JP6606017B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP6606017B2 JP6606017B2 JP2016113501A JP2016113501A JP6606017B2 JP 6606017 B2 JP6606017 B2 JP 6606017B2 JP 2016113501 A JP2016113501 A JP 2016113501A JP 2016113501 A JP2016113501 A JP 2016113501A JP 6606017 B2 JP6606017 B2 JP 6606017B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temperature
- wafer
- polishing
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
空吸着させるとき、テーブルの平坦でない部分と基板とは接触しない。そのため、テーブルと基板との間に隙間が生じ、この隙間からエアーが漏れ、基板の吸着率が低くなることがある。また、テーブルに使用される材料は一般的に高硬度材料なので、テーブルに接触する基板の裏面はダメージを受けやすい。一方、基板の裏面へのダメージを低減するために、比較的に硬度の低い樹脂でテーブルを構成することもあるが、樹脂製のテーブルの場合、一般的に平坦性が悪くなる。
領域を有し、前記ヒーターは、前記テーブルの前記複数の領域に対応する位置に配置される複数のヒーターを有し、前記制御装置は、前記複数のヒーターをそれぞれ独立に制御するように構成される。かかる形態によれば、基板の表面に所望の温度分布を形成することができ、基板の処理速度を領域ごとに制御することができる。
いる。本実施形態では、ヘッド30の寸法は、ウェハWfの寸法よりも小さい。すなわち、ヘッド30からウェハWfに向けて投影した場合のヘッド30の投影面積は、ウェハWfの面積よりも小さい。また、ヘッド30は、駆動部すなわちアクチュエータ(図示省略)によって回転可能に構成されている。また、ヘッド30の触媒をウェハWfに接触摺動させるために、ヘッド30をウェハWfに対して昇降させるモータやエアシリンダを揺動アーム50内に備えている(図示省略)。
持しつつテーブル表面の硬さを緩和するために、樹脂製フィルム28の厚さは約30μmから約500μmであることが望ましい。
20…テーブル
22…通路
24…上面
26…開口部
28…樹脂製フィルム
29…貫通孔
30…ヘッド
33…パッド
40…処理液供給部
50…揺動アーム
51…回転中心
100…ヒーター
150…温度センサ
200…コンディショニング部
300…制御部
Wf…ウェハ
PL…処理液
Claims (4)
- 研磨装置であって、
基板を保持するためのテーブルと、
前記研磨装置は、前記テーブルの上面に取り付けられる樹脂フィルムと、
前記テーブルの内部に設けられるヒーターと、を有し、
前記テーブルの前記上面はセラミックスから形成され、前記テーブルの前記上面は、真空源に接続可能な開口部を有し、
前記樹脂フィルムはポリイミドから形成され、前記テーブルの前記上面に取り付けられたときに前記テーブルの開口部に対応する位置に、貫通孔が形成される、
研磨装置。 - 請求項1に記載の研磨装置であって、
前記テーブル上に保持された基板の表面温度を測定するための温度センサを有する、
研磨装置。 - 請求項2に記載の研磨装置であって、
前記温度センサおよび前記ヒーターと連絡可能な制御装置を有し、
前記制御装置は、前記温度センサで測定された温度に基づいて前記ヒーターを制御するように構成される、
研磨装置。 - 請求項3に記載の研磨装置であって、
前記テーブルは複数の領域を有し、
前記ヒーターは、前記テーブルの前記複数の領域に対応する位置に配置される複数のヒーターを有し、
前記制御装置は、前記複数のヒーターをそれぞれ独立に制御するように構成される、
研磨装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016113501A JP6606017B2 (ja) | 2016-06-07 | 2016-06-07 | 基板処理装置 |
US15/615,475 US20170352573A1 (en) | 2016-06-07 | 2017-06-06 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016113501A JP6606017B2 (ja) | 2016-06-07 | 2016-06-07 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017217723A JP2017217723A (ja) | 2017-12-14 |
JP6606017B2 true JP6606017B2 (ja) | 2019-11-13 |
Family
ID=60482505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016113501A Active JP6606017B2 (ja) | 2016-06-07 | 2016-06-07 | 基板処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20170352573A1 (ja) |
JP (1) | JP6606017B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7254412B2 (ja) * | 2018-12-11 | 2023-04-10 | 株式会社ディスコ | 被加工物の加工方法および樹脂シートユニット |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3273773B2 (ja) * | 1999-08-12 | 2002-04-15 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ |
US6561881B2 (en) * | 2001-03-15 | 2003-05-13 | Oriol Inc. | System and method for chemical mechanical polishing using multiple small polishing pads |
US20040149226A1 (en) * | 2003-01-30 | 2004-08-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate clamp ring with removable contract pads |
US7914202B2 (en) * | 2006-11-29 | 2011-03-29 | Sokudo Co., Ltd. | First detecting sheet and first thermometric system for detecting and measuring temperature of an object under test, second detecting sheet and second thermometric system for detecting and measuring temperature of a dummy substrate, and heat treatment apparatus using same |
JP6180510B2 (ja) * | 2012-04-26 | 2017-08-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Escの接着剤の浸食を防止するための方法及び装置 |
KR102202331B1 (ko) * | 2014-10-03 | 2021-01-13 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 처리 장치 및 처리 방법 |
-
2016
- 2016-06-07 JP JP2016113501A patent/JP6606017B2/ja active Active
-
2017
- 2017-06-06 US US15/615,475 patent/US20170352573A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20170352573A1 (en) | 2017-12-07 |
JP2017217723A (ja) | 2017-12-14 |
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