JP6645057B2 - Converter device and converter device manufacturing method - Google Patents

Converter device and converter device manufacturing method Download PDF

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JP6645057B2
JP6645057B2 JP2015143201A JP2015143201A JP6645057B2 JP 6645057 B2 JP6645057 B2 JP 6645057B2 JP 2015143201 A JP2015143201 A JP 2015143201A JP 2015143201 A JP2015143201 A JP 2015143201A JP 6645057 B2 JP6645057 B2 JP 6645057B2
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housing
opening
converter device
mounting
bottom plate
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JP2017028020A (en
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一治 北谷
一治 北谷
光 浦田
光 浦田
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Description

本発明は、実装基板と実装基板を収容する筐体と筐体の開口部を覆う蓋部とを備え実装基板の電気部品を覆うように筐体内に充填剤が充填されたコンバータ装置、およびそのコンバータ装置を製造するコンバータ装置製造方法に関するものである。   The present invention provides a converter device in which a housing is filled with a filler so as to cover an electric component of the mounting substrate, the converter device including a mounting substrate, a housing that houses the mounting substrate, and a lid that covers an opening of the housing, and a converter device. The present invention relates to a converter device manufacturing method for manufacturing a converter device.

この種の装置として、下記特許文献１に開示された樹脂封止型電子回路装置（以下「電子回路装置」ともいう）が知られている。この電子回路装置は、ケースと、部品が実装された配線基板と、ケースの開口部を覆う蓋状枠体とを備えて構成されている。また、この電子回路装置では、ケース内に収容された配線基板の部品を覆うように充填樹脂がケース内に充填されている。   As this type of device, a resin-sealed electronic circuit device (hereinafter, also referred to as “electronic circuit device”) disclosed in Patent Document 1 below is known. This electronic circuit device includes a case, a wiring board on which components are mounted, and a lid-like frame that covers an opening of the case. In this electronic circuit device, the case is filled with a filling resin so as to cover components of the wiring board housed in the case.

実開平０３−６８７９号公報（第３−４頁、第１−３図）Japanese Utility Model Laid-Open Publication No. 03-6879 (page 3-4, FIG. 1-3)

ところが、従来の電子回路装置には、以下の問題点がある。すなわち、従来の電子回路装置では、部品を上向きにした状態（ケースの開口部側に向けた状態）で配線基板をケースの底部側に収容し、その上から流動性を有する充填樹脂を流し込んで部品を覆っている。この場合、充填樹脂は、部品が発生する熱を熱伝導させてケースを介してケースの外に放熱させることが主な機能であるため、部品同士の隙間、部品と基板との間の隙間、および部品とケースとの間の隙間に満遍なく充填されることが望ましい。しかしながら、部品の上から充填樹脂を流し込むだけでは、上記した各隙間に充填樹脂を満遍なく充填させるのは困難である。このため、従来の電子回路装置には、充填樹脂の放熱機能を効果的に発揮させることができないという問題点が存在する。また、この種の電子回路装置に用いられる樹脂製のケースは、一般的に射出成形によって形成されるが、射出成形では、成形品の離型性を確保するために、底部側から開口部側に向かうに従って水平面積が広くなる形状にケースを構成する必要がある。このため、ケースの底部側に配線基板を収容する従来の電子回路装置では、ケースにおける開口部側の水平面積が配線基板の面積よりも大きくなる。このため、従来の電子回路装置には、ケース内における配線基板よりも開口部側の領域に無駄な空間が多く存在することとなるため、その分、小形化が困難となっている。   However, the conventional electronic circuit device has the following problems. That is, in the conventional electronic circuit device, the wiring board is accommodated in the bottom side of the case in a state where the components are directed upward (a state facing the opening side of the case), and a filling resin having fluidity is poured from above. Covering parts. In this case, since the main function of the filling resin is to conduct heat generated by the component and radiate heat to the outside of the case through the case, a gap between the components, a gap between the component and the board, Also, it is desirable that the gap between the component and the case be uniformly filled. However, it is difficult to uniformly fill the above-described gaps with the filling resin only by pouring the filling resin from above the component. For this reason, the conventional electronic circuit device has a problem that the heat dissipation function of the filling resin cannot be effectively exerted. In addition, a resin case used for this type of electronic circuit device is generally formed by injection molding. In the case of injection molding, in order to ensure mold releasability of a molded product, the case is formed from the bottom side to the opening side. It is necessary to configure the case in such a shape that the horizontal area becomes wider toward. For this reason, in the conventional electronic circuit device in which the wiring board is accommodated on the bottom side of the case, the horizontal area of the case on the opening side is larger than the area of the wiring board. For this reason, in a conventional electronic circuit device, a large amount of useless space exists in a region closer to the opening than the wiring board in the case, and it is difficult to reduce the size accordingly.

本発明は、かかる問題点に鑑みてなされたものであり、実装基板における電気部品間の隙間に充填材を確実に充填すると共に小形化を実現し得るコンバータ装置を提供することを主目的とする。   The present invention has been made in view of such a problem, and has as its main object to provide a converter device capable of reliably filling a gap between electric components in a mounting board with a filler and realizing miniaturization. .

上記目的を達成すべく本発明に係るコンバータ装置は、基板に電気部品が実装された実装基板と、一面に開口部を有して当該実装基板を収容する筐体と、前記開口部を覆うように前記筐体に装着される蓋部とを備え、当該筐体に収容された前記実装基板の前記電気部品を覆うように当該筐体内に充填剤が充填されて構成されたコンバータ装置であって、前記筐体は、底板と当該底板の外周部に立設された第１側板とを備え、当該底板側から前記開口部側に向かうに従って水平面積が徐々に広くなり、かつ当該開口部側の水平面積を前記基板の面積に合わせた形状に形成されると共に、前記第１側板における互いに対向する内面に一対以上のリブが設けられ、かつ当該第１側板における前記開口部側の縁部に形成された係合部を備えて構成され、前記実装基板は、前記電気部品が実装されている前記基板の実装面が前記底板に対向しかつ前記リブに前記実装面が当接した状態で前記筐体に収容され、前記充填剤は、前記底板と前記実装基板の前記実装面との間に充填され、前記蓋部は、前記筐体の前記開口部と略同形状の主板と当該主板の外周部に立設された第２側板とを備え、当該主板の内面に設けられた突起部を有し、かつ前記筐体に装着された状態において前記係合部が係合する被係合部を備えて構成されると共に、前記第２側板の内面が前記第１側板における前記開口部側の外面に接触し、かつ前記突起部が前記実装基板における前記基板の裏面に当接して当該実装基板を前記底板側に押え付けた状態で前記被係合部に前記係合部が係合させられて前記筐体に装着されている。 In order to achieve the above object, a converter device according to the present invention includes a mounting board on which an electric component is mounted on a board, a housing having an opening on one surface for housing the mounting board, and covering the opening. And a lid attached to the housing, wherein the housing is filled with a filler so as to cover the electrical components of the mounting board housed in the housing, The casing includes a bottom plate and a first side plate erected on an outer peripheral portion of the bottom plate, a horizontal area gradually increases from the bottom plate side to the opening side , and A horizontal area is formed in a shape corresponding to the area of the substrate, and a pair of or more ribs are provided on inner surfaces of the first side plate facing each other , and formed on an edge of the first side plate on the opening side. It is configured to include an engaging portion which is The mounting board is housed in the housing in a state where the mounting surface of the board on which the electric component is mounted faces the bottom plate and the mounting surface is in contact with the rib, and the filler is The lid is filled between the bottom plate and the mounting surface of the mounting board, and the lid includes a main plate having substantially the same shape as the opening of the housing and a second side plate erected on an outer peripheral portion of the main plate. provided, has a projection portion provided on the inner surface of the main plate, and the engaging portion in a state of being mounted to the housing is configured with a engaged portion for engaging Rutotomoni, the second side plate the object in a state in which the inner surface of contact with the outer surface of the opening side of the first side plate, and the projecting portion is pressed to contact with the mounting substrate on the rear surface of the substrate in the mounting substrate to the bottom plate side the engaging portion in the engaging portion is mounted to the housing are engaged

また、本発明に係るコンバータ装置は、前記筐体は、一面に開口部を有する直方体形状に形成されている。   Further, in the converter device according to the present invention, the housing is formed in a rectangular parallelepiped shape having an opening on one surface.

また、本発明に係るコンバータ装置は、前記筐体は、一面に開口部を有する立方体形状に形成されている。   Further, in the converter device according to the present invention, the housing is formed in a cubic shape having an opening on one surface.

また、本発明に係るコンバータ装置は、前記筐体は、一端部に開口部を有する円筒形状に形成されている。   Further, in the converter device according to the present invention, the housing is formed in a cylindrical shape having an opening at one end.

また、本発明に係るコンバータ装置は、前記筐体は、前記底板を平面視した平面視状態において当該底板の中心を対称点として点対称の形状に形成されている。   Further, in the converter device according to the present invention, the casing is formed in a point-symmetrical shape with a center of the bottom plate as a symmetric point in a plan view state of the bottom plate in plan view.

また、本発明に係るコンバータ装置製造方法は、基板に電気部品が実装された実装基板と、一面に開口部を有して当該実装基板を収容する筐体と、前記開口部を覆うように前記筐体に装着される蓋部とを備え、当該筐体に収容された前記実装基板の前記電気部品を覆うように当該筐体内に充填剤が充填されて構成されたコンバータ装置を製造するコンバータ装置製造方法であって、底板と当該底板の外周部に立設された第１側板とを備えて当該第１側板における互いに対向する内面に一対以上のリブが設けられ、かつ当該第１側板における前記開口部側の縁部に形成された係合部を備えて構成された前記筐体内に流動性を有する状態の前記充填剤を注入し、その後に、前記電気部品が実装されている前記基板の実装面が前記筐体の底板に対向する姿勢で前記実装基板を当該筐体内に収容し、その後に、前記筐体の前記開口部と略同形状の主板と当該主板の外周部に立設された第２側板とを備えて当該主板の内面に突起部が設けられ、かつ前記筐体に装着された状態において前記係合部が係合する被係合部を備えた前記蓋部を当該開口部を覆うように前記筐体に装着する際に、前記第２側板の内面を前記第１側板における前記開口部側の外面に接触させ、かつ前記突起部を前記実装基板における前記基板の裏面に当接させて、前記リブに前記実装面が当接するまで前記実装基板を前記底板側に押え付けると共に前記係合部を前記被係合部に係合させ、その後に、前記充填剤を硬化させて前記コンバータ装置を製造する。 Further, the method for manufacturing a converter device according to the present invention includes a mounting substrate having an electrical component mounted on the substrate, a housing having an opening on one surface for housing the mounting substrate, and a cover for covering the opening. A converter device for manufacturing a converter device comprising a lid mounted on a housing and filling the housing with a filler so as to cover the electrical components of the mounting board housed in the housing. A manufacturing method, comprising: a bottom plate and a first side plate erected on an outer peripheral portion of the bottom plate, wherein a pair of or more ribs are provided on inner surfaces of the first side plate facing each other , and Inject the filler in a flowable state into the housing configured with the engaging portion formed on the edge on the opening side , and then, inject the filler in the board on which the electrical component is mounted. Mounting surface faces the bottom plate of the housing That the mounting board is housed in the casing in a posture, then, the housing wherein the opening and the main plate of substantially the same shape and the main plate the main plate and a second side plate provided upright on an outer peripheral portion of the A lid provided with a projection on an inner surface thereof and having an engaged portion with which the engagement portion engages in a state where the projection is mounted on the housing, the lid being attached to the housing so as to cover the opening; When mounting , the inner surface of the second side plate is brought into contact with the outer surface of the first side plate on the side of the opening, and the projection is brought into contact with the back surface of the substrate in the mounting substrate, so that the mounting on the rib is performed. It faces the mounting board is engaged with Rutotomoni the engaging portion presses the bottom plate side the engaged portion to abut, then, to produce the converter device by curing the filler.

本発明に係るコンバータ装置では、実装面が筐体の底板に対向し、かつ筐体の第１側板に形成されたリブに実装面が当接した状態で実装基板が筐体に収容され、底板と実装基板の実装面との間に充填剤が充填され、蓋部に設けられた突起部が実装基板の基板の裏面に当接して実装基板を底板側に押え付けた状態で蓋部が筐体に装着されている。このため、このコンバータ装置では、突起部による底板側への実装基板の押え付けにより、各電気部品同士の間の隙間や、各電気部品と実装面との間の隙間に充填剤が満遍なく充填されている。したがって、このコンバータ装置によれば、充填剤の放熱機能を効果的に発揮させることができる。また、このコンバータ装置によれば、底板側から開口部側に向かうに従って水平面積が徐々に広くなる形状に形成された筐体の底板に実装面が対向し、リブに実装面が当接した状態で実装基板が筐体に収容されているため、実装基板の基板を筐体の開口部側に位置させることができる。したがって、このコンバータ装置によれば、開口部側の水平面積を実装基板の基板の面積に合わせて筐体を形成することで、底板側の水平面積を基板の面積よりも狭くすることができる結果、筐体を小形化することができる。 In the converter device according to the present invention, the mounting board is housed in the housing with the mounting surface facing the bottom plate of the housing and the mounting surface abutting on the rib formed on the first side plate of the housing. A filler is filled between the mounting board and the mounting surface of the mounting board, and the lid is mounted on the housing in a state where the protrusion provided on the lid abuts against the back surface of the mounting board and presses the mounting board against the bottom plate. It is attached to the body. For this reason, in this converter device, the space between the electric components and the space between the electric components and the mounting surface are evenly filled with the filler by pressing the mounting board on the bottom plate side by the protrusions. ing. Therefore, according to this converter device, the heat radiation function of the filler can be effectively exhibited. Also, according to this converter device, the mounting surface faces the bottom plate of the housing formed so that the horizontal area gradually increases from the bottom plate side toward the opening side, and the mounting surface abuts against the ribs. Thus, since the mounting board is housed in the housing, the board of the mounting board can be positioned on the opening side of the housing. Therefore, according to this converter device, the horizontal area on the bottom plate side can be made smaller than the area of the substrate by forming the housing so that the horizontal area on the opening side matches the area of the substrate of the mounting substrate. In addition, the size of the housing can be reduced.

また、本発明に係るコンバータ装置によれば、一面に開口部を有する直方体形状に筐体を形成したことにより、コンバータ装置の配置スペースが直方体形状のときに、無駄な隙間を少なく抑えた状態でその配置スペースにコンバータ装置を配置することができる。   Further, according to the converter device of the present invention, by forming the housing in a rectangular parallelepiped shape having an opening on one surface, when the arrangement space of the converter device is a rectangular parallelepiped shape, it is possible to reduce unnecessary gaps. The converter device can be arranged in the arrangement space.

また、本発明に係るコンバータ装置によれば、一面に開口部を有する立方体形状に筐体を形成したことにより、コンバータ装置の配置スペースが立方体形状のときに、無駄な隙間を少なく抑えた状態でその配置スペースにコンバータ装置を配置することができる。   Further, according to the converter device of the present invention, by forming the casing in a cubic shape having an opening on one surface, when the arrangement space of the converter device is a cubic shape, it is possible to reduce unnecessary gaps. The converter device can be arranged in the arrangement space.

また、本発明に係るコンバータ装置によれば、一端部に開口部を有する円筒形状に筐体を形成したことにより、コンバータ装置の配置スペースが円柱状のときに、無駄な隙間を少なく抑えた状態でその配置スペースにコンバータ装置をその配置スペース配置することができる。   Further, according to the converter device of the present invention, since the housing is formed in a cylindrical shape having an opening at one end, when the arrangement space of the converter device is a columnar shape, the useless gap is reduced. Thus, the converter device can be arranged in the arrangement space in the arrangement space.

また、本発明に係るコンバータ装置によれば、係合部を備えて筐体を構成し、装着状態において係合部が係合する被係合部を備えて蓋部を構成したことにより、筐体の開口部に向けて蓋部を押圧するだけで、係合部と被係合部とが係合して、筐体からの蓋部の脱落を確実に防止することができると共に、実装基板を筐体の底板側に押え付けた状態に維持することができる。また、係合部と被係合部とが係合するため、筐体と蓋部とを固定用の部材等で固定するような作業を行うことなく、充填剤の充填、実装基板の収容、および蓋部の装着が完了した筐体を例えば加熱装置にセットして充填剤に対する加熱処理（硬化処理）を行うことができるため、製造効率を向上させることができる。 Further, according to the converter device of the present invention, the housing is configured to include the engaging portion, and the lid portion is configured to include the engaged portion to which the engaging portion is engaged in the mounted state. By simply pressing the lid toward the opening of the body, the engaging portion and the engaged portion are engaged, and it is possible to reliably prevent the lid from falling off the housing and to mount the mounting substrate. Can be kept pressed against the bottom plate of the housing. In addition, since the engaging portion and the engaged portion are engaged with each other, without performing an operation of fixing the housing and the lid with a fixing member or the like, filling the filler, housing the mounting board, In addition, since the housing in which the lid is completely mounted can be set in, for example, a heating device to perform a heating process (curing process) on the filler, manufacturing efficiency can be improved.

また、本発明に係るコンバータ装置によれば、底板の中心を対称点として点対称の形状に筐体を形成したことにより、点対称の形状に形成されていない筐体とは異なり、実装基板を筐体に収容する際に、筐体の左右の向きを実装基板の左右の向きに合わせるような作業を行う必要がないため、その分、製造効率を向上させることができる。   Further, according to the converter device of the present invention, since the housing is formed in a point-symmetrical shape with the center of the bottom plate as a symmetrical point, unlike a housing not formed in a point-symmetrical shape, the mounting board is formed. When housed in the housing, it is not necessary to perform an operation of adjusting the left and right directions of the housing to the left and right directions of the mounting board, so that the manufacturing efficiency can be improved accordingly.

また、本発明に係るコンバータ装置製造方法によれば、筐体内に流動性を有する状態の充填剤を注入し、その後に実装面が筐体の底板に対向する姿勢で実装基板を筐体内に収容し、その後に蓋部を筐体に装着する際に、蓋部の突起部を実装基板における基板の裏面に当接させて、筐体のリブに実装面が当接するまで実装基板を底板側に押え付け、その後に充填剤を硬化させることにより、突起部による底板側への実装基板の押え付けによって各電気部品同士の間の隙間や、各電気部品と実装面との間の隙間に充填剤を満遍なく充填させることができる。したがって、このコンバータ装置製造方法によれば、充填剤の放熱機能を効果的に発揮させることができるコンバータ装置を製造することができる。 According to the method of manufacturing a converter device according to the present invention, the filler in a fluid state is injected into the housing, and then the mounting board is housed in the housing with the mounting surface facing the bottom plate of the housing. Then, when attaching the lid to the housing, the projection of the lid is brought into contact with the back surface of the substrate in the mounting board, and the mounting board is placed on the bottom plate side until the mounting surface comes into contact with the rib of the housing. Pressing, and then curing the filler, the filler presses the mounting board on the bottom plate side by the protrusions, the gap between each electric component and the gap between each electric component and the mounting surface Can be filled evenly. Therefore, according to this converter device manufacturing method, it is possible to manufacture a converter device capable of effectively exhibiting the heat radiation function of the filler.

コンバータ装置１の斜視図である。FIG. 2 is a perspective view of the converter device 1. 蓋部４を外した状態のコンバータ装置１の斜視図である。FIG. 3 is a perspective view of the converter device 1 with a cover 4 removed. 実装基板２の斜視図である。FIG. 3 is a perspective view of a mounting board 2. 筐体３の斜視図である。FIG. 4 is a perspective view of a housing 3. 開口部３３側から見た筐体３の平面図である。FIG. 4 is a plan view of the housing 3 as viewed from an opening 33 side. 蓋部４の斜視図である。FIG. 4 is a perspective view of a lid portion 4. コンバータ装置１の製造方法を説明する第１の説明図である。FIG. 5 is a first explanatory diagram illustrating a method for manufacturing converter device 1. コンバータ装置１の製造方法を説明する第２の説明図である。FIG. 5 is a second explanatory view illustrating the method for manufacturing converter device 1. コンバータ装置１の製造方法を説明する第３の説明図である。FIG. 8 is a third explanatory view illustrating the method for manufacturing converter device 1. コンバータ装置１の製造方法を説明する第４の説明図である。FIG. 14 is a fourth explanatory view illustrating the method for manufacturing the converter device 1. コンバータ装置１の製造方法を説明する第５の説明図である。FIG. 14 is a fifth explanatory view illustrating the method for manufacturing the converter device 1.

以下、コンバータ装置およびコンバータ装置製造方法（以下、単に「製造方法」ともいう）の実施の形態について、添付図面を参照して説明する。   Hereinafter, embodiments of a converter device and a method of manufacturing a converter device (hereinafter, also simply referred to as “manufacturing method”) will be described with reference to the accompanying drawings.

最初に、コンバータ装置の一例としての図１に示すコンバータ装置１の構成について説明する。コンバータ装置１は、例えば、交流電流を入力して、直流電流を出力するＡＣ−ＤＣコンバータであって、同図および図２に示すように、実装基板２、筐体３および蓋部４を備えて構成されている。また、このコンバータ装置１では、図１０に示すように、筐体３内に充填剤５が充填されている。   First, the configuration of the converter device 1 shown in FIG. 1 as an example of the converter device will be described. The converter device 1 is, for example, an AC-DC converter that inputs an AC current and outputs a DC current, and includes a mounting board 2, a housing 3, and a lid 4, as shown in FIGS. It is configured. In this converter device 1, as shown in FIG. 10, the casing 3 is filled with the filler 5.

実装基板２は、図３に示すように、基板２１、および基板２１に実装された各種の電気部品２２を備えて構成されている。基板２１は、同図に示すように、平面視略矩形（例えば、略長方形）に形成されている。各電気部品２２は、ＡＣ−ＤＣ変換処理を行う処理回路を構成する。また、この実装基板２では、各電気部品２２のうちの、トランスやコンデンサ等の大形の電気部品２２が、基板２１の実装面２１ａ（同図における下面）に実装されている。また、基板２１の裏面２１ｂ（実装面２１ａの反対側の面であって、同図における上面）には、交流電流を入力する２本の入力端子（一次側端子）２３ａ、および直流電流を出力する２本の出力端子（二次側端子）２３ｂが配設されている。また、実装基板２は、図１０に示すように、実装面２１ａが筐体３の底板３１に対向する（つまり、トランスやコンデンサ等の大形の電気部品２２が下向きとなる）と共に、基板２１が筐体３の開口部３３側に位置する状態で筐体３に収容されている。   As shown in FIG. 3, the mounting board 2 includes a board 21 and various electric components 22 mounted on the board 21. As shown in the figure, the substrate 21 is formed in a substantially rectangular shape (for example, a substantially rectangular shape) in plan view. Each of the electric components 22 constitutes a processing circuit that performs an AC-DC conversion process. In the mounting board 2, among the electric components 22, a large-sized electric component 22 such as a transformer or a capacitor is mounted on a mounting surface 21 a (a lower surface in the figure) of the substrate 21. Two input terminals (primary terminals) 23a for inputting an AC current and a DC current are output on a back surface 21b (a surface opposite to the mounting surface 21a, which is an upper surface in FIG. 2) of the substrate 21. Two output terminals (secondary terminals) 23b are provided. As shown in FIG. 10, the mounting board 2 has a mounting surface 21 a facing the bottom plate 31 of the housing 3 (that is, the large electrical components 22 such as a transformer and a capacitor face down), and Is housed in the housing 3 in a state of being located on the opening 33 side of the housing 3.

筐体３は、図４，５に示すように、略矩形の底板３１、および底板３１の各外周部に立設された４つの側板３２ａ〜３２ｄ（「第１側板」の一例：以下、区別しないときには「側板３２」ともいう）を有して、一面に開口部３３を有する（一面が開放された）略直方体の箱形に形成されている。この場合、筐体３は、樹脂を射出成形することによって形成されるため、成形時の離型性を確保するために、底板３１側から開口部３３側に向かうに従って水平面積が徐々に広くなる形状に形成されている。 As shown in FIGS. 4 and 5, the housing 3 includes a substantially rectangular bottom plate 31, and four side plates 32 a to 32 d (e.g., “first side plate”) that are erected on each outer peripheral portion of the bottom plate 31. If not, it is also formed as a substantially rectangular parallelepiped box having an opening 33 on one side (opened on one side). In this case, since the housing 3 is formed by injection-molding a resin, the horizontal area gradually increases from the bottom plate 31 side toward the opening 33 side in order to ensure releasability during molding. It is formed in a shape.

ここで、このコンバータ装置１では、上記したように、実装面２１ａが筐体３の底板３１に対向し、基板２１が筐体３の開口部３３側に位置する状態で実装基板２が筐体３に収容されている（図１０参照）。このため、このコンバータ装置１では、開口部３３側の水平面積を実装基板２の基板２１の面積に合わせて筐体３を形成することができるため、底板３１側の水平面積を基板２１の面積よりも狭くすることが可能となっている。このため、このコンバータ装置１では、基板２１が底板３１側に位置する状態で実装基板２が筐体３に収容される構成と比較して、筐体３を小形化することが可能となっている。言い換えれば、筐体３を同じ大きさとした場合には、基板２１が底板３１側に位置する状態で実装基板２が筐体３に収容される構成と比較して、基板２１の水平面積を大きくすることが可能となっている。   Here, in the converter device 1, as described above, the mounting substrate 2 is mounted on the housing 3 with the mounting surface 21 a facing the bottom plate 31 of the housing 3 and the substrate 21 positioned on the opening 33 side of the housing 3. 3 (see FIG. 10). For this reason, in this converter device 1, since the housing 3 can be formed by adjusting the horizontal area on the opening 33 side to the area of the substrate 21 of the mounting substrate 2, the horizontal area on the bottom plate 31 side is reduced to the area of the substrate 21. It is possible to make it narrower. For this reason, in this converter device 1, it is possible to reduce the size of the housing 3 as compared with a configuration in which the mounting board 2 is housed in the housing 3 with the board 21 positioned on the bottom plate 31 side. I have. In other words, when the housing 3 has the same size, the horizontal area of the board 21 is larger than in a configuration in which the mounting board 2 is housed in the housing 3 with the board 21 positioned on the bottom plate 31 side. It is possible to do.

また、図５に示すように、各側板３２のうちの互いに対向する２つの側板３２ａ，３２ｃの内面には、リブ３４（図４も参照）がそれぞれ設けられている。このリブ３４は、図１０に示すように、実装基板２を筐体３内に収容する際に、実装基板２の基板２１における実装面２１ａの縁部が当接して実装基板２を支持する機能を有している。また、リブ３４は、同図に示すように、底板３１からリブ３４の上端部（基板２１に当接する部分）までの長さが、実装基板２における基板２１の実装面２１ａからの電気部品２２の最大の高さ（同図では下端部までの長さ）よりもやや長くなるように形成されている。   Further, as shown in FIG. 5, ribs 34 (see also FIG. 4) are provided on the inner surfaces of two side plates 32a and 32c of each side plate 32 which face each other. As shown in FIG. 10, the rib 34 functions to support the mounting substrate 2 when the mounting substrate 2 is accommodated in the housing 3, with the edge of the mounting surface 21 a of the substrate 21 of the mounting substrate 2 abutting. have. As shown in the figure, the length of the rib 34 from the bottom plate 31 to the upper end of the rib 34 (the portion in contact with the substrate 21) is equal to the length of the electrical component 22 from the mounting surface 21 a of the substrate 21 in the mounting substrate 2. Is formed to be slightly longer than the maximum height (the length to the lower end in the figure).

また、図４，５に示すように、各側板３２のうちの互いに対向する２つの側板３２ｂ，３２ｄにおける開口部３３側の縁部には、蓋部４の係合孔４４（被係合部に相当する：図６参照）と係合する爪部３５（係合部）がそれぞれ形成されている。   As shown in FIGS. 4 and 5, an edge of the two side plates 32 b and 32 d facing each other of the side plates 32 on the opening 33 side is provided with an engagement hole 44 of the lid 4 (an engaged portion). (See FIG. 6) are formed respectively.

また、筐体３は、図５に示すように、底板３１を平面視した平面視状態において、底板３１の中心３１ａを対称点として点対称の形状に形成されている。つまり、各リブ３４の形成位置や各爪部３５の形成位置が、底板３１の中心３１ａを対称点として点対称となるように規定されている。   Further, as shown in FIG. 5, the casing 3 is formed in a point-symmetrical shape with the center 31a of the bottom plate 31 as a point of symmetry in a plan view of the bottom plate 31 in a plan view. That is, the formation position of each rib 34 and the formation position of each claw portion 35 are defined so as to be point-symmetric with respect to the center 31 a of the bottom plate 31 as a symmetric point.

蓋部４は、図６に示すように、略矩形（筐体３の開口部３３と略同形状）の主板４１、および主板４１の各外周部に立設された４つの側板４２ａ〜４２ｄ（「第２側板」の一例：以下、区別しないときには「側板４２」ともいう）を有して浅皿状に形成され、図１，１１に示すように、筐体３の開口部３３（図４参照）を覆うように筐体３に装着可能に構成されている。この場合、蓋部４は、樹脂を射出成形することによって形成される。 As shown in FIG. 6, the lid portion 4 has a main plate 41 having a substantially rectangular shape (substantially the same shape as the opening 33 of the housing 3), and four side plates 42 a to 42 d ( An example of a “second side plate”: hereinafter, also referred to as a “side plate 42” when not distinguished, is formed in a shallow dish shape, and as shown in FIGS. ) So as to cover the housing 3. In this case, the lid 4 is formed by injection molding a resin.

また、図６に示すように、主板４１の内面（同図における上面）には、複数（例えば、３つ）の突起部４３が設けられている。この場合、図１０に示すように、実装基板２が収容された筐体３に蓋部４を装着したときに、基板２１の裏面２１ｂに実装されている電気部品２２に接触しない任意の位置に突起部４３を設けることができる。この突起部４３は、同図に示すように、コンバータ装置１を製造する際に、筐体３内に収容した実装基板２における基板２１の裏面２１ｂに先端部を当接させて、実装基板２を筐体３の底板３１側に押え付けるのに用いられる。   As shown in FIG. 6, a plurality (for example, three) of protrusions 43 are provided on the inner surface (the upper surface in FIG. 6) of the main plate 41. In this case, as shown in FIG. 10, when the cover 4 is attached to the housing 3 in which the mounting board 2 is housed, the lid 4 is located at an arbitrary position that does not come into contact with the electric component 22 mounted on the back surface 21 b of the board 21. A projection 43 can be provided. As shown in the figure, when the converter device 1 is manufactured, the protruding portion 43 is brought into contact with the rear end 21b of the board 21 of the mounting board 2 housed in the housing 3 by contacting the tip thereof to form the mounting board 2 Is pressed to the bottom plate 31 side of the housing 3.

また、図６に示すように、主板４１には、実装基板２の各入力端子２３ａおよび各出力端子２３ｂを挿通させるための挿通孔４５が形成されている。また、主板４１における互いに対向する２つの縁部およびこれらの縁部に立設されている２つの側板４２ｂ，４２ｄには、これらの一部を切り欠いて形成されて、筐体３の爪部３５と係合する係合孔４４（図１０，１１も参照）がそれぞれ形成されている。   As shown in FIG. 6, the main plate 41 is formed with an insertion hole 45 through which each input terminal 23a and each output terminal 23b of the mounting board 2 are inserted. Further, two opposing edges of the main plate 41 and two side plates 42b and 42d erected on these edges are formed by cutting out a part of them, and the claw portions of the housing 3 are formed. Engagement holes 44 (see also FIGS. 10 and 11) which engage with the respective holes 35 are formed.

充填剤５は、一例として熱硬化型シリコーン樹脂（熱硬化型シリコーンエラストマー）であって、絶縁性を有すると共に、硬化処理前の状態では、流動性を有するゲル状をなし、硬化処理（加熱処理）によって硬化してゴム状に変化する。また、この充填剤５では、熱伝導率が高く、放熱性に優れた熱硬化型シリコーン樹脂が用いられている。この充填剤５は、実装基板２が収容された筐体３内、具体的には、筐体３の底板３１と実装基板２の基板２１との間に充填されて、実装基板２を筐体３に固定する（実装基板２の移動を規制する）と共に、電気部品２２が発生する熱を熱伝導させて筐体３を介して外部に放熱させる機能を有している。   The filler 5 is, for example, a thermosetting silicone resin (thermosetting silicone elastomer), which has an insulating property and has a fluid gel state before the curing treatment, and has a curing treatment (heat treatment). ) And it changes to a rubbery state. The filler 5 is made of a thermosetting silicone resin having high thermal conductivity and excellent heat dissipation. The filler 5 is filled in the housing 3 in which the mounting board 2 is accommodated, specifically, between the bottom plate 31 of the housing 3 and the board 21 of the mounting board 2, and 3 (restricts the movement of the mounting board 2), and has a function of conducting heat generated by the electric component 22 and radiating the heat to the outside via the housing 3.

次に、コンバータ装置１を製造するコンバータ装置製造方法について、図面を参照して説明する。なお、図７〜図１０では、筐体３の内部の状態を説明するため、紙面手前側の側板３２を透視した状態で図示している。   Next, a converter device manufacturing method for manufacturing the converter device 1 will be described with reference to the drawings. 7 to 10, in order to explain the internal state of the housing 3, the side plate 32 on the near side of the drawing is shown in a see-through state.

まず、図７に示すように、硬化処理前のゲル状の充填剤５を、ディスペンサ５０を用いて、予め決められた規定量だけ筐体３内に注入する。次いで、図８に示すように、実装基板２における基板２１の実装面２１ａが筐体３の底板３１に対向する姿勢で、実装基板２を筐体３内に収容する。   First, as shown in FIG. 7, the gel filler 5 before the curing treatment is injected into the housing 3 by using a dispenser 50 by a predetermined amount. Next, as shown in FIG. 8, the mounting substrate 2 is housed in the housing 3 with the mounting surface 21 a of the substrate 21 of the mounting substrate 2 facing the bottom plate 31 of the housing 3.

この場合、このコンバータ装置１では、筐体３が、底板３１の中心３１ａを対称点として点対称の形状に形成されている（図５参照）。つまり、筐体３は、左右を入れ替えても（１８０°回動させても）平面視形状が変化しない構成となっている。このため、筐体３の平面視形状が点対称ではない構成とは異なり、実装基板２を筐体３に収容する際に、筐体３の左右の向きを実装基板２の左右の向きに合わせるような作業を行う必要がないため、その分、製造効率を向上させることが可能となっている。   In this case, in the converter device 1, the housing 3 is formed in a point-symmetrical shape with the center 31a of the bottom plate 31 as a point of symmetry (see FIG. 5). That is, the casing 3 has a configuration in which the shape in a plan view does not change even if the left and right are switched (even if the casing 3 is rotated by 180 °). Therefore, unlike the configuration in which the shape of the housing 3 in a plan view is not point-symmetric, when the mounting board 2 is accommodated in the housing 3, the left and right directions of the housing 3 are matched with the left and right directions of the mounting board 2. Since it is not necessary to perform such an operation, it is possible to improve the manufacturing efficiency accordingly.

続いて、図９に示すように、筐体３の開口部３３を覆うように、蓋部４を筐体３に装着する。具体的には、実装基板２の入力端子２３ａおよび出力端子２３ｂを蓋部４の各通孔４５に挿通させ、次いで、蓋部４を下向きに移動させる。   Subsequently, as shown in FIG. 9, the cover 4 is attached to the housing 3 so as to cover the opening 33 of the housing 3. Specifically, the input terminals 23a and the output terminals 23b of the mounting board 2 are inserted into the respective through holes 45 of the cover 4, and then the cover 4 is moved downward.

続いて、図１０に示すように、下向きへの蓋部４の移動によって突起部４３の先端部が実装基板２における基板２１の裏面２１ｂに当接したときに、蓋部４を下向きに（筐体３の開口部３３に向けて）押圧して、実装基板２を筐体３の底板３１側に押え付ける。この際に、基板２１の移動によって充填剤５に圧力が加わり、基板２１の実装面２１ａに実装されている各電気部品２２同士の間の隙間や、各電気部品２２と実装面２１ａとの間の隙間に充填剤５が流れ込む。この結果、同図に示すように、これらの隙間に充填剤５が満遍なく充填される。   Subsequently, as shown in FIG. 10, when the tip of the protrusion 43 comes into contact with the back surface 21 b of the board 21 of the mounting board 2 by the downward movement of the cover 4, the cover 4 is (Toward the opening 33 of the body 3) to press the mounting board 2 against the bottom plate 31 of the housing 3. At this time, pressure is applied to the filler 5 by the movement of the substrate 21, and a gap between the electric components 22 mounted on the mounting surface 21 a of the substrate 21 and a gap between the electric components 22 and the mounting surface 21 a are formed. The filler 5 flows into the gap. As a result, as shown in the figure, these gaps are evenly filled with the filler 5.

次いで、基板２１の実装面２１ａが筐体３に形成されているリブ３４の上端部に当接したときには、蓋部４に対する押圧を解除する（蓋部４から手を離す）。この状態では、図１０，１１に示すように、筐体３の爪部３５と蓋部４の係合孔４４とが係合して、筐体３からの蓋部４の脱落が確実に防止される。また、爪部３５と係合孔４４とが係合することで、蓋部４から手を離しても、実装基板２が筐体３の底板３１側に押え付けられた状態が維持される。   Next, when the mounting surface 21a of the board 21 comes into contact with the upper end of the rib 34 formed on the housing 3, the pressing on the lid 4 is released (the hand is released from the lid 4). In this state, as shown in FIGS. 10 and 11, the claw portion 35 of the housing 3 is engaged with the engagement hole 44 of the lid portion 4 to reliably prevent the lid portion 4 from falling off the housing 3. Is done. Also, the engagement between the claw portion 35 and the engagement hole 44 allows the mounting substrate 2 to be kept pressed against the bottom plate 31 of the housing 3 even when the hand is released from the lid portion 4.

以上により、充填剤５の充填、実装基板２の収容、および蓋部４の装着が完了する。続いて、充填剤５に対する硬化処理を実行する。この硬化処理では、充填剤５の充填、実装基板２の収容、および蓋部４の装着が完了した筐体３（以下、「組立が完了した筐体３」ともいう）を図外の加熱装置にセットして硬化処理としての加熱処理を行う。この場合、上記したように、爪部３５と係合孔４４とが係合することで、筐体３からの蓋部４の脱落が確実に防止されると共に、実装基板２が筐体３の底板３１側に押え付けられた状態が維持されるため、筐体３と蓋部４とを固定用の部材等で固定するような作業を行うことなく、組立が完了した筐体３をそのまま加熱装置にセットして充填剤５に対する加熱処理を行うことができるため、製造効率を向上させることができる。   Thus, the filling of the filler 5, the housing of the mounting board 2, and the mounting of the lid 4 are completed. Subsequently, a curing process is performed on the filler 5. In this curing process, the housing 3 (hereinafter, also referred to as “assembled housing 3”) in which the filling of the filler 5, the housing of the mounting board 2, and the attachment of the cover 4 are completed is heated by an unillustrated heating device. And heat treatment as a curing treatment is performed. In this case, as described above, the engagement between the claw portion 35 and the engagement hole 44 reliably prevents the lid portion 4 from dropping from the housing 3 and also allows the mounting board 2 to Since the state of being pressed against the bottom plate 31 is maintained, the assembled housing 3 is directly heated without performing an operation of fixing the housing 3 and the lid 4 with a fixing member or the like. Since the heat treatment can be performed on the filler 5 by being set in the apparatus, the production efficiency can be improved.

上記の加熱処理（硬化処理）によって充填剤５が硬化してゲル状からゴム状に変化する。また、充填剤５が硬化することにより、実装基板２が筐体３に確実に固定される。これにより、コンバータ装置１が完成する。このコンバータ装置１では、上記したように、各電気部品２２同士の間の隙間や、各電気部品２２と実装面２１ａとの間の隙間に充填剤５が満遍なく充填されている。このため、このコンバータ装置１では、充填剤５の放熱機能を効果的に発揮させることが可能となっている。   The filler 5 is cured by the above-mentioned heat treatment (curing treatment) and changes from a gel state to a rubber state. In addition, when the filler 5 is cured, the mounting substrate 2 is securely fixed to the housing 3. Thereby, converter device 1 is completed. In the converter device 1, as described above, the gaps between the electric components 22 and the gaps between the electric components 22 and the mounting surface 21a are evenly filled with the filler 5. For this reason, in this converter device 1, it is possible to effectively exert the heat radiation function of the filler 5.

このように、このコンバータ装置１では、実装面２１ａが筐体３の底板３１に対向し、かつ筐体３の側板３２ａ，３２ｃに形成されたリブ３４に実装面２１ａが当接した状態で実装基板２が筐体３に収容され、底板３１と実装基板２の実装面２１ａとの間に充填剤５が充填され、蓋部４に設けられた突起部４３が実装基板２の基板２１の裏面２１ｂに当接して実装基板２を底板３１側に押え付けた状態で蓋部４が筐体３に装着されている。このため、このコンバータ装置１では、突起部４３による底板３１側への実装基板２の押え付けにより、各電気部品２２同士の間の隙間や、各電気部品２２と実装面２１ａとの間の隙間に充填剤５が満遍なく充填されている。したがって、このコンバータ装置１によれば、充填剤５の放熱機能を効果的に発揮させることができる。また、このコンバータ装置１によれば、実装面２１ａが底板３１に対向し、リブ３４に実装面２１ａが当接した状態で実装基板２が筐体３に収容されているため、実装基板２の基板２１を筐体３の開口部３３側に位置させることができる。したがって、このコンバータ装置１によれば、開口部３３側の水平面積を実装基板２の基板２１の面積に合わせて筐体３を形成することで、底板３１側の水平面積を基板２１の面積よりも狭くすることができる結果、筐体３を小形化することができる。   As described above, in the converter device 1, the mounting surface 21a is opposed to the bottom plate 31 of the housing 3, and the mounting surface 21a is in contact with the ribs 34 formed on the side plates 32a and 32c of the housing 3. The substrate 2 is accommodated in the housing 3, the filler 5 is filled between the bottom plate 31 and the mounting surface 21 a of the mounting substrate 2, and the protrusion 43 provided on the lid 4 is formed on the back surface of the substrate 21 of the mounting substrate 2. The lid portion 4 is mounted on the housing 3 in a state where the mounting substrate 2 is pressed against the bottom plate 31 side while being in contact with 21b. For this reason, in the converter device 1, the gap between the electric components 22 and the gap between the electric components 22 and the mounting surface 21 a are formed by pressing the mounting board 2 against the bottom plate 31 by the protrusion 43. Is filled with the filler 5 uniformly. Therefore, according to the converter device 1, the heat radiation function of the filler 5 can be effectively exhibited. According to the converter device 1, the mounting board 2 is housed in the housing 3 in a state where the mounting surface 21 a faces the bottom plate 31 and the mounting surface 21 a is in contact with the rib 34. The substrate 21 can be located on the opening 33 side of the housing 3. Therefore, according to this converter device 1, by forming casing 3 so that the horizontal area on the side of opening 33 is equal to the area of substrate 21 of mounting substrate 2, the horizontal area on the side of bottom plate 31 is smaller than the area of substrate 21. As a result, the size of the housing 3 can be reduced.

また、このコンバータ装置１によれば、筐体３を一面に開口部３３を有する直方体形状に形成したことにより、コンバータ装置１の配置スペースが直方体形状のときに、無駄な隙間を少なく抑えた状態でその配置スペースにコンバータ装置１を配置することができる。   Further, according to the converter device 1, since the housing 3 is formed in a rectangular parallelepiped shape having the opening 33 on one surface, when the arrangement space of the converter device 1 is a rectangular parallelepiped shape, useless gaps are reduced. Thus, converter device 1 can be arranged in the arrangement space.

また、このコンバータ装置１によれば、爪部３５を備えて筐体３を構成し、装着状態において爪部３５が係合する係合孔４４を備えて蓋部４を構成したことにより、筐体３の開口部３３に向けて蓋部４を押圧するだけで、爪部３５と係合孔４４とが係合して、筐体３からの蓋部４の脱落を確実に防止することができると共に、実装基板２を筐体３の底板３１側に押え付けた状態に維持することができる。また、爪部３５と係合孔４４とが係合するため、筐体３と蓋部４とを固定用の部材等で固定するような作業を行うことなく、充填剤５の充填、実装基板２の収容、および蓋部４の装着が完了した筐体３を例えば加熱装置にセットして充填剤５に対する加熱処理（硬化処理）を行うことができるため、製造効率を向上させることができる。 According to the converter device 1, the housing 3 is provided with the claw portions 35, and the lid portion 4 is provided with the engagement holes 44 with which the claw portions 35 are engaged in the mounted state, so that the housing 3 is provided. By simply pressing the lid 4 toward the opening 33 of the body 3, the claw 35 and the engaging hole 44 are engaged, and the drop of the lid 4 from the housing 3 can be reliably prevented. At the same time, the mounting board 2 can be kept pressed against the bottom plate 31 of the housing 3. Further, since the claw portion 35 and the engagement hole 44 are engaged, the filling of the filler 5 and the mounting board can be performed without performing an operation of fixing the housing 3 and the lid portion 4 with a fixing member or the like. Since the housing 3 in which the housing 2 has been accommodated and the lid 4 has been mounted can be set in, for example, a heating device to perform a heating process (curing process) on the filler 5, the production efficiency can be improved.

また、このコンバータ装置１によれば、底板３１の中心３１ａを対称点として点対称の形状に筐体３を形成したことにより、点対称の形状に形成されていない筐体３とは異なり、実装基板２を筐体３に収容する際に、筐体３の左右の向きを実装基板２の左右の向きに合わせるような作業を行う必要がないため、その分、製造効率を向上させることができる。   Further, according to the converter device 1, since the housing 3 is formed in a point-symmetrical shape with the center 31a of the bottom plate 31 as a point of symmetry, unlike the case 3 not formed in a point-symmetrical shape, the mounting is performed. When housing the substrate 2 in the housing 3, it is not necessary to perform an operation of matching the left and right directions of the housing 3 to the left and right directions of the mounting substrate 2, so that the manufacturing efficiency can be improved accordingly. .

また、このコンバータ装置製造方法によれば、筐体３内に流動性を有する状態の充填剤５を注入し、実装面２１ａが筐体３の底板３１に対向する姿勢で実装基板２を筐体３内に収容し、蓋部４を筐体３に装着する際に、蓋部４の突起部４３を実装基板２における基板２１の裏面２１ｂに当接させて、筐体３のリブ３４に実装面２１ａが当接するまで実装基板２を底板３１側に押え付け、その後に充填剤５を硬化させることにより、突起部４３による底板３１側への実装基板２の押え付けによって各電気部品２２同士の間の隙間や、各電気部品２２と実装面２１ａとの間の隙間に充填剤５を満遍なく充填させることができる。したがって、このコンバータ装置製造方法によれば、充填剤５の放熱機能を効果的に発揮させることができるコンバータ装置１を製造することができる。   Further, according to this converter device manufacturing method, the filler 5 in a fluid state is injected into the housing 3, and the mounting substrate 2 is mounted in a posture in which the mounting surface 21 a faces the bottom plate 31 of the housing 3. When the cover 4 is housed in the housing 3 and the cover 4 is mounted on the housing 3, the protrusion 43 of the cover 4 is brought into contact with the back surface 21 b of the board 21 of the mounting board 2 and mounted on the rib 34 of the housing 3. The mounting substrate 2 is pressed against the bottom plate 31 until the surface 21a contacts, and then the filler 5 is hardened, so that the projections 43 press the mounting substrate 2 against the bottom plate 31 so that the electric components 22 are connected to each other. The filler 5 can be uniformly filled in the gaps between the electrical components 22 and the gaps between the electric components 22 and the mounting surface 21a. Therefore, according to this converter device manufacturing method, it is possible to manufacture converter device 1 capable of effectively exhibiting the heat radiation function of filler 5.

なお、コンバータ装置およびコンバータ装置製造方法は、上記の構成および方法に限定されない。例えば、筐体３の側板３２ａ，３２ｃにそれぞれリブ３４を設けた例について上記したが、側板３２ｂ，３２ｄにそれぞれリブ３４を設けたり、４つの側板３２の全てにそれぞれリブ３４を設けたりする構成を採用することもできる。また、各側板３２に設けるリブ３４の数は、１つに限定されず、複数でもよい。また、平面視形状が点対称となるように筐体３を形成した例について上記したが、平面視形状が点対称とはならない構成の筐体３を採用することもできる。   Note that the converter device and the converter device manufacturing method are not limited to the above configuration and method. For example, although the example in which the ribs 34 are provided on the side plates 32a and 32c of the housing 3 is described above, the ribs 34 are provided on the side plates 32b and 32d, respectively, or the ribs 34 are provided on all the four side plates 32. Can also be adopted. The number of ribs 34 provided on each side plate 32 is not limited to one, and may be plural. Further, although the case where the case 3 is formed so that the shape in plan view is point-symmetric is described above, the case 3 having a configuration in which the shape in plan view does not become point-symmetric may be adopted.

また、側板３２ｂ，３２ｄに係合部としての爪部３５をそれぞれ形成し、主板４１における互いに対向する２つの縁部、および２つの側板４２ｂ，４２ｄに被係合部としての係合孔４４をそれぞれ形成した例について上記したが、爪部３５や係合孔４４の形成位置や数は任意に規定することができる。また、爪部３５や係合孔４４の形状も任意に変更することができる。また、蓋部４の主板４１に３つの突起部４３を設けた例について上記したが、突起部４３は３つに限定されず任意の数（１つ若しくは２つ、好ましくは３つ以上）に規定することができる。また、上記した他の構成の筐体３や蓋部４を備えるコンバータ装置、およびそのコンバータ装置製造方法を採用することができる。   Further, claw portions 35 as engagement portions are respectively formed on the side plates 32b and 32d, and two opposing edges of the main plate 41 and an engagement hole 44 as an engaged portion are formed on the two side plates 42b and 42d. As described above, the positions and numbers of the claw portions 35 and the engagement holes 44 can be arbitrarily defined. Further, the shapes of the claw portions 35 and the engagement holes 44 can be arbitrarily changed. Moreover, although the example in which the three protruding portions 43 are provided on the main plate 41 of the lid portion 4 is described above, the number of the protruding portions 43 is not limited to three and may be any number (one or two, preferably three or more). Can be specified. In addition, a converter device having the housing 3 and the lid portion 4 having another configuration described above, and a method of manufacturing the converter device can be adopted.

また、充填剤５の一例として、熱硬化型シリコーン樹脂を用いる構成および方法について上記したが、充填剤５はこれに限定されず、上記した構成および方法に適合する各種の充填剤５を用いることができる。   Further, as an example of the filler 5, the configuration and the method using a thermosetting silicone resin have been described above. However, the filler 5 is not limited to this, and various fillers 5 that are compatible with the configuration and the method described above may be used. Can be.

また、一面に開口部３３を有する直方体形状に筐体３を形成した例について上記したが、筐体３の形状は任意に規定することができる。例えば、一面に開口部を有する立方体形状に形成した筐体３や、一端部に開口部を有する円筒形状に形成した筐体を採用することができる。   In addition, although the case where the housing 3 is formed in a rectangular parallelepiped shape having the opening 33 on one surface is described above, the shape of the housing 3 can be arbitrarily defined. For example, a case 3 formed in a cubic shape having an opening on one surface or a case formed in a cylindrical shape having an opening on one end can be adopted.

１ コンバータ装置
２ 実装基板
３ 筐体
４ 蓋部
５ 充填剤
２１ 基板
２１ａ 実装面
２１ｂ 裏面
２２ 電気部品
３１ 底板
３１ａ 中心
３２ａ〜３２ｄ 側板
３３ 開口部
３４ リブ
３５ 爪部
４１ 主板
４３ 突起部
４４ 係合孔 REFERENCE SIGNS LIST 1 converter device 2 mounting board 3 housing 4 lid 5 filler 21 substrate 21 a mounting surface 21 b back surface 22 electric component 31 bottom plate 31 a center 32 a to 32 d side plate 33 opening 34 rib 35 claw 41 main plate 43 projection 44 engagement hole

Claims (6)

基板に電気部品が実装された実装基板と、一面に開口部を有して当該実装基板を収容する筐体と、前記開口部を覆うように前記筐体に装着される蓋部とを備え、当該筐体に収容された前記実装基板の前記電気部品を覆うように当該筐体内に充填剤が充填されて構成されたコンバータ装置であって、
前記筐体は、底板と当該底板の外周部に立設された第１側板とを備え、当該底板側から前記開口部側に向かうに従って水平面積が徐々に広くなり、かつ当該開口部側の水平面積を前記基板の面積に合わせた形状に形成されると共に、前記第１側板における互いに対向する内面に一対以上のリブが設けられ、かつ当該第１側板における前記開口部側の縁部に形成された係合部を備えて構成され、
前記実装基板は、前記電気部品が実装されている前記基板の実装面が前記底板に対向しかつ前記リブに前記実装面が当接した状態で前記筐体に収容され、
前記充填剤は、前記底板と前記実装基板の前記実装面との間に充填され、
前記蓋部は、前記筐体の前記開口部と略同形状の主板と当該主板の外周部に立設された第２側板とを備え、当該主板の内面に設けられた突起部を有し、かつ前記筐体に装着された状態において前記係合部が係合する被係合部を備えて構成されると共に、前記第２側板の内面が前記第１側板における前記開口部側の外面に接触し、かつ前記突起部が前記実装基板における前記基板の裏面に当接して当該実装基板を前記底板側に押え付けた状態で前記被係合部に前記係合部が係合させられて前記筐体に装着されているコンバータ装置。 A mounting board having an electrical component mounted on the board, a housing having an opening on one surface for housing the mounting board, and a lid attached to the housing so as to cover the opening, A converter device configured to be filled with a filler in the housing so as to cover the electrical components of the mounting board housed in the housing,
The housing includes a bottom plate and a first side plate erected on an outer peripheral portion of the bottom plate. A horizontal area gradually increases from the bottom plate side to the opening side, and a horizontal area on the opening side is increased . An area is formed in a shape corresponding to the area of the substrate, and at least one pair of ribs are provided on inner surfaces of the first side plate opposed to each other , and formed on an edge of the first side plate on the opening side. Comprising an engaging portion ,
The mounting board is housed in the housing in a state where the mounting surface of the board on which the electric component is mounted faces the bottom plate and the mounting surface is in contact with the rib,
The filler is filled between the bottom plate and the mounting surface of the mounting board,
The lid includes a main plate having substantially the same shape as the opening of the housing, and a second side plate erected on an outer peripheral portion of the main plate, and includes a projection provided on an inner surface of the main plate . and wherein the engaging portion in a state of being mounted to the housing is configured with a engaged portion for engaging Rutotomoni, contacts the outer surface of the opening side inner surface of the second side plate is in said first side plate And the engaging portion is engaged with the engaged portion in a state where the protrusion contacts the back surface of the substrate in the mounting substrate and presses the mounting substrate against the bottom plate, so that the casing is Converter device attached to the body. 前記筐体は、一面に開口部を有する直方体形状に形成されている請求項１記載のコンバータ装置。   The converter device according to claim 1, wherein the housing is formed in a rectangular parallelepiped shape having an opening on one surface. 前記筐体は、一面に開口部を有する立方体形状に形成されている請求項１記載のコンバータ装置。   The converter device according to claim 1, wherein the housing is formed in a cubic shape having an opening on one surface. 前記筐体は、一端部に開口部を有する円筒形状に形成されている請求項１記載のコンバータ装置。   The converter device according to claim 1, wherein the housing is formed in a cylindrical shape having an opening at one end. 前記筐体は、前記底板を平面視した平面視状態において当該底板の中心を対称点として点対称の形状に形成されている請求項１から４のいずれかに記載のコンバータ装置。 The converter device according to any one of claims 1 to 4 , wherein the housing is formed in a point-symmetrical shape with the center of the bottom plate as a symmetric point in a plan view state of the bottom plate. 基板に電気部品が実装された実装基板と、一面に開口部を有して当該実装基板を収容する筐体と、前記開口部を覆うように前記筐体に装着される蓋部とを備え、当該筐体に収容された前記実装基板の前記電気部品を覆うように当該筐体内に充填剤が充填されて構成されたコンバータ装置を製造するコンバータ装置製造方法であって、
底板と当該底板の外周部に立設された第１側板とを備えて当該第１側板における互いに対向する内面に一対以上のリブが設けられ、かつ当該第１側板における前記開口部側の縁部に形成された係合部を備えて構成された前記筐体内に流動性を有する状態の前記充填剤を注入し、
その後に、前記電気部品が実装されている前記基板の実装面が前記筐体の底板に対向する姿勢で前記実装基板を当該筐体内に収容し、
その後に、前記筐体の前記開口部と略同形状の主板と当該主板の外周部に立設された第２側板とを備えて当該主板の内面に突起部が設けられ、かつ前記筐体に装着された状態において前記係合部が係合する被係合部を備えた前記蓋部を当該開口部を覆うように前記筐体に装着する際に、前記第２側板の内面を前記第１側板における前記開口部側の外面に接触させ、かつ前記突起部を前記実装基板における前記基板の裏面に当接させて、前記リブに前記実装面が当接するまで前記実装基板を前記底板側に押え付けると共に前記係合部を前記被係合部に係合させ、
その後に、前記充填剤を硬化させて前記コンバータ装置を製造するコンバータ装置製造方法。 A mounting board having an electrical component mounted on the board, a housing having an opening on one surface for housing the mounting board, and a lid attached to the housing so as to cover the opening, A converter device manufacturing method for manufacturing a converter device configured to be filled with a filler in the housing so as to cover the electrical components of the mounting board housed in the housing,
A bottom plate and a first side plate erected on an outer peripheral portion of the bottom plate, at least one pair of ribs are provided on inner surfaces of the first side plate facing each other , and an edge of the first side plate on the opening side; Inject the filler in a state having fluidity into the casing configured with the engaging portion formed in ,
Thereafter, the mounting board is accommodated in the housing in a posture in which a mounting surface of the board on which the electric component is mounted faces a bottom plate of the housing,
After that, a projection is provided on the inner surface of the main plate including a main plate having substantially the same shape as the opening of the housing and a second side plate erected on an outer peripheral portion of the main plate , and the housing has When the lid provided with the engaged portion with which the engaging portion engages in the mounted state is mounted on the housing so as to cover the opening , the inner surface of the second side plate is moved to the first side. The mounting plate is pressed against the bottom plate until the mounting surface comes into contact with the ribs by contacting the outer surface of the side plate on the side of the opening and contacting the protrusion with the back surface of the substrate of the mounting substrate. Paste Rutotomoni the engaging portion is engaged with the engaged portion,
Then, the converter device manufacturing method of manufacturing the converter device by curing the filler.
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