JP6439148B2 - MOUNTING BOARD MANUFACTURING SYSTEM AND METHOD FOR INSTALLING BOARD SUBSTITTING MEMBER IN MOUNTING BOARD MANUFACTURING SYSTEM - Google Patents

Description

本発明は、基板に対するスクリーン印刷や部品の装着等の所定の処理を施す実装基板製造システム及びこの実装基板製造システムにおける基板下受け部材の設置方法に関するものである。   The present invention relates to a mounting board manufacturing system that performs predetermined processing such as screen printing and component mounting on a board, and a method for installing a substrate receiving member in the mounting board manufacturing system.

従来、基板に対するスクリーン印刷や部品の装着等の所定の処理を行って実装基板を製造する実装基板製造システムにおいて、基板に対する処理を安定的に行うことを目的として、処理対象となる基板の下面を支持することが行われている（例えば、下記の特許文献１）。この基板の支持に用いられる基板下受け部材は、基板のサイズや下面の状態（例えば、基板の下面に既に実装されている部品の配置状態）等に応じて形状や大きさ等が異なるものであり、生産する基板の種類を切り替える際には、処理対処となる基板に応じて基板下受け部材を取り換える段取り作業が必要となる。   2. Description of the Related Art Conventionally, in a mounting board manufacturing system that manufactures a mounting board by performing predetermined processing such as screen printing and component mounting on the board, the lower surface of the board to be processed is removed for the purpose of stably processing the board. Support is performed (for example, the following patent document 1). The substrate receiving member used for supporting the substrate differs in shape, size, etc. depending on the size of the substrate and the state of the lower surface (for example, the arrangement state of components already mounted on the lower surface of the substrate). In order to switch the type of substrate to be produced, it is necessary to prepare for replacing the substrate receiving member in accordance with the substrate to be processed.

特開２０１５−２１４０８８号公報Japanese Patent Laid-Open No. 2015-214088

しかしながら、従来、基板下受け部材を取り換える段取り作業はほとんどが手作業によるものであり、作業工数が増大して実装基板の生産性が低下するおそれがあるという問題点があった。   However, conventionally, most of the setup work for replacing the substrate receiving member is manual work, and there is a problem that the work man-hour increases and the productivity of the mounting board may be lowered.

そこで本発明は、基板下受け部材の取り換えに要する作業工数を低減して実装基板の生産性を向上させることができる実装基板製造システム及びこの実装基板製造システムにおける基板下受け部材の設置方法を提供することを目的とする。   Therefore, the present invention provides a mounting board manufacturing system capable of reducing the man-hours required for replacing the board receiving member and improving the productivity of the mounting board, and a method for installing the board receiving member in the mounting board manufacturing system. The purpose is to do.

本発明の実装基板製造システムは、搬送対象物を作業位置に搬送する搬送部と、前記搬送部の下方に設けられた下受け部材設置部と、前記下受け部材設置部に着脱自在に設置され、前記搬送部により前記作業位置に搬送された前記搬送対象物としての基板の下面を支持する基板下受け部材と、前記基板下受け部材により下面が支持された基板の上面に所定の処理を施す基板処理部と、前記搬送対象物としての前記基板下受け部材を下面に保持する第１のキャリヤとを備え、前記搬送部は、前記基板下受け部材を保持した前記第１のキャリヤを前記作業位置に搬送することで前記基板下受け部材を前記作業位置に位置させ、前記作業位置に位置された前記基板下受け部材は、前記基板下受け部材の下面に設けられた第１の磁石の磁力により前記下受け部材設置部に固定される。   The mounting board manufacturing system of the present invention is detachably installed on a conveyance unit that conveys a conveyance object to a work position, a lower member installation unit provided below the conveyance unit, and the lower member installation unit. The substrate lowering member that supports the lower surface of the substrate as the transfer object transferred to the work position by the transfer unit and the upper surface of the substrate whose lower surface is supported by the substrate lowering member are subjected to predetermined processing. A substrate processing section; and a first carrier that holds the substrate receiving member as the transfer object on a lower surface thereof, and the transfer section uses the first carrier holding the substrate receiving member as the work. The substrate lowering member is positioned at the working position by being conveyed to a position, and the substrate lowering member positioned at the working position is a magnetic force of a first magnet provided on the lower surface of the substrate lowering member. By the above It is fixed to the receiving member installation portion.

本発明の実装基板製造システムにおける基板下受け部材の設置方法は、搬送対象物を作業位置に搬送する搬送部と、前記搬送部の下方に設けられた下受け部材設置部と、前記下受け部材設置部に着脱自在に設置され、前記搬送部により前記作業位置に搬送された前記搬送対象物としての基板の下面を支持する基板下受け部材と、前記基板下受け部材により下面が支持された基板の上面に所定の処理を施す基板処理部と、前記搬送対象物としての前記基板下受け部材を下面に保持する第１のキャリヤとを備えた実装基板製造システムにおける基板下受け部材の設置方法であって、前記基板下受け部材を保持した前記第１のキャリヤを前記搬送部によって前記作業位置に搬送することで、前記基板下受け部材を前記作業位置に位置させる基板下受け部材搬送工程と、前記作業位置に位置させた前記基板下受け部材を、前記基板下受け部材の下面に設けられた第１の磁石の磁力により前記下受け部材設置部に固定する基板下受け部材設置工程とを含む。   In the mounting substrate manufacturing system of the present invention, the substrate receiving member installation method includes a transport unit that transports a transport target to a work position, a lower support member installation unit provided below the transport unit, and the lower support member. A substrate lower support member that is detachably installed in the installation section and supports the lower surface of the substrate as the transfer object that is transferred to the work position by the transfer section, and a substrate whose lower surface is supported by the substrate lower support member In the mounting method of the substrate support member in the mounting substrate manufacturing system, comprising: a substrate processing unit that performs a predetermined process on the upper surface of the substrate; and a first carrier that holds the substrate support member as the transport object on the lower surface. And the substrate carrier that moves the first carrier holding the substrate receiving member to the working position by the carrying unit, thereby positioning the substrate receiving member at the working position. A substrate conveying member, and a substrate lowering member that fixes the substrate lowering member positioned at the working position to the lower receiving member installation portion by a magnetic force of a first magnet provided on a lower surface of the substrate lowering member. Installation process.

本発明によれば、基板下受け部材の取り換えに要する作業工数を低減して実装基板の生産性を向上させることができる。   According to the present invention, it is possible to improve the productivity of the mounting substrate by reducing the number of work steps required to replace the substrate receiving member.

本発明の一実施の形態における実装基板製造システムの概略構成を示す平面図The top view which shows schematic structure of the mounting substrate manufacturing system in one embodiment of this invention 本発明の一実施の形態における実装基板製造システムが備えるスクリーン印刷装置の側面図The side view of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided 本発明の一実施の形態における実装基板製造システムが備えるスクリーン印刷装置の基板下受け部材の近傍の側断面図The sectional side view of the vicinity of the board | substrate receiving member of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided 本発明の一実施の形態における実装基板製造システムが備えるスクリーン印刷装置の基板下受け部材を下受け部材設置部とともに示す側断面図The sectional side view which shows the board | substrate lower receiving member of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided with the lower receiving member installation part 本発明の一実施の形態における実装基板製造システムが備えるスクリーン印刷装置の動作系統を示すブロック図The block diagram which shows the operation | movement system of the screen printing apparatus with which the mounting board manufacturing system in one embodiment of this invention is provided. （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによるスクリーン印刷作業時の動作説明図(A) (b) (c) Operation | movement explanatory drawing at the time of the screen printing operation | work by the mounting substrate manufacturing system in one embodiment of this invention （ａ）（ｂ）本発明の一実施の形態における実装基板製造システムによるスクリーン印刷作業時の動作説明図(A) (b) Operation explanatory drawing at the time of screen printing work by the mounting board manufacturing system in one embodiment of the present invention 本発明の一実施の形態における実装基板製造システムによるスクリーン印刷作業時の動作説明図Operation explanatory diagram at the time of screen printing work by the mounting board manufacturing system in one embodiment of the present invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによるスクリーン印刷作業時の動作説明図(A) (b) (c) Operation | movement explanatory drawing at the time of the screen printing operation | work by the mounting substrate manufacturing system in one embodiment of this invention （ａ）（ｂ）本発明の一実施の形態における実装基板製造システムが備えるスクリーン印刷装置の基板下受け部材を第１のキャリヤとともに示す斜視図(A) (b) The perspective view which shows the board | substrate receiving member of the screen printing apparatus with which the mounting board | substrate manufacturing system in one embodiment of this invention is provided with a 1st carrier （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによる基板下受け部材の設置作業時の動作説明図(A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによる基板下受け部材の設置作業時の動作説明図(A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによる基板下受け部材の設置作業時の動作説明図(A) (b) (c) Operation explanatory drawing at the time of the installation work of the board lowering member by the mounting board manufacturing system in one embodiment of the present invention （ａ）（ｂ）本発明の一実施の形態における実装基板製造システムが備えるスクリーン印刷装置の基板下受け部材を第２のキャリヤとともに示す斜視図(A) (b) The perspective view which shows the board | substrate lower receiving member of the screen printing apparatus with which the mounting board | substrate manufacturing system in one embodiment of this invention is equipped with a 2nd carrier （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによる基板下受け部材の回収作業時の動作説明図(A) (b) (c) Explanatory drawing of operation | movement at the time of the collection | recovery operation | work of the substrate lowering member by the mounting substrate manufacturing system in one embodiment of this invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムにより基板下受け部材の回収作業時の動作説明図(A) (b) (c) Operation explanatory drawing at the time of collection work of a substrate lowering member by a mounting substrate manufacturing system in one embodiment of the present invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における実装基板製造システムによる基板下受け部材の回収作業時の動作説明図(A) (b) (c) Explanatory drawing of operation | movement at the time of the collection | recovery operation | work of the substrate lowering member by the mounting substrate manufacturing system in one embodiment of this invention

以下、図面を参照して本発明の実施の形態について説明する。図１は本発明の一実施の形態における実装基板製造システム１を示している。実装基板製造システム１は基板２にスクリーン印刷処理と部品の装着処理とを施して実装基板を製造するものであり、基板供給部１１、搬入側中継コンベア１２、スクリーン印刷装置１３、搬出側中継コンベア１４及び部品実装装置１５を備えている。基板２の流れは作業者ＯＰから見た左方から右方へ向かう方向であり、この方向をＸ軸方向とする。また、作業者ＯＰから見た前後方向をＹ軸方向とし、上下方向をＺ軸方向とする。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a mounting board manufacturing system 1 according to an embodiment of the present invention. The mounting board manufacturing system 1 manufactures a mounting board by subjecting a board 2 to screen printing processing and component mounting processing, and includes a board supply unit 11, a carry-in relay conveyor 12, a screen printing device 13, and a carry-out relay conveyor. 14 and a component mounting apparatus 15 are provided. The flow of the substrate 2 is a direction from the left to the right as viewed from the operator OP, and this direction is defined as the X-axis direction. Further, the front-rear direction viewed from the operator OP is the Y-axis direction, and the vertical direction is the Z-axis direction.

基板供給部１１は実装基板製造システム１の最も上流工程側に設けられており、基板２を連続的に供給する。搬入側中継コンベア１２は基板供給部１１の下流工程側に設けられており、基板供給部１１が供給する基板２を受け取ってスクリーン印刷装置１３に受け渡す。   The substrate supply unit 11 is provided on the most upstream process side of the mounting substrate manufacturing system 1 and continuously supplies the substrate 2. The carry-in relay conveyor 12 is provided on the downstream process side of the substrate supply unit 11, receives the substrate 2 supplied by the substrate supply unit 11, and transfers it to the screen printing device 13.

スクリーン印刷装置１３は図１に示すように、基台２１上に搬入部２２と、印刷実行部２３と、搬出部２４を備えている。印刷実行部２３は基台２１の中央部に設けられており、搬入部２２は基台２１上の印刷実行部２３の左側の領域（印刷実行部２３の上流工程側）に設けられている。搬出部２４は基台２１上の印刷実行部２３の右側の領域（印刷実行部２３の下流工程側）に設けられている。   As shown in FIG. 1, the screen printing apparatus 13 includes a carry-in unit 22, a print execution unit 23, and a carry-out unit 24 on a base 21. The print execution unit 23 is provided in the center of the base 21, and the carry-in unit 22 is provided in the left area of the print execution unit 23 on the base 21 (upstream process side of the print execution unit 23). The carry-out unit 24 is provided in a region on the right side of the print execution unit 23 on the base 21 (on the downstream process side of the print execution unit 23).

図２において、印刷実行部２３は、基台２１上に設けられた基板保持ユニット３１と、マスク３２及びスキージヘッド３３を備えている。基板保持ユニット３１は、基台２１上に設置されたＸＹＺ回転ステージ４１と、ＸＹＺ回転ステージ４１によって水平面内の移動と昇降移動及びＺ軸回りの回転が自在なベース部４２と、ベース部４２が有する一対の搬送部支持壁４３に取り付けられた搬送部４４及び一対のクランプ部材４５と、搬送部４４の下方に設けられた下受け部材設置部４６と、下受け部材設置部４６の上面に着脱自在に設置された基板下受け部材４７と、下受け部材設置部４６を（すなわち基板下受け部材４７を）ベース部４２に対して昇降させる昇降機構４８（下受け部材設置部昇降機構）を備えている。マスク３２及びスキージヘッド３３は、基板下受け部材４７により下面が支持された基板２の上面に所定の処理を施す基板処理部を構成する。   In FIG. 2, the print execution unit 23 includes a substrate holding unit 31 provided on a base 21, a mask 32, and a squeegee head 33. The substrate holding unit 31 includes an XYZ rotary stage 41 installed on the base 21, a base part 42 that can be moved in the horizontal plane, moved up and down, and rotated around the Z axis by the XYZ rotary stage 41, and a base part 42. A pair of clamps 45 and a transport unit 44 attached to a pair of transport unit support walls 43, a lower receiving member installation unit 46 provided below the transport unit 44, and an upper surface of the lower support member installation unit 46. A freely installed substrate lowering member 47 and an elevating mechanism 48 (lower receiving member installing portion elevating mechanism) for elevating and lowering the lower receiving member setting portion 46 (that is, the lower substrate receiving member 47) with respect to the base portion 42 are provided. ing. The mask 32 and the squeegee head 33 constitute a substrate processing unit that performs a predetermined process on the upper surface of the substrate 2 whose lower surface is supported by the substrate receiving member 47.

図２において、搬送部４４はＹ軸方向に対向して設置された一対のコンベア４４ａを有している。一対のクランプ部材４５はクランプ部材駆動部４５Ｍに駆動されて互いに近接或いは離間するように作動する。搬送部４４は搬入部２２から送られてきた搬送対象物を受け取って作業位置に搬送（搬入）し、作業位置の搬送対象物を外部に搬送（搬出）する。   In FIG. 2, the transport unit 44 includes a pair of conveyors 44 a that are installed to face each other in the Y-axis direction. The pair of clamp members 45 are driven by the clamp member drive unit 45M to operate so as to approach or separate from each other. The transport unit 44 receives the transport object sent from the carry-in unit 22 and transports (carries in) the work object to the work position, and transports (unloads) the transport object at the work position to the outside.

マスク３２は、図２及び図３に示すように、基板保持ユニット３１の上方に水平姿勢に保持されている。マスク３２は例えば金属製の平板状部材から成り、その中央部には、基板２の上面に形成された複数の電極（図示せず）の各々に対応したパターン開口（図示せず）が設けられている。スキージヘッド３３はヘッド駆動機構３３Ｍに駆動されてマスク３２の上方をＹ軸方向に移動するスキージベース３３ｂに、Ｙ軸方向に対向して設けられた２つのスキージ３３ｋと、各スキージ３３ｋをスキージベース３３ｂに対して昇降させる２つのシリンダ３３ｓを備えた構成となっている。   As shown in FIGS. 2 and 3, the mask 32 is held in a horizontal posture above the substrate holding unit 31. The mask 32 is made of, for example, a metal plate-like member, and a pattern opening (not shown) corresponding to each of a plurality of electrodes (not shown) formed on the upper surface of the substrate 2 is provided at the center thereof. ing. The squeegee head 33 is driven by a head drive mechanism 33M and is moved to the squeegee base 33b that moves in the Y-axis direction above the mask 32. The two squeegees 33k are provided so as to face each other in the Y-axis direction. The configuration includes two cylinders 33 s that are moved up and down with respect to 33 b.

基板下受け部材４７は、図３及び図４に示すように内部空間４７Ｓを有した中空の箱状部材であり、磁性体材料から成る。基板下受け部材４７は、搬送部４４により作業位置に位置決めされた搬送対象物としての基板２の下面を支持する部材であり、本実施の形態では、搬送部４４によって作業位置に位置された基板２の下面を支持しながら吸着する構成となっている。   The substrate receiving member 47 is a hollow box-shaped member having an internal space 47S as shown in FIGS. 3 and 4, and is made of a magnetic material. The substrate receiving member 47 is a member that supports the lower surface of the substrate 2 as a conveyance object positioned at the work position by the conveyance unit 44. In this embodiment, the substrate positioned at the work position by the conveyance unit 44. It is configured to adsorb while supporting the lower surface of 2.

基板下受け部材４７の天板５１の上面は基板２の下面と接触する面であり、上方に開口する複数の吸着孔５１ａを備えている。基板下受け部材４７の底板５２の下面は下受け部材設置部４６の上面と接触する面であり、下方に開口する複数の配管接続孔５２ａを備えている。   The upper surface of the top plate 51 of the substrate receiving member 47 is a surface that contacts the lower surface of the substrate 2 and includes a plurality of suction holes 51a that open upward. The lower surface of the bottom plate 52 of the substrate lower receiving member 47 is a surface that comes into contact with the upper surface of the lower receiving member installation portion 46, and includes a plurality of pipe connection holes 52a that open downward.

図３及び図４において、基板下受け部材４７の底板５２には下面側に露出するように埋め込まれた複数の磁石（第１の磁石４７Ｍ）が設けられている。一方、下受け部材設置部４６はその少なくとも上面を含む一定の領域が磁性体材料からなっている。このため基板下受け部材４７と下受け部材設置部４６との間には互いに引き寄せ合う磁力が作用しており、下受け部材設置部４６に基板下受け部材４７が設置されると基板下受け部材４７は磁力によって下受け部材設置部４６に固定される。   3 and 4, a plurality of magnets (first magnets 47 </ b> M) embedded so as to be exposed on the lower surface side are provided on the bottom plate 52 of the substrate receiving member 47. On the other hand, the lower receiving member installation portion 46 is made of a magnetic material in a certain region including at least the upper surface thereof. Therefore, a magnetic force attracting each other acts between the substrate lower receiving member 47 and the lower receiving member installing portion 46, and when the substrate lower receiving member 47 is installed in the lower receiving member installing portion 46, the substrate lower receiving member 47 is fixed to the receiving member installation portion 46 by magnetic force.

図４に示すように、基板下受け部材４７の下面には下方に突出した凸部４７ａが設けられており、下受け部材設置部４６の上面には凸部４７ａと嵌合し得る形状の凹部４６ａが設けられている。凸部４７ａと凹部４６ａはそれぞれＸ軸方向（図４の紙面に垂直な方向）に複数個ずつ並んで設けられており、基板下受け部材４７の複数の凸部４７ａが下受け部材設置部４６の複数の凹部４６ａと嵌合することで、基板下受け部材４７は下受け部材設置部４６に対して正確に位置決めされた状態で下受け部材設置部４６に設置される。   As shown in FIG. 4, a convex portion 47a projecting downward is provided on the lower surface of the substrate receiving member 47, and a concave portion having a shape that can be fitted to the convex portion 47a on the upper surface of the lower member installing portion 46. 46a is provided. A plurality of convex portions 47 a and concave portions 46 a are provided side by side in the X-axis direction (direction perpendicular to the paper surface of FIG. 4), and the plurality of convex portions 47 a of the substrate lowering member 47 are the lower receiving member installation portions 46. The substrate receiving member 47 is installed in the lower receiving member installation portion 46 in a state of being accurately positioned with respect to the lower receiving member installation portion 46 by being engaged with the plurality of recesses 46a.

凸部４７ａは円錐台状であることが好ましく、このようにすれば、基板下受け部材４７を下受け部材設置部４６に上方から設置する際、各凸部４７ａの中心軸が対応する凹部４６ａの中心軸から少々ずれていたとしても、基板下受け部材４７を下受け部材設置部４６上の正確な設置に設置することができる。なお、ここでは基板下受け部材４７の下面に凸部４７ａが設けられ、下受け部材設置部４６の上面に凹部４６ａが設けられるとしているが、基板下受け部材４７の下面に凹部が設けられ、下受け部材設置部４６の上面に凸部が設けられるのであってもよい。すなわち、基板下受け部材４７と下受け部材設置部４６のうちのいずれか一方に設けられた凸部が基板下受け部材４７と下受け部材設置部４６のうちのいずれか他方に設けられた凹部と嵌合した状態で基板下受け部材４７が下受け部材設置部４６に設置されるのであればよい。   The convex portions 47a are preferably frustoconical. In this way, when the substrate lower receiving member 47 is installed on the lower receiving member installation portion 46 from above, the central axis of each convex portion 47a corresponds to the concave portion 46a. Even if it is slightly deviated from the central axis, the substrate receiving member 47 can be installed in an accurate installation on the receiving member installation portion 46. Here, the convex portion 47 a is provided on the lower surface of the substrate receiving member 47 and the concave portion 46 a is provided on the upper surface of the lower receiving member installation portion 46, but the concave portion is provided on the lower surface of the substrate lowering member 47, A convex portion may be provided on the upper surface of the lower receiving member installation portion 46. That is, the convex portion provided in one of the substrate lower receiving member 47 and the lower receiving member installation portion 46 is the concave portion provided in either one of the substrate lower receiving member 47 and the lower receiving member installation portion 46. As long as the board lower member 47 is installed in the lower member installation portion 46 in a state where it is fitted.

図３及び図４において、下受け部材設置部４６の内部には吸着用配管５６が形成されており、下受け部材設置部４６の上面には吸着用配管５６の出口開口５６ａが形成されている。下受け部材設置部４６に基板下受け部材４７が設置されると吸着用配管５６の出口開口５６ａが基板下受け部材４７の底板５２に設けられた配管接続孔５２ａと合致し、基板下受け部材４７の内部空間４７Ｓと吸着用配管５６が接続される（図４）。   3 and 4, an adsorption pipe 56 is formed inside the lower receiving member installation portion 46, and an outlet opening 56 a of the adsorption pipe 56 is formed on the upper surface of the lower receiving member installation portion 46. . When the substrate receiving member 47 is installed in the lower receiving member installation portion 46, the outlet opening 56a of the suction piping 56 matches the pipe connection hole 52a provided in the bottom plate 52 of the substrate receiving member 47, and the substrate receiving member The internal space 47S of 47 and the suction pipe 56 are connected (FIG. 4).

図３において、吸着用配管５６は下受け部材設置部４６の外部を延びる外部配管５６Ｇを通じて真空源ＶＰに繋がっており、外部配管５６Ｇには制御バルブ５７が介装されている。基板下受け部材４７に基板２が接触している状態で真空源ＶＰが外部配管５６Ｇ及び吸着用配管５６を通じて空気を吸い出すと、吸着孔５１ａに発生する吸着力によって基板２が基板下受け部材４７に吸着される。制御バルブ５７を駆動して吸着孔５１ａに発生する吸着力の大きさを調節することで基板２の保持力を調節できるほか、制御バルブ５７を駆動して吸着用配管５６を大気に開放することで基板下受け部材４７への基板２の吸着を解除することができる。   In FIG. 3, the suction pipe 56 is connected to the vacuum source VP through an external pipe 56G extending outside the lower member installation portion 46, and a control valve 57 is interposed in the external pipe 56G. When the vacuum source VP sucks out air through the external pipe 56G and the suction pipe 56 in a state where the substrate 2 is in contact with the substrate lower receiving member 47, the substrate 2 is lowered by the suction force generated in the suction hole 51a. To be adsorbed. The holding force of the substrate 2 can be adjusted by driving the control valve 57 and adjusting the magnitude of the suction force generated in the suction hole 51a, and the suction valve 56 is opened to the atmosphere by driving the control valve 57. Thus, the adsorption of the substrate 2 to the substrate receiving member 47 can be released.

図１において、搬送部４４は搬送対象物を搬出するときには搬出部２４に搬送対象物を搬出する。搬出部２４は、搬送部４４から搬出された搬送対象物を受け取って、外部（搬送側中継コンベア１４）に、搬送対象物を搬出する。   In FIG. 1, the conveyance unit 44 carries the conveyance object to the carry-out unit 24 when carrying the conveyance object. The carry-out unit 24 receives the conveyance object carried out from the conveyance unit 44 and carries out the conveyance object to the outside (conveyance-side relay conveyor 14).

上記構成のスクリーン印刷装置１３において、搬入部２２の作動制御、搬送部４４の作動制御、クランプ部材駆動部４５Ｍの作動制御、ＸＹＺ回転ステージ４１によるベース部４２の移動制御、昇降機構４８によるベース部４２の昇降作動制御、シリンダ３３ｓによるスキージ３３ｋの昇降作動制御、ヘッド駆動機構３３Ｍによるスキージヘッド３３の移動制御及び搬出部２４の作動制御は、スクリーン印刷装置１３が備える制御装置６０が行う（図５）。また、制御装置６０は制御バルブ５７の駆動制御も行う（図３も参照）。   In the screen printing apparatus 13 configured as described above, the operation control of the carry-in unit 22, the operation control of the transport unit 44, the operation control of the clamp member driving unit 45M, the movement control of the base unit 42 by the XYZ rotary stage 41, the base unit by the lifting mechanism 48 The control device 60 provided in the screen printing device 13 performs the control operation of the lift 42, the control of the lift operation of the squeegee 33k by the cylinder 33s, the movement control of the squeegee head 33 by the head drive mechanism 33M, and the operation control of the carry-out unit 24 (FIG. 5). ). The control device 60 also performs drive control of the control valve 57 (see also FIG. 3).

図１において、搬出側中継コンベア１４はスクリーン印刷装置１３の下流工程側に設けられている。搬出側中継コンベア１４は、スクリーン印刷装置１３の搬出部２４が外部に搬出した搬送対象物を受け取って、部品実装装置１５に搬送する。   In FIG. 1, the carry-out side relay conveyor 14 is provided on the downstream process side of the screen printing apparatus 13. The carry-out side relay conveyor 14 receives the conveyance object carried out by the carry-out unit 24 of the screen printing apparatus 13 to the outside and conveys it to the component mounting apparatus 15.

図１において、部品実装装置１５は、搬出側中継コンベア１４から送られてきた基板２を基板搬送路６１によって搬送して作業位置に位置決めし、基板搬送路６１の下方に位置した基板支持ユニット６２によって基板２を支持する。そして、装着ヘッド６３により、スクリーン印刷装置１３においてスクリーン印刷が施された基板２の電極上に、部品（図示せず）を装着する。   In FIG. 1, the component mounting apparatus 15 conveys the substrate 2 sent from the carry-out side relay conveyor 14 by the substrate conveyance path 61 and positions it at the work position, and the substrate support unit 62 positioned below the substrate conveyance path 61. To support the substrate 2. Then, a component (not shown) is mounted on the electrode of the substrate 2 on which screen printing has been performed in the screen printing apparatus 13 by the mounting head 63.

次に、実装基板製造システム１による実装基板の製造時の動作を説明する。実装基板の製造では先ず、基板供給部１１が搬入側中継コンベア１２に基板２を供給する（図６（ａ））。基板供給部１１から基板２を受け取った搬入側中継コンベア１２は、搬入部２２に基板２を受け渡す（図６（ｂ））。基板２を受け取った搬入部２２は基板２を搬送部４４に搬出し、搬送部４４は受け取った基板２を作業位置に搬送する（図６（ｃ））。基板２が作業位置に搬送されたら昇降機構４８は下受け部材設置部４６を上昇させ（図７（ａ）中に示す矢印Ａ１）、基板下受け部材４７の上面を基板２の下面に接触させる（図７（ａ））。   Next, the operation at the time of manufacturing a mounting board by the mounting board manufacturing system 1 will be described. In manufacturing the mounting substrate, first, the substrate supply unit 11 supplies the substrate 2 to the carry-in relay conveyor 12 (FIG. 6A). The carry-in relay conveyor 12 that has received the substrate 2 from the substrate supply unit 11 delivers the substrate 2 to the carry-in unit 22 (FIG. 6B). The carrying-in part 22 which received the board | substrate 2 carries out the board | substrate 2 to the conveyance part 44, and the conveyance part 44 conveys the received board | substrate 2 to a working position (FIG.6 (c)). When the substrate 2 is transported to the working position, the lifting mechanism 48 raises the lower receiving member installation portion 46 (arrow A1 shown in FIG. 7A), and the upper surface of the lower substrate receiving member 47 is brought into contact with the lower surface of the substrate 2. (FIG. 7A).

基板下受け部材４７の上面が基板２の下面に接触したら、制御装置６０は制御バルブ５７を作動させて、吸着孔５１ａに吸着力を発生させる。これにより基板２は基板下受け部材４７の上面に密着し、基板２に反り等の変形がある場合であってもその変形が修正された状態で基板下受け部材４７に支持される。   When the upper surface of the substrate lowering member 47 comes into contact with the lower surface of the substrate 2, the control device 60 operates the control valve 57 to generate an adsorption force in the adsorption hole 51a. As a result, the substrate 2 is in close contact with the upper surface of the substrate receiving member 47 and is supported by the substrate receiving member 47 in a state where the deformation is corrected even when the substrate 2 is deformed such as warping.

基板下受け部材４７により基板２が支持されたら、昇降機構４８は更に下受け部材設置部４６を上昇させる（図７（ｂ）中に示す矢印Ａ２）。これにより基板２は基板下受け部材４７によって持ち上げられ、搬送部４４から離間する（図７（ｂ））。基板２が持ち上げられてその上面が一対のクランプ部材４５の上面と同じ高さになったら、クランプ部材駆動部４５Ｍに駆動された一対のクランプ部材４５が互いに近接するように作動し、基板２をＹ軸方向の両端側からクランプする（図７（ｂ）。図中に示す矢印Ｂ）。   When the substrate 2 is supported by the substrate lower receiving member 47, the lifting mechanism 48 further raises the lower receiving member installation portion 46 (arrow A2 shown in FIG. 7B). Thus, the substrate 2 is lifted by the substrate receiving member 47 and is separated from the transport unit 44 (FIG. 7B). When the substrate 2 is lifted and the upper surfaces thereof are at the same height as the upper surfaces of the pair of clamp members 45, the pair of clamp members 45 driven by the clamp member driving unit 45M operate so as to be close to each other. Clamping from both ends in the Y-axis direction (FIG. 7 (b), arrow B shown in the figure).

一対のクランプ部材４５が基板２をクランプしたら、ＸＹＺ回転ステージ４１が作動し、マスク３２のパターン開口と基板２の電極が上下に合致するように基板２を水平移動させたうえで、ベース部４２を上昇させる（図８中に示す矢印Ｃ）。これにより基板２の上面がマスク３２の下面に接触したら、スキージヘッド３３はシリンダ３３ｓにより一方のスキージ３３ｋを下降させ、そのスキージ３３ｋの下端をマスク３２の上面に当接させる（図８）。スキージ３３ｋの下端がマスク３２の上面に当接したら、ヘッド駆動機構３３Ｍが作動してスキージヘッド３３をＹ軸方向に移動させ（図８及び図９（ａ）に示す矢印Ｄ）、マスク３２上でスキージ３３ｋを摺動させる。これによりマスク３２上に予め供給されていたペーストＰｓｔがスキージ３３ｋによって掻き寄せられ、マスク３２の開口を通じて基板２の電極にペーストＰｓｔが印刷される。   When the pair of clamp members 45 clamp the substrate 2, the XYZ rotation stage 41 is actuated to move the substrate 2 horizontally so that the pattern opening of the mask 32 and the electrode of the substrate 2 are aligned vertically, and then the base portion 42. Is raised (arrow C shown in FIG. 8). Thus, when the upper surface of the substrate 2 comes into contact with the lower surface of the mask 32, the squeegee head 33 lowers one squeegee 33k by the cylinder 33s and makes the lower end of the squeegee 33k contact the upper surface of the mask 32 (FIG. 8). When the lower end of the squeegee 33k comes into contact with the upper surface of the mask 32, the head drive mechanism 33M is operated to move the squeegee head 33 in the Y-axis direction (arrow D shown in FIGS. 8 and 9A). Then slide the squeegee 33k. As a result, the paste Pst previously supplied onto the mask 32 is scraped by the squeegee 33k, and the paste Pst is printed on the electrode of the substrate 2 through the opening of the mask 32.

基板２の電極にペーストＰｓｔが印刷されたらＸＹＺ回転ステージ４１が作動してベース部４２を下降させ、基板２をマスク３２から離間（版離れ）させる。基板２がマスク３２から離間したら、制御装置６０は制御バルブ５７を作動させて基板２の吸着を解除する。基板２の吸着が解除されたら一対のクランプ部材４５が互いに離間する方向に作動して基板２のクランプを解除し、昇降機構４８が下受け部材設置部４６を下降させて、基板２を搬送部４４に載置させる（図３）。基板２が搬送部４４に載置されたら搬送部４４は基板２を搬送して搬出部２４に搬出する（図９（ｂ））。搬出部２４は、搬送部４４が搬出した基板２（スクリーン印刷が施された基板２）を受け取って、搬出側中継コンベア１４に受け渡す（図９（ｃ））。これによりスクリーン印刷装置１３による基板２の１枚当たりのスクリーン印刷が完了する。   When the paste Pst is printed on the electrode of the substrate 2, the XYZ rotary stage 41 is operated to lower the base portion 42, thereby separating the substrate 2 from the mask 32 (plate separation). When the substrate 2 is separated from the mask 32, the control device 60 operates the control valve 57 to release the adsorption of the substrate 2. When the suction of the substrate 2 is released, the pair of clamp members 45 operate in a direction away from each other to release the clamp of the substrate 2, and the lifting mechanism 48 lowers the lower member setting portion 46 to transfer the substrate 2 to the transport portion. 44 (FIG. 3). If the board | substrate 2 is mounted in the conveyance part 44, the conveyance part 44 will convey the board | substrate 2 and will carry it out to the carrying-out part 24 (FIG.9 (b)). The carry-out unit 24 receives the substrate 2 (substrate 2 on which screen printing has been performed) carried out by the conveyance unit 44, and transfers it to the carry-out side relay conveyor 14 (FIG. 9C). Thereby, the screen printing per substrate 2 by the screen printing device 13 is completed.

搬出側中継コンベア１４は、スクリーン印刷装置１３から受け取った基板２を部品実装装置１５に搬出する。部品実装装置１５は搬出側中継コンベア１４が搬出した基板２を基板搬送路６１により受け取って作業位置に位置決めし、その基板２を基板支持ユニット６２によって支持したうえで、装着ヘッド６３により基板２に部品を装着する。そして、基板２に装着すべき全ての部品を装着したら、基板２を外部（下流工程側）に搬出する。   The carry-out relay conveyor 14 carries the board 2 received from the screen printing device 13 to the component mounting device 15. The component mounting apparatus 15 receives the substrate 2 carried out by the carry-out-side relay conveyor 14 through the substrate conveyance path 61 and positions the substrate 2 at a work position. Install the parts. When all the components to be mounted on the substrate 2 are mounted, the substrate 2 is carried out to the outside (downstream process side).

このような構成の実装基板製造システム１では、スクリーン印刷装置１３が備える基板下受け部材４７の設置と取り外しをそれぞれ自動で行うことができるようになっており、以下にその手順を説明する。   In the mounting board manufacturing system 1 having such a configuration, the board receiving member 47 provided in the screen printing apparatus 13 can be automatically installed and removed, and the procedure will be described below.

基板下受け部材４７をスクリーン印刷装置１３の下受け部材設置部４６に自動で設置する場合には、基板状に形成された第１のキャリヤ７１（図１０（ａ），（ｂ））を用いる。第１のキャリヤ７１の下面には複数の磁石（第２の磁石７１Ｍ）が下方に露出するようにして設けられている。前述したように基板下受け部材４７は磁性体材料から成っており、第２の磁石７１Ｍは基板下受け部材４７を磁力で引き寄せるので、基板下受け部材４７の上面を第１のキャリヤ７１の下面に接触させると、基板下受け部材４７が第１のキャリヤ７１に保持される。このように本実施の形態において、第１のキャリヤ７１の下面には第２の磁石７１Ｍが設けられており、基板下受け部材４７は、第２の磁石７１Ｍが発揮する磁力により第１のキャリヤ７１の下面に保持されるようになっている。   When the substrate support member 47 is automatically installed in the support member installation portion 46 of the screen printing apparatus 13, the first carrier 71 (FIGS. 10A and 10B) formed in a substrate shape is used. . A plurality of magnets (second magnets 71M) are provided on the lower surface of the first carrier 71 so as to be exposed downward. As described above, the substrate receiving member 47 is made of a magnetic material, and the second magnet 71M attracts the substrate receiving member 47 with a magnetic force, so that the upper surface of the substrate receiving member 47 is set to the lower surface of the first carrier 71. The substrate lower receiving member 47 is held by the first carrier 71. As described above, in the present embodiment, the second magnet 71M is provided on the lower surface of the first carrier 71, and the substrate lowering member 47 is formed by the magnetic force exerted by the second magnet 71M. 71 is held on the lower surface.

ここで、第２の磁石７１Ｍは、基板下受け部材４７に設けられた第１の磁石４７Ｍが下受け部材設置部４６を引き寄せる磁力よりも弱い引き寄せ力で基板下受け部材４７を引き寄せる磁力を発揮するものとなっている。すなわち、基板下受け部材４７と第１のキャリヤ７１との間の引き寄せ力は基板下受け部材４７と下受け部材設置部４６との間の引き寄せ力よりも弱くなっている。   Here, the second magnet 71 </ b> M exerts a magnetic force that attracts the substrate receiving member 47 with an attractive force that is weaker than the magnetic force that the first magnet 47 </ b> M provided on the substrate receiving member 47 attracts the lower receiving member installation portion 46. It is supposed to be. That is, the pulling force between the substrate lower receiving member 47 and the first carrier 71 is weaker than the pulling force between the substrate lower receiving member 47 and the lower receiving member installing portion 46.

図１０（ａ），（ｂ）に示すように、第１のキャリヤ７１の下面には下方に突出した複数の突起部７１ａが設けられており、基板下受け部材４７の上面には各突起部７１ａと嵌合し得る形状の複数の穴部４７ｂが設けられている。第１のキャリヤ７１の複数の突起部７１ａが基板下受け部材４７の複数の穴部４７ｂと嵌合することで、基板下受け部材４７は第１のキャリヤ７１に対する所定の保持位置に正確に保持される。   As shown in FIGS. 10A and 10B, the lower surface of the first carrier 71 is provided with a plurality of protrusions 71a protruding downward, and the protrusions 71a are provided on the upper surface of the substrate receiving member 47. A plurality of holes 47b having a shape that can be fitted to 71a are provided. The plurality of protrusions 71 a of the first carrier 71 are fitted into the plurality of holes 47 b of the substrate receiving member 47 so that the substrate receiving member 47 is accurately held at a predetermined holding position with respect to the first carrier 71. Is done.

作業者ＯＰは、基板下受け部材４７を下受け部材設置部４６に設置する場合には、基板下受け部材４７を保持させた第１のキャリヤ７１を搬入側中継コンベア１２に投入（供給）する（基板下受け部材供給工程。図１１（ａ））。基板下受け部材４７を保持した第１のキャリヤ７１を受け取った搬入側中継コンベア１２は、第１のキャリヤ７１を搬入部２２に受け渡す（図１１（ｂ））。搬入部２２は、搬入側中継コンベア１２から受け取った第１のキャリヤ７１を搬送部４４に受け渡し、次いで搬送部４４は、受け取った第１のキャリヤ７１を作業位置に搬送する（図１１（ｃ））。すなわち、搬送部４４は、基板下受け部材４７を保持した第１のキャリヤ７１を作業位置に搬送することで、基板下受け部材４７を作業位置に位置させる（基板下受け部材搬送工程）。   When the operator OP installs the substrate support member 47 in the support member installation portion 46, the operator OP inputs (supplies) the first carrier 71 holding the substrate support member 47 to the carry-in relay conveyor 12. (Substrate lowering member supplying step. FIG. 11A). The carry-in relay conveyor 12 that has received the first carrier 71 holding the substrate lower receiving member 47 delivers the first carrier 71 to the carry-in section 22 (FIG. 11B). The carry-in unit 22 transfers the first carrier 71 received from the carry-in relay conveyor 12 to the transport unit 44, and then the transport unit 44 transports the received first carrier 71 to the work position (FIG. 11C). ). That is, the transport unit 44 transports the first carrier 71 holding the substrate support member 47 to the work position, thereby positioning the substrate support member 47 at the work position (substrate support member transport process).

搬送部４４が第１のキャリヤ７１を作業位置に搬送することによって、第１のキャリヤ７１に保持された基板下受け部材４７が作業位置（下受け部材設置部４６の上方）に位置したら（図１２（ａ））、昇降機構４８は、基板下受け部材４７を下受け部材設置部４６に設置する（基板下受け部材設置工程）。具体的には、先ず、昇降機構４８が下受け部材設置部４６を上昇させ（図１２（ｂ）中に示す矢印Ａ３）、下受け部材設置部４６の上面を基板下受け部材４７の下面に接触させることによって、第１の磁石４７Ｍと下受け部材設置部４６との間の磁力により、第１のキャリヤ７１に保持された基板下受け部材４７を下受け部材設置部４６に固定する（このとき、下受け部材設置部４６側の複数の凹部４６ａが基板下受け部材４７側の複数の凸部４７ａと嵌合するようにする）。このようにして基板下受け部材４７が下受け部材設置部４６に固定されたら、昇降機構４８が下受け部材設置部４６を下降させる（図１２（ｃ）。図中に示す矢印Ａ４）。   When the transport unit 44 transports the first carrier 71 to the working position, the substrate lowering member 47 held by the first carrier 71 is positioned at the working position (above the lower receiving member installation unit 46) (see FIG. 12 (a)), the elevating mechanism 48 installs the substrate receiving member 47 in the lower receiving member installation portion 46 (substrate under receiving member installation step). Specifically, first, the elevating mechanism 48 raises the lower receiving member installation portion 46 (arrow A3 shown in FIG. 12B), and the upper surface of the lower receiving member installation portion 46 is made the lower surface of the substrate lower receiving member 47. By making the contact, the substrate lowering member 47 held by the first carrier 71 is fixed to the lower receiving member setting portion 46 by the magnetic force between the first magnet 47M and the lower receiving member setting portion 46 (this (The plurality of concave portions 46a on the lower receiving member installation portion 46 side are fitted with the plurality of convex portions 47a on the substrate lower receiving member 47 side). When the substrate receiving member 47 is fixed to the lower receiving member installation portion 46 in this way, the elevating mechanism 48 lowers the lower receiving member installation portion 46 (FIG. 12 (c), arrow A4 shown in the figure).

上記のような下受け部材設置部４６の昇降作動において、第１のキャリヤ７１に保持された基板下受け部材４７の下面に下受け部材設置部４６が接触した際、基板下受け部材４７は第１のキャリヤ７１との間の引き寄せ力と下受け部材設置部４６との間の引き寄せ力とを受けるが、前述したように、基板下受け部材４７と第１のキャリヤ７１との間の引き寄せ力は基板下受け部材４７と下受け部材設置部４６との間の引き寄せ力よりも弱いことから、その後下受け部材設置部４６が下降すると、基板下受け部材４７は第１のキャリヤ７１から分離し、下受け部材設置部４６に設置された状態となる（図１２（ｃ））   In the raising / lowering operation of the lower receiving member installation portion 46 as described above, when the lower receiving member installation portion 46 comes into contact with the lower surface of the lower substrate receiving member 47 held by the first carrier 71, the lower substrate receiving member 47 is The pulling force between the first carrier 71 and the pulling force between the lower receiving member installation portion 46 are received. As described above, the pulling force between the substrate lowering member 47 and the first carrier 71 is received. Is weaker than the pulling force between the substrate receiving member 47 and the lower receiving member installation portion 46, and when the lower receiving member installation portion 46 is subsequently lowered, the substrate lower receiving member 47 is separated from the first carrier 71. Then, it is in a state where it is installed in the lower receiving member installation section 46 (FIG. 12C).

上述のようにして基板下受け部材４７が下受け部材設置部４６に設置されたら、搬送部４４は基板下受け部材４７と分離した第１のキャリヤ７１を搬送し、搬出部２４に受け渡す（図１３（ａ））。そして、第１のキャリヤ７１を受け取った搬出部２４はその第１のキャリヤ７１を搬出側中継コンベア１４に搬出する（図１３（ｂ））。第１のキャリヤ７１が搬出側中継コンベア１４に搬出されたら、作業者ＯＰは、搬出側中継コンベア１４から第１のキャリヤ７１を取り出して、回収する（図１３（ｃ））。これによりスクリーン印刷装置１３への基板下受け部材４７の設置が完了する。   When the substrate lowering member 47 is installed in the lower receiving member installation unit 46 as described above, the transport unit 44 transports the first carrier 71 separated from the substrate lowering member 47 and delivers it to the carry-out unit 24 ( FIG. 13 (a)). Then, the unloading unit 24 that has received the first carrier 71 unloads the first carrier 71 to the unloading-side relay conveyor 14 (FIG. 13B). When the first carrier 71 is carried out to the carry-out relay conveyor 14, the operator OP takes out the first carrier 71 from the carry-out relay conveyor 14 and collects it (FIG. 13C). Thereby, the installation of the substrate lower receiving member 47 in the screen printing apparatus 13 is completed.

スクリーン印刷装置１３に設置されている基板下受け部材４７を自動で回収する場合には、基板状に形成された第２のキャリヤ７２を用いる（図１４（ａ），（ｂ））。図１４（ａ），（ｂ）において、第２のキャリヤ７２の下面には複数の磁石（第３の磁石７２Ｍ）が下方に露出するようにして設けられている。前述したように、基板下受け部材４７は磁性体材料から成っており、第３の磁石７２Ｍは基板下受け部材４７を磁力で引き寄せるので、基板下受け部材４７の上面を第２のキャリヤ７２の下面に接触させることで、基板下受け部材４７を第２のキャリヤ７２に保持させることができる。なお、第２のキャリヤ７２に設けられる第３の磁石７２Ｍは、基板下受け部材４７に設けられた第１の磁石４７Ｍが下受け部材設置部４６を引き寄せる磁力よりも強い引き寄せ力を発揮するものとなっている。すなわち、基板下受け部材４７と第２のキャリヤ７２との間の引き寄せ力は基板下受け部材４７と下受け部材設置部４６との間の引き寄せ力よりも強くなっている。   When the substrate receiving member 47 installed in the screen printing device 13 is automatically collected, the second carrier 72 formed in a substrate shape is used (FIGS. 14A and 14B). 14A and 14B, a plurality of magnets (third magnets 72M) are provided on the lower surface of the second carrier 72 so as to be exposed downward. As described above, the substrate lowering member 47 is made of a magnetic material, and the third magnet 72M attracts the substrate lowering member 47 with a magnetic force, so that the upper surface of the substrate lowering member 47 is placed on the second carrier 72. By contacting the lower surface, the substrate lowering member 47 can be held by the second carrier 72. The third magnet 72M provided on the second carrier 72 exhibits an attractive force stronger than the magnetic force with which the first magnet 47M provided on the substrate lower receiving member 47 pulls the lower receiving member installation portion 46. It has become. That is, the pulling force between the substrate lower receiving member 47 and the second carrier 72 is stronger than the pulling force between the substrate lower receiving member 47 and the lower receiving member installation portion 46.

下受け部材設置部４６に設置されている基板下受け部材４７を回収する場合には、作業者ＯＰは、第２のキャリヤ７２を搬入側中継コンベア１２に搬入部２２に投入（供給）する。第２のキャリヤ供給工程。図１５（ａ））。第２のキャリヤ７２を受け取った搬入側中継コンベア１２は、第２のキャリヤ７２を搬入部２２に受け渡す（図１５（ｂ））。搬入部２２は、搬入側中継コンベア１２から受け取った第２のキャリヤ７２を搬送部４４に受け渡し、次いで搬送部４４は、受け取った第２のキャリヤ７２を作業位置に搬送する（図１５（ｃ））。   When collecting the substrate lower receiving member 47 installed in the lower receiving member installing portion 46, the operator OP inputs (supplies) the second carrier 72 to the carry-in relay conveyor 12 to the carry-in portion 22. Second carrier supply step. FIG. 15 (a)). The carry-in relay conveyor 12 that has received the second carrier 72 delivers the second carrier 72 to the carry-in unit 22 (FIG. 15B). The carry-in unit 22 transfers the second carrier 72 received from the carry-in relay conveyor 12 to the transport unit 44, and then the transport unit 44 transports the received second carrier 72 to the working position (FIG. 15C). ).

搬送部４４が第２のキャリヤ７２を作業位置に搬送することによって、その第２のキャリヤ７２が下受け部材設置部４６に設置されている基板下受け部材４７の上方に位置したら（図１６（ａ））、下受け部材設置部４６に設置された基板下受け部材４７を下受け部材設置部４６から取り外して搬送部４４に受け渡す（基板下受け部取外し工程）。具体的には、先ず、昇降機構４８が下受け部材設置部４６を上昇させ（図１６（ｂ）中に示す矢印Ａ５）、基板下受け部材４７の上面を第２のキャリヤ７２の下面に接触させることによって、第３の磁石７２Ｍと基板下受け部材４７との間の磁力により、基板下受け部材４７を第２のキャリヤ７２に保持させる。そして、このようにして基板下受け部材４７が第２のキャリヤ７２に保持されたら、（図１６（ｂ））、昇降機構４８が下受け部材設置部４６を下降させる（図１６（ｃ）。図中に示す矢印Ａ６）。   When the transporting part 44 transports the second carrier 72 to the working position, the second carrier 72 is positioned above the substrate lowering member 47 installed in the lowering member installing part 46 (FIG. 16 ( a)) The substrate lowering member 47 installed in the lower receiving member installation unit 46 is removed from the lower receiving member installation unit 46 and delivered to the transport unit 44 (substrate lowering unit removal step). Specifically, first, the elevating mechanism 48 raises the lower receiving member installation portion 46 (arrow A5 shown in FIG. 16B), and the upper surface of the substrate lowering member 47 contacts the lower surface of the second carrier 72. By doing so, the substrate lowering member 47 is held by the second carrier 72 by the magnetic force between the third magnet 72M and the substrate lowering member 47. When the substrate lowering member 47 is thus held by the second carrier 72 (FIG. 16B), the elevating mechanism 48 lowers the lower receiving member installation portion 46 (FIG. 16C). Arrow A6) shown in the figure.

上記のような下受け部材設置部４６の昇降作動において、基板下受け部材４７の上面に第２のキャリヤ７２が接触した際、基板下受け部材４７は下受け部材設置部４６との間の引き寄せ力と第２のキャリヤ７２との間の引き寄せ力とを受けるが、前述したように、基板下受け部材４７と第２のキャリヤ７２との間の引き寄せ力は基板下受け部材４７と下受け部材設置部４６との間の引き寄せ力よりも強いことから、その後下受け部材設置部４６が下降すると、基板下受け部材４７は下受け部材設置部４６から分離し、第２のキャリヤ７２に受け渡されて基板下受け部材４７が下受け部材設置部４６から取り外された状態となる（図１６（ｃ））。   In the raising / lowering operation of the lower receiving member installation portion 46 as described above, when the second carrier 72 comes into contact with the upper surface of the lower substrate receiving member 47, the lower substrate receiving member 47 is attracted to the lower receiving member installation portion 46. Although the force and the pulling force between the second carrier 72 are received, as described above, the pulling force between the substrate lower receiving member 47 and the second carrier 72 is different from the substrate lower receiving member 47 and the lower receiving member. Since it is stronger than the pulling force between the mounting portion 46 and the lower receiving member setting portion 46 is subsequently lowered, the substrate lowering member 47 is separated from the lower receiving member setting portion 46 and delivered to the second carrier 72. Thus, the substrate lower receiving member 47 is removed from the lower receiving member installation portion 46 (FIG. 16C).

上述のようにして基板下受け部材４７が第２のキャリヤ７２に受け渡されたら、搬送部４４は第２のキャリヤ７２を搬出部２４に受け渡し（図１７（ａ））、次いで搬出部２４は、搬送部４４から受け取った第２のキャリヤ７２を搬出側中継コンベア１４に搬出する（基板下受け部材搬出工程。図１７（ｂ））。作業者ＯＰは、基板下受け部材４７を保持した第２のキャリヤ７２が搬出側中継コンベア１４に搬出されたら、搬出側中継コンベア１４から第２のキャリヤ７２を取り出す（図１７（ｃ））。このように搬送部４４は、基板下受け部材４７を保持した第２のキャリヤ７２を搬送することで、作業位置から基板下受け部材４７を搬出するようになっている。これによりスクリーン印刷装置１３からの基板下受け部材４７の回収が完了する。   When the substrate receiving member 47 is transferred to the second carrier 72 as described above, the transport unit 44 transfers the second carrier 72 to the unloading unit 24 (FIG. 17A), and the unloading unit 24 then Then, the second carrier 72 received from the transport unit 44 is carried out to the carry-out-side relay conveyor 14 (substrate lowering member carrying-out step, FIG. 17B). The operator OP takes out the second carrier 72 from the carry-out relay conveyor 14 when the second carrier 72 holding the substrate receiving member 47 is carried out to the carry-out relay conveyor 14 (FIG. 17C). In this way, the transport unit 44 transports the second carrier 72 holding the substrate receiving member 47 so that the substrate receiving member 47 is unloaded from the work position. Thereby, the recovery of the substrate receiving member 47 from the screen printing apparatus 13 is completed.

上述の手順によりスクリーン印刷装置１３への基板下受け部材４７の設置とスクリーン印刷装置１３からの基板下受け部材４７の回収を行うことができるが、基板下受け部材４７の回収を行った後、続けて基板下受け部材４７の設置作業を行うことにより、実装基板の生産中における基板下受け部材４７の交換作業を自動で行うことができる。   The substrate receiving member 47 can be installed on the screen printing apparatus 13 and the substrate receiving member 47 can be collected from the screen printing apparatus 13 by the above-described procedure. After the substrate receiving member 47 is collected, Subsequently, by performing the installation work of the substrate lower support member 47, the replacement work of the substrate lower support member 47 during the production of the mounting board can be automatically performed.

以上説明したように、本実施の形態における実装基板製造システム１（実装基板製造システム１における基板下受け部材の設置方法）では、基板下受け部材４７を下面に保持した第１のキャリヤ７１を搬送部４４により作業位置に搬送することで基板下受け部材４７を作業位置に位置させ、作業位置に位置した基板下受け部材４７を、基板下受け部材４７の下面に設けられた第１の磁石４７Ｍの磁力により下受け部材設置部４６に固定するようになっている。このため基板下受け部材４７の自動設置が可能となり、基板下受け部材４７の取り換えに要する作業工数が低減して実装基板の生産性を向上させることができる。   As described above, in the mounting substrate manufacturing system 1 in this embodiment (the method for installing the substrate receiving member in the mounting substrate manufacturing system 1), the first carrier 71 holding the substrate receiving member 47 on the lower surface is conveyed. The substrate receiving member 47 is positioned at the working position by being conveyed to the working position by the unit 44, and the substrate lowering member 47 located at the working position is provided with the first magnet 47M provided on the lower surface of the substrate lowering member 47. It is configured to be fixed to the lower receiving member installation portion 46 by the magnetic force. For this reason, it is possible to automatically install the substrate support member 47, and the number of work steps required to replace the substrate support member 47 can be reduced and the productivity of the mounting substrate can be improved.

なお、上述の実施の形態では、基板下受け部材４７は磁力によって第１のキャリヤ７１に保持にされるようになっていたが、基板下受け部材４７は、磁力以外の手段によって第１のキャリヤ７１に保持されるようになっていてもよい。また同様に、基板下受け部材４７は磁力によって第２のキャリヤ７２に保持されるようになっていたが、基板下受け部材４７は、磁力以外の手段によって第２のキャリヤ７２に保持されるようになっていてもよい。   In the above-described embodiment, the substrate lowering member 47 is held by the first carrier 71 by magnetic force. However, the substrate lowering member 47 is held by the first carrier by means other than magnetic force. 71 may be held. Similarly, the substrate receiving member 47 is held by the second carrier 72 by magnetic force, but the substrate receiving member 47 is held by the second carrier 72 by means other than magnetic force. It may be.

また、上述の実施の形態では、第１のキャリヤ７１及び第２のキャリヤ７２を搬入側中継コンベア１２に投入し、搬出側中継コンベア１４から取り出す作業を作業者ＯＰが手作業で行うようになっていたが、これら作業者ＯＰが行っていた作業を自動化することも可能である。この場合には、第１のキャリヤ７１及び第２のキャリヤ７２を搬入側中継コンベア１２に投入するキャリヤ供給装置を設けるとともに、搬出側中継コンベア１４から第１のキャリヤ７１及び第２のキャリヤ７２を取り出すキャリヤ取出し装置を設けるようにする。また、搬入部２２及び搬出部２４をそれぞれ振分けコンベアとして使用するようにしたうえで、これら振分けコンベアとした搬入部２２及び搬出部２４と、上記キャリヤ供給装置及びキャリヤ取出し装置を組み合わせることによっても自動化を図ることができる。   Further, in the above-described embodiment, the operator OP manually inputs the first carrier 71 and the second carrier 72 into the carry-in relay conveyor 12 and removes them from the carry-out relay conveyor 14. However, it is also possible to automate the work that was performed by these workers OP. In this case, a carrier supply device for feeding the first carrier 71 and the second carrier 72 into the carry-in relay conveyor 12 is provided, and the first carrier 71 and the second carrier 72 are moved from the carry-out relay conveyor 14. A carrier take-out device for taking out is provided. Further, after the carry-in unit 22 and the carry-out unit 24 are used as distribution conveyors, respectively, the carry-in unit 22 and the carry-out unit 24, which are the distribution conveyors, and the carrier supply device and the carrier take-out device are combined for automation. Can be achieved.

また、上述の実施の形態では、基板２に対する処理内容がスクリーン印刷装置１３によって基板２にペーストＰｓｔを印刷するスクリーン印刷作業であったが、これは他の作業、例えば、部品実装装置１５によって基板２に部品を装着する部品装着作業等であってもよい。基板２に対する処理内容が部品装着作業である場合には、上述の実施の形態の形態に示した部品実装装置１５が備える基板搬送路６１を上述の実施の形態における搬送部４４に、基板支持ユニット６２を基板下受け部材４７に置き換えた構成とすればよい。   Further, in the above-described embodiment, the processing content for the substrate 2 is a screen printing operation in which the paste Pst is printed on the substrate 2 by the screen printing device 13, but this is another operation, for example, the substrate by the component mounting device 15. 2 may be a component mounting operation for mounting a component. When the processing content for the substrate 2 is a component mounting operation, the substrate support path 61 provided in the component mounting apparatus 15 shown in the above embodiment is provided in the transport unit 44 in the above embodiment as a substrate support unit. What is necessary is just to set it as the structure which replaced 62 with the board | substrate lowering member 47. FIG.

基板下受け部材の取り換えに要する作業工数を低減して実装基板の生産性を向上させることができる実装基板製造システム及びこの実装基板製造システムにおける基板下受け部材の設置方法を提供する。   Provided are a mounting board manufacturing system capable of reducing the man-hours required for replacing a board lowering member and improving the productivity of the mounting board, and a method for installing the board lowering member in the mounting board manufacturing system.

１ 実装基板製造システム
２ 基板
３２ マスク（基板処理部）
３３ スキージヘッド（基板処理部）
４４ 搬送部
４６ 下受け部材設置部
４６ａ 凹部
４７ 基板下受け部材
４７ａ 凸部
４７Ｍ 第１の磁石
４８ 昇降機構（下受け部材設置部昇降機構）
７１ 第１のキャリヤ
７１Ｍ 第２の磁石
７２ 第２のキャリヤ 1 mounting substrate manufacturing system 2 substrate 32 mask (substrate processing section)
33 Squeegee head (substrate processing section)
44 Conveying part 46 Lower receiving member installation part 46a Concave part 47 Substrate lowering member 47a Convex part 47M First magnet 48 Elevating mechanism (lower receiving member installation part elevating mechanism)
71 1st carrier 71M 2nd magnet 72 2nd carrier

Claims (8)

搬送対象物を作業位置に搬送する搬送部と、
前記搬送部の下方に設けられた下受け部材設置部と、
前記下受け部材設置部に着脱自在に設置され、前記搬送部により前記作業位置に搬送された前記搬送対象物としての基板の下面を支持する基板下受け部材と、
前記基板下受け部材により下面が支持された基板の上面に所定の処理を施す基板処理部と、
前記搬送対象物としての前記基板下受け部材を下面に保持する第１のキャリヤとを備え、
前記搬送部は、前記基板下受け部材を保持した前記第１のキャリヤを前記作業位置に搬送することで前記基板下受け部材を前記作業位置に位置させ、
前記作業位置に位置された前記基板下受け部材は、前記基板下受け部材の下面に設けられた第１の磁石の磁力により前記下受け部材設置部に固定されることを特徴とする実装基板製造システム。 A transport unit for transporting a transport object to a work position;
A lower receiving member installation section provided below the transport section;
A substrate lower receiving member that is detachably installed in the lower receiving member setting portion and supports a lower surface of the substrate as the transfer object transferred to the work position by the transfer portion;
A substrate processing unit for performing a predetermined process on the upper surface of the substrate whose lower surface is supported by the substrate receiving member;
A first carrier that holds the substrate receiving member as the transport object on a lower surface;
The transport unit transports the first carrier holding the substrate receiving member to the working position to position the substrate receiving member at the working position,
The mounting substrate manufacturing method, wherein the substrate receiving member positioned at the work position is fixed to the receiving member installation portion by a magnetic force of a first magnet provided on a lower surface of the substrate receiving member. system. 前記第１のキャリヤの下面には第２の磁石が設けられており、前記基板下受け部材は、前記第２の磁石の磁力により前記第１のキャリヤの下面に保持されることを特徴とする請求項１に記載の実装基板製造システム。   A second magnet is provided on the lower surface of the first carrier, and the substrate receiving member is held on the lower surface of the first carrier by the magnetic force of the second magnet. The mounting board manufacturing system according to claim 1. 前記下受け部材設置部を昇降させる下受け部材設置部昇降機構を備え、前記下受け部材設置部昇降機構は、前記下受け部材設置部を上昇させて、前記第１のキャリヤに保持された前記基板下受け部材を前記下受け部材設置部に固定し、前記基板下受け部材が前記下受け部材設置部に固定されたら前記下受け部材設置部を下降させることで前記基板下受け部材を前記下受け部材設置部に設置することを特徴とする請求項１又は２に記載の実装基板製造システム。   A lower receiving member installation portion elevating mechanism that elevates and lowers the lower receiving member installation portion, and the lower receiving member installation portion elevating mechanism raises the lower receiving member installation portion and is held by the first carrier. A substrate lower receiving member is fixed to the lower receiving member installing portion, and when the substrate lower receiving member is fixed to the lower receiving member installing portion, the lower receiving member installing portion is lowered to lower the substrate lower receiving member. The mounting board manufacturing system according to claim 1, wherein the mounting board manufacturing system is installed in a receiving member installation section. 前記下受け部材設置部を昇降させる下受け部材設置部昇降機構を備え、前記下受け部材設置部昇降機構は、前記下受け部材設置部を上昇させて前記基板下受け部材を第２のキャリヤに保持させ、前記基板下受け部材が前記第２のキャリヤに保持されたら前記下受け部材設置部を下降させることで前記基板下受け部材を前記下受け部材設置部から取り外すことを特徴とする請求項１〜３のいずれかに記載の実装基板製造システム。   A lower receiving member installation portion elevating mechanism for elevating the lower receiving member installation portion is provided, and the lower receiving member installation portion elevating mechanism raises the lower receiving member installation portion so that the substrate lower receiving member becomes a second carrier. The substrate receiving member is removed from the lower receiving member installation portion by lowering the lower receiving member installation portion when the substrate lowering member is held by the second carrier. The mounting board manufacturing system in any one of 1-3. 前記搬送部は、前記基板下受け部材を保持した前記第２のキャリヤを搬送することで、前記作業位置から前記基板下受け部材を搬出することを特徴とする請求項４に記載の実装基板製造システム。   5. The mounting substrate manufacturing method according to claim 4, wherein the transport unit transports the second carrier holding the substrate lower receiving member to unload the substrate lower receiving member from the work position. system. 前記基板下受け部材は前記搬送部によって前記作業位置に位置された基板の下面を支持しながら吸着することを特徴とする請求項１〜５のいずれかに記載の実装基板製造システム。   The mounting substrate manufacturing system according to claim 1, wherein the substrate receiving member is adsorbed while supporting a lower surface of the substrate positioned at the working position by the transport unit. 前記基板下受け部材と前記下受け部材設置部とのうちのいずれか一方に設けられた凸部が、前記基板下受け部材と前記下受け部材設置部とのうちのいずれか他方に設けられた凹部と嵌合した状態で前記基板下受け部材が前記下受け部材設置部に設置されることを特徴とする請求項１〜６のいずれかに記載の実装基板製造システム。   A convex portion provided on one of the substrate lower receiving member and the lower receiving member installing portion is provided on either one of the substrate lower receiving member and the lower receiving member installing portion. The mounting substrate manufacturing system according to claim 1, wherein the substrate lower receiving member is installed in the lower receiving member installation portion in a state of being fitted with the concave portion. 搬送対象物を作業位置に搬送する搬送部と、前記搬送部の下方に設けられた下受け部材設置部と、前記下受け部材設置部に着脱自在に設置され、前記搬送部により前記作業位置に搬送された前記搬送対象物としての基板の下面を支持する基板下受け部材と、前記基板下受け部材により下面が支持された基板の上面に所定の処理を施す基板処理部と、前記搬送対象物としての前記基板下受け部材を下面に保持する第１のキャリヤとを備えた実装基板製造システムにおける基板下受け部材の設置方法であって、
前記基板下受け部材を保持した前記第１のキャリヤを前記搬送部によって前記作業位置に搬送することで、前記基板下受け部材を前記作業位置に位置させる基板下受け部材搬送工程と、
前記作業位置に位置させた前記基板下受け部材を、前記基板下受け部材の下面に設けられた第１の磁石の磁力により前記下受け部材設置部に固定する基板下受け部材設置工程とを含むことを特徴とする実装基板製造システムにおける基板下受け部材の設置方法。 A conveyance unit that conveys a conveyance object to a work position, a lower receiving member installation unit provided below the conveyance unit, and a removably installed unit on the lower reception member installation unit. A substrate receiving member that supports the lower surface of the substrate as the transferred object, a substrate processing unit that performs a predetermined process on the upper surface of the substrate whose lower surface is supported by the substrate receiving member, and the transfer object A mounting method for a substrate receiving member in a mounting substrate manufacturing system comprising: a first carrier that holds the substrate receiving member as a lower surface;
A substrate lowering member transporting step of positioning the substrate lowering member at the working position by transporting the first carrier holding the substrate lowering member to the working position by the transporting unit;
And a substrate lower member installation step of fixing the substrate lower member positioned at the working position to the lower receiver member installation portion by a magnetic force of a first magnet provided on a lower surface of the substrate lower member. An installation method of a substrate receiving member in a mounting substrate manufacturing system.

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