JP6533624B2 - Led発光ユニット、led発光パネル及びledディスプレイスクリーン - Google Patents
Led発光ユニット、led発光パネル及びledディスプレイスクリーン Download PDFInfo
- Publication number
- JP6533624B2 JP6533624B2 JP2018520014A JP2018520014A JP6533624B2 JP 6533624 B2 JP6533624 B2 JP 6533624B2 JP 2018520014 A JP2018520014 A JP 2018520014A JP 2018520014 A JP2018520014 A JP 2018520014A JP 6533624 B2 JP6533624 B2 JP 6533624B2
- Authority
- JP
- Japan
- Prior art keywords
- drive
- layer
- led chip
- led
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 claims description 64
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene vinyl acetate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/06102—Disposition the bonding areas being at different heights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4905—Shape
- H01L2224/49051—Connectors having different shapes
- H01L2224/49052—Different loop heights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10157—Shape being other than a cuboid at the active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- General Engineering & Computer Science (AREA)
Description
前記LEDチップ及び駆動ICがいずれも前記複合層の前側に実装され、前記LEDチップの負極引出リード線が前記駆動ICに接続され、前記複合層の前側に複数のブラインドホールが開設され、前記LEDチップの正極が1つの前記ブラインドホールを介して複合層の内部から正電極に接続され、前記駆動ICのVDDピン引出リード線が1つの前記ブラインドホールを介して複合層の内部から前記正電極に接続され、前記駆動ICのGNDピン引出リード線が1つの前記ブラインドホールを介して複合層の内部から負電極に接続され、前記駆動ICが信号線に接続され、前記信号線は前記駆動ICの信号伝送用のものであり、
前記LEDチップの負極引出リード線、前記駆動ICのVDDピン引出リード線、前記駆動ICのGNDピン引出リード線、及び前記信号線はいずれもボンディングされるゴールドワイヤーである。
図1は本開示の実施形態に係るLED発光ユニットの第1の実施例の正面図である。図1に示すように、該LED発光ユニットは、複合層10と、LEDチップ30を含む少なくとも1つのLEDチップセットと、少なくとも1つの駆動IC20とを含み、前記複合層10は前側に位置する基板11を含み、
前記LEDチップ30及び駆動IC20がいずれも前記複合層10の前側に実装され、前記LEDチップ30の負極引出リード線31が前記駆動IC20に接続され、前記複合層10の前側に複数のブラインドホールが開設され、前記LEDチップ30の正極が1つの前記ブラインドホールを介して複合層10の内部から正電極121に接続され、前記駆動IC20のVDDピン引出リード線31が1つの前記ブラインドホールを介して複合層10の内部から正電極121に接続され、前記駆動IC20のGNDピン引出リード線31が1つの前記ブラインドホールを介して複合層10の内部から負電極122に接続され、前記駆動IC20同士が信号線22を介して接続される。
図2及び図3はそれぞれ本開示の実施形態に係るLED発光ユニットの第2の実施例の正面図及び電極分布模式図である。図2に示すように、LEDチップセットはR−LEDチップ、G−LEDチップ及びB−LEDチップを含む。
前記電極層に正電極121及び負電極122が設置され、前記基板11に前記正電極121又は負電極122に到達する複数のブラインドホールが開設される。
図4は、本開示の実施形態に係るLED発光ユニットの第3の実施例の内部構造模式図である。本実施例の内部構造模式図は第2の実施例の図2のLEDチップセットのレイアウト方式に基づいて実現されるものである。図4に示すように、前記複合層10は、前記基板11の後側に順に設置された第1の電極層、第1の絶縁層13、第2の電極層及び第2の絶縁層15をさらに含み、前記第1の電極層と第2の電極層のうちの一方が正電極121として設置され、他方が負電極122として設置され、前記ブラインドホールは、前記基板11を貫通して正電極121に到達する第1のブラインドホールと、前記基板11を貫通して負電極122に到達する第2のブラインドホールとを含み、前記LEDチップ30の正極引出リード線31が前記第1のブラインドホールを介して前記正電極121に接続され、前記駆動IC20のVDDピン引出リード線31が前記第1のブラインドホールを介して前記正電極121に接続され、前記駆動IC20のGNDピン引出リード線31が前記第2のブラインドホールを介して前記負電極122に接続される。
図5及び図6は、それぞれ本開示の実施形態に係る第4の実施例の正面図及び内部構造模式図である。図5に示すように、5個のLEDチップセットが1つの発光セットを構成し、各発光セットが1つの駆動IC20に対応し、各発光セットが隣接する2行に位置し、一方の行に2つのLEDチップセットがあり、他方の行に3つのLEDチップセットがあり、前記駆動IC20が前記隣接する2行の間に設置される。
図7は、本開示の実施形態に係る第5の実施例の内部構造模式図である。図に示すように、R−LEDチップが銀ペーストを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッド40に実装され、前記G−LEDチップ及びB−LEDチップが絶縁グルーを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッド40に実装される。
11 基板
12 電極層
121 正電極
122 負電極
13 第1の絶縁層
14 第3の絶縁層
15 第2の絶縁層
16 信号配線層
20 駆動IC
21 信号ピン
22 信号線
30 LEDチップ
31 リード線
40 ボンディングパッド
Claims (17)
- LED発光ユニットであって、複合層(10)と、LEDチップ(30)を含む少なくとも1つのLEDチップセットと、少なくとも1つの駆動IC(20)とを含み、前記複合層(10)は前側に位置する基板(11)を含み、
前記LEDチップ(30)及び駆動IC(20)がいずれも前記複合層(10)の前側に実装され、前記LEDチップ(30)の負極引出リード線(31)が前記駆動IC(20)に接続され、前記複合層(10)の前側に複数のブラインドホールが開設され、前記LEDチップ(30)の正極が1つの前記ブラインドホールを介して複合層(10)の内部から正電極(121)に接続され、前記駆動IC(20)のVDDピン引出リード線(31)が1つの前記ブラインドホールを介して複合層(10)の内部から前記正電極(121)に接続され、前記駆動IC(20)のGNDピン引出リード線(31)が1つの前記ブラインドホールを介して複合層(10)の内部から負電極(122)に接続され、前記駆動IC(20)が信号線(22)に接続され、前記信号線(22)は前記駆動IC(20)の信号伝送用のものであり、
前記LEDチップ(30)の負極引出リード線(31)、前記駆動IC(20)のVDDピン引出リード線(31)、前記駆動IC(20)のGNDピン引出リード線(31)、及び前記信号線(22)はいずれもボンディングされるゴールドワイヤーである、LED発光ユニット。 - 前記複合層(10)が透明複合層である請求項1に記載のLED発光ユニット。
- 各前記LEDチップセットが1つの駆動IC(20)に対応し、前記LEDチップセットと駆動IC(20)が行別に間隔的に配列される請求項2に記載のLED発光ユニット。
- 複数のアレイ状に分布するLEDチップセットを含む請求項2に記載のLED発光ユニット。
- 2×1、2×2又は2×3ずつのLEDチップセットが1つの発光セットを構成し、各発光セットが1つの駆動IC(20)に対応し、前記駆動IC(20)が前記発光セットの平面中心に設置される請求項4に記載のLED発光ユニット。
- 5個ずつのLEDチップセットが1つの発光セットを構成し、各発光セットが1つの駆動IC(20)に対応し、各発光セットが隣接する2行に位置し、一方の行に2つのLEDチップセットがあり、他方の行に3つのLEDチップセットがあり、前記駆動IC(20)が前記隣接する2行の間に設置される請求項4に記載のLED発光ユニット。
- 前記駆動IC(20)はパッケージングされていないベアチップである請求項1〜6のいずれか一項に記載のLED発光ユニット。
- 前記複合層(10)は、前記基板(11)の後側に順に設置された電極層及び第2の絶縁層(15)をさらに含み、
前記電極層に前記正電極(121)及び前記負電極(122)が設置され、前記基板(11)に前記正電極(121)又は前記負電極(122)に到達する複数のブラインドホールが開設される請求項1〜6のいずれか一項に記載のLED発光ユニット。 - 前記複合層(10)は、前記基板(11)の後側に順に設置された第1の電極層、第1の絶縁層(13)、第2の電極層及び第2の絶縁層(15)をさらに含み、前記第1の電極層と第2の電極層のうちの一方が前記正電極(121)として設置され、他方が前記負電極(122)として設置され、前記ブラインドホールは、前記基板(11)を貫通して前記正電極(121)に到達する第1のブラインドホールと、前記基板(11)を貫通して前記負電極(122)に到達する第2のブラインドホールとを含み、前記LEDチップ(30)の正極引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のVDDピン引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のGNDピン引出リード線(31)が前記第2のブラインドホールを介して前記負電極(122)に接続される請求項1〜6のいずれか一項に記載のLED発光ユニット。
- 前記複合層(10)は、前記基板(11)の後側に順に設置された第1の電極層、第1の絶縁層(13)、第2の電極層及び第2の絶縁層(15)をさらに含み、前記第1の電極層と第2の電極層のうちの一方が前記正電極(121)として設置され、他方が前記負電極(122)として設置され、前記ブラインドホールは、前記基板(11)を貫通して前記正電極(121)に到達する第1のブラインドホールと、前記基板(11)を貫通して前記負電極(122)に到達する第2のブラインドホールとを含み、前記LEDチップ(30)の正極引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のVDDピン引出リード線(31)が前記第1のブラインドホールを介して前記正電極(121)に接続され、前記駆動IC(20)のGNDピン引出リード線(31)が前記第2のブラインドホールを介して前記負電極(122)に接続され、前記複合層(10)は、第3の絶縁層(14)と、前記第3の絶縁層(14)を介して前記第1の電極層又は第2の電極層と絶縁する信号配線層(16)とをさらに含み、前記ブラインドホールは、前記基板(11)を貫通して前記信号配線層(16)に到達する第3のブラインドホールを含み、前記信号線(22)が前記信号配線層(16)に設置された信号パターン層であり、前記駆動IC(20)の信号ピン(21)の引出リード線(31)が前記第3のブラインドホールを介して前記信号パターン層に接続される請求項1〜6のいずれか一項に記載のLED発光ユニット。
- 前記複合層(10)は少なくとも2層の前記信号配線層(16)及び少なくとも2層の前記第3の絶縁層(14)を含む請求項10に記載のLED発光ユニット。
- 前記ブラインドホールの底部にボンディングパッド(40)が設置され、前記LEDチップ(30)の正極引出リード線(31)、前記駆動IC(20)のVDDピン引出リード線(31)、前記駆動IC(20)のGNDピン引出リード線(31)、及び前記駆動IC(20)の信号ピン(21)の引出リード線(31)が前記ボンディングパッド(40)を介して前記複合層(10)に電気的に接続される請求項10に記載のLED発光ユニット。
- 1つの前記LEDチップセットはR−LEDチップ、G−LEDチップ及びB−LEDチップを含む請求項12に記載のLED発光ユニット。
- 前記R−LEDチップが銀ペーストを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッドに実装され、前記G−LEDチップ及びB−LEDチップが絶縁グルーを用いたダイボンディングによって前記第1のブラインドホールに対応する第1のボンディングパッドに実装される請求項13に記載のLED発光ユニット。
- 前記LEDチップ(30)及び駆動IC(20)がCOB又はCOGプロセスによって前記基板(11)に実装され、前記基板(11)の前側に透明シーラントが被覆される請求項1に記載のLED発光ユニット。
- 少なくとも2つの請求項1〜15のいずれか一項に記載のLED発光ユニットを含むLED発光パネル。
- 請求項16に記載のLED発光パネルを含むLEDディスプレイスクリーン。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510400412.9A CN104979326B (zh) | 2015-07-09 | 2015-07-09 | Led发光组件、led发光面板和led显示屏 |
PCT/CN2016/098611 WO2017005225A2 (zh) | 2015-07-09 | 2016-09-09 | Led发光组件、led发光面板和led显示屏 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018530792A JP2018530792A (ja) | 2018-10-18 |
JP6533624B2 true JP6533624B2 (ja) | 2019-06-19 |
Family
ID=54275696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018520014A Active JP6533624B2 (ja) | 2015-07-09 | 2016-09-09 | Led発光ユニット、led発光パネル及びledディスプレイスクリーン |
Country Status (6)
Country | Link |
---|---|
US (1) | US10388638B2 (ja) |
EP (1) | EP3321961A4 (ja) |
JP (1) | JP6533624B2 (ja) |
CN (1) | CN104979326B (ja) |
RU (1) | RU2680257C1 (ja) |
WO (1) | WO2017005225A2 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104979326B (zh) | 2015-07-09 | 2017-12-05 | 深圳市晶泓科技有限公司 | Led发光组件、led发光面板和led显示屏 |
RU2690769C1 (ru) | 2015-08-06 | 2019-06-05 | И Линь | Светодиодный пиксельный элемент, светоизлучающий компонент, светоизлучающая панель и экран дисплея |
FR3069089B1 (fr) * | 2017-07-13 | 2019-08-09 | Thales | Afficheur transparent a matrice active comportant des pixels emissifs a diodes electroluminescentes colorees |
CN109272877A (zh) * | 2018-07-31 | 2019-01-25 | 深圳市创显光电有限公司 | 一种高集成度的led显示装置 |
CN109103176A (zh) * | 2018-08-10 | 2018-12-28 | 深圳市晶泓科技有限公司 | 一种led发光组件、led发光面板以及led显示屏 |
CN109087910A (zh) * | 2018-08-10 | 2018-12-25 | 深圳市晶泓科技有限公司 | 一种led发光组件、led发光面板以及led显示屏 |
CN112673411B (zh) * | 2018-09-07 | 2023-10-10 | 株式会社半导体能源研究所 | 显示装置、显示模块及电子设备 |
CN113661783A (zh) * | 2019-03-28 | 2021-11-16 | 昕诺飞控股有限公司 | 用于颜色混合的多层pcb堆叠 |
CN110838266A (zh) * | 2019-11-20 | 2020-02-25 | 江苏上达电子有限公司 | 基于内埋晶体管高分辨率点阵式电子驱动基板设计方法 |
TWI715323B (zh) * | 2019-12-02 | 2021-01-01 | 友達光電股份有限公司 | 顯示裝置 |
CN113724633A (zh) | 2020-05-26 | 2021-11-30 | 京东方科技集团股份有限公司 | 一种驱动芯片及显示装置 |
CN111653556B (zh) * | 2020-07-09 | 2024-06-04 | 李�浩 | 一种可视有色线路透明发光组件 |
RU2739704C1 (ru) * | 2020-09-29 | 2020-12-28 | Дмитрий Николаевич Карпенко | Устройство и система модульного равномерного освещения |
KR20220069690A (ko) * | 2020-11-20 | 2022-05-27 | 삼성전자주식회사 | 디스플레이 모듈, 디스플레이 장치 및 그 제조방법 |
CN214147795U (zh) * | 2021-01-11 | 2021-09-07 | 黄萍 | 信号串联的移位寄存贴片发光二极管灯珠用印制电路板 |
CN112992879B (zh) * | 2021-02-10 | 2023-10-17 | Tcl华星光电技术有限公司 | 阵列基板、背光模组及显示面板 |
CN113113526B (zh) * | 2021-04-16 | 2022-11-25 | 安徽精卓光显技术有限责任公司 | 一种小尺寸led透明显示屏及其生产方法 |
CN113809063A (zh) * | 2021-09-17 | 2021-12-17 | 深圳市兆驰晶显技术有限公司 | 一种微间距led灯板及led灯板晶元植入方法 |
CN114863868B (zh) * | 2022-03-27 | 2023-04-25 | 深圳市美矽微半导体有限公司 | 一种led载板及其显示设备 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2942398B2 (ja) * | 1991-09-17 | 1999-08-30 | 電気化学工業株式会社 | マトリックス回路基板 |
US7579629B2 (en) | 2003-04-01 | 2009-08-25 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
KR101171178B1 (ko) * | 2005-01-04 | 2012-08-06 | 삼성전자주식회사 | 커팅 패턴이 형성된 가요성 인쇄회로기판용 원판 및 이를커팅한 가요성 인쇄회로기판을 구비한 평판표시장치 |
CN2817077Y (zh) | 2005-03-23 | 2006-09-13 | 柯雅慧 | 二极管封装结构 |
CN100550370C (zh) * | 2006-09-29 | 2009-10-14 | 宝创科技股份有限公司 | 发光二极管发光装置的平面结构 |
US20080151143A1 (en) | 2006-10-19 | 2008-06-26 | Intematix Corporation | Light emitting diode based backlighting for color liquid crystal displays |
JP5038997B2 (ja) * | 2008-09-02 | 2012-10-03 | 本田技研工業株式会社 | 車両用操舵装置 |
JP4916578B2 (ja) * | 2008-10-07 | 2012-04-11 | シャープ株式会社 | 表示装置及びその製造方法、並びにアクティブマトリクス基板 |
US20110205716A1 (en) * | 2008-11-19 | 2011-08-25 | Hiroyuki Moriwaki | Circuit substrate, display panel and display device |
JP5216602B2 (ja) * | 2009-01-08 | 2013-06-19 | 株式会社日立製作所 | 画像表示装置 |
US8094102B2 (en) * | 2009-01-18 | 2012-01-10 | Apa Electronic Co.,Ltd. | Single full-color LED with driving mechanism |
US8322882B2 (en) * | 2010-09-22 | 2012-12-04 | Bridgelux, Inc. | Flexible distributed LED-based light source and method for making the same |
CN202282120U (zh) * | 2011-09-14 | 2012-06-20 | 北京富卓电子科技股份有限公司 | 高清led矩阵显示屏 |
CN202551491U (zh) * | 2012-03-23 | 2012-11-21 | 深圳市三德冠精密电路科技有限公司 | 一种用于制作连续led灯条的柔性线路板 |
EP2860777B1 (en) * | 2012-06-07 | 2021-09-15 | Shikoku Instrumentation Co., Ltd. | Led illumination module and led illumination apparatus |
KR101983374B1 (ko) * | 2012-11-06 | 2019-08-29 | 삼성디스플레이 주식회사 | 표시 패널, 칩 온 필름, 및 이들을 포함하는 표시 장치 |
CN103065560B (zh) * | 2013-01-11 | 2015-09-09 | 深圳市晶泓科技有限公司 | 一种led显示屏显示单元及其生产方法 |
US8916902B2 (en) * | 2013-04-17 | 2014-12-23 | Ubleds Co., Ltd. | LED module packaging structure with an IC chip |
JP6128046B2 (ja) * | 2014-03-31 | 2017-05-17 | ソニー株式会社 | 実装基板および電子機器 |
CN203800046U (zh) | 2014-04-11 | 2014-08-27 | 广东威创视讯科技股份有限公司 | 一种灯驱合一的led封装器件 |
CN103996676B (zh) * | 2014-06-05 | 2018-02-13 | 广东威创视讯科技股份有限公司 | 一种led封装结构 |
TWI733238B (zh) * | 2014-06-18 | 2021-07-11 | 愛爾蘭商艾克斯展示公司技術有限公司 | 微組裝發光二極體顯示器及照明元件 |
CN204857715U (zh) * | 2015-07-09 | 2015-12-09 | 林谊 | Led发光组件、led发光面板和led显示屏 |
CN104979326B (zh) | 2015-07-09 | 2017-12-05 | 深圳市晶泓科技有限公司 | Led发光组件、led发光面板和led显示屏 |
CN205016161U (zh) * | 2015-08-06 | 2016-02-03 | 林谊 | Led像素点、发光组件、发光面板和显示屏 |
-
2015
- 2015-07-09 CN CN201510400412.9A patent/CN104979326B/zh active Active
-
2016
- 2016-09-09 US US15/743,137 patent/US10388638B2/en active Active
- 2016-09-09 WO PCT/CN2016/098611 patent/WO2017005225A2/zh active Application Filing
- 2016-09-09 JP JP2018520014A patent/JP6533624B2/ja active Active
- 2016-09-09 EP EP16820876.7A patent/EP3321961A4/en not_active Withdrawn
- 2016-09-09 RU RU2018104444A patent/RU2680257C1/ru not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US10388638B2 (en) | 2019-08-20 |
JP2018530792A (ja) | 2018-10-18 |
WO2017005225A2 (zh) | 2017-01-12 |
WO2017005225A3 (zh) | 2017-02-02 |
US20190107271A1 (en) | 2019-04-11 |
CN104979326B (zh) | 2017-12-05 |
EP3321961A4 (en) | 2019-03-06 |
CN104979326A (zh) | 2015-10-14 |
RU2680257C1 (ru) | 2019-02-19 |
EP3321961A2 (en) | 2018-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6533624B2 (ja) | Led発光ユニット、led発光パネル及びledディスプレイスクリーン | |
JP6561398B2 (ja) | Led画素点、発光ユニット、発光パネル及びディスプレイスクリーン | |
US20090251040A1 (en) | Transparent electric sign and chip led applied thereto | |
CN113327516B (zh) | 显示面板及显示装置 | |
CN101340777A (zh) | 柔性印刷电路板和使用其的液晶显示装置及其制造方法 | |
CN205016161U (zh) | Led像素点、发光组件、发光面板和显示屏 | |
CN112992879A (zh) | 阵列基板、背光模组及显示面板 | |
CN111047993A (zh) | 一种可弯曲透明led显示屏及加工方法 | |
CN204857715U (zh) | Led发光组件、led发光面板和led显示屏 | |
TWI764096B (zh) | 雙面顯示封裝結構 | |
JP6872769B2 (ja) | Ledディスプレイ装置 | |
CN113964149B (zh) | 显示面板及其制备方法、显示装置 | |
TWM619393U (zh) | 柔性透明顯示屏及其柔性線路板 | |
TWI789756B (zh) | 柔性透明顯示屏及其柔性線路板 | |
TWI832429B (zh) | 柔性透明顯示屏及其柔性線路板 | |
TWI822335B (zh) | 柔性透明顯示屏及其柔性線路板 | |
WO2024130716A1 (zh) | 发光模组和显示装置 | |
KR102217631B1 (ko) | 발광 다이오드 칩, 발광 다이오드 패키지 및 표시장치 | |
TWI665650B (zh) | Led發光燈條及廣告屏幕 | |
CN210865434U (zh) | 一种可弯曲透明led显示屏 | |
JP6904551B2 (ja) | Ledディスプレイ装置 | |
CN116913943A (zh) | 一种显示面板及显示装置 | |
CN115731817A (zh) | 一种不规则形状led透明显示屏 | |
CN114974083A (zh) | 显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190115 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190415 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190507 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190524 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6533624 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |