JP6415564B2 - 光学コンポーネント - Google Patents
光学コンポーネント Download PDFInfo
- Publication number
- JP6415564B2 JP6415564B2 JP2016537259A JP2016537259A JP6415564B2 JP 6415564 B2 JP6415564 B2 JP 6415564B2 JP 2016537259 A JP2016537259 A JP 2016537259A JP 2016537259 A JP2016537259 A JP 2016537259A JP 6415564 B2 JP6415564 B2 JP 6415564B2
- Authority
- JP
- Japan
- Prior art keywords
- optical component
- printed circuit
- circuit board
- mirror
- moems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
- G02B19/0023—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors) at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1822—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors comprising means for aligning the optical axis
- G02B7/1827—Motorised alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Optical Elements Other Than Lenses (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
Description
Claims (15)
- 光学コンポーネント(40)であって、
1.1 少なくとも1つの微小光学電気機械システム(MOEMS)(73)であり、
1.1.1 表側及び
1.1.2 裏側
を有する少なくとも1つの微小光学電気機械システム(MOEMS)(73)と、
1.2 少なくとも1つのプリント回路基板(56)と、
1.3 真空気密にシールされた空洞(64)と
を備え、
1.4 前記少なくとも1つのプリント回路基板(56)は、前記少なくとも1つのMOEMS(73)の前記裏側に配置され、
1.5 前記少なくとも1つのプリント回路基板(56)は、前記空洞(64)の横方向境界を形成し、
1.6 前記空洞(64)は、前記少なくとも1つのMOEMS(73)によって片側の境界が定められ、
1.7 前記空洞(64)は、カバー(66)によって真空気密に境界が定められる光学コンポーネント。 - 請求項1に記載の光学コンポーネント(40)において、前記少なくとも1つのプリント回路基板(56)は、多層実施形態を有することを特徴とする光学コンポーネント。
- 請求項1又は2に記載の光学コンポーネント(40)において、前記空洞(64)は、前記MOEMS(73)の前記裏側に直接隣接することを特徴とする光学コンポーネント。
- 請求項1に記載の光学コンポーネント(40)において、電気部品及び/又は冷却素子が前記空洞(64)内に配置されることを特徴とする光学コンポーネント。
- 請求項1に記載の光学コンポーネント(40)において、前記空洞(64)は、充填材によって少なくとも部分的に充填されることを特徴とする光学コンポーネント。
- 請求項1〜5のいずれか1項に記載の光学コンポーネント(40)において、前記プリント回路基板(56)は、横方向接点(67)を有し、該横方向接点(67)は、案内特性を有することを特徴とする光学コンポーネント。
- 請求項6に記載の光学コンポーネント(40)において、前記横方向接点(67)は、ビア(垂直相互接続アクセス)として具現されることを特徴とする光学コンポーネント。
- 請求項6に記載の光学コンポーネント(40)において、前記横方向接点(67)は、自動調心実施形態を有することを特徴とする光学コンポーネント。
- 請求項6〜8のいずれか1項に記載の光学コンポーネント(40)において、ばね付勢要素が、前記横方向接点(67)の電気的接触のために設けられることを特徴とする光学コンポーネント。
- 請求項1〜9のいずれか1項に記載の光学コンポーネント(40)において、前記少なくとも1つのプリント回路基板(56)は、ワイヤボンド接点(63)及び/又はフリップチップ接点(72)及び/又は他のボンド接点によって前記少なくとも1つのMOEMS(73)に電気的に接続されることを特徴とする光学コンポーネント。
- 投影露光装置(1)の照明光学ユニット(4)のファセットミラー(13、14)であって、請求項1〜10のいずれか1項に記載の少なくとも1つの光学コンポーネント(40)を備えたファセットミラー。
- 投影露光装置(1)の照明光学ユニット(4)であって、請求項1〜10のいずれか1項に記載の少なくとも1つの光学コンポーネント(40)を備えた照明光学ユニット。
- 投影露光装置(1)の照明系(2)であって、
13.1 請求項12に記載の照明光学ユニット(4)と、
13.2 放射源(3)と
を備えた照明系。 - マイクロリソグラフィ用の投影露光装置(1)であって、
14.1 請求項12に記載の照明光学ユニット(4)と、
14.2 物体視野(5)を像視野(8)に投影する投影光学ユニット(7)と
を備えたマイクロリソグラフィ用の投影露光装置。 - 微細構造又はナノ構造コンポーネントを製造する方法であって、
感光材料からなる層を少なくとも部分的に施される基板を用意するステップと、
結像対象構造を有するレチクルを用意するステップと、
請求項14に記載の投影露光装置(1)を用意するステップと、
前記投影露光装置(1)を用いて、前記レチクルの少なくとも一部を前記基板の前記感光層の領域に投影するステップと
を含む方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013217146.3 | 2013-08-28 | ||
DE102013217146.3A DE102013217146A1 (de) | 2013-08-28 | 2013-08-28 | Optisches Bauelement |
PCT/EP2014/068040 WO2015028450A1 (de) | 2013-08-28 | 2014-08-26 | Optisches bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016531323A JP2016531323A (ja) | 2016-10-06 |
JP6415564B2 true JP6415564B2 (ja) | 2018-10-31 |
Family
ID=51399657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016537259A Active JP6415564B2 (ja) | 2013-08-28 | 2014-08-26 | 光学コンポーネント |
Country Status (5)
Country | Link |
---|---|
US (1) | US9851555B2 (ja) |
JP (1) | JP6415564B2 (ja) |
KR (1) | KR102273545B1 (ja) |
DE (1) | DE102013217146A1 (ja) |
WO (1) | WO2015028450A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015221976A1 (de) * | 2015-11-09 | 2016-10-27 | Carl Zeiss Smt Gmbh | Kippanordnung, Verfahren zum Herstellen einer Kippanordnung und Lithographieanlage |
DE102017200775A1 (de) * | 2017-01-19 | 2018-07-19 | Carl Zeiss Smt Gmbh | Bauelement für eine Projektionsbelichtungsanlage |
DE102017211443A1 (de) | 2017-07-05 | 2019-01-10 | Carl Zeiss Smt Gmbh | Metrologiesystem mit einer EUV-Optik |
DE102021203721A1 (de) * | 2021-04-15 | 2022-10-20 | Carl Zeiss Smt Gmbh | Aktuator-sensor-vorrichtung und lithographieanlage |
DE102023204477A1 (de) | 2022-05-12 | 2023-11-16 | Carl Zeiss Smt Gmbh | Mikroelektromechanisches System (MEMS) |
DE102022207555A1 (de) * | 2022-07-25 | 2024-01-25 | Carl Zeiss Smt Gmbh | Optisches system, lithographieanlage mit einem optischen system und verfahren zum herstellen eines optischen systems |
CN118039583A (zh) * | 2022-11-03 | 2024-05-14 | 三赢科技(深圳)有限公司 | 封装模组 |
DE102022212167A1 (de) | 2022-11-16 | 2023-09-14 | Carl Zeiss Smt Gmbh | EUV-Quellen-Modul für eine EUV-Projektionsbelichtungsanlage |
DE102022212168A1 (de) | 2022-11-16 | 2024-05-16 | Carl Zeiss Smt Gmbh | EUV-Optik-Modul für eine EUV-Projektionsbelichtungsanlage |
DE102023200234A1 (de) * | 2023-01-12 | 2024-07-18 | Carl Zeiss Smt Gmbh | Optisches system, lithographieanlage und verfahren zum herstellen eines optischen systems |
DE102023200235A1 (de) * | 2023-01-12 | 2024-07-18 | Carl Zeiss Smt Gmbh | Optisches system und lithographieanlage |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10138313A1 (de) | 2001-01-23 | 2002-07-25 | Zeiss Carl | Kollektor für Beleuchtugnssysteme mit einer Wellenlänge < 193 nm |
WO2003042094A2 (en) * | 2001-11-09 | 2003-05-22 | Movaz Networks, Inc. | Multi-chip module integrating mems mirror array with electronics |
KR100789545B1 (ko) * | 2005-03-07 | 2007-12-28 | 삼성전기주식회사 | 플립칩 실장 기술을 이용한 광변조기 모듈 패키지 |
EP2074464A2 (en) * | 2007-01-19 | 2009-07-01 | Pixtronix Inc. | Mems display apparatus |
JP5330697B2 (ja) * | 2007-03-19 | 2013-10-30 | 株式会社リコー | 機能素子のパッケージ及びその製造方法 |
US20100328913A1 (en) * | 2007-03-30 | 2010-12-30 | Andreas Kugler | Method for the producing an electronic subassembly, as well as electronic subassembly |
DE102008026079A1 (de) * | 2007-05-31 | 2008-12-04 | Dynaenergetics Gmbh & Co. Kg | Verfahren zur Komplettierung eines Bohrlochs |
WO2009069807A1 (ja) * | 2007-11-29 | 2009-06-04 | Kyocera Corporation | 光学装置、封止用基板および光学装置の製造方法 |
DE102008000842A1 (de) * | 2008-03-27 | 2009-10-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe |
WO2009145726A1 (en) * | 2008-05-27 | 2009-12-03 | Agency For Science, Technology And Research | Micro electro mechanical device package and method of manufacturing a micro electro mechanical device package |
WO2010049076A2 (de) | 2008-10-20 | 2010-05-06 | Carl Zeiss Smt Ag | Optische baugruppe zur führung eines strahlungsbündels |
JP5375311B2 (ja) * | 2009-04-28 | 2013-12-25 | オムロン株式会社 | 電子部品実装装置及びその製造方法 |
NL2004924A (en) * | 2009-06-26 | 2010-12-27 | Asml Netherlands Bv | Electrical connection system, lithographic projection apparatus, device manufacturing method and method for manufacturing an electrical connection system. |
US8390083B2 (en) * | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
DE102011006100A1 (de) | 2011-03-25 | 2012-09-27 | Carl Zeiss Smt Gmbh | Spiegel-Array |
JP5989982B2 (ja) * | 2011-09-29 | 2016-09-07 | スタンレー電気株式会社 | 光偏向器 |
DE102013201509A1 (de) | 2012-02-17 | 2013-08-22 | Carl Zeiss Smt Gmbh | Optisches Bauelement |
-
2013
- 2013-08-28 DE DE102013217146.3A patent/DE102013217146A1/de not_active Withdrawn
-
2014
- 2014-08-26 WO PCT/EP2014/068040 patent/WO2015028450A1/de active Application Filing
- 2014-08-26 KR KR1020167007700A patent/KR102273545B1/ko active IP Right Grant
- 2014-08-26 JP JP2016537259A patent/JP6415564B2/ja active Active
-
2016
- 2016-02-23 US US15/050,664 patent/US9851555B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9851555B2 (en) | 2017-12-26 |
JP2016531323A (ja) | 2016-10-06 |
KR20160048867A (ko) | 2016-05-04 |
KR102273545B1 (ko) | 2021-07-07 |
DE102013217146A1 (de) | 2015-03-05 |
WO2015028450A1 (de) | 2015-03-05 |
US20160170201A1 (en) | 2016-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6415564B2 (ja) | 光学コンポーネント | |
TWI477812B (zh) | 鏡陣列、含鏡陣列的光學元件、光學組件、照明系統及光學元件與光學組件的製造方法 | |
JP5355699B2 (ja) | 放射線ビームを案内するための光学モジュール | |
JP6530603B2 (ja) | 光学コンポーネント | |
JP6568865B2 (ja) | ミラーアレイ | |
JP6207530B2 (ja) | 光学コンポーネント | |
KR102401868B1 (ko) | 투영 노광 시스템의 오브젝트 필드를 조명하는 방법 | |
US20190324372A1 (en) | Component for a projection exposure apparatus | |
US9915872B2 (en) | Optical component | |
JP2023522747A (ja) | ファセットミラー用のファセットアセンブリ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170824 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180627 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180821 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180911 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181002 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6415564 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |