JP6645470B2 - 外部電極用導電性ペーストおよびその外部電極用導電性ペーストを用いて製造する電子部品の製造方法 - Google Patents
外部電極用導電性ペーストおよびその外部電極用導電性ペーストを用いて製造する電子部品の製造方法 Download PDFInfo
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- JP6645470B2 JP6645470B2 JP2017081486A JP2017081486A JP6645470B2 JP 6645470 B2 JP6645470 B2 JP 6645470B2 JP 2017081486 A JP2017081486 A JP 2017081486A JP 2017081486 A JP2017081486 A JP 2017081486A JP 6645470 B2 JP6645470 B2 JP 6645470B2
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- conductive paste
- external electrode
- glass frit
- electronic component
- conductive
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/065—Spherical particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
- B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
- B22F2007/047—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method non-pressurised baking of the paste or slurry containing metal powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Description
導電性金属粉末と、
平均粒径D50が0.8μm以下であり、平均扁平度が1.5以上5.5以下の扁平形状を有するガラスフリットと、
バインダ樹脂と、
を備え、
前記ガラスフリットは、B−Si系ガラスを含むことを特徴とする。
電子部品素子を準備する工程と、
前記電子部品素子の外表面に、上述した外部電極用導電性ペーストを付与する工程と、
付与された前記外部電極用導電性ペーストを焼き付けることによって外部電極を形成する工程と、
を有することを特徴とする。
(a)導電性金属粉末と、
(b)平均粒径D50が0.8μm以下であり、平均扁平度が1.5以上5.5以下の扁平形状を有するガラスフリットと、
(c)バインダ樹脂と、
を備える。
外部電極用導電性ペーストを作製するために、上記(a)の導電性金属粉末と、上記(b)のガラスフリットと、上記(c)のバインダ樹脂と、溶剤であるターピネオールとを用意した。
ブリスタの有無を確認するため、試料番号1〜14の外部電極用導電性ペーストを用いて、電子部品である積層セラミックコンデンサを作製した。積層セラミックコンデンサは、試料番号1〜14の各外部電極用導電性ペーストを用いて、それぞれ100個以上作製した。
試料番号1〜14の外部電極用導電性ペーストを用いて、上述した作製方法と同じ作製方法により、それぞれ20個の積層セラミックコンデンサを作製した。ただし、一対の外部電極の表面には、NiめっきおよびSnめっきを施した。
31 導電性金属粉末
32 ガラスフリット
Claims (5)
- 導電性金属粉末と、
平均粒径D50が0.8μm以下であり、平均扁平度が1.5以上5.5以下の扁平形状を有するガラスフリットと、
バインダ樹脂と、
を備え、
前記ガラスフリットは、B−Si系ガラスを含むことを特徴とする外部電極用導電性ペースト。 - 前記ガラスフリットは、Ba、Ti、Al、Zn、Srからなる群より選ばれる少なくとも1種を含むことを特徴とする請求項1に記載の外部電極用導電性ペースト。
- 前記導電性金属粉末の形状は、球形であることを特徴とする請求項1または2に記載の外部電極用導電性ペースト。
- 前記導電性金属粉末は、平均粒径D50が1.0μm以下のCuの粉末であることを特徴とする請求項1〜3のいずれかに記載の外部電極用導電性ペースト。
- 電子部品素子を準備する工程と、
前記電子部品素子の外表面に、請求項1〜4のいずれかに記載の外部電極用導電性ペーストを付与する工程と、
付与された前記外部電極用導電性ペーストを焼き付けることによって外部電極を形成する工程と、
を有することを特徴とする電子部品の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017081486A JP6645470B2 (ja) | 2017-04-17 | 2017-04-17 | 外部電極用導電性ペーストおよびその外部電極用導電性ペーストを用いて製造する電子部品の製造方法 |
KR1020180039611A KR102102800B1 (ko) | 2017-04-17 | 2018-04-05 | 외부전극용 도전성 페이스트 및 그 외부전극용 도전성 페이스트를 이용하여 제조하는 전자부품의 제조 방법 |
US15/950,421 US10529486B2 (en) | 2017-04-17 | 2018-04-11 | Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode |
Applications Claiming Priority (1)
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JP2017081486A JP6645470B2 (ja) | 2017-04-17 | 2017-04-17 | 外部電極用導電性ペーストおよびその外部電極用導電性ペーストを用いて製造する電子部品の製造方法 |
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JP2018181672A JP2018181672A (ja) | 2018-11-15 |
JP6645470B2 true JP6645470B2 (ja) | 2020-02-14 |
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US (1) | US10529486B2 (ja) |
JP (1) | JP6645470B2 (ja) |
KR (1) | KR102102800B1 (ja) |
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EP4324577A1 (en) | 2015-12-16 | 2024-02-21 | 6K Inc. | Method of producing spheroidal dehydrogenated titanium alloy particles |
US10987735B2 (en) | 2015-12-16 | 2021-04-27 | 6K Inc. | Spheroidal titanium metallic powders with custom microstructures |
JP7171171B2 (ja) * | 2017-07-25 | 2022-11-15 | 太陽誘電株式会社 | セラミック電子部品及びセラミック電子部品の製造方法 |
CA3104080A1 (en) | 2018-06-19 | 2019-12-26 | 6K Inc. | Process for producing spheroidized powder from feedstock materials |
US11611130B2 (en) | 2019-04-30 | 2023-03-21 | 6K Inc. | Lithium lanthanum zirconium oxide (LLZO) powder |
SG11202111576QA (en) | 2019-04-30 | 2021-11-29 | 6K Inc | Mechanically alloyed powder feedstock |
JP2023512391A (ja) | 2019-11-18 | 2023-03-27 | シックスケー インコーポレイテッド | 球形粉体用の特異な供給原料及び製造方法 |
US11590568B2 (en) | 2019-12-19 | 2023-02-28 | 6K Inc. | Process for producing spheroidized powder from feedstock materials |
EP4173060A1 (en) | 2020-06-25 | 2023-05-03 | 6K Inc. | Microcomposite alloy structure |
AU2021349358A1 (en) | 2020-09-24 | 2023-02-09 | 6K Inc. | Systems, devices, and methods for starting plasma |
US11919071B2 (en) | 2020-10-30 | 2024-03-05 | 6K Inc. | Systems and methods for synthesis of spheroidized metal powders |
JP2022129225A (ja) * | 2021-02-24 | 2022-09-05 | 株式会社村田製作所 | 積層セラミックコンデンサ |
WO2024085091A1 (ja) * | 2022-10-19 | 2024-04-25 | 昭栄化学工業株式会社 | 導電性ペースト及び電子部品の製造方法 |
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US6248824B1 (en) * | 1999-04-09 | 2001-06-19 | Morton International, Inc. | Translucent high-temperature powder coatings |
JP2011138704A (ja) * | 2009-12-28 | 2011-07-14 | Kyocera Chemical Corp | 導電性ペーストおよびセラミックコンデンサ |
WO2011132778A1 (ja) * | 2010-04-23 | 2011-10-27 | 日立化成工業株式会社 | p型拡散層形成組成物、p型拡散層の製造方法、及び太陽電池素子の製造方法 |
US20120260982A1 (en) * | 2011-04-14 | 2012-10-18 | Hitachi Chemical Company, Ltd. | Paste composition for electrode, photovoltaic cell element, and photovoltaic cell |
KR20130065199A (ko) | 2011-12-09 | 2013-06-19 | 삼성전기주식회사 | 외부 전극용 도전성 페이스트, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법 |
CN104081468B (zh) | 2012-01-31 | 2016-09-21 | 株式会社村田制作所 | 金属端子接合用导电糊剂、带有金属端子的电子部件及其制造方法 |
JP6107394B2 (ja) | 2013-05-08 | 2017-04-05 | 株式会社村田製作所 | 導電性ペーストとその製造方法およびそれを用いたセラミック電子部品 |
KR20150054352A (ko) | 2013-11-12 | 2015-05-20 | 엘지전자 주식회사 | 유리 프릿 조성물 및 이를 포함하는 태양 전지 전극용 페이스트 조성물, 그리고 태양 전지 모듈 |
EP2913313A1 (en) * | 2014-02-26 | 2015-09-02 | Heraeus Precious Metals North America Conshohocken LLC | Tungsten-containing glass frit for electroconductive paste composition |
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2018
- 2018-04-05 KR KR1020180039611A patent/KR102102800B1/ko active IP Right Grant
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Publication number | Publication date |
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JP2018181672A (ja) | 2018-11-15 |
US10529486B2 (en) | 2020-01-07 |
KR20180116746A (ko) | 2018-10-25 |
KR102102800B1 (ko) | 2020-04-22 |
US20180301280A1 (en) | 2018-10-18 |
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