JP6637892B2 - 離脱式波長変換器を含む発光デバイス - Google Patents
離脱式波長変換器を含む発光デバイス Download PDFInfo
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- JP6637892B2 JP6637892B2 JP2016543618A JP2016543618A JP6637892B2 JP 6637892 B2 JP6637892 B2 JP 6637892B2 JP 2016543618 A JP2016543618 A JP 2016543618A JP 2016543618 A JP2016543618 A JP 2016543618A JP 6637892 B2 JP6637892 B2 JP 6637892B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/08—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromatic; for reducing intensity of light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
- H05B45/18—Controlling the intensity of the light using temperature feedback
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
- H05B45/24—Controlling the colour of the light using electrical feedback from LEDs or from LED modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/105—Controlling the light source in response to determined parameters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0003—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being doped with fluorescent agents
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Semiconductor Lasers (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Description
Claims (13)
- ロック機構を含む支持構造体と、
前記支持構造体に接触して配置される光源と、
第1の波長範囲から第2の波長範囲に光を変換し、光を受け取る光入射面と光を放射する光出射面とを有する波長変換器と、
を含み、
前記波長変換器は、前記ロック機構を介してロック位置にある前記支持構造体に離脱可能に接続され、前記波長変換器の前記光出射面が、前記波長変換器の前記光入射面に対して、非ゼロの角度を有し、前記光出射面の面積が、前記波長変換器の前記光入射面の面積よりも小さくなるように、前記支持構造体によって部分的に取り囲まれ、前記光入射面は、前記光源と光学的に接触して配置される、照明デバイス。 - 前記支持構造体は、前記光源に熱的に結合されるヒートシンクを含む、請求項1に記載の照明デバイス。
- 前記波長変換器は、100マイクロメートル未満である空隙によって、前記ヒートシンクから離されている、請求項2に記載の照明デバイス。
- 前記支持構造体は更に、第1の部分と第2の部分とを含み、前記第1の部分は、前記ロック機構が前記第1の部分を、前記第2の部分に対して固定位置に維持し、これにより、前記波長変換器が前記第1の部分と前記第2の部分との間に保持される位置になるように、前記第2の部分に向かって移動可能である、請求項1に記載の照明デバイス。
- 前記光源と前記波長変換器の前記光入射面との間であって、かつ、前記光源と前記波長変換器の前記光入射面とに接触して配置され、前記光源からの光を前記波長変換器に導く光学要素を更に含む、請求項4に記載の照明デバイス。
- 前記光学要素は、1.4よりも低い屈折率を有する、請求項5に記載の照明デバイス。
- 前記波長変換器と前記支持構造体との間であって、かつ、前記波長変換器と前記支持構造体とに接触して配置される光学要素を更に含み、前記光学要素は、前記光学要素と前記波長変換器との界面において屈折される光を反射する、請求項3に記載の照明デバイス。
- 前記光学要素の厚さは、100マイクロメートル未満である、請求項5又は7に記載の照明デバイス。
- 前記光学要素は、熱伝導性であり、約1W/mKを上回る熱伝導率を有する、請求項5又は7に記載の照明デバイス。
- 前記支持構造体は、第2の部分に旋回可能に接続される第1の部分を含み、前記第1の部分は、ロック位置となるように、前記第2の部分に向かって旋回可能であり、これにより、前記波長変換器が前記第1の部分と前記第2の部分との間に保持される、請求項1に記載の照明デバイス。
- 前記支持構造体は更に、突出部を含み、前記波長変換器は、前記突出部に対応する凹部を含み、前記突出部は、前記波長変換器を前記支持構造体に対してロック位置に保持するように前記凹部に係合する、請求項1に記載の照明デバイス。
- 前記支持構造体は更に、突出部を含み、前記波長変換器は更に、前記波長変換器を部分的に取り囲む熱伝導層を含み、前記熱伝導層は、前記波長変換器が前記支持構造体に接続されると、前記支持構造体に接触し、前記熱伝導層は、前記突出部に対応する凹部を含み、前記突出部は、前記波長変換器を前記支持構造体に対してロック位置に保持するように前記凹部に係合する、請求項1に記載の照明デバイス。
- 前記光出射面に光学的に接続され、前記波長変換器を、光方向転換要素と前記支持構造体との間に離脱可能に保持する前記光方向転換要素を更に含む、請求項1に記載の照明デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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EP14150006.6 | 2014-01-02 | ||
EP14150006 | 2014-01-02 | ||
PCT/EP2014/078939 WO2015101535A1 (en) | 2014-01-02 | 2014-12-22 | Light emitting device comprising releasable wavelength converter |
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JP2017507475A JP2017507475A (ja) | 2017-03-16 |
JP2017507475A5 JP2017507475A5 (ja) | 2018-02-08 |
JP6637892B2 true JP6637892B2 (ja) | 2020-01-29 |
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Country Status (5)
Country | Link |
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US (1) | US9722152B2 (ja) |
EP (1) | EP3090451B1 (ja) |
JP (1) | JP6637892B2 (ja) |
CN (1) | CN105874616B (ja) |
WO (1) | WO2015101535A1 (ja) |
Families Citing this family (8)
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US9722152B2 (en) * | 2014-01-02 | 2017-08-01 | Philips Lighting Holding B.V. | Light emitting device comprising releasable wavelength converter |
CN106998201B (zh) * | 2016-01-22 | 2020-06-09 | 清华大学 | 光识别开关装置 |
JP6672024B2 (ja) * | 2016-03-08 | 2020-03-25 | キヤノン株式会社 | 光源装置、画像投射装置および光源色制御プログラム |
EP3309446A1 (en) * | 2016-10-17 | 2018-04-18 | Lumileds Holding B.V. | Light converting device with clamped light converter |
JP2019035886A (ja) * | 2017-08-18 | 2019-03-07 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法、波長変換部材の母材、並びに発光デバイス |
EP3775680B1 (en) | 2018-03-29 | 2021-12-01 | Signify Holding B.V. | Single-sided illumination of high lumen density lamps |
WO2020078790A1 (en) | 2018-10-16 | 2020-04-23 | Signify Holding B.V. | Hld module with improved thermal performance |
US11899233B2 (en) | 2019-06-21 | 2024-02-13 | Signify Holding B.V. | HLD module with cavity for improved light coupling |
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JP5158472B2 (ja) | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
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WO2011122655A1 (ja) | 2010-03-30 | 2011-10-06 | 三菱化学株式会社 | 発光装置 |
JP4916564B2 (ja) * | 2010-04-07 | 2012-04-11 | 三菱電機照明株式会社 | 発光装置 |
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TWM452305U (zh) * | 2012-12-12 | 2013-05-01 | Genesis Photonics Inc | 發光裝置 |
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WO2015010318A1 (zh) * | 2013-07-26 | 2015-01-29 | Liu Zongxi | 充气垫结构 |
US9722152B2 (en) * | 2014-01-02 | 2017-08-01 | Philips Lighting Holding B.V. | Light emitting device comprising releasable wavelength converter |
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2014
- 2014-12-22 US US15/103,354 patent/US9722152B2/en active Active
- 2014-12-22 CN CN201480072123.4A patent/CN105874616B/zh active Active
- 2014-12-22 JP JP2016543618A patent/JP6637892B2/ja active Active
- 2014-12-22 WO PCT/EP2014/078939 patent/WO2015101535A1/en active Application Filing
- 2014-12-22 EP EP14815765.4A patent/EP3090451B1/en active Active
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Publication number | Publication date |
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EP3090451B1 (en) | 2020-03-11 |
CN105874616B (zh) | 2019-05-10 |
WO2015101535A1 (en) | 2015-07-09 |
JP2017507475A (ja) | 2017-03-16 |
CN105874616A (zh) | 2016-08-17 |
US20160315232A1 (en) | 2016-10-27 |
EP3090451A1 (en) | 2016-11-09 |
US9722152B2 (en) | 2017-08-01 |
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