JP6668047B2 - Device mounting board and electronic components - Google Patents

Device mounting board and electronic components Download PDF

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JP6668047B2
JP6668047B2 JP2015227007A JP2015227007A JP6668047B2 JP 6668047 B2 JP6668047 B2 JP 6668047B2 JP 2015227007 A JP2015227007 A JP 2015227007A JP 2015227007 A JP2015227007 A JP 2015227007A JP 6668047 B2 JP6668047 B2 JP 6668047B2
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conductor layer
element mounting
substrate
base portion
mounting substrate
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JP2017098341A (en
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悠史 三田
悠史 三田
寛 小路
寛 小路
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Nippon Carbide Industries Co Inc
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Description

本発明は、素子搭載用基板及び当該素子搭載用基板を備える電子部品に関する。   The present invention relates to an element mounting substrate and an electronic component including the element mounting substrate.

発光ダイオード、水晶振動子、ＭＥＭＳ（Micro Electro Mechanical Systems）等の素子を搭載する素子搭載用基板の例として、セラミック基板を挙げることができる。また、このようなセラミック基板にはキャビティ（凹部）に上記各種素子を搭載してキャビティを蓋体で封止されるものがある。そして、キャビティには素子に電気的に接続される電極が固定される。   As an example of an element mounting substrate on which elements such as a light emitting diode, a quartz oscillator, and MEMS (Micro Electro Mechanical Systems) are mounted, a ceramic substrate can be given. Some of such ceramic substrates have the above-described various elements mounted in a cavity (recess) and the cavity is sealed with a lid. An electrode electrically connected to the element is fixed to the cavity.

上記のようなキャビティに電極が固定される素子搭載用基板に関する技術として、例えば下記特許文献１には、基板と基板の外周縁の上面に設けられる枠体と、基板の上面に設けられる電極と、を有する素子搭載用基板が開示されている。また、下記特許文献２には、凹部を有し、当該凹部の底面に一部が切り欠かれた電極を備える素子搭載用基板が開示されている。   As a technique relating to an element mounting substrate in which an electrode is fixed in a cavity as described above, for example, Patent Document 1 below discloses a substrate and a frame provided on an upper surface of an outer peripheral edge of the substrate, and an electrode provided on an upper surface of the substrate. Are disclosed. Further, Patent Literature 2 below discloses an element mounting substrate having a concave portion and an electrode having a partially cutout on the bottom surface of the concave portion.

特開２０１５−１２６３４３号公報JP-A-2015-126343 特開２０１５−１４２０９８号公報JP 2015-142098 A

近年の電子部品の需要は車載部品や携帯電話等へと拡大しており、従来よりも過酷な温度条件や振動条件下で電子部品が使用される。このような状況下において、電子部品に備えられる素子搭載用基板に固定される電極の固定強度の向上が求められている。電極の固定強度が不十分である場合、熱衝撃や振動等によって電極が素子搭載用基板から剥がれる虞がある。上記特許文献１や特許文献２に開示されているような従来の素子搭載用基板では、電極が固定されている部位はキャビティの底面のみである。   In recent years, demand for electronic components has been expanding to in-vehicle components, mobile phones, and the like, and electronic components are used under severer temperature and vibration conditions than in the past. Under such circumstances, there is a demand for an improvement in the fixing strength of an electrode fixed to an element mounting substrate provided in an electronic component. If the fixing strength of the electrode is insufficient, the electrode may be peeled off from the element mounting substrate due to thermal shock, vibration, or the like. In the conventional device mounting substrates disclosed in Patent Documents 1 and 2, the electrode is fixed only on the bottom surface of the cavity.

そこで、本発明は、搭載される素子に電気的に接続される導電体層を有する素子搭載用基板であって当該導電体層が剥がれ難い素子搭載用基板、及び当該素子搭載用基板を備える電子部品を提供しようとするものである。   Therefore, the present invention provides an element mounting substrate having a conductor layer electrically connected to an element to be mounted, wherein the conductor layer is difficult to peel off, and an electronic device including the element mounting substrate. It is intended to provide parts.

上記課題を解決するため、本発明の素子搭載用基板は、基体部と前記基体部の一方の面に設けられる枠状の枠体部とを有する基板本体と、前記基板本体上に配置され、搭載される素子に電気的に接続される導電体層と、を備え、前記枠体部の内周面は前記基体部から延在する複数の面からなり、前記導電体層は、前記基体部の前記一方の面のうち前記枠体部で囲われる部分である上面と、前記複数の面のうち少なくとも二つの面とに跨るように配置されることを特徴とする。   In order to solve the above problems, an element mounting substrate of the present invention is a substrate body having a base portion and a frame-shaped frame portion provided on one surface of the base portion, and is disposed on the substrate body, A conductive layer electrically connected to an element to be mounted, wherein an inner peripheral surface of the frame portion includes a plurality of surfaces extending from the base portion, and the conductive layer includes the base portion. Wherein the one surface is arranged so as to straddle an upper surface which is a portion surrounded by the frame body portion and at least two surfaces of the plurality of surfaces.

本発明の素子搭載用基板によれば、導電体層は基体部の上面だけでなく枠体部の内周面に含まれる複数の面のうち少なくとも二つの面にも跨いで配置されるため、導電体層が固定される面積を大きくし易くなるとともに、導電体層が３次元的又は立体的に配置されることで、基板の面方向（基板の厚み方向に垂直な方向）の振動に対して導電体層が剥がれ難くなる。従って、導電体層を基板本体に強固に固定させやすくなり、熱衝撃や振動等によって導電体層に応力が加わるとしても導電体層が基板本体から剥がれ難い。   According to the element mounting substrate of the present invention, since the conductive layer is arranged not only on the upper surface of the base portion but also on at least two of a plurality of surfaces included in the inner peripheral surface of the frame portion, In addition to making it easy to increase the area where the conductor layer is fixed, the conductor layer is arranged three-dimensionally or three-dimensionally, so that vibration in the plane direction of the substrate (the direction perpendicular to the thickness direction of the substrate) is prevented. The conductor layer is hardly peeled off. Therefore, it is easy to firmly fix the conductor layer to the substrate body, and even if stress is applied to the conductor layer due to thermal shock, vibration, or the like, the conductor layer does not easily peel off from the substrate body.

また、上記素子搭載用基板において、前記導電体層は、前記基体部の前記上面と前記複数の面のうち互いに隣り合う二つの面とに跨るように配置されることが好ましい。   Further, in the element mounting board, it is preferable that the conductor layer is disposed so as to straddle the upper surface of the base portion and two adjacent surfaces of the plurality of surfaces.

このように導電体層が枠体部の内周面のうち互いに隣り合う二つの面に配置されることによって、導電体層が設けられる箇所を狭い範囲に集中させやすくなり、導電体層が応力を受けても基板本体からより剥がれ難くなる。   By arranging the conductor layer on two adjacent surfaces of the inner peripheral surface of the frame portion in this manner, it is easy to concentrate the portion where the conductor layer is provided in a narrow range, and the conductor layer is stressed. Even if it receives, it becomes difficult to peel off from the substrate body.

また、上記素子搭載用基板において、上記のように導電体層が枠体部の内周面を構成する複数の面のうち互いに隣り合う二つの面に配置される場合、前記基体部の前記上面と前記隣り合う二つの面とで形成される角部は、前記導電体層が非配置とされることが好ましい。   Further, in the above-mentioned element mounting substrate, when the conductor layer is disposed on two mutually adjacent surfaces among the plurality of surfaces constituting the inner peripheral surface of the frame body portion as described above, the upper surface of the base portion It is preferable that the conductor layer is not disposed at a corner formed by the two adjacent surfaces.

基体部の上面と枠体部の内周面のうち互いに隣り合う二つの面で形成される角部は他の部位に比べて応力が集中しやすい。当該角部に導電体層が非配置とされることによって、導電体層に応力が加わり難くなり、導電体層が基板本体からより剥がれ難くなる。   Stress is more likely to concentrate on corners formed by two adjacent surfaces of the upper surface of the base portion and the inner peripheral surface of the frame portion than other portions. When the conductor layer is not disposed at the corner, stress is less likely to be applied to the conductor layer, and the conductor layer is less likely to be separated from the substrate body.

また、上記素子搭載用基板において、前記導電体層は素子が電気的に接続される素子接続部を有し、前記素子接続部は、前記二つの面のうち一方の面と前記基体部の上面との交線に垂直な線と、前記二つの面のうち他方の面と前記基体部の上面との交線に垂直な線と、の交点を含む領域に位置することが好ましい。   Further, in the element mounting board, the conductor layer has an element connection portion to which an element is electrically connected, and the element connection portion is provided on one of the two surfaces and an upper surface of the base portion. And a line perpendicular to the line of intersection of the two surfaces and a line perpendicular to the line of intersection of the other surface of the two surfaces and the upper surface of the base portion.

素子が上記領域に位置する素子接続部で接続されることによって、素子から導電体層に加えられる応力が分散しやすくなるため、導電体層が基板本体からより剥がれ難くなる。また、導電体層の剥がれは、素子接続部を支点として素子接続部の近傍で発生するため、導電体層のうち最も強固な部分である上記領域に素子接続部が設けられることによって、導電体層が基板本体からより剥がれ難くなる。   When the element is connected at the element connection portion located in the above region, the stress applied to the conductor layer from the element is easily dispersed, so that the conductor layer is less likely to be peeled from the substrate body. Further, since the peeling of the conductor layer occurs near the element connection part with the element connection part as a fulcrum, the element connection part is provided in the above-described region which is the strongest part of the conductor layer, and thus the conductor layer is separated. The layer is less likely to peel from the substrate body.

また、本発明の電子部品は、上述の本発明の素子搭載用基板と、前記導電体層に電気的に接続される素子と、を備えることを特徴とする。   Further, an electronic component according to the present invention includes the above-described substrate for mounting an element according to the present invention, and an element electrically connected to the conductor layer.

上述したように本発明の素子搭載用基板によれば導電体層が基板本体から剥がれ難い。よって、本発明の素子搭載用基板の導電体層に接続される素子から当該導電体層が熱衝撃や振動等を加えられるとしても、当該導電体層は基板本体から剥がれ難い。従って、本発明の電子部品は耐久性が向上される。   As described above, according to the element mounting substrate of the present invention, the conductor layer is not easily peeled off from the substrate body. Therefore, even if the conductive layer is subjected to thermal shock, vibration, or the like from the element connected to the conductive layer of the element mounting substrate of the present invention, the conductive layer is unlikely to be peeled off from the substrate body. Therefore, the electronic component of the present invention has improved durability.

以上のように、本発明の素子搭載用基板は素子に電気的に接続される導電体層が基板本体から剥がれ難く、本発明の電子部品は耐久性が向上される。   As described above, in the element mounting substrate of the present invention, the conductor layer electrically connected to the element is hardly peeled off from the substrate main body, and the electronic component of the present invention has improved durability.

一つの実施形態に係る電子部品を概略的に示す分解斜視図である。1 is an exploded perspective view schematically illustrating an electronic component according to one embodiment. 図１に示す素子搭載用基板を概略的に示す斜視図である。FIG. 2 is a perspective view schematically showing the element mounting board shown in FIG. 1. 図２に示す素子搭載用基板から接着剤及び絶縁層が省略されている図である。FIG. 3 is a view in which an adhesive and an insulating layer are omitted from the element mounting substrate shown in FIG. 2. 図３に示す素子搭載用基板の平面図である。FIG. 4 is a plan view of the element mounting board shown in FIG. 3. 図４にＶで示す部分を拡大して示す図である。It is a figure which expands and shows the part shown by V in FIG. 図４にＶＩで示す部分を拡大して示す図である。FIG. 5 is an enlarged view showing a portion indicated by VI in FIG. 4. 他の実施形態に係る素子搭載用基板を概略的に示す平面図である。FIG. 7 is a plan view schematically showing an element mounting board according to another embodiment.

以下、本発明について図面を参照しながら詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the drawings.

図１は本発明の一つの実施形態に係る電子部品を概略的に示す分解斜視図である。本実施形態の電子部品１は、素子搭載用基板１０、素子５０及び蓋体６０を主な構成として備えている。以下、電子部品１を構成するこれらの構成要素についてより詳細に説明する。   FIG. 1 is an exploded perspective view schematically showing an electronic component according to one embodiment of the present invention. The electronic component 1 of the present embodiment mainly includes an element mounting board 10, an element 50, and a lid 60 as main components. Hereinafter, these components constituting the electronic component 1 will be described in more detail.

＜素子搭載用基板１０＞
図２は図１に示す素子搭載用基板１０を概略的に示す斜視図である。図３は図２に示す素子搭載用基板１０から接着剤３０及び絶縁層２０が省略されている図である。図４は図３に示す素子搭載用基板１０の平面図である。 <Element mounting substrate 10>
FIG. 2 is a perspective view schematically showing the element mounting substrate 10 shown in FIG. FIG. 3 is a diagram in which the adhesive 30 and the insulating layer 20 are omitted from the element mounting substrate 10 shown in FIG. FIG. 4 is a plan view of the element mounting substrate 10 shown in FIG.

素子搭載用基板１０は、基体部１１と枠体部１２とを有する基板本体１０ｘ、絶縁層２０、接着剤３０、及び導電体層４０，４１を主な構成として備えている。なお、基体部１１及び枠体部１２は一体成形されており、図１から図３において基体部１１と枠体部１２との境界は点線で示されている。   The element mounting substrate 10 mainly includes a substrate body 10x having a base portion 11 and a frame portion 12, an insulating layer 20, an adhesive 30, and conductor layers 40 and 41. The base portion 11 and the frame portion 12 are integrally formed, and a boundary between the base portion 11 and the frame portion 12 is shown by a dotted line in FIGS.

基体部１１は、仮に基体部１１と枠体部１２とを分離する場合、平板状の部位とされる。基体部１１は平板状であれば形状及び大きさは特に限定されない。本実施形態の基体部１１は外周の形状が四角形であり、この場合の基体部１１の大きさは、例えば３ｍｍ（縦幅）×２ｍｍ（横幅）×０．６ｍｍ（厚さ）とされる。   If the base part 11 and the frame body part 12 are separated from each other, the base part 11 is a flat part. The shape and size of the base 11 are not particularly limited as long as the base 11 is flat. The base portion 11 of the present embodiment has a square outer periphery, and the size of the base portion 11 in this case is, for example, 3 mm (length) × 2 mm (width) × 0.6 mm (thickness).

枠体部１２は、基体部１１の一方の面に設けられる枠状の部位である。枠体部１２は枠状であれば形状及び大きさは特に限定されない。本実施形態の枠体部１２は外周及び内周の形状が四角形であり、枠体部１２の内周面１３は基体部１１から延在する四つの面１３ａ，１３ｂ，１３ｃ，１３ｄから構成されている。   The frame portion 12 is a frame-shaped portion provided on one surface of the base portion 11. The shape and size of the frame portion 12 are not particularly limited as long as the shape is a frame shape. The outer periphery and the inner periphery of the frame portion 12 of the present embodiment are quadrangular, and the inner peripheral surface 13 of the frame portion 12 is composed of four surfaces 13a, 13b, 13c, 13d extending from the base portion 11. ing.

枠体部１２の内周面１３によって囲まれる領域は厚さ方向に貫通する孔になっている。上記のように枠体部１２は基体部１１の一面上に設けられるため、枠体部１２の基体部１１と反対側は開口している。そして、基体部１１の当該一面のうち枠体部１２で囲われる部分である“枠体部１２側の面１１ａ”（以下、「上面１１ａ」という。）と枠体部１２の内周面１３とにより凹部であるキャビティ１５が形成されている。なお、本実施形態では内周面１３を構成する各面１３ａ，１３ｂ，１３ｃ，１３ｄは上記開口側に向かうにつれて外周側に向かう傾斜面とされている。   A region surrounded by the inner peripheral surface 13 of the frame portion 12 is a hole penetrating in the thickness direction. As described above, since the frame 12 is provided on one surface of the base 11, the opposite side of the frame 12 from the base 11 is open. The “surface 11 a on the frame body 12 side” (hereinafter referred to as “upper surface 11 a”), which is a portion of the one surface of the base body 11 that is surrounded by the frame body 12, and the inner peripheral surface 13 of the frame body 12. Thus, a cavity 15 which is a concave portion is formed. In the present embodiment, each of the surfaces 13a, 13b, 13c, and 13d constituting the inner peripheral surface 13 is an inclined surface toward the outer peripheral side toward the opening side.

枠体部１２の大きさは特に限定されないが、例えば３ｍｍ（縦幅）×２ｍｍ（横幅）×０．２ｍｍ（厚さ）とされる。また、傾斜面である面１３ａ，１３ｂ，１３ｃ，１３ｄの傾斜角度は特に限定されないが、例えば基体部１１の上面１１ａに対して７５°とされる。また、キャビティ１５の開口の大きさは特に限定されないが、例えば０．９ｍｍ（縦幅）×０．９ｍｍ（横幅）とされる。   The size of the frame portion 12 is not particularly limited, but is, for example, 3 mm (length) × 2 mm (width) × 0.2 mm (thickness). The inclination angles of the inclined surfaces 13a, 13b, 13c, 13d are not particularly limited, but are set to, for example, 75 ° with respect to the upper surface 11a of the base portion 11. The size of the opening of the cavity 15 is not particularly limited, but is, for example, 0.9 mm (length) × 0.9 mm (width).

本実施形態の基板本体１０ｘはセラミックスで構成されており、当該セラミックスとしては特に限定されないが、例えば、アルミナを主成分とするセラミックスや、窒化アルミニウムを主成分とするセラミックスや、ムライトを主成分とするセラミックス等を挙げることができる。   The substrate body 10x of the present embodiment is made of ceramics, and is not particularly limited as the ceramics. For example, ceramics mainly containing alumina, ceramics mainly containing aluminum nitride, and mullite mainly containing Ceramics and the like.

また、基板本体１０ｘは例えば以下のようにして作製される。セラミックグリーンシートを準備し、当該セラミックグリーンシートをプレス成型してから焼成することによって得られる。なお、セラミックグリーンシートとは、焼成することによりセラミック焼結体となる生シートのことであって、焼成前のセラミック基板のことをいう。セラミックグリーンシートは次のように製造される。例えば、基板本体１０ｘがアルミナセラミックスから成る場合には、アルミナ粉末、焼結助剤、有機バインダ、溶剤、可塑剤等を適宜混合してスラリーを調製する。次に、調製したスラリーをドクターブレード法やカレンダーロール法等の方法により平坦なシート状に成形して単層のセラミックグリーンシートを作製する。なお、セラミックグリーンシートは、原料粉末を成型機に充填して加圧成形することにより作製することもできる。セラミックグリーンシートを焼成する際には、上記のように基板本体１０ｘがアルミナセラミックスから成る場合、アルミナが焼結し得る所定の温度（例えば、１４００℃から１８００℃程度の温度）で焼成する。   The substrate body 10x is manufactured, for example, as follows. It is obtained by preparing a ceramic green sheet, press-molding the ceramic green sheet, and then firing. Note that the ceramic green sheet is a green sheet that becomes a ceramic sintered body by firing, and refers to a ceramic substrate before firing. The ceramic green sheet is manufactured as follows. For example, when the substrate body 10x is made of alumina ceramics, a slurry is prepared by appropriately mixing alumina powder, a sintering aid, an organic binder, a solvent, a plasticizer, and the like. Next, the prepared slurry is formed into a flat sheet by a method such as a doctor blade method or a calender roll method to produce a single-layer ceramic green sheet. The ceramic green sheet can also be produced by filling a raw material powder into a molding machine and performing pressure molding. When firing the ceramic green sheet, when the substrate body 10x is made of alumina ceramics as described above, firing is performed at a predetermined temperature at which alumina can be sintered (for example, a temperature of about 1400 ° C. to 1800 ° C.).

ただし、基板本体１０ｘの製造方法は特に限定されない。例えば、平板状の基体部１１を作製した後、別に作製した枠体部１２を当該基体部１１に一体化させて基板本体１０ｘとしてもよい。   However, the method for manufacturing the substrate body 10x is not particularly limited. For example, after the flat base 11 is manufactured, the frame 12 separately manufactured may be integrated with the base 11 to form the substrate body 10x.

上述のキャビティ１５は発光ダイオード、水晶振動子、ＭＥＭＳ等の素子５０が搭載される部位である。従って、キャビティ１５には素子５０に電気的に接続される一対の導電体層４０，４１が設けられる。導電体層４０，４１のうち基体部１１の上面１１ａ上に配置される一部は素子５０に電気的に接続される電極として機能する。また、導電体層４０，４１の他の一部は枠体部１２の基体部１１とは反対側の面１２ａ（以下、「天面１２ａ」という。）を超えて基体部１１の枠体部１２とは反対側の面（図に表れていない面）まで配設され、当該反対側の面に配設される導電体層４０，４１の一部は電子部品１の外部と接続される入力端子又は出力端子として機能する。   The above-described cavity 15 is a portion where the element 50 such as a light emitting diode, a quartz oscillator, and MEMS is mounted. Therefore, the cavity 15 is provided with a pair of conductor layers 40 and 41 electrically connected to the element 50. Some of the conductor layers 40 and 41 disposed on the upper surface 11a of the base portion 11 function as electrodes electrically connected to the element 50. The other part of the conductor layers 40 and 41 exceeds the surface 12a of the frame portion 12 opposite to the base portion 11 (hereinafter referred to as “top surface 12a”). 12 is provided up to a surface (a surface not shown in the drawing) on the opposite side, and a part of the conductor layers 40 and 41 provided on the opposite surface is an input connected to the outside of the electronic component 1. Functions as a terminal or an output terminal.

導電体層４０，４１は基板本体１０ｘ上に配置され、搭載される素子５０に電気的に接続される導電性を有する一対の層である。それぞれの導電体層４０，４１は、基体部１１の上面１１ａと内周面１３を構成する複数の面１３ａ，１３ｂ，１３ｃ，１３ｄのうち少なくとも二つの面とに跨るようにそれぞれ配置されている。より具体的には、導電体層４０は基体部１１の上面１１ａと三つの面１３ａ，１３ｂ，１３ｃとに跨るように配置され、導電体層４１は基体部１１の上面１１ａと互いに隣り合う二つの面１３ａ，１３ｄとに跨るように配置されている。ただし、導電体層４０は上面１１ａと面１３ａ，１３ｂとで形成される角部１４ａ及び上面１１ａと面１３ｂ，１３ｃとで形成される角部１４ｂには非配置であり、導電体層４１は上面１１ａと面１３ａ，１３ｄとで形成される角部１４ｃには非配置である。   The conductor layers 40 and 41 are a pair of conductive layers disposed on the substrate body 10x and electrically connected to the mounted element 50. Each of the conductor layers 40 and 41 is disposed so as to straddle at least two of the plurality of surfaces 13a, 13b, 13c and 13d constituting the inner peripheral surface 13 and the upper surface 11a of the base portion 11. . More specifically, the conductor layer 40 is disposed so as to straddle the upper surface 11a of the base portion 11 and the three surfaces 13a, 13b, 13c. It is arranged so as to straddle the two surfaces 13a and 13d. However, the conductor layer 40 is not disposed on the corner 14a formed by the upper surface 11a and the surfaces 13a and 13b and the corner 14b formed by the upper surface 11a and the surfaces 13b and 13c. No corners 14c are formed by the upper surface 11a and the surfaces 13a and 13d.

導電体層４０，４１を基板本体１０ｘに固定する方法は特に限定されない。例えば、導電性を有する材料を含むペーストを、インクジェット印刷、パッド印刷、スクリーン印刷等の印刷方法によって、導電体層４０，４１が配置される場所に塗布して乾燥させて導電体層４０，４１を形成する方法や、導電性を有する材料から構成される薄膜を接着剤等で基板本体１０ｘに接着させて当該薄膜を導電体層４０，４１とする方法等によって、導電体層４０，４１を基板本体１０ｘに固定することができる。   The method for fixing the conductor layers 40 and 41 to the substrate body 10x is not particularly limited. For example, a paste containing a material having conductivity is applied to a place where the conductor layers 40 and 41 are to be disposed by a printing method such as ink jet printing, pad printing, screen printing, and the like, and dried, so that the conductor layers 40 and 41 are dried. The conductive layers 40 and 41 are formed by a method of forming a conductive layer or a method of bonding a thin film made of a conductive material to the substrate body 10x with an adhesive or the like to form the thin films into the conductive layers 40 and 41. It can be fixed to the substrate body 10x.

本実施形態の素子搭載用基板１０によれば、上記のように導電体層４０，４１は基体部１１の上面１１ａだけでなく枠体部１２の内周面１３を構成する面のうち少なくとも二つの面にも跨いで配置されるため、導電体層４０，４１が固定される部分の面積を大きくし易くなるとともに、導電体層４０，４１が３次元的又は立体的に配置されることで、素子搭載用基板１０の面方向（素子搭載用基板１０の厚み方向に垂直な方向）の振動に対して導電体層４０，４１が剥がれ難くなる。従って、導電体層４０，４１を基板本体１０ｘに強固に固定させ易くなり、熱衝撃や振動等によって導電体層４０，４１に応力が加わるとしても導電体層４０，４１が基板本体１０ｘから剥がれ難い。   According to the element mounting substrate 10 of the present embodiment, as described above, the conductor layers 40 and 41 are formed not only on the upper surface 11a of the base portion 11 but also on at least two of the surfaces constituting the inner peripheral surface 13 of the frame portion 12. Since the conductor layers 40 and 41 are arranged across two surfaces, the area of the portion where the conductor layers 40 and 41 are fixed is easily increased, and the conductor layers 40 and 41 are arranged three-dimensionally or three-dimensionally. In addition, the conductor layers 40 and 41 are less likely to be peeled off by the vibration in the surface direction of the element mounting substrate 10 (the direction perpendicular to the thickness direction of the element mounting substrate 10). Therefore, the conductor layers 40 and 41 are easily fixed firmly to the substrate body 10x, and even if stress is applied to the conductor layers 40 and 41 by thermal shock, vibration, or the like, the conductor layers 40 and 41 are peeled off from the substrate body 10x. hard.

また、上記のように導電体層４０，４１が枠体部の内周面１３のうち互いに隣り合う二つの面に配置されることによって、導電体層４０，４１が固定される箇所を狭い範囲に集中させやすくなり、導電体層４０，４１が応力を受けても基板本体１０ｘからより剥がれ難くなる。   Further, as described above, since the conductor layers 40 and 41 are arranged on two adjacent surfaces of the inner peripheral surface 13 of the frame portion, the place where the conductor layers 40 and 41 are fixed can be narrowed. And the conductor layers 40 and 41 are less likely to be separated from the substrate main body 10x even when subjected to stress.

さらに、角部１４ａ，１４ｂ，１４ｃに導電体層４０，４１が非配置とされることによって、以下に説明するように導電体層４０，４１がより剥がれ難くなる。基体部１１の上面１１ａと枠体部１２の内周面１３のうち互いに隣り合う二つの面で形成される角部１４ａ，１４ｂ，１４ｃは他の部位に比べて応力が集中しやすい。当該角部１４ａ，１４ｂ，１４ｃに導電体層４０，４１が非配置とされることによって、導電体層４０，４１に応力が加わり難くなり、導電体層４０，４１が基板本体１０ｘから剥がれ難くなる。   Further, since the conductor layers 40 and 41 are not disposed on the corners 14a, 14b and 14c, the conductor layers 40 and 41 are more difficult to peel off as described below. The corners 14a, 14b, 14c formed by two adjacent surfaces of the upper surface 11a of the base portion 11 and the inner peripheral surface 13 of the frame portion 12 are more likely to concentrate stress than other portions. Since the conductor layers 40 and 41 are not disposed on the corners 14a, 14b and 14c, stress is less likely to be applied to the conductor layers 40 and 41, and the conductor layers 40 and 41 are less likely to be separated from the substrate body 10x. Become.

次に、絶縁層２０について説明する。絶縁層２０は、枠体部１２の天面１２ａ上に配置される導電体層４０，４１を覆うように、枠体部１２の外周に沿って天面１２ａの全体又は一部に形成される枠状の層である。   Next, the insulating layer 20 will be described. The insulating layer 20 is formed on the whole or a part of the top surface 12a along the outer periphery of the frame body portion 12 so as to cover the conductor layers 40 and 41 arranged on the top surface 12a of the frame body portion 12. It is a frame-shaped layer.

絶縁層２０は電気絶縁体で構成される。また、絶縁層２０を構成する材料は、接着剤３０を介して素子搭載用基板１０に蓋体６０を固定する際に溶融し難い材料であることが好ましい。後述するように、素子搭載用基板１０に蓋体６０を固定する際には加熱する場合がある。このとき、絶縁層２０が溶融すると絶縁層２０が意図した場所に形成されない虞がある。従って、絶縁層２０を構成する材料の例としては、接着剤３０より融点が高いガラスや樹脂等を挙げることができる。また、キャビティ１５に収容される素子５０が空気や水分による悪影響を受けることを抑制するためには、絶縁層２０は空気や水分が透過し難い材料で構成されることが好ましい。従って、絶縁層２０は例えばガラスで構成されることが好ましい。   The insulating layer 20 is made of an electric insulator. Further, the material forming the insulating layer 20 is preferably a material that is not easily melted when the lid 60 is fixed to the element mounting substrate 10 via the adhesive 30. As described later, heating may be performed when fixing the lid body 60 to the element mounting substrate 10. At this time, if the insulating layer 20 melts, the insulating layer 20 may not be formed at an intended place. Therefore, examples of the material forming the insulating layer 20 include glass and resin having a higher melting point than the adhesive 30. In order to prevent the element 50 housed in the cavity 15 from being adversely affected by air or moisture, the insulating layer 20 is preferably made of a material through which air or moisture hardly permeates. Therefore, it is preferable that the insulating layer 20 is made of, for example, glass.

次に、接着剤３０について説明する。接着剤３０は枠体部１２の天面１２ａ側に、枠体部１２の外周に沿って枠状に塗布され、素子搭載用基板１０に蓋体６０を固定する接着剤である。接着剤３０としては、ガラスや樹脂などの熱可塑性材料、熱硬化性樹脂、架橋性樹脂、紫外線硬化性樹脂等を用いることができる。ただし、接着剤３０は熱可塑性材料であることが好ましい。熱可塑性材料は常温では変形し難い。従って、接着剤３０として熱可塑性材料を用いる場合、素子搭載用基板１０と蓋体６０との接着を開始する前は接着剤３０を所望の位置に保持しやすい。   Next, the adhesive 30 will be described. The adhesive 30 is applied in a frame shape on the top surface 12 a side of the frame body 12 along the outer periphery of the frame body 12, and is an adhesive for fixing the lid body 60 to the element mounting substrate 10. As the adhesive 30, a thermoplastic material such as glass or resin, a thermosetting resin, a crosslinkable resin, an ultraviolet curable resin, or the like can be used. However, the adhesive 30 is preferably a thermoplastic material. Thermoplastic materials are not easily deformed at room temperature. Therefore, when a thermoplastic material is used as the adhesive 30, it is easy to hold the adhesive 30 at a desired position before the bonding between the element mounting substrate 10 and the lid 60 is started.

また、キャビティ１５に収容される素子５０が熱による悪影響を受けることを抑制するためには、接着剤３０は素子搭載用基板１０に蓋体６０を固定させる際に高温の熱を必要としない材料であることが好ましい。また、キャビティ１５に収容される素子５０が空気や水分による悪影響を受けることを抑制するためには、接着剤３０は空気や水分が透過し難い材料であることが好ましい。従って、接着剤３０としては、例えば３００℃〜４００℃程度のガラス転移点を有する低融点ガラスが好ましい。   In order to prevent the device 50 housed in the cavity 15 from being adversely affected by heat, the adhesive 30 is made of a material that does not require high-temperature heat when fixing the lid 60 to the device mounting substrate 10. It is preferred that In order to prevent the element 50 housed in the cavity 15 from being adversely affected by air or moisture, the adhesive 30 is preferably a material through which air or moisture hardly permeates. Therefore, as the adhesive 30, for example, a low-melting glass having a glass transition point of about 300 ° C. to 400 ° C. is preferable.

＜素子５０＞
素子５０は上述したように素子搭載用基板１０のキャビティ１５に搭載される。素子５０の具体例としては、発光ダイオード、水晶振動子、ＭＥＭＳ等を挙げることができる。素子５０は図示していない電極と当該電極に電気的に接続された端子を有しており、当該端子が導電性ペーストやはんだ等で導電体層４０，４１に電気的に接続されることによって、素子５０が通電可能な状態でキャビティ１５に搭載される。 <Element 50>
The element 50 is mounted in the cavity 15 of the element mounting substrate 10 as described above. Specific examples of the element 50 include a light emitting diode, a crystal oscillator, and MEMS. The element 50 has an electrode (not shown) and a terminal electrically connected to the electrode, and the terminal is electrically connected to the conductor layers 40 and 41 with a conductive paste or solder. The element 50 is mounted in the cavity 15 in a state where it can be energized.

導電体層４０，４１に素子５０が電気的に接続される素子接続部４２，４３の位置は特に限定されないが、以下に説明する位置であることが好ましい。素子接続部４２，４３の位置について、図５及び図６を参照して説明する。図５は図４にＶで示す部分を拡大して示す図である。図６は図４にＶＩで示す部分を拡大して示す図である。   The positions of the element connection portions 42 and 43 where the element 50 is electrically connected to the conductor layers 40 and 41 are not particularly limited, but are preferably the positions described below. The positions of the element connection portions 42 and 43 will be described with reference to FIGS. FIG. 5 is an enlarged view of a portion indicated by V in FIG. FIG. 6 is an enlarged view of a portion indicated by VI in FIG.

導電体層４０は素子５０が電気的に接続される素子接続部４２を有し、素子接続部４２は導電体層４０が配置されている二つの面１３ａ，１３ｂのうち一方の面１３ａと基体部１１の上面１１ａとの交線Ｌ１に垂直な線Ｌ２と、当該二つの面１３ａ，１３ｂのうち他方の面１３ｂと基体部１１の上面１１ａとの交線Ｌ３に垂直な線Ｌ４との交点を含む領域に位置することが好ましい。また、導電体層４１は素子５０が電気的に接続される素子接続部４３を有し、素子接続部４３は導電体層４１が配置されている二つの面１３ａ，１３ｄのうち一方の面１３ａと基体部１１の上面１１ａとの交線Ｌ５に垂直な線Ｌ６と、当該二つの面１３ａ，１３ｄのうち他方の面１３ｄと基体部１１の上面１１ａとの交線Ｌ７に垂直な線Ｌ８との交点を含む領域に位置することが好ましい。素子接続部４２，４３がこのような領域に位置することによって、素子５０から導電体層４０，４１に加えられる応力が分散しやすくなるため、導電体層４０，４１が剥がれ難くなる。また、導電体層４０，４１の剥がれは、素子接続部４２，４３を支点として素子接続部４２，４３の近傍で発生するため、導電体層４０，４１のうち最も強固な部分である上記領域に素子接続部４２，４３が設けられることによって、導電体層４０，４１が基板本体１０ｘからより剥がれ難くなる。   The conductor layer 40 has an element connection part 42 to which the element 50 is electrically connected. The element connection part 42 is connected to one of the two surfaces 13 a and 13 b on which the conductor layer 40 is disposed and the base 13. Intersection of a line L2 perpendicular to an intersection line L1 with the upper surface 11a of the portion 11 and a line L4 perpendicular to an intersection line L3 between the other surface 13b of the two surfaces 13a and 13b and the upper surface 11a of the base portion 11. Is preferably located in a region including The conductor layer 41 has an element connection portion 43 to which the element 50 is electrically connected. The element connection portion 43 is one of the two surfaces 13a and 13d on which the conductor layer 41 is disposed. A line L6 perpendicular to an intersection line L5 between the upper surface 11a of the base portion 11 and a line L8 perpendicular to an intersection line L7 between the other surface 13d of the two surfaces 13a and 13d and the upper surface 11a of the base portion 11. Is preferably located in a region including the intersection of. When the element connection portions 42 and 43 are located in such a region, the stress applied from the element 50 to the conductor layers 40 and 41 is easily dispersed, so that the conductor layers 40 and 41 are hardly peeled off. Moreover, since the peeling of the conductor layers 40 and 41 occurs near the element connection parts 42 and 43 with the element connection parts 42 and 43 as fulcrums, the above-described region, which is the strongest part of the conductor layers 40 and 41, is used. Since the element connection portions 42 and 43 are provided on the substrate 10, the conductor layers 40 and 41 are less likely to be peeled off from the substrate body 10x.

＜蓋体６０＞
蓋体６０は接着剤３０を介して素子搭載用基板１０に固定され、キャビティ１５を密封する部材である。蓋体６０の大きさ及び形状はキャビティ１５を密封できる大きさ及び形状であれば特に限定されない。このような蓋体６０は、例えばニッケル、鉄、銅等の金属や、セラミックス、シリコン、ガラス、樹脂等によって構成される。また、蓋体６０と素子搭載用基板１０とを強固に固定する観点からは、接着剤３０に接着する部位に接着剤を蓋体６０の素子搭載用基板１０側の面に塗布してもよい。 <Lid 60>
The lid 60 is a member that is fixed to the element mounting substrate 10 via the adhesive 30 and seals the cavity 15. The size and shape of the lid 60 are not particularly limited as long as the size and shape can seal the cavity 15. Such a lid 60 is made of, for example, a metal such as nickel, iron, or copper, ceramics, silicon, glass, resin, or the like. In addition, from the viewpoint of firmly fixing the lid 60 and the element mounting substrate 10, an adhesive may be applied to the surface of the lid 60 on the element mounting substrate 10 side at a portion to be bonded to the adhesive 30. .

蓋体６０を素子搭載用基板１０に固定する方法は接着剤３０の種類に応じて適宜選択される。例えば接着剤３０は熱可塑性材料からなる場合、接着剤３０を介して蓋体６０を素子搭載用基板１０に載せて接着剤３０が軟化する温度で加熱し、その後冷却することによって蓋体６０を素子搭載用基板１０に固定することができる。   The method for fixing the lid 60 to the element mounting substrate 10 is appropriately selected according to the type of the adhesive 30. For example, when the adhesive 30 is made of a thermoplastic material, the lid 60 is placed on the element mounting substrate 10 via the adhesive 30 and heated at a temperature at which the adhesive 30 softens, and then cooled to cool the lid 60. It can be fixed to the element mounting substrate 10.

以上説明したように、本実施形態の素子搭載用基板１０によれば導電体層４０，４１が固定される部分の面積を大きくし易くなるとともに、導電体層４０，４１が３次元的又は立体的に配置されることで、素子搭載用基板１０の面方向（素子搭載用基板１０の厚み方向に垂直な方向）の振動に対して導電体層４０，４１が剥がれ難くなる。よって、導電体層４０，４１に接続される素子５０から導電体層４０，４１が熱衝撃や振動等を加えられるとしても、導電体層４０，４１は基板本体１０ｘから剥がれ難い。従って、素子搭載用基板１０を備える電子部品１は従来よりも過酷な温度条件や振動条件下で使用される場合であっても耐久性が向上される。   As described above, according to the element mounting substrate 10 of the present embodiment, the area of the portion where the conductor layers 40 and 41 are fixed is easily increased, and the conductor layers 40 and 41 are three-dimensional or three-dimensional. By virtue of this arrangement, the conductor layers 40 and 41 are less likely to be peeled off by vibration in the surface direction of the element mounting substrate 10 (the direction perpendicular to the thickness direction of the element mounting substrate 10). Therefore, even if the conductor layers 40, 41 are subjected to thermal shock, vibration, or the like from the element 50 connected to the conductor layers 40, 41, the conductor layers 40, 41 are unlikely to peel off from the substrate body 10x. Therefore, the durability of the electronic component 1 including the element mounting board 10 is improved even when the electronic component 1 is used under severer temperature and vibration conditions than before.

なお、これまでの本発明の実施形態に係る説明では、導電体層４０，４１が枠体部１２の内周面１３を構成する複数の面のうち互いに隣り合う面に配置される形態を例示して説明したが、本発明は係る形態に限定されない。本発明の素子搭載用基板において、導電体層は基体部の上面と枠体部の内周面を構成する複数の面のうち少なくとも二つの面とに跨るように配置されていればよい。図７は他の実施形態に係る素子搭載用基板１０ａを概略的に示す平面図である。図７において素子搭載用基板１０と同様の構成には同符号を付している。素子搭載用基板１０ａは導電体層４０に代えて導電体層４０ａを備える点で素子搭載用基板１０と異なる。導電体層４０ａは基体部１１の上面１１ａと内周面１３に含まれる面のうち隣り合わない面１３ａ，１３ｃとに跨るように配置されている。このような形態であっても導電体層４０ａが固定される部分の面積を大きくすることができるとともに、導電体層４０ａが３次元的又は立体的に配置されるので、素子搭載用基板１０ａの面方向（素子搭載用基板１０ａの厚み方向に垂直な方向）の振動に対して導電体層４０ａが剥がれ難くなる。従って、導電体層４０ａを基板本体１０ｘに強固に固定させやすくなり、熱衝撃や振動等によって導電体層４０ａに応力が加わるとしても導電体層４０ａが基板本体１０ｘから剥がれ難い。   In the description according to the embodiment of the present invention, the form in which the conductor layers 40 and 41 are arranged on mutually adjacent surfaces among a plurality of surfaces constituting the inner peripheral surface 13 of the frame portion 12 is exemplified. However, the present invention is not limited to such an embodiment. In the element mounting substrate of the present invention, the conductor layer may be disposed so as to straddle the upper surface of the base portion and at least two of the plurality of surfaces constituting the inner peripheral surface of the frame portion. FIG. 7 is a plan view schematically showing an element mounting board 10a according to another embodiment. 7, the same components as those of the element mounting substrate 10 are denoted by the same reference numerals. The element mounting substrate 10a differs from the element mounting substrate 10 in that a conductor layer 40a is provided instead of the conductor layer 40. The conductor layer 40a is arranged so as to straddle the upper surface 11a of the base portion 11 and the non-adjacent surfaces 13a and 13c among the surfaces included in the inner peripheral surface 13. Even in such a form, the area of the portion where the conductor layer 40a is fixed can be increased, and the conductor layer 40a is three-dimensionally or three-dimensionally arranged. The conductor layer 40a is less likely to peel off in a plane direction (a direction perpendicular to the thickness direction of the element mounting substrate 10a). Therefore, the conductor layer 40a is easily fixed firmly to the substrate body 10x, and even if stress is applied to the conductor layer 40a due to thermal shock, vibration, or the like, the conductor layer 40a does not easily peel off from the substrate body 10x.

また、これまでの本発明の実施形態に係る説明では枠体部１２の内周の形状が四角形であり、内周面１３が四つの面から構成される形態を例示して説明したが、本発明は係る形態に限定されない。本発明の素子搭載用基板において、枠体部の内周面はより多くの面を有する形状であってもよく、導電体層は枠体部の内周面に含まれるこれらの面のうち少なくとも二つの面に跨るように配置されていればよい。   Also, in the description according to the embodiment of the present invention, the inner peripheral shape of the frame body portion 12 is a quadrangle, and the inner peripheral surface 13 is configured by four surfaces. The invention is not limited to such an embodiment. In the element mounting substrate of the present invention, the inner peripheral surface of the frame portion may have a shape having more surfaces, and the conductor layer is at least one of these surfaces included in the inner peripheral surface of the frame portion. What is necessary is just to arrange so that it may straddle two surfaces.

また、これまでの本発明の実施形態に係る説明では基体部１１の上面１１ａと枠体部１２の内周面１３のうち互いに隣り合う二つの面とで形成される角部に導電体層４０，４１が非配置である形態について説明したが、本発明は係る形態に限定されない。すなわち、基体部の上面と枠体部の内周面のうち互いに隣り合う二つの面とで形成される角部に導電体層が配置されてもよい。ただし、上述のように導電体層を基板本体からより剥がれ難くする観点からは、当該角部には導電体層が非配置であることが好ましい。   In the above description of the embodiment of the present invention, the conductor layer 40 is formed at a corner formed by the upper surface 11a of the base portion 11 and the two adjacent surfaces of the inner peripheral surface 13 of the frame portion 12. , 41 are not arranged, but the present invention is not limited to such an embodiment. That is, the conductor layer may be disposed at a corner formed by the upper surface of the base portion and two adjacent surfaces of the inner peripheral surface of the frame portion. However, from the viewpoint of making it difficult for the conductor layer to be peeled off from the substrate body as described above, it is preferable that the conductor layer is not disposed at the corner.

以上説明したように、本発明によれば素子に電気的に接続される導電体層が基板本体から剥がれ難い素子搭載用基板が提供され、水晶振動子等の素子を素子搭載用基板に搭載して用いられる電子部品の分野で利用することができる。   As described above, according to the present invention, there is provided an element mounting substrate on which a conductive layer electrically connected to an element is hardly peeled off from the substrate body, and an element such as a quartz oscillator is mounted on the element mounting substrate. It can be used in the field of electronic components used.

１・・・電子部品
１０・・・素子搭載用基板
１０ｘ・・・基板本体
１１・・・基体部
１１ａ・・・上面
１２・・・枠体部
１２ａ・・・天面
１３・・・内周面
１３ａ，１３ｂ，１３ｃ，１３ｄ・・・面
１５・・・キャビティ
２０・・・絶縁層
３０・・・接着剤
４０，４１・・・導電体層
４２，４３・・・素子接続部
５０・・・素子
６０・・・蓋体 DESCRIPTION OF SYMBOLS 1 ... Electronic component 10 ... Element mounting board 10x ... Board body 11 ... Base part 11a ... Top surface 12 ... Frame body part 12a ... Top surface 13 ... Inner circumference Surfaces 13a, 13b, 13c, 13d Surface 15 Cavity 20 Insulating layer 30 Adhesives 40 and 41 Conductor layers 42 and 43 Element connection portion 50・ Element 60 ・ ・ ・ Lid

Claims (5)

基体部と前記基体部の一方の面に設けられる枠状の枠体部とを有する基板本体と、
前記基板本体上に配置され、搭載される素子に電気的に接続される導電体層と、
を備え、
前記枠体部の内周面は前記基体部から延在する複数の面からなり、
前記導電体層は、前記基体部の前記一方の面のうち前記枠体部で囲われる部分である上面と、前記複数の面のうち少なくとも二つの面とに跨るように配置され、
前記少なくとも二つの面は、互いに隣り合わない二つの面を含む
ことを特徴とする素子搭載用基板。 A substrate body having a base portion and a frame-shaped frame portion provided on one surface of the base portion;
A conductor layer disposed on the substrate body and electrically connected to a mounted element,
With
The inner peripheral surface of the frame portion includes a plurality of surfaces extending from the base portion,
The conductor layer is disposed so as to straddle at least one of the plurality of surfaces, the upper surface being a portion surrounded by the frame portion of the one surface of the base portion ,
The element mounting substrate, wherein the at least two surfaces include two surfaces that are not adjacent to each other . 前記少なくとも二つの面は、三つ以上の面であり、
前記三つ以上の面は、前記互いに隣り合わない二つの面のうち少なくとも一方と隣り合う面を含む
ことを特徴とする請求項１に記載の素子搭載用基板。 The at least two surfaces are three or more surfaces,
Wherein three or more surfaces, device mounting board of claim 1, wherein <br/> includes at least one and next if Cormorants surface of the two surfaces the not adjacent to each other. 前記基体部の前記上面と前記複数の面のうち隣り合う二つの面とで形成される角部は、前記導電体層が非配置とされる
ことを特徴とする請求項２に記載の素子搭載用基板。 3. The device mounting device according to claim 2, wherein the conductor layer is not disposed at a corner formed by the upper surface of the base portion and two adjacent surfaces of the plurality of surfaces. Substrate. 前記導電体層は素子が電気的に接続される素子接続部を有し、
前記素子接続部は、前記二つの面のうち一方の面と前記基体部の前記上面との交線に垂直な線と、前記二つの面のうち他方の面と前記基体部の前記上面との交線に垂直な線と、の交点を含む領域に位置する
ことを特徴とする請求項２または３に記載の素子搭載用基板。 The conductor layer has an element connection portion where the element is electrically connected,
The element connection portion is a line perpendicular to an intersection line between one of the two surfaces and the upper surface of the base portion, and a line perpendicular to an intersection line between the two surfaces and the upper surface of the base portion. 4. The element mounting board according to claim 2, wherein the element mounting board is located in a region including an intersection of a line perpendicular to the intersection line. 請求項１から４のいずれか１項に記載の素子搭載用基板と、
前記導電体層に電気的に接続される素子と、
を備える
ことを特徴とする電子部品。 An element mounting substrate according to any one of claims 1 to 4,
An element electrically connected to the conductor layer,
An electronic component comprising:
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