. By making a plurality of small light emitting modules 100 and inspecting each of them, the yield can be improved as compared with the case of making the light emitting module 100 in which a large number of light emitting elements 11 are mounted.

発光モジュール１００は、図２０に示すように、配線基板２５を有していてもよい。配線基板２５は、例えば、絶縁性の基材に設けられた複数のビアホール内に充填された導電性部材２６と、基材の両面側において導電性部材２６と電気的に接続された配線層２７が形成されている。そして、電極１１ｂが、配線基板２５と電気的に接続されている。
なお、１つの発光モジュール１００が１つの配線基板に接合されてもよいし、複数の発光モジュール１００が、１つの配線基板に接合されてもよい。これにより、外部との電気的な接続端子（例えばコネクタ）を集約できる（つまり、発光モジュール１つごとに用意する必要がない）ため、液晶ディスプレイ装置１０００の構造を簡易にすることができる。 The light emitting module 100 may include a wiring board 25, as shown in FIG. The wiring board 25 includes, for example, a conductive member 26 filled in a plurality of via holes provided in an insulating base material, and a wiring layer 27 electrically connected to the conductive member 26 on both surface sides of the base material. Are formed. The electrode 11b is electrically connected to the wiring board 25.
Note that one light emitting module 100 may be bonded to one wiring board, or a plurality of light emitting modules 100 may be bonded to one wiring board. As a result, electrical connection terminals (for example, connectors) with the outside can be integrated (that is, it is not necessary to prepare each light emitting module individually), so that the structure of the liquid crystal display device 1000 can be simplified.

また、この複数の発光モジュール１００が接合された１つの配線基板を複数並べて一つの液晶ディスプレイ装置１０００のバックライトとしてもよい。この時、例えば、複数の配線基板をフレーム等に載置し、それぞれコネクタ等を用いて外部の電源と接続することができる。 In addition, a plurality of one wiring board to which the plurality of light emitting modules 100 are joined may be arranged to form a backlight of one liquid crystal display device 1000. At this time, for example, a plurality of wiring boards can be placed on a frame or the like, and each can be connected to an external power source using a connector or the like.

なお、導光板１上には、拡散等の機能を有する透光性の部材をさらに積層してもよい。その場合、光学機能部１ａが凹みである場合には、凹みの開口（つまり、導光板１の第一主面１ｃに近い部分）を塞ぐが、凹みを埋めないように、透光性の部材を設けることが好ましい。これにより、光学機能部１ａの凹み内に空気の層を設けることができ、発光素子１１からの光を良好に広げることができる。 A transparent member having a function such as diffusion may be further laminated on the light guide plate 1. In that case, when the optical function portion 1a is a recess, the opening of the recess (that is, the portion near the first main surface 1c of the light guide plate 1) is blocked, but a translucent member so as not to fill the recess. Is preferably provided. Thereby, an air layer can be provided in the recess of the optical function part 1a, and the light from the light emitting element 11 can be spread well.

本開示に係る発光モジュールは、テレビやタブレット、液晶ディスプレイ装置のバックライトとして、テレビやタブレット、スマートフォン、スマートウォッチ、ヘッドアップディスプレイ、デジタルサイネージ、掲示板などに好適に利用できる。また、照明用の光源としても利用でき、非常灯やライン照明、あるいは各種のイルミネーションや車載用のインストールなどにも利用できる。 The light emitting module according to the present disclosure can be suitably used as a backlight of a television, a tablet, a liquid crystal display device, a television, a tablet, a smartphone, a smart watch, a head-up display, a digital signage, a bulletin board, and the like. It can also be used as a light source for lighting, and can also be used for emergency lighting, line lighting, various illuminations, and installation for vehicles.

１０００…液晶ディスプレイ装置
１００、１００’、２００、３００…発光モジュール
１１０ａ…レンズシート
１１０ｂ…レンズシート
１１０ｃ…拡散シート
１２０…液晶パネル
１、１’…導光板
１ａ…光学機能部
１ｃ…第一主面
１ｄ…第二主面
１ｅ…溝
１ｆ…傾斜面
１ｈ…突起部
３、３Ａ、３Ｂ…発光体
５…発光ビット
１０…透光性部材
１１…発光素子
１１ｂ…電極
１１ｃ…主発光面
１１ｄ…電極形成面
１２…波長変換部材
１３…光拡散部
１４…接合部材
１４ａ…傾斜面
１５…第一光反射性部材
１６…第二光反射性部材
１７…凹部
１８…隙間
１９…透光性接着部材
２０…透光性樹脂部
２４…導電膜
２５…配線基板
２６…導電性部材
２７…配線層
３０…ベースシート
３１…第１のシート
３２…第２のシート
３３…プレート 1000... Liquid crystal display device 100, 100', 200, 300... Light emitting module 110a... Lens sheet 110b... Lens sheet 110c... Diffusion sheet 120... Liquid crystal panel 1, 1'... Light guide plate 1a... Optical function part 1c... First main surface 1d... 2nd main surface 1e... Groove 1f... Inclined surface 1h... Projection part 3, 3A, 3B... Light-emitting body 5... Light-emitting bit 10... Translucent member 11... Light-emitting element 11b... Electrode 11c... Main light-emitting surface 11d... Electrode Forming surface 12... Wavelength converting member 13... Light diffusing portion 14... Joining member 14a... Inclined surface 15... First light reflecting member 16... Second light reflecting member 17... Recess 18... Gap 19... Translucent adhesive member 20 Translucent resin portion 24 Conductive film 25 Wiring substrate 26 Conductive member 27 Wiring layer 30 Base sheet 31 First sheet 32 Second sheet 33 Plate

Claims (6)

発光素子を含む発光体と、
外部に光を放射する発光面となる第一主面と、前記第一主面の反対側の面であって凹部を備える第二主面とを有し、前記凹部が、(i) 実質的な平坦な面からなり、前記凹部の開口部の大きさよりも小さい底面と、(ii)前記底面側に設けられ、前記凹部の外側に向かって凸の湾曲面または前記開口部に向かって傾斜した平面を少なくとも有する側面とを含む、透光性の導光板と
を準備する工程と、
前記発光体を、接合部材を介して前記凹部の底面に固着する工程と、
前記発光素子の電極に配線を形成する工程と、
を含む、発光モジュールの製造方法。 A light-emitting body including a light-emitting element,
A first main surface that is a light emitting surface that emits light to the outside, and a second main surface that is a surface opposite to the first main surface and that includes a recess, and the recess is (i) substantially A flat surface that is smaller than the size of the opening of the recess, and (ii) is provided on the bottom side and is curved toward the outside of the recess or inclined toward the opening. A step of preparing a translucent light guide plate, including a side surface having at least a flat surface ;
Fixing the light emitting body to the bottom surface of the recess via a joining member;
A step of forming wiring on the electrodes of the light emitting element,
A method for manufacturing a light emitting module, comprising: 前記側面は、垂直な面を含む、請求項１に記載の発光モジュールの製造方法。 The method of manufacturing a light emitting module according to claim 1, wherein the side surface includes a vertical surface. 前記発光体が、発光素子と、前記発光素子の主発光面を覆う透光性部材を有し、
前記発光素子の主発光面を前記導光板の第二主面と同一平面に配置して、前記発光体を前記導光板に固着する、請求項１又は２に記載の発光モジュールの製造方法。 The light emitting body has a light emitting element and a translucent member that covers a main light emitting surface of the light emitting element,
Said main light emitting surface of the light emitting elements are arranged on the second main surface flush with the light guide plate, securing said light emitter to the light guide plate, a manufacturing method of a light emitting module according to claim 1 or 2. 前記凹部の開口部の内形を、前記透光性部材の外形よりも大きくし、
前記凹部に前記透光性部材を配置してできる、前記凹部の内周と前記透光性部材の外周との間にできる隙間に接合部材を充填させる、請求項３記載の発光モジュールの製造方法。 The inner shape of the opening of the recess is made larger than the outer shape of the translucent member,
4. The method for manufacturing a light emitting module according to claim 3 , wherein a gap formed between the inner circumference of the recess and the outer circumference of the translucent member, which is formed by disposing the translucent member in the recess, is filled with a bonding member. .. 前記透光性部材は、波長変換部材を含む、請求項３又は４に記載発光モジュールの製造方法。 The translucent member includes wavelength converting member, the manufacturing method according emitting module to claim 3 or 4. 接合部材が、波長変換部材を含む、請求項１〜５のいずれか一項に記載の発光モジュールの製造方法。 Bonding member includes a wavelength conversion member, a manufacturing method of a light emitting module according to any one of claims 1-5.
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