JP6521857B2 - Antenna device - Google Patents

Antenna device Download PDF

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JP6521857B2
JP6521857B2 JP2015256726A JP2015256726A JP6521857B2 JP 6521857 B2 JP6521857 B2 JP 6521857B2 JP 2015256726 A JP2015256726 A JP 2015256726A JP 2015256726 A JP2015256726 A JP 2015256726A JP 6521857 B2 JP6521857 B2 JP 6521857B2
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thick copper
copper layer
power supply
antenna
receiving
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JP2017120989A (en
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聡 岡崎
聡 岡崎
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Mitsubishi Electric Corp
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Description

本発明は、フェーズドアレイアンテナ（ＰＡＡ：Ｐｈａｓｅｄ Ａｒｒａｙ Ａｎｔｅｎｎａ）を含むアンテナ装置に関する。   The present invention relates to an antenna apparatus including a phased array antenna (PAA).

一般的なフェーズドアレイアンテナは、素子アンテナ、送受信モジュール、電源制御分配基板、給電基板及びアンテナ筐体を備える。送受信モジュールには電源制御分配基板を介して、各種制御信号と併せて電源供給を行い、電源系統によって大電流を流すことが可能である。従来、大電流が必要な電源系統には電源制御分配基板に対して工夫がなされている。   A general phased array antenna includes an element antenna, a transmitting / receiving module, a power control distribution substrate, a feeding substrate, and an antenna housing. It is possible to supply power to the transmission / reception module together with various control signals via the power control distribution substrate, and to flow a large current by the power supply system. Conventionally, in a power supply system requiring a large current, a device is devised for the power supply control distribution board.

一例として特許文献１には、「電源ブスを基板等に半田付けする際、帯状導電板と基板との間の熱膨脹率の差から生ずる基板の反り、半田やスルーホールの割れ等を防止すること」を目的として、「端子を帯状導電板の長手方向と直交する方向の端面に成形し、且つ折り曲げることで、最も問題となる帯状導電板長手方向の伸縮歪をこの曲げ部分が吸収し、端子自身が基板となす角度を初期角から変化させ平衡に達するようにする」構成が開示されている。特許文献１では、電源ブスの端子を帯状導電板の長手方向に成形し、且つ折り曲げることで、基板との間の熱膨脹率の違いによる伸縮歪を吸収し、装着時の半田付けにおける基板の反りを抑えている。   For example, in Patent Document 1, "When soldering a power supply bus to a substrate or the like, to prevent the warpage of the substrate caused by the difference in thermal expansion coefficient between the strip-like conductive plate and the substrate, cracking of solder or through holes, etc. For this purpose, “the terminal is formed on the end face in the direction orthogonal to the longitudinal direction of the strip-shaped conductive plate and bent, this bent portion absorbs the stretching strain in the longitudinal direction of the strip-shaped conductive plate which causes the most problems. An arrangement is disclosed in which the angle formed by itself with the substrate is changed from the initial angle to reach equilibrium. In Patent Document 1, the terminals of the power supply busses are formed in the longitudinal direction of the strip-shaped conductive plate and bent to absorb the expansion / contraction strain due to the difference between the thermal expansion coefficient with the substrate and to warp the substrate at the time of mounting. I

特開平７−７８６４２号公報Japanese Patent Application Laid-Open No. 7-78642

しかしながら、上記従来の技術によれば、基板毎に複数の電源ブスの開発が必要であり、基板の高さ方向に装着スペースが必要である。そのため、電源制御分配基板の低コスト化と小型化が困難である、という問題があった。   However, according to the above-mentioned prior art, development of a plurality of power supply busses is required for each substrate, and a mounting space is required in the height direction of the substrate. Therefore, there is a problem that it is difficult to reduce the cost and size of the power supply control distribution substrate.

本発明は、上記に鑑みてなされたものであって、低コスト化と小型化を実現した電源制御分配基板を備えるアンテナ装置を得ることを目的とする。   The present invention is made in view of the above, and an object of the present invention is to obtain an antenna device provided with a power supply control distribution substrate which realizes cost reduction and miniaturization.

上述した課題を解決し、目的を達成するために、本発明は、ＲＦ信号を送受信する送受信器と、送受信器に接続されて電磁波を送受信する空中線と、空中線に電力を供給する電源器と、空中線に制御信号を送受信する信号処理器とを備える。空中線は、送受信器から送信されたＲＦ信号を分配する給電基板と、給電基板で分配されたＲＦ信号の位相及び振幅を制御する複数の送受信モジュールと、電源器と複数の送受信モジュールとを接続する第１の厚銅層、第２の厚銅層、第３の厚銅層および第４の厚銅層と、信号処理器と複数の送受信モジュールとを接続する、第１から第４の厚銅層よりも厚さが薄い複数の銅箔層とを有する多層の電源制御分配基板と、複数の送受信モジュールに接続され、送信時には複数の送受信モジュールによって制御されたＲＦ信号を空中に放射して受信時には空中から電磁波を受信する複数個の素子アンテナとを備え、第１の厚銅層および第２の厚銅層は、電源器から複数の送受信モジュールへの電流往路を構成し、第３の厚銅層および第４の厚銅層は、複数の送受信モジュールから電源器への電流復路を構成し、第１の厚銅層と第３の厚銅層とは隣接するように層配置され、第２の厚銅層と第４厚銅層とは隣接するように層配置され、第１の厚銅層、第２の厚銅層、第３の厚銅層および第４の厚銅層は、複数の第１の銅箔層と複数の第２の銅箔層によって挟持されるように層配置されることを特徴とする。 In order to solve the problems described above and achieve the object, the present invention provides a transceiver for transmitting and receiving RF signals, an antenna connected to the transceiver for transmitting and receiving electromagnetic waves, and a power supply for supplying power to the antenna. And a signal processor for transmitting and receiving control signals to the antenna. The antenna connects a feeding board for distributing the RF signal transmitted from the transmitter / receiver, a plurality of transmitting / receiving modules for controlling the phase and amplitude of the RF signal distributed by the feeding board, a power supply and a plurality of transmitting / receiving modules First to fourth thick copper layers connecting the signal processor and the plurality of transmitting / receiving modules, the first thick copper layer, the second thick copper layer, the third thick copper layer, and the fourth thick copper layer Multilayer power control distribution board with multiple copper foil layers thinner than the layer, and multiple transmit / receive modules, which transmit and receive RF signals controlled by the multiple transmit / receive modules in the air when transmitting Sometimes, the first thick copper layer and the second thick copper layer form a current path from the power supply to the plurality of transmitting and receiving modules, and the third thickness is provided with a plurality of element antennas for receiving electromagnetic waves from the air. Copper layer and fourth thick copper layer Forming a current return path from the plurality of transmission / reception modules to the power supply, and the first thick copper layer and the third thick copper layer are arranged adjacent to each other, and the second thick copper layer and the fourth thick copper The first thick copper layer, the second thick copper layer, the third thick copper layer, and the fourth thick copper layer are arranged so as to be adjacent to the layer, and the plurality of first copper foil layers And the second copper foil layer is disposed so as to be sandwiched .

本発明によれば、低コスト化と小型化を実現した電源制御分配基板を備えるアンテナ装置を得ることができるという効果を奏する。   According to the present invention, it is possible to obtain an antenna device provided with a power control distribution substrate realizing cost reduction and miniaturization.

実施の形態１に係るアンテナ装置の構成の一例を示す図The figure which shows an example of a structure of the antenna apparatus which concerns on Embodiment 1. 実施の形態１において、電源制御分配基板を示す図FIG. 2 is a diagram showing a power control distribution substrate in the first embodiment 実施の形態１において、電源ブスが装着された電源制御分配基板を示す図FIG. 6 is a diagram showing a power supply control distribution board on which a power supply bus is mounted in the first embodiment. 実施の形態１において、電源制御分配基板の層構造を示す概略図Schematic diagram showing a layer structure of a power control distribution substrate in the first embodiment. 実施の形態２に係るアンテナ装置の構成の一例を示す図The figure which shows an example of a structure of the antenna apparatus which concerns on Embodiment 2. 実施の形態２において、電源制御分配基板を示す図FIG. 6 shows a power control distribution substrate in a second embodiment.

以下に、本発明の実施の形態にかかるアンテナ装置を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。   Hereinafter, an antenna device according to an embodiment of the present invention will be described in detail based on the drawings. The present invention is not limited by the embodiment.

実施の形態１．
図１は、本発明の実施の形態１に係るアンテナ装置の構成の一例を示す図である。図１に示すアンテナ装置は、ＲＦ信号を送受信する送受信器１と、送受信器１からのＲＦ信号が入力されて電磁波を送信し、空中からの電磁波を受信して送受信器１に出力する空中線２と、空中線２に電力を供給する電源器３と、制御信号を送受信して空中線２を制御する信号処理器４とを備える。空中線２は、送受信器１から入力されたＲＦ信号を分配する給電基板５と、電源器３から供給された電力及び信号処理器４から入力される制御信号を送受信モジュール７−１から７−Ｎに分配する電源制御分配基板６と、ＲＦ信号の位相及び振幅を制御するＮ個の送受信モジュール７−１から７−Ｎと、送信時には位相及び振幅が制御されたＲＦ信号を電磁波として空中に放射して受信時には空中から電磁波を受信する素子アンテナ８−１から８−Ｎとを備える。なお、振幅の制御は、振幅の増幅を含む。 Embodiment 1
FIG. 1 is a diagram showing an example of the configuration of an antenna apparatus according to Embodiment 1 of the present invention. The antenna device shown in FIG. 1 includes a transceiver 1 for transmitting and receiving RF signals, and an antenna 2 for receiving an RF signal from the transceiver 1 and transmitting an electromagnetic wave, receiving an electromagnetic wave from the air and outputting the electromagnetic wave to the transceiver 1. And a power supply 3 for supplying power to the antenna 2, and a signal processor 4 for controlling the antenna 2 by transmitting and receiving control signals. The antenna 2 distributes the RF signal input from the transmitter / receiver 1, the power supplied from the power supply 3 and the control signal input from the signal processor 4 to the transceiver modules 7-1 to 7-N. Power distribution board 6 for distributing to N, N transceiver modules 7-1 to 7-N for controlling the phase and amplitude of the RF signal, and an RF signal whose phase and amplitude is controlled at the time of transmission is radiated into the air as electromagnetic waves. And element antennas 8-1 to 8-N for receiving electromagnetic waves from the air at the time of reception. The control of the amplitude includes amplification of the amplitude.

送受信器１は給電基板５に接続され、電源器３及び信号処理器４は電源制御分配基板６に接続されている。給電基板５の分配端の各々は、Ｎ個の送受信モジュール７−１から７−Ｎの各々と接続され、送受信モジュール７−１から７−Ｎの各々は、素子アンテナ８−１から８−Ｎの各々に接続されている。電源制御分配基板６の分配端の各々は、Ｎ個の送受信モジュール７−１から７−Ｎの各々に接続されている。   The transmitter / receiver 1 is connected to the feeding substrate 5, and the power supply 3 and the signal processor 4 are connected to the power control distribution substrate 6. Each of the distribution ends of the feeding substrate 5 is connected to each of the N transmission / reception modules 7-1 to 7-N, and each of the transmission / reception modules 7-1 to 7-N is an element antenna 8-1 to 8-N. Connected to each of the Each of the distribution ends of the power supply control distribution substrate 6 is connected to each of the N transmission / reception modules 7-1 to 7-N.

図２は、電源制御分配基板６を示す図である。図２（Ａ）は、図１の電源制御分配基板６の概略構成を示す側面図であり、図２（Ｂ）は、図１の電源制御分配基板６を示す斜視図である。図２（Ａ）に示す電源制御分配基板６は、厚銅層を有し、厚銅層を有するプリント配線基板（ＰＷＢ：Ｐｒｉｎｔｅｄ Ｗｉｒｉｎｇ Ｂｏａｒｄ）１１と、信号処理器４と制御信号を送受信する信号配線１２と、電源器３からの電力供給が行われる電源配線１３Ａ，１３Ｂと、送受信モジュール７−１から７−Ｎへの接続部１４−１から１４−Ｎとを備える。   FIG. 2 is a diagram showing the power control distribution substrate 6. 2 (A) is a side view showing a schematic configuration of the power control distribution substrate 6 of FIG. 1, and FIG. 2 (B) is a perspective view showing the power control distribution substrate 6 of FIG. The power control distribution substrate 6 shown in FIG. 2A has a thick copper layer and a printed wiring board (PWB: Printed Wiring Board) 11 having a thick copper layer, and signals for transmitting and receiving control signals to and from the signal processor 4. The wiring 12 includes power supply wirings 13A and 13B to which power supply from the power supply 3 is performed, and connections 14-1 to 14-N from the transmission / reception modules 7-1 to 7-N.

図３は、電源ブスが装着された電源制御分配基板２０を示す図である。図３は、図２の比較例である。図３に示す電源ブスが装着された電源制御分配基板２０は、厚銅層を有する電源ブス用のＰＷＢ２１と、信号処理器４と制御信号を送受信する信号配線２２と、電源器３からの電力供給が行われる電源配線２３Ａ，２３Ｂと、送受信モジュール７−１から７−Ｎへの接続部２４−１から２４−Ｎと、電源ブス２５−１から２５−１２とを備える。電源ブスが装着された電源制御分配基板２０では、電源器３からの電源配線２３Ａ，２３Ｂ及び電源ブス２５−１から２５−１２を介してＰＷＢ２１に流れた大電流が、接続部２４−１から２４−Ｎに供給される。   FIG. 3 is a view showing the power supply control distribution substrate 20 on which the power supply bus is mounted. FIG. 3 is a comparative example of FIG. The power supply control distribution substrate 20 on which the power supply bus shown in FIG. 3 is mounted includes the PWB 21 for the power supply bus having a thick copper layer, the signal wiring 22 for transmitting and receiving control signals to and from the signal processor 4, and the power from the power supply unit 3. Power supply wirings 23A and 23B to be supplied, connections 24-1 to 24-N from transmission / reception modules 7-1 to 7-N, and power supply buses 25-1 to 25-12. In the power supply control distribution substrate 20 on which the power supply bus is mounted, a large current flowing to the PWB 21 from the power supply 3 through the power supply wires 23A and 23B and the power supply buses 25-1 to 25-12 is transmitted from the connection portion 24-1. 24-N is supplied.

厚銅層を有する電源制御分配基板６では、大電流は厚銅層を有するＰＷＢ１１に直接流れ、接続部１４−１から１４−Ｎに供給される。   In the power supply control distribution substrate 6 having a thick copper layer, a large current flows directly to the PWB 11 having a thick copper layer and is supplied to the connection parts 14-1 to 14-N.

図４は、電源制御分配基板６の層構造を示す概略図である。図４に示す電源制御分配基板６は、厚銅層である層Ｌ９から層Ｌ１２で構成されて大電流を流すことが可能な大電流電源系統層３０と、大電流を要さない他の電源系統層及び各種制御信号が流れるパターン層であり、大電流電源系統層３０を挟持する小電流層３１Ａ，３１Ｂとを備える。なお、小電流層３１Ａは、層Ｌ１からＬ８で構成され、小電流層３１Ｂは、層Ｌ１３からＬ２０で構成されている。なお、層Ｌ１からＬ２０では、隣接する層間は絶縁されている。   FIG. 4 is a schematic view showing a layer structure of the power control distribution substrate 6. Power supply control distribution substrate 6 shown in FIG. 4 is composed of layers L9 to L12 which are thick copper layers to allow a large current to flow and another power supply which does not require a large current. A system layer and a pattern layer through which various control signals flow, and small current layers 31A and 31B sandwiching the large current power supply system layer 30 are provided. The small current layer 31A is composed of layers L1 to L8, and the small current layer 31B is composed of layers L13 to L20. In the layers L1 to L20, adjacent layers are insulated.

図４において、大電流を要する大電流電源系統層３０は、薄い銅箔層である小電流層３１Ａ，３１Ｂよりも厚く形成されており、大電流電源系統層３０としては、２４０μｍ以上の厚い銅箔層を例示することができる。また、導体損失を低減するために大電流電源系統層３０には往路及び復路が各々２層ずつ割り当てられている。これにより、図３の比較例における電源ブス２５−１から２５−１２の使用時と同等の損失で大電流を流すことができる。   In FIG. 4, the large current power supply system layer 30 requiring a large current is formed thicker than the small current layers 31A and 31B which are thin copper foil layers, and as the large current power supply system layer 30, thick copper of 240 μm or more A foil layer can be illustrated. Further, in order to reduce the conductor loss, two forward paths and two return paths are allocated to the large current power supply system layer 30 respectively. As a result, a large current can be flowed with the same loss as when using the power supply buses 25-1 to 25-12 in the comparative example of FIG.

また、図４に示すように、往路である層Ｌ９，Ｌ１１と復路である層Ｌ１０，Ｌ１２とが交互に配置されており、往路と復路とを隣接させることで電磁干渉を抑えることができ、電源ブスを使用したときよりもＥＭＣ（Ｅｌｅｃｔｒｏ Ｍａｇｎｅｔｉｃ Ｃｏｍｐａｔｉｂｉｌｉｔｙ）対処能力を向上させることができる。   Further, as shown in FIG. 4, the layers L9 and L11 which are the forward path and the layers L10 and L12 which are the return path are alternately disposed, and electromagnetic interference can be suppressed by making the forward path and the return path adjacent. The ability to handle Electro Magnetic Compatibility (EMC) can be improved more than when using a power supply bus.

実施の形態２．
図５は、本発明の実施の形態２に係るアンテナ装置の構成の一例を示す図である。図５に示すアンテナ装置は、空中線２を空中線２ａに置き換えた点が図１に示すアンテナ装置と異なる。空中線２ａは、電源制御分配基板６ａを備え、電源制御分配基板６ａはエネルギーバンク６０を有する。図５に示すアンテナ装置のその他の構成は、図１に示すアンテナ装置の構成と同じである。 Second Embodiment
FIG. 5 is a diagram showing an example of a configuration of an antenna apparatus according to Embodiment 2 of the present invention. The antenna apparatus shown in FIG. 5 differs from the antenna apparatus shown in FIG. 1 in that the antenna 2 is replaced with an antenna 2a. The antenna 2 a includes a power control distribution substrate 6 a, and the power control distribution substrate 6 a includes an energy bank 60. The other configuration of the antenna device shown in FIG. 5 is the same as the configuration of the antenna device shown in FIG.

図６は、電源制御分配基板６ａを示す図である。図６（Ａ）は、図５に示す電源制御分配基板６ａの概略構成を示す側面図であり、図６（Ｂ）は、図５に示す電源制御分配基板６ａを示す斜視図である。図６（Ａ）に示す電源制御分配基板６ａは、厚銅層を有するＰＷＢ１１と、信号処理器４と制御信号を送受信する信号配線１２と、電源器３からの電力供給が行われる電源配線１３Ａ，１３Ｂと、送受信モジュール７−１から７−Ｎへの接続部１４−１から１４−Ｎと、コンデンサ群４１とを備える。   FIG. 6 is a diagram showing the power control distribution substrate 6a. FIG. 6A is a side view showing a schematic configuration of the power control distribution substrate 6a shown in FIG. 5, and FIG. 6B is a perspective view showing the power control distribution substrate 6a shown in FIG. The power control distribution substrate 6a shown in FIG. 6A includes a PWB 11 having a thick copper layer, a signal wiring 12 for transmitting and receiving control signals to and from the signal processor 4, and a power wiring 13A to which power is supplied from the power supply 3. , 13B, connections 14-1 to 14-N from the transceiver modules 7-1 to 7-N, and a capacitor group 41.

コンデンサ群４１は、図５に示すエネルギーバンク６０に相当し、図３において電源ブス２５−１から２５−１２が占有しているスペースに配されている。図５に示すアンテナ装置がレーダである場合には電源のパルス駆動を要する。しかしながら、エネルギーバンクを備えない構成では、電源の急峻な立ち上がりに対して、電源器３から送受信モジュール７−１から７−Ｎへの電流応答が間に合わず、電圧にサグが発生する。このようにコンデンサ群によるエネルギーバンクが設けられると、送受信モジュール７−１から７−Ｎに供給するための電荷を蓄積することができ、電源の急峻な立ち上がりに対しても対応することができる。   The capacitor group 41 corresponds to the energy bank 60 shown in FIG. 5, and is disposed in the space occupied by the power supply buses 25-1 to 25-12 in FIG. When the antenna device shown in FIG. 5 is a radar, pulse drive of the power supply is required. However, in the configuration without the energy bank, the current response from the power supply 3 to the transceiver modules 7-1 to 7-N is not in time for a sharp rise of the power supply, and a sag occurs in the voltage. As described above, when the energy bank of the capacitor group is provided, it is possible to store electric charge to be supplied to the transmission / reception modules 7-1 to 7-N, and to cope with a sharp rise of the power supply.

以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。   The configuration shown in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and one of the configurations is possible within the scope of the present invention. Parts can be omitted or changed.

１ 送受信器、２，２ａ 空中線、３ 電源器、４ 信号処理器、５ 給電基板、６，６ａ，２０ 電源制御分配基板、７−１から７−Ｎ 送受信モジュール、８−１から８−Ｎ 素子アンテナ、１１，２１ ＰＷＢ、１２，２２ 信号配線、１３Ａ，１３Ｂ，２３Ａ，２３Ｂ 電源配線、１４−１から１４−Ｎ，２４−１から２４−Ｎ 接続部、２５−１から２５−１２ 電源ブス、３０ 大電流電源系統層、３１Ａ，３１Ｂ 小電流層、４１ コンデンサ群、６０ エネルギーバンク。   Reference Signs List 1 transceiver, 2, 2a antenna, 3 power source, 4 signal processor, 5 power feeding substrate, 6, 6a, 20 power control distribution substrate, 7-1 to 7-N transceiver module, 8-1 to 8-N element Antenna, 11, 21 PWB, 12, 22 signal wiring, 13A, 13B, 23A, 23B power supply wiring, 14-1 to 14-N, 24-1 to 24-N connection, 25-1 to 25-12 power supply bus , 30 high current power supply system layer, 31A, 31B small current layer, 41 capacitor group, 60 energy bank.

Claims (3)

ＲＦ信号を送受信する送受信器と、
前記送受信器に接続されて電磁波を送受信する空中線と、
前記空中線に電力を供給する電源器と、
前記空中線に制御信号を送受信する信号処理器と、を備え、
前記空中線は、
前記送受信器から送信された前記ＲＦ信号を分配する給電基板と、
前記給電基板で分配された前記ＲＦ信号の位相及び振幅を制御する複数の送受信モジュールと、
前記電源器と前記複数の送受信モジュールとを接続する第１の厚銅層、第２の厚銅層、第３の厚銅層および第４の厚銅層と、前記信号処理器と前記複数の送受信モジュールとを接続する、前記第１から前記第４の厚銅層よりも厚さが薄い複数の銅箔層とを有する多層の電源制御分配基板と、
前記複数の送受信モジュールに接続され、送信時には前記複数の送受信モジュールによって制御された前記ＲＦ信号を空中に放射して受信時には空中から電磁波を受信する複数の素子アンテナと、を備え、
前記第１の厚銅層および前記第２の厚銅層は、前記電源器から前記複数の送受信モジュールへの電流往路を構成し、前記第３の厚銅層および前記第４の厚銅層は、前記複数の送受信モジュールから前記電源器への電流復路を構成し、前記第１の厚銅層と前記第３の厚銅層とは隣接するように層配置され、前記第２の厚銅層と前記第４の厚銅層とは隣接するように層配置され、
前記第１の厚銅層、前記第２の厚銅層、前記第３の厚銅層および前記第４の厚銅層は、複数の第１の銅箔層と複数の第２の銅箔層によって挟持されるように層配置されることを特徴とするアンテナ装置。 A transceiver for transmitting and receiving RF signals;
An antenna connected to the transceiver for transmitting and receiving electromagnetic waves;
A power supply for supplying power to the antenna;
And a signal processor for transmitting and receiving control signals to said antenna,
The antenna is
A feeding substrate for distributing the RF signal transmitted from the transceiver;
A plurality of transmitting and receiving modules for controlling the phase and amplitude of the RF signal distributed by the feeding substrate;
A first thick copper layer, a second thick copper layer, a third thick copper layer and a fourth thick copper layer, which connect the power supply and the plurality of transceiver modules, and the signal processor and the plurality A multi-layered power supply control distribution substrate having a plurality of copper foil layers thinner than the first to fourth thick copper layers, which are connected to a transmission / reception module ;
Wherein the plurality of connected to the transceiver module, at the time of transmission and a multiple element antenna for receiving electromagnetic waves from the air at the time of receiving a controlled the RF signal radiated in the air by the plurality of transceiver modules,
The first thick copper layer and the second thick copper layer constitute a current path from the power source to the plurality of transmitting / receiving modules, and the third thick copper layer and the fourth thick copper layer are Forming a current return path from the plurality of transmitting / receiving modules to the power supply, and the first thick copper layer and the third thick copper layer are disposed adjacent to each other, and the second thick copper layer And the fourth thick copper layer are arranged adjacent to each other,
The first thick copper layer, the second thick copper layer, the third thick copper layer, and the fourth thick copper layer are a plurality of first copper foil layers and a plurality of second copper foil layers. An antenna device characterized in that the layers are arranged to be sandwiched by 前記電源制御分配基板がエネルギーバンクを有することを特徴とする請求項１に記載のアンテナ装置。   The antenna device according to claim 1, wherein the power control distribution substrate comprises an energy bank. 前記エネルギーバンクはコンデンサ群であることを特徴とする請求項２に記載のアンテナ装置。   The antenna device according to claim 2, wherein the energy bank is a capacitor group.
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