JP6409459B2 - Lighting device - Google Patents

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JP6409459B2
JP6409459B2 JP2014199731A JP2014199731A JP6409459B2 JP 6409459 B2 JP6409459 B2 JP 6409459B2 JP 2014199731 A JP2014199731 A JP 2014199731A JP 2014199731 A JP2014199731 A JP 2014199731A JP 6409459 B2 JP6409459 B2 JP 6409459B2
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optical component
wiring
lighting device
emitting device
light
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JP2016072068A (en
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若木　亮輔
亮輔 若木
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Nichia Corp
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Nichia Corp
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Description

照明装置に関する。   The present invention relates to a lighting device.

導光板の側面側に発光ダイオード（以下「ＬＥＤ」と略記する）等の光源が配されたエッジライト型のバックライト装置では、導光板の振動や熱膨張等によって導光板が板面方向においてがたつくと、導光板と光源との間の距離が変動してしまい、良好な光学設計を維持できなくなる。そこで、従来、光源と導光板との間にスペーサ部材を介在させて、これにより導光板のがたつきを防止ないし抑制するバックライト装置が提案された（特許文献１参照）。   In an edge-light type backlight device in which a light source such as a light emitting diode (hereinafter abbreviated as “LED”) is disposed on the side surface of the light guide plate, the light guide plate is distorted in the plate surface direction due to vibration or thermal expansion of the light guide plate. As a result, the distance between the light guide plate and the light source varies, and a good optical design cannot be maintained. Therefore, conventionally, a backlight device has been proposed in which a spacer member is interposed between the light source and the light guide plate, thereby preventing or suppressing rattling of the light guide plate (see Patent Document 1).

特開２０１３−１８２１６４号公報JP2013-182164A

しかしながら、スペーサ部材は光源が実装される基板とは別部材であるため、上記従来のバックライト装置では量産性が悪化するという問題があった。   However, since the spacer member is a separate member from the substrate on which the light source is mounted, the conventional backlight device has a problem that mass productivity deteriorates.

上記課題は、例えば、次の手段により解決することができる。   The above problem can be solved by, for example, the following means.

配線を有する基板と、前記基板上に載置された発光装置と、前記発光装置の光を伝搬する光学部品と、を備え、前記配線は、前記光学部品と前記発光装置との間に所定の隙間が確保されるよう、前記光学部品に当接して前記光学部品を位置決めすることを特徴とする照明装置。   A substrate having wiring, a light-emitting device mounted on the substrate, and an optical component that propagates light of the light-emitting device, wherein the wiring has a predetermined gap between the optical component and the light-emitting device. An illumination device, wherein the optical component is positioned in contact with the optical component such that a gap is secured.

上記した照明装置によれば、基板が有する配線により光学部品が位置決めされるため、照明装置の量産性を維持しながら信頼性を高めることができる。   According to the illumination device described above, since the optical component is positioned by the wiring of the substrate, the reliability can be improved while maintaining the mass productivity of the illumination device.

実施形態１に係る照明装置の模式的平面図である。1 is a schematic plan view of a lighting device according to Embodiment 1. FIG. 図１Ａ中のＡ−Ａ端面図である。It is AA end elevations in FIG. 1A. 図１Ａ中のＢ−Ｂ端面図である。It is a BB end view in Drawing 1A. 実施形態２に係る照明装置の模式的平面図である。6 is a schematic plan view of a lighting device according to Embodiment 2. FIG. 図２Ａ中のＡ−Ａ端面図である。It is an AA end view in FIG. 2A. 図２Ａ中のＢ−Ｂ端面図である。It is a BB end elevation in FIG. 2A. 実施形態３に係る照明装置の模式的平面図である。6 is a schematic plan view of a lighting device according to Embodiment 3. FIG. 図３Ａ中のＡ−Ａ端面図である。It is an AA end view in FIG. 3A. 図３Ａ中のＢ−Ｂ端面図である。It is a BB end elevation in FIG. 3A. 実施形態４に係る照明装置の模式的平面図である。6 is a schematic plan view of a lighting device according to Embodiment 4. FIG. 図４Ａ中のＡ−Ａ端面図である。It is an AA end elevation in FIG. 4A. 図４Ａ中のＢ−Ｂ端面図である。It is a BB end elevation in FIG. 4A. 実施形態５に係る照明装置の模式的平面図である。6 is a schematic plan view of a lighting device according to Embodiment 5. FIG. 図５Ａ中のＡ−Ａ断面図である。It is AA sectional drawing in FIG. 5A.

［実施形態１に係る照明装置］
図１Ａは実施形態１に係る照明装置の模式的平面図であり、図１Ｂは図１Ａ中のＡ−Ａ端面図であり、図１Ｃは図１Ａ中のＢ−Ｂ端面図である。図１Ａから図１Ｃに示すように、実施形態１に係る照明装置は、配線１０を有する基板２０と、基板２０上に載置された発光装置３０と、発光装置３０の光を伝搬する光学部品４０と、を備え、配線１０は、光学部品４０と発光装置３０との間に所定の隙間Ｄが確保されるよう、光学部品４０に当接して光学部品４０を位置決めする照明装置である。実施形態１に係る照明装置によれば、基板２０が有する配線１０により光学部品４０が位置決めされるため、照明装置の量産性を維持しながら信頼性を高めることができる。以下、詳細に説明する。 [Lighting Device According to Embodiment 1]
1A is a schematic plan view of a lighting device according to Embodiment 1, FIG. 1B is an AA end view in FIG. 1A, and FIG. 1C is a BB end view in FIG. 1A. As shown in FIGS. 1A to 1C, the illumination device according to the first embodiment includes a substrate 20 having wiring 10, a light emitting device 30 placed on the substrate 20, and an optical component that propagates light from the light emitting device 30. 40, and the wiring 10 is an illuminating device that contacts the optical component 40 and positions the optical component 40 so that a predetermined gap D is secured between the optical component 40 and the light emitting device 30. According to the lighting device according to the first embodiment, since the optical component 40 is positioned by the wiring 10 included in the substrate 20, the reliability can be improved while maintaining the mass productivity of the lighting device. Details will be described below.

（基板２０）
基板２０は配線１０を有している。基板２０は、フレキシブル（可撓性）基板でもよいし、リジッド基板でもよい。基板２０は、多くの場合、配線１０を支持する支持体２１を有している。リジッド基板の支持体としては、酸化アルミニウム、窒化アルミニウム、酸化ジルコニウム、窒化ジルコニウム、酸化チタン、窒化チタン若しくはこれらの混合物を含むセラミックスの板、銅、鉄、ニッケル、クロム、アルミニウム、銀、金、チタン若しくはこれらの合金を含む金属の板（絶縁層との積層体）、ガラスエポキシの板、ＢＴレジンの板、ガラスの板、樹脂の板、紙の板などを用いることができる。フレキシブル基板の支持体としては、ポリイミド、ポリエチレンテレフタレート、ポリエチレンナフタレート、液晶ポリマー、シクロオレフィンポリマーなどのフィルムを用いることができる。支持体２１の厚さは、特に限定されないが、例えば０．０２ｍｍ以上２ｍｍ以下であり、０．０５ｍｍ以上１ｍｍ以下が好ましく、０．０５ｍｍ以上０．４ｍｍ以下がより好ましい。また、基板２０は、保護膜２２を有していてもよい。保護膜２２は、電気的絶縁性を有し、配線１０及び／又は支持体２１を保護する膜である。保護膜２２は、配線１０の所定部位が露出される開口を有している。保護膜２２は、例えばカバーレイ、ソルダーレジスト、シルクなどを用いることができる。保護膜２２は、顔料を含有することで、白色など任意に着色することができる。保護膜２２の厚さは、特に限定されないが、例えば０．００５ｍｍ以上０．１ｍｍ以下であり、０．０１ｍｍ以上０．０５ｍｍ以下が好ましく、０．０１ｍｍ以上０．０４ｍｍ以下がより好ましい。 (Substrate 20)
The substrate 20 has the wiring 10. The substrate 20 may be a flexible (flexible) substrate or a rigid substrate. In many cases, the substrate 20 includes a support 21 that supports the wiring 10. Rigid substrate supports include: aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride or ceramic plates containing a mixture thereof, copper, iron, nickel, chromium, aluminum, silver, gold, titanium Alternatively, a metal plate containing these alloys (a laminate with an insulating layer), a glass epoxy plate, a BT resin plate, a glass plate, a resin plate, a paper plate, or the like can be used. As a support for the flexible substrate, films of polyimide, polyethylene terephthalate, polyethylene naphthalate, liquid crystal polymer, cycloolefin polymer, and the like can be used. Although the thickness of the support body 21 is not specifically limited, For example, it is 0.02 mm or more and 2 mm or less, 0.05 mm or more and 1 mm or less are preferable, and 0.05 mm or more and 0.4 mm or less are more preferable. Further, the substrate 20 may have a protective film 22. The protective film 22 is an electrically insulating film that protects the wiring 10 and / or the support 21. The protective film 22 has an opening through which a predetermined portion of the wiring 10 is exposed. For example, a coverlay, solder resist, silk, or the like can be used for the protective film 22. The protective film 22 can be arbitrarily colored, such as white, by containing a pigment. Although the thickness of the protective film 22 is not specifically limited, For example, it is 0.005 mm or more and 0.1 mm or less, 0.01 mm or more and 0.05 mm or less are preferable, and 0.01 mm or more and 0.04 mm or less are more preferable.

（配線１０）
配線１０は、箔や膜として、支持体２１の少なくとも上面に設けられ、支持体２１の内部及び／又は下面にも設けられてもよい。また、配線１０は、発光装置３０が接合されるランド部、外部接続端子部、及びこれらを接続する引き出し配線部を含むことが好ましい。配線１０としては銅、鉄、ニッケル、タングステン、クロム、アルミニウム、銀、金、チタン、パラジウム、ロジウム、若しくはこれらの合金などを用いることができる。特に、熱伝導性の観点では銅又は銅合金が好ましい。配線１０は、単層でもよいし、多層でもよい。配線１０の光学部品４０に当接する部位以外の部位（配線１０が給電部１１と位置決め部１２とを有する場合（後述）には給電部１１）の厚さは、特に限定されないが、例えば０．０３ｍｍ以上１．０ｍｍ以下であり、０．０５ｍｍ以上０．４ｍｍ以下が好ましく、０．０５ｍｍ以上０．２ｍｍ以下がより好ましい。配線１０の光学部品４０に当接する部位（配線１０が給電部１１と位置決め部１２とを有する場合（後述）には位置決め部１２）の厚さは、光学部品４０の位置決めの観点から、配線１０が光学部品４０の端面に当接する場合には、他の部位より０．０１５ｍｍ以上０．８ｍｍ以下の範囲で厚いことが好ましく、他の部位より０．１ｍｍ以上０．３ｍｍ以下の範囲で厚いことがより好ましく、配線１０が光学部品４０の下面に当接する場合には発光装置３０の厚さに応じて適宜決めればよい。このような配線１０の光学部品４０に当接する部位は、鍍金、蒸着、スパッタ、積層、エッチングなどの方法により形成することができる。配線１０における光学部品４０との当接面には、銀、アルミニウム、ロジウム、又はこれらの合金の被膜５０が設けられていることが好ましく、なかでも光反射性に優れる銀又は銀合金の被膜５０が設けられていることが好ましい。被膜５０を設ければ、光学部品４０から発光装置３０側に向かう戻り光を配線１０の光学部品４０との当接面により効率的に反射して、照明装置の発光効率を高めることができる。なお、被膜５０は、配線１０の光学部品４０に当接する部位（配線１０が給電部１１と位置決め部１２とを有する場合（後述）には位置決め部１２）にのみ設けられてもよいし、配線１０の露出した全ての表面に設けられてもよい。 (Wiring 10)
The wiring 10 is provided on at least the upper surface of the support 21 as a foil or a film, and may be provided on the inside and / or the lower surface of the support 21. Moreover, it is preferable that the wiring 10 includes a land portion to which the light emitting device 30 is bonded, an external connection terminal portion, and a lead-out wiring portion that connects them. As the wiring 10, copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy thereof can be used. In particular, copper or a copper alloy is preferable from the viewpoint of thermal conductivity. The wiring 10 may be a single layer or a multilayer. The thickness of the portion other than the portion that contacts the optical component 40 of the wiring 10 (when the wiring 10 has a power feeding portion 11 and a positioning portion 12 (described later), the thickness of the power feeding portion 11) is not particularly limited. It is 03 mm or more and 1.0 mm or less, 0.05 mm or more and 0.4 mm or less are preferable, and 0.05 mm or more and 0.2 mm or less are more preferable. From the viewpoint of positioning of the optical component 40, the thickness of the portion of the wiring 10 that contacts the optical component 40 (the positioning portion 12 when the wiring 10 includes the power feeding portion 11 and the positioning portion 12 (described later)) is determined. Is in the range of 0.015 mm or more and 0.8 mm or less from other parts, and is thicker in the range of 0.1 mm or more and 0.3 mm or less than other parts. More preferably, when the wiring 10 is in contact with the lower surface of the optical component 40, it may be determined as appropriate according to the thickness of the light emitting device 30. Such a portion of the wiring 10 that contacts the optical component 40 can be formed by a method such as plating, vapor deposition, sputtering, lamination, or etching. The contact surface of the wiring 10 with the optical component 40 is preferably provided with a film 50 of silver, aluminum, rhodium, or an alloy thereof, and in particular, a film 50 of silver or a silver alloy having excellent light reflectivity. Is preferably provided. If the coating 50 is provided, the return light from the optical component 40 toward the light emitting device 30 can be efficiently reflected by the contact surface of the wiring 10 with the optical component 40, and the luminous efficiency of the lighting device can be increased. Note that the coating 50 may be provided only on a portion of the wiring 10 that contacts the optical component 40 (when the wiring 10 includes a power feeding portion 11 and a positioning portion 12 (described later), the positioning portion 12). It may be provided on all 10 exposed surfaces.

配線１０は、光学部品４０と発光装置３０との間に所定の隙間Ｄが確保されるよう、光学部品４０に当接して光学部品４０を位置決めする。このように、基板２０が有する配線１０により光学部品４０を位置決めすれば、スペーサ部材を別途設置する必要がなく部品点数の増大を抑えることができるため、照明装置の量産性を維持しながら信頼性を高めることができる。   The wiring 10 contacts the optical component 40 and positions the optical component 40 so that a predetermined gap D is secured between the optical component 40 and the light emitting device 30. As described above, if the optical component 40 is positioned by the wiring 10 included in the substrate 20, it is not necessary to separately install a spacer member, and an increase in the number of components can be suppressed. Therefore, reliability is maintained while maintaining mass productivity of the lighting device. Can be increased.

配線１０は、発光装置３０に給電する給電部１１と、給電部１１から絶縁された光学部品４０に当接する位置決め部１２と、を有することが好ましい。このようにすれば、発光装置３０への給電を給電部１１により行いつつ、光学部品４０の位置決めを給電部１１から絶縁された位置決め部１２により行うことができる。このため、光学部品４０からの応力を受けて位置決め部１２が切断されたりなどしても発光装置３０への給電が継続されるので、照明装置の信頼性が高まる。なお、光学部品４０を給電部１１により位置決めする場合は、光学部品４０を位置決めする給電部１１とは別の給電部１１を設け、双方の給電部１１から発光装置３０に給電することが好ましい。このようにすれば、光学部品４０からの応力を受けて一の給電部１１が切断されたりなどしても他の給電部１１により発光装置３０への給電を継続することができるため、照明装置の信頼性が高まる。   The wiring 10 preferably includes a power supply unit 11 that supplies power to the light emitting device 30 and a positioning unit 12 that contacts the optical component 40 that is insulated from the power supply unit 11. With this configuration, the optical component 40 can be positioned by the positioning unit 12 insulated from the power supply unit 11 while the power supply unit 11 supplies power to the light emitting device 30. For this reason, since the power supply to the light emitting device 30 is continued even if the positioning portion 12 is cut by receiving stress from the optical component 40, the reliability of the lighting device is increased. When the optical component 40 is positioned by the power supply unit 11, it is preferable to provide a power supply unit 11 that is different from the power supply unit 11 that positions the optical component 40 and supply power to the light emitting device 30 from both power supply units 11. In this way, even if one power supply unit 11 is cut due to stress from the optical component 40, the power supply to the light emitting device 30 can be continued by the other power supply unit 11, and thus the illumination device Increased reliability.

（発光装置３０）
発光装置３０は基板２０上に載置される。発光装置３０は、１つでもよいが、複数の場合が多い。発光装置３０の発光色は、白色のほか、青色でもよいし、赤色、緑色、青色の３種としてもよい。発光装置３０としては、ＬＥＤチップや各種のＬＥＤパッケージなどを用いることができる。ＬＥＤパッケージは、樹脂又はセラミックのパッケージの凹部内にＬＥＤチップが封止されたパッケージ型ＬＥＤ（特に表面実装型：ＳＭＤ）、回路基板上にＬＥＤチップが実装且つ封止された基板型ＬＥＤ（チップ・オン・ボード：ＣＯＢ）、ＬＥＤチップに突起電極（バンプ）と蛍光体層などが接合されたチップ・サイズ・パッケージ（ＣＳＰ）などが挙げられる。また、ＬＥＤパッケージは、上面発光（トップビュー）型でもよいし、側面発光（サイドビュー）型でもよい。ＬＥＤチップは、基板２０上に載置された後、封止部材（蛍光体含有可）で封止されていてもよい。発光装置３０の厚さは、特に限定されないが、例えば０．１ｍｍ以上３ｍｍ以下であり、照明装置の薄型化の観点から、０．１ｍｍ以上０．８ｍｍ以下が好ましく、０．１ｍｍ以上０．６ｍｍ以下がより好ましく、０．１ｍｍ以上０．４ｍｍ以下がよりいっそう好ましい。側面発光型の発光装置は、上面発光型の発光装置に比べて、基板２０との接合強度が低くなりやすく、信頼性向上のため、光学部品４０との間に所定の隙間Ｄを確保する場合が多くなる。なかでも、厚さが０．６ｍｍ以下及び／又は奥行きが１ｍｍ以下の側面発光型の発光装置では、特に基板２０との接合強度が低くなりやすい。なお、発光装置３０は半田などの接続部材６０を用いて配線１０（給電部１１）に接続される。 (Light Emitting Device 30)
The light emitting device 30 is placed on the substrate 20. There may be one light emitting device 30, but there are many cases where there are a plurality of light emitting devices 30. The light emission color of the light emitting device 30 may be blue as well as white, or may be three types of red, green, and blue. As the light emitting device 30, an LED chip, various LED packages, or the like can be used. The LED package is a package type LED (in particular, a surface mount type: SMD) in which an LED chip is sealed in a recess of a resin or ceramic package, and a substrate type LED (chip) in which the LED chip is mounted and sealed on a circuit board. On-board: COB), chip size package (CSP) in which protruding electrodes (bumps), phosphor layers and the like are bonded to LED chips. The LED package may be a top emission type or a side emission type. After the LED chip is placed on the substrate 20, it may be sealed with a sealing member (phosphor can be contained). The thickness of the light emitting device 30 is not particularly limited, but is, for example, 0.1 mm or more and 3 mm or less. From the viewpoint of thinning the lighting device, 0.1 mm or more and 0.8 mm or less is preferable, and 0.1 mm or more and 0.6 mm or less. The following is more preferable, and 0.1 to 0.4 mm is even more preferable. The side-emitting type light-emitting device tends to have a lower bonding strength with the substrate 20 than the top-emitting type light-emitting device, and a predetermined gap D is secured between the optical component 40 and the optical component 40 in order to improve reliability. Will increase. In particular, in the side-emitting type light emitting device having a thickness of 0.6 mm or less and / or a depth of 1 mm or less, the bonding strength with the substrate 20 tends to be particularly low. The light emitting device 30 is connected to the wiring 10 (power feeding unit 11) using a connection member 60 such as solder.

（光学部品４０）
光学部品４０としては発光装置３０の光を伝搬する部材（例：導光板、拡散板）を用いることができる。各種のレンズでもよい。エッジライト型の照明装置における光学部品４０には導光板が好適である。光学部品４０の材質は、アクリル樹脂、ポリカーボネート樹脂、ＰＭＭＡ樹脂、ポリノルボルネン樹脂、ポリスチレン樹脂、若しくはこれらの変性樹脂、又はガラスなどが挙げられる。なお、光学部品４０の下面には反射シート７０を設けることができる。 (Optical component 40)
As the optical component 40, a member (for example, a light guide plate or a diffusion plate) that propagates light of the light emitting device 30 can be used. Various lenses may be used. A light guide plate is suitable for the optical component 40 in the edge light type illumination device. Examples of the material of the optical component 40 include acrylic resin, polycarbonate resin, PMMA resin, polynorbornene resin, polystyrene resin, modified resins thereof, and glass. A reflective sheet 70 can be provided on the lower surface of the optical component 40.

以上説明した実施形態１に係る照明装置によれば、基板２０が有する配線１０により光学部品４０が位置決めされるため、照明装置の量産性を維持しながら信頼性を高めることができる。   According to the illuminating device according to the first embodiment described above, the optical component 40 is positioned by the wiring 10 included in the substrate 20, so that the reliability can be improved while maintaining the mass productivity of the illuminating device.

［実施形態２に係る照明装置］
図２Ａは実施形態２に係る照明装置の模式的平面図であり、図２Ｂは図２Ａ中のＡ−Ａ端面図であり、図２Ｃは図２Ａ中のＢ−Ｂ端面図である。図２Ａから図２Ｃに示すように、実施形態２に係る照明装置は、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）における光学部品４０との当接面が曲面状、より具体的には円柱面状である点で、当該当接面が平面状である実施形態１に係る照明装置と相違する。このようにすれば、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）における光学部品４０との当接面にて光学部品４０の応力を分散させることができるため、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）が光学部品４０からの応力を受けて基板２０から剥がれたり切断されたりなどすることを抑制又は防止することができる。なお、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）における光学部品４０との当接面は楕円柱面状にすることもできる。 [Lighting Device According to Embodiment 2]
2A is a schematic plan view of the lighting device according to the second embodiment, FIG. 2B is an AA end view in FIG. 2A, and FIG. 2C is an BB end view in FIG. 2A. As illustrated in FIGS. 2A to 2C, the lighting device according to the second embodiment is in contact with the optical component 40 in the wiring 10 (positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12). The surface is a curved surface, more specifically, a cylindrical surface, and is different from the illumination device according to the first embodiment in which the contact surface is a flat surface. In this way, the stress of the optical component 40 can be dispersed on the contact surface with the optical component 40 in the wiring 10 (or the positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12). Therefore, it is possible to suppress the wiring 10 (the positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12) from being peeled off or cut from the substrate 20 due to the stress from the optical component 40, or Can be prevented. In addition, the contact surface with the optical component 40 in the wiring 10 (or the positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12) may be in the shape of an elliptic cylinder.

［実施形態３に係る照明装置］
図３Ａは実施形態３に係る照明装置の模式的平面図であり、図３Ｂは図３Ａ中のＡ−Ａ端面図であり、図３Ｃは図３Ａ中のＢ−Ｂ端面図である。図３Ａから図３Ｃに示すように、実施形態３に係る照明装置は、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）における光学部品４０との当接面が曲面状、より具体的には球面状である点で、当該当接面が平面状である実施形態１に係る照明装置と相違する。このようにすれば、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）における光学部品４０との当接面にて光学部品４０の応力を分散させることができるため、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）が光学部品４０からの応力を受けて基板２０から剥がれたり切断されたりなどすることを抑制又は防止することができる。 [Lighting Device According to Embodiment 3]
3A is a schematic plan view of the lighting device according to Embodiment 3, FIG. 3B is an AA end view in FIG. 3A, and FIG. 3C is a BB end view in FIG. 3A. As shown in FIGS. 3A to 3C, the lighting device according to the third embodiment is in contact with the optical component 40 in the wiring 10 (positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12). The surface is a curved surface, more specifically, a spherical surface, and is different from the illumination device according to the first embodiment in which the contact surface is a flat surface. In this way, the stress of the optical component 40 can be dispersed on the contact surface with the optical component 40 in the wiring 10 (or the positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12). Therefore, it is possible to suppress the wiring 10 (the positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12) from being peeled off or cut from the substrate 20 due to the stress from the optical component 40, or Can be prevented.

［実施形態４に係る照明装置］
図４Ａは実施形態４に係る照明装置の模式的平面図であり、図４Ｂは図４Ａ中のＡ−Ａ端面図であり、図４Ｃは図４Ａ中のＢ−Ｂ端面図である。図４Ａから図４Ｃに示すように、実施形態４に係る照明装置は、配線１０（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）における光学部品４０との当接面に凹凸が設けられている点で、当該当接面が平坦状である実施形態１に係る照明装置と相違する。このようにすれば、光学部品４０から発光装置３０側に向かう戻り光を配線１０の光学部品４０との当接面により散乱させて、光学部品４０内の輝度分布の斑を抑えることができる。凹凸は、規則的なものでもよいし、不規則なものでもよい。また、ここでいう凹凸は、複数の凹部により成るもの、及び複数の凸部により成るものを含む。なお、このような凹凸は、配線１０の光学部品４０に当接する部位（配線１０が給電部１１と位置決め部１２とを有する場合には位置決め部１２）にのみ設けられてもよいし、配線１０の露出した全ての表面に設けられてもよい。 [Lighting Device According to Embodiment 4]
4A is a schematic plan view of the lighting device according to Embodiment 4, FIG. 4B is an AA end view in FIG. 4A, and FIG. 4C is a BB end view in FIG. 4A. As shown in FIGS. 4A to 4C, the lighting device according to the fourth embodiment is in contact with the optical component 40 in the wiring 10 (positioning unit 12 when the wiring 10 includes the power feeding unit 11 and the positioning unit 12). It differs from the illuminating device according to Embodiment 1 in which the contact surface is flat in that the surface is provided with irregularities. In this way, the return light that travels from the optical component 40 toward the light emitting device 30 side is scattered by the contact surface of the wiring 10 with the optical component 40, and the unevenness of the luminance distribution in the optical component 40 can be suppressed. The irregularities may be regular or irregular. Moreover, the unevenness | corrugation here contains what consists of a some recessed part, and what consists of a some convex part. Such unevenness may be provided only in a portion of the wiring 10 that contacts the optical component 40 (positioning portion 12 when the wiring 10 includes the power feeding portion 11 and the positioning portion 12). May be provided on all exposed surfaces.

［実施形態５に係る照明装置］
図５Ａは実施形態５に係る照明装置の模式的平面図であり、図５Ｂは図５Ａ中のＡ−Ａ断面図である。実施形態５に係る照明装置は、配線１０が光学部品４０の下面に当接する直下型の照明装置である点で、配線１０が光学部品４０の端面に当接するエッジライト型の照明装置に適用することができる実施形態１に係る照明装置と相違する。このような直下型の照明装置における光学部品４０には拡散板が好適である。実施形態５に係る照明装置によっても、実施形態１に係る照明装置と同様に、基板２０が有する配線１０により光学部品４０が位置決めされるため、照明装置の量産性を維持しながら信頼性を高めることができる。 [Lighting Apparatus According to Embodiment 5]
FIG. 5A is a schematic plan view of a lighting device according to Embodiment 5, and FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A. The illumination device according to the fifth embodiment is applied to an edge light type illumination device in which the wiring 10 is in contact with the end surface of the optical component 40 in that the wiring 10 is a direct type illumination device in contact with the lower surface of the optical component 40. This is different from the illumination device according to the first embodiment. A diffusion plate is suitable for the optical component 40 in such a direct illumination device. Also in the lighting device according to the fifth embodiment, the optical component 40 is positioned by the wiring 10 included in the substrate 20 as in the lighting device according to the first embodiment. Therefore, the reliability is improved while maintaining the mass productivity of the lighting device. be able to.

以上、実施形態について説明したが、これらの説明は一例に関するものであり、特許請求の範囲に記載された構成を何ら限定するものではない。   While the embodiments have been described above, these descriptions are only examples, and do not limit the configurations described in the claims.

１０ 配線
１１ 給電部
１２ 位置決め部
２０ 基板
２１ 支持体
２２ 保護膜
３０ 発光装置
４０ 光学部品
５０ 被膜
６０ 接続部材
７０ 反射シート
Ｄ 隙間
DESCRIPTION OF SYMBOLS 10 Wiring 11 Electric power feeding part 12 Positioning part 20 Board | substrate 21 Support body 22 Protective film 30 Light-emitting device 40 Optical component 50 Coating 60 Connection member 70 Reflection sheet D Gap

Claims (8)

配線を有する基板と、
前記基板上に載置された発光装置と、
前記発光装置の光を伝搬する光学部品と、を備え、
前記配線は、前記配線の一部として、
前記発光装置に給電する給電部と、
前記給電部から絶縁され、前記光学部品と前記発光装置との間に所定の隙間が確保されるよう、前記光学部品に当接して前記光学部品を位置決めする位置決め部と、を有することを特徴とする照明装置。 A substrate having wiring;
A light-emitting device mounted on the substrate;
An optical component that propagates the light of the light emitting device, and
The wiring is a part of the wiring,
A power feeding unit for feeding power to the light emitting device;
A positioning unit that is insulated from the power supply unit and positions the optical component in contact with the optical component so that a predetermined gap is secured between the optical component and the light emitting device. Lighting device. 前記位置決め部は、前記光学部品との当接面に銀、アルミニウム、ロジウム、又はこれらの合金の被膜を有することを特徴とする請求項１に記載の照明装置。 The positioning unit, the lighting device according to claim 1, characterized in that it comprises an abutment surface on silver, aluminum, rhodium, or coating of an alloy thereof and the optical component. 前記位置決め部における前記光学部品との当接面は曲面状であることを特徴とする請求項１または２に記載の照明装置。 The lighting device according to claim 1, wherein a contact surface of the positioning unit with the optical component is a curved surface. 前記位置決め部は、前記光学部品との当接面に凹凸を有することを特徴とする請求項１から３のいずれか１項に記載の照明装置。 The lighting device according to any one of claims 1 to 3, wherein the positioning portion has irregularities on a contact surface with the optical component. 前記位置決め部は前記光学部品の端面に当接することを特徴とする請求項１から４のいずれか１項に記載の照明装置。 5. The illumination device according to claim 1, wherein the positioning portion is in contact with an end face of the optical component. 前記光学部品は導光板であることを特徴とする請求項５に記載の照明装置。 The lighting device according to claim 5 , wherein the optical component is a light guide plate. 前記位置決め部は前記光学部品の下面に当接することを特徴とする請求項１から４のいずれか１項に記載の照明装置。 5. The illumination device according to claim 1, wherein the positioning portion is in contact with a lower surface of the optical component. 前記光学部品は拡散板であることを特徴とする請求項７に記載の照明装置。 The lighting device according to claim 7 , wherein the optical component is a diffusion plate.
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