JP6709161B2 - 導電性織物デバイス - Google Patents
導電性織物デバイス Download PDFInfo
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- JP6709161B2 JP6709161B2 JP2016551027A JP2016551027A JP6709161B2 JP 6709161 B2 JP6709161 B2 JP 6709161B2 JP 2016551027 A JP2016551027 A JP 2016551027A JP 2016551027 A JP2016551027 A JP 2016551027A JP 6709161 B2 JP6709161 B2 JP 6709161B2
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- 239000004753 textile Substances 0.000 title claims description 96
- 239000004744 fabric Substances 0.000 claims description 132
- 239000000835 fiber Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000009940 knitting Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000012811 non-conductive material Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000009941 weaving Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009950 felting Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001126 phototherapy Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10113—Lamp
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Woven Fabrics (AREA)
- Surface Heating Bodies (AREA)
- Knitting Of Fabric (AREA)
- Nonwoven Fabrics (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
Claims (15)
- 第1の導電性織物部分、
第2の導電性織物部分であって、前記第1の導電性織物部分及び前記第2の導電性織物部分は互いに電気的に絶縁され、電気を通すことができる単一の電極として用いられるよう全体として構成される、少なくとも2次元で幾何学的に定義される、第2の導電性織物部分、及び
前記第1の導電性織物部分に電気的に接続される第1の接触パッド及び前記第2の導電性織物部分に電気的に接続される第2の接触パッドを持つ電気素子、
を有するデバイスであって、前記第1の導電性織物部分及び前記第2の導電性織物部分は、前記電気素子に電力を供給するよう構成される、デバイス。 - 前記第1の導電性織物部分及び前記第2の導電性織物部分はそれぞれ、導電性の表面部分を含む、請求項1に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分はそれぞれ、交絡ファイバを含む、請求項1又は2に記載のデバイス。
- 前記交絡ファイバは、導電性材料を含む、請求項3に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分のうちの少なくとも1つは、導電性材料で少なくとも部分的に被覆されている、請求項1に記載のデバイス。
- 前記第1の接触パッドは、前記第1の導電性織物部分の複数のファイバに電気的に接続され、前記第2の接触パッドは、前記第2の導電性織物部分の複数のファイバに電気的に接続される、請求項1に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分は、共通の面に拡がる、請求項1に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分は、別々の面に拡がる、請求項1に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分は、互いに対して積み重ねられ、絶縁層により電気的に分離されている、請求項1に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分は、ウィーブ織、ニット編クローシェ編及び/又はノット編ファイバから形成される、請求項1に記載のデバイス。
- 前記第1の接触パッドは、導電性接着剤により、前記第1の導電性織物部分に接続され、前記第2の接触パッドは、導電性接着剤により、前記第2の導電性織物部分に接続される、請求項1に記載のデバイス。
- 前記第1の導電性織物部分及び前記第2の導電性織物部分は、非導電性基体に取り付けられている、請求項1に記載のデバイス。
- 前記電気素子は、半導体デバイス、発光素子又はセンサデバイスである、請求項1に記載のデバイス。
- 第1の導電性織物部分を設けるステップ、
前記第1の導電性織物部分と電気的に絶縁される第2の導電性織物部分を設けるステップ、
第1の接触パッド及び第2の接触パッドを持つ電気素子を設けるステップ、
前記第1の接触パッドを前記第1の導電性織物部分に電気的に接続するステップ、及び
前記第2の接触パッドを前記第2の導電性織物部分に電気的に接続するステップ、
を有し、
前記第1の導電性織物部分及び前記第2の導電性織物部分は、電気を通すことができる単一の電極として用いられるよう全体として構成される、少なくとも2次元で幾何学的に定義される、デバイスを製造する方法。 - 前記電気素子に電力を供給するよう各織物部分の接続点に電源を接続するステップ、及び
前記電気素子に供給される電力を制御するよう前記電気素子及び前記接続点間の距離を調整するステップ、
を有する、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13191533 | 2013-11-05 | ||
EP13191533.2 | 2013-11-05 | ||
PCT/EP2014/073752 WO2015067626A1 (en) | 2013-11-05 | 2014-11-05 | Electrically conducting textile device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016539513A JP2016539513A (ja) | 2016-12-15 |
JP6709161B2 true JP6709161B2 (ja) | 2020-06-10 |
Family
ID=49552192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016551027A Expired - Fee Related JP6709161B2 (ja) | 2013-11-05 | 2014-11-05 | 導電性織物デバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US9826633B2 (ja) |
EP (1) | EP3066897B1 (ja) |
JP (1) | JP6709161B2 (ja) |
CN (1) | CN105830541B (ja) |
WO (1) | WO2015067626A1 (ja) |
Families Citing this family (17)
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EP3232743A4 (en) * | 2014-12-08 | 2018-09-19 | Fujikura, Ltd. | Stretchable substrate |
JP6518451B2 (ja) * | 2015-02-02 | 2019-05-22 | 株式会社フジクラ | 伸縮性回路基板 |
JP6582187B2 (ja) * | 2015-03-12 | 2019-10-02 | 松文産業株式会社 | 半導体素子付き繊維構造体 |
JP2016178121A (ja) * | 2015-03-18 | 2016-10-06 | タツタ電線株式会社 | ストレッチャブルケーブルおよびストレッチャブル回路基板 |
CN107949815B (zh) * | 2015-09-23 | 2021-03-12 | 阿莫绿色技术有限公司 | 可穿戴设备及其制造方法 |
US10327330B2 (en) * | 2015-09-24 | 2019-06-18 | Intel Corporation | Stretchable electronic assembly |
US10993635B1 (en) | 2016-03-22 | 2021-05-04 | Flextronics Ap, Llc | Integrating biosensor to compression shirt textile and interconnect method |
JP2018014381A (ja) * | 2016-07-20 | 2018-01-25 | 富士通株式会社 | 基板及び電子機器 |
US20180061578A1 (en) * | 2016-09-01 | 2018-03-01 | Apple Inc. | Stacked passive component structures |
JP2018067845A (ja) * | 2016-10-20 | 2018-04-26 | 帝人株式会社 | シート構造体、シート構造体の製造方法、及び、立体構造体の使用方法 |
EP3364731A1 (en) * | 2017-02-20 | 2018-08-22 | IMEC vzw | A system including a conductive textile and an electronic circuit unit and a method |
KR102003644B1 (ko) * | 2018-06-28 | 2019-10-01 | 조현민 | 신축 전도성 연결 기반 신축성 전자 장치 및 그 제조 방법 |
US10985484B1 (en) * | 2018-10-01 | 2021-04-20 | Flex Ltd. | Electronic conductive interconnection for bridging across irregular areas in a textile product |
WO2020195544A1 (ja) * | 2019-03-25 | 2020-10-01 | 株式会社村田製作所 | 伸縮性実装基板 |
US11337312B2 (en) * | 2020-09-08 | 2022-05-17 | Palo Alto Research Center Incorporated | Systems and methods for bonding electronic components on substrates with rough surfaces |
CN114146321B (zh) * | 2021-12-06 | 2024-03-01 | 固安翌光科技有限公司 | 一种具有调节功能的光疗装置 |
EP4364663A1 (en) | 2022-11-07 | 2024-05-08 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Smart sensing textile |
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US7144830B2 (en) * | 2002-05-10 | 2006-12-05 | Sarnoff Corporation | Plural layer woven electronic textile, article and method |
GB2396252A (en) * | 2002-10-01 | 2004-06-16 | Steven Leftly | Textile light system |
CA2464153A1 (en) | 2003-04-14 | 2004-10-14 | Integral Technologies, Inc. | Low cost lighting circuits manufactured from conductive loaded resin-based materials |
JP2006299457A (ja) * | 2005-04-20 | 2006-11-02 | Hideo Hirose | 発光布帛または発光紐 |
EP1727408A1 (de) * | 2005-05-13 | 2006-11-29 | Eidgenössische Technische Hochschule Zürich | Textil mit einem Leiterbahnsystem und Verfahren zu dessen Herstellung |
CN101184876A (zh) | 2005-05-31 | 2008-05-21 | 皇家飞利浦电子股份有限公司 | 允许无源和有源矩阵寻址的全织物电极布局 |
DE202006015357U1 (de) | 2006-10-05 | 2007-01-04 | Sächsische Teppichmanufaktur Bernards, Schmidt und Wenschuh KG | Leuchtmittel aufweisendes Gewebe |
CN101652903B (zh) * | 2007-03-29 | 2013-08-21 | 皇家飞利浦电子股份有限公司 | 用于附着到织物基底上的电子组件、电子纺织品和这种电子纺织品的制造方法 |
KR100938684B1 (ko) * | 2007-10-16 | 2010-01-25 | 코오롱글로텍주식회사 | 전자 원단 및 이의 제조방법 |
WO2009053872A1 (en) * | 2007-10-26 | 2009-04-30 | Koninklijke Philips Electronics N.V. | Robust connections in a multi-layer woven fabric |
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US20120327651A1 (en) * | 2010-03-16 | 2012-12-27 | Koninklijke Philips Electronics, N.V. | Light-emitting textile-based architectural element |
US20130027963A1 (en) * | 2010-04-16 | 2013-01-31 | Maarten Marinus Johannes Wilhelmus Van Herpen | Textile product having a lighting function and method for the production thereof |
TW201208217A (en) | 2010-08-09 | 2012-02-16 | Kings Metal Fiber Technologies | Electrical connection structure and light emitting device, fabric circuits, and singal fabric having the same |
CN103109586B (zh) * | 2010-09-21 | 2017-02-15 | 皇家飞利浦电子股份有限公司 | 电子纺织品和制造电子纺织品的方法 |
EP2749153B1 (en) * | 2011-12-07 | 2015-04-15 | Koninklijke Philips N.V. | Electronic textile with means for facilitating waste sorting |
CN104015187A (zh) * | 2014-05-26 | 2014-09-03 | 苏州西点金工精密机械有限公司 | 柔性冲压机械手 |
-
2014
- 2014-11-05 JP JP2016551027A patent/JP6709161B2/ja not_active Expired - Fee Related
- 2014-11-05 EP EP14793165.3A patent/EP3066897B1/en not_active Not-in-force
- 2014-11-05 US US15/032,044 patent/US9826633B2/en not_active Expired - Fee Related
- 2014-11-05 WO PCT/EP2014/073752 patent/WO2015067626A1/en active Application Filing
- 2014-11-05 CN CN201480060703.1A patent/CN105830541B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP3066897A1 (en) | 2016-09-14 |
US20160270223A1 (en) | 2016-09-15 |
EP3066897B1 (en) | 2019-01-09 |
CN105830541B (zh) | 2019-04-23 |
US9826633B2 (en) | 2017-11-21 |
JP2016539513A (ja) | 2016-12-15 |
CN105830541A (zh) | 2016-08-03 |
WO2015067626A1 (en) | 2015-05-14 |
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