JP6663504B2 - 通信ノード - Google Patents
通信ノード Download PDFInfo
- Publication number
- JP6663504B2 JP6663504B2 JP2018545289A JP2018545289A JP6663504B2 JP 6663504 B2 JP6663504 B2 JP 6663504B2 JP 2018545289 A JP2018545289 A JP 2018545289A JP 2018545289 A JP2018545289 A JP 2018545289A JP 6663504 B2 JP6663504 B2 JP 6663504B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- housing
- communication node
- module
- poe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000004891 communication Methods 0.000 title claims description 53
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000013011 mating Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/13—Patch panels for monitoring, interconnecting or testing circuits, e.g. patch bay, patch field or jack field; Patching modules
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/04—Frames or mounting racks for selector switches; Accessories therefor, e.g. frame cover
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/18—Electrical details
- H04Q1/20—Testing circuits or apparatus; Circuits or apparatus for detecting, indicating, or signalling faults or troubles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/02—Details
- H04L12/10—Current supply arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/03—Power distribution arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10333—Individual female type metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Data Exchanges In Wide-Area Networks (AREA)
Description
本出願は、2016年3月1日に出願された米国仮出願第62/301,926号の優先権の利益を主張するものであり、これはその全体が参照により本明細書に組み込まれる。
Claims (9)
- 通信ノードであって、
複数のポートを有する第1の面を有するケースと、
前記第1の面の近傍に取り付けられたカードモジュールと、を備え、該カードモジュールが、
回路基板であって、前部縁部及び後部縁部、並びに前記回路基板の内部に設けられた複数のハウジングスロットであって、前記回路基板の前記前部縁部に位置付けされた複数のハウジングスロットを含む回路基板と、
2つのハウジングスロットの間の前記回路基板上に取り付けられたチクレットであって、複数の端子を有し、前記複数の端子の各々の端子が、前記回路基板に電気的に接続されたテールを含む、チクレットと、
複数のスロット壁部を有するハウジングを含むポートモジュールであって、前記スロット壁部が、前記ハウジングスロット内に位置付けされ、前記ハウジングが、前記複数の端子と整列したポート凹部を含む、ポートモジュールと、
前記回路基板上に取り付けられたトランスボックスであって、前記ポート凹部に関連付けられ、前記トランスボックスのケーブル側とチップ側との間に磁気結合を提供するように構成され、前記後部縁部と前記ハウジングとの間に位置付けされている、トランスボックスと、を含む、通信ノード。 - 前記回路基板上に取り付けられたパワーオーバーイーサネット(POE)カードをさらに備え、該POEカードが、POE電力を供給するために前記ケーブル側上に設けられた中央タップに電力を注入するように構成されている、請求項1に記載の通信ノード。
- 前記POEカードが、前記トランスボックスと前記ハウジングとの間に位置付けされている、請求項2に記載の通信ノード。
- 前記POEカードが、垂直に位置付けされている、請求項3に記載の通信ノード。
- 前記スロット壁部が、前記チクレットと係合する取り付けチャネルを含み、前記係合が、前記チクレットに前記ハウジングを固定するのを助ける、請求項1に記載の通信ノード。
- 前記チクレットが、ノッチを含み、前記取り付けチャネルが、前記ノッチと圧入方式で係合するリブを含む、請求項4に記載の通信ノード。
- 前記ハウジングが、前記ポート凹部内に前記端子を位置付けするように結合するコム及び端子壁部を含む、請求項1に記載の通信ノード。
- 前記ポートモジュールが、前記ハウジングに取り付けられたシールドを含む、請求項1に記載の通信ノード。
- 前記テールが、前記回路基板にはんだ付けされている、請求項1に記載の通信ノード。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662301926P | 2016-03-01 | 2016-03-01 | |
US62/301,926 | 2016-03-01 | ||
PCT/US2017/020189 WO2017151761A1 (en) | 2016-03-01 | 2017-03-01 | Communication node |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019516262A JP2019516262A (ja) | 2019-06-13 |
JP6663504B2 true JP6663504B2 (ja) | 2020-03-11 |
Family
ID=59744442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018545289A Active JP6663504B2 (ja) | 2016-03-01 | 2017-03-01 | 通信ノード |
Country Status (6)
Country | Link |
---|---|
US (2) | US11109120B2 (ja) |
EP (1) | EP3424227B1 (ja) |
JP (1) | JP6663504B2 (ja) |
KR (1) | KR102174018B1 (ja) |
CN (1) | CN109076266B (ja) |
WO (1) | WO2017151761A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7027305B2 (ja) | 2015-08-25 | 2022-03-01 | モレックス エルエルシー | デジタル平面インターフェースを有する通信ノード |
WO2017151761A1 (en) | 2016-03-01 | 2017-09-08 | Molex, Llc | Communication node |
CN107911306A (zh) * | 2017-12-20 | 2018-04-13 | 吴永 | 一种便于固定的收放网线的路由器 |
CN114500124A (zh) * | 2020-11-12 | 2022-05-13 | 华为技术有限公司 | PoE供电设备、PoE供电***和接口部件 |
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-
2017
- 2017-03-01 WO PCT/US2017/020189 patent/WO2017151761A1/en active Application Filing
- 2017-03-01 CN CN201780027291.5A patent/CN109076266B/zh active Active
- 2017-03-01 US US16/080,478 patent/US11109120B2/en active Active
- 2017-03-01 JP JP2018545289A patent/JP6663504B2/ja active Active
- 2017-03-01 EP EP17760713.2A patent/EP3424227B1/en active Active
- 2017-03-01 KR KR1020187027981A patent/KR102174018B1/ko active IP Right Grant
-
2021
- 2021-07-27 US US17/385,963 patent/US11533547B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3424227A1 (en) | 2019-01-09 |
EP3424227B1 (en) | 2022-04-13 |
CN109076266B (zh) | 2021-06-25 |
WO2017151761A1 (en) | 2017-09-08 |
US11533547B2 (en) | 2022-12-20 |
KR20180110211A (ko) | 2018-10-08 |
US20190069048A1 (en) | 2019-02-28 |
US11109120B2 (en) | 2021-08-31 |
JP2019516262A (ja) | 2019-06-13 |
CN109076266A (zh) | 2018-12-21 |
US20210360335A1 (en) | 2021-11-18 |
EP3424227A4 (en) | 2019-10-23 |
KR102174018B1 (ko) | 2020-11-04 |
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