JP6486078B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6486078B2 JP6486078B2 JP2014236277A JP2014236277A JP6486078B2 JP 6486078 B2 JP6486078 B2 JP 6486078B2 JP 2014236277 A JP2014236277 A JP 2014236277A JP 2014236277 A JP2014236277 A JP 2014236277A JP 6486078 B2 JP6486078 B2 JP 6486078B2
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- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 239000004065 semiconductor Substances 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 48
- 239000011159 matrix material Substances 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
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- 238000004519 manufacturing process Methods 0.000 description 9
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- 229910052751 metal Inorganic materials 0.000 description 8
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- 229910052709 silver Inorganic materials 0.000 description 6
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- 239000007769 metal material Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
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- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Description
11 搭載基板
12 p側配線(第1の配線、個別配線)
13 n側配線(第2の配線、共通配線)
20、20A、20B (半導体)発光素子
21 半導体構造層
22 p型半導体層(第1の半導体層)
23 発光層
24 n型半導体層(第2の半導体層)
30、30A、30B 透光板
30S、30AS、30BS 側面
LB 遮光膜
TR 透光樹脂
Claims (5)
- 搭載基板と、
前記搭載基板上にマトリクス状に並置された複数の発光素子と、
前記複数の発光素子の各々を埋設するように前記複数の発光素子上に形成された透光樹脂と、
前記透光樹脂上に形成され、各々が前記複数の発光素子の各々の上面全体を覆うように形成された複数の透光板と、
隣接する前記透光板間において互いに対向する一方の透光板の側面及び他方の透光板の側面のうち、いずれか一方の側面を覆うように形成された遮光膜と、を有し、
前記透光樹脂は、前記隣接する透光板間を充填するように形成された充填部を有することを特徴とする発光装置。 - 前記複数の発光素子の各々は、前記搭載基板上に、第1の導電型を有する第1の半導体層、発光層及び前記第1の導電型とは反対導電型の第2の導電型を有する第2の半導体層がこの順で順次積層された構造を有する半導体構造層を有し、
前記搭載基板上には、各々が前記第1の半導体層の各々に接続され、互いに電気的に分離された個別配線と、前記第2の半導体層の各々に接続された共通配線とが設けられていることを特徴とする請求項1に記載の発光装置。 - 前記充填部は、前記透光板の上面と同一の高さ位置において平坦化されていることを特徴とする請求項1又は2に記載の発光装置。
- 前記透光樹脂は、前記搭載基板上における隣接する前記発光素子間の領域に延在する空洞を有し、
前記空洞は、前記隣接する前記発光素子の高さよりも大きな高さを有し、その上端が前記発光素子の高さ方向において前記発光素子と前記透光板との間に位置していることを特徴とする請求項1乃至3のいずれか1つに記載の発光装置。 - 前記空洞を充填するように形成された遮光部を有することを特徴とする請求項4に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014236277A JP6486078B2 (ja) | 2014-11-21 | 2014-11-21 | 発光装置 |
US14/947,389 US9570426B2 (en) | 2014-11-21 | 2015-11-20 | Semiconductor light-emitting device having matrix-arranged light-emitting elements and transparent plates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014236277A JP6486078B2 (ja) | 2014-11-21 | 2014-11-21 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016100457A JP2016100457A (ja) | 2016-05-30 |
JP6486078B2 true JP6486078B2 (ja) | 2019-03-20 |
Family
ID=56010972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014236277A Active JP6486078B2 (ja) | 2014-11-21 | 2014-11-21 | 発光装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9570426B2 (ja) |
JP (1) | JP6486078B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102651645B1 (ko) * | 2023-05-12 | 2024-03-27 | 주식회사 금호에이치티 | 플렉시블 슬림 면광원 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6428730B2 (ja) * | 2016-08-24 | 2018-11-28 | 日亜化学工業株式会社 | 発光装置 |
FR3061358B1 (fr) * | 2016-12-27 | 2021-06-11 | Aledia | Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine |
JP7082270B2 (ja) | 2017-08-28 | 2022-06-08 | 日亜化学工業株式会社 | 発光装置 |
JP7177336B2 (ja) * | 2018-07-20 | 2022-11-24 | 日亜化学工業株式会社 | 発光装置 |
JP7323763B2 (ja) | 2018-12-27 | 2023-08-09 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
CN109556073B (zh) * | 2018-12-31 | 2021-09-07 | 广州市诺思赛光电科技有限公司 | 一种大功率led车灯 |
JP6947990B2 (ja) * | 2019-04-22 | 2021-10-13 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
KR20210081475A (ko) * | 2019-12-23 | 2021-07-02 | 서울반도체 주식회사 | 헤드 램프 장치 |
TWI720785B (zh) * | 2020-01-15 | 2021-03-01 | 東貝光電科技股份有限公司 | 微型led發光裝置及其製造方法 |
JP7328557B2 (ja) | 2020-11-30 | 2023-08-17 | 日亜化学工業株式会社 | 光源、光源装置および光源の製造方法 |
Family Cites Families (15)
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JP2843219B2 (ja) * | 1992-10-16 | 1999-01-06 | アルプス電気株式会社 | 発光素子アレイ装置 |
JP3452982B2 (ja) * | 1994-08-24 | 2003-10-06 | ローム株式会社 | Ledプリントヘッド、およびledアレイチップ、ならびにそのledアレイチップの製造方法 |
JP2001326388A (ja) * | 2000-05-12 | 2001-11-22 | Rohm Co Ltd | 半導体発光装置 |
JP2005093649A (ja) * | 2003-09-17 | 2005-04-07 | Oki Data Corp | 半導体複合装置、ledプリントヘッド、及び、それを用いた画像形成装置 |
RU2489774C2 (ru) * | 2007-11-29 | 2013-08-10 | Нития Корпорейшн | Светоизлучающее устройство и способ его изготовления |
JP2009134965A (ja) | 2007-11-29 | 2009-06-18 | Stanley Electric Co Ltd | 照明装置及び照明装置の製造方法 |
JP5622494B2 (ja) * | 2010-09-09 | 2014-11-12 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
JP2012169189A (ja) * | 2011-02-15 | 2012-09-06 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
JP5823211B2 (ja) | 2011-09-01 | 2015-11-25 | 株式会社小糸製作所 | 車両用前照灯装置 |
JP5816031B2 (ja) | 2011-09-05 | 2015-11-17 | 株式会社小糸製作所 | 車両用前照灯装置 |
DE102012101892B4 (de) * | 2012-03-06 | 2021-05-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement und Anzeigevorrichtung damit sowie Verfahren zur Herstellung eines Wellenlängenkonversionselements |
JP5965162B2 (ja) * | 2012-03-08 | 2016-08-03 | スタンレー電気株式会社 | 発光装置及びその製造方法 |
CN104169641B (zh) * | 2012-03-15 | 2016-08-31 | 株式会社小糸制作所 | 发光装置及车辆用灯具 |
JP6153327B2 (ja) * | 2013-01-22 | 2017-06-28 | シチズン電子株式会社 | Ledモジュール |
JP2014179407A (ja) * | 2013-03-14 | 2014-09-25 | Stanley Electric Co Ltd | Led発光装置とそれを用いた車両用灯具 |
-
2014
- 2014-11-21 JP JP2014236277A patent/JP6486078B2/ja active Active
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2015
- 2015-11-20 US US14/947,389 patent/US9570426B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102651645B1 (ko) * | 2023-05-12 | 2024-03-27 | 주식회사 금호에이치티 | 플렉시블 슬림 면광원 |
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JP2016100457A (ja) | 2016-05-30 |
US9570426B2 (en) | 2017-02-14 |
US20160148912A1 (en) | 2016-05-26 |
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