JP6652367B2 - Electronic component storage package, electronic device and electronic module - Google Patents

Electronic component storage package, electronic device and electronic module Download PDF

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JP6652367B2
JP6652367B2 JP2015210925A JP2015210925A JP6652367B2 JP 6652367 B2 JP6652367 B2 JP 6652367B2 JP 2015210925 A JP2015210925 A JP 2015210925A JP 2015210925 A JP2015210925 A JP 2015210925A JP 6652367 B2 JP6652367 B2 JP 6652367B2
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electronic component
connection conductor
frame
electronic
insulating film
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JP2017084941A (en
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拓男 木佐木
拓男 木佐木
鈴木　真樹
真樹 鈴木
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Kyocera Corp
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Description

本発明は、圧電振動素子等の電子部品を気密に収容するための電子部品収納用パッケージ、電子装置および電子モジュールに関するものである。   The present invention relates to an electronic component storage package, an electronic device, and an electronic module for hermetically storing electronic components such as a piezoelectric vibration element.

従来、圧電振動素子または半導体素子等の電子部品を搭載するための電子部品収納用パッケージとして、一般に、セラミック焼結体等からなる絶縁基板に電子部品が収容される搭載部が設けられたものが用いられている。絶縁基板の上面には、搭載部を塞ぐように蓋体が接合される。このような電子部品収納用パッケージは、上面に電子部品の搭載部を有する平板状の基部およびこの基部の上面に搭載部を取り囲んで積層された枠部を有する絶縁基板と、搭載部から基部の下面等にかけて形成された配線導体とにより基本的に構成されている。   2. Description of the Related Art Conventionally, as an electronic component storage package for mounting an electronic component such as a piezoelectric vibrating element or a semiconductor element, a package in which an electronic component is mounted on an insulating substrate made of a ceramic sintered body or the like is generally provided. Used. A lid is joined to the upper surface of the insulating substrate so as to close the mounting portion. Such an electronic component storage package includes a flat base having an electronic component mounting portion on the upper surface, an insulating substrate having a frame portion stacked on the upper surface of the base portion surrounding the mounting portion, and a base portion from the mounting portion to the base portion. It is basically composed of a wiring conductor formed over the lower surface and the like.

配線導体のうち、搭載部に設けられたものは電子部品が接続される接続導体として機能し、基部の下面（絶縁基板の下面）に設けられたものは、外部接続用の導体（外部接続導体）として機能する。そして、搭載部に電子部品が搭載され、電子部品の各電極が接続導体に電気的に接続された後、搭載部が蓋体等で封止されて電子装置が製作される。   Of the wiring conductors, those provided on the mounting portion function as connection conductors to which electronic components are connected, and those provided on the lower surface of the base (the lower surface of the insulating substrate) are conductors for external connection (external connection conductors). ). Then, the electronic component is mounted on the mounting portion, and after each electrode of the electronic component is electrically connected to the connection conductor, the mounting portion is sealed with a lid or the like to manufacture an electronic device.

電子部品が例えば圧電振動素子である場合、搭載部の上面と電子部品の下面との間に適度な隙間を形成する必要がある。これは、圧電振動素子が振動するために、圧電振動素子が導電性接着剤等の接合材により接続導体に片持ちで搭載されるためである。   When the electronic component is, for example, a piezoelectric vibrating element, it is necessary to form an appropriate gap between the upper surface of the mounting portion and the lower surface of the electronic component. This is because the piezoelectric vibrating element vibrates, so that the piezoelectric vibrating element is cantilevered on the connection conductor by a bonding material such as a conductive adhesive.

このように、搭載部の上面と電子部品の下面との間に適度な隙間を形成する方法として、搭載部に導体を複数回印刷することによりメタライズバンプを形成して接続導体を形成することが行なわれている。   As described above, as a method of forming an appropriate gap between the upper surface of the mounting portion and the lower surface of the electronic component, a connection conductor is formed by forming a metallized bump by printing a conductor on the mounting portion a plurality of times. Is being done.

特開平10−135762号公報JP-A-10-135762

しかしながら、近年、電子部品収納用パッケージは、ますます小型化、低背化が図られてきている。これに伴い、搭載部に形成される接続導体の厚みおよび形成位置等の高い寸法精度が求められている。従来のように、導体を複数回印刷することにより接続導体を形成する方法では、印刷時のにじみや位置ずれが発生することがあり、接続導体の高い寸法精度を得られないという問題が顕著になっている。接続導体の寸法精度が低いと、近接した他の配線導体との短絡等が発生する問題があった。   However, in recent years, electronic component storage packages have been increasingly reduced in size and height. Along with this, high dimensional accuracy such as the thickness and the formation position of the connection conductor formed on the mounting portion is required. In the method of forming the connection conductor by printing the conductor a plurality of times as in the past, blurring and misalignment may occur during printing, and the problem that high dimensional accuracy of the connection conductor cannot be obtained is remarkable. Has become. When the dimensional accuracy of the connection conductor is low, there is a problem that a short circuit or the like with another adjacent wiring conductor occurs.

本発明の１つの態様の電子部品収納用パッケージは、電子部品の搭載部を備えた第１主面を有する基部と、前記搭載部に設けられ、該搭載部から突出した突出部と、前記基部上に前記搭載部を囲むように設けられ、第２主面を有する枠部と、該枠部の前記第２主面に設けられた枠状メタライズ層と、電子部品が接続される複数の接続導体とを含んでおり、該複数の接続導体のそれぞれは、前記突出部を覆うように、該突出部の上面から側面および前記第１主面にかけて設けられており、前記突出部の上面の周縁部と前記第１主面との間において絶縁膜で覆われており、前記接続導体の下面から前記突出部の上面および内部にかけて貫通導体が設けられていることを特徴とする。
An electronic component storage package according to one aspect of the present invention includes a base having a first main surface including a mounting portion for an electronic component, a protrusion provided on the mounting portion, and protruding from the mounting portion; A frame portion provided on the top to surround the mounting portion and having a second main surface, a frame-shaped metallization layer provided on the second main surface of the frame portion, and a plurality of connections for connecting electronic components A plurality of connection conductors, each of the plurality of connection conductors being provided from an upper surface of the protrusion to a side surface and the first main surface so as to cover the protrusion, and a peripheral edge of an upper surface of the protrusion. A portion between the portion and the first main surface is covered with an insulating film, and a through conductor is provided from the lower surface of the connection conductor to the upper surface and the inside of the protrusion .

本発明の１つの態様の電子装置は、上記の電子部品収納用パッケージと、該電子部品収納用パッケージに搭載された電子部品を有していることを特徴とする。   An electronic device according to one embodiment of the present invention includes the electronic component storage package described above and an electronic component mounted on the electronic component storage package.

本発明の１つの態様の電子モジュールは、上記の電子装置と、該電子装置が接続されたモジュール用基板とを有していることを特徴とする。   An electronic module according to one embodiment of the present invention includes the electronic device described above and a module substrate to which the electronic device is connected.

本発明の１つの態様の電子部品収納用パッケージによれば、電子部品の搭載部を備えた第１主面を有する基部と、搭載部に設けられ、搭載部から突出した突出部と、基部上に搭載部を囲むように設けられ、第２主面を有する枠部と、枠部の第２主面に設けられた枠状メタライズ層と、電子部品が接続される複数の接続導体とを含んでおり、複数の接続導体のそれぞれは、突出部を覆うように、突出部の上面から側面および第１主面にかけて設けられており、突出部の上面の周縁部と前記第１主面との間において絶縁膜で覆われており、接続導体の下面から突出部の上面および内部にかけて貫通導体が設けられていることから、例えば電子部品を接合する際に接合材が流れた場合に、枠状メタライズ等の他の配線導体との短絡を抑制できるとともに、電子部品の実装信頼性に優れた電子部品収納用パッケージを実現できる。 According to the electronic component storage package of one aspect of the present invention, a base having a first main surface including a mounting portion for an electronic component, a projection provided on the mounting portion and projecting from the mounting portion, A frame portion provided to surround the mounting portion and having a second main surface, a frame-shaped metallization layer provided on the second main surface of the frame portion, and a plurality of connection conductors to which electronic components are connected. Each of the plurality of connection conductors is provided from the upper surface of the protruding portion to the side surface and the first main surface so as to cover the protruding portion, and is provided between the peripheral portion of the upper surface of the protruding portion and the first main surface. Since the through conductor is provided from the lower surface of the connection conductor to the upper surface and the inside of the protruding portion , for example, when the joining material flows when joining the electronic components, the frame shape is formed. Short circuit with other wiring conductors such as metallization can be suppressed. A, it can be realized an electronic component electronic component storing package excellent mounting reliability.

本発明の１つの態様の電子装置によれば、上記の電子部品収納用パッケージを用いることにより、電子部品の実装工程における短絡が抑制された、動作信頼性の高い電子装置を実現できる。   According to the electronic device of one embodiment of the present invention, by using the electronic component housing package, it is possible to realize an electronic device with high operation reliability in which a short circuit in the electronic component mounting process is suppressed.

本発明の１つの態様の電子モジュールによれば、上記の電子装置を用いることにより、搭載部に搭載された電子部品に対する接続信頼性が高められ、動作信頼性に優れた電子モジュールを実現できる。   According to the electronic module of one embodiment of the present invention, by using the above electronic device, the connection reliability with respect to the electronic component mounted on the mounting portion is improved, and an electronic module with excellent operation reliability can be realized.

（ａ）は本発明の実施形態の電子部品収納用パッケージを示す上面透視図であり、（ｂ）は（ａ）のＸ−Ｘ’線における断面透視図である。1A is a top perspective view showing an electronic component housing package according to an embodiment of the present invention, and FIG. 2B is a sectional perspective view taken along line X-X ′ in FIG. 本発明の実施形態の電子部品収納用パッケージの要部を示す断面透視図である。It is a sectional perspective view showing an important section of an electronic parts storage package of an embodiment of the present invention. 本発明の実施形態の電子部品収納用パッケージの他の例を示す要部断面透視図である。It is principal part sectional perspective drawing which shows the other example of the electronic component storage package of embodiment of this invention. 本発明の実施形態の電子部品収納用パッケージの他の例を示す要部断面透視図である。It is principal part sectional perspective drawing which shows the other example of the electronic component storage package of embodiment of this invention. 本発明の実施形態の電子部品収納用パッケージの他の例を示す要部断面透視図である。It is principal part sectional perspective drawing which shows the other example of the electronic component storage package of embodiment of this invention. 本発明の実施形態の電子部品収納用パッケージの他の例を示す要部断面透視図である。It is principal part sectional perspective drawing which shows the other example of the electronic component storage package of embodiment of this invention.

本発明の電子部品収納用パッケージ等について、添付の図面を参照しつつ説明する。図１（ａ）は本発明の電子部品収納用パッケージ100の実施の形態の一例を示す上面透視図
であり、図１（ｂ）は図１（ａ）のＸ−Ｘ’線における断面透視図である。 The electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top perspective view showing an example of an embodiment of an electronic component housing package 100 of the present invention, and FIG. 1B is a sectional perspective view taken along line XX ′ in FIG. 1A. It is.

図１において、電子部品収納用パッケージ100は、外部回路基板（図示せず）への実装
面となる第１主面102、および封止面となる第２主面を有しており、絶縁基板101に搭載部104が設けられている。搭載部104には圧電振動素子等の電子部品110が搭載される。絶縁
基板101は、互いに積層された枠部105および基部106を有している。絶縁基板101の側面には切欠き108が設けられており、この切欠き108内には側面導体109が配置されている。 In FIG. 1, an electronic component storage package 100 has a first main surface 102 serving as a mounting surface on an external circuit board (not shown) and a second main surface serving as a sealing surface. A mounting unit 104 is provided on 101. An electronic component 110 such as a piezoelectric vibration element is mounted on the mounting section 104. The insulating substrate 101 has a frame 105 and a base 106 that are stacked on each other. A cutout 108 is provided on a side surface of the insulating substrate 101, and a side conductor 109 is arranged in the cutout 108.

そして、側面導体109と直接に接続された外部接続導体107が絶縁基板101の下面に設け
られている。また、この例の配線基板では、枠部105の上面に設けられた枠状メタライズ
層113、搭載部104内に位置し、電子部品110が接続される接続導体111をさらに有している。この電子部品収納用パッケージ100について、蓋体115が銀ろう等の封止材（図示せず）によって絶縁基板101上に接合されて、電子部品110が気密封止される。 An external connection conductor 107 directly connected to the side conductor 109 is provided on the lower surface of the insulating substrate 101. Further, the wiring board of this example further includes a frame-shaped metallized layer 113 provided on the upper surface of the frame portion 105, and a connection conductor 111 located in the mounting portion 104 and connected to the electronic component 110. With respect to the electronic component storage package 100, the lid 115 is joined onto the insulating substrate 101 with a sealing material (not shown) such as silver braze, and the electronic component 110 is hermetically sealed.

なお、この実施の形態において、絶縁基板101は、厚み方向の断面透視で凹型の搭載部104を有している。この電子部品収納用パッケージ100に圧電振動素子等の電子部品110が気密封止されて電子装置120が形成される。搭載部104を封止する蓋体115は、図１において
は見やすくするために透視している。 In this embodiment, the insulating substrate 101 has a mounting portion 104 that is concave in cross section in the thickness direction. An electronic component 110 such as a piezoelectric vibrating element is hermetically sealed in the electronic component storage package 100 to form an electronic device 120. The lid 115 that seals the mounting portion 104 is transparent in FIG. 1 for easy viewing.

絶縁基板101は、平板状の基部106上に、枠部105が積層されて形成されている。また、
平面視において、枠部105が基部106の上面の搭載部104を取り囲んでいる。この枠部105の内側面と搭載部104の内側において露出する基部106とによって、電子部品110を搭載する
ための凹型の搭載部104が設けられている。 The insulating substrate 101 is formed by laminating a frame 105 on a flat base 106. Also,
In a plan view, the frame portion 105 surrounds the mounting portion 104 on the upper surface of the base portion 106. A concave mounting portion 104 for mounting the electronic component 110 is provided by the inner surface of the frame portion 105 and the base portion exposed inside the mounting portion 104.

枠部105および基部106は、例えば酸化アルミニウム質焼結体，窒化アルミニウム焼結体，ムライト質焼結体またはガラス−セラミック焼結体等のセラミック材料からなる。絶縁基板101は、例えば全体の外形が平面視で一辺の長さが1.6〜10ｍｍ程度の長方形状であり、厚みが0.3〜２ｍｍ程度の板状であり、その上面に凹型の搭載部104を有している。   The frame 105 and the base 106 are made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The insulating substrate 101 has, for example, a rectangular shape with an overall length of about 1.6 to 10 mm on a side in plan view, a plate shape with a thickness of about 0.3 to 2 mm, and has a concave mounting portion 104 on its upper surface. are doing.

絶縁基板101は、枠部105および基部106が酸化アルミニウム質焼結体からなる場合であ
れば、酸化アルミニウム，酸化珪素，酸化マグネシウムおよび酸化カルシウム等の原料粉末に適当な有機バインダや溶剤，可塑剤等を添加混合して泥漿状にするとともに、これを例えばドクターブレード法やロールカレンダー法等のシート成形法によりシート状となすことにより複数枚のセラミックグリーンシートを得て、次に一部のセラミックグリーンシートに適当な打ち抜き加工を施して枠状に成形するとともに、枠状に成形していない平板状のセラミックグリーンシートの上面にそれぞれ枠状のセラミックグリーンシートが位置するように上下に積層し、その積層体を高温で焼成することにより製作することができる。 When the frame 105 and the base 106 are made of an aluminum oxide sintered body, the insulating substrate 101 may be made of an organic binder, a solvent, a plasticizer, or the like suitable for a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. Are mixed and formed into a slurry, and this is formed into a sheet by a sheet forming method such as a doctor blade method or a roll calender method to obtain a plurality of ceramic green sheets. The green sheet is subjected to an appropriate punching process and molded into a frame shape, and stacked up and down so that the frame-shaped ceramic green sheet is located on the upper surface of the flat ceramic green sheet not formed in the frame shape, The laminate can be manufactured by firing at a high temperature.

絶縁基板101は、例えば、それぞれが個片の絶縁基板101になる基板領域が配列された母基板（図示せず）として作製された後に個片に分割されて製作されている。母基板は、互いに積層された、基部106となる複数の領域を有する平板状の絶縁層（図示せず）と、そ
れぞれ枠部105となる複数の領域を有する（複数の開口部が配列された）絶縁層（図示せ
ず）とを有している。 The insulating substrate 101 is manufactured, for example, after being manufactured as a mother substrate (not shown) in which substrate regions that become the individual insulating substrates 101 are arranged, and then divided into individual pieces. The mother substrate has a flat insulating layer (not shown) having a plurality of regions serving as base portions 106 stacked on each other and a plurality of regions serving as frame portions 105 (a plurality of openings are arranged). ) And an insulating layer (not shown).

枠部105は、上面に枠状メタライズ層113を有し、外側面に切欠き108を有していてもよ
い。また、基部106には、搭載部104に搭載される電子部品110とモジュール用基板130の外部電気回路とを電気的に接続するための導電路として、接続導体111、側面導体109および外部接続導体107が設けられている。また、この例では、絶縁基板101のコーナー部に切欠き108が設けられているが、絶縁基板101の外側面のその他の場所である長辺側や短辺側に設けられる場合もある。また、側面導体109を貫通導体（図示せず）等に変更して、切欠
き108が設けられない絶縁基板101としてもよい。 The frame portion 105 may have a frame-shaped metallized layer 113 on the upper surface and may have a notch 108 on the outer surface. In addition, the base 106 includes a connection conductor 111, a side conductor 109, and an external connection conductor as conductive paths for electrically connecting the electronic component 110 mounted on the mounting portion 104 and an external electric circuit of the module substrate 130. 107 are provided. Further, in this example, the notch 108 is provided at the corner of the insulating substrate 101, but may be provided at the other side of the outer surface of the insulating substrate 101, that is, the long side or the short side. Further, the side conductor 109 may be changed to a through conductor (not shown) or the like, so that the insulating substrate 101 without the notch 108 may be used.

ここで、電子装置がＴＣＸＯ（Temperature Compensated Crystal Oscillator、温度補償水晶発振器）等の複数の電子部品（図示せず）が搭載部104内に搭載される場合には、
複数の電子部品が搭載される段状の内側面を有する搭載部（図示せず）を設けるために、枠部105が２層以上の絶縁層で構成される場合もある。 Here, when a plurality of electronic components (not shown) such as a TCXO (Temperature Compensated Crystal Oscillator) are mounted in the mounting unit 104,
In order to provide a mounting portion (not shown) having a stepped inner surface on which a plurality of electronic components are mounted, the frame portion 105 may be formed of two or more insulating layers.

搭載部104は、例えば四角板状の電子部品110に合わせて平面視で四角形状である。図１の例では、その四角形状の搭載部104の互いに隣り合う２つのコーナー部に一対の接続導
体111が設けられている。この接続導体111は、搭載部104に搭載される圧電振動素子等の
電子部品110の電極（図示せず）を接続するための導体層として機能する。電子部品110が圧電振動素子であれば、通常、その外形が平面視で四角形状であり、その主面のコーナー部に接続用の一対の電極（図示せず）が設けられている。そのような電極の接続を容易かつ確実に行なえるようにするため、接続導体111は搭載部104のコーナー部に設けられる。 The mounting portion 104 has a rectangular shape in plan view, for example, in accordance with the electronic component 110 having a rectangular plate shape. In the example of FIG. 1, a pair of connection conductors 111 are provided at two adjacent corners of the rectangular mounting portion 104. The connection conductor 111 functions as a conductor layer for connecting electrodes (not shown) of the electronic component 110 such as a piezoelectric vibration element mounted on the mounting section 104. If the electronic component 110 is a piezoelectric vibrating element, its outer shape is generally a quadrangle in a plan view, and a pair of electrodes (not shown) for connection are provided at corners of its main surface. The connection conductor 111 is provided at a corner of the mounting portion 104 so that such electrode connection can be performed easily and reliably.

電子部品110の各電極と接続導体111との接続は、導電性接着剤等の接合材114を介して
行なわれる。すなわち、図１（ａ）に示すように電子部品110の主面のコーナー部に設け
られた一対の電極が、搭載部104上に設けられた一対の接続導体111に対向するように電子部品110を搭載部104に位置決めして、あらかじめ接続導体111に被着させておいた接合材114を加熱して硬化させ、電子部品110の電極と接続導体111とが接続される。 The connection between each electrode of the electronic component 110 and the connection conductor 111 is performed via a bonding material 114 such as a conductive adhesive. That is, as shown in FIG. 1A, the electronic component 110 is arranged such that a pair of electrodes provided at corners of the main surface of the electronic component 110 face a pair of connection conductors 111 provided on the mounting portion 104. Is positioned on the mounting portion 104, and the bonding material 114 previously applied to the connection conductor 111 is heated and cured, so that the electrode of the electronic component 110 and the connection conductor 111 are connected.

なお、接続導体111は、この実施の形態の例では電子部品110として圧電振動素子を用いた例を説明しているので上記のような位置に接続導体111が設けられているが、その他の
電子部品（図示せず）を搭載する場合、またその他の電子部品を複数搭載する場合には、その電子部品の電極の配置に応じて位置や形状を変えて設けられてもよい。このようなその他の電子部品としては、例えば、セラミック圧電素子や弾性表面波素子等の圧電素子，半導体素子，容量素子および抵抗素子等を挙げることができる。 In this embodiment, the connection conductor 111 is described as an example in which a piezoelectric vibrating element is used as the electronic component 110. Therefore, the connection conductor 111 is provided at the position as described above. When a component (not shown) is mounted, or when a plurality of other electronic components are mounted, they may be provided in different positions or shapes according to the arrangement of the electrodes of the electronic component. Examples of such other electronic components include a piezoelectric element such as a ceramic piezoelectric element and a surface acoustic wave element, a semiconductor element, a capacitance element and a resistance element.

本発明の電子部品収納用パッケージ100は、電子部品110の搭載部104を備えた第１主面102を有する基部106と、搭載部104に設けられ、搭載部104から突出した突出部112と、基部106上に搭載部104を囲むように設けられ、第２主面103を有する枠部105と、枠部105の第
２主面103に設けられた枠状メタライズ層113と、電子部品110が接続される複数の接続導
体111とを含んでいる。また、複数の接続導体111のそれぞれは、突出部112を覆うように
、突出部112の上面から側面および第１主面102にかけて設けられており、突出部112の上
面の周縁部と第１主面102との間において絶縁膜116で覆われている。 The electronic component storage package 100 of the present invention includes a base 106 having a first main surface 102 provided with a mounting portion 104 for an electronic component 110, a projecting portion 112 provided on the mounting portion 104 and projecting from the mounting portion 104, A frame portion 105 provided on the base portion 106 so as to surround the mounting portion 104 and having the second main surface 103, a frame-shaped metallized layer 113 provided on the second main surface 103 of the frame portion 105, and an electronic component 110 And a plurality of connection conductors 111 to be connected. Further, each of the plurality of connection conductors 111 is provided from the upper surface of the protruding portion 112 to the side surface and the first main surface 102 so as to cover the protruding portion 112. The surface 102 is covered with an insulating film 116.

このような構造により、電子部品収納用パッケージ100が小型化および低背化しても、
電子部品110が接続される接続導体111と他の配線導体との短絡を抑制できる。つまり、接続導体111としての高い寸法精度を得られるため、近接した他の配線導体、例えば他方の
接続導体や搭載部104の第１主面102に設けられた配線導体（図示せず）等との短絡を抑制できる。また、例えば電子部品110を接合する際に接合材114が流れた場合に、枠状メタライズ層113等の他の配線導体との短絡を抑制できるとともに、電子部品110の実装信頼性に優れた電子部品収納用パッケージ100を実現できる。上記の電子部品収納用パッケージ100の例を、図１（ａ）、（ｂ）に示す。また、図１における要部を、図２に断面透視図として示す。 With such a structure, even if the electronic component storage package 100 is reduced in size and height,
A short circuit between the connection conductor 111 to which the electronic component 110 is connected and another wiring conductor can be suppressed. That is, since a high dimensional accuracy as the connection conductor 111 can be obtained, the connection conductor 111 can be connected to another adjacent wiring conductor such as the other connection conductor or the wiring conductor (not shown) provided on the first main surface 102 of the mounting portion 104. Short circuit can be suppressed. Further, for example, when the bonding material 114 flows when the electronic component 110 is bonded, a short circuit with another wiring conductor such as the frame-shaped metallized layer 113 can be suppressed, and the electronic component 110 has excellent mounting reliability. The component storage package 100 can be realized. FIGS. 1A and 1B show examples of the electronic component storage package 100 described above. FIG. 2 is a cross-sectional perspective view of a main part in FIG.

このように、突出部112に接続導体111を設けるためには、例えば、基部106となるセラ
ミックグリーンシートの各配線基板領域の搭載部104において、接続導体111となるメタライズペーストを所定の位置に形成しておき、突出部112の上面に露出する接続導体111を除く位置に、接続導体111を取り囲んで絶縁膜116となるセラミックペーストを所定の位置に形成しておく。ここで、セラミックペーストは実質的に絶縁基板101と同じ材料を用いる
ことが望ましい。同じ材料とは、焼成後に絶縁基板101と同じセラミック成分が含まれる
ものであり、このセラミックペーストは塗布する方法（例えば、スクリーン印刷等）の仕様に合わせてセラミックに混合するバインダーや溶剤の添加量が調整される。 As described above, in order to provide the connection conductor 111 on the protruding portion 112, for example, a metallized paste serving as the connection conductor 111 is formed at a predetermined position in the mounting portion 104 of each wiring board region of the ceramic green sheet serving as the base 106. In addition, a ceramic paste that surrounds the connection conductor 111 and becomes the insulating film 116 is formed at a predetermined position except for the connection conductor 111 exposed on the upper surface of the protrusion 112. Here, it is desirable that the ceramic paste be made of substantially the same material as that of the insulating substrate 101. The same material includes the same ceramic component as that of the insulating substrate 101 after firing, and the amount of the binder or solvent added to the ceramic in accordance with the specification of a method of applying the coating (for example, screen printing). Is adjusted.

さらに、メタライズペースト、セラミックペーストが形成された基部106となるセラミ
ックグリーンシートの表面に、接続導体111が突出して突出部112が設けられるように、凹部が形成された加圧治具（図示せず）で加圧することにより形成できる。この際、電子部品110が搭載される接続導体111が突出部112の上面で露出し、さらに絶縁膜116が接続導体111の周縁部と第１主面との間にかけて設けられる構造とするためには、加圧治具の凹部
の底部が接続導体111となるメタライズペーストの露出部の全部、および絶縁膜116となるセラミックペーストの内周縁を加圧するように、加圧治具の位置を決めればよい。 Further, a pressing jig (not shown) having a concave portion so that the connection conductor 111 protrudes and a protruding portion 112 is provided on the surface of the ceramic green sheet that becomes the base portion 106 on which the metallized paste and the ceramic paste are formed. ) Can be formed by pressing. At this time, in order to obtain a structure in which the connection conductor 111 on which the electronic component 110 is mounted is exposed on the upper surface of the protrusion 112 and the insulating film 116 is provided between the peripheral portion of the connection conductor 111 and the first main surface. If the position of the pressing jig is determined so that the bottom of the concave portion of the pressing jig presses the entire exposed portion of the metallized paste that becomes the connection conductor 111 and the inner peripheral edge of the ceramic paste that becomes the insulating film 116, Good.

このとき、加圧治具の凹部の深さは一定であり、加圧加工後の突出部112の高さも一定
とすることができ、従来のように搭載部104にメタライズペーストを複数回印刷すること
によりメタライズバンプを形成して接続導体が設けられる場合と比較して、接続導体111
の厚みにおける寸法精度を高めることができる。そして、突出部112が設けられた基部106となるセラミックグリーンシートに、枠部105となるセラミックグリーンシートを積層す
ることにより、電子部品収納用パッケージ100となる配線基板領域が複数配列された母基
板を作製することができる。 At this time, the depth of the concave portion of the pressing jig is constant, and the height of the protruding portion 112 after the pressing process can be constant, and the metallizing paste is printed on the mounting portion 104 a plurality of times as in the related art. As a result, compared to the case where the metallized bump is formed and the connection conductor is provided, the connection conductor 111 is provided.
The dimensional accuracy in the thickness of the substrate can be improved. Then, by laminating the ceramic green sheet serving as the frame portion 105 on the ceramic green sheet serving as the base portion 106 provided with the protruding portion 112, a mother board in which a plurality of wiring board regions serving as the electronic component storage package 100 are arranged Can be produced.

なお、上記の例では枠部105と基部106を別々に形成しておき、突出部112を加圧工程に
より形成した後に積層して母基板を作製したが、枠部105の厚みが比較的小さい場合、１
枚のセラミックグリーンシートに接続導体等となるメタライズペーストや絶縁膜116とな
るセラミックペーストを形成しておき、突出部112と枠部105となる凹部を一括して加圧加工してもよい。このような方法により、寸法精度の高い加圧治具を用いて、搭載部104に
おける接続導体111の位置精度や、接続導体111を含んだ突出部112の形状における寸法精
度を高いものとすることができる。 In the above example, the frame portion 105 and the base portion 106 were separately formed, the protruding portions 112 were formed by a pressing step, and then laminated to form a mother substrate. However, the thickness of the frame portion 105 was relatively small. Case 1
A metallized paste serving as a connection conductor or a ceramic paste serving as an insulating film 116 may be formed on a single ceramic green sheet, and the protrusion 112 and the recess serving as the frame 105 may be collectively pressed. According to such a method, by using a pressing jig having high dimensional accuracy, the positional accuracy of the connection conductor 111 in the mounting portion 104 and the dimensional accuracy in the shape of the protrusion 112 including the connection conductor 111 are improved. Can be.

また、本発明の電子部品収納用パッケージ100は、図３に示す例のように、絶縁膜116が突出部112の上面の周縁部において複数の接続導体111を覆っていてもよい。このような構造により、接続導体111における実際に電子部品110が接続される領域の位置を良好に確認することができる。つまり、突出部112の上面に接続導体111が設けられており、この上面における外端部に絶縁膜116が設けられているため、突出部112の上面において、接続導体111に被着されるめっき層（図示せず）と絶縁膜116との色調差により、絶縁基板101にお
ける接続導体111の位置を画像認識装置等により搭載位置を容易に確認することができる
。よって、電子部品110の搭載性に優れる。 Further, in the electronic component housing package 100 of the present invention, as in the example shown in FIG. 3, the insulating film 116 may cover the plurality of connection conductors 111 at the periphery of the upper surface of the protrusion 112. With such a structure, the position of the region where the electronic component 110 is actually connected in the connection conductor 111 can be confirmed well. That is, since the connection conductor 111 is provided on the upper surface of the protrusion 112 and the insulating film 116 is provided on the outer end of the upper surface, the plating applied to the connection conductor 111 on the upper surface of the protrusion 112 Based on the color difference between the layer (not shown) and the insulating film 116, the mounting position of the connection conductor 111 on the insulating substrate 101 can be easily confirmed by an image recognition device or the like. Therefore, the mountability of the electronic component 110 is excellent.

なお、接続導体111，枠状メタライズ層113、および外部接続導体107等は、酸化腐食を
防止するとともに、接続導体111と電子部品110の電極との接続、または外部接続導体107
と外部回路基板（図示せず）との接続等をより容易または強固なものとするために、それらの露出した表面に１〜20μｍ程度の厚みのニッケルめっき層と0.1〜3.0μｍ程度の厚みの金めっき層とが順次被着されていてもよい。 The connection conductor 111, the frame-shaped metallized layer 113, the external connection conductor 107, and the like prevent oxidation corrosion and connect the connection conductor 111 to the electrode of the electronic component 110 or the external connection conductor 107.
In order to make the connection with an external circuit board (not shown) easier or stronger, a nickel plating layer having a thickness of about 1 to 20 μm and a thickness of about 0.1 to 3.0 μm are formed on the exposed surfaces thereof. A gold plating layer may be sequentially applied.

このように、突出部112に接続導体111および絶縁膜116を設けるためには、例えば上記
と同様の方法でメタライズペースト、セラミックペーストが形成された基部106となるセ
ラミックグリーンシートの表面に、接続導体111が突出して突出部112が設けられるように、凹部が設けられた加圧治具で加圧することにより形成すればよい。この際に、基部106
となるセラミックグリーンシートの表面に、複数の接続導体111となるメタライズペース
トを形成しておき、さらにこの接続導体111のうち、実際に電子部品110が接続される領域（すなわち、突出部112となる上面）の周囲を取り囲んで絶縁膜となるセラミックペース
トを枠状に形成すればよい。これにより、加圧加工後に絶縁膜116が突出部112の上面の周縁部において複数の接続導体111を覆う構造となる。 As described above, in order to provide the connection conductor 111 and the insulating film 116 on the protruding portion 112, for example, the connection conductor is formed on the surface of the ceramic green sheet to be the base 106 on which the metallized paste and the ceramic paste are formed in the same manner as described above. It may be formed by pressing with a pressing jig provided with a concave portion so that the protruding portion 112 is provided by protruding the 111. At this time, the base 106
A metallized paste to be a plurality of connection conductors 111 is formed on the surface of the ceramic green sheet to be formed, and furthermore, a region of the connection conductor 111 to which the electronic component 110 is actually connected (that is, a projection 112). The ceramic paste that surrounds the periphery of the (upper surface) and becomes an insulating film may be formed in a frame shape. Thus, the structure in which the insulating film 116 covers the plurality of connection conductors 111 at the peripheral edge of the upper surface of the protruding portion 112 after the pressing is performed.

また、上記方法により、突出部112を設ける場合、絶縁膜116が突出部112に埋設される
とともに、突出部112の上面における接続導体111の露出面と絶縁膜116の露出面とが同一
面として形成されるため、段差がなく電子部品110の搭載性が良好となる。 In addition, when the protrusion 112 is provided by the above method, the insulating film 116 is embedded in the protrusion 112, and the exposed surface of the connection conductor 111 on the upper surface of the protrusion 112 and the exposed surface of the insulating film 116 are formed as the same surface. Since it is formed, there is no step and the mountability of the electronic component 110 is good.

また、本発明の電子部品収納用パッケージ100は、絶縁膜116は突出部112の側面におい
て複数の接続導体111を覆っていてもよい。このような構造により、接続導体111における実際に電子部品110が接続される領域の位置をさらに良好に確認することができる。つま
り、突出部112の上面に接続導体111が設けられており、突出部112の側面に絶縁膜116が設けられているため、突出部112の上面の位置について、接続導体111に被着されるめっき層（図示せず）と絶縁膜116との色調差により、絶縁基板101における接続導体111の位置を
画像認識装置等により搭載位置をさらに容易に確認することができる。よって、電子部品110の搭載性に優れる。上記のような電子部品収納用パッケージ100の要部を、図４に断面透視図として示す。 Further, in the electronic component housing package 100 of the present invention, the insulating film 116 may cover the plurality of connection conductors 111 on the side surface of the protrusion 112. With such a structure, the position of the region where the electronic component 110 is actually connected in the connection conductor 111 can be more properly confirmed. That is, since the connection conductor 111 is provided on the upper surface of the protrusion 112 and the insulating film 116 is provided on the side surface of the protrusion 112, the connection conductor 111 is attached to the position of the upper surface of the protrusion 112. Due to the color difference between the plating layer (not shown) and the insulating film 116, the position of the connection conductor 111 on the insulating substrate 101 can be more easily confirmed by the image recognition device or the like. Therefore, the mountability of the electronic component 110 is excellent. The main part of the electronic component storage package 100 as described above is shown in FIG.

なお、絶縁膜116は、突出部112の側面に絶縁膜116が設けられており、絶縁膜116で覆われた部分については接続導体111が露出しないことから、各めっき層が被着されない。よ
って、金めっき層等の貴金属の使用量を削減でき、低コスト化が可能となる。ここで、突出部112の側面に設けられた接続導体111は、電子部品110との接続に直接寄与するもので
はなく、突出部112を設ける際に形成されるものである。よって、電子部品110の電極との接続を良好なものとするために、めっき層が被着される必要はない。また、突出部112の
側面に設けられた接続導体111が絶縁膜116で覆われていることにより、この部分の接続導体111については大気と接触せず、酸化腐食が抑制される構造となっている。 Note that the insulating film 116 is provided with the insulating film 116 on the side surface of the protruding portion 112, and since the connection conductor 111 is not exposed in a portion covered with the insulating film 116, no plating layer is applied. Therefore, the amount of use of a noble metal such as a gold plating layer can be reduced, and the cost can be reduced. Here, the connection conductor 111 provided on the side surface of the protrusion 112 does not directly contribute to the connection with the electronic component 110 but is formed when the protrusion 112 is provided. Therefore, there is no need to apply a plating layer in order to improve the connection with the electrodes of the electronic component 110. In addition, since the connection conductor 111 provided on the side surface of the protrusion 112 is covered with the insulating film 116, the connection conductor 111 in this portion does not come into contact with the atmosphere, and has a structure in which oxidation corrosion is suppressed. I have.

また、本発明の電子部品収納用パッケージ100は、絶縁膜116が第１主面102において複
数の接続導体111を覆っていてもよい。このような構造により、接続導体111における実際に電子部品110が接続される領域の位置を、さらに良好に確認することができる。つまり
、突出部112の上面にめっき層が被着された接続導体111が設けられており、第１主面102
において複数の接続導体111を覆うように絶縁膜116が設けられているため、突出部112の
上面において、接続導体111に被着されるめっき層（図示せず）と第１主面102に設けられた絶縁膜116との色調差により、絶縁基板101における接続導体111の位置を画像認識装置
等により容易に検出することができる。 Further, in the electronic component housing package 100 of the present invention, the insulating film 116 may cover the plurality of connection conductors 111 on the first main surface 102. With such a structure, the position of the region of the connection conductor 111 where the electronic component 110 is actually connected can be more properly confirmed. That is, the connection conductor 111 on which the plating layer is adhered is provided on the upper surface of the protrusion 112, and the first main surface 102
Since the insulating film 116 is provided so as to cover the plurality of connection conductors 111, the plating layer (not shown) provided on the connection conductor 111 and the first main surface 102 are provided on the upper surface of the protrusion 112. The position of the connection conductor 111 on the insulating substrate 101 can be easily detected by an image recognition device or the like, based on the difference in color tone from the obtained insulating film 116.

つまり、突出部112の上面に接続導体111が設けられており、かつ第１主面102に複数の
接続導体111を覆って絶縁膜116が設けられていることから、突出部112の上面に設けられ
た接続導体111に被着されるめっき層（図示せず）と、第１主面102に設けられた絶縁膜116との色調差により、絶縁基板101における接続導体111の位置を画像認識装置等によりさ
らに容易に検出することができる。上記のような電子部品収納用パッケージ100の要部を
、図５に断面透視図として示す。 That is, since the connection conductor 111 is provided on the upper surface of the protrusion 112 and the insulating film 116 is provided on the first main surface 102 so as to cover the plurality of connection conductors 111, the connection conductor 111 is provided on the upper surface of the protrusion 112. The position of the connection conductor 111 on the insulating substrate 101 is determined by an image recognition device based on the color tone difference between the plating layer (not shown) provided on the connection conductor 111 and the insulating film 116 provided on the first main surface 102. Can be detected more easily. The main part of the electronic component storage package 100 as described above is shown in FIG.

詳細には、電子部品110を搭載する接続導体111の画像認識装置等での確認は、第１主面102に垂直になるように画像認識用のカメラが設置されるとともに、照明装置からの光が
接続導体111に向けて照射されている。突出部112の上面に設けられた接続導体111は第１
主面102から突出して設けられているため、カメラの焦点が突出部112の上面に設けられた接続導体111に合っても、その外周は焦点が合っていない状態で第１主面102の色調が撮影されることになる。 More specifically, the confirmation of the connection conductor 111 on which the electronic component 110 is mounted by an image recognition device or the like is performed by setting an image recognition camera so as to be perpendicular to the first main surface 102, Is radiated toward the connection conductor 111. The connection conductor 111 provided on the upper surface of the projection 112 is the first conductor.
Since the projection is provided from the main surface 102, even when the camera focuses on the connection conductor 111 provided on the upper surface of the protrusion 112, the outer periphery thereof is not focused on the color tone of the first main surface 102. Will be photographed.

しかし、このように第１主面102に複数の接続導体111を覆って絶縁膜116が設けられて
いれば、カメラの焦点が合っていない接続導体111の外周の第１主面102における絶縁膜116の色調が、金属光沢のあるめっき層と異なる状態となるため、突出部112の上面に設けられた接続導体111をより良好に確認することができる。 However, if the insulating film 116 is provided on the first main surface 102 so as to cover the plurality of connection conductors 111, the insulating film on the first main surface 102 on the outer periphery of the connection conductor 111 out of focus of the camera is provided. Since the color tone of 116 is different from that of the plating layer having a metallic luster, the connection conductor 111 provided on the upper surface of the protruding portion 112 can be confirmed more favorably.

また、本発明の電子部品収納用パッケージ100は、絶縁膜116が突出部112の上面の周縁
部から側面および第１主面102にかけて複数の接続導体111を覆っていてもよい。このような構造により、突出部112を覆って設けられた接続導体111を、突出部112の上面に露出し
た電子部品110が接続される領域を除いて絶縁膜116で覆うことができ、さらに効果的に
電子部品110が接続される接続導体111と他の配線導体との短絡を効果的に抑制できる。 In the electronic component housing package 100 of the present invention, the insulating film 116 may cover the plurality of connection conductors 111 from the peripheral edge of the upper surface of the protrusion 112 to the side surface and the first main surface 102. With such a structure, the connection conductor 111 provided over the protrusion 112 can be covered with the insulating film 116 except for a region where the electronic component 110 exposed on the upper surface of the protrusion 112 is connected. Short circuit between the connection conductor 111 to which the electronic component 110 is connected and another wiring conductor can be effectively suppressed.

つまり、接続導体111としての高い寸法精度を得られるとともに、近接した他の配線導
体、例えば他方の接続導体や搭載部104の第１主面102に設けられた配線導体（図示せず）等との短絡を抑制できる。上記のような電子部品収納用パッケージ100の要部を、図６に
断面透視図として示す。 In other words, a high dimensional accuracy can be obtained as the connection conductor 111, and another wiring conductor close to the connection conductor 111, such as the other connection conductor or a wiring conductor (not shown) provided on the first main surface 102 of the mounting portion 104, can be used. Short circuit can be suppressed. FIG. 6 is a cross-sectional perspective view of a main part of the electronic component storage package 100 as described above.

ここで、接続導体111を覆う絶縁膜116は複数の接続導体111を連続した絶縁膜116で覆う構造でもよく、また別々に覆う構造でもよい。さらに、絶縁膜116は図６に示すように突
出部112の上面の周縁部から側面、および第１主面102、枠部105の上面から内側面の上側
周縁部にかけて設けられた枠状メタライズ層113の一部を覆う構造でもよい。このように
、接続導体111だけでなく、枠状メタライズ層113の一部を覆うことにより、電子部品110
が接続される接続導体111と他の配線導体との短絡だけでなく、電子部品110を気密封止するために、枠状メタライズ層113に蓋体115を銀ろう等の封止材によって絶縁基板101上に
接合する際の封止材が流れた場合に、枠状メタライズ層113と、接続導体111または他の接続導体との短絡を抑制できる。 Here, the insulating film 116 covering the connection conductor 111 may have a structure in which the plurality of connection conductors 111 are covered with the continuous insulating film 116 or a structure in which the connection conductors 111 are separately covered. Further, as shown in FIG. 6, the insulating film 116 is a frame-shaped metallized layer provided from the peripheral edge of the upper surface of the protrusion 112 to the side surface, and from the upper surface of the first main surface 102 and the frame portion 105 to the upper peripheral edge of the inner surface. A structure that covers a part of 113 may be used. In this way, by covering not only the connection conductor 111 but also a part of the frame-shaped metallization layer 113, the electronic component 110
In order to hermetically seal the electronic component 110, as well as a short circuit between the connection conductor 111 to which the connection conductor 111 is connected and other wiring conductors, the lid 115 is sealed to the frame-shaped metallized layer 113 with a sealing material such as silver solder. When the sealing material flows when joining on 101, short circuit between frame-shaped metallized layer 113 and connection conductor 111 or another connection conductor can be suppressed.

ここで、枠状メタライズ層113は、通常、枠部105の上面に設けられる構造であるが、枠部105を設けるために、上記で記載したように凹部が設けられた加圧治具で加圧する工程
を用いた場合、枠状メタライズ層113の一部が延び、枠部105の上面から内側面の上側周縁部にかけて枠状メタライズ層113が形成される場合がある。この場合でも、枠部105の内側面の上側周縁部に延びた枠状メタライズ層113の一部を絶縁膜116で覆う構造であれば、加圧治具で加圧する工程を用いた場合でも枠状メタライズ層113が枠部105の内側面の上側周縁部に露出するのを抑えた構造となる。よって、枠状メタライズ層113に蓋体115を銀ろう等の封止材によって絶縁基板101上に接合する際の封止材の流れ出しによる枠状メタライ
ズ層113と、接続導体111や他の接続導体との短絡を抑制する効果がある。 Here, the frame-shaped metallized layer 113 is usually provided on the upper surface of the frame 105, but in order to provide the frame 105, it is pressed by the pressing jig provided with the recess as described above. When the pressing step is used, a part of the frame-shaped metallized layer 113 may be extended, and the frame-shaped metallized layer 113 may be formed from the upper surface of the frame portion 105 to the upper peripheral portion of the inner side surface. Even in this case, if the insulating film 116 covers a part of the frame-shaped metallized layer 113 extending to the upper peripheral portion of the inner side surface of the frame portion 105, even if the step of pressing with a pressing jig is used, the frame The structure is such that the metallized layer 113 is prevented from being exposed at the upper peripheral portion of the inner side surface of the frame portion 105. Accordingly, when the lid 115 is joined to the frame-shaped metallization layer 113 on the insulating substrate 101 by a sealing material such as silver solder, the frame-shaped metallization layer 113 formed by the flow of the sealing material, the connection conductor 111 and other connection conductors This has the effect of suppressing short circuiting.

なお、加圧加工前において印刷等の形成方法により枠部105の内側面となる枠状メタラ
イズ層113の一部を絶縁膜116が覆って段差が形成されていても、加圧治具で加圧することにより枠部105の内側面に形成された枠状メタライズ層113、枠部105の内側面、および枠
部105の内側面に形成された絶縁膜116とが同一面として形成される。つまり、枠部105の
内側面の上側周縁部の接続導体111の一部を覆って形成された絶縁膜116は、図６に示すように加圧工程により接続導体111が枠部105の内部にめり込むため、枠部105の内側面にお
ける段差がなく電子部品110の搭載性が良好となる。なお、絶縁膜116は、枠部105の内周
の一部を覆っていても全部を覆っていてもよい。 It should be noted that even if the insulating film 116 covers a part of the frame-shaped metallized layer 113 serving as the inner side surface of the frame portion 105 by a forming method such as printing before the pressing process, a step is formed by the pressing jig. By pressing, the frame-shaped metallized layer 113 formed on the inner surface of the frame 105, the inner surface of the frame 105, and the insulating film 116 formed on the inner surface of the frame 105 are formed as the same surface. That is, the insulating film 116 formed to cover a part of the connection conductor 111 on the upper peripheral portion of the inner surface of the frame portion 105 has the connection conductor 111 inside the frame portion 105 by a pressing process as shown in FIG. Because of the recess, there is no step on the inner side surface of the frame portion 105, and the mountability of the electronic component 110 is improved. Note that the insulating film 116 may cover a part of the inner periphery of the frame 105 or may cover the entire inner periphery.

本発明の電子装置120は、上記のいずれかに記載の電子部品収納用パッケージ100と、電子部品収納用パッケージ100に搭載された電子部品110とを有している。このような構造により、電子部品110の実装工程における短絡が抑制された、動作信頼性の高い電子装置120を実現できる。つまり、電子部品収納用パッケージ100が小型化および低背化することに
より電子装置120を小型化および低背化しても、電子部品110が接続される接続導体111と
他の配線導体との短絡を抑制できる。また、接続導体111としての高い寸法精度を得られ
るため、近接した他の配線導体、例えば他方の接続導体や搭載部104の第１主面102に設けられた配線導体（図示せず）等との短絡を抑制できる。 An electronic device 120 of the present invention includes the electronic component housing package 100 described above and an electronic component 110 mounted on the electronic component housing package 100. With such a structure, it is possible to realize an electronic device 120 with high operation reliability in which a short circuit in the mounting process of the electronic component 110 is suppressed. That is, even if the electronic device 120 is reduced in size and height due to the reduction in the size and height of the electronic component storage package 100, a short circuit between the connection conductor 111 to which the electronic component 110 is connected and another wiring conductor is prevented. Can be suppressed. In addition, in order to obtain high dimensional accuracy as the connection conductor 111, another connection conductor, such as the other connection conductor or the connection conductor (not shown) provided on the first main surface 102 of the mounting portion 104, can be used in order to obtain high dimensional accuracy. Short circuit can be suppressed.

また、接続導体111に被着されるめっき層と絶縁膜116との色調差により、絶縁基板101
における接続導体111の位置を画像認識装置等により容易に確認することができるため、
絶縁基板101における接続導体111の位置を画像認識装置等により容易に搭載位置を検出することができる。よって、電子部品110の搭載性に優れ、搭載部104の接続導体111に位置
精度よく電子部品110が搭載された、動作信頼性の高い電子装置120を実現できる。 Also, due to the color difference between the plating layer deposited on the connection conductor 111 and the insulating film 116, the insulating substrate 101
Since the position of the connection conductor 111 in can be easily confirmed by an image recognition device or the like,
The mounting position of the connection conductor 111 on the insulating substrate 101 can be easily detected by an image recognition device or the like. Therefore, it is possible to realize an electronic device 120 having excellent mountability of the electronic component 110 and high operation reliability in which the electronic component 110 is mounted on the connection conductor 111 of the mounting portion 104 with high positional accuracy.

ここで、電子装置120が、ＴＣＸＯ等の複数の電子部品（図示せず）が搭載部104内に搭載されるようなものである場合には、複数の電子部品が搭載される段状の内側面を有する搭載部（図示せず）を設けるために、枠部105が２層以上の絶縁層で構成される場合もあ
る。このような電子部品としては、例えば、セラミック圧電素子または弾性表面波素子等の圧電素子、半導体素子、容量素子、抵抗器等を挙げることができる。 Here, when the electronic device 120 is a device in which a plurality of electronic components (not shown) such as TCXO are mounted in the mounting unit 104, the electronic device 120 has a stepped shape in which the plurality of electronic components are mounted. In order to provide a mounting portion (not shown) having a side surface, the frame portion 105 may be composed of two or more insulating layers. Examples of such an electronic component include a piezoelectric element such as a ceramic piezoelectric element or a surface acoustic wave element, a semiconductor element, a capacitance element, a resistor, and the like.

また、電子部品の種類、形状、接続導体の数、搭載位置等に応じて、搭載部104に設け
られる突出部112の高さ、形状、設ける位置を変更してもよい。そして、突出部112を覆って設けられた接続導体111は、その下面から基部106の内部にかけて貫通導体（図示せず）等が設けられており、他の配線導体と接続される導通経路として作用する。また、搭載部104に搭載される電子部品が例えば半導体素子である場合、接続導体111の下面に複数の貫通導体を設けておき、この複数の貫通導体から半導体素子の熱を外部に逃がす熱伝導体として作用させてもよい。 Further, the height, shape, and position of the protruding portion 112 provided on the mounting portion 104 may be changed according to the type and shape of the electronic component, the number of connection conductors, the mounting position, and the like. The connecting conductor 111 provided to cover the protruding portion 112 is provided with a through conductor (not shown) and the like from the lower surface to the inside of the base portion 106, and acts as a conduction path connected to another wiring conductor. I do. When the electronic component mounted on the mounting portion 104 is, for example, a semiconductor element, a plurality of through conductors are provided on the lower surface of the connection conductor 111, and heat conduction from the plurality of through conductors to release heat of the semiconductor element to the outside is provided. It may act as a body.

本発明の電子モジュールは、上記に記載の電子装置120と、この電子装置120が半田等の接合材を介して接続されたモジュール用基板130とを有している。このような構造により
、搭載部104に搭載された電子部品110に対する接続信頼性が高められ、動作信頼性に優れた電子モジュールを実現できる。つまり、電子装置120が小型化・低背化されても、電子
部品収納用パッケージ100に搭載される電子部品110が接続される接続導体111と、他の配
線導体との短絡が抑制され、接続導体111としての高い寸法精度を得られるため、動作信
頼性に優れた電子モジュールを実現できる。 The electronic module of the present invention includes the electronic device 120 described above, and a module substrate 130 to which the electronic device 120 is connected via a bonding material such as solder. With such a structure, the reliability of connection to the electronic component 110 mounted on the mounting portion 104 is improved, and an electronic module with excellent operation reliability can be realized. In other words, even if the electronic device 120 is reduced in size and height, a short circuit between the connection conductor 111 to which the electronic component 110 mounted on the electronic component housing package 100 is connected and another wiring conductor is suppressed, and the connection is reduced. Since high dimensional accuracy as the conductor 111 can be obtained, an electronic module with excellent operation reliability can be realized.

なお、突出部112に設けられる接続導体111は、上記のように突出部112の上面に露出し
た電子部品110が接続される領域を除いて、突出部112を絶縁膜116で覆う構造となってい
ることから、接続導体111の外周が突出部112に強固に接合されることになる。よって、この電子モジュールが搭載された携帯電話やスマートフォン等の電子機器が落下等により衝撃を受けて、電子装置120に含まれる電子部品収納用パッケージ100に搭載された電子部品110に落下時の衝撃が加わっても、接続導体111が突出部112から剥離することが抑制され
る。よって、電子機器の落下時の衝撃等の影響を受け難い電子装置120が搭載された、耐
衝撃性に優れた電子モジュールを実現できる。 The connecting conductor 111 provided on the protrusion 112 has a structure in which the protrusion 112 is covered with the insulating film 116 except for the region where the electronic component 110 exposed on the upper surface of the protrusion 112 is connected as described above. Therefore, the outer periphery of the connection conductor 111 is firmly joined to the protrusion 112. Therefore, an electronic device such as a mobile phone or a smartphone on which the electronic module is mounted is subjected to an impact due to a drop or the like, and the electronic device 110 mounted on the electronic component storage package 100 included in the electronic device 120 is subjected to an impact when dropped. Is applied, the separation of the connection conductor 111 from the protrusion 112 is suppressed. Therefore, it is possible to realize an electronic module excellent in impact resistance, in which the electronic device 120 that is hardly affected by an impact when the electronic device is dropped is mounted.

このような電子モジュールが電子機器（図示せず）に搭載される場合は、枠状メタライズ層113および蓋体118をグランド電位と同電位にすることで、搭載部104内が外部ノイズ
から遮蔽される構造となる。つまり、外部からの電磁波が搭載部104に収容された電子部
品110に到達する量を抑えることができる。言い換えると、このような電子モジュールは
、電子機器からの電磁波が到達する量を抑えることができ、電子機器からの電磁波の影響を抑えることができる構造となっている。 When such an electronic module is mounted on an electronic device (not shown), the inside of the mounting portion 104 is shielded from external noise by setting the frame-shaped metallized layer 113 and the lid 118 to the same potential as the ground potential. Structure. That is, the amount of electromagnetic waves from the outside that reaches the electronic component 110 accommodated in the mounting portion 104 can be suppressed. In other words, such an electronic module has a structure in which the amount of electromagnetic waves from the electronic device can be suppressed, and the effect of the electromagnetic waves from the electronic device can be suppressed.

なお、本発明は上述の実施の形態の一例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。例えば、上述の実施の形態の一例では、枠部105の上面に枠状メタライズ層113が設けられ、基部106に接続導体111および絶縁膜116を含んだ突出部112が設けられた構造の電子部品収納用パッケージ100を示したが、枠部105の上面に金属枠体（図示せず）がろう付けされた構造であってもよい。   Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in an example of the above-described embodiment, an electronic component having a structure in which the frame-shaped metallized layer 113 is provided on the upper surface of the frame portion 105, and the projection portion 112 including the connection conductor 111 and the insulating film 116 is provided on the base portion 106 Although the storage package 100 is shown, a structure in which a metal frame (not shown) is brazed to the upper surface of the frame 105 may be used.

また、電子部品収納用パッケージ100を構成する絶縁基板101を基部106だけの構成（絶
縁基板として枠部がないもの）として、この基部106の外縁部に金属枠体がろう付けされ
た構造であってもよい。この場合、金属枠体の厚みに対して突出部112の厚みが小さくな
るように上記方法により寸法精度よく設けることができるとともに、金属枠体が枠部として作用することにより、電子部品110が収容される凹部を設けることができ、電子装置120の低背化が可能となり、より一層薄型化した電子モジュールを実現できる。 Further, the insulating substrate 101 constituting the electronic component storage package 100 is configured to have only the base 106 (there is no insulating substrate as a frame), and a metal frame is brazed to the outer edge of the base 106. You may. In this case, the protrusions 112 can be provided with high dimensional accuracy by the above method so that the thickness of the protruding portions 112 becomes smaller than the thickness of the metal frame, and the electronic component 110 is accommodated by the metal frame acting as the frame. The height of the electronic device 120 can be reduced, and an electronic module having a further reduced thickness can be realized.

100・・・電子部品収納用パッケージ
101・・・絶縁基板
102・・・第１主面（実装面）
103・・・第２主面（封止面）
104・・・搭載部
105・・・枠部
106・・・基部
107・・・外部接続導体
108・・・切欠き
109・・・側面導体
110・・・電子部品
111・・・接続導体
112・・・突出部
113・・・枠状メタライズ層
114・・・接合材
115・・・蓋体
116・・・絶縁膜
120・・・電子装置
130・・・モジュール用基板
100 ・ ・ ・ Package for storing electronic components
101 ・ ・ ・ Insulating substrate
102 ··· 1st main surface (mounting surface)
103 ・ ・ ・ Second main surface (sealing surface)
104 ・ ・ ・ Mounting section
105 ・ ・ ・ Frame
106 ・ ・ ・ Base
107 ・ ・ ・ External connection conductor
108 ・ ・ ・ Notch
109 ・ ・ ・ Side conductor
110 ・ ・ ・ Electronic parts
111 ・ ・ ・ Connection conductor
112 ・ ・ ・ Protrusion
113 ・ ・ ・ Frame-shaped metallized layer
114 ・ ・ ・ joining material
115 ・ ・ ・ Lid
116 ・ ・ ・ Insulating film
120 ・ ・ ・ Electronic device
130 ・ ・ ・ Module substrate

Claims (7)

電子部品の搭載部を備えた第１主面を有する基部と、
前記搭載部に設けられ、該搭載部から突出した突出部と、
前記基部上に前記搭載部を囲むように設けられ、第２主面を有する枠部と、
該枠部の前記第２主面に設けられた枠状メタライズ層と、
電子部品が接続される複数の接続導体とを含んでおり、
該複数の接続導体のそれぞれは、前記突出部を覆うように、該突出部の上面から側面および前記第１主面にかけて設けられており、前記突出部の上面の周縁部と前記第１主面との間において絶縁膜で覆われており、
前記接続導体の下面から前記突出部の上面および内部にかけて貫通導体が設けられていることを特徴とする電子部品収納用パッケージ。 A base having a first main surface including a mounting portion for an electronic component;
A protrusion provided on the mounting portion and protruding from the mounting portion;
A frame portion provided on the base portion so as to surround the mounting portion, and having a second main surface;
A frame-shaped metallized layer provided on the second main surface of the frame,
A plurality of connection conductors to which the electronic component is connected,
Each of the plurality of connection conductors is provided from the upper surface of the projecting portion to the side surface and the first main surface so as to cover the projecting portion, and a peripheral portion of the upper surface of the projecting portion and the first main surface are provided. Is covered with an insulating film ,
An electronic component housing package, wherein a through conductor is provided from the lower surface of the connection conductor to the upper surface and the inside of the protrusion . 前記絶縁膜は、前記突出部の上面の周縁部において前記複数の接続導体を覆っていることを特徴とする請求項１に記載の電子部品収納用パッケージ。 The electronic component storage package according to claim 1, wherein the insulating film covers the plurality of connection conductors at a peripheral edge of an upper surface of the protrusion. 前記絶縁膜は、前記突出部の側面において前記複数の接続導体を覆っていることを特徴とする請求項１に記載の電子部品収納用パッケージ。 The electronic component storage package according to claim 1, wherein the insulating film covers the plurality of connection conductors on a side surface of the protrusion. 前記絶縁膜は、前記第１主面において前記複数の接続導体を覆っていることを特徴とする請求項１に記載の電子部品収納用パッケージ。 The electronic component storage package according to claim 1, wherein the insulating film covers the plurality of connection conductors on the first main surface. 前記絶縁膜は、前記突出部の上面の周縁部から側面および前記第１主面にかけて前記複数の接続導体を覆っていることを特徴とする請求項１に記載の電子部品収納用パッケージ。 2. The electronic component storage package according to claim 1, wherein the insulating film covers the plurality of connection conductors from a peripheral edge of an upper surface of the protrusion to a side surface and the first main surface. 3. 請求項１乃至請求項５のいずれかに記載の電子部品収納用パッケージと、
該電子部品収納用パッケージに搭載された電子部品とを有していることを特徴とする電子装置。 An electronic component storage package according to any one of claims 1 to 5,
An electronic component mounted on the electronic component storage package. 請求項６に記載の電子装置と、該電子装置が接続されたモジュール用基板とを有していることを特徴とする電子モジュール。 An electronic module comprising: the electronic device according to claim 6; and a module substrate to which the electronic device is connected.
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