JP6475502B2 - Circuit board held and fixed by mechanical structure, and electronic device using the same - Google Patents

Circuit board held and fixed by mechanical structure, and electronic device using the same Download PDF

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JP6475502B2
JP6475502B2 JP2015016552A JP2015016552A JP6475502B2 JP 6475502 B2 JP6475502 B2 JP 6475502B2 JP 2015016552 A JP2015016552 A JP 2015016552A JP 2015016552 A JP2015016552 A JP 2015016552A JP 6475502 B2 JP6475502 B2 JP 6475502B2
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circuit board
vertex
gripped
electronic device
circuit
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JP2016143696A (en
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淳史 倉内
淳史 倉内
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Honda Motor Co Ltd
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Description

本発明は、回路基板に関し、特に、筺体等の機械的構造物により把持され固定される回路基板、及び当該回路基板を用いた電子装置に関する。   The present invention relates to a circuit board, and more particularly, to a circuit board that is held and fixed by a mechanical structure such as a housing, and an electronic device using the circuit board.

一般に、電子回路を用いる装置では、電気部品が搭載された回路基板を筺体内に収容し、筺体内に設けられた内部コネクタを介して、筺体外から引き込んだ電源ラインや通信ラインと回路基板との接続が行われる。   Generally, in an apparatus using an electronic circuit, a circuit board on which an electrical component is mounted is accommodated in a housing, and a power line or a communication line drawn from outside the housing and a circuit board through an internal connector provided in the housing. Connection is made.

通常、このような内部コネクタとしては、複数の電極を備えた多芯コネクタが用いられ、内部コネクタに求められる電極の数は、電子回路の高機能化に伴う処理情報の増大と共に増加する。一方で、装置の小型化の要求は不変であり、コネクタサイズの増大を招くことなく電極数を増加させるため、各電極の幅が縮小される。その結果、電子回路を用いる装置では、使用される内部コネクタの電極幅は１ｍｍ未満であることが多い。   Usually, as such an internal connector, a multi-core connector provided with a plurality of electrodes is used, and the number of electrodes required for the internal connector increases with an increase in processing information accompanying an increase in functionality of an electronic circuit. On the other hand, the demand for downsizing the device is unchanged, and the width of each electrode is reduced in order to increase the number of electrodes without increasing the connector size. As a result, in an apparatus using an electronic circuit, the electrode width of the internal connector used is often less than 1 mm.

ところで、電子回路における動作の安定性の面からは、回路基板の設けられるグランドパターンと電源からのグランドラインとの接続箇所における接触面積は、できるだけ広いことが望ましい。このため、上記のような１ｍｍ未満の電極幅を持つ多芯コネクタを用いてグランドラインを接続する場合には、グランドラインとの接触面積を確保すべく、多数の電極が使用される。しかしながら、コネクタサイズの増大を招かないように、限られた電極数の中で情報伝送に必要な電極数を確保しつつグランドライン接続のための電極数の数を増やすことは、回路設計の観点からは大きな困難を伴う。   By the way, from the viewpoint of operational stability in the electronic circuit, it is desirable that the contact area at the connection point between the ground pattern provided on the circuit board and the ground line from the power source is as large as possible. For this reason, when connecting a ground line using a multi-core connector having an electrode width of less than 1 mm as described above, a large number of electrodes are used to ensure a contact area with the ground line. However, in order to prevent an increase in connector size, increasing the number of electrodes for ground line connection while securing the number of electrodes necessary for information transmission within the limited number of electrodes is a viewpoint of circuit design. From there is a big difficulty.

また、車両の動作を制御する電子制御装置（ＥＣＵ、Electronic Control Unit）のように、エンジン等からの大きな電磁輻射雑音に晒される制御装置においては、グランドライン接続における接触面積は特に広く設ける必要があり、電極幅の狭い電極を多数用いるだけでは、放射雑音の影響を十分に回避することは困難となる。   In addition, in a control device that is exposed to large electromagnetic radiation noise from an engine or the like, such as an electronic control unit (ECU, Electronic Control Unit) that controls the operation of the vehicle, it is necessary to provide a particularly large contact area for ground line connection. It is difficult to sufficiently avoid the influence of radiation noise only by using a large number of electrodes having a narrow electrode width.

この場合、例えば、電源のグランドを筺体に接続し、回路基板のグランドパターンと筺体との間に幅の広い導体板等を設け、当該導体板を回路基板と筺体とにそれぞれハンダ付けして固定する方法が考えられる。しかしながら、導体板をハンダ付けする構成では、筺体から回路基板を着脱することができないことから、回路基板上の電子回路の保守が困難になるという不都合が生ずる。   In this case, for example, the ground of the power supply is connected to the housing, a wide conductor plate is provided between the ground pattern of the circuit board and the housing, and the conductor plate is fixed to the circuit board and the housing by soldering. A way to do this is conceivable. However, in the configuration in which the conductor plate is soldered, the circuit board cannot be attached to and detached from the housing, so that there is a disadvantage that maintenance of the electronic circuit on the circuit board becomes difficult.

このような不都合を回避する方法として、電源のグランドに接続された筺体内の２つの機械的構造物により、回路基板の外周部に設けられたグランドパターン部分を挟み込んで、当該回路基板を固定すると共に当該グランドパターンと電源からのグランドラインとの電気的接続を行う構成が知られている。このような構成は、例えば、筺体内に設けられた二つの導体により回路基板を挟み、当該二つの導体を連結するネジを締めることにより、当該グランドパターン部分と当該導体とを加圧接触させて実現することができる。   As a method of avoiding such inconvenience, the circuit board is fixed by sandwiching the ground pattern portion provided on the outer periphery of the circuit board by two mechanical structures connected to the ground of the power source. In addition, a configuration is known in which the ground pattern is electrically connected to a ground line from a power source. In such a configuration, for example, the circuit board is sandwiched between two conductors provided in the housing, and the ground pattern portion and the conductor are brought into pressure contact with each other by tightening a screw connecting the two conductors. Can be realized.

上記のようなグランドパターン部分を挟み込む方法は、グランドライン接続部分の接触面積を広くとることができ、かつ、上記ネジを緩めることにより筺体から回路基板を着脱することも可能となるので、上記不都合を解消することができる。   The method of sandwiching the ground pattern portion as described above can increase the contact area of the ground line connection portion, and also allows the circuit board to be attached to and detached from the housing by loosening the screw. Can be eliminated.

しかしながら、電子装置に用いる回路基板は、当該回路基板上への部品実装を自動機械により行う都合等から矩形形状であることが一般的であり、このような矩形形状の回路基板の外周部を挟み込む場合には、当該回路基板での機械的損傷を招きやすい。例えば、回路基板の外周の１辺のみを挟み込む場合には、矩形の回路基板が片持ち状態で固定されることから共振振動が生じた場合に破損に至る可能性がある。また、例えば、回路基板外周の対向する２辺をそれぞれ挟み込む場合には、上記共振振動の問題は軽減されるものの、筺体素材と回路基板素材との間の線膨張係数差により回路基板に応力が加わることで更なる機械的損傷の原因となり得る。また、挟み込み箇所が２つに分離されることにより、それぞれの挟み込み箇所に適切な挟み込み力（把持力）を生じさせるべく、機械構造物に設けるべきネジの数も増加し、筺体組み立ての時間が長くなってコスト高ともなる。   However, a circuit board used for an electronic device is generally rectangular because of the convenience of mounting components on the circuit board by an automatic machine, and sandwiches the outer periphery of such a rectangular circuit board. In such a case, the circuit board is likely to be mechanically damaged. For example, when only one side of the outer periphery of the circuit board is sandwiched, the rectangular circuit board is fixed in a cantilevered state, and therefore there is a possibility that damage occurs when resonance vibration occurs. In addition, for example, when the two opposite sides of the circuit board outer periphery are sandwiched, the problem of resonance vibration is reduced, but stress is applied to the circuit board due to the difference in linear expansion coefficient between the housing material and the circuit board material. Adding it can cause further mechanical damage. In addition, by separating the sandwiching portions into two parts, the number of screws to be provided on the machine structure is increased in order to generate an appropriate sandwiching force (gripping force) at each sandwiching portion, and the time for assembling the housing is increased. Longer and more expensive.

上記の如く、回路基板を２つの機械的構造物の間に把持して固定する従来の電子装置は、熱膨張や機械的振動等に起因する当該回路基板の機械的損傷の防止及び生産コストの低減の観点から、なお改善の余地がある。   As described above, a conventional electronic device that holds and fixes a circuit board between two mechanical structures prevents mechanical damage to the circuit board due to thermal expansion, mechanical vibration, etc. and reduces production costs. There is still room for improvement in terms of reduction.

本発明の一の態様は、機械的構造物である２つの支持体の間に把持されて固定される回路基板であって、当該回路基板は、平面視が三角形であり、当該三角形の一の頂点を挟む２辺に沿う帯状部分において前記支持体により把持され、前記支持体により把持される前記帯状部分と重なるようにグランドパターンが形成されている。
本発明の他の態様によると、平面視が直角三角形であって、前記一の頂点は直角を為す頂点である。
本発明の他の態様によると、平面視が直角二等辺三角形であって、前記一の頂点は直角を為す頂点である。
本発明の他の態様によると、直角を為す前記頂点を挟む２辺の方向に沿って回路部品が実装されている。
本発明の他の態様によると、前記三角形の回路基板は、矩形形状の回路基板であって当該矩形形状の辺の方向に沿って回路部品が実装された回路基板を当該回路基板の対角線に沿って切断することにより、作製される。
本発明の他の態様は、平面視が三角形の前記回路基板と、当該回路基板を支持する前記支持体を備えた筺体と、を有する電子装置である。
本発明の他の態様によると、前記電子装置は、前記筺体のうち平面視が三角形の前記回路基板を収容する部分以外の部分に放熱フィンが形成されている。 One embodiment of the present invention is a circuit board that is gripped and fixed between two supports, which are mechanical structures, and the circuit board has a triangular shape in plan view. A ground pattern is formed so as to be gripped by the support body in a belt-like portion along two sides sandwiching the apex and to overlap the belt-like portion gripped by the support body.
According to another aspect of the present invention , the planar view is a right triangle, and the one vertex is a vertex making a right angle.
According to another aspect of the invention, the planar view is a right isosceles triangle, and the one vertex is a vertex forming a right angle.
According to another aspect of the present invention, circuit components are mounted along the direction of two sides sandwiching the vertex that forms a right angle.
According to another aspect of the present invention, the triangular circuit board is a rectangular circuit board, and a circuit board on which circuit components are mounted along the direction of the side of the rectangular shape is along a diagonal line of the circuit board. It is produced by cutting.
Another aspect of the present invention is an electronic device including the circuit board having a triangular shape in plan view and a housing including the support body that supports the circuit board.
According to another aspect of the present invention, in the electronic device, heat radiating fins are formed in a portion other than the portion that accommodates the circuit board having a triangular plan view in the casing.

本発明の一実施形態に係る回路基板を用いた電子装置の構成を示す図である。It is a figure which shows the structure of the electronic device using the circuit board which concerns on one Embodiment of this invention. 図１に示す電子装置の内部の構成を示す図である。It is a figure which shows the structure inside the electronic device shown in FIG. 本発明の一実施形態に係る回路基板の製造に用いられる矩形形状の回路基板の一例を示す図である。It is a figure which shows an example of the rectangular circuit board used for manufacture of the circuit board which concerns on one Embodiment of this invention.

以下、図面を参照して、本発明の実施の形態を説明する。なお、本実施形態では、一例として、車両に搭載されて当該車両の動作を制御する制御装置である電子装置に用いられる回路基板を示しているが、本発明に係る回路基板は、本用途に限られるものではなく、車両制御を行う制御装置以外の、他の装置、機器等にも同様に適用し得る。   Embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, as an example, a circuit board that is mounted on a vehicle and used in an electronic device that is a control device that controls the operation of the vehicle is shown. However, the circuit board according to the present invention is used for this application. The present invention is not limited, and the present invention can be similarly applied to other devices and devices other than the control device that performs vehicle control.

図１は、本発明の一実施形態に係る回路基板を用いた電子装置の構成を示す図である。本実施形態に示す電子装置は、例えば、車両に搭載されて当該車両の動作を制御する制御装置である。ただし、本発明は、そのような制御装置に限られるものではなく、車両制御を行う制御装置以外の、他の機械、機器等にも同様に適用し得る。   FIG. 1 is a diagram showing a configuration of an electronic device using a circuit board according to an embodiment of the present invention. The electronic device shown in the present embodiment is, for example, a control device that is mounted on a vehicle and controls the operation of the vehicle. However, the present invention is not limited to such a control device, and can be similarly applied to other machines, devices, and the like other than the control device that performs vehicle control.

図１Ａは、本電子装置１０の上面図であり、図１Ｂは、図１Ａに示す電子装置１０の断面を示すＳＳ矢視図である。
電子装置１０は、例えば車両に搭載されて当該車両のエンジン制御を行う電子制御ユニット（ＥＣＵ、Electronic Control Unit）であり、導電性のベース１００ａとカバー１００ｂとにより構成される筺体１００と、本発明の一実施形態に係る回路基板１０２とを有している（図１Ｂ）。筺体１００は、当該筺体が搭載される車両の車体のうち導電性を有する部分に取り付けられ（不図示）、当該車体を介して電源のグランド端子（不図示）に接続されている。 FIG. 1A is a top view of the electronic device 10, and FIG. 1B is an SS arrow view showing a cross section of the electronic device 10 shown in FIG. 1A.
The electronic device 10 is, for example, an electronic control unit (ECU, Electronic Control Unit) that is mounted on a vehicle and controls the engine of the vehicle. Circuit board 102 according to one embodiment (FIG. 1B). The housing 100 is attached to a conductive part (not shown) of the vehicle body of the vehicle on which the housing is mounted, and is connected to a ground terminal (not shown) of the power source via the vehicle body.

ベース１００ａとカバー１００ｂとは、２つのネジ１０８ａ、１０８ｂにより互いに固定されて平面視が略三角形の内部空洞を形成し、当該内部空洞内に回路基板１０２を収容する。また、カバー１００ｂには、上記内部空洞部分を構成する以外の、図１Ａにおける図示左右両側の略三角形の領域に、放熱フィン１１２ａ、１１２ｂが形成されている。また、図１Ａの図示上側には、回路基板１０２に設けられた２つのコネクタ１１０ａ、１１０ｂの一部が、筺体１００の外部に露出している。   The base 100a and the cover 100b are fixed to each other by two screws 108a and 108b to form an internal cavity having a substantially triangular shape in plan view, and the circuit board 102 is accommodated in the internal cavity. Further, the cover 100b is formed with heat radiation fins 112a and 112b in substantially triangular regions on both the left and right sides in FIG. 1A other than that constituting the internal cavity portion. In addition, on the upper side of FIG. 1A, some of the two connectors 110 a and 110 b provided on the circuit board 102 are exposed to the outside of the housing 100.

図２は、図１Ｂに示す電子装置１０のＴＴ矢視図である。
回路基板１０２は、図示下部の頂点２００の頂角を直角とする平面視が直角三角形の平板であり、当該頂角が直角である頂点２００を挟む２辺に沿って略Ｖ字形状のグランドパターン２０２が形成されている。また、回路基板１０２上には、種々の回路部品が実装されて、所定の機能を有する電子回路を構成されている。当該電子回路は、コネクタ１１０ａ、１１０ｂを介して、外部の電源（不図示）からの電力供給と他装置（不図示）との間での情報伝送が行われる。 2 is a TT arrow view of the electronic device 10 shown in FIG. 1B.
The circuit board 102 is a flat plate having a right triangle in the apex angle of the apex 200 at the lower part of the figure, and a substantially V-shaped ground pattern along two sides sandwiching the apex 200 having the apex angle of right angle. 202 is formed. On the circuit board 102, various circuit components are mounted to constitute an electronic circuit having a predetermined function. The electronic circuit performs power transmission from an external power source (not shown) and information transmission between other devices (not shown) via connectors 110a and 110b.

図２において、回路基板１０２の頂点２００を挟む２辺に沿う帯状部分として点線とハッチングにより示したＶ字形状部分は、ベース１００ａとカバー１００ｂとにより把持される把持部分２０４を示している。すなわち、図１ＢのＳＳ矢視図においてその矩形断面が示されている回路基板１０２の図示左右の端部近傍が、それぞれ平面視Ｖ字形状の把持部分２０４の２つの腕の一部分に対応しており、当該把持部分２０４が、カバー１００ｂの平面視Ｖ字形状の支持部１０４ａ（図示斜線部分）と、これに対向するベース１００ａの平面視Ｖ字形状の支持部１０４ｂ（図示斜線部分）との間で把持されている。   In FIG. 2, a V-shaped portion indicated by a dotted line and hatching as a band-shaped portion along two sides sandwiching the vertex 200 of the circuit board 102 indicates a grip portion 204 gripped by the base 100a and the cover 100b. That is, the vicinity of the left and right end portions of the circuit board 102 whose rectangular cross section is shown in the SS arrow view of FIG. 1B corresponds to a part of two arms of the grip portion 204 having a V shape in plan view. The holding portion 204 includes a V-shaped support portion 104a (indicated by hatching in the drawing) of the cover 100b and a V-shaped support portion 104b (indicated by hatching in the drawing) of the base 100a opposite thereto. Is gripped between.

回路基板１０２は、ベース１００ａとカバー１００ｂとを固定するネジ１０８ａ、１０８ｂを締結することにより、支持部１０４ａと１０４ｂとの間に加圧された状態で把持される。すなわち、ネジ１０８ａ、１０８ｂは、２つの支持体であるベース１００ａとカバー１００ｂとを、互いに締結して当該支持体による回路基板１０２上の把持領域（把持部分）２０４を加圧する締結部である。   The circuit board 102 is gripped while being pressed between the support portions 104a and 104b by fastening screws 108a and 108b for fixing the base 100a and the cover 100b. That is, the screws 108a and 108b are fastening portions that fasten the gripping region (grip portion) 204 on the circuit board 102 by the support body by fastening the base 100a and the cover 100b, which are two support bodies, to each other.

回路基板１０２上のグランドパターン２０２と把持部分２０４とは互いに重なり合っており（図２）、この重なり部分において、グランドパターン２０２と支持部１０４ｂとが接触して、互いに電気的に接続される。これにより、グランドパターン２０２は、筺体１００の一部である支持部１０４ｂと、筺体１００が取り付けられた導電性の車体部分（不図示）とを介して電源のグランド端子（不図示）に接続される。   The ground pattern 202 and the gripping portion 204 on the circuit board 102 overlap each other (FIG. 2), and in this overlapping portion, the ground pattern 202 and the support portion 104b come into contact with each other and are electrically connected to each other. As a result, the ground pattern 202 is connected to the ground terminal (not shown) of the power source via the support portion 104b which is a part of the casing 100 and the conductive body part (not shown) to which the casing 100 is attached. The

なお、グランドパターン２０２は、回路基板１０２の表面（図２における図示の面を表面とする）ではなく裏面に設けてもよく、この場合には、グランドパターン２０２は支持部１０４ａと接触して、電源のグランド端子への電気的接続が確保される。また、回路基板１０２の表面に形成したグランドパターン２０２に加えて、回路基板１０２の裏面にも別のグランドパターンを設けて、当該別のグランドパターンも支持部１０４ａと接触させて、電源のグランド端子へのより面積の広い電気的接続を確保するものとしてもよい。   The ground pattern 202 may be provided on the back surface instead of the front surface (the surface shown in FIG. 2 is the front surface) of the circuit board 102. In this case, the ground pattern 202 is in contact with the support portion 104a, Electrical connection to the ground terminal of the power supply is ensured. Further, in addition to the ground pattern 202 formed on the front surface of the circuit board 102, another ground pattern is provided on the back surface of the circuit board 102, and the other ground pattern is brought into contact with the support portion 104a so that the ground terminal of the power It is also possible to secure a larger area electrical connection to the.

回路基板１０２には、頂点２００を挟む２辺に沿って、集積回路部品２１０、２１２、２１４、トランジスタ等の半導体部品２１６、コンデンサや抵抗値等のチップ部品２１８、抵抗器やダイオード等のアキシャル形部品２２０が、実装されている。すなわち、略矩形形状の集積回路部品２１０〜２１２や半導体部品２１６やチップ部品２１８については、それらの矩形パッケージの各辺が頂点２００を挟む２辺に沿うように、及び又はアキシャル形部品２２０については、それらの形状の軸が頂点２００を挟む２辺のいずれか少なくとも一方の方向に沿うように、実装されている。   On the circuit board 102, along two sides sandwiching the vertex 200, integrated circuit components 210, 212, 214, a semiconductor component 216 such as a transistor, a chip component 218 such as a capacitor and a resistance value, and an axial type such as a resistor and a diode A component 220 is mounted. That is, for the substantially rectangular integrated circuit components 210 to 212, the semiconductor component 216, and the chip component 218, each side of the rectangular package is along two sides sandwiching the apex 200 and / or the axial component 220. These are mounted so that the axes of their shapes are along at least one of the two sides sandwiching the apex 200.

このような回路基板１０２は、例えば、矩形形状の回路基板を当該矩形形状の対角線に沿って切断することで作製されるものとすることができる。より具体的には、例えばそのような矩形形状の回路基板上において当該矩形形状の一の対角線を挟んで区画される２つの直角三角形の領域のそれぞれに配線パターンを形成すると共に回路部品を実装し、当該対角線に沿って当該矩形形状の回路基板を切断して作製することができる。   Such a circuit board 102 can be produced, for example, by cutting a rectangular circuit board along a diagonal line of the rectangular shape. More specifically, for example, on such a rectangular circuit board, a wiring pattern is formed in each of two right-angled triangular regions partitioned by sandwiching one diagonal line of the rectangular shape, and circuit components are mounted. The rectangular circuit board can be cut along the diagonal line.

図３は、回路基板１０２の作製に用いられる矩形形状の回路基板の一例を示す図である。回路基板３００は、例えば平面視が正方形の回路基板であり、対角線３０２により区画される２つの直角二等辺三角形の領域３０４ａ、３０４ｂのそれぞれに、回路基板３００の正方形の中心に関して対称に、配線パターンが形成されると共に回路部品が実装されている。回路基板１０２は、例えばこのように作製された回路基板３００を対角線３０２に沿って切断することで作製されるものとすることができる。   FIG. 3 is a diagram illustrating an example of a rectangular circuit board used for manufacturing the circuit board 102. The circuit board 300 is, for example, a circuit board having a square shape in plan view, and symmetrically with respect to the square center of the circuit board 300 in each of two right-angled isosceles triangular regions 304a and 304b defined by the diagonal 302. Are formed and circuit components are mounted. The circuit board 102 can be manufactured, for example, by cutting the circuit board 300 manufactured in this way along the diagonal 302.

このように、回路基板１０２を矩形形状の回路基板３００から切り出して作製することで、回路基板３００への配線パターン及び回路部品の実装は、回路基板３００の直交する２辺を２軸（Ｘ軸及びＹ軸）とする座標系を用いて、周知の一般的な配線パターン設計用ＣＡＤ装置や回路部品自動実装装置を用いて、安価に行うことができる。   In this way, by cutting the circuit board 102 from the rectangular circuit board 300 and manufacturing the wiring pattern and circuit components on the circuit board 300, two orthogonal sides of the circuit board 300 are arranged in two axes (X axis). And a Y-axis) coordinate system, and a known general wiring pattern design CAD device and automatic circuit component mounting device can be used at low cost.

上記のように構成された電子装置１０は、平面視が三角形の回路基板１０２の一の頂点２００を挟む２辺に沿ったＶ字形状部分（把持部分２０４）を、筺体１００のベース１００ａとカバー１００ｂとにより挟んで把持する構成となっているため、頂点２００を挟む２辺の方向に沿って連続に又は不連続に把持部分２０４の面積の全体を大きく確保することができるので、任意の方向に印加される衝撃に対して回路基板１０２を安定に保持することができる。   In the electronic device 10 configured as described above, the V-shaped portion (gripping portion 204) along two sides sandwiching one vertex 200 of the circuit board 102 having a triangular shape in plan view is covered with the base 100a of the casing 100 and the cover 100. 100b is sandwiched and gripped, so that the entire area of the gripping portion 204 can be ensured large continuously or discontinuously along the direction of the two sides sandwiching the apex 200. The circuit board 102 can be stably held against an impact applied to the circuit board 102.

また、上記のように把持部分２０４の面積を大きく確保することができるので、把持部分２０４と重なるグランドパターン２０２の近傍に発熱量の大きい回路部品を配置することで、当該回路部品が発する熱を筺体１００を介して外部へ効率良く放熱することができる。   In addition, since the area of the grip portion 204 can be secured large as described above, the heat generated by the circuit component can be generated by arranging a circuit component having a large amount of heat generation in the vicinity of the ground pattern 202 that overlaps the grip portion 204. Heat can be efficiently radiated to the outside through the casing 100.

また、把持部分２０４がＶ字形状であることにより、筺体１００と回路基板１０２との間の線膨張係数差に起因して環境温度の変化時に回路基板１０２に加わる応力は、頂点２００に対向する辺の部分を最大として頂点２００に向かって減少し、従来のように矩形形状の回路基板の対向する２辺を把持して当該２辺間の全体にわたって最大応力が発生する構成に比べて、回路基板１０２に加わる応力を低減することができる。   Further, since the grip portion 204 is V-shaped, the stress applied to the circuit board 102 when the environmental temperature changes due to the difference in linear expansion coefficient between the housing 100 and the circuit board 102 faces the apex 200. Compared to the conventional configuration in which the side portion is reduced toward the apex 200 and the two opposite sides of the rectangular circuit board are gripped and the maximum stress is generated across the two sides as in the prior art. The stress applied to the substrate 102 can be reduced.

また、同様に、回路基板１０２を部分的に見た場合の、振動印加時に発生する撓み振動の部分的な共振振動数は、頂点２００に対向する辺の部分を最小として頂点２００に向かって増加していく結果、回路基板１０２全体としての機械的振動のＱ値は小さくなるので、従来のように矩形形状の回路基板の１辺を把持する構成や対向する２辺を把持する構成に比べて、回路基板１０２の耐振動性を大幅に向上することができる。   Similarly, when the circuit board 102 is partially viewed, the partial resonance frequency of the flexural vibration generated when applying the vibration increases toward the vertex 200 with the side portion facing the vertex 200 being minimized. As a result, the Q value of the mechanical vibration of the circuit board 102 as a whole is reduced, so that compared to the conventional configuration of gripping one side of a rectangular circuit board and the configuration of gripping two opposing sides. The vibration resistance of the circuit board 102 can be greatly improved.

また、筺体１００を一般的な矩形形状とすれば、三角形の回路基板１０２の実装部分以外の部分に放熱フィン１１２ａ、１１２ｂを形成するための領域を容易に確保することができ、筺体１００の放熱効果を高めることができる。   Further, if the casing 100 has a general rectangular shape, it is possible to easily secure areas for forming the radiation fins 112a and 112b in portions other than the mounting portion of the triangular circuit board 102. The effect can be enhanced.

さらに、回路基板１０２の頂点２００の頂角を直角としたため、回路基板１０２を、周知の一般的な配線パターンＣＡＤ装置や部品自動実装装置を用いて作製された矩形形状の回路基板から切り出して、安価に作製することができる。また、回路基板の各辺から所定距離内の直近部分は、一般に、配線パターンを配置することのできない領域とされるが、直角三角形の回路基板１０２は、矩形形状の回路基板を対角線に沿って切断して作製することができるので、頂点２００に対向する辺（矩形形状の回路基板）の直近まで配線パターンを設けることができ、回路基板１０２の基板面積の利用率（配線領域として使用可能な面積の基板全体面積に対する比）を高めることができる。   Furthermore, since the apex angle of the apex 200 of the circuit board 102 is a right angle, the circuit board 102 is cut out from a rectangular circuit board produced using a known general wiring pattern CAD device or component automatic mounting device, It can be manufactured at low cost. In addition, the nearest part within a predetermined distance from each side of the circuit board is generally an area where a wiring pattern cannot be arranged. However, the circuit board 102 having a right triangle has a rectangular circuit board along a diagonal line. Since it can be cut and manufactured, a wiring pattern can be provided as close as possible to the side (rectangular circuit board) facing the apex 200, and the utilization factor of the circuit board 102 (which can be used as a wiring area) The ratio of the area to the entire substrate area) can be increased.

なお、本実施形態では、把持部分２０４が一つの連続するＶ字形状であるものとして図示したが、これに限らず、把持部分２０４は、略Ｖ字形状を為すように複数の部分に分割されているものとしてもよい。   In the present embodiment, the grip portion 204 is illustrated as one continuous V-shape. However, the present invention is not limited to this, and the grip portion 204 is divided into a plurality of portions so as to be substantially V-shaped. It is good as it is.

また、本実施形態では、回路基板１０２を直角二等辺三角形として、正方形の回路基板３００から切り出して作製されるものとしたが、これに限らず、回路基板１０２は、単に三角形であれば、上述した熱膨張係数差に起因する応力の低減効果と機械的振動に対する耐振動性の向上効果を奏することができる。また、回路基板１０２を、二等辺三角形でない直角三角形としても、応力低減効果と耐振動性向上効果に加えて、上述した一般のＣＡＤ装置及び部品自動実装装置を用いることによるコスト低減効果を奏するものとすることができる。この場合（すなわち、回路基板１０２が二等辺三角形でない直角三角形でない場合）には、回路基板１０２は、長方形の回路基板から切り出して作製されるものとなる。   In the present embodiment, the circuit board 102 is cut out from the square circuit board 300 as a right-angled isosceles triangle. However, the present invention is not limited to this. The effect of reducing the stress caused by the difference in thermal expansion coefficient and the effect of improving the vibration resistance against mechanical vibration can be achieved. Further, even if the circuit board 102 is a right triangle that is not an isosceles triangle, in addition to the stress reduction effect and the vibration resistance improvement effect, there is a cost reduction effect by using the above-described general CAD device and automatic component mounting device. It can be. In this case (that is, when the circuit board 102 is not a right triangle other than an isosceles triangle), the circuit board 102 is cut out from a rectangular circuit board.

また、本実施形態では、（回路基板３００を用いることにより）頂点２００を挟む直交する２辺の方向に沿って回路部品が自動実装装置により実装されるものとして記載したが、一部の回路部品については、一般に行われているように、手作業等により上記２辺の方向と異なる方向に沿って回路基板１０２上に実装されるものとすることもできる。   In the present embodiment, the circuit component is described as being mounted by the automatic mounting apparatus along the two orthogonal directions sandwiching the apex 200 (by using the circuit board 300). As is generally done, it may be mounted on the circuit board 102 along a direction different from the direction of the two sides by manual work or the like.

１０・・・電子装置、１００・・・筺体、１００ａ・・・ベース、１００ｂ・・・カバー、１０２・・・回路基板、１０４ａ、１０４ｂ・・・支持部、１０８ａ、１０８ｂ・・・ネジ、１１０ａ、１１０ｂ・・・コネクタ、１１２ａ、１１２ｂ・・・放熱フィン、２００・・・頂点、２０２・・・グランドパターン、２０４・・・把持部分、２１０、２１２、２１４・・・集積回路部品、２１６・・・半導体部品、２１８・・・チップ部品、２２０・・・アキシャル形部品。   DESCRIPTION OF SYMBOLS 10 ... Electronic device, 100 ... Housing, 100a ... Base, 100b ... Cover, 102 ... Circuit board, 104a, 104b ... Support part, 108a, 108b ... Screw, 110a 110b ... Connector, 112a, 112b ... Heat radiation fin, 200 ... Vertex, 202 ... Ground pattern, 204 ... Holding part, 210, 212, 214 ... Integrated circuit component, 216 ..Semiconductor parts, 218... Chip parts, 220... Axial parts.

Claims (7)

機械的構造物である２つの支持体の間に把持されて固定される回路基板であって、
当該回路基板は、
平面視が三角形であり、
当該三角形の一の頂点を挟む２辺に沿う帯状部分において前記支持体により把持され、
前記支持体により把持される前記帯状部分と重なるようにグランドパターンが形成されている、
回路基板。 A circuit board that is gripped and fixed between two supports that are mechanical structures,
The circuit board
The plan view is a triangle,
It is gripped by the support in a band-like portion along two sides sandwiching one vertex of the triangle ,
A ground pattern is formed so as to overlap with the belt-shaped portion gripped by the support.
Circuit board. 平面視が直角三角形であって、前記一の頂点は直角を為す頂点である、請求項１に記載の回路基板。 The circuit board according to claim 1, wherein the circuit board is a right triangle when viewed from above, and the one vertex is a vertex forming a right angle . 平面視が直角二等辺三角形であって、前記一の頂点は直角を為す頂点である、請求項１又は２に記載の回路基板。 The circuit board according to claim 1 , wherein the circuit board is a right-angled isosceles triangle and the one vertex is a vertex forming a right angle . 直角を為す前記頂点を挟む２辺の方向に沿って回路部品が実装されている、請求項２又は３に記載の回路基板。 4. The circuit board according to claim 2 , wherein circuit components are mounted along a direction of two sides sandwiching the vertex forming a right angle . 5. 平面視が三角形の前記回路基板は、矩形形状の回路基板であって当該矩形形状の辺の方向に沿って回路部品が実装された回路基板を当該回路基板の対角線に沿って切断することにより、作製される、請求項２ないし４のいずれか一項に記載の回路基板。 The circuit board having a triangular plan view is a rectangular circuit board, and a circuit board on which circuit components are mounted along the direction of the side of the rectangular shape is cut along a diagonal line of the circuit board, The circuit board according to claim 2, which is manufactured . 請求項１ないし５のいずれか一項に記載の平面視が三角形の前記回路基板と、当該回路基板を支持する前記支持体を備えた筺体と、を有し、
前記回路基板は、当該三角形の一の頂点を挟む２辺に沿う帯状部分において前記支持体により把持され、
前記支持体により把持される前記帯状部分と重なるようにグランドパターンが形成されている、
電子装置。 The circuit board according to any one of claims 1 to 5 has a triangular circuit board and a housing including the support body that supports the circuit board,
The circuit board is gripped by the support in a band-shaped portion along two sides sandwiching one vertex of the triangle,
A ground pattern is formed so as to overlap with the belt-shaped portion gripped by the support.
Electronic equipment. 前記筺体のうち、平面視が三角形の前記回路基板を収容する部分以外の部分に放熱フィンが形成されている、請求項６に記載の電子装置。 The electronic device according to claim 6, wherein heat radiating fins are formed in a portion of the housing other than a portion that accommodates the circuit board having a triangular plan view .
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