JP6717266B2 - 回路装置 - Google Patents
回路装置 Download PDFInfo
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- JP6717266B2 JP6717266B2 JP2017126355A JP2017126355A JP6717266B2 JP 6717266 B2 JP6717266 B2 JP 6717266B2 JP 2017126355 A JP2017126355 A JP 2017126355A JP 2017126355 A JP2017126355 A JP 2017126355A JP 6717266 B2 JP6717266 B2 JP 6717266B2
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- 230000017525 heat dissipation Effects 0.000 claims description 54
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/03—Cooling
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/081—Bases, casings or covers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/088—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings or inlets
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/02—Details
- H02G3/08—Distribution boxes; Connection or junction boxes
- H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Civil Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Thermal Sciences (AREA)
- Connection Or Junction Boxes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
この問題を解決する対策として、耐熱性が高い制御素子を用いることができる。しかしながら、耐熱性が高い制御素子は高価であるため、製造費用が嵩むという問題がある。
最初に本発明の実施態様を列挙して説明する。以下に記載する実施形態の少なくとも一部を任意に組み合わせてもよい。
本発明の実施形態に係る電気接続箱(回路装置)の具体例を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
2つのスタッドボルト20,22の上側の端面は、蓋体31の底壁に当接している。
図7における2つの導線11及び接続端子21,23の図示は省略されている。
図4及び図5に示すように、左側仕切り板33a、右側仕切り板33b、後側仕切り板33c、及び突出部33d夫々の下側の端面は放熱体12の上面12aに当接している。
収容室101は、蓋体31、支持板32、左側仕切り板33a、右側仕切り板33b、後側仕切り板33c、突出部33d、及び放熱体12(第1の放熱体)に囲まれている。収容室101には、絶縁部材13、導電体14,15,16、FET17,18、第1回路基板19、及び第2回路基板24等が収容されている。
また、放熱体12が収容体10の壁体の一部を構成しているので、放熱体12が収容体10の内部の空間を狭める虞はない。
収容体10内で生じる対流は、前述したような流れに限定されない。例えば、収容室101内の空気が、連通孔322を通して放熱室102に流入し、放熱室102内の空気が、連通孔321を通して収容室101に流入してもよい。
連通孔の個数は4つに限定されない。また、連通孔の配置位置は支持板32に限定されず、左側仕切り板33a、右側仕切り板33b、又は後側仕切り板33cでもよい。
10 収容体
101 収容室
102 放熱室
11 導線
12 放熱体(第1の放熱体、第2の放熱体)
12a 上面(取付面,放熱面)
13 絶縁部材
14,15,16 導電体
17,18 FET(回路部品、半導体スイッチ)
19 第1回路基板
20,22 スタッドボルト
21,23 接続端子
24 第2回路基板(回路基板)
25 制御素子
26 接続体
30 枠体
30a 前壁
30b 左壁
30c 右壁
30d 後壁
30g,31a,31b 切欠き
31 蓋体
32 支持板(仕切り板)
321,322 連通孔
33a 左側仕切り板
33b 右側仕切り板
33c 後側仕切り板
33d 突出部
K1 コネクタ
Claims (4)
- 第1の放熱体の取付面に絶縁部材を介して取り付けられている導電体に回路部品が電気的に接続されている回路装置であって、
前記回路部品の動作を制御する制御信号を出力する制御素子と、
該制御素子が配置され、前記第1の放熱体及び前記導電体から離隔している回路基板と、
前記回路部品及び前記回路基板を収容する収容室、第2の放熱体の放熱面に接触するように空気が通流する放熱室、及び該放熱室と前記収容室とを連通する複数の連通孔を有し、前記放熱室と前記収容室とを仕切る仕切り板が設けられている収容体と
を備え、
前記取付面を除く前記第1の放熱体の一部及び前記放熱面を除く前記第2の放熱体の一部が装置外部の空気に接触している回路装置。 - 前記収容体は、液密に密閉されている請求項1に記載の回路装置。
- 前記第1の放熱体及び前記第2の放熱体は一体に形成されており、前記収容体の壁体の一部を構成している請求項1又は2に記載の回路装置。
- 前記導電体の数は2以上であり、
前記回路部品は、2つの前記導電体に電気的に接続される半導体スイッチであり、
前記制御信号は、前記回路部品のオン又はオフを指示する信号である請求項1から3の何れか1つに記載の回路装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017126355A JP6717266B2 (ja) | 2017-06-28 | 2017-06-28 | 回路装置 |
US16/621,105 US11302607B2 (en) | 2017-06-28 | 2018-06-19 | Circuit device |
PCT/JP2018/023287 WO2019004009A1 (ja) | 2017-06-28 | 2018-06-19 | 回路装置 |
DE112018003371.6T DE112018003371B4 (de) | 2017-06-28 | 2018-06-19 | Schaltungsvorrichtung |
CN201880038650.1A CN110731009B (zh) | 2017-06-28 | 2018-06-19 | 电路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017126355A JP6717266B2 (ja) | 2017-06-28 | 2017-06-28 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019009377A JP2019009377A (ja) | 2019-01-17 |
JP6717266B2 true JP6717266B2 (ja) | 2020-07-01 |
Family
ID=64742925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017126355A Active JP6717266B2 (ja) | 2017-06-28 | 2017-06-28 | 回路装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11302607B2 (ja) |
JP (1) | JP6717266B2 (ja) |
CN (1) | CN110731009B (ja) |
DE (1) | DE112018003371B4 (ja) |
WO (1) | WO2019004009A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6740959B2 (ja) * | 2017-05-17 | 2020-08-19 | 株式会社オートネットワーク技術研究所 | 回路装置 |
IT201700103511A1 (it) * | 2017-09-15 | 2019-03-15 | St Microelectronics Srl | Dispositivo microelettronico dotato di connessioni protette e relativo processo di fabbricazione |
JP6819569B2 (ja) * | 2017-12-28 | 2021-01-27 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US11994551B2 (en) | 2019-06-04 | 2024-05-28 | Qualtec Co., Ltd. | Semiconductor component test device and method of testing semiconductor components |
US20210384715A1 (en) * | 2020-06-09 | 2021-12-09 | Michael M. Bogart | Utility junction box |
US11942771B2 (en) * | 2021-01-13 | 2024-03-26 | Sumitomo Wiring Systems, Ltd. | Power distribution box with an engagement feature for overcoming a cantilevered force of a bend in a wire bundle |
CN115425601A (zh) * | 2021-09-03 | 2022-12-02 | 李涛 | 一种智能冷却耐火型母线槽 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3076220B2 (ja) * | 1995-04-27 | 2000-08-14 | 株式会社三社電機製作所 | 電源装置 |
JPH1035375A (ja) * | 1996-05-22 | 1998-02-10 | Harness Sogo Gijutsu Kenkyusho:Kk | コネクタ及び電気接続箱 |
JP2000196011A (ja) * | 1998-12-28 | 2000-07-14 | Mitsubishi Electric Corp | 電子装置及びその製造方法 |
JP2001136756A (ja) * | 1999-11-01 | 2001-05-18 | Hitachi Ltd | モータ駆動装置及び半導体素子冷却装置 |
JP4357762B2 (ja) * | 2001-03-30 | 2009-11-04 | 株式会社オートネットワーク技術研究所 | 車両用パワーディストリビュータ |
US6496375B2 (en) * | 2001-04-30 | 2002-12-17 | Hewlett-Packard Company | Cooling arrangement for high density packaging of electronic components |
JP2003332526A (ja) * | 2001-11-07 | 2003-11-21 | Hitachi Ltd | 電力変換装置 |
JP4002427B2 (ja) | 2001-11-26 | 2007-10-31 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
JP4214988B2 (ja) * | 2004-11-25 | 2009-01-28 | 株式会社デンソー | 放熱構造および車両用表示装置 |
US7586747B2 (en) * | 2005-08-01 | 2009-09-08 | Salmon Technologies, Llc. | Scalable subsystem architecture having integrated cooling channels |
JP2007201283A (ja) * | 2006-01-27 | 2007-08-09 | Denso Corp | 電子制御装置及び電子制御装置の筐体 |
US7684187B1 (en) * | 2008-09-17 | 2010-03-23 | Celsia Technologies Taiwan, Inc. | Heat dissipation device |
JP2011170566A (ja) * | 2010-02-17 | 2011-09-01 | Toshiba Corp | 半導体記憶装置および電子機器 |
DE102011012673A1 (de) | 2010-03-17 | 2011-09-22 | Hitachi Automotive Systems, Ltd. | Elektronische Steuereinrichtung für Fahrzeuge |
JP5368351B2 (ja) * | 2010-03-23 | 2013-12-18 | 日立オートモティブシステムズ株式会社 | 自動車用電子制御装置 |
JP5879533B2 (ja) * | 2011-04-28 | 2016-03-08 | パナソニックIpマネジメント株式会社 | 室外機及び冷凍装置 |
JP2013071617A (ja) * | 2011-09-28 | 2013-04-22 | Mitsubishi Heavy Ind Ltd | 熱媒体加熱装置およびそれを備えた車両用空調装置 |
CN103946977A (zh) * | 2011-12-01 | 2014-07-23 | 富士电机株式会社 | 功率转换装置 |
GB2513794B (en) * | 2012-02-28 | 2018-08-22 | Toshiba Carrier Corp | Electric Equipment and Air Conditioner |
CN104303412A (zh) * | 2012-08-03 | 2015-01-21 | 富士电机株式会社 | 冷却构造体和电力转换装置 |
JP6331424B2 (ja) * | 2014-01-30 | 2018-05-30 | 日本精工株式会社 | 電子制御ユニットおよび電動パワーステアリング装置 |
WO2015178880A1 (en) * | 2014-05-19 | 2015-11-26 | Hewlett-Packard Development Company, L.P. | Substrate sprayer |
JP6432792B2 (ja) * | 2015-09-29 | 2018-12-05 | 株式会社オートネットワーク技術研究所 | 回路構成体及び電気接続箱 |
US10383261B2 (en) * | 2015-10-20 | 2019-08-13 | Ge Global Sourcing Llc | Heat transfer chassis and method for forming the same |
JP6701701B2 (ja) * | 2015-12-04 | 2020-05-27 | 富士電機株式会社 | インバータ装置 |
JP6274196B2 (ja) * | 2015-12-16 | 2018-02-07 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US9899292B2 (en) * | 2016-02-05 | 2018-02-20 | Qorvo Us, Inc. | Top-side cooling of RF products in air cavity composite packages |
US10158357B1 (en) * | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US10085364B2 (en) * | 2016-08-11 | 2018-09-25 | Seagate Technology Llc | SSD internal thermal transfer element |
US20180157297A1 (en) * | 2016-12-07 | 2018-06-07 | Microsoft Technology Licensing, Llc | Thermal management in electronics with metallurgically bonded devices |
US10512182B2 (en) * | 2017-02-22 | 2019-12-17 | Toshiba Memory Corporation | Electronic apparatus |
JP6930653B2 (ja) * | 2018-02-23 | 2021-09-01 | 住友電装株式会社 | 電気接続箱 |
US11302599B2 (en) * | 2018-04-19 | 2022-04-12 | Intel Corporation | Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure |
CN112086413B (zh) * | 2019-06-14 | 2024-04-23 | Jmj韩国株式会社 | 半导体封装 |
US11069383B1 (en) * | 2020-04-06 | 2021-07-20 | Seagate Technology Llc | Thermal interface materials for immersion cooled data storage devices |
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JP2019009377A (ja) | 2019-01-17 |
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