JP6424514B2 - Power converter - Google Patents
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- JP6424514B2 JP6424514B2 JP2014169919A JP2014169919A JP6424514B2 JP 6424514 B2 JP6424514 B2 JP 6424514B2 JP 2014169919 A JP2014169919 A JP 2014169919A JP 2014169919 A JP2014169919 A JP 2014169919A JP 6424514 B2 JP6424514 B2 JP 6424514B2
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- dissipating fin
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- 238000001816 cooling Methods 0.000 claims description 33
- 230000005855 radiation Effects 0.000 claims description 30
- 238000005192 partition Methods 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 11
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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- Inverter Devices (AREA)
Description
本発明は、電力変換装置に関し、特に半導体素子が例えばＳｉＣ（炭化ケイ素）を用いて構成されたＳｉＣパッケージ適用ユニットを冷却するための構造に関する。 The present invention relates to a power converter, and more particularly to a structure for cooling a SiC package application unit in which a semiconductor element is configured using, for example, SiC (silicon carbide).
図５および図６は、下記特許文献１に記載されている従来の電力変換装置（例．インバータ装置）の冷却構造を示す縦断面図である。図５に示されるように、従来の電力変換装置の冷却構造は、段差部４４が放熱フィン４６の下側に設けられ、放熱フィン４６と排気冷却ファン４７との間における隔壁３７を平坦に形成するとともに、放熱フィン４６の先端と箱体３１の背面カバー３３との間に、放熱フィン４６と排気冷却ファン４７との高さの差を埋める絞り板４８を設けるようにしている。絞り板４８は高さＨの空間を冷却風がバイパスすることを防止し、放熱フィン４６を通過する冷却風の風速を上昇させる機能をもっている。放熱フィン４６と冷却ファン４７との間で隔壁３７が平坦に形成されているので、冷却ファン４７で冷却風を吸い込む際のフィンベース４６ａ側の流体抵抗が減少し、フィン４６ｂの付け根付近の流速が上昇する。その結果、高温のフィン付け根側が有効に除熱される構成になっている。 FIG. 5 and FIG. 6 are longitudinal sectional views showing a cooling structure of a conventional power converter (ex. Inverter device) described in Patent Document 1 below. As shown in FIG. 5, in the cooling structure of the conventional power conversion device, the step portion 44 is provided below the radiation fin 46, and the partition 37 between the radiation fin 46 and the exhaust cooling fan 47 is formed flat. At the same time, a throttling plate 48 is provided between the tip of the heat dissipating fin 46 and the back cover 33 of the box 31 to fill in the difference in height between the heat dissipating fin 46 and the exhaust cooling fan 47. The throttling plate 48 prevents the cooling air from bypassing the space of height H, and has a function of increasing the wind speed of the cooling air passing through the radiation fins 46. Since the partition wall 37 is formed flat between the radiation fin 46 and the cooling fan 47, the fluid resistance on the side of the fin base 46a when the cooling air is drawn by the cooling fan 47 decreases, and the flow velocity near the root of the fin 46b Will rise. As a result, the high temperature fin root side is configured to be effectively removed.
また、図６に示される従来の電力変換装置の他の冷却構造は、隔壁３７により放熱フィン４６と排気冷却ファン４７との間に、放熱フィン４６とフィンベース４６ａと隔壁３７との段差部４４を解消する導風板４９を個別に設けるようにしている。鋼板から図示断面形状に折り曲げ形成された導風板４９は、フィンベース４６ａのフィン接合面から冷却ファン４７の手前まで緩やかに下降し、段差部ｈによる冷却ファン直後の流路断面積の急拡大を解消するようにして、段差部ｈによる圧力損失を低減する。 Further, another cooling structure of the conventional power conversion device shown in FIG. 6 is a step portion 44 between the radiation fin 46, the fin base 46a and the partition 37 between the radiation fin 46 and the exhaust cooling fan 47 by the partition 37. The wind guide plate 49 for eliminating the problem is separately provided. The air guide plate 49 formed by bending the steel plate into the cross-sectional shape shown in the figure gradually descends from the fin joint surface of the fin base 46a to the front of the cooling fan 47, and the step portion h rapidly expands the flow path cross section immediately after the cooling fan. To reduce the pressure loss due to the stepped portion h.
上記した従来の電力変換装置は、排気冷却ファンを使って熱を排気する方式であるが、排気冷却ファンを使用しているため、箱体内部の静圧が低くなり、箱体のあらゆる隙間から空気と一緒に塵埃を吸ってしまうという課題があった。 The above-mentioned conventional power conversion system is a method of exhausting heat using an exhaust cooling fan, but since the exhaust cooling fan is used, the static pressure inside the box becomes low, and any gaps in the box There was a problem of sucking in dust with the air.
また、従来の電力変換装置の隔壁は箱体の一部であり、この隔壁は放熱フィンを支持しているが、放熱フィンの熱を箱体内部に導いてしまい、放熱フィンと反対側に位置する室の内気が上昇し、その区画室に配置された電気部品に熱を加えてしまうため電気部品の故障や寿命低下を招くという課題があった。 Moreover, although the partition of the conventional power converter is a part of a box, and this partition supports the radiation fin, the heat of the radiation fin is guide | induced to the inside of a box, and it is located in the opposite side to a radiation fin The interior air of the room rises, and heat is applied to the electrical components disposed in the compartment, which causes a problem of causing a failure or a reduction in the life of the electrical components.
そこで本発明の目的は、放熱フィンで暖められた空気の熱を箱体内部の熱的に弱い電気部品に伝わるのを防止できるようにした電力変換装置を提供することである。 Therefore, an object of the present invention is to provide a power conversion device capable of preventing the heat of the air warmed by the radiation fins from being transmitted to the thermally weak electrical component inside the box.
放熱フィンの高さに調整された絶縁体から成る隔壁を設ける。さらに、この絶縁体から成る隔壁は、（一次）放熱フィンを通過した後の発熱量の大きい電気部品に取り付けられた二次放熱フィンに対して、前記絶縁体の一部に絞り込み部を設けるようにする。 Providing a partition wall consisting adjusted insulator height of the heat radiating fins. Further, partition walls made of the insulator, the secondary radiating fins attached to (primary) calorific value of greater electrical components after passing through the heat radiation fins, so as to provide a narrowing portion in a part of the insulator Make it
より具体的に示せば請求項１記載の発明は、直方体の箱体内に少なくとも半導体素子及び電気部品が収納された電力変換装置であって、前記箱体の前面側カバーに取り付けられた押し込み冷却ファンと、前記半導体素子に取り付けられた第１の放熱フィンと、発熱量の大きい前記電気部品に取り付けられた、前記第１の放熱フィンとは分離された第２の放熱フィンと、前記箱体内に配置され、前記箱体の内部空間を、前記半導体素子及び前記電気部品を含む第１の空間と、前記第１及び第２の放熱フィンを含む第２の空間とに仕切る隔壁であって、少なくとも熱絶縁性を有する薄い絶縁シートにより構成され隔壁と、を備え、前記押し込み冷却ファンによって前記箱体内に押し込まれた空気は、前記第１及び第２の放熱フィンを含む前記第２の空間を通って前記箱体の背面側から排出され、前記第２の放熱フィンは、前記第１の放熱フィンよりも、前記押し込み冷却ファンによる空気の流れの下流側に位置し、前記第１の放熱フィンを通過する空気の風速よりも前記第２の放熱フィンを通過する空気の風速が上昇するよう、前記隔壁における前記第１の放熱フィンの位置と前記第２の放熱フィンの位置との間に絞り込み部を設けた、ことを特徴とする。 More specifically, the invention according to claim 1 is a power conversion device in which at least a semiconductor element and an electrical component are housed in a rectangular parallelepiped box body, and a push-in cooling fan attached to a front cover of the box body. , A first heat dissipating fin attached to the semiconductor element, a second heat dissipating fin attached to the electrical component having a large amount of heat generation, separated from the first heat dissipating fin, and the box body is disposed, the interior space of the box body, a said the first space containing the semiconductor element and the electrical component, said first and second partition wall for partitioning into a second space containing a heat radiating fin, at least is constituted by a thin insulating sheet having thermal insulation comprises a partition wall, the air pushed into the box body by the pushing cooling fan, the second comprising the first and second heat radiation fins The second heat radiation fin is discharged downstream from the back side of the box through the space, and the second heat radiation fin is located downstream of the flow of air by the push-in cooling fan than the first heat radiation fin, Between the position of the first radiation fin and the position of the second radiation fin in the partition so that the velocity of the air passing through the second radiation fin is higher than the velocity of air passing through the radiation fin , And a narrowing unit is provided.
また請求項２記載の発明は、請求項１記載の発明において、前記半導体素子が放出する熱の温度は、前記電気部品が放出する熱の温度よりも高いことを特徴とする。 Or second aspect of the present invention is the invention of claim 1 wherein, the temperature of the heat the semiconductor element is released, the electrical component may be higher than the temperature of the heat release.
また請求項３記載の発明は、請求項１または２に記載の発明において、前記半導体素子は、炭化ケイ素、窒化ガリウムもしくはダイアモンドを主材料とする高耐熱性を有するワイドバンドギャップ半導体素子であることを特徴とする。 Also, in the invention according to claim 3, in the invention according to claim 1 or 2 , the semiconductor device is a wide band gap semiconductor device having high heat resistance mainly composed of silicon carbide, gallium nitride or diamond. It is characterized by
本発明の電力変換装置によれば、放熱フィンの高さにあわせた隔壁を設けることができるので、放熱フィンで暖められた空気の熱を箱体内部の熱的に弱い電気部品に伝わるのを防止できる。 According to the power conversion device of the present invention, since it is possible to provide a partition according to the height of the radiation fin, it is possible to transmit the heat of the air warmed by the radiation fin to the thermally weak electrical component inside the box. It can prevent.
さらに、隔壁の一部に絞込み部を設けることで、押し込み冷却ファンにより押し込まれた空気が、放熱フィンを通過した後、発熱量の大きい電気部品に取り付けられた二次放熱フィンに対して、風速を上げられることで放熱性を良好にすることができる。 Furthermore, by providing a throttling portion in a part of the partition wall, the air pushed in by the push-in cooling fan passes through the heat dissipating fins, and then the wind velocity with respect to the secondary heat dissipating fins attached to the electrical component having a large calorific value. The heat dissipation can be improved by raising the
また上記の隔壁を薄い絶縁シートにより構成しているので、該絶縁シートの加工が容易であり、加工が容易な絶縁体を使うことで熱絶縁もできるため、板金などで製作された従来の隔壁とは違い、熱遮蔽の効果が大きい。特に前記絶縁体の一部に絞り込みを入れる加工も、簡単な型で製作可能であり、コスト削減にもなる。 Also since the more configured thin insulating sheet above the partition wall is easily processed insulating sheet, processing for also thermally insulated by using an easy insulator, conventional fabricated like sheet metal Unlike partition walls, the effect of heat shielding is great. In particular, the process of narrowing down a part of the insulator can also be manufactured with a simple mold, which also reduces the cost.
以下、本発明の実施の形態について、詳細に説明する。
図１は、本発明の実施形態に係る電力変換装置の構成を示す斜視図であり、直方体形状の箱体１の前面カバー２に押し込み冷却ファン１８が配置されるとともに、直方体形状の箱体１に側面カバー６を取り付ける。そうして押し込み冷却ファン１８を介して取り込んだ空気（冷気）は背面カバー３側に排気される。
Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 is a perspective view showing a configuration of a power conversion device according to an embodiment of the present invention, wherein a pressing fan 18 is disposed in a front cover 2 of a rectangular parallelepiped box 1 and a rectangular parallelepiped box 1 Attach the side cover 6 to the Then, the air (cold air) taken in through the press-in cooling fan 18 is exhausted to the back cover 3 side.
図２は、本発明の実施形態に係る電力変換装置の構成を示す平面図である。図２において直方体形状の箱体１の内部は、隔壁２７により少なくとも前室および後室の２つ以上に分割され、分割されたそれぞれの室に各種電気部品２６ａ〜２６ｄが配置される。押し込み冷却ファン１８より取り込まれた空気は、分割された内部の室に個別に押し込まれる。プリント基板２８に実装された半導体素子１０は、前室の放熱フィン１６(図３および図４参照)上に取り付けられる。ここでプリント基板２８に実装される半導体素子１０は、本例ではＳｉＣ（炭化ケイ素）を用いて構成されたＳｉＣ半導体素子であるとして説明する。その一方、押し込み冷却ファン１８により押し込まれた空気は、絶縁体から成る隔壁７(図３および図４参照)により、電気部品２６b〜dに風が当たらないように、遮蔽している。 FIG. 2 is a plan view showing the configuration of the power conversion device according to the embodiment of the present invention. In FIG. 2, the interior of the rectangular parallelepiped box 1 is divided into at least two or more of a front chamber and a rear chamber by a partition wall 27, and various electric components 26 a to 26 d are disposed in each of the divided chambers. The air taken in from the push-in cooling fan 18 is separately pushed into the divided inner chambers. The semiconductor element 10 mounted on the printed circuit board 28 is mounted on the radiation fin 16 (see FIGS. 3 and 4) in the front chamber. Here, the semiconductor element 10 mounted on the printed board 28 is described as a SiC semiconductor element configured using SiC (silicon carbide) in this example. On the other hand, the air pushed by the pushing cooling fan 18 is shielded by the partition 7 (see FIGS. 3 and 4) made of an insulator so that the air does not hit the electric components 26b to 26d.
さらに、隔壁７の一部に絞込み部８を設けることで、押し込み冷却ファン１８により押し込まれた空気(冷気)が、放熱フィン１６を通過した後、発熱量の大きい電気部品２６ｄに取り付けられた二次放熱フィン１７に対して、風速を上げられることで放熱性を良好にすることができる(図３および図４参照)。 Further, by providing the refining unit 8 in a part of the partition wall 7, and more pressed air to push the cooling fan 18 (cooling air) is, after passing through the heat radiating fin 16, attached to the large electrical parts 26d of the heat value Heat dissipation can be improved by raising the wind speed with respect to the secondary radiation fins 17 (see FIGS. 3 and 4).
また隔壁７を薄い絶縁シートにより構成しているので、加工が容易であり、加工が容易な絶縁体を使うことで熱絶縁もできるため、板金などで製作された従来の隔壁とは違い、熱遮蔽の効果が大きい。特に絶縁体の一部に絞り込みを入れる加工も、簡単な型で製作可能であり、コスト削減にもなる。 Also since the more constitute a partition wall 7 into thin insulating sheet, machining is easy, since the thermal insulation can also by machining using an easy insulator, unlike conventional bulkhead fabricated like sheet metal, The effect of heat shielding is great. In particular, the process of narrowing down a part of the insulator can also be manufactured with a simple mold, which also reduces the cost.
図３は、本発明の実施形態に係る電力変換装置の構成を示す断面図（その１）であり、直方体形状の箱体１の前面カバー２に押し込み冷却ファン１８が配置され、該冷却ファン１８により押し込まれた空気は放熱フィン１６を通り、絶縁体から成る隔壁７により、電気部品２６ｃ，２６ｂに風を当てないようにして、背面カバー３側へ排気される。 FIG. 3 is a cross-sectional view (part 1) showing the configuration of the power conversion device according to the embodiment of the present invention, in which the cooling fan 18 is disposed in the front cover 2 of the rectangular parallelepiped box 1. The air that has been pushed in passes through the heat dissipating fins 16 and is exhausted to the back cover 3 side by the partition wall 7 made of an insulator so as not to blow air on the electric components 26c and 26b.
本実施形態では、箱体１の前室側に配置された半導体素子１０が放出する熱の温度は、箱体１の後室側に配置された電気部品２６ｂ〜ｄが放出する熱の温度よりも高いため、半導体素子１０が放出する熱を冷却する放熱フィン１６で暖められた空気の熱が、箱体内部の熱的に弱い電気部品２６ｃ，２６ｂに伝わらないように隔壁７により熱を遮断する。 In the present embodiment, the temperature of the heat emitted from the semiconductor element 10 disposed on the front chamber side of the box 1 is higher than the temperature of the heat emitted from the electrical components 26 b to d disposed on the rear chamber side of the box 1. Also, since the heat of the air warmed by the radiation fins 16 for cooling the heat released by the semiconductor element 10 is not transmitted to the thermally weak electrical components 26 c and 26 b inside the box, the heat is blocked by the partition 7. Do.
図４は、本発明の実施形態に係る電力変換装置の構成を示す断面図（その２）であって、図３に示した断面部とは異なる断面部におけるものであり、直方体形状の箱体１の前面カバー２に押し込み冷却ファン１８が配置され、該冷却ファン１８により押し込まれた空気は（一次）放熱フィン１６を通り、絶縁体から成る隔壁７により、発熱量の大きい電気部品２６ｄが取り付けられた二次放熱フィン１７に風を流して、背面カバー３側へ排気される。 FIG. 4 is a cross-sectional view (part 2) showing the configuration of the power conversion device according to the embodiment of the present invention, which is at a cross-section different from the cross-section shown in FIG. The cooling fan 18 is disposed in the front cover 2 of 1, the air pressed by the cooling fan 18 passes through the (primary) radiation fins 16, and the electric component 26d with a large amount of heat generation is attached by the partition 7 made of an insulator. The air is blown to the secondary radiation fins 17 and exhausted to the back cover 3 side.
上記で説明した半導体パッケージは、もっぱらＳｉＣ（炭化ケイ素）を用いて構成されたＳｉＣ半導体パッケージを使用する例について示したが、他の半導体素子、例えば、窒化ガリウムやダイアモンドなどを用いた高耐熱性を有するワイドバンドギャップ半導体素子で構成される半導体パッケージに適用するようにしても同じ効果を奏するものである。 Although the semiconductor package described above shows an example of using a SiC semiconductor package configured exclusively using SiC (silicon carbide), other semiconductor elements, for example, high heat resistance using gallium nitride, diamond, etc. The same effect can be obtained even when applied to a semiconductor package constituted by a wide band gap semiconductor device having the
１ 箱体
２ 前面カバー
３ 背面カバー
６ 側面カバー
７、２７ 隔壁
８ 絞り込み部
１０ 半導体素子
１６ (一次)放熱フィン
１７ 二次放熱フィン
１８ 押し込み冷却ファン
２６、２６ａ〜２６ｄ 電気部品
２８ プリント基板
REFERENCE SIGNS LIST 1 box 2 front cover 3 back cover 6 side cover 7, 27 partition 8 narrowing portion 10 semiconductor element 16 (primary) radiation fin 17 secondary radiation fin 18 push-in cooling fan 26, 26 a to 26 d electric component 28 printed circuit board
Claims (3)
前記箱体の前面側カバーに取り付けられた押し込み冷却ファンと、
前記半導体素子に取り付けられた第１の放熱フィンと、
発熱量の大きい前記電気部品に取り付けられた、前記第１の放熱フィンとは分離された第２の放熱フィンと、
前記箱体内に配置され、前記箱体の内部空間を、前記半導体素子及び前記電気部品を含む第１の空間と、前記第１及び第２の放熱フィンを含む第２の空間とに仕切る隔壁であって、少なくとも熱絶縁性を有する薄い絶縁シートにより構成され隔壁と、
を備え、
前記押し込み冷却ファンによって前記箱体内に押し込まれた空気は、前記第１及び第２の放熱フィンを含む前記第２の空間を通って前記箱体の背面側から排出され、
前記第２の放熱フィンは、前記第１の放熱フィンよりも、前記押し込み冷却ファンによる空気の流れの下流側に位置し、
前記第１の放熱フィンを通過する空気の風速よりも前記第２の放熱フィンを通過する空気の風速が上昇するよう、前記隔壁における前記第１の放熱フィンの位置と前記第２の放熱フィンの位置との間に絞り込み部を設けた、ことを特徴とする電力変換装置。 A power conversion device in which at least a semiconductor element and an electrical component are housed in a rectangular box body,
A forced cooling fan attached to the front cover of the box;
A first heat radiation fin attached to the semiconductor element;
A second heat dissipating fin attached to the electrical component having a large amount of heat generation and separated from the first heat dissipating fin;
Disposed in the box body, the inner space of the box body, with the a first space containing a semiconductor element and the electrical component, said first and second partition wall partitioning the second space containing a heat dissipating fins And a partition formed of a thin insulating sheet having at least thermal insulation , and
Equipped with
The air pushed into the box body by the pushing cooling fan is discharged from the back side of the box through the second space including the first and second radiation fins.
The second heat dissipating fin is located downstream of the first heat dissipating fin on the downstream side of the flow of air by the push-in cooling fan,
The position of the first heat dissipating fin in the partition and the second heat dissipating fin so that the speed of air passing through the second heat dissipating fin is higher than the speed of air passing through the first heat dissipating fin A power converter characterized in that a narrowing portion is provided between the position and the position.
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| JP2014169919A JP6424514B2 (en) | 2014-08-22 | 2014-08-22 | Power converter |
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| JP6424514B2 true JP6424514B2 (en) | 2018-11-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5611391Y2 (en) * | 1975-11-28 | 1981-03-14 | ||
| DE68920513T2 (en) * | 1988-08-31 | 1995-05-04 | Hitachi Ltd | Inverter device. |
| JPH03268483A (en) * | 1990-03-19 | 1991-11-29 | Fuji Electric Co Ltd | Cooling device for electronic equipment |
| JP3575328B2 (en) * | 1999-04-23 | 2004-10-13 | 松下電工株式会社 | Solar power generator |
| JP2002368470A (en) * | 2001-06-07 | 2002-12-20 | Toshiba Corp | Heat generating body cooler |
| JP2008060430A (en) * | 2006-08-31 | 2008-03-13 | Daikin Ind Ltd | Power converter |
| JP5402702B2 (en) * | 2010-02-12 | 2014-01-29 | 株式会社デンソー | Power converter |
| JP5663450B2 (en) * | 2011-10-18 | 2015-02-04 | 株式会社日立製作所 | Power converter |
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