JP6666320B2 - 樹脂成型基板及びコンデンサの実装構造 - Google Patents
樹脂成型基板及びコンデンサの実装構造 Download PDFInfo
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- JP6666320B2 JP6666320B2 JP2017223464A JP2017223464A JP6666320B2 JP 6666320 B2 JP6666320 B2 JP 6666320B2 JP 2017223464 A JP2017223464 A JP 2017223464A JP 2017223464 A JP2017223464 A JP 2017223464A JP 6666320 B2 JP6666320 B2 JP 6666320B2
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- 239000011347 resin Substances 0.000 title claims description 89
- 229920005989 resin Polymers 0.000 title claims description 89
- 239000003990 capacitor Substances 0.000 title claims description 88
- 239000000758 substrate Substances 0.000 claims description 83
- 238000003780 insertion Methods 0.000 claims description 46
- 230000037431 insertion Effects 0.000 claims description 46
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 41
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
[第1実施形態]
図1は、本発明の第1実施形態に係る樹脂成型基板を用いたコンデンサの実装構造を示す図である。図2は、本発明の第1実施形態に係る樹脂成型基板の部分平面図である。
本発明における樹脂成型基板1は、図2に示すように、コンデンサCをはんだSによって実装可能な基板である。樹脂成型基板1は、コンデンサCの一対のリード端子C2、C2を挿通させる一対の端子挿通穴2、2と、樹脂成型基板1の裏面1bに、各端子挿通穴2、2に対応するランド3、3とを有する。
図4は、本発明の第2実施形態に係る樹脂成型基板を用いたコンデンサの実装構造を示す図である。図5は、本発明の第2実施形態に係る樹脂成型基板の部分平面図である。図1〜図3と同一符号の部位は同一構成の部位であるため、それらの説明は上記説明を援用し、ここで説明は省略する。以下では、第1実施形態と相違する構成について説明する。
第2実施形態に係る樹脂成型基板1は、一対の端子挿通穴2、2に対して1つの突起部4だけが設けられている。この突起部4は、端子挿通穴2、2の間に配置され、端子挿通穴2、2の並び方向(図4、図5の左右方向)に対して直交する方向(図5の上下方向)に沿って延びている。
図6は、本発明の第3実施形態に係る樹脂成型基板を用いたコンデンサの実装構造を示す図である。図7は、本発明の第3実施形態に係る樹脂成型基板の部分平面図である。図1〜図3と同一符号の部位は同一構成の部位であるため、それらの説明は上記説明を援用し、ここでの説明は省略する。以下では、第1実施形態及び第2実施形態と相違する構成について説明する。
第3実施形態に係る樹脂成型基板1は、第1実施形態と同様に一対の突起部4、4を有しているが、突起部4、4は、それぞれ端子挿通穴2、2に重なるように配置されており、端子挿通穴2、2が突起部4、4を貫通している。突起部4、4は、端子挿通穴2、2の並び方向(図6、図7の左右方向)に対して直交する方向(図7の上下方向)に沿って平行に延びている。
1a 表面
2 端子挿通穴
4 突起部
C コンデンサ
C1 底部
C2 リード端子
C3 周縁部
S はんだ
Claims (3)
- 底部に一対のリード端子を有する円筒形状のコンデンサをはんだによって直立状態で実装する樹脂成型基板であって、
前記コンデンサの前記リード端子を挿通させる一対の端子挿通穴と、
前記リード端子が前記端子挿通穴に挿通された前記コンデンサの前記底部側と当接して、前記コンデンサを基板の表面から離隔させる1つの突起部又は一対の突起部と、を有し、
前記突起部は、基板の表面に一体に成形された一体成形部であり、
1つの前記突起部は、一対の前記端子挿通穴のうちの一方に重なるように配置され、又は、一対の前記突起部は、一対の前記端子挿通穴にそれぞれ個別に重なるように配置され、
前記突起部と重なる前記端子挿通穴は、前記突起部を貫通しており、
前記コンデンサと前記樹脂成型基板との間に、外部から目視可能な空間が形成されている、樹脂成型基板。 - 前記突起部は、前記コンデンサの前記底部側の周縁部と当接するように配置されている、請求項1に記載の樹脂成型基板。
- 底部に一対のリード端子を有する円筒形状のコンデンサが樹脂成型基板にはんだによって直立状態で実装されたコンデンサの実装構造であって、
前記樹脂成型基板は、請求項1又は2に記載の樹脂成型基板であり、
前記コンデンサは、前記リード端子が前記樹脂成型基板の前記端子挿通穴に挿通され、前記コンデンサの前記底部側が、前記樹脂成型基板の少なくとも1つの前記突起部と当接することにより、前記樹脂成型基板の表面から離隔して実装されている、コンデンサの実装構造。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017223464A JP6666320B2 (ja) | 2017-11-21 | 2017-11-21 | 樹脂成型基板及びコンデンサの実装構造 |
US16/136,425 US20190157002A1 (en) | 2017-11-21 | 2018-09-20 | Resin molded substrate and mounting structure for capacitor |
DE102018219340.1A DE102018219340A1 (de) | 2017-11-21 | 2018-11-13 | Aus harz geformtes substrat und montagestruktur für einen kondensator |
CN201821899961.0U CN209266200U (zh) | 2017-11-21 | 2018-11-16 | 树脂成型基板以及电容器的安装构造 |
CN201811369521.9A CN109817450B (zh) | 2017-11-21 | 2018-11-16 | 树脂成型基板以及电容器的安装构造 |
US16/831,641 US10984949B2 (en) | 2017-11-21 | 2020-03-26 | Resin molded substrate and mounting structure for capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017223464A JP6666320B2 (ja) | 2017-11-21 | 2017-11-21 | 樹脂成型基板及びコンデンサの実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019096687A JP2019096687A (ja) | 2019-06-20 |
JP6666320B2 true JP6666320B2 (ja) | 2020-03-13 |
Family
ID=66336651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017223464A Active JP6666320B2 (ja) | 2017-11-21 | 2017-11-21 | 樹脂成型基板及びコンデンサの実装構造 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20190157002A1 (ja) |
JP (1) | JP6666320B2 (ja) |
CN (2) | CN109817450B (ja) |
DE (1) | DE102018219340A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020150566A1 (en) | 2019-01-19 | 2020-07-23 | Corning Research & Development Corporation | Unitized fiber optic cables |
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JPS603688B2 (ja) | 1976-04-12 | 1985-01-30 | 株式会社リコー | 磁気記録バイアス回路 |
JPS53109060U (ja) | 1977-02-08 | 1978-09-01 | ||
JPS53109060A (en) | 1977-03-04 | 1978-09-22 | Hitachi Ltd | Electromagnetic clutch fitting structure |
CA1085066A (en) | 1978-04-20 | 1980-09-02 | Colin J. Allan | Self-powered neutron and gamma-ray flux detector |
JPS613688A (ja) | 1984-06-19 | 1986-01-09 | Nippon Kokan Kk <Nkk> | 絶縁皮膜を表層に有する金属板の抵抗溶接法 |
JPS6118995A (ja) | 1984-07-05 | 1986-01-27 | カシオ計算機株式会社 | 演奏システム |
JPS6228472U (ja) * | 1985-08-05 | 1987-02-20 | ||
JPH01171024U (ja) * | 1988-05-20 | 1989-12-04 | ||
JPH0735411Y2 (ja) * | 1990-10-15 | 1995-08-09 | 北陸電気工業株式会社 | 回路基板 |
JPH0513892A (ja) * | 1991-06-28 | 1993-01-22 | Hitachi Ltd | 配線回路成形基板 |
JPH08321669A (ja) * | 1995-05-26 | 1996-12-03 | Nemic Lambda Kk | 電子部品の実装構造 |
WO1997001263A1 (fr) * | 1995-06-20 | 1997-01-09 | Matsushita Electric Industrial Co., Ltd. | Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication |
US5880926A (en) * | 1996-04-19 | 1999-03-09 | Nichicon Corporation | Electronic device with mounting structure |
US6012223A (en) * | 1998-07-31 | 2000-01-11 | Delco Electronics Corp. | Process for structurally securing stick-leaded components to a circuit board |
JP2000196215A (ja) * | 1998-12-28 | 2000-07-14 | Jeco Co Ltd | プリント配線板 |
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KR101208823B1 (ko) * | 2004-03-31 | 2012-12-06 | 미츠비시 덴센 고교 가부시키가이샤 | 회로기판 및 이 회로기판을 이용한 조인트 박스 |
JP2005302929A (ja) * | 2004-04-09 | 2005-10-27 | Matsushita Electric Ind Co Ltd | ガス抜きプリント基板 |
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JP2011061125A (ja) * | 2009-09-14 | 2011-03-24 | Hitachi Automotive Systems Ltd | プリント基板接続用の端子部材を備えた制御装置、および、プリント基板へのリード端子の半田付け方法 |
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JP2015179710A (ja) * | 2014-03-19 | 2015-10-08 | パナソニックIpマネジメント株式会社 | 電子部品実装方法及び電子部品実装基板 |
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JP6118995B2 (ja) | 2015-10-13 | 2017-04-26 | パナソニックIpマネジメント株式会社 | キャパシタモジュール |
-
2017
- 2017-11-21 JP JP2017223464A patent/JP6666320B2/ja active Active
-
2018
- 2018-09-20 US US16/136,425 patent/US20190157002A1/en not_active Abandoned
- 2018-11-13 DE DE102018219340.1A patent/DE102018219340A1/de active Pending
- 2018-11-16 CN CN201811369521.9A patent/CN109817450B/zh active Active
- 2018-11-16 CN CN201821899961.0U patent/CN209266200U/zh active Active
-
2020
- 2020-03-26 US US16/831,641 patent/US10984949B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10984949B2 (en) | 2021-04-20 |
CN209266200U (zh) | 2019-08-16 |
DE102018219340A1 (de) | 2019-05-23 |
CN109817450A (zh) | 2019-05-28 |
CN109817450B (zh) | 2021-04-06 |
US20190157002A1 (en) | 2019-05-23 |
JP2019096687A (ja) | 2019-06-20 |
US20200227206A1 (en) | 2020-07-16 |
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