JP6506101B2 - Vacuum chuck member and method of manufacturing vacuum chuck member - Google Patents

Vacuum chuck member and method of manufacturing vacuum chuck member Download PDF

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JP6506101B2
JP6506101B2 JP2015107127A JP2015107127A JP6506101B2 JP 6506101 B2 JP6506101 B2 JP 6506101B2 JP 2015107127 A JP2015107127 A JP 2015107127A JP 2015107127 A JP2015107127 A JP 2015107127A JP 6506101 B2 JP6506101 B2 JP 6506101B2
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vacuum chuck
chuck member
peripheral surface
mounting
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JP2016225337A (en
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古川　茂伸
茂伸 古川
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Kyocera Corp
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Description

本発明は、真空チャック部材および真空チャック部材の製造方法に関する。   The present invention relates to a vacuum chuck member and a method of manufacturing the vacuum chuck member.

従来、半導体製造装置等で用いる、半導体ウエハを固定する治具として、緻密質セラミック体からなる支持部の凹部に半導体ウエハを載置する載置部が設けられた真空チャック部材がある（例えば、特許文献１参照）。この載置部は、例えば多孔質セラミック体を主成分とし、この載置部を介して半導体ウエハを吸引することにより、載置部上に半導体ウエハを吸着させて固定することができる。このような真空チャック部材は、例えば緻密質セラミック体からなる支持部の凹部にガラスペーストを塗布し、その後に予め作製した多孔質体からなる載置部を凹部にはめ込み、ガラスペーストを溶融させた後に冷却して固化したガラス層を接合層として、緻密質セラミック体からなる支持部と多孔質体からなる載置部とが接合されて形成されている。   Conventionally, as a jig for fixing a semiconductor wafer used in a semiconductor manufacturing apparatus or the like, there is a vacuum chuck member provided with a mounting portion for mounting the semiconductor wafer in a recess of a support made of a dense ceramic body (for example, Patent Document 1). For example, the mounting portion has a porous ceramic body as a main component, and can suck and fix the semiconductor wafer on the mounting portion by sucking the semiconductor wafer through the mounting portion. In such a vacuum chuck member, for example, a glass paste is applied to the concave portion of the support portion made of a dense ceramic body, and then the mounting portion made of a porous body prepared in advance is fitted into the concave portion to melt the glass paste A supporting portion made of a dense ceramic body and a mounting portion made of a porous body are formed by bonding using a glass layer which is cooled and solidified later as a bonding layer.

特開２０１０−２０５７８９号公報Unexamined-Japanese-Patent No. 2010-205789

このような従来の真空チャック部材では、ガラスペーストを一旦溶融させるので、溶融したガラスペーストの厚さ分布等を高精度に制御することが難しい。例えば半導体製造装置では、半導体ウエハの位置をナノメートル（ｎｍ）レベルの精度で制御することが求められており、半導体ウエハを載置する載置部の形状精度も高い精度が求められている。固化したガラスペーストからなる接合層に厚さ分布が存在したり、局所的な凹凸が存在する場合は、この接合層を介して載置部にかかる圧力に大きさの分布が生じたり、局所的に強い力がかかる場合がある。この場合、載置部にかかる力の分布が大きくなったり、局所的に大きな力がかかり、載置部の変形の大きさの分布が大きくなったり、局所的に大きく変形し、載置部の形状精度の制御が難しくなる場合がある。このような変形の大きさの分布に起因して載置部の形状が制御し難い場合、載置部に吸着した半導体ウエハの表面の位置精度を例えばナノメートルレベルの高精度に制御することが難しいといった課題があった。   In such a conventional vacuum chuck member, since the glass paste is once melted, it is difficult to control the thickness distribution and the like of the melted glass paste with high accuracy. For example, in a semiconductor manufacturing apparatus, it is required to control the position of a semiconductor wafer with an accuracy of nanometer (nm) level, and the shape accuracy of a mounting portion on which the semiconductor wafer is mounted is also required to be high. In the case where there is a thickness distribution in the bonding layer made of solidified glass paste, or in the presence of local unevenness, the pressure applied to the mounting portion via this bonding layer causes a size distribution, or the local In some cases, a strong force may be applied. In this case, the distribution of the force applied to the mounting portion becomes large, or a large force is locally applied, and the distribution of the magnitude of deformation of the mounting portion becomes large, or the local deformation is largely generated. It may be difficult to control the shape accuracy. When it is difficult to control the shape of the mounting unit due to the distribution of the magnitude of deformation, it is possible to control the positional accuracy of the surface of the semiconductor wafer adsorbed to the mounting unit with high accuracy on the nanometer level, for example. There was a problem that it was difficult.

また、例えば半導体製造装置では、載置部ひいては載置部に載置した半導体ウエハの温度や温度分布を高精度に制御する必要があるが、厚さ分布等を正確に把握することができない接合層が支持部と載置部との間に介在することで、載置部ひいては載置部に載置した半導体ウエハの温度や温度分布を高精度に制御することが難しいといった課題もあった。   In addition, for example, in a semiconductor manufacturing apparatus, it is necessary to control with high precision the temperature of the mounting portion and therefore the temperature and temperature distribution of the semiconductor wafer mounted on the mounting portion, but bonding which can not accurately grasp the thickness distribution etc. There is also a problem that it is difficult to control with high precision the temperature and temperature distribution of the mounting portion, that is, the semiconductor wafer mounted on the mounting portion because the layer is interposed between the support portion and the mounting portion.

また、真空チャック部材は、繰り返し使用することで、多孔質体からなる載置部の孔が目詰りする場合も多い。しかし従来の真空チャック部材は、ガラスペースト等からなる接合層によって支持部に載置部が強固に接合されており、多孔質体からなる載置部を取り外して充分に洗浄することが難しかった。結果、真空チャック部材を継続的に使用した場合、載置部の孔の目詰りによって真空チャック部材の吸着力（ウエハの保持力）が徐々に低下していっても、吸着力が低下していく真空チャック部材を使い続ける必要があるといった問題があった。   In addition, the vacuum chuck member often clogs the holes of the mounting portion made of a porous body by repeated use. However, in the conventional vacuum chuck member, the mounting portion is firmly bonded to the supporting portion by the bonding layer made of glass paste or the like, and it has been difficult to remove the mounting portion made of the porous body and wash it sufficiently. As a result, when the vacuum chuck member is continuously used, even if the suction force (wafer holding force) of the vacuum chuck member is gradually reduced due to clogging of the hole of the mounting portion, the suction force is reduced. There is a problem that it is necessary to continue to use a certain vacuum chuck member.

上記課題を解決するために、本発明の一実施形態は、平面状の載置面を有する多孔質セラミック体からなる載置部と、前記載置部の外周面を囲んだ、前記外周面と対向する内周面を備える外壁部、および前記載置部の前記載置面と反対側の面と当接するベース面を有する緻密質セラミック体からなる支持部とを備え、前記載置面に載置した対象体を前記載置部を介して真空吸着するための真空チャック部材であって、前記内周面は、前記内周面の周方向に沿って連続して前記外周面と直接当接する第１領域と、前記第１領域よりも前記ベース面に近い側に、前記内周面の周方向に沿って連続して配置された、前記外周面から離れている第２領域とを備えてなり、前記外周面は、前記第２領域に対向する部分に、前記反対側の面に接続した傾斜面部を備え、前記傾斜面部は前記反対側の面に近づくにつれて前記載置部の中心軸に近づくように傾斜していることを特徴とする真空チャック部材を提供する。
また、本発明の他の実施形態は、平面状の載置面を有する多孔質セラミック体からなる載置部と、前記載置部の外周面を囲んだ、前記外周面と対向する内周面を備える外壁部、および前記載置部の前記載置面と反対側の面と当接するベース面を有する緻密質セラミック体からなる支持部とを備え、前記載置面に載置した対象体を前記載置部を介して真空吸着するための真空チャック部材であって、前記内周面は、前記内周面の周方向に沿って連続して前記外周面と直接当接する第１領域と、前記第１領域よりも前記ベース面に近い側に、前記内周面の周方向に沿って連続して配置された、前記外周面から離れている第２領域とを備えてなり、前記載置部は、前記支持部と当接する前記外周面の近傍における密度が、前記載置面の重心位置近傍の密度に比べて大きいことを特徴とする真空チャック部材
を提供する。 In order to solve the above-mentioned subject, in one embodiment of the present invention , there is provided a mounting portion made of a porous ceramic body having a planar mounting surface, and the outer peripheral surface surrounding the outer peripheral surface of the mounting portion. An outer wall portion having an inner peripheral surface opposite to the outer surface portion, and a support portion made of a dense ceramic body having a base surface in contact with the surface opposite to the mounting surface of the mounting portion; It is a vacuum chuck member for vacuum-sucking a placed object through the placement portion, wherein the inner circumferential surface is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface. A first area, and a second area spaced apart from the outer peripheral surface and disposed continuously along the circumferential direction of the inner peripheral surface on a side closer to the base surface than the first area; Do Ri, the outer peripheral surface, the portion facing the second region, inclination connected to a surface of the opposite side Comprising a part, the inclined surface portion to provide a vacuum chuck member, characterized in that is inclined so as to approach the center axis of the placement section closer to the surface of the opposite side.
Further, according to another embodiment of the present invention, there is provided a mounting portion made of a porous ceramic body having a planar mounting surface, and an inner peripheral surface surrounding the outer peripheral surface of the mounting portion and facing the outer peripheral surface. And a support made of a dense ceramic body having a base surface that abuts against the mounting surface and the opposite surface of the mounting unit, and the object placed on the mounting surface is A vacuum chuck member for vacuum suction through the placement portion, wherein the inner circumferential surface is a first region which continuously contacts the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface; And a second region spaced apart from the outer circumferential surface and disposed continuously along the circumferential direction of the inner circumferential surface on the side closer to the base surface than the first region, and In the portion, the density in the vicinity of the outer peripheral surface in contact with the support portion is in the vicinity of the center of gravity of the mounting surface Vacuum chuck member being greater than the density
I will provide a.

また、平面状の載置面を有する多孔質セラミック体からなる載置部と、前記載置部の外周面を囲んだ、前記外周面と対向する内周面を備える外壁部、および前記載置部の前記載置面と反対側の面と当接するベース面を有する緻密質セラミック体からなる支持部とを備え、前記載置面に載置した対象体を前記載置部を介して真空吸着するための真空チャック部材であって、前記内周面は、前記内周面の周方向に沿って連続して前記外周面と直接当接する第１領域と、前記第１領域よりも前記ベース面に近い側に配置された、前記外周面から離れて前記外周面に対向する第２領域とを備える真空チャック部材の製造方法であって、前記内周面または前記外周面の少なくともいずれか一方の前記ベース面に近い側に凹状部を形成する工程と、前記支持部を加熱して熱膨張させる工程と、熱膨張した状態の前記支持部の、前記内周面と前記ベース面とで囲まれた領域に、前記支持部よりも低温度の前記載置部を配置する工程と、前記支持部の温度を降温させて前記支持部と前記載置部の温度を均一化させることで前記支持部の膨張を緩和させて、前記凹状部に対応する部分で前記内周面と前記外周面とが離れるとともに、前記凹状部に対応する部分以外の部分で前記内周面と前記外周面とが直接当接している真空チャック部材を得る工程とを有することを特徴とする真空チャック部材の製造方法を併せて提供する。   Further, a mounting portion made of a porous ceramic body having a planar mounting surface, an outer wall portion surrounding an outer peripheral surface of the mounting portion and having an inner peripheral surface facing the outer peripheral surface, and And a support made of a dense ceramic body having a base surface in contact with the mounting surface and the opposite side of the mounting portion, and a target object placed on the mounting surface is vacuum suctioned through the mounting portion Vacuum chuck member, wherein the inner peripheral surface is a first area which is in direct contact with the outer peripheral surface continuously along the circumferential direction of the inner peripheral surface, and the base surface rather than the first area A method of manufacturing a vacuum chuck member, comprising: a second region disposed on the side closer to and facing the outer peripheral surface away from the outer peripheral surface, wherein at least one of the inner peripheral surface or the outer peripheral surface Forming a concave portion on the side close to the base surface; Heating the portion to thermally expand the support portion at a temperature lower than the temperature of the support portion in a region surrounded by the inner peripheral surface and the base surface of the support portion in the thermally expanded state; The step of disposing and lowering the temperature of the support portion to equalize the temperature of the support portion and the placement portion alleviates the expansion of the support portion, and the inside of the portion corresponding to the concave portion Obtaining a vacuum chuck member in which the inner peripheral surface and the outer peripheral surface are in direct contact with each other at a portion other than the portion corresponding to the concave portion while the peripheral surface and the outer peripheral surface are separated. The present invention also provides a method of manufacturing a vacuum chuck member.

本発明の真空チャック部材によれば、載置部の載置面の変形を抑制し、載置部に吸着した半導体ウエハの表面の位置精度を比較的高精度に制御することができる。また、本発明の真空チャック部材の製造方法によれば、真空チャック部材から載置部を比較的容易に取り外して洗浄することができ、載置部の孔の目詰りによる吸着力の低下を抑制することができる。   According to the vacuum chuck member of the present invention, it is possible to suppress the deformation of the mounting surface of the mounting unit, and to control the positional accuracy of the surface of the semiconductor wafer adsorbed by the mounting unit with relatively high accuracy. Further, according to the method for manufacturing a vacuum chuck member of the present invention, the mounting portion can be removed relatively easily from the vacuum chuck member and cleaned, and the decrease in the adsorption force due to clogging of the holes in the mounting portion is suppressed. can do.

本発明の第１の実施形態に係る真空チャック部材を示す斜視図である。It is a perspective view showing a vacuum chuck member concerning a 1st embodiment of the present invention. （ａ）は、図１の真空チャック部材を示す上面図、（ｂ）は、（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows the vacuum chuck member of FIG. 1, (b) is sectional drawing in the AA of (a). 図２（ｂ）のＢ部の拡大図である。It is an enlarged view of the B section of FIG.2 (b). 図１の真空チャック部材に対象体を吸着させた状態を示す断面図である。It is sectional drawing which shows the state which adsorb | sucked the target object to the vacuum chuck member of FIG. （ａ）および（ｂ）は、本発明の真空チャック部材の他の実施形態について説明する概略断面図である。(A) And (b) is a schematic sectional drawing explaining the other embodiment of the vacuum chuck member of this invention. （ａ）〜（ｄ）は、図１の真空チャック用部材の製造方法を模式的に示した図である。(A)-(d) is the figure which showed typically the manufacturing method of the member for vacuum chucks of FIG.

以下、図面を参照して、本発明の実施の形態について詳細に説明する。図１は、本発明の真空チャック部材の一実施形態である真空チャック部材１の概略斜視図であり、図２（ａ）は上面図、図２（ｂ）は、（ａ）のＡ−Ａ線における断面図であり、図３は図２（ｂ）のＢ部の拡大図である。また図４は、図１の真空チャック部材に対象体Ｗを吸着させた状態を示す断面図である。真空チャック部材１は、平面状の載置面２αを有する多孔質セラミック体２（以降、載置部２ともいう）と、載置部２の外周面２ａを囲んだ、外周面２ａと対向する内周面４ａを備える外壁部４１、および載置部２の載置面２αと反対側の面２β（下面２βともいう）と当接するベース面４αを有する緻密質セラミック体４（以降、支持部４ともいう）とを備えている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic perspective view of a vacuum chuck member 1 which is one embodiment of a vacuum chuck member of the present invention, FIG. 2 (a) is a top view, and FIG. 2 (b) is an AA of FIG. FIG. 3 is a cross-sectional view taken along a line, and FIG. 3 is an enlarged view of a portion B of FIG. Further, FIG. 4 is a cross-sectional view showing a state in which the object W is adsorbed to the vacuum chuck member of FIG. The vacuum chuck member 1 faces the outer peripheral surface 2 a which surrounds the outer peripheral surface 2 a of the porous ceramic body 2 (hereinafter also referred to as the mounting unit 2) having the planar mounting surface 2 α and the outer peripheral surface 2 a of the mounting unit 2. A dense ceramic body 4 (hereinafter referred to as a support portion) having an outer wall portion 41 having an inner circumferential surface 4a and a base surface 4α in contact with a surface 2β (also referred to as a lower surface 2β) opposite to the mounting surface 2α of the mounting portion 2 4) and.

支持部４は、中央に円形の凹部を備え、例えば、外壁部４１の外径が８５〜１００ｍｍ、厚さが２０〜６０ｍｍである略円板状の枠体である。載置部２は、例えば、直径が７０〜９０ｍｍ、厚さが１０〜２０ｍｍの円板状体である。   The support portion 4 is a substantially disc-like frame which has a circular recess at the center and, for example, the outer diameter of the outer wall portion 41 is 85 to 100 mm and the thickness is 20 to 60 mm. The placement unit 2 is, for example, a discoid body having a diameter of 70 to 90 mm and a thickness of 10 to 20 mm.

支持部４は、アルミナ（Ａｌ２Ｏ３）、窒化珪素（Ｓｉ３Ｎ４）、炭化珪素（ＳｉＣ）、炭窒化珪素（ＳｉＣｘＮｙ（ｘおよびｙは、それぞれ０＜ｘ＜１、０＜ｙ＜４／３の範囲で、４ｘ＋３ｙ＝４を満たす数値である。））、酸化珪素（ＳｉＯ２）、サイアロン（Ｓｉ６−ＺＡｌＺＯＺＮ８−Ｚ（ｚは０．１≦ｚ≦１を満たす数値である。））等の緻密質セラミック体からなる。これら組成は定比であっても不定比であってもよい。支持部４の気孔率は、５体積％以下、特に、０．１体積％以下が好ましい。 The supporting portion 4 is made of alumina (Al 2 O 3 ), silicon nitride (Si 3 N 4 ), silicon carbide (SiC), silicon carbonitride (SiC x N y (where x and y are 0 <x <1, 0, respectively). In the range of <y <4/3, 4x + 3y = 4))), silicon oxide (SiO 2 ), sialon (Si 6 -Z Al Z O Z N 8-Z (z is 0.1 ≦ It is a numerical value which satisfy | fills z <= 1.)) etc. It consists of a dense ceramic body. These compositions may be in a fixed ratio or an unfixed ratio. The porosity of the support portion 4 is preferably 5% by volume or less, and particularly preferably 0.1% by volume or less.

支持部４には、複数の吸引孔６が設けられている。吸引孔６の開口はベース面４αに設けられている。吸引孔６から空気を吸引すると、載置部２の内部の空気が吸引されて、載置部２の載置面２αに載置された対象体Ｗが、載置面２αに吸着される。支持部材４にはまた、純水などの液体や気体などの冷却用流体が流れる流路９が設けられている。流路９は真空チャック部材１の温度ひいては載置面２αに載置させた対象体Ｗの温度を制御するものである。この流路９は、図示しない流体供給手段と図示しない流体回収手段とに接続している。真空チャック部材１は、対象体Ｗの温度制御の自由度と精度とを上げる観点で流路９を備えておくことが好ましいが、流路９を必ずしも備えている必要はない。   The support portion 4 is provided with a plurality of suction holes 6. The opening of the suction hole 6 is provided in the base surface 4α. When air is sucked from the suction holes 6, the air inside the placement unit 2 is sucked, and the object W placed on the placement surface 2α of the placement unit 2 is adsorbed on the placement surface 2α. The supporting member 4 is also provided with a flow path 9 through which a cooling fluid such as liquid or gas such as pure water flows. The flow path 9 controls the temperature of the vacuum chuck member 1 and thus the temperature of the object W placed on the mounting surface 2α. The flow path 9 is connected to fluid supply means (not shown) and fluid recovery means (not shown). The vacuum chuck member 1 preferably includes the flow path 9 in order to increase the degree of freedom and accuracy of the temperature control of the target body W, but the flow path 9 is not necessarily required.

なお、支持部４の下方には、真空チャック部材１を支持して固定するための固定ベース（不図示）が備えられる。支持部４と固定ベース（不図示）とは、例えば、円周方向に沿って等間隔に設置された取り付け穴７に挿入されたボルト等を介して連結、固定される。   In addition, below the support part 4, the fixed base (not shown) for supporting and fixing the vacuum chuck member 1 is provided. The support portion 4 and the fixed base (not shown) are connected and fixed, for example, via bolts or the like inserted into the mounting holes 7 installed at equal intervals along the circumferential direction.

載置部２は、支持部４を構成する成分を主成分とする多孔質セラミック体からなり、図示しない複数の連通孔を備えている。これら組成は定比であっても不定比であってもよい。載置部２の気孔率は２５〜５０体積％の範囲内であることが好ましい。気孔率がこの範囲であると、機械的強度および熱伝導率を維持することができるとともに、圧力損失の増加を抑制することができる。支持部４および載置部２のそれぞれの気孔率は、アルキメデス法に準拠して求めることができる。   The placement unit 2 is made of a porous ceramic body whose main component is a component of the support unit 4 and includes a plurality of communication holes (not shown). These compositions may be in a fixed ratio or an unfixed ratio. It is preferable that the porosity of the mounting part 2 exists in the range of 25-50 volume%. When the porosity is in this range, mechanical strength and thermal conductivity can be maintained, and an increase in pressure loss can be suppressed. The porosity of each of the support portion 4 and the mounting portion 2 can be determined in accordance with the Archimedes method.

また、載置部２の平均気孔径は、２０〜１００μｍの範囲内であることが好ましい。平均気孔径がこの範囲であると、低い圧力損失を維持することができるとともに、対象体Ｗの表面の平面度を小さくすることができる。載置部２の平均気孔径は、ＪＩＳ Ｒ １６５５−２００３に準拠した水銀圧入法により求めることができる。   Moreover, it is preferable that the average pore diameter of the mounting part 2 exists in the range of 20-100 micrometers. When the average pore diameter is in this range, low pressure loss can be maintained, and the surface flatness of the object W can be reduced. The average pore diameter of the mounting portion 2 can be determined by the mercury intrusion method according to JIS R 1655-2003.

真空チャック部材１では、後述するように、例えば載置部２の外周面２ａが内周面４ａの第１領域４１ａによって押圧されるような力を受けた状態で、載置部２が支持部４に固定（支持）されている。   In the vacuum chuck member 1, as described later, for example, in a state where the mounting portion 2 receives a force such that the outer peripheral surface 2a of the mounting portion 2 is pressed by the first region 41a of the inner peripheral surface 4a It is fixed (supported) to 4.

真空チャック部材１は、図３に示すように、載置部２の載置面２αに載置した対象体Ｗを載置部２を介して真空吸着するための部材であって、緻密質セラミック体４の内周面４ａは、内周面４ａの周方向に沿って連続して外周面２ａと直接当接する第１領域４１ａと、第１領域４１ａよりもベース面４αに近い側に内周面２ａの周方向に沿って連続して(
ｏｒ第１領域４１ａに沿って)配置された、載置部２の外周面２ａから離れている第２領
域４２ａとを備えている。 The vacuum chuck member 1 is a member for vacuum-sucking the object W placed on the placement surface 2α of the placement portion 2 through the placement portion 2 as shown in FIG. The inner circumferential surface 4a of the body 4 is continuous with the first region 41a which is in direct contact with the outer circumferential surface 2a continuously along the circumferential direction of the inner circumferential surface 4a, and the inner circumferential surface closer to the base surface 4α than the first region 41a. Continuously along the circumferential direction of the surface 2a (
and a second region 42a which is disposed apart from the outer peripheral surface 2a of the mounting portion 2 and disposed along the first region 41a.

真空チャック部材１では、第１領域４１ａが内周面４ａの周方向に沿って連続して外周面２ａと直接当接しており、第１領域４１ａと外周面２ａとの間に例えばガラスペースト等の接合部材が存在していない。すなわち、載置部２にかかる圧力の大きさの分布の原因となる接合層の厚さのばらつきがない。このため、制御できない圧力分布や局所的な圧力に起因した、載置部２の変形等が抑制されている。   In the vacuum chuck member 1, the first region 41a is continuously in direct contact with the outer peripheral surface 2a along the circumferential direction of the inner peripheral surface 4a, and, for example, glass paste or the like is interposed between the first region 41a and the outer peripheral surface 2a. There is no bonding member. That is, there is no variation in the thickness of the bonding layer which causes the distribution of the magnitude of the pressure applied to the placement unit 2. For this reason, deformation or the like of the mounting portion 2 due to uncontrollable pressure distribution or local pressure is suppressed.

さらに真空チャック部材１は、第１領域４１ａよりもベース面４αに近い側に配置された、外周面２ａから離れて外周面２ａに対向する第２領域４２ａとを備えている。この第２領域４２ａに対応する部分では、第２領域４２ａから載置部２に対して圧力がかかることがない。第２領域４２ａは、内周面４ａまたは外周面２ａの少なくともいずれか一方のベース面４αに近い側に凹状部を設けることで形成すればよい。凹状部は、図に示しているような内周面４ａまたは外周面２ａに部分的に設けられた段差をもった凹部であってもよいし、内周面４ａや外周面２ａのベース面４α側に設けられた面取り部であってもよい。なお面取り部は、直線状のいわゆるＣ面でもよいし、曲面（Ｒ面）であってもよい。凹状部の形状については特に限定されない。真空チャック部材２では、内周面４ａに凹部を有するとともに、外周面２ａにも面取り部（傾斜面部２２ａ）を有している。   Furthermore, the vacuum chuck member 1 is provided with a second region 42a disposed on the side closer to the base surface 4α than the first region 41a and facing the outer circumferential surface 2a apart from the outer circumferential surface 2a. In the portion corresponding to the second area 42a, no pressure is applied to the placement unit 2 from the second area 42a. The second region 42a may be formed by providing a concave portion on the side closer to the base surface 4α of at least one of the inner peripheral surface 4a and the outer peripheral surface 2a. The concave portion may be a concave portion having a step partially provided on the inner peripheral surface 4a or the outer peripheral surface 2a as shown in the drawing, or the base surface 4α of the inner peripheral surface 4a or the outer peripheral surface 2a. It may be a chamfer provided on the side. The chamfered portion may be a so-called straight C surface or a curved surface (R surface). The shape of the concave portion is not particularly limited. In the vacuum chuck member 2, the inner circumferential surface 4 a has a recess, and the outer circumferential surface 2 a also has a chamfer (inclined surface 22 a).

真空チャック部材１のように、支持部４の内周面２ａに凹部を有し、この凹部が第２領域４２ａに対応する場合は、この第２領域４２ａに対応する部分に、載置部２の一部をはみ出させて配置することができる。例えば載置部２が内周面４ａの第１領域４１ａから強い圧力を受けた場合、この圧力に応じて載置部２が変形しようとするが、真空チャック部材１では、第２領域４２ａに対応する部分が部分的にはみ出すように変形し易い。すなわち真空チャック部材１では、第１領域４１ａから載置部２に強い圧力がかかる状態でも、この圧力は、載置部２の第２領域４２ａに対応する領域の変形によって解放され易いので、第２領域４２ａに対応する部分以外の部分の余分な変形が抑制される。特に、載置部２の載置面２αにおける変形を抑制することで、載置部２の載置面２αの平面度を良好に保って、載置部２に吸着した対象体Ｗの表面の位置精度を高精度に制御することができる。真空チャック部材１では、第２領域４２ａと外周面２ａとの間隔Ｌは、例えば、０．０８ｍｍ以上０．３２ｍｍ以下である。   As in the case of the vacuum chuck member 1, when the inner peripheral surface 2 a of the support portion 4 has a recess and this recess corresponds to the second region 42 a, the mounting portion 2 is formed on the portion corresponding to the second region 42 a It is possible to put out part of the For example, when the placement unit 2 receives a strong pressure from the first area 41a of the inner circumferential surface 4a, the placement unit 2 tends to be deformed according to this pressure, but in the vacuum chuck member 1, the second area 42a It is easy to deform so that the corresponding part may partially protrude. That is, in the vacuum chuck member 1, even in the state where a strong pressure is applied from the first area 41 a to the placement unit 2, this pressure is easily released by the deformation of the area corresponding to the second region 42 a of the placement unit 2. Excessive deformation of portions other than the portion corresponding to the two regions 42a is suppressed. In particular, by suppressing the deformation of the placement surface 2α of the placement unit 2, the flatness of the placement surface 2α of the placement unit 2 is well maintained, and the surface of the object W adsorbed to the placement unit 2 The position accuracy can be controlled with high accuracy. In the vacuum chuck member 1, the distance L between the second region 42 a and the outer peripheral surface 2 a is, for example, 0.08 mm or more and 0.32 mm or less.

また、真空チャック部材１は、第１領域４１ａが内周面４ａの周方向に沿って連続して載置面２αの周縁線２１ａと直接当接している。すなわち、載置面２αの周縁線２１ａが内周面４ａと当接しており、載置面２αと内周面４ａとは隙間（間隙）なく当接している。このような構成であると、パーティクル等が載置面２αの周縁線２１ａと第１領域４１ａとの間に侵入し難く、侵入したパーティクルの一部が突出することで生じる局所的な凸部や、侵入したパーティクル部分に支持部４からの圧力が集中することで発生する載置部２への局所的な応力集中が抑制されるので、対象体Ｗを載置面２ａに精度よく吸着することができる。   Further, in the vacuum chuck member 1, the first region 41a is in direct contact with the peripheral edge line 21a of the mounting surface 2α continuously along the circumferential direction of the inner peripheral surface 4a. That is, the peripheral line 21a of the mounting surface 2α is in contact with the inner peripheral surface 4a, and the mounting surface 2α and the inner peripheral surface 4a are in contact without any gap (gap). With such a configuration, it is difficult for particles or the like to intrude between the peripheral region 21a of the mounting surface 2α and the first region 41a, and a local convex portion or a convex portion that is generated when a part of the intruded particle protrudes. Since local stress concentration on the placement unit 2 generated by concentration of pressure from the support unit 4 on the intruded particle portion is suppressed, the object W is accurately adsorbed on the placement surface 2a Can.

また真空チャック部材１は、ベース面４αから載置面２αに向かう厚さ方向において、第２領域４２ａの厚さ方向に沿った長さに比べて、第１領域４１ａの厚さ方向に沿った長さの方が大きい。このような構成であると、載置部２の外周面２ａに対する内周面４ａによる押圧力が比較的強い。このため、接着剤などの接合層を介して接合していなくても、載置部２を支持部４で比較的強固に支持することができる。   In the thickness direction from base surface 4α to mounting surface 2α, vacuum chuck member 1 extends along the thickness direction of first region 41a as compared to the length along the thickness direction of second region 42a. The length is larger. With such a configuration, the pressing force by the inner peripheral surface 4 a against the outer peripheral surface 2 a of the mounting portion 2 is relatively strong. Therefore, even if bonding is not performed via a bonding layer such as an adhesive, the placement unit 2 can be supported relatively firmly by the support unit 4.

また真空チャック部材１では、真空チャック部材１の載置部２の外周面２ａが、第２領域４２ａに対向する部分に、下面２βに接続した傾斜面部２２ａを備え、傾斜面部２２ａは下面２βに近づくにつれて載置部２の中心軸ＣＬに近づくように傾斜している。言い換えれば、載置部２のベース面の外縁部（ベース面と外周面との角部）は面取り部を有して
いる。面取り部はベース面に垂直な断面視で直線状の、いわゆるＣ面でもよいし、同じ断面視で曲線状の曲面（Ｒ面）であってもよい。なお、載置部２の中心軸ＣＬとは、載置面２αの重心位置を通る、載置面２αに垂直な仮想直線である。 Further, in the vacuum chuck member 1, the outer peripheral surface 2a of the mounting portion 2 of the vacuum chuck member 1 is provided with the inclined surface 22a connected to the lower surface 2β at a portion facing the second region 42a. As it approaches, it inclines so that central axis CL of mounting part 2 may be approached. In other words, the outer edge portion (the corner portion between the base surface and the outer peripheral surface) of the base surface of the mounting portion 2 has a chamfered portion. The chamfered portion may be a so-called C-surface which is linear in a cross-sectional view perpendicular to the base surface, or may be a curved surface (R-surface) in the same cross-sectional view. The central axis CL of the mounting unit 2 is a virtual straight line passing through the center of gravity of the mounting surface 2α and perpendicular to the mounting surface 2α.

図３に示す実施形態の真空チャック部材１の場合、傾斜面部２２ａと支持部４（より詳しくは内周面４ａの第２領域４２ａとが離れ、載置部２の角に対応する領域（内周面４ａとベース面４αとが接続する部分の近傍の領域）に空間を形成することができる。例えば図５（ｂ）に示す実施形態では、載置部２の角部に対応する領域が、内周面４ａの第１領域４１ａに平行な面とベース面４αに平行な面とが接続した稜線を有する角状であり、この稜線を有する角状部には応力等が集中し易く、角状部が破損し易い。図３に示す真空チャック部材１では、載置部２の角に対応する領域（内周面４ａとベース面４αとが接続する部分の近傍の領域）に空間を形成しているので、圧力が局所的に集中し難く、載置部２や支持部４の破損が抑制されている。これにより真空チャック部材１では、載置面２αの平面度を良好に保って、載置部に吸着した対象体Ｗの表面の位置精度を高精度に制御することができる。   In the case of the vacuum chuck member 1 of the embodiment shown in FIG. 3, the inclined surface 22a and the support 4 (more specifically, the second region 42a of the inner peripheral surface 4a is separated and the region corresponding to the corner of the mounting portion 2 A space can be formed in a region near the portion where the circumferential surface 4a and the base surface 4α are connected. For example, in the embodiment shown in FIG. 5 (b), the region corresponding to the corner of the mounting portion 2 is A corner having a ridge line in which a plane parallel to the first region 41a of the inner circumferential surface 4a and a plane parallel to the base surface 4α are connected, stress and the like are easily concentrated in the corner having the ridge line, In the vacuum chuck member 1 shown in Fig. 3, a space is set in a region corresponding to the corner of the mounting portion 2 (a region in the vicinity of a portion where the inner peripheral surface 4a and the base surface 4α are connected). Because the pressure is formed locally, it is difficult for the pressure to be concentrated locally, and the breakage of the mounting portion 2 and the support portion 4 is suppressed. . Thus, in the vacuum chuck member 1, and good keeping the flatness of the mounting surface 2.alpha, the positional accuracy of the surface of the object W adsorbed on the placing portion can be controlled with high precision.

また真空チャック部材１では、内周面４ａの第２領域４２ａは、ベース面４αに接続した曲面部４２ｂを備え、曲面部４２ｂはベース面４に近づくにつれて載置部２の中心軸に近づくように曲がっている。いいかえれば、内周面４ａとベース面４αとの接続部分の角部は凹曲面となっている。このように内周面４ａとベース面４αとの接続部分が曲面状であることで、支持部４における応力の集中も抑制され、支持部４の破損も抑制されている。ここで、曲面部４２ｂの曲率半径は、例えば１．５ｍｍ以上２．５ｍｍ以下である。   Further, in the vacuum chuck member 1, the second region 42 a of the inner circumferential surface 4 a includes the curved surface portion 42 b connected to the base surface 4 α, and the curved surface portion 42 b approaches the central axis of the mounting portion 2 as it approaches the base surface 4. It is crooked. In other words, the corner of the connection portion between the inner peripheral surface 4a and the base surface 4α is a concave surface. As described above, since the connection portion between the inner circumferential surface 4a and the base surface 4α is curved, concentration of stress in the support portion 4 is also suppressed, and breakage of the support portion 4 is also suppressed. Here, the radius of curvature of the curved surface portion 42b is, for example, 1.5 mm or more and 2.5 mm or less.

また、載置部２は支持部４と当接する外周面２ａの近傍における密度が、載置面２αの重心位置近傍Ｇの密度に比べて大きい。これは、例えば載置部２の外周面２ａが内周面４ａによって押圧されることで、載置部２の外周面２ａの近傍のセラミック粒子同士の距離が近づくことで起きる。外周面２ａ近傍における密度が、載置面２αの重心位置（中心軸ＣＬが通過する部分）近傍の密度に比べて大きいことで、衝撃等が加わりやすい外周面２ａ近傍の機械的強度が強くなり、この外周面２ａ近傍からのパーティクル脱落等が抑制されている。   Further, the density of the mounting portion 2 in the vicinity of the outer peripheral surface 2 a in contact with the support portion 4 is larger than the density of the gravity center position vicinity G of the mounting surface 2α. This occurs, for example, when the outer peripheral surface 2a of the mounting portion 2 is pressed by the inner peripheral surface 4a and the distance between the ceramic particles in the vicinity of the outer peripheral surface 2a of the mounting portion 2 approaches. When the density in the vicinity of the outer peripheral surface 2a is larger than the density in the vicinity of the gravity center position of the mounting surface 2α (the portion through which the central axis CL passes), the mechanical strength in the vicinity of the outer peripheral surface 2a to which an impact or the like is easily applied becomes stronger The particles are prevented from falling out of the vicinity of the outer peripheral surface 2a.

図５（ａ）および（ｂ）は、本発明の真空チャック部材の他の実施形態の拡大断面図である。本発明では、図５（ａ）のように、支持部４の内周面４ａに凹状部を設けずに、載置部２のベース面の外縁部のみに面取り部（図５（ａ）では傾斜面部２２ａ）を設け、内周面４の面取り部に対向する領域を、外周面２ａから離れている第２領域としてもよい。また逆に、載置部２に面取り部を設けずに、支持部４の内周面４ａのみに凹状部を設け、この凹状部に対応する部分を第２領域としてもよい。   5 (a) and 5 (b) are enlarged sectional views of another embodiment of the vacuum chuck member of the present invention. In the present invention, as shown in FIG. 5 (a), the inner peripheral surface 4a of the support 4 is not provided with a concave portion, and only the outer edge of the base surface of the mounting unit 2 is chamfered (FIG. 5 (a) An inclined surface portion 22a may be provided, and a region opposed to the chamfered portion of the inner peripheral surface 4 may be a second region separated from the outer peripheral surface 2a. Also, conversely, without providing a chamfered portion in the mounting portion 2, a recessed portion may be provided only in the inner peripheral surface 4a of the support portion 4, and a portion corresponding to this recessed portion may be used as a second region.

本実施形態の真空チャック部材１では、載置面２αに載置した対象体Ｗの表面位置の精度を高精度に制御することができる。また、ガラスペースト等の接合層やこの接合層の厚さ分布等が存在していないので、載置面２αに載置した対象体Ｗの温度分布を高精度に制御することもできる。   In the vacuum chuck member 1 of the present embodiment, the accuracy of the surface position of the target object W placed on the placement surface 2α can be controlled with high accuracy. Further, since there is no bonding layer such as glass paste or the thickness distribution of the bonding layer, the temperature distribution of the object W placed on the mounting surface 2α can be controlled with high accuracy.

次に、本発明の真空チャック部材の製造方法の一実施形態について、真空チャック部材１の製造方法を例として説明する。   Next, an embodiment of a method of manufacturing a vacuum chuck member of the present invention will be described by taking a method of manufacturing a vacuum chuck member 1 as an example.

本実施形態の真空チャック部材の製造方法は、内周面４ａまたは外周面２ａの少なくともいずれか一方のベース面４αに近い側に凹状部を形成する工程と、支持部４を加熱して熱膨張させる工程と、熱膨張した状態の支持部４の内周面４ａとベース面４ａとで囲まれた領域に、支持部４よりも低温度の載置部２を配置する工程と、支持部４の温度を降温さ
せて支持部４と載置部２の温度を均一化させることで支持部４の膨張を緩和させて、凹状部または面取り部の少なくともいずれか一方に対応する部分で内周面４ａと外周面２ａとが離れるとともに、対応する部分以外の部分で内周面４ａと外周面２ａとが直接当接している真空チャック部材を得る工程とを有する。 In the method of manufacturing the vacuum chuck member of the present embodiment, the step of forming a concave portion on the side closer to the base surface 4α of at least one of the inner peripheral surface 4a or the outer peripheral surface 2a; And disposing the mounting portion 2 at a temperature lower than that of the supporting portion 4 in a region surrounded by the inner peripheral surface 4a and the base surface 4a of the supporting portion 4 in a thermally expanded state; The temperature of the support 4 is lowered to equalize the temperatures of the support 4 and the placement unit 2 to alleviate the expansion of the support 4, and the inner circumferential surface at a portion corresponding to at least one of the recessed portion or the chamfered portion. Obtaining a vacuum chuck member in which the inner peripheral surface 4a and the outer peripheral surface 2a are in direct contact with each other at portions other than the corresponding portions while the outer peripheral surface 2a is separated from 4a.

図６（ａ）〜（ｄ）は、本発明の真空チャック部材の製造方法の一実施形態について説明する概略断面図である。まず、図６（ａ）に示すように、緻密質セラミック体４（支持部４）と多孔質セラミック体２（載置部２）とを準備する。この際、内周面４ａまたは外周面２ａの少なくともいずれか一方のベース面４αに近い側に凹状部を形成しておく。本実施形態では、支持部４の内周面４ａのベース面４αに近い側に凹部を形成するとともに、外周面２ａのベース面４αの外縁部に面取り部を形成する。これら凹部や面取り部の形成手法は特に限定されず、例えば生成形体の加圧成形によって形成してもよいし、生成形体を研削して形成してもよいし、焼成後の焼成体に研削加工等を施して形成してもよい。支持部４には、予め吸引孔６が設けられている。吸引孔６の開口はベース面４αに設けられている。なお、図６（ｂ）以降の図では、吸引孔６の符号を省略する。吸引孔６には、この時点で、高温になると蒸発する有機物が充填されている。この有機物は、後述する熱処理時に蒸発し、その結果、吸引孔６が空洞になる。   6 (a) to 6 (d) are schematic cross-sectional views for explaining an embodiment of a method of manufacturing a vacuum chuck member of the present invention. First, as shown in FIG. 6A, the dense ceramic body 4 (supporting portion 4) and the porous ceramic body 2 (mounting portion 2) are prepared. At this time, the concave portion is formed on the side closer to the base surface 4α of at least one of the inner peripheral surface 4a and the outer peripheral surface 2a. In the present embodiment, the concave portion is formed on the side closer to the base surface 4α of the inner peripheral surface 4a of the support portion 4, and the chamfered portion is formed on the outer edge portion of the base surface 4α of the outer peripheral surface 2a. There are no particular limitations on the method of forming these recesses and chamfers, and for example, they may be formed by pressure forming of a formed body, or may be formed by grinding a formed body, or may be ground to a sintered body after firing. You may form by giving etc. Suction holes 6 are provided in advance in the support portion 4. The opening of the suction hole 6 is provided in the base surface 4α. In addition, the code | symbol of the suction hole 6 is abbreviate | omitted in the figure after FIG.6 (b). At this time, the suction holes 6 are filled with an organic substance that evaporates when the temperature becomes high. The organic matter evaporates during heat treatment to be described later, and as a result, the suction holes 6 become hollow.

次に、図６（ｂ）に示すように、支持部４を加熱炉等に導入して支持部４を昇温させて支持部４を熱膨張させる。例えば、支持部４を加熱して１００℃〜２００℃程度まで昇温させる。この加熱によって支持部４は熱膨張し、内周面４ａの直径は加熱前に比べて大きくなる。   Next, as shown in FIG. 6 (b), the support 4 is introduced into a heating furnace or the like to raise the temperature of the support 4 and thermally expand the support 4. For example, the support part 4 is heated and heated up to about 100 degreeC-200 degreeC. The heating causes the support 4 to thermally expand, and the diameter of the inner circumferential surface 4 a becomes larger than that before heating.

次に、図６（ｃ）に示すように、熱膨張した状態の支持部４を加熱炉から取り出し、内周面４ａとベース面４αとで囲まれた領域に、支持部４よりも低温度の載置部２を配置する。載置部２の外径２ａの直径の大きさは、支持部４が熱膨張した状態では、支持４の内周面４ａの直径の大きさよりも小さくなるように設定されている。   Next, as shown in FIG. 6C, the thermally expanded support portion 4 is taken out of the heating furnace, and the temperature is lower than that of the support portion 4 in a region surrounded by the inner peripheral surface 4a and the base surface 4α. The placement unit 2 of the The diameter of the outer diameter 2a of the mounting portion 2 is set to be smaller than the diameter of the inner peripheral surface 4a of the support 4 when the support 4 is thermally expanded.

次に、支持部４の温度を降温させて支持部４と載置部２の温度を均一化させることで支持部４の膨張を緩和させる。この降温させる処理は、特に冷却装置等を用いずに、例えば室温環境下に置いておくだけでもよい。この結果、図６（ｄ）に示すように、内周面４ａの直径は降温前に比べて小さくなり、内周面４ａと外周面２ａとが当接し、さらに外周面２ａによって内周面４ａが締め付けられるように、外周面２ａから内周面４ａに圧力がかかって物理的に強固に締結される。このように外周面２ａから内周面４ａに圧力がかかると、載置部２はその圧力によって変形しようとするが、真空チャック部材１では、第２領域４２ａに対応する部分が部分的にはみ出すように変形することでこの圧力が解放され易いので、第２領域４２ａに対応する部分以外の部分の余分な変形が抑制される。   Next, the temperature of the support portion 4 is lowered to make the temperatures of the support portion 4 and the placement portion 2 uniform, thereby alleviating the expansion of the support portion 4. The temperature lowering process may be performed, for example, only at room temperature, without using a cooling device or the like. As a result, as shown in FIG. 6 (d), the diameter of the inner peripheral surface 4a becomes smaller than before the temperature decrease, the inner peripheral surface 4a and the outer peripheral surface 2a abut, and the outer peripheral surface 2a causes the inner peripheral surface 4a. As a result, pressure is applied from the outer peripheral surface 2a to the inner peripheral surface 4a so as to be tightened physically and firmly. Thus, when pressure is applied from the outer peripheral surface 2a to the inner peripheral surface 4a, the mounting portion 2 tends to be deformed by the pressure, but in the vacuum chuck member 1, a portion corresponding to the second region 42a partially protrudes By deforming as described above, this pressure is easily released, so that excessive deformation of parts other than the part corresponding to the second area 42a is suppressed.

この後、載置面２αが所定の平面度となるように、研磨加工する。研磨の際に用いる砥石は、例えばダイヤモンド砥石でダイヤモンドの粒径の番手は、例えば＃２３０（粒径６８μｍ）である。研磨しろは、０．５〜２ｍｍ程度である。研磨によって、図５（ｅ）に示すように、支持部４の上面と載置部２の載置面２αは面一になる。このような工程を経て、真空チャック部材１を製造することができる。   Thereafter, polishing is performed so that the mounting surface 2α has a predetermined flatness. The grindstone used at the time of grinding | polishing is a diamond grindstone, for example, and the count number of the particle size of a diamond is # 230 (grain size 68 micrometers), for example. The polishing margin is about 0.5 to 2 mm. By polishing, as shown in FIG. 5E, the upper surface of the support 4 and the mounting surface 2α of the mounting unit 2 become flush. The vacuum chuck member 1 can be manufactured through such a process.

上述した各実施形態の製造方法で製造した真空チャック部材は、ガラスペースト等の接合層を用いずに支持部４と載置部２とが接合されているので、例えば支持部４を集中的に加熱して載置部２に比べて支持部４の温度を高くし、内周面４ａの直径を選択的に大きくすることで、載置部２を支持部４から比較的容易に取外すことができる。このような製造方法で製造された真空チャック部材１は、載置面２αを有する多孔質セラミック体２（載置部２）のみを取り外して洗浄することができるので、比較的長期間にわたって高い吸着
力を維持したまま真空チャック部材１を継続して使用することができる。 In the vacuum chuck member manufactured by the manufacturing method of each embodiment described above, for example, since the support portion 4 and the placement portion 2 are joined without using a bonding layer such as glass paste, the support portion 4 is concentrated, for example. The mounting portion 2 can be removed relatively easily from the supporting portion 4 by heating to raise the temperature of the supporting portion 4 compared to the mounting portion 2 and selectively enlarging the diameter of the inner peripheral surface 4a. it can. Since the vacuum chuck member 1 manufactured by such a manufacturing method can remove and wash only the porous ceramic body 2 (mounting portion 2) having the mounting surface 2α, high adsorption for a relatively long period of time The vacuum chuck member 1 can be used continuously while maintaining the force.

また真空チャック部材１では、載置部２を洗浄した後、昇温および降温によって、載置部２を支持部４に取り付けた際、洗浄後の残留パーティクルや脱粒した粒子などは、第２領域４２ａに配置されることで、残留パーティクルや脱粒した粒子などによって載置部２に局所的に余分な圧力がかかることが抑制されている。   Further, in the vacuum chuck member 1, when the mounting unit 2 is attached to the support unit 4 by heating and lowering the temperature after cleaning the mounting unit 2, residual particles after the cleaning and particles that are disintegrated are the second region. By being arranged at 42a, it is suppressed that an excess pressure is locally applied to the mounting part 2 by the residual particle, the particle which shattered, etc.

以上、本発明の実施形態および実施例について説明したが、本発明は上述の実施形態や実施例に限定されるものでない。本発明は、本発明の要旨を逸脱しない範囲において、各種の改良および変更を行なってもよいのはもちろんである。   Although the embodiments and examples of the present invention have been described above, the present invention is not limited to the embodiments and examples described above. The present invention may, of course, be subjected to various improvements and modifications without departing from the scope of the present invention.

１ 真空チャック部材
２ 多孔質セラミック体（載置部）
２α 載置面
２β 反対側の面（下面）
２ａ 外周面
４ 緻密質セラミック体（支持部）
４ａ 内周面
４α ベース面
４１ 外壁部
２２ 傾斜面部
４１ａ 第１領域
４２ａ 第２領域
４２ｂ 曲面部 1 vacuum chuck member 2 porous ceramic body (mounting portion)
2α mounting surface 2β opposite surface (bottom surface)
2a Outer peripheral surface 4 Dense ceramic body (support portion)
4a inner circumferential surface 4α base surface 41 outer wall 22 inclined surface 41a first region 42a second region 42b curved surface

Claims (6)

平面状の載置面を有する多孔質セラミック体からなる載置部と、
前記載置部の外周面を囲んだ、前記外周面と対向する内周面を備える外壁部、および前記載置部の前記載置面と反対側の面と当接するベース面を有する緻密質セラミック体からなる支持部とを備え、
前記載置面に載置した対象体を前記載置部を介して真空吸着するための真空チャック部材であって、
前記内周面は、前記内周面の周方向に沿って連続して前記外周面と直接当接する第１領域と、前記第１領域よりも前記ベース面に近い側に、前記内周面の周方向に沿って連続して配置された、前記外周面から離れている第２領域とを備えてなり、
前記外周面は、前記第２領域に対向する部分に、前記反対側の面に接続した傾斜面部を備え、
前記傾斜面部は前記反対側の面に近づくにつれて前記載置部の中心軸に近づくように傾斜していることを特徴とする真空チャック部材。 A mounting portion made of a porous ceramic body having a planar mounting surface;
A dense ceramic having an outer wall portion surrounding an outer peripheral surface of the placing portion and having an inner circumferential surface opposite to the outer circumferential surface, and a base surface abutting on a surface of the placing portion opposite the placing surface And a body support.
A vacuum chuck member for vacuum-adsorbing an object placed on the mounting surface via the mounting portion, the vacuum chuck member comprising:
The inner circumferential surface is a first region that is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface, and a side closer to the base surface than the first region, of the inner circumferential surface disposed in succession along the circumferential direction, Ri na and a second region that is remote from said outer peripheral surface,
The outer peripheral surface includes an inclined surface portion connected to the opposite surface at a portion facing the second region,
The vacuum chuck member characterized in that the inclined surface portion is inclined so as to approach the central axis of the placing portion as approaching the opposite surface . 平面状の載置面を有する多孔質セラミック体からなる載置部と、  A mounting portion made of a porous ceramic body having a planar mounting surface;
前記載置部の外周面を囲んだ、前記外周面と対向する内周面を備える外壁部、および前記載置部の前記載置面と反対側の面と当接するベース面を有する緻密質セラミック体からなる支持部とを備え、A dense ceramic having an outer wall portion surrounding an outer peripheral surface of the placing portion and having an inner circumferential surface opposite to the outer circumferential surface, and a base surface abutting on a surface of the placing portion opposite the placing surface And a body support.
前記載置面に載置した対象体を前記載置部を介して真空吸着するための真空チャック部材であって、A vacuum chuck member for vacuum-adsorbing an object placed on the mounting surface via the mounting portion, the vacuum chuck member comprising:
前記内周面は、前記内周面の周方向に沿って連続して前記外周面と直接当接する第１領域と、前記第１領域よりも前記ベース面に近い側に、前記内周面の周方向に沿って連続して配置された、前記外周面から離れている第２領域とを備えてなり、The inner circumferential surface is a first region that is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface, and a side closer to the base surface than the first region, of the inner circumferential surface And a second region spaced apart from the outer circumferential surface, the second region being continuously disposed along the circumferential direction,
前記載置部は、前記支持部と当接する前記外周面の近傍における密度が、前記載置面の重心位置近傍の密度に比べて大きいことを特徴とする真空チャック部材。A vacuum chucking member characterized in that the placing portion has a density in the vicinity of the outer peripheral surface in contact with the support portion is larger than a density in the vicinity of the center of gravity of the placing surface. 前記第１領域は、前記内周面の周方向に沿って連続して前記載置面の周縁線と直接当接することを特徴とする請求項１または２記載の真空チャック部材。 The vacuum chuck member according to claim 1 or 2 , wherein the first region is in direct contact with the peripheral edge of the mounting surface continuously along the circumferential direction of the inner peripheral surface. 前記第２領域の前記厚さ方向に沿った長さに比べて、前記第１領域の前記厚さ方向に沿った長さの方が大きいことを特徴とする請求項１〜３のいずれかに記載の真空チャック部材。 Than the length along the thickness direction of the second region, to one of the claims 1-3, characterized in that the direction of length along said thickness direction of said first region is larger Vacuum chuck member as described. 前記内周面の前記第２領域は、前記ベース面に接続した曲面部を備え、
前記曲面部は前記ベース面に近づくにつれて前記載置部の中心軸に近づくように曲がっていることを特徴とする請求項１〜４のいずれかに記載の真空チャック部材。 The second region of the inner circumferential surface comprises a curved surface portion connected to the base surface,
The vacuum chuck member according to any one of claims 1 to 4 , wherein the curved surface portion is bent so as to approach the central axis of the placing portion as approaching the base surface. 平面状の載置面を有する多孔質セラミック体からなる載置部と、
前記載置部の外周面を囲んだ、前記外周面と対向する内周面を備える外壁部、および前記載置部の前記載置面と反対側の面と当接するベース面を有する緻密質セラミック体からなる支持部とを備え、
前記載置面に載置した対象体を前記載置部を介して真空吸着するための真空チャック部材であって、
前記内周面は、前記内周面の周方向に沿って連続して前記外周面と直接当接する第１領域と、前記第１領域よりも前記ベース面に近い側に配置された、前記外周面から離れて前記外周面に対向する第２領域とを備える真空チャック部材の製造方法であって、
前記内周面または前記外周面の少なくともいずれか一方の前記ベース面に近い側に凹状部を形成する工程と、
前記支持部を加熱して熱膨張させる工程と、
熱膨張した状態の前記支持部の、前記内周面と前記ベース面とで囲まれた領域に、前記支持部よりも低温度の前記載置部を配置する工程と、
前記支持部の温度を降温させて前記支持部と前記載置部の温度を均一化させることで前記支持部の膨張を緩和させて、前記凹状部に対応する部分で前記内周面と前記外周面とが離れるとともに、前記凹状部に対応する部分以外の部分で前記内周面と前記外周面とが直接当接している真空チャック部材を得る工程とを有することを特徴とする真空チャック部材の製造方法。 A mounting portion made of a porous ceramic body having a planar mounting surface;
A dense ceramic having an outer wall portion surrounding an outer peripheral surface of the placing portion and having an inner circumferential surface opposite to the outer circumferential surface, and a base surface abutting on a surface of the placing portion opposite the placing surface And a body support.
A vacuum chuck member for vacuum-adsorbing an object placed on the mounting surface via the mounting portion, the vacuum chuck member comprising:
The inner circumferential surface is a first region which is in direct contact with the outer circumferential surface continuously along the circumferential direction of the inner circumferential surface, and the outer periphery which is disposed closer to the base surface than the first region. A method of manufacturing a vacuum chuck member, comprising: a second region facing the outer peripheral surface away from a surface;
Forming a concave portion on the side closer to the base surface of at least one of the inner peripheral surface and the outer peripheral surface;
Heating and thermally expanding the support portion;
Placing the placement portion at a temperature lower than that of the support portion in a region surrounded by the inner peripheral surface and the base surface of the support portion in a thermally expanded state;
The temperature of the support portion is lowered to equalize the temperature of the support portion and the placement portion, thereby alleviating the expansion of the support portion, and the inner peripheral surface and the outer periphery at a portion corresponding to the concave portion. Obtaining a vacuum chuck member in which the inner peripheral surface and the outer peripheral surface are in direct contact with each other at a portion other than the portion corresponding to the concave portion while being separated from the surface; Production method.
JP2015107127A 2015-05-27 2015-05-27 Vacuum chuck member and method of manufacturing vacuum chuck member Expired - Fee Related JP6506101B2 (en)

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