JP6679872B2 - Coating unevenness detection device and coating unevenness detection method - Google Patents
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- 239000011248 coating agent Substances 0.000 title claims description 160
- 238000000576 coating method Methods 0.000 title claims description 160
- 238000001514 detection method Methods 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims description 60
- 238000001035 drying Methods 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 239000010408 film Substances 0.000 description 116
- 230000000737 periodic effect Effects 0.000 description 44
- 238000007689 inspection Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Description
本発明はインクや高分子樹脂溶液などの塗液を基板に塗布した塗膜の乾燥過程において塗膜に発生するムラを画像検出することができるムラ検出装置およびムラ検出方法に関する。 The present invention relates to a nonuniformity detection device and a nonuniformity detection method capable of image-detecting nonuniformity generated in a coating film in which a coating liquid such as ink or a polymer resin solution is applied to a substrate in a drying process.
光学フィルムやガスバリアフィルム、液晶関連のカラーフィルタなど、インクや高分子樹脂溶液などの塗液で塗膜を形成する工程では、外観上のムラが原因で製品が欠陥となる場合がある。光学フィルムやカラーフィルタでは光学特性の欠陥となり、ガスバリアフィルムではバリア性能の不良などが生じる。 In the process of forming a coating film with a coating liquid such as an ink or a polymer resin solution such as an optical film, a gas barrier film, and a color filter related to liquid crystal, the product may be defective due to unevenness in appearance. Optical films and color filters cause defects in optical properties, and gas barrier films cause defective barrier performance.
このようなムラの発生を抑えるには、塗液と塗液の塗布・乾燥条件において、どの条件で、またどの段階でムラが生じるかを見出し、最適な塗液とその塗布・乾燥条件を把握して適用することが有効である。しかし、塗膜は、通常１μｍ〜数百μｍと薄く、着色があったり透明である場合や、照明条件と塗膜を目視で見る角度、またはカメラなどで撮像できる角度がムラによって異なることなど、ムラを光学的に観察するには困難な場合が多い。 In order to suppress such unevenness, find out under what conditions and at what stage the coating liquid and coating liquid coating / drying conditions will occur, and understand the optimum coating liquid and its coating / drying conditions. Then it is effective to apply. However, the coating film is usually as thin as 1 μm to several hundreds μm and is colored or transparent, or the illumination condition and the angle at which the coating film is visually viewed or the angle at which a camera or the like can be imaged vary depending on unevenness. It is often difficult to observe unevenness optically.
光学的に塗膜のムラが観察されない場合であっても、塗膜面内での乾燥状態の違いが、その後の製品で不良を生じさせるため、物理的に塗膜に接触せず、実際の乾燥状態がどの程度、塗膜の面内で分布しているかを光学的に観察することは重要であるが、困難である。このような乾燥状態のムラの発生を抑えるには、塗液と塗布乾燥条件において、どの条件で、どの段階で乾燥状態のムラが生じるか、また乾燥状態の分布を測定し、乾燥状態のムラを発生させない塗液と塗布乾燥条件を把握することが重要である。 Even if the unevenness of the coating film is not observed optically, the difference in the dry state in the coating film surface causes a defect in the subsequent product, so that it does not physically contact the coating film and Optically observing to what extent the dry state is distributed in the plane of the coating film is important but difficult. In order to suppress the occurrence of such unevenness in the dry state, in the coating liquid and the coating and drying conditions, under what conditions and at which stage the unevenness of the dry state occurs, the distribution of the dry state is measured, and the unevenness of the dry state is measured. It is important to understand the coating liquid and the coating and drying conditions that do not generate
塗膜のムラを把握する手段として、画像検査する方法が多く提案されている（例えば特許文献１参照）。従来の塗膜のムラの画像検査方法では、照明方法などを変えて強調して、塗膜のムラを画像計測する方法が多く用いられている。 As a means for grasping the unevenness of the coating film, many image inspection methods have been proposed (for example, refer to Patent Document 1). In the conventional image inspection method for unevenness of a coating film, a method of measuring an image of the unevenness of the coating film by emphasizing it by changing an illumination method is often used.
しかしながら、従来のムラを光学的に強調して画像化する方法では、わずかな反射光や透過光の変化として測定されるムラを高感度に画像化することは難しかった。
また塗膜が液体の状態で塗布され乾燥する過程において、塗液と乾燥条件を変えてムラが発生しない条件を求めたい場合、乾燥過程において塗膜の性状が変化して行き、ムラが画像測定できる光学条件も変わって行くため、ムラを画像として捉えることは困難であった。
また、乾燥状態の違いが外観で光学的に観察できない場合は、画像として捉えることは不可能であった。
However, it has been difficult to image the unevenness measured as a slight change in the reflected light or the transmitted light with high sensitivity by the conventional method of optically emphasizing the unevenness.
Also, in the process of coating and drying the coating film in a liquid state, if you want to obtain conditions that do not cause unevenness by changing the coating liquid and drying conditions, the properties of the coating film will change during the drying process, and unevenness will be measured by the image. It is difficult to capture the unevenness as an image because the optical conditions that can be changed also change.
Further, if the difference in dry state cannot be optically observed by appearance, it was impossible to capture it as an image.
本発明は、上記の問題点を解決するためになされたものであり、インクや高分子樹脂溶液などの塗液を基板に塗布した場合の塗膜の乾燥過程において発生するムラを、画像検出することができる塗膜ムラ検出装置および塗膜ムラ検出方法を提供することを課題とする
。
The present invention has been made to solve the above-mentioned problems, and detects unevenness in an image during the drying process of a coating film when a coating liquid such as an ink or a polymer resin solution is applied to a substrate. An object of the present invention is to provide a coating film unevenness detection device and a coating film unevenness detection method that can be performed.
上記課題を解決するための手段として、請求項１に記載の発明は、基板上に塗液を塗布することで形成される塗膜に発生するムラを光学的に検出するための塗膜ムラ検出装置であって、
基板上に塗液を塗布することで形成される塗膜に、平行且つ等間隔の直線状または曲線状の凹凸形状を形成するための手段と、
塗膜に形成された凹凸形状に直交する方向から光を照射し反射光を得るための光源と、
その凹凸形状からの反射光を受光し撮像するために基板の上方に備えられた画像検出器と、を備えている塗膜ムラ検出装置であって、
前記凹凸形状を形成するための手段が、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極に電圧を印加することにより、塗膜にマクスウェルの応力を作用させる手段であることを特徴とする塗膜ムラ検出装置である。
As a means for solving the above problems, the invention according to claim 1 is a coating film unevenness detection for optically detecting unevenness occurring in a coating film formed by applying a coating liquid on a substrate. A device,
Means for forming parallel or evenly-spaced linear or curved uneven shapes on the coating film formed by applying the coating liquid on the substrate,
A light source for irradiating light from a direction orthogonal to the uneven shape formed on the coating film to obtain reflected light,
An image detector provided above the substrate for receiving and imaging the reflected light from the uneven shape, and a coating film unevenness detecting device comprising :
The means for forming the concavo-convex shape is a means for applying Maxwell stress to the coating film by applying a voltage to parallel and evenly-spaced linear or curved electrodes formed on the substrate. It is a coating film unevenness detection device characterized by the above.
また、請求項２に記載の発明は、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極が、２つの櫛状電極を対向させることにより形成された電極であることを特徴とする請求項１に記載の塗膜ムラ検出装置である。 Further, the invention according to claim 2 is that the parallel or evenly-spaced linear or curved electrodes formed on the substrate are electrodes formed by facing two comb-shaped electrodes. The coating film nonuniformity detection device according to claim 1 .
また請求項３に記載の発明は、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極が、１つの櫛状電極であることを特徴とする請求項１に記載の塗膜ムラ検出装置である。 The invention described in claim 3, the coating according to claim 1, straight or curved electrodes parallel and equidistant formed on said substrate, characterized in that it is a single comb-shaped electrode It is a film unevenness detection device.
また請求項４に記載の発明は、請求項１〜３のいずれかに記載の塗膜ムラ検出装置を使用した塗膜ムラ検出方法であって、前記基板に塗液を塗布することにより基板上に塗膜を形成する塗膜形成工程と、
基板に塗布された塗膜を乾燥しながら、前記凹凸形状を形成するための手段により塗膜に凹凸形状を形成し、その凹凸形状に直交する方向から光を照射することにより反射光を生じせしめ、その反射光を前記画像検出器により受光することで塗膜に形成されたムラを撮像する工程と、を備えていることを特徴とする塗膜ムラ検出方法である。
A fourth aspect of the present invention is a coating film unevenness detecting method using the coating film unevenness detecting device according to any one of the first to third embodiments, wherein a coating liquid is applied to the substrate to form a coating on the substrate. A coating film forming step of forming a coating film on
While the coating film applied to the substrate is being dried, a concave-convex shape is formed on the coating film by the means for forming the concave-convex shape, and reflected light is generated by irradiating light from a direction orthogonal to the concave-convex shape. And a step of imaging the unevenness formed on the coating film by receiving the reflected light by the image detector, and a coating film unevenness detection method.
また、請求項５に記載の発明は、前記凹凸形状を形成するための手段が、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極に電圧を印加する手段であることを特徴とする請求項４に記載の塗膜ムラ検出方法である。 Further, in the invention according to claim 5 , the means for forming the uneven shape is means for applying a voltage to parallel or evenly-spaced linear or curved electrodes formed on the substrate. 5. The coating film unevenness detection method according to claim 4 .
また、請求項６に記載の発明は、前記電圧が交流電圧であることを特徴とする請求項５に記載の塗膜ムラ検出方法である。 The invention according to claim 6 is the coating film unevenness detection method according to claim 5 , wherein the voltage is an AC voltage.
また、請求項７に記載の発明は、前記塗膜形成工程において基板上に形成した塗膜の乾燥を開始した直後から乾燥が進んだ段階に至る乾燥過程において、前記交流電圧の周波数を１０ｋＨｚ以下とすることを特徴とする請求項６に記載の塗膜ムラ検出方法である。 Further, in the invention according to claim 7 , the frequency of the alternating voltage is 10 kHz or less in the drying process from immediately after the drying of the coating film formed on the substrate in the coating film forming step to the stage where the drying progresses. The coating film unevenness detection method according to claim 6, wherein:
本発明の装置によれば、乾燥中の塗膜のムラを、基板に電場を印加することで周期的な電極パターンに沿って変形させて、ムラを周期的な塗膜の変形の中に強調して画像測定することができる。 According to the apparatus of the present invention, the unevenness of the coating film during drying is deformed along the periodic electrode pattern by applying an electric field to the substrate, and the unevenness is emphasized in the periodic deformation of the coating film. Then, the image can be measured.
塗布した塗膜のムラを光学的に検出することが難しい場合でも、塗膜を電場で変形させてムラが強調され、高感度に検出することができる。塗膜の厚さの違いによるムラだけで
なく、場所によって異なる塗膜の乾燥状態の違いが、電場による塗膜の変形状態としてムラとして画像測定できる。よって乾燥状態の場所による違いも、乾燥中に画像測定することができる。
Even when it is difficult to optically detect the unevenness of the applied coating film, the unevenness is emphasized by deforming the coating film with an electric field, and it is possible to detect with high sensitivity. Not only the unevenness due to the difference in the thickness of the coating film, but also the difference in the dried state of the coating film depending on the place can be image-measured as unevenness as the deformation state of the coating film due to the electric field. Therefore, it is possible to measure the image during the drying even for the difference depending on the location of the dry state.
以下に図面を参照して本発明の実施の形態を説明する。 Embodiments of the present invention will be described below with reference to the drawings.
＜塗膜ムラ検出装置＞
本発明の塗膜ムラ検出装置は、基板上に塗布された塗液に発生するムラを光学的に検出するための塗膜ムラ検出装置である。
基板上に塗布された塗膜に、平行且つ等間隔の直線状または曲線状の凹凸形状を形成するための手段と、塗膜に形成された凹凸形状に直交する方向から光を照射し反射光を得るための光源と、その凹凸形状からの反射光を受光し撮像するために基板の上方に備えられた画像検出器と、を備えている。
<Paint unevenness detection device>
The coating film unevenness detection device of the present invention is a coating film unevenness detection device for optically detecting unevenness occurring in a coating liquid applied on a substrate.
Means for forming parallel or evenly-spaced linear or curved uneven shapes on the coating film applied on the substrate, and reflected light by irradiating light from a direction orthogonal to the uneven shapes formed on the coating film And a image detector provided above the substrate for receiving and imaging reflected light from the uneven shape.
前記凹凸形状を形成するための手段が、基板上に形成された平行且つ等間隔の直線状または曲線状の電極に電圧を印加することにより、塗膜にマクスウェルの応力（電界が形成されることにより塗膜に発生する力）を作用させる手段であっても良い。また、マクスウェルの応力を使用しない手段であっても構わない。 The means for forming the concavo-convex shape applies a voltage to parallel or evenly-spaced linear or curved electrodes formed on the substrate, whereby Maxwell stress (electric field is formed) The force generated by the coating film) may be applied. Further, a means that does not use Maxwell stress may be used.
また、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極が、２つの櫛状電極を対向させることにより形成された電極であっても良いし、１つの櫛状電極であっても良い。 Further, the parallel or evenly spaced linear or curved electrodes formed on the substrate may be electrodes formed by facing two comb-shaped electrodes, or one comb-shaped electrode. It may be.
＜塗膜ムラ検出方法＞
また、本発明の塗膜ムラ検出方法は、基板に塗液を塗布することにより基板上に塗膜を形成する塗膜形成工程と、基板に塗布された塗膜を乾燥しながら、凹凸形状を形成するための手段により基板上に形成された塗膜に凹凸形状を形成し、その凹凸形状に直交する方向から光を照射することにより反射光を生じせしめ、その反射光を撮像カメラなどの画像検出器により受光することで、塗膜に形成されたムラを撮像する工程とを備えている。
<Method for detecting coating film unevenness>
Further, the coating film unevenness detection method of the present invention includes a coating film forming step of forming a coating film on a substrate by applying a coating liquid to the substrate, and drying the coating film applied to the substrate to form uneven shapes. An uneven shape is formed on the coating film formed on the substrate by the means for forming, and reflected light is generated by irradiating light from a direction orthogonal to the uneven shape, and the reflected light is imaged by an imaging camera or the like. The step of imaging the unevenness formed on the coating film by receiving light from the detector is provided.
凹凸形状を形成するための手段は、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極に電圧を印加する手段であっても良い。 The means for forming the concavo-convex shape may be means for applying a voltage to parallel and evenly-spaced linear or curved electrodes formed on the substrate.
電極に印加する電圧は、直流電圧であっても良いし、交流電圧であっても良い。 The voltage applied to the electrodes may be a DC voltage or an AC voltage.
塗膜形成工程において、基板上に形成した塗膜の乾燥を開始した直後から乾燥が進んだ段階に至る乾燥過程において、前記交流電圧の周波数を１０ｋＨｚ以下とすることにより、その範囲の適切な周波数を選択することにより、各乾燥段階におけるムラを鮮明に検出することが可能となる。 In the coating film forming step, the frequency of the AC voltage is set to 10 kHz or less in the drying process from immediately after the drying of the coating film formed on the substrate to the stage where the drying is advanced, so that the appropriate frequency within the range is obtained. By selecting, it becomes possible to clearly detect unevenness at each drying stage.
＜第１の実施形態＞
本発明のムラ検査装置３０の第１の実施形態を図１に従って説明する。
<First Embodiment>
A first embodiment of the unevenness inspection device 30 of the present invention will be described with reference to FIG.
図１（ａ）は、本発明のムラ検査装置３０の全体構成の一例を示す概略説明図である。
基板３に形成された周期的な電極パターン２に、電圧源５から電圧を印加することによって、基板３上に塗布された塗膜４に形成された塗膜の変形７が周期的なうねりパターンを形成することができる。
FIG. 1A is a schematic explanatory view showing an example of the overall configuration of the unevenness inspection device 30 of the present invention.
By applying a voltage from the voltage source 5 to the periodic electrode pattern 2 formed on the substrate 3, the deformation 7 of the coating film formed on the coating film 4 applied on the substrate 3 is a periodic waviness pattern. Can be formed.
この周期的なうねりパターンが形成された塗膜４の表面に向けて、光源１から光を照射する。この時、周期的な電極パターン２が平行に形成された方向に直交する方向から光を入射させることが望ましい。そのようにすることで、塗膜４の表面に形成された周期的なパターンで反射する反射光を最も強くすることが可能である。そのようにして塗膜４の表面から反射した光を、基板３の上方に備えられた撮像カメラなどの画像検出器８によって撮像し、画像検出器８が取得した画像データを画像処理装置９に転送し、記録する。記録された画像データは、必要な時に読み出し、図示していない画像表示装置に表示することができる。 Light is emitted from the light source 1 toward the surface of the coating film 4 on which this periodic waviness pattern is formed. At this time, it is desirable that light be incident from a direction orthogonal to the direction in which the periodic electrode patterns 2 are formed in parallel. By doing so, it is possible to maximize the reflected light reflected by the periodic pattern formed on the surface of the coating film 4. The light reflected from the surface of the coating film 4 in this way is imaged by the image detector 8 such as an imaging camera provided above the substrate 3, and the image data acquired by the image detector 8 is sent to the image processing device 9. Transfer and record. The recorded image data can be read out when necessary and displayed on an image display device (not shown).
塗膜４にムラが存在する場合、周期的なうねりパターンにもそのムラが反映するが、塗膜４が平坦な表面の場合より、周期的なうねりパターンの中に存在するムラは強調されて観察される。
本発明のムラ検査装置３０は、この現象を使用することにより、基板３上に形成された塗膜４に乾燥過程で発生するムラを逐次、画像検出し、記録することが可能である。
When the coating film 4 has unevenness, the unevenness is also reflected in the periodic waviness pattern, but the unevenness present in the periodic waviness pattern is emphasized more than when the coating film 4 has a flat surface. To be observed.
By using this phenomenon, the unevenness inspection apparatus 30 of the present invention can sequentially detect and record unevenness in the coating film 4 formed on the substrate 3 during the drying process.
画像処理装置９では、画像検出器８から転送された画像データの画像処理を行う。画像処理の内容は、限定しないが、例えば、基板３上に形成した周期的な電極パターン２に起因するムラを除外する処理を行うことができる。周期的な電極パターン２に電圧を印加することによって形成される電界やマクスウェル応力に応じた塗膜４に塗膜の変形７が生じるが、周期的な電極パターン２のエッジ部は、電界やマクスウェル応力に乱れが生じるため、それらを除外する処理を実施することも可能である。 The image processing device 9 performs image processing of the image data transferred from the image detector 8. Although the content of the image processing is not limited, it is possible to perform processing for excluding unevenness caused by the periodic electrode pattern 2 formed on the substrate 3, for example. Deformation 7 of the coating film occurs in the coating film 4 in response to the electric field formed by applying a voltage to the periodic electrode pattern 2 or Maxwell stress, but the edge portion of the periodic electrode pattern 2 has an electric field or Maxwell. Since the stress is disturbed, it is possible to carry out a process to exclude them.
また、基板３上に形成された周期的な電極パターン２の表面と基板３の表面の濡れ性が異なる場合は、それも塗膜４のムラの原因になる。そのため、周期的な電極パターン２に起因するムラについても、画像処理装置９によって除外することが可能である。また、基板３上に周期的な電極パターン２を形成し、その両者の表面を絶縁材料によって均一に被覆しても良い。このようにすることで、表面の塗れ性を均一にし、ムラの発生要因を低減することが可能である。 Further, when the surface of the periodic electrode pattern 2 formed on the substrate 3 and the surface of the substrate 3 have different wettability, this also causes unevenness of the coating film 4. Therefore, the image processing apparatus 9 can also eliminate the unevenness caused by the periodic electrode pattern 2. Alternatively, the periodic electrode pattern 2 may be formed on the substrate 3 and the surfaces of both electrodes may be uniformly covered with an insulating material. By doing so, it is possible to make the wettability of the surface uniform and reduce the cause of unevenness.
基板３の基材には、絶縁性が高く、塗膜が平滑性良く塗布でき、電極パターン２が形成できる石英ガラス基材などを用いることができる。 As the base material of the substrate 3, a quartz glass base material or the like which has a high insulating property, a coating film can be applied with good smoothness, and the electrode pattern 2 can be formed can be used.
光源１は、ハロゲン光、メタルハライド光、ＬＥＤ光、キセノン光などを用いることができる。光源１は、集光した平行または略平行光が好適であり、集光レンズ、線状光源などを用いても良い。基板３が光の透過性がある場合、透過光でも可能である。 As the light source 1, halogen light, metal halide light, LED light, xenon light, or the like can be used. The light source 1 is preferably condensed parallel or substantially parallel light, and a condenser lens, a linear light source, or the like may be used. If the substrate 3 is transparent to light, transmitted light is also possible.
周期的な電極パターン２としては、直線状の等間隔に平行に形成されたパターンが望ましいが、周期的なパターンであれば使用可能であり、曲線でも等間隔に平行に形成されたパターンであれば使用可能である。 As the periodic electrode pattern 2, a linear pattern formed in parallel at equal intervals is desirable, but a periodic pattern can be used, and even a curved line pattern formed in parallel at equal intervals can be used. It can be used.
電極パターン２には、図１（ｂ）に示したような、平行に多数形成された線電極が互いに電気的に接続された２つの櫛状電極を、互いに向い合わせにして、線状電極が平行に且つ等間隔に配置した櫛状電極間に電圧を印加できるようにしたすだれ状電極２−１などを
用いることができる。基板３に、塗膜４を塗布し、電圧源５から電極パターンに交互に電圧印加と接地すると、周期的な電極パターン２間に電気力線６が生じる。塗膜４を電気力線６が通ると、塗膜４と空気の誘電率が異なるためマクスウェル応力が働き、その力によって塗膜が変形し、塗膜の変形７が生じる。電気力線が生じるためには、塗膜４の膜厚は１００μｍ以下、周期的な電極パターン２のピッチは１００μｍ以下が好適である。
In the electrode pattern 2, as shown in FIG. 1 (b), two comb-shaped electrodes in which a large number of parallel line electrodes are electrically connected to each other are made to face each other to form a linear electrode. It is possible to use the interdigital electrodes 2-1 or the like capable of applying a voltage between the comb-shaped electrodes arranged in parallel and at equal intervals. When the coating film 4 is applied to the substrate 3 and voltage is alternately applied to the electrode pattern from the voltage source 5 and grounded, lines of electric force 6 are generated between the periodic electrode patterns 2. When the electric force lines 6 pass through the coating film 4, the Maxwell stress acts because the permittivity of the coating film 4 is different from that of air, and the force causes the coating film to deform, resulting in deformation 7 of the coating film. In order to generate lines of electric force, it is preferable that the thickness of the coating film 4 is 100 μm or less and the pitch of the periodic electrode patterns 2 is 100 μm or less.
このような条件にて周期的な電極パターン２間に電圧を印加し適度な電場を形成すると、塗膜４に周期的な電極パターン２の周期と同じ周期のうねりからなる周期的パターンを持った塗膜の変形７が形成される。この塗膜の変形７は、塗膜４が持っているムラに関する情報を含んでおり、塗膜４の膜厚ムラや乾燥状態の違いに関する情報を反映している。そして塗膜の変形７の形状の微妙な違いが、周期的パターンの乱れとなって現れ、容易に観察できるようになる。 When a voltage is applied between the periodic electrode patterns 2 under such conditions to form an appropriate electric field, the coating film 4 has a periodic pattern having the same period as the periodic pattern of the periodic electrode patterns 2. Deformation 7 of the coating film is formed. The deformation 7 of the coating film includes information on the unevenness of the coating film 4, and reflects information on the unevenness of the film thickness of the coating film 4 and the difference in the dry state. Then, a subtle difference in the shape of the deformation 7 of the coating film appears as a disorder of the periodic pattern, which allows easy observation.
光源１から出射した光は暗視野照明となるように基板３の斜め上方からの照明光であり、周期的な電極パターン２の線状方向に直交する方向から照射することで、塗膜の変形７によりムラが強調される。そのため、このような周期的なうねりからなる周期的パターンを形成しない通常の状態では検出できなかったムラが、画像検出器８で画像検出され、画像処理装置９で画像における塗膜の変形７部分の微妙な違いが、周期的パターンの乱れとなって現れるため、容易にムラを観察、測定することができる。 The light emitted from the light source 1 is the illumination light obliquely above the substrate 3 so as to provide dark field illumination, and by irradiating the light from a direction orthogonal to the linear direction of the periodic electrode pattern 2, the coating film is deformed. The unevenness is emphasized by 7. Therefore, the unevenness that could not be detected in the normal state in which the periodic pattern composed of such periodic undulations is not detected is detected by the image detector 8 and the image processing apparatus 9 deforms the coating film in the image 7 part. Since the subtle difference of appears as the disturbance of the periodic pattern, the unevenness can be easily observed and measured.
＜第２の実施形態＞
本発明の第２の実施形態について、図１および図２を用いて説明する。
<Second Embodiment>
A second embodiment of the present invention will be described with reference to FIGS. 1 and 2.
本発明の第２の実施形態は、基板１０において、周期的な電極パターン１１が基板１０の片面に形成され、もう一方の面に形成された導体膜からなる電極１２が形成されている構成である（図２（ａ）参照）。
この基板１０の周期的な電極パターン１１が形成されている面に塗膜１３を塗布した後、電圧源５から周期的な電極パターン１１に電圧を印加し、電極１２を接地すると、周期的な電極パターン１１から基板１０を通り電極１２へ向って電気力線１３が生じる。周期的な電極パターン１１は、すだれ状電極２−１（図１（ｂ）参照）を同電位としてもよいし、図２（ｃ）に示した電極パターン１５のように、互いに電気的に接続された平行且つ等間隔な線状の電極パターン１５（櫛状電極とも言う。）が接続されていてもよい。電気力線１３によって、塗膜の変形１６が生じて、第１の実施形態と同様の方法で測定が実施できる。
The second embodiment of the present invention has a structure in which a periodic electrode pattern 11 is formed on one surface of the substrate 10 and an electrode 12 made of a conductive film is formed on the other surface of the substrate 10. Yes (see FIG. 2 (a)).
After applying the coating film 13 to the surface of the substrate 10 on which the periodic electrode pattern 11 is formed, a voltage is applied from the voltage source 5 to the periodic electrode pattern 11 and the electrode 12 is grounded. Lines of electric force 13 are generated from the electrode pattern 11 through the substrate 10 and toward the electrode 12. The periodic electrode pattern 11 may have the interdigital electrodes 2-1 (see FIG. 1B) at the same potential, or may be electrically connected to each other like the electrode pattern 15 shown in FIG. 2C. The parallel and evenly spaced linear electrode patterns 15 (also called comb-shaped electrodes) may be connected. The electric force line 13 causes a deformation 16 of the coating film, and the measurement can be performed by the same method as in the first embodiment.
図２（ａ）において、数μｍ以上１００μｍ以下の塗膜１３に対して、基板１０の厚さは５００μｍ以下とすることが、電気力線１３を発生させて塗膜の変形１６を生じさせるために好適である。周期的な電極パターン１１または電極パターン１５を同電位とすることで、交互に対向する線状の電極間に電位差が生じず、導電性の高い塗膜での電気的短絡を防ぐことができる。 In FIG. 2A, the thickness of the substrate 10 is set to 500 μm or less for the coating film 13 having a thickness of several μm or more and 100 μm or less in order to generate the lines of electric force 13 and cause deformation 16 of the coating film. Suitable for By setting the periodic electrode pattern 11 or the electrode pattern 15 to the same potential, a potential difference does not occur between the linear electrodes that are alternately opposed to each other, and an electrical short circuit in a coating film having high conductivity can be prevented.
また、図２（ｂ）に示した基板１７のように、片面の周期的な電極パターン１８に対し、もう一方の面に周期的な電極パターン１８と同様な電極パターン１９を形成して、基板１７に塗膜２０を塗布してから、電圧源５から周期的な電極パターン１８を同電位として電圧を印加し、電極パターン１９を設置すると、電気力線２１の面方向への広がりを抑えることができ、塗膜の変形２２の広がりも同様に抑えられ、塗膜の変形２２を明瞭に画像測定でき、第１の実施形態と同様の方法で測定が実施できる。 Further, as in the substrate 17 shown in FIG. 2B, the electrode pattern 19 similar to the periodic electrode pattern 18 is formed on the other surface of the electrode pattern 18 on one surface to form the substrate 17. When the coating film 20 is applied to 17, the voltage is applied from the voltage source 5 with the periodic electrode pattern 18 at the same potential, and the electrode pattern 19 is installed, the spread of the electric force lines 21 in the surface direction is suppressed. Similarly, the spread of the deformation 22 of the coating film can be suppressed, the deformation 22 of the coating film can be clearly image-measured, and the measurement can be performed by the same method as in the first embodiment.
＜第３の実施形態＞
本発明の第３の実施形態を図１および図３を用いて説明する。
<Third Embodiment>
A third embodiment of the present invention will be described with reference to FIGS.
図１（ａ）の基板３において、周期的な電極パターン２に交互に電圧を印加して、接地されていない電極に正電圧を印加した場合、正の電荷が生じる。塗膜４には誘電体の粒子２５（図３参照）が含まれることが多く、この場合、周期的な電極パターン２側に負の電荷、反対側に正の電荷を帯電し、塗膜４において誘電体の粒子２５が拡散することで、電気力線６も広がってしまい、塗膜の変形７も広がって明瞭に画像検出できなくなる。 In the substrate 3 of FIG. 1A, when a voltage is alternately applied to the periodic electrode pattern 2 and a positive voltage is applied to an electrode that is not grounded, a positive charge is generated. The coating film 4 often contains dielectric particles 25 (see FIG. 3). In this case, the coating film 4 is charged with a negative charge on the side of the periodic electrode pattern 2 and a positive charge on the opposite side. At this point, the dielectric particles 25 are diffused, so that the lines of electric force 6 are also widened and the deformation 7 of the coating film is also widened, so that the image cannot be clearly detected.
電極パターン２に交流電圧を印加することで、電極パターン２の電圧を印加された付近の塗膜４では、誘電体の粒子２５の帯電箇所は正負交互に帯電してその都度電気力線６が周期的な電極パターン２の隣接するパターン間に向きを変えながら発生する。マクスウェル応力の特性から電気力線６の向きに塗膜の変形７は影響を受けないので、交流電圧での正負の電圧において等しく変形が発生する。 By applying an AC voltage to the electrode pattern 2, in the coating film 4 in the vicinity where the voltage of the electrode pattern 2 is applied, the charged portions of the particles 25 of the dielectric are alternately charged positively and negatively, and the electric lines of force 6 are generated each time. It occurs while changing the direction between the adjacent patterns of the periodic electrode pattern 2. Since the deformation 7 of the coating film is not affected by the Maxwell stress characteristics in the direction of the lines of electric force 6, the deformation is equally generated at positive and negative AC voltages.
誘電体の粒子２５が塗膜４において広がっても、交流電圧を印加していることで正負の帯電が中和され、電気力線は広がらず、塗膜の変形７は周期的な電極パターン２付近で生じて、明瞭に画像検出でき、第１の実施形態と同様の方法で測定が実施できる。交流電圧の周波数は、数μｍ以上１００μｍ以下の塗膜４において、数十ヘルツ以上数ｋヘルツ以下が好適である。 Even if the dielectric particles 25 spread in the coating film 4, the positive and negative charges are neutralized by applying the AC voltage, the lines of electric force do not spread, and the deformation 7 of the coating film is the periodic electrode pattern 2 It occurs in the vicinity, and the image can be clearly detected, and the measurement can be performed by the same method as in the first embodiment. The frequency of the AC voltage is preferably several tens of hertz to several kilohertz in the coating film 4 having a thickness of several μm to 100 μm.
＜第４の実施形態＞
本発明の第４の実施形態を、図１を用いて説明する。
<Fourth Embodiment>
A fourth embodiment of the present invention will be described with reference to FIG.
基板３に塗布した塗膜４が乾燥する過程において、電圧源５から印加する電圧の周波数が異なると、塗膜の変形７の大きさや形状が異なる。塗膜４が乾燥する過程において、印加する電圧の周波数を変化させていくことで、塗膜の変形７が明瞭に画像検出でき、第１の実施形態と同様の方法で測定が実施できる。乾燥を開始した直後は、数百〜数ｋヘルツの周波数とし、乾燥が進んだ段階では１ヘルツ以下から数ヘルツの周波数とすることで、明瞭な画像検出が可能となる。 If the frequency of the voltage applied from the voltage source 5 is different in the process of drying the coating film 4 applied to the substrate 3, the size and shape of the deformation 7 of the coating film are different. By changing the frequency of the applied voltage in the process of drying the coating film 4, the deformation 7 of the coating film can be clearly image-detected, and the measurement can be performed by the same method as in the first embodiment. Immediately after the drying is started, the frequency is set to several hundred to several kilohertz, and when the drying is advanced, the frequency is set to 1 hertz or less to several hertz, so that clear image detection can be performed.
１・・・光源
２・・・周期的な電極パターン
２−１・・・すだれ状電極
３・・・基板
４・・・塗膜
５・・・電圧源
６・・・電気力線
７・・・塗膜の変形
８・・・画像検出器
９・・・画像処理装置
１０・・・基板
１１・・・周期的な電極パターン
１２・・・電極
１３・・・塗膜
１４・・・電気力線
１５・・・電極パターン
１６・・・塗膜の変形
１７・・・基板
１８・・・周期的な電極パターン
１９・・・電極パターン
２０・・・塗膜
２１・・・電気力線
２２・・・塗膜の変形
２５・・・誘電体の粒子
３０・・・ムラ検査装置
1 ... Light source 2 ... Periodic electrode pattern 2-1 ... Interdigital electrode 3 ... Substrate 4 ... Coating film 5 ... Voltage source 6 ... Electric force line 7 ... Deformation 8 of coating film ... Image detector 9 ... Image processing device 10 ... Substrate 11 ... Periodic electrode pattern 12 ... Electrode 13 ... Coating film 14 ... Electric force Line 15 ... Electrode pattern 16 ... Deformation of coating film 17 ... Substrate 18 ... Periodic electrode pattern 19 ... Electrode pattern 20 ... Coating film 21 ... Electric force line 22 ... ..Deformation of coating 25 ... Dielectric particles 30 ... Mura inspection device
Claims (7)
基板上に塗液を塗布することで形成される塗膜に、平行且つ等間隔の直線状または曲線状の凹凸形状を形成するための手段と、
塗膜に形成された凹凸形状に直交する方向から光を照射し反射光を得るための光源と、
その凹凸形状からの反射光を受光し撮像するために基板の上方に備えられた画像検出器と、を備えている塗膜ムラ検出装置であって、
前記凹凸形状を形成するための手段が、前記基板上に形成された平行且つ等間隔の直線状または曲線状の電極に電圧を印加することにより、塗膜にマクスウェルの応力を作用させる手段であることを特徴とする塗膜ムラ検出装置。 A coating film unevenness detection device for optically detecting unevenness occurring in a coating film formed by applying a coating liquid on a substrate,
Means for forming parallel or evenly-spaced linear or curved uneven shapes on the coating film formed by applying the coating liquid on the substrate,
A light source for irradiating light from a direction orthogonal to the uneven shape formed on the coating film to obtain reflected light,
An image detector provided above the substrate for receiving and imaging the reflected light from the uneven shape, and a coating film unevenness detecting device comprising :
The means for forming the concavo-convex shape is a means for applying Maxwell stress to the coating film by applying a voltage to parallel or evenly-spaced linear or curved electrodes formed on the substrate. A coating film unevenness detection device characterized by the above.
基板に塗布された塗膜を乾燥しながら、前記凹凸形状を形成するための手段により塗膜に凹凸形状を形成し、その凹凸形状に直交する方向から光を照射することにより反射光を生じせしめ、その反射光を前記画像検出器により受光することで塗膜に形成されたムラを撮像する工程と、を備えていることを特徴とする塗膜ムラ検出方法。 A coating unevenness detecting method using a coating film unevenness detecting device according to any one of claims 1 to 3, a coating film forming step of forming a coating film on a substrate by applying a coating liquid to the substrate When,
While the coating film applied to the substrate is being dried, a concave-convex shape is formed on the coating film by the means for forming the concave-convex shape, and reflected light is generated by irradiating light from a direction orthogonal to the concave-convex shape. And a step of imaging the unevenness formed on the coating film by receiving the reflected light by the image detector, and a coating film unevenness detection method.
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