JP6695705B2 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
- Publication number
- JP6695705B2 JP6695705B2 JP2016028359A JP2016028359A JP6695705B2 JP 6695705 B2 JP6695705 B2 JP 6695705B2 JP 2016028359 A JP2016028359 A JP 2016028359A JP 2016028359 A JP2016028359 A JP 2016028359A JP 6695705 B2 JP6695705 B2 JP 6695705B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- microwave
- dielectric
- plasma
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012545 processing Methods 0.000 title claims description 82
- 239000004020 conductor Substances 0.000 claims description 85
- 230000005684 electric field Effects 0.000 claims description 27
- 230000001902 propagating effect Effects 0.000 claims description 7
- 230000005284 excitation Effects 0.000 claims description 6
- 239000012141 concentrate Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 81
- 238000004088 simulation Methods 0.000 description 14
- 238000010521 absorption reaction Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/3222—Antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32229—Waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32238—Windows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32293—Microwave generated discharge using particular waveforms, e.g. polarised waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Description
12 チャンバ
14 マイクロ波発生器
15 アンテナ
18 誘電体窓
18a 対向面
18b 面
18c 領域
19 導体パターン
19a 第1の部分
19b 第2の部分
20 ステージ
36 スロット板
36a スロット
Claims (5)
- 処理空間を画成する処理容器と、
プラズマ励起用のマイクロ波を発生するマイクロ波発生器と、
前記処理空間に対向する対向面を有する誘電体と、
前記誘電体の前記対向面とは反対側の面上に設けられ、前記誘電体を介して前記マイクロ波を前記処理空間へ放射する複数のスロットが形成されたスロット板と、
前記誘電体の前記対向面上に設けられ、各前記スロットから放射された前記マイクロ波に応じた電界を集中させる導体パターンと
を備え、
前記導体パターンは、前記誘電体の前記対向面において、当該対向面に垂直な方向から見た場合に前記複数のスロットとそれぞれ重なる複数の領域のうち、少なくともいずれか一つの領域に設けられることを特徴とするプラズマ処理装置。 - 前記導体パターンの少なくとも一部は、矩形状に形成され、
前記導体パターンの少なくとも一部の長さは、前記誘電体の内部を伝播する前記マイクロ波の波長がλであるとすると、3λ/8以上5λ/8以下の範囲内であることを特徴とする請求項1に記載のプラズマ処理装置。 - 前記導体パターンの少なくとも一部の長さは、前記マイクロ波に共振する長さであることを特徴とする請求項2に記載のプラズマ処理装置。
- 前記導体パターンの少なくとも一部の長さは、λ/2であることを特徴とする請求項3に記載のプラズマ処理装置。
- 前記導体パターン上には、前記導体パターンをプラズマから保護するための保護膜が形成されることを特徴とする請求項1〜4のいずれか一つに記載のプラズマ処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016028359A JP6695705B2 (ja) | 2016-02-17 | 2016-02-17 | プラズマ処理装置 |
US15/429,393 US10546725B2 (en) | 2016-02-17 | 2017-02-10 | Plasma processing apparatus |
KR1020170019956A KR20170096960A (ko) | 2016-02-17 | 2017-02-14 | 플라즈마 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016028359A JP6695705B2 (ja) | 2016-02-17 | 2016-02-17 | プラズマ処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017147129A JP2017147129A (ja) | 2017-08-24 |
JP6695705B2 true JP6695705B2 (ja) | 2020-05-20 |
Family
ID=59559759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016028359A Active JP6695705B2 (ja) | 2016-02-17 | 2016-02-17 | プラズマ処理装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10546725B2 (ja) |
JP (1) | JP6695705B2 (ja) |
KR (1) | KR20170096960A (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6804280B2 (ja) * | 2016-12-07 | 2020-12-23 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP7250376B2 (ja) * | 2017-07-28 | 2023-04-03 | ヤマハファインテック株式会社 | ガス漏れ検査システム及びガス漏れ検査方法 |
JP2022039820A (ja) * | 2020-08-28 | 2022-03-10 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
US11948776B2 (en) * | 2021-01-21 | 2024-04-02 | Hitachi High-Tech Corporation | Plasma processing apparatus |
WO2023032725A1 (ja) * | 2021-09-03 | 2023-03-09 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ制御方法 |
JP2023180320A (ja) * | 2022-06-09 | 2023-12-21 | 東京エレクトロン株式会社 | プラズマ処理装置及び共振周波数測定方法 |
CN115821215B (zh) * | 2023-02-20 | 2023-04-28 | 成都富林达新材料有限公司 | 一种用于悬浮蒸镀氧化铝的喷射装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3164200B2 (ja) * | 1995-06-15 | 2001-05-08 | 住友金属工業株式会社 | マイクロ波プラズマ処理装置 |
JP5036092B2 (ja) | 1999-03-24 | 2012-09-26 | 東京エレクトロン株式会社 | マイクロ波プラズマ処理装置 |
JP3723783B2 (ja) * | 2002-06-06 | 2005-12-07 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US6998565B2 (en) * | 2003-01-30 | 2006-02-14 | Rohm Co., Ltd. | Plasma processing apparatus |
US7998307B2 (en) * | 2006-09-12 | 2011-08-16 | Tokyo Electron Limited | Electron beam enhanced surface wave plasma source |
JP6410622B2 (ja) | 2014-03-11 | 2018-10-24 | 東京エレクトロン株式会社 | プラズマ処理装置及び成膜方法 |
-
2016
- 2016-02-17 JP JP2016028359A patent/JP6695705B2/ja active Active
-
2017
- 2017-02-10 US US15/429,393 patent/US10546725B2/en active Active
- 2017-02-14 KR KR1020170019956A patent/KR20170096960A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US10546725B2 (en) | 2020-01-28 |
KR20170096960A (ko) | 2017-08-25 |
US20170236690A1 (en) | 2017-08-17 |
JP2017147129A (ja) | 2017-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6695705B2 (ja) | プラズマ処理装置 | |
TWI681073B (zh) | 電漿處理裝置 | |
CN105122951B (zh) | 使用介质谐振器的等离子体发生器 | |
EP0791949A2 (en) | Plasma processing method and apparatus | |
CN110622279B (zh) | 具有局部洛伦兹力的模块化微波源 | |
JP2006244891A (ja) | マイクロ波プラズマ処理装置 | |
US20130228283A1 (en) | Temperature Control in RF Chamber with Heater and Air Amplifier | |
US10968513B2 (en) | Plasma film-forming apparatus and substrate pedestal | |
JP6846776B2 (ja) | プラズマ処理装置 | |
US20180127880A1 (en) | Microwave plasma source and microwave plasma processing apparatus | |
US20090133838A1 (en) | Plasma Processor Apparatus | |
TWI738920B (zh) | 半導體製造方法及相關裝置與電漿處理系統 | |
JP2012216525A (ja) | プラズマ処理装置及びプラズマ発生用アンテナ | |
US9646867B2 (en) | Plasma processing apparatus, power supply unit and mounting table system | |
TWI585813B (zh) | Plasma processing device and plasma processing method | |
KR102531442B1 (ko) | 플라스마 처리 장치 | |
KR20140103844A (ko) | 플라즈마 처리 장치 | |
JP7162837B2 (ja) | プラズマ処理装置、及び、プラズマ処理方法 | |
US20190279845A1 (en) | Antenna device and plasma processing apparatus | |
US10832892B2 (en) | Antenna, plasma processing device and plasma processing method | |
US10190217B2 (en) | Plasma film-forming method and plasma film-forming apparatus | |
US10553402B2 (en) | Antenna device and plasma processing apparatus | |
CN114514794B (zh) | 具有集成温度控制的单片式模块化微波源 | |
US10896811B2 (en) | Antenna device, radiation method of electromagnetic waves, plasma processing apparatus, and plasma processing method | |
KR101722307B1 (ko) | 마이크로파 방사 안테나, 마이크로파 플라즈마원 및 플라즈마 처리 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181113 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190821 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191030 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200324 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200422 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6695705 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |