JP6485679B2 - 有機elパネル及びその製造方法 - Google Patents
有機elパネル及びその製造方法 Download PDFInfo
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- JP6485679B2 JP6485679B2 JP2014194283A JP2014194283A JP6485679B2 JP 6485679 B2 JP6485679 B2 JP 6485679B2 JP 2014194283 A JP2014194283 A JP 2014194283A JP 2014194283 A JP2014194283 A JP 2014194283A JP 6485679 B2 JP6485679 B2 JP 6485679B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 51
- 239000012044 organic layer Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 15
- 238000000206 photolithography Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Description
100a マルチ有機EL基板
101 第一端子部
102 第二端子部
10 支持基板
20 第一電極
30 補助電極
40 絶縁層
50 有機層
60 第二電極
70 封止部材
71 平板部
72 支持部
73 分割部
74 溝部
80 接着剤
90 補助導電部
91 導線
E 発光部
Claims (5)
- 外部電源から共通配線で給電される透光性の第一電極と、
前記第一電極と対となる第二電極と、
前記第一電極と前記第二電極とで挟持される少なくとも発光層を有する有機層と、
前記第一電極、前記第二電極、前記有機層を支持する支持基板と、
前記支持基板との間で前記第一電極、前記第二電極、前記有機層を覆う封止部材と、を備え、
前記第一電極上に前記第一電極よりも抵抗率の低い補助電極を形成し、
前記封止部材の外側面に溝部を設け、前記溝部に前記補助電極に接触する導電性材料からなる補助導電部を設け、
前記支持基板側から光を出射する、
ことを特徴とする有機ELパネル。 - 外部電源から共通配線で給電される透光性の第一電極と、
前記第一電極と対となる第二電極と、
前記第一電極と前記第二電極とで挟持される少なくとも発光層を有する有機層と、
前記第一電極、前記第二電極、前記有機層を支持する支持基板と、
前記支持基板との間で前記第一電極、前記第二電極、前記有機層を覆う封止部材と、を備え、
前記第一電極上に前記第一電極よりも抵抗率の低い補助電極を形成し、
前記封止部材の少なくとも一部に溝部を設け、前記溝部に前記補助電極に接触する導電性材料からなる補助導電部を設け、
前記封止部材は、前記有機層と対向する平板部と、前記平板部を囲むように前記支持基板側に延在する支持部と、を有し、前記平板部の一部は前記支持部より外側に延出し、前記溝部は、前記支持部と前記支持部から外側に延在した前記平板部とで形成される、
ことを特徴とする有機ELパネル。 - 前記補助導電部は、導電性ペーストからなる、
ことを特徴とする請求項1又は2に記載の有機ELパネル。 - 前記補助導電部は、前記補助電極に電気的に接続された導線を有する、
ことを特徴とする請求項1乃至3のいずれかに記載の有機ELパネル。 - 共通基板から分割して複数の有機ELパネルを製造する方法において、
透光性の支持基板上に透光性の導電材料からなる第一電極と、前記第一電極上の一部に前記導電材料よりも抵抗率の低い補助電極と、を形成する工程と、
前記補助電極を絶縁材料で覆い、前記第一電極上に少なくとも発光層を有する有機層と、前記第一電極と対になる第二電極とを順次積層する工程と、
前記支持基板上に前記第一電極、前記補助電極、前記第二電極、前記有機層を封止部材で封止する工程と、
上記工程で生成した前記共通基板を複数の有機ELパネルに分割する分割工程と、
前記分割工程で生成された前記有機ELパネルの外側面に前記封止部材で形成される溝部に導電性材料からなる補助導電部を前記補助電極に接触するように形成する工程と、を有し、
前記封止部材は、前記有機層と対向する平板部と、前記平板部を囲むように前記支持基板側に延在する支持部と、を有し、前記平板部の一部は前記支持部より外側に延出し、前記溝部は、前記支持部と前記支持部から外側に延在した前記平板部とで形成される、
ことを特徴とする有機ELパネルの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014194283A JP6485679B2 (ja) | 2014-09-24 | 2014-09-24 | 有機elパネル及びその製造方法 |
CN201580051199.3A CN107113927B (zh) | 2014-09-24 | 2015-09-18 | 有机el面板及其制造方法 |
KR1020177007760A KR20170063593A (ko) | 2014-09-24 | 2015-09-18 | 유기 el 패널 및 그 제조방법 |
US15/513,549 US20170301874A1 (en) | 2014-09-24 | 2015-09-18 | Organic el panel and method for producing same |
PCT/JP2015/076752 WO2016047622A1 (ja) | 2014-09-24 | 2015-09-18 | 有機elパネル及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014194283A JP6485679B2 (ja) | 2014-09-24 | 2014-09-24 | 有機elパネル及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016066482A JP2016066482A (ja) | 2016-04-28 |
JP6485679B2 true JP6485679B2 (ja) | 2019-03-20 |
Family
ID=55581147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014194283A Expired - Fee Related JP6485679B2 (ja) | 2014-09-24 | 2014-09-24 | 有機elパネル及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20170301874A1 (ja) |
JP (1) | JP6485679B2 (ja) |
KR (1) | KR20170063593A (ja) |
CN (1) | CN107113927B (ja) |
WO (1) | WO2016047622A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6587508B2 (ja) * | 2015-11-05 | 2019-10-09 | 株式会社小糸製作所 | 発光装置 |
JP2018073526A (ja) * | 2016-10-26 | 2018-05-10 | パイオニア株式会社 | 発光装置 |
CN106684256A (zh) * | 2016-12-23 | 2017-05-17 | 上海天马有机发光显示技术有限公司 | 一种显示面板及其制作方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3620706B2 (ja) * | 2000-04-13 | 2005-02-16 | 日本精機株式会社 | 有機elパネルの製造方法 |
JP2002231439A (ja) * | 2001-01-30 | 2002-08-16 | Nippon Seiki Co Ltd | 有機elパネル |
JP2002359071A (ja) * | 2001-04-20 | 2002-12-13 | Lg Phillips Lcd Co Ltd | 有機発光素子 |
JP3682860B2 (ja) * | 2001-05-16 | 2005-08-17 | 日本精機株式会社 | 有機elパネル及びその製造方法 |
JP2003123990A (ja) * | 2001-10-17 | 2003-04-25 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子 |
JP4240276B2 (ja) * | 2002-07-05 | 2009-03-18 | 株式会社半導体エネルギー研究所 | 発光装置 |
JP5298856B2 (ja) * | 2006-11-21 | 2013-09-25 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスパネル |
JP5695312B2 (ja) * | 2009-10-27 | 2015-04-01 | ローム株式会社 | 有機el装置 |
DE102009046755A1 (de) * | 2009-11-17 | 2011-05-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organisches photoelektrisches Bauelement |
JP2011192544A (ja) * | 2010-03-15 | 2011-09-29 | Idemitsu Kosan Co Ltd | 光電変換装置 |
KR101798212B1 (ko) * | 2010-08-24 | 2017-11-15 | 코닌클리케 필립스 엔.브이. | 유기 전계발광 소자 |
JP5421218B2 (ja) * | 2010-10-26 | 2014-02-19 | 出光興産株式会社 | 光電変換装置、及び光電変換装置の製造方法 |
JP2012186080A (ja) * | 2011-03-07 | 2012-09-27 | Panasonic Corp | 面状発光装置およびその製造方法 |
WO2013137089A1 (en) * | 2012-03-14 | 2013-09-19 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, display device, electronic device, and lighting device |
-
2014
- 2014-09-24 JP JP2014194283A patent/JP6485679B2/ja not_active Expired - Fee Related
-
2015
- 2015-09-18 US US15/513,549 patent/US20170301874A1/en not_active Abandoned
- 2015-09-18 WO PCT/JP2015/076752 patent/WO2016047622A1/ja active Application Filing
- 2015-09-18 KR KR1020177007760A patent/KR20170063593A/ko unknown
- 2015-09-18 CN CN201580051199.3A patent/CN107113927B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN107113927A (zh) | 2017-08-29 |
KR20170063593A (ko) | 2017-06-08 |
WO2016047622A1 (ja) | 2016-03-31 |
US20170301874A1 (en) | 2017-10-19 |
CN107113927B (zh) | 2019-07-19 |
JP2016066482A (ja) | 2016-04-28 |
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