JP6478526B2 - Manufacturing method of liquid crystal display element - Google Patents

Manufacturing method of liquid crystal display element Download PDF

Info

Publication number
JP6478526B2
JP6478526B2 JP2014171977A JP2014171977A JP6478526B2 JP 6478526 B2 JP6478526 B2 JP 6478526B2 JP 2014171977 A JP2014171977 A JP 2014171977A JP 2014171977 A JP2014171977 A JP 2014171977A JP 6478526 B2 JP6478526 B2 JP 6478526B2
Authority
JP
Japan
Prior art keywords
electrode
substrate
liquid crystal
conductive material
crystal display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014171977A
Other languages
Japanese (ja)
Other versions
JP2016045470A (en
Inventor
金孝 関口
関口　　金孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
Original Assignee
Citizen Watch Co Ltd
Citizen Fine Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd, Citizen Fine Device Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP2014171977A priority Critical patent/JP6478526B2/en
Publication of JP2016045470A publication Critical patent/JP2016045470A/en
Application granted granted Critical
Publication of JP6478526B2 publication Critical patent/JP6478526B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Liquid Crystal (AREA)

Description

本発明は、液晶表示素子の製造方法に関するものである。   The present invention relates to a method for manufacturing a liquid crystal display element.

一般に、液晶表示素子は、表面に電極が形成された第一基板と、それに相対する表面に電極が形成された第二基板を、所定の位置関係でシール材を介して互いに貼り合せ、それにより形成された基板間の間隙に液晶を封入することで構成され、第一電極と第二電極との間に電位差を与えて液晶の配向を制御することにより各種表示を得るものである。   In general, a liquid crystal display element includes a first substrate having an electrode formed on a surface thereof and a second substrate having an electrode formed on the surface opposite thereto, bonded to each other through a sealing material in a predetermined positional relationship, thereby The liquid crystal is sealed in the gap between the formed substrates, and various displays are obtained by applying a potential difference between the first electrode and the second electrode to control the alignment of the liquid crystal.

図３は、従来の製造方法を用いて製造された液晶表示素子を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図、（Ｃ）Ｄ−Ｄ断面図である。液晶表示素子１５は以下のように構成されている。第一基板１は例えばガラス基板であり、その片側主面に接続電極３ａ、３ｂと第一電極４ａ、４ｂが形成されている。第二基板２は例えばガラス基板であり、第一基板１に相対する片側主面に第二電極５が形成されている。第一基板１と第二基板２の各電極形成面の最上面にはポリイミドなどの有機樹脂からなる配向膜８が薄く均一に形成されている。第一基板１と第二基板２は紫外線硬化樹脂などからなるシール材６を介して互いに貼り合わされ、それにより基板間に所定の間隙が形成されており、その間隙にシール材６の一部に設けられた注入口１８を介して液晶１６が注入され、注入口１８が紫外線硬化樹脂などからなる封口材１９により塞がれている。シール材６の一部には第一基板１上の接続電極３ａ、３ｂと第二基板２上の第二電極５とを電気的に接続する導通部９ａ、９ｂが設けられている。導通部９ａ、９ｂは導電性樹脂からなる導電性シール材で構成されている。（例えば、特許文献１、２参照）   3A and 3B are diagrams showing a liquid crystal display device manufactured by using a conventional manufacturing method, and are (A) a top view, (B) a CC sectional view, and (C) a DD sectional view. The liquid crystal display element 15 is configured as follows. The 1st board | substrate 1 is a glass substrate, for example, The connection electrodes 3a and 3b and the 1st electrodes 4a and 4b are formed in the one side main surface. The second substrate 2 is, for example, a glass substrate, and a second electrode 5 is formed on one main surface facing the first substrate 1. An alignment film 8 made of an organic resin such as polyimide is thinly and uniformly formed on the uppermost surfaces of the electrode formation surfaces of the first substrate 1 and the second substrate 2. The first substrate 1 and the second substrate 2 are bonded to each other via a sealing material 6 made of an ultraviolet curable resin or the like, whereby a predetermined gap is formed between the substrates, and a part of the sealing material 6 is formed in the gap. The liquid crystal 16 is injected through the injection port 18 provided, and the injection port 18 is closed by a sealing material 19 made of an ultraviolet curable resin or the like. Conductive portions 9 a and 9 b that electrically connect the connection electrodes 3 a and 3 b on the first substrate 1 and the second electrode 5 on the second substrate 2 are provided on a part of the sealing material 6. The conducting portions 9a and 9b are made of a conductive sealing material made of a conductive resin. (For example, see Patent Documents 1 and 2)

液晶表示素子１５を製造する際には、まず、片側主面に第一電極４ａ、４ｂと接続電極３ａ、３ｂを備えた第１基板１と、片側主面に第二電極５を備えた第二基板２を用意し、それらの各電極形成面に配向膜８を形成する。その際、導通部９ａ、９ｂを形成する領域には、予め配向膜８を形成しないようにする、あるいは、配向膜８を形成した後に除去することにより、接続電極３ａ、３ｂと第二電極５が露出された状態とする。次に、第一基板１の片側主面に接続電極３ａ、３ｂの一部を避けるようにシール材６を概ね枠状に塗布し、続いて、シール材６が塗布されていない接続電極３ａ、３ｂの一部に導電性シール材を塗布する。その後、第一基板１と第二基板２をシール材６と導電性シール材を介して互いに貼り合わせ、シール材６と導電性シール材を硬化させる。これより、第一基板１と第二基板２が互いに固定されると共に、シール材６と導電性シール材が一体化し、シール材６の一部に導通部９ａ、９ｂが形成された状態となる。そして、予めシール材６の一部に設けられた注入口１８から基板間に液晶１６を注入した後、注入口１８を封口材１９で塞ぐことにより液晶表示素子１５が完成する。   When the liquid crystal display element 15 is manufactured, first, the first substrate 1 provided with the first electrodes 4a and 4b and the connection electrodes 3a and 3b on one side main surface, and the second electrode 5 provided with the second electrode 5 on one side main surface. Two substrates 2 are prepared, and an alignment film 8 is formed on each electrode forming surface thereof. At this time, the connection electrodes 3a and 3b and the second electrode 5 are not formed in the region where the conductive portions 9a and 9b are formed, by not forming the alignment film 8 in advance or by removing the alignment film 8 after the alignment film 8 is formed. Is exposed. Next, the sealing material 6 is applied in a generally frame shape so as to avoid a part of the connection electrodes 3a and 3b on one side main surface of the first substrate 1, and subsequently, the connection electrodes 3a to which the sealing material 6 is not applied. A conductive sealing material is applied to a part of 3b. Then, the 1st board | substrate 1 and the 2nd board | substrate 2 are mutually bonded together through the sealing material 6 and a conductive sealing material, and the sealing material 6 and a conductive sealing material are hardened. Thus, the first substrate 1 and the second substrate 2 are fixed to each other, the sealing material 6 and the conductive sealing material are integrated, and the conductive portions 9a and 9b are formed in a part of the sealing material 6. . And after injecting the liquid crystal 16 between the board | substrates from the injection hole 18 previously provided in a part of the sealing material 6, the liquid crystal display element 15 is completed by plugging the injection hole 18 with the sealing material 19. FIG.

図４は、従来の製造方法を用いて製造された液晶表示素子が回路基板に実装された状態を表す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図である。液晶表示素子１５は、回路基板１０に主面を対向させて実装され、第一基板１に形成された第一電極４ａ、４ｂと接続電極３ａ、３ｂは、ワイヤー１１によって回路基板１０上の電極パッド１４ａ、１４ｂと電極パッド１３ａ、１３ｂにそれぞれ電気的に接続されている。第一基板１に形成された第一電極４ａ、４ｂにはワイヤー１１を介して電位が供給され、第二基板２に形成された第二電極５にはワイヤー１１、接続電極３ａ、３ｂ及び導通部９ａ、９ｂを介してそれとは異なる電位が供給され、それにより液晶１６の配向状態が変化する。   4A and 4B are views showing a state in which a liquid crystal display element manufactured using a conventional manufacturing method is mounted on a circuit board, and FIG. 4A is a top view and FIG. 4B is a cross-sectional view taken along line CC. The liquid crystal display element 15 is mounted with the main surface facing the circuit board 10, and the first electrodes 4 a and 4 b and the connection electrodes 3 a and 3 b formed on the first substrate 1 are electrodes on the circuit board 10 by wires 11. The pads 14a and 14b are electrically connected to the electrode pads 13a and 13b, respectively. A potential is supplied to the first electrodes 4a and 4b formed on the first substrate 1 through the wire 11, and the wire 11, the connection electrodes 3a and 3b, and the conduction are supplied to the second electrode 5 formed on the second substrate 2. A potential different from that is supplied through the portions 9a and 9b, whereby the alignment state of the liquid crystal 16 changes.

尚、上述の液晶表示素子１５は３Ｄビデオカメラや３Ｄメガネの液晶シャッターとして使用されるもので、例えば図に示すような円形の表示領域７を備えているが、表示領域はその外にも様々な形態を取り得る。   The liquid crystal display element 15 described above is used as a liquid crystal shutter of a 3D video camera or 3D glasses, and has a circular display area 7 as shown in the figure, for example. Can take various forms.

特開２００９−１５７１８８号公報JP 2009-157188 A 特開２００８−９６８７４号公報JP 2008-96874 A

従来の液晶表示素子の製造方法では、第一基板１上にシール材６を塗布した後、その状態のまま導電性シール材を塗布しているため、その間にシール材６を含む第一基板１の表面にゴミが付着したり、シール材６が変質したりする恐れがある。   In the conventional method of manufacturing a liquid crystal display element, since the sealing material 6 is applied on the first substrate 1 and then the conductive sealing material is applied as it is, the first substrate 1 including the sealing material 6 therebetween. There is a risk that dust will adhere to the surface of the surface or the seal material 6 may be altered.

また、二種類のシール材を一体化させなければならないため、その分、工程が複雑となり、標準的な製造ラインでは対応が困難である。製造ラインの変更は製造コストの増加を招く。   In addition, since two kinds of sealing materials must be integrated, the process becomes complicated accordingly, and it is difficult to cope with a standard production line. Changing the production line causes an increase in production cost.

また、第一基板１と第二基板２を貼り合わせる段階で導通部９ａ、９ｂを形成しているため、仮にそれよりも後の工程（液晶注入工程や封止工程）で不良が発生した場合には、特殊材料である導電性シール材を含めて廃棄することとなり、その分、製造コストが増加する。   In addition, since the conductive portions 9a and 9b are formed at the stage where the first substrate 1 and the second substrate 2 are bonded, if a defect occurs in a later process (liquid crystal injection process or sealing process). In this case, the conductive sealing material, which is a special material, is discarded, and the manufacturing cost is increased accordingly.

また、互いに材質の異なる二種類のシール材を介して第一基板１と第二基板２を貼り合わせているため、第一基板１と第二基板２との隙間が液晶注入領域内において不均一になり易い。このことは画像品質の低下、ひいては不良へと繋がる。   Further, since the first substrate 1 and the second substrate 2 are bonded together through two kinds of sealing materials of different materials, the gap between the first substrate 1 and the second substrate 2 is not uniform in the liquid crystal injection region. It is easy to become. This leads to a decrease in image quality and eventually to a defect.

本発明は、以上の問題点に鑑みたもので、安価で信頼性の高い液晶表示素子の製造方法を提供することを目的とする。   The present invention has been made in view of the above problems, and an object thereof is to provide a method for manufacturing a liquid crystal display element that is inexpensive and highly reliable.

液晶に電圧を印加するための第一電極及び導電路を引き回すための接続電極が形成された第一基板と、前記液晶に駆動電圧を印加するための第二電極が形成された第二基板とが、前記第一電極及び前記接続電極と前記第二電極とが互いに対向するようにシール材を介して貼り合わされ、前記接続電極と前記第二電極とが、前記シール材よりも外周側の領域において導電材を介して電気的に接続された液晶表示素子の製造方法であって、前記第一基板と前記第二基板とを、前記第一電極及び前記接続電極と前記第二電極とが互いに対向するように、前記シール材を介して貼り合わせる基板貼り合わせ工程と、前記貼り合わせ工程よりも後に、前記シール材よりも外周側の領域において互いに対向する前記接続電極と前記第二電極との間に液状の前記導電材を注入する導電材注入工程と、前記導電材注入工程よりも後に、前記接続電極と前記第二電極との間に前記導電材を介してパルス電流を印加することにより、前記導電材が注入された領域の前記接続電極上及び／又は前記第二電極上に存在する配向膜を除去する工程と、を有する液晶表示素子の製造方法とする。 A first substrate on which a first electrode for applying a voltage to the liquid crystal and a connection electrode for routing a conductive path are formed; a second substrate on which a second electrode for applying a driving voltage to the liquid crystal is formed; However, the first electrode, the connection electrode, and the second electrode are bonded via a sealing material such that the connection electrode and the second electrode are opposed to each other, and the connection electrode and the second electrode are on the outer peripheral side of the sealing material. A method of manufacturing a liquid crystal display element electrically connected via a conductive material in which the first substrate and the second substrate are connected to each other, and the first electrode, the connection electrode, and the second electrode are connected to each other. A substrate bonding step for bonding through the sealing material so as to face each other , and after the bonding step, the connection electrode and the second electrode facing each other in a region on the outer peripheral side of the sealing material of liquid in between A conductive material injection step of injecting the Kishirube material, later than the conductive material injection step, by applying a pulse current through the conductive material between the second electrode and the connection electrode, the conductive material And a step of removing the alignment film existing on the connection electrode and / or the second electrode in the region where the hydrogen is implanted .

前記導電材注入工程よりも後に、前記導電材が注入された領域の前記接続電極上及び／又は前記第二電極上に存在する配向膜をレーザーで除去することにより、液状の前記導電材を前記接続電極及び／又は前記第二電極に接触させる工程を有する液晶表示素子の製造方法とすることができる。   After the step of injecting the conductive material, the alignment film existing on the connection electrode and / or the second electrode in the region where the conductive material has been injected is removed with a laser, so that the liquid conductive material is removed. It can be set as the manufacturing method of the liquid crystal display element which has a process made to contact a connection electrode and / or said 2nd electrode.

前記導電材注入工程よりも前に、前記導電材が注入される領域の前記接続電極上及び／又は前記第二電極上に存在する配向膜をレーザーで除去する工程を有する液晶表示素子の製造方法とすることができる。   Prior to the conductive material injection step, a method of manufacturing a liquid crystal display element, including a step of removing an alignment film existing on the connection electrode and / or the second electrode in a region where the conductive material is injected with a laser It can be.

本発明によれば、安価で信頼性の高い液晶表示素子の製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of an inexpensive and reliable liquid crystal display element can be provided.

本発明の製造方法を用いて製造された液晶表示素子を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図、（Ｃ）Ｄ−Ｄ断面図BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the liquid crystal display element manufactured using the manufacturing method of this invention, (A) Top view, (B) CC sectional drawing, (C) DD sectional drawing. 本発明の製造方法を用いて製造された液晶表示素子が回路基板に実装された状態を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図The figure which shows the state by which the liquid crystal display element manufactured using the manufacturing method of this invention was mounted in the circuit board, (A) Top view, (B) CC sectional drawing 従来の製造方法を用いて製造された液晶表示素子を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図、（Ｃ）Ｄ−Ｄ断面図It is a figure which shows the liquid crystal display element manufactured using the conventional manufacturing method, (A) Top view, (B) CC sectional drawing, (C) DD sectional drawing. 従来の製造方法を用いて製造された液晶表示素子が回路基板に実装された状態を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図It is a figure which shows the state by which the liquid crystal display element manufactured using the conventional manufacturing method was mounted in the circuit board, (A) Top view, (B) CC sectional drawing

図１は、本発明の製造方法を用いて製造された液晶表示素子を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図、（Ｃ）Ｄ−Ｄ断面図である。液晶表示素子１７は以下のように構成されている。第一基板１は例えばガラス基板であり、片側主面上に接続電極３ａ、３ｂと第一電極４ａ、４ｂが形成されている。第二基板２は例えばガラス基板であり、第一基板１と相対する片側主面上に第二電極５が形成されている。第一基板１と第二基板２の各電極形成面の最上面には例えばポリイミドなどの有機樹脂からなる配向膜８が薄く均一に形成されている。第一基板１と第二基板２は例えば紫外線硬化樹脂からなるシール材６を介して所定の位置関係で互いに接着され、それにより基板間に間隙が形成されており、その間隙にシール材６の一部に設けられた注入口１８を介して液晶１６が注入され、注入口１８が樹脂などからなる封口材１９で塞がれている。   FIG. 1 is a view showing a liquid crystal display device manufactured by using the manufacturing method of the present invention, and is a (A) top view, (B) CC sectional view, and (C) DD sectional view. The liquid crystal display element 17 is configured as follows. The first substrate 1 is, for example, a glass substrate, and connection electrodes 3a and 3b and first electrodes 4a and 4b are formed on one main surface. The second substrate 2 is, for example, a glass substrate, and a second electrode 5 is formed on one main surface facing the first substrate 1. An alignment film 8 made of an organic resin such as polyimide is thinly and uniformly formed on the uppermost surfaces of the electrode formation surfaces of the first substrate 1 and the second substrate 2. The first substrate 1 and the second substrate 2 are bonded to each other in a predetermined positional relationship via a sealing material 6 made of, for example, an ultraviolet curable resin, thereby forming a gap between the substrates. Liquid crystal 16 is injected through an injection port 18 provided in a part, and the injection port 18 is closed with a sealing material 19 made of resin or the like.

シール材６よりも外周側に位置する第一基板１と第二基板２との隙間には、例えば銀ペーストなどの導電材で構成される導通部９ａ、９ｂが設けられている。導通部９ａ、９ｂの一端は第一基板１上の接続電極３ａ、３ｂにそれぞれ接続され、他端は第二基板２上の第二電極５に接続されている。   Conductive portions 9a and 9b made of a conductive material such as silver paste are provided in the gap between the first substrate 1 and the second substrate 2 located on the outer peripheral side of the sealing material 6. One end of each of the conductive portions 9 a and 9 b is connected to the connection electrodes 3 a and 3 b on the first substrate 1, and the other end is connected to the second electrode 5 on the second substrate 2.

図２は、本発明の製造方法を用いて製造された液晶表示素子が回路基板に実装された状態を示す図で、（Ａ）上面図、（Ｂ）Ｃ−Ｃ断面図である。液晶表示素子１７は回路基板１０上に第二基板２を対向させて実装されている。第一基板１に形成された第一電極４ａ、４ｂと接続電極３ａ、３ｂは、ワイヤー１１によって回路基板１０上の電極パッド１４ｂと電気的に接続されている。第一基板１に形成された第一電極４ａ、４ｂにはワイヤー１１を介して電位が供給され、第二基板２に形成された第二電極５にはワイヤー１１、接続電極３ａ、３ｂ及び導通部９ａ、９ｂを介してそれとは異なる電位が供給され、それにより液晶１６の配向状態が変化する。   2A and 2B are diagrams showing a state in which a liquid crystal display element manufactured by using the manufacturing method of the present invention is mounted on a circuit board. FIG. 2A is a top view and FIG. 2B is a cross-sectional view taken along line CC. The liquid crystal display element 17 is mounted on the circuit board 10 with the second substrate 2 facing it. The first electrodes 4 a and 4 b and the connection electrodes 3 a and 3 b formed on the first substrate 1 are electrically connected to the electrode pads 14 b on the circuit substrate 10 by wires 11. A potential is supplied to the first electrodes 4a and 4b formed on the first substrate 1 through the wire 11, and the wire 11, the connection electrodes 3a and 3b, and the conduction are supplied to the second electrode 5 formed on the second substrate 2. A potential different from that is supplied through the portions 9a and 9b, whereby the alignment state of the liquid crystal 16 changes.

以下、本発明の液晶表示素子の製造方法について説明する。まず、片側主面に厚さ１０ｎｍ程度の酸化インジウムスズ（ＩＴＯ）からなる第一電極４ａ、４ｂと接続電極３ａ、３ｂを備えた縦１２ｍｍ、横１６ｍｍ、厚さ７００μｍのホウケイサンガラスで構成される第１基板１と、それと同様に片側主面にＩＴＯからなる第二電極５を備えた縦１２ｍｍ、横１８ｍｍ、厚さ７００ｕｍのホウケイサンガラスで構成される第二基板２を用意し、それらのＩＴＯ形成面に、ＩＴＯを覆うようにポリイミド樹脂からなる配向膜８をそれぞれ形成する。配向膜８の形成方法は例えば以下のとおりである。まず、有機溶剤によって１００倍に希釈したポリイミド樹脂を基板表面に滴下し、スピンコーター装置で基板を高速回転させることで２００Åの厚みになるように均一に引き伸ばす。その後、３００℃で基板を加熱し、ポリイミド樹脂を硬化させる。次に、硬化したポリイミド樹脂に対し、ラビング装置によりラビングを行うことで配向膜８を形成する。その際、ラビング角度やラビングローラーの回転速度、加圧条件を液晶の種類や駆動モードなどに応じて適宜調整することで所望の表面状態を得る。   Hereinafter, the manufacturing method of the liquid crystal display element of this invention is demonstrated. First, it is composed of borosilicate glass having a length of 12 mm, a width of 16 mm, and a thickness of 700 μm provided with first electrodes 4 a and 4 b made of indium tin oxide (ITO) having a thickness of about 10 nm on one side main surface and connection electrodes 3 a and 3 b. And a second substrate 2 made of borosilicate glass having a length of 12 mm, a width of 18 mm, and a thickness of 700 μm, and a second electrode 5 made of ITO on one main surface. An alignment film 8 made of polyimide resin is formed on the ITO forming surface so as to cover the ITO. A method for forming the alignment film 8 is, for example, as follows. First, polyimide resin diluted 100 times with an organic solvent is dropped on the substrate surface, and the substrate is stretched uniformly to a thickness of 200 mm by rotating the substrate at high speed with a spin coater device. Thereafter, the substrate is heated at 300 ° C. to cure the polyimide resin. Next, the alignment film 8 is formed by rubbing the cured polyimide resin with a rubbing apparatus. At that time, a desired surface state is obtained by appropriately adjusting the rubbing angle, the rotation speed of the rubbing roller, and the pressurizing condition according to the type of liquid crystal, the driving mode, and the like.

続いて、配向膜８を形成した第一基板１と第二基板２とを第一電極４ａ、４ｂ及び接続電極３ａ、３ｂと第二電極５とが互いに対向するようにシール材６を介して貼り合わせる。シール材６には例えばφ６μｍのビーズスペーサーを重量比で数％含む紫外線硬化樹脂を使用し、第一基板１上の表示領域７の周囲に５００μｍの幅で接続電極３ａ、３ｂの一部を避けるように配置する。   Subsequently, the first substrate 1 and the second substrate 2 on which the alignment film 8 is formed are passed through the sealing material 6 so that the first electrodes 4a and 4b and the connection electrodes 3a and 3b and the second electrode 5 face each other. to paste together. For example, an ultraviolet curable resin containing several percent by weight of a φ6 μm bead spacer is used as the sealing material 6, and a part of the connection electrodes 3 a and 3 b is avoided with a width of 500 μm around the display region 7 on the first substrate 1. Arrange as follows.

その後、シール材６が塗布された状態の第一基板１と第二基板２とをそれぞれの表示領域７が互いに対応するように正確に重ね合わせ、エアバッグにより均一に加圧することにより、第一基板１と第二基板２との間に所定の間隙を形成する。   Thereafter, the first substrate 1 and the second substrate 2 in a state where the sealing material 6 is applied are accurately overlapped so that the respective display areas 7 correspond to each other, and the first substrate 1 and the second substrate 2 are uniformly pressurized by an airbag. A predetermined gap is formed between the substrate 1 and the second substrate 2.

続いて、シール材６を紫外線によって硬化する。このとき、紫外線照射ランプには例えば高圧水銀ランプを用い、紫外線の照射強度は１５０ｍＷ／ｃｍ２、照射時間は数百ｓｅｃとする。シール材６は紫外線を照射した後に熱を加えることで完全に硬化するため、更に１００℃の雰囲気中で数時間焼成することでシール材６を完全に硬化させる。 Subsequently, the sealing material 6 is cured by ultraviolet rays. At this time, for example, a high-pressure mercury lamp is used as the ultraviolet irradiation lamp, the ultraviolet irradiation intensity is 150 mW / cm 2 , and the irradiation time is several hundred seconds. Since the sealing material 6 is completely cured by applying heat after being irradiated with ultraviolet rays, the sealing material 6 is completely cured by baking for several hours in an atmosphere of 100 ° C.

次に、貼り合わされた第一基板１と第二基板２を真空中にて２００℃で数時間加熱して脱ガスを行った後、同じく真空中にてディスペンサーにより注入口付近に液晶１６を塗布し、そのまま数十分間放置することで毛細管現象により液晶を第一基板１と第二基板２との間隙に充填する。その後、真空層から貼り合わされた第一基板１と第二基板２を取り出し、注入口１８に紫外線硬化樹脂からなる封口材１９を塗布して硬化させることで封止する。   Next, after degassing by heating the bonded first substrate 1 and second substrate 2 at 200 ° C. for several hours in a vacuum, the liquid crystal 16 is applied in the vicinity of the injection port by a dispenser in the same vacuum. Then, the liquid crystal is filled in the gap between the first substrate 1 and the second substrate 2 by capillary action by being left as it is for several tens of minutes. Thereafter, the first substrate 1 and the second substrate 2 bonded together from the vacuum layer are taken out and sealed by applying a sealing material 19 made of an ultraviolet curable resin to the injection port 18 and curing it.

続いて、第一基板１と第二基板２の表面に形成されている配向膜８のうち、シール材６よりも外周側の領域であって接続電極３ａ、３ｂと第二電極５とが互いに対向する領域の一部にそれぞれレーザーを照射し、その部分の配向膜８を除去する。このとき、レーザー光源には例えばフッ化アルゴンエキシマレーザーを用い、パルス幅は２０ｎｓｅｃ、エネルギー密度は２００ｍｍJ／ｃｍ２とする。 Subsequently, in the alignment film 8 formed on the surfaces of the first substrate 1 and the second substrate 2, the connection electrodes 3a, 3b and the second electrode 5 are regions on the outer peripheral side of the sealing material 6 and are connected to each other. Each of the opposed regions is irradiated with a laser to remove the alignment film 8 at that portion. At this time, for example, an argon fluoride excimer laser is used as the laser light source, the pulse width is 20 nsec, and the energy density is 200 mmJ / cm 2 .

次に、配向膜８を除去した領域の第一基板１と第二基板２との隙間に銀ペーストをディスペンサーで注入する。銀ペーストは毛細管現象で間隙内部に浸透して接続電極３ａ、３ｂと第二電極５まで到達し、それらと電気的に接続される。その後、銀ペーストを硬化させることで導通部９ａ、９ｂが形成され、図１に示すような液晶表示素子１７が完成する。   Next, a silver paste is injected into the gap between the first substrate 1 and the second substrate 2 in the region where the alignment film 8 has been removed with a dispenser. The silver paste penetrates into the gap by capillarity and reaches the connection electrodes 3a, 3b and the second electrode 5, and is electrically connected to them. Thereafter, the conductive portions 9a and 9b are formed by curing the silver paste, and the liquid crystal display element 17 as shown in FIG. 1 is completed.

従来の製造方法では、第一基板１上にシール材６を塗布した後、そのままの状態で導電性シール材を塗布しているため、その間にシール材６を含む第一基板１の表面にゴミが付着したり、シール材６が変質したりする恐れがあるが、本発明の製造方法では、第一基板１上にシール材６を塗布してからそこに第二基板２を貼り合わせるまでの時間が短いため、そのようなリスクが低減される。   In the conventional manufacturing method, after applying the sealing material 6 on the first substrate 1, the conductive sealing material is applied as it is, so that dust is deposited on the surface of the first substrate 1 including the sealing material 6 between them. However, in the manufacturing method of the present invention, the process from applying the sealing material 6 on the first substrate 1 to bonding the second substrate 2 to the first substrate 1 is likely to occur. Because of the short time, such risks are reduced.

また、従来の製造方法では、二種類のシール材を一つのシール材として一体化させなければならないため、工程が複雑となり、標準的な製造ラインでは対応が困難であるが、本発明の製造方法では、使用するシール材は一種類であるため、標準的な製造ラインでそのまま対応することができる。   Further, in the conventional manufacturing method, since two kinds of sealing materials must be integrated as one sealing material, the process becomes complicated, and it is difficult to cope with a standard manufacturing line. Then, since there is only one kind of sealing material to be used, it can be handled as it is in a standard production line.

また、従来の製造方法では、第一基板１と第二基板２を貼り合わせる段階で導通部９ａ、９ｂを形成しているため、仮にそれよりも後の工程（例えば液晶注入工程や封止工程）で不良が発生した場合には、特殊材料である導電性シール材を含めて廃棄することとなり、その分、材料費が増加することになるが、本発明の製造方法では、液晶表示素子が完成する直前の段階で導通部９ａ、９ｂを形成しているため、そのようなリスクが低減される。   Moreover, in the conventional manufacturing method, since the conduction | electrical_connection part 9a, 9b is formed in the step which bonds the 1st board | substrate 1 and the 2nd board | substrate 2, a process (for example, a liquid crystal injection process or a sealing process) after that temporarily ), The conductive sealing material, which is a special material, is discarded, and the material cost increases accordingly. In the manufacturing method of the present invention, the liquid crystal display element is Since the conducting portions 9a and 9b are formed immediately before completion, such a risk is reduced.

また、従来の製造方法では、互いに材質の異なる二種類のシール材（シール材６と導電性シール材）を介して第一基板１と第二基板２とを貼り合わせているため、第一基板１と第二基板２との間隙が液晶注入領域内において不均一になり易いが、本発明の製造方法では、一種類のシール材（シール材６）を介して第一基板１と第二基板２とを貼り合わせており、更に、導通部９ａ、９ｂを液晶注入領域から離れたシール材６よりも外周側の領域において第一基板１と第二基板２との隙間に毛細管現象を利用して液状の導電材を緩やかに注入することで形成しているため、第一基板１と第二基板２との間隙が液晶注入領域内において不均一になり難い。   Moreover, in the conventional manufacturing method, since the 1st board | substrate 1 and the 2nd board | substrate 2 are bonded together through two types of sealing materials (seal material 6 and electroconductive sealing material) from which a mutually different material differs, Although the gap between the first substrate 2 and the second substrate 2 is likely to be non-uniform in the liquid crystal injection region, in the manufacturing method of the present invention, the first substrate 1 and the second substrate are interposed via one kind of sealing material (sealing material 6). In addition, the capillarity is used in the gap between the first substrate 1 and the second substrate 2 in the region on the outer peripheral side of the sealing material 6 away from the liquid crystal injection region. Therefore, the gap between the first substrate 1 and the second substrate 2 is unlikely to be uneven in the liquid crystal injection region.

本実施例における製造方法が前述の実施例１における製造方法と異なる点は、銀ペーストを注入する工程の後に、レーザーにより配向膜を除去する工程と、パルス電流により配向膜を除去する工程を有する点である。   The manufacturing method in the present embodiment is different from the manufacturing method in the first embodiment described above in that after the step of injecting the silver paste, the step of removing the alignment film with a laser and the step of removing the alignment film with a pulse current are included. Is a point.

具体的には、第一基板１と第二基板２との間隙に液晶を注入して注入口を封止した後、まず、導通部９ａ、９ｂが形成される領域の第一基板１と第二基板２との間隙に銀ペーストをディスペンサーで注入する。この時、銀ペーストは間隙内部へと浸透していくが、配向膜８に阻まれて接続電極３ａ、３ｂと第二電極５には接触しない。その後、銀ペーストが完全に硬化する前に、銀ペーストが注入された領域の配向膜８にレーザーを照射してその部分の配向膜８を除去し、その配向膜８が除去された部分に銀ペーストを流入させて接続電極３ａ、３ｂと第二電極５に接触させることにより、互いに電気的に接続させる。この時、配向膜８の除去領域には銀ペーストが存在するため、レーザーを照射しても配向膜８の屑が周りに飛散せず、周囲を汚染することはない。このことは、その後の洗浄工程の簡略化へと繋がる。   Specifically, after the liquid crystal is injected into the gap between the first substrate 1 and the second substrate 2 to seal the injection port, first, the first substrate 1 and the first substrate 1 in the region where the conductive portions 9a and 9b are formed are formed. A silver paste is injected into the gap between the two substrates 2 with a dispenser. At this time, the silver paste penetrates into the gap, but is blocked by the alignment film 8 and does not contact the connection electrodes 3 a and 3 b and the second electrode 5. Thereafter, before the silver paste is completely cured, the alignment film 8 in the region where the silver paste has been injected is irradiated with a laser to remove the portion of the alignment film 8, and the portion where the alignment film 8 has been removed is subjected to silver. By causing the paste to flow into contact with the connection electrodes 3a, 3b and the second electrode 5, they are electrically connected to each other. At this time, since the silver paste is present in the removal region of the alignment film 8, even if the laser is irradiated, the debris of the alignment film 8 is not scattered around and the surroundings are not contaminated. This leads to simplification of the subsequent cleaning process.

続いて、図２に示すように回路基板１０に液晶表示素子１７を実装した後、回路基板１０上の電極パッド１３ａ、１３ｂに対して、例えば５０Ｈｚで１００Ｖの矩形状のパルス電流を３００秒印加する。印加されたパルス電流はワイヤー１１を介して接続電極３ａ、３ｂ、導通部９ａ、９ｂ、第二電極５へと流れる。仮に銀ペーストと接続電極３ａ、３ｂ及び第二電極２との間に配向膜８が残っていたとしても、パルス電流により配向膜８が絶縁破壊を起こして除去されるため、導電性を改善することができる。   Subsequently, as shown in FIG. 2, after the liquid crystal display element 17 is mounted on the circuit board 10, a rectangular pulse current of, for example, 100 V at 50 Hz is applied to the electrode pads 13a and 13b on the circuit board 10 for 300 seconds. To do. The applied pulse current flows through the wire 11 to the connection electrodes 3a and 3b, the conduction portions 9a and 9b, and the second electrode 5. Even if the alignment film 8 remains between the silver paste, the connection electrodes 3a, 3b, and the second electrode 2, the alignment film 8 is removed by dielectric breakdown due to the pulse current, so that the conductivity is improved. be able to.

尚、配向膜８をレーザーにより除去する工程と、配向膜８をパルス電流により除去する工程は、順序を互いに入れ替えて実施しても良く、また、何れか一方のみを実施しても良い。   Note that the step of removing the alignment film 8 with a laser and the step of removing the alignment film 8 with a pulse current may be carried out in a different order, or only one of them may be carried out.

また、導通部９ａ、９ｂを形成する領域の配向膜８は、第一基板１と第二基板２との間隙に導電材を注入する前に予め除去しておく、あるいは、予め形成しないようにしておくことも可能である。特に前者の方法において、仮に第一基板１と第二基板２とを貼り合わせた後に配向膜８をレーザーで除去すれば、レーザーを第一基板１と第二基板２の何れか一方側から照射するだけで第一基板１と第二基板２の両側の配向膜８を除去することができ、加えて、レーザーにより除去された配向膜８が飛散して表示領域７に付着するのを防止することができる。但し、配向膜８を除去する手段としては、レーザーに限らず、エッチングなどを用いても良い。   The alignment film 8 in the region where the conductive portions 9a and 9b are to be formed is removed in advance before the conductive material is injected into the gap between the first substrate 1 and the second substrate 2, or is not formed in advance. It is also possible to keep it. In particular, in the former method, if the alignment film 8 is removed with a laser after the first substrate 1 and the second substrate 2 are bonded together, the laser is irradiated from either the first substrate 1 or the second substrate 2. By doing so, the alignment films 8 on both sides of the first substrate 1 and the second substrate 2 can be removed, and in addition, the alignment film 8 removed by the laser is prevented from scattering and adhering to the display region 7. be able to. However, the means for removing the alignment film 8 is not limited to laser, and etching or the like may be used.

尚、ここで説明した配向膜８の除去方法（予め除去しておくあるいは形成しない方法）と、実施例１、２に示した配向膜８の除去方法（レーザーによる除去）は、第一基板１側の配向膜８と第二基板２側の配向膜８に対して選択的に適用することが可能である。具体的には、例えば、第一基板１側の配向膜８については、第一基板１と第二基板２との間隙に導電材を注入する前に予め除去しておき、第二基板２側の配向膜８については、第一基板１と第二基板２との間隙に導電材を注入した後にレーザーで除去することが挙げられるが、その組み合わせには限定されない。   The method for removing the alignment film 8 described here (a method for removing or not forming the alignment film in advance) and the method for removing the alignment film 8 shown in Examples 1 and 2 (removal by laser) are used for the first substrate 1. This can be selectively applied to the alignment film 8 on the side and the alignment film 8 on the second substrate 2 side. Specifically, for example, the alignment film 8 on the first substrate 1 side is removed in advance before injecting a conductive material into the gap between the first substrate 1 and the second substrate 2, and the second substrate 2 side The alignment film 8 may be removed by laser after injecting a conductive material into the gap between the first substrate 1 and the second substrate 2, but the combination is not limited.

第一基板１に形成される接続電極３ａ、３ｂ及び第一電極４ａ、４ｂの形状、第二基板２に形成される第二電極５の形状は、その他種々の形状を選択することが可能である。   Various other shapes can be selected as the shapes of the connection electrodes 3a and 3b and the first electrodes 4a and 4b formed on the first substrate 1 and the shape of the second electrode 5 formed on the second substrate 2. is there.

１ 第一基板
２ 第二基板
３ａ 接続電極
３ｂ 接続電極
４ａ 第一電極
４ｂ 第一電極
５ 第二電極
６ シール材
７ 表示領域
８ 配向膜
９ａ 導通部
９ｂ 導通部
１０ 回路基板
１１ ワイヤー
１２ コネクター
１３ａ 電極パッド
１３ｂ 電極パッド
１４ａ 電極パッド
１４ｂ 電極パッド
１５ 液晶表示素子
１６ 液晶
１７ 液晶表示素子
１８ 注入口
１９ 封口材 DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 2nd board | substrate 3a Connection electrode 3b Connection electrode 4a 1st electrode 4b 1st electrode 5 2nd electrode 6 Sealing material 7 Display area 8 Orientation film 9a Conductive part 9b Conductive part 10 Circuit board 11 Wire 12 Connector 13a Electrode Pad 13b Electrode pad 14a Electrode pad 14b Electrode pad 15 Liquid crystal display element 16 Liquid crystal 17 Liquid crystal display element 18 Inlet 19 Sealing material

Claims (3)

液晶に電圧を印加するための第一電極及び導電路を引き回すための接続電極が形成された第一基板と、前記液晶に駆動電圧を印加するための第二電極が形成された第二基板とが、前記第一電極及び前記接続電極と前記第二電極とが互いに対向するようにシール材を介して貼り合わされ、前記接続電極と前記第二電極とが、前記シール材よりも外周側の領域において導電材を介して電気的に接続された液晶表示素子の製造方法であって、
前記第一基板と前記第二基板とを、前記第一電極及び前記接続電極と前記第二電極とが互いに対向するように、前記シール材を介して貼り合わせる基板貼り合わせ工程と、
前記貼り合わせ工程よりも後に、前記シール材よりも外周側の領域において互いに対向する前記接続電極と前記第二電極との間に液状の前記導電材を注入する導電材注入工程と、
前記導電材注入工程よりも後に、前記接続電極と前記第二電極との間に前記導電材を介してパルス電流を印加することにより、前記導電材が注入された領域の前記接続電極上及び／又は前記第二電極上に存在する配向膜を除去する工程と、
を有することを特徴とする液晶表示素子の製造方法。 A first substrate on which a first electrode for applying a voltage to the liquid crystal and a connection electrode for routing a conductive path are formed; a second substrate on which a second electrode for applying a driving voltage to the liquid crystal is formed; However, the first electrode, the connection electrode, and the second electrode are bonded via a sealing material such that the connection electrode and the second electrode are opposed to each other, and the connection electrode and the second electrode are on the outer peripheral side of the sealing material. A method of manufacturing a liquid crystal display element electrically connected via a conductive material in
A substrate laminating step of laminating the first substrate and the second substrate via the sealing material so that the first electrode and the connection electrode and the second electrode face each other;
After the bonding step, a conductive material injection step of injecting the liquid conductive material between the connection electrode and the second electrode facing each other in a region on the outer peripheral side of the seal material,
After the step of injecting the conductive material, a pulse current is applied between the connection electrode and the second electrode via the conductive material, so that the region on which the conductive material is injected and / or Or removing the alignment film present on the second electrode;
A method for producing a liquid crystal display element, comprising: 前記導電材注入工程よりも後に、前記導電材が注入された領域の前記接続電極上及び／又は前記第二電極上に存在する配向膜をレーザーで除去することにより、前記導電材を前記接続電極及び／又は前記第二電極に接触させる工程を有することを特徴とする請求項１に記載の液晶表示素子の製造方法。 After the step of injecting the conductive material, the alignment material existing on the connection electrode and / or the second electrode in the region where the conductive material has been injected is removed with a laser, thereby removing the conductive material from the connection electrode. The method for manufacturing a liquid crystal display element according to claim 1, further comprising a step of contacting the second electrode. 前記導電材注入工程よりも前に、前記導電材が注入される領域の前記接続電極上及び／又は前記第二電極上に存在する配向膜をレーザーで除去する工程を有することを特徴とする請求項１または２に記載の液晶表示素子の製造方法。
Before the step of injecting the conductive material, the method further comprises a step of removing an alignment film existing on the connection electrode and / or the second electrode in a region where the conductive material is injected with a laser. Item 3. A method for producing a liquid crystal display element according to Item 1 or 2.
JP2014171977A 2014-08-26 2014-08-26 Manufacturing method of liquid crystal display element Active JP6478526B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014171977A JP6478526B2 (en) 2014-08-26 2014-08-26 Manufacturing method of liquid crystal display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014171977A JP6478526B2 (en) 2014-08-26 2014-08-26 Manufacturing method of liquid crystal display element

Publications (2)

Publication Number Publication Date
JP2016045470A JP2016045470A (en) 2016-04-04
JP6478526B2 true JP6478526B2 (en) 2019-03-06

Family

ID=55636055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014171977A Active JP6478526B2 (en) 2014-08-26 2014-08-26 Manufacturing method of liquid crystal display element

Country Status (1)

Country Link
JP (1) JP6478526B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109324432B (en) * 2018-11-08 2021-01-01 深圳市华星光电半导体显示技术有限公司 Display panel and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0139374B1 (en) * 1994-12-30 1998-06-15 김광호 Transfer contact forming method and its structure of tft lcd
JP2000047241A (en) * 1998-07-29 2000-02-18 Sharp Corp Preparation of liquid crystal display device
CN102854651B (en) * 2012-09-27 2015-07-15 豪威科技(上海)有限公司 Reflective liquid crystal panel and manufacturing method thereof

Also Published As

Publication number Publication date
JP2016045470A (en) 2016-04-04

Similar Documents

Publication Publication Date Title
KR101787240B1 (en) Display device
JP5776971B2 (en) Connection structure and display device including the connection structure
TWI416199B (en) Touch panel
TWI516833B (en) Liquid crystal display device and method of manufacturing the same
WO2016161719A1 (en) Anisotropic conductive adhesive film, display device and repairing method therefor
TW201931345A (en) Electronic device and manufacturing method thereof
TW201728972A (en) Method for manufacturing optical compound film structure with controllable transparency pattern changes
TW201200933A (en) Method for fabricating display panel
WO2016150033A1 (en) Electronic device packaging method and packaging system
US20150015933A1 (en) Electrophoretic device, manufacturing method for electrophoretic device, and electronic apparatus
WO2013001771A1 (en) Display device manufacturing method
JP6478526B2 (en) Manufacturing method of liquid crystal display element
JP2009015131A (en) Method for manufacturing display device, and display device
US20210129515A1 (en) Residual layer removal method, residual layer removal device, and display module
CN104570520B (en) A kind of liquid crystal lens
JP5538948B2 (en) Manufacturing method of liquid crystal display element
TWI564637B (en) Liquid crystal display panel and method of fabricating the same
JP4978248B2 (en) Liquid crystal display device and manufacturing method thereof
JP5358143B2 (en) Manufacturing method of liquid crystal display device
JP2017024947A (en) Laminated body and method for manufacturing the same, and electronic device and method for manufacturing the same
JP2005268400A (en) Junction apparatus of semiconductor device
KR101813531B1 (en) Transparent electrode and manufacturing method of this
CN103682178A (en) Packaging method of organic light emitting diode and organic light emitting diode device
JP4370788B2 (en) Manufacturing method of electro-optical device
JP6561767B2 (en) Manufacturing method of liquid crystal display device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171110

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171120

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180604

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180801

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190205

R150 Certificate of patent or registration of utility model

Ref document number: 6478526

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150